Copyright CPI 2008. All rights reserved

A Career in the Process Industry

Sharon Louch

Centre for Process Innovation

12/04/23 Leicester Postgraduate Careers Day 2

CPI Overview

• Purpose: To support and sustain the process industries in the UK

– Set up in 2004

– Government and private industry funded

– Basic Model: Provide capital equipment and high level technology expertise to a range of industries to accelerate the commercialisation of ideas to profitable products

– Grown to +150 staff in the past 7 years

• CPI has developed a strong and influential position within the UK and now the EU

• Recently awarded TIC status.

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CPI Operating Space

Science£1

Universitybased and

curiosity driven

10 - 15 years

Academic skillset

£63

Industry basedand market led

3 - 10 years

Techno-commercialskillset

AssetsMoneyResearch

Technology Readiness Levels 1 - 3

InnovationTechnology Readiness Levels 4 - 7

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CPI Operating Space

TRL 1 TRL 2 TRL 3 TRL 5 TRL 4 TRL 6 TRL 7 TRL 8 TRL 9

Launch andOperations

TechnologyDemonstration

TechnologyDevelopment

Research toprove Feasibility

Basic TechnologyResearch

SystemSub-System Dev

Knowledge Development Technology Development Business Development

CPIACADEMIA INDUSTRY

TRL 1TRL 1 TRL 2TRL 2 TRL 3TRL 3 TRL 5 TRL 5 TRL 4TRL 4 TRL 6TRL 6 TRL 7TRL 7 TRL 8TRL 8 TRL 9TRL 9

Launch andOperations

TechnologyDemonstration

TechnologyDevelopment

Research toprove Feasibility

Basic TechnologyResearch

SystemSub-System Dev

Knowledge Development Technology Development Business Development

CPIACADEMIA INDUSTRY

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• A World Class Innovation Centre supporting the Process Industries

This is Done by:

• Providing assetsto prove concepts, develop technology and demonstrate it to reduce scale up risks

• Creating collaborative partnershipsbetween industry, academia, public and private sectors to leverage resource and reduce development risks

• Building multi-disciplinary teamsthat cross the boundaries between invention and delivery by combining engineering, process development and systems skills

• Creating new businesses and joint ventures where appropriate

CPI Vision

This Approach is Unique in the UK

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CPI Model

An Internationally ranked Innovation Centre

CPI Technology

CPI Enterprises

CPI Economic Support

Economic DevelopmentDirectly Supporting Regional

Business Development

Developing TechnologyInternational Activity

National ScopeEU/UK Policy Influence

Spin-out BusinessesNew Businesses to Create

Value from Technology

Sustainable processingBio-Fuels, Bio-Process, Renewable Energy

Printed ElectronicsOTFTs, Solid State Lighting, PV cells

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CPI locations in North East England

All CPI facilities for printed/plastic electronics and NIBF located within 30-40 minutes of each other

Newcastle

Durham

Wilton

Sedgefield

North Sea

30km

R2R sputterFacility & NIBF

PETEC prototyping facility

NewcastleALD facility

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CPI: Sedgefield and Wilton sites

Wilton site – CPI headquarters, R2R sputter facility, barrier testing facilities

NIBF facility

Sedgefield - PETEC prototyping facility for processing up to 12” plastic electronic devices

Phase 2 expansion, pilot facilities for OLED-lighting (200mm), display backplane line (cassette to cassette, non-contact lithography)

2

R2R coater

NIBF

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CPI Technology: Printed Electronics (PETEC)

• National Printed Electronics Facility

• R2R Sputter coating and ALD systems in

satellite locations

• Drives the growth of a new UK industry

sector

• Asset and expertise base

An Internationally Competitive Technology Innovation Centre for Printed and Plastic Electronics ,

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CPI Technology: Sustainable Processing (SUSPROC)

• National Industrial Biotechnology Facility

• National Anaerobic Digestion Development Centre

• Advanced Manufacturing & low impact processes

• Underpin and develop a successful UK sector

• Asset and expertise base

An Internationally Competitive Technology Innovation Centre for Sustainable

Processing, Low Carbon & Industrial Bio-technology

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Traditional Uses for Roll to Roll Vacuum Coating

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Electronics Applications for TCOs, Barrier Films and Metallised Film

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OptilabTM Sputter Coater

•Medium Frequency AC dual rotatable magnetron

•720mm length, 152mm ID

•6-12mm target wall thickness

•Planar 10kW pulsed power DC magnetron

•650 x 135mm target area

In-line optical and electrical resistance monitoring

Plasma Treatment

400mm web width(356mm coating width)

Web speed 0.1 – 20m/min

12 – 250 micron webs

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FESF Cleanroom

ParticleCounts(≥0.5μ)

~10 to100(at rest)

© & Confidential to The Centre for Process Innovation Ltd

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ITO from a Ceramic TargetIn2O3/SnO2 (10%wt),

99.99% purity

Usage between cleaning:

~ 8 hours @ 2.8kW (2.0W/mm)

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ITO: Resistance MinimaResistivity Minimum for ITO from Ceramic Target at

2.8kW, 0.004mbar

6.0E-04

7.0E-04

8.0E-04

9.0E-04

1.0E-03

1.1E-03

1.2E-03

1.00 1.50 2.00 2.50 3.00 3.50

% Oxygen Concentration

Re

sis

tiv

ity

(o

hm

cm

)

ITO Transmission Spectra

0

10

20

30

40

50

60

70

80

90

100

300 400 500 600 700 800

Wavelength (nm)

%T No oxygen

1.38% oxygen

1.75% oxygen

2.13% oxygen

2.65% oxygen

3.04% oxygen

PET Ref

99.9nm

96.0nm

96.8nm

97.9nm

97.8nm

Dependence of Sheet Resistance on Oxygen % for Different Pressures at 2 .8kW Sputter Power

60

70

80

90

100

110

120

130

140

0.50 1.00 1.50 2.00 2.50 3.00 3.50 4.00

Oxygen Concentration (%)

Sh

eet R

esis

tan

ce (o

hm

s/sq

)

2E-3mbar

4E-3mbar

6E-3mbar

8E-3mbar

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ITO UniformityITO Uniformity Curves

(2.8kW; 0.004mbar; 100mm target-film distance)

60

65

70

75

80

85

90

95

100

0 50 100 150 200 250 300 350

Position across web (mm)

She

et R

esis

tanc

e (o

hms/

sq) 1.67%O2

1.75%O2

1.97%O2

2.13%O2

2.36%O2

2.5%O2

ITO Coating Uniformity (2.8kW; 0.0054mbar; 115mm target-web distance)

60

65

70

75

80

85

90

95

100

0 50 100 150 200 250 300 350

Position across web (mm)

She

et R

esis

tanc

e (o

hms/

sq) 1.81%O2

2.05%O2

2.27%O2

2.50%O2

2.63%O2

2.8%O2

N.B. DC pulsing at 100kHz with 2μs pulse used for all depositions in this presentation

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SEM Images of ITO on PET

ArO2 plasma-pre-treated No plasma-pre-treat

Average Grain Size: 47nm

Surface Roughness: 5.40nm

Average Grain Size: 32nm

Surface Roughness: 3.99nm

Average Grain Size: 17nm

Surface Roughness: 2.64nm

Average Grain Size: 29nm

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Teamwork

Business Managers

Customers

Finance

Partners/ Collaborators

Politicians

Neighbours

Health & Safety

Engineers/ Technicians

Suppliers

Wider Technical Community

Scientists from all disciplines

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Acknowledgements

Mark Hodgson (DTF)

Kevin Luxmore

Steven Edge

Alf Smith

Thank-You For Listening