A4193_ROC364

Flow Computer DivisionWebsite: www.EmersonProcess.com/flow

Form A4193Part Number D301060X012May 2002

ROC364 REMOTE OPERATIONS CONTROLLERInstruction Manual

ROC364 Instruction Manual

ii Rev 5/02

Revision Tracking SheetMay 2002

This manual is revised periodically to incorporate new or updated information. The revision level ofeach page is indicated at the bottom of the page opposite the page number. A major change in thecontent of the manual also changes the date of the manual which appears on the front cover. Listedbelow is the revision level of each page.

Page Revision

All pages 5/02

ROCLINK is a mark of one of the Emerson Process Management companies. The Emerson logo is a trademark and servicemark of Emerson Electric Co. All other marks are the property of their respective owners.

© Fisher Controls International, Inc. 1992-2002. All rights reserved.Printed in the U.S.A.

While this information is presented in good faith and believed to be accurate, Fisher Controls does not guarantee satisfactoryresults from reliance upon such information. Nothing contained herein is to be construed as a warranty or guarantee,express or implied, regarding the performance, merchantability, fitness or any other matter with respect to the products, noras a recommendation to use any product or process in conflict with any patent. Fisher Controls reserves the right, withoutnotice, to alter or improve the designs or specifications of the products described herein.


Rev 4/02 iii

Table of Contents

SECTION 1 — GENERAL INFORMATION ............................................................ 1-1

1.1 SCOPE OF MANUAL.................................................................................................................1-1

1.2 PRODUCT OVERVIEW.............................................................................................................1-2

1.3 INSTALLATION GUIDELINES ....................................................................................................1-2

1.4 POWER SUPPLY REQUIREMENTS ........................................................................................1-6

1.5 STARTUP AND OPERATION.................................................................................................1-10

1.6 SERVICE BULLETINS ............................................................................................................1-12

SECTION 2 MASTER CONTROLLER UNIT AND I/O MODULE RACK......... 2-1

2.1 SCOPE .........................................................................................................................................2-1

2.2 PRODUCT DESCRIPTIONS......................................................................................................2-1

2.3 INSTALLATION.......................................................................................................................2-12

2.4 CONNECTING THE MCU TO WIRING.................................................................................2-15

2.5 TROUBLESHOOTING AND REPAIR ....................................................................................2-18

2.6 ROC364 SPECIFICATIONS.....................................................................................................2-25

SECTION 3 — INPUT/OUTPUT MODULES ........................................................... 3-1

3.1 SCOPE .........................................................................................................................................3-1

3.2 MODULE DESCRIPTIONS........................................................................................................3-1

3.3 INITIAL INSTALLATION AND SETUP ..................................................................................3-6

3.4 CONNECTING THE I/O MODULES TO WIRING ..................................................................3-6


3.6 REMOVAL, ADDITION, AND REPLACEMENT..................................................................3-31

3.7 I/O MODULE SPECIFICATIONS............................................................................................3-33

SECTION 4 — COMMUNICATIONS CARDS......................................................... 4-1

4.1 SCOPE .........................................................................................................................................4-1

4.2 PRODUCT DESCRIPTIONS......................................................................................................4-1


Table of Contents (Continued)

iv Rev 5/02


4.4 CONNECTING COMMUNICATIONS CARDS TO WIRING ...............................................4-12


4.6 COMMUNICATIONS CARD SPECIFICATIONS..................................................................4-21

SECTION 5 — I/O CONVERTER CARD.................................................................. 5-1

5.1 SCOPE .........................................................................................................................................5-1

5.2 PRODUCT DESCRIPTION ........................................................................................................5-1


5.4 TROUBLESHOOTING AND REPAIR ......................................................................................5-2

5.5 SPECIFICATIONS ......................................................................................................................5-4

APPENDIX A — LIGHTNING PROTECTION MODULE.................................... A-1

A.1 SCOPE ........................................................................................................................................A-1

A.2 PRODUCT DESCRIPTION .......................................................................................................A-1

A.3 INITIAL INSTALLATION ........................................................................................................A-2

A.4 CONNECTING THE LPM TO WIRING...................................................................................A-3

A.5 TROUBLESHOOTING AND REPAIR .....................................................................................A-3

A.6 LPM SPECIFICATIONS............................................................................................................A-4

APPENDIX B — LOCAL DISPLAY PANEL ............................................................B-1

B.1 SCOPE ........................................................................................................................................ B-1

B.2 PRODUCT DESCRIPTION ....................................................................................................... B-1

B.3 INSTALLATION........................................................................................................................ B-2

B.4 OPERATION .............................................................................................................................. B-5

B.5 TROUBLESHOOTING AND REPAIR ................................................................................... B-26

B.6 LDP SPECIFICATIONS........................................................................................................... B-26

APPENDIX C — I/O SIMULATION ......................................................................... C-1

C.1 SCOPE ........................................................................................................................................ C-1


Table of Contents (Continued)

Rev 5/02 v

C.2 ANALOG OUTPUTS TO ANALOG INPUTS.......................................................................... C-1

C.3 ANALOG OUTPUTS TO AMMETER...................................................................................... C-2

C.4 DISCRETE OUTPUTS TO DISCRETE INPUTS ..................................................................... C-3

C.5 DISCRETE OUTPUTS TO PULSE INPUTS ............................................................................ C-4

C.6 POTENTIOMETER TO ANALOG INPUTS............................................................................. C-5

C.7 SWITCH TO DISCRETE INPUTS ............................................................................................ C-6

C.8 SWITCH TO PULSE INPUTS................................................................................................... C-7

GLOSSARY OF TERMS ............................................................................................. G-1

TOPICAL INDEX...........................................................................................................I-1


vi Rev 5/02


Rev 5/02 1-1

SECTION 1 — GENERAL INFORMATION

1.1 SCOPE OF MANUAL

This manual focuses on the hardware aspects of the ROC364 Remote Operations Controller (ROC).All versions of this product are covered in this manual, including ROCs with either a FlashPAC or aROCPAC memory module (responsible for certain differences as noted in this manual). For softwareaspects such as configuration, refer to the appropriate configuration user manual: ROCLINKConfiguration Software User Manual (Form A6051) or ROCLINK for Windows Configuration SoftwareUser Manual (Form A6091).

This manual contains the following sections:

Section 1 - General Information - describes related manuals and provides an overview of the ROChardware.

Section 2 - Master Controller Unit and I/O Module Rack - provides information on installation, wiring,troubleshooting, and specifications for the Master Controller Unit (MCU), memory modules, I/Omodule rack, and backplate.

Section 3 - Input/Output (I/O) Modules - provides information and specifications for the I/O modulesavailable for the ROCs.

Section 4 - Communication Cards - provides information and specifications for the communicationscards available for the ROCs.

Section 5 - Input/Output Converter Card - describes information and specifications for the optional I/OConverter Card.

Appendix A - Lightning Protection Module - details the optional Lightning Protection Module.

Appendix B - Local Display Panel - describes how to use the optional Local Display Panel (LDP) toaccess operational data in the ROC. If the ROC has a FlashPAC, then the LDP can also be used forcertain configuration changes.

Appendix C - I/O Simulation - shows various ways to set up I/O simulation for troubleshootingcomponents and configurations.

Information on accessory items for the ROC, such as enclosures, batteries, and power supplies, iscontained in the ROC/FloBoss Accessories Instruction Manual (Form A4637).


1-2 Rev 5/02

1.2 PRODUCT OVERVIEW

The ROC364 is a microprocessor-based controller that provides the functions required for a variety offield automation applications. The unit is used primarily where there is a need for remote monitoring,measurement, data archival, and control. You can configure the ROC364 for specific applicationsincluding those requiring calculations, PID control, or logic/sequencing control. Refer to Section 1.1for a list of user manuals containing configuration information.

The ROC364 features modularized field inputs and outputs (I/O), which provide the flexibility to meetthe requirements of a specific application. Up to 64 I/O modules can be used in any combination ofdiscrete inputs, discrete outputs, analog inputs, analog outputs, and pulse inputs.

The modular design of the ROC364 makes it cost-effective for both small and large applications. Youcan select from a variety of communications and operator interface options to customize the installationfor a given system. The ROC is approved for use in Class I – Division 2 hazardous area locations. TheROC is available either with a FlashPAC or a ROCPAC main memory module.

ROC units with a FlashPAC have some additional features contained in firmware, such as 1992 AGAflow calculations, RBX alarm messaging, Local Display Panel configuring, and radio power control.For ROCs with ROCPACs, additional memory is available to use for applications needing a largerhistory database or running multiple user programs.

Figure 1-1 shows the major components that make up the ROC master controller unit (MCU). Figure2-6 shows the outline and mounting dimensions for the ROC364 controller. See Section 2 for furtherhardware and firmware details.

1.3 INSTALLATION GUIDELINES

The design of the ROC makes it highly adaptable to a wide variety of installations; therefore, not allpossibilities can be covered in this manual. If additional information is required concerning a specificinstallation, contact your Fisher Representative.

Planning is essential to a good installation. Because installation requirements depend on many factorssuch as the application, location, ground conditions, climate, and accessibility, only generalizedguidelines can be provided in this document.

The variety of application firmware (embedded software) in the FlashPAC or ROCPAC modules allowsthe ROC364 to be used in many types of installations. For additional information concerning a specificinstallation, contact your local sales representative.

Refer to Section 2 for specific installation instructions.


Rev 5/02 1-3

BACKPLATE

MCU

I/O MODULE

MODULE

I/O RACK

DOC0049BModified

TERMINATION

ROCREMOTE OPERATIONSCONTROLLER

FLA

SH

PA

C

Figure 1-1. ROC364 Controller Components Mounted on Backplate

1.3.1 Environmental Requirements

The ROC364 needs protection from direct exposure to rain, snow, ice, blowing dust or debris,and corrosive atmospheres. If the ROC is installed outside of a building, it must be placed in aNEMA 3 or higher rated enclosure to ensure the necessary level of protection.

! NOTE: In salt spray environments, it is especially important to ensure that the enclosure issealed properly, including all entry and exit points. If salt is allowed to enter, it can shorten thelife of the lithium battery in the ROC and cause the battery to leak corrosive chemicals.

The ROCs are designed to operate over a wide range of temperatures. However, in extreme climates itmay be necessary to provide temperature controlling devices to maintain stable operating conditions. Inextremely hot climates, a filtered ventilation system or air conditioning may be required. In extremelycold climates, it may be necessary to provide a thermostatically controlled heater in the same enclosureas the unit. To maintain a non-condensing atmosphere inside the ROC enclosure in areas of high


1-4 Rev 5/02

humidity, it may be necessary to add heat or dehumidification. Section 2.6 contains the environmentalspecifications for the ROC.

1.3.2 Site Requirements

Careful consideration when locating the ROC on the site can help reduce future operational problems.The following items should be considered when choosing a location:

♦ Local, state, and federal codes often place restrictions on ROC locations and dictate siterequirements. Examples of these restrictions are fall distance from a meter run, distancefrom pipe flanges, and hazardous area classifications. Ensure that all code requirements aremet.

♦ Locate the ROC to minimize the length of signal and power wiring. By code, line powerwiring must not cross meter runs.

♦ Solar panels must be faced due South (not magnetic South) in the northern hemisphere anddue North (not magnetic North) in the southern hemisphere. Make sure nothing blocks thesunlight during any part of the day.

♦ ROCs equipped for radio communications should be located so the antenna has anunobstructed signal path. Antennas should not be aimed into storage tanks, buildings, orother tall structures. If possible, ROCs should be located at the highest point on the site.Overhead clearance should be sufficient to allow the antenna to be raised to a height of atleast twenty feet.

♦ To minimize interference with radio communications, locate the ROC away from electricalnoise sources, such as engines, large electric motors, and utility line transformers.

♦ Locate ROCs away from heavy traffic areas to reduce the risk of being damaged byvehicles. However, provide adequate vehicle access to aid monitoring and maintenance.

1.3.3 Compliance With Hazardous Area Standards

The ROC364 hazardous location approval is for Class I, Division 2, Groups A, B, C, and D. The class,division, and group terms are defined as follows:

1. Class defines the general nature of the hazardous material in the surrounding atmosphere.Class I is for locations where flammable gases or vapors may be present in the air inquantities sufficient to produce explosive or ignitable mixtures.

2. Division defines the probability of hazardous material being present in an ignitableconcentration in the surrounding atmosphere. Division 2 locations are locations that arepresumed to be hazardous only in an abnormal situation.


Rev 5/02 1-5

3. Group defines the hazardous material in the surrounding atmosphere. Groups A to D are asfollows:

♦ Group A - Atmosphere containing acetylene.♦ Group B - Atmosphere containing hydrogen, gases or vapors of equivalent nature.♦ Group C - Atmosphere containing ethylene, gases or vapors of equivalent nature.♦ Group D - Atmosphere containing propane, gases or vapors of equivalent nature.

For the ROC to be approved for hazardous locations, it must be installed in accordance with theNational Electrical Code (NEC) guidelines or other applicable codes.

When working on units located in a hazardous area (where explosive gases may bepresent), make sure the area is in a non-hazardous state before performing theseprocedures. Performing these procedures in a hazardous area could result in personalinjury or property damage.

1.3.4 Power Installation Requirements

Typical sources of primary power for ROC installations are line power and solar power. Be sure toroute line power away from hazardous areas, as well as sensitive monitoring and radio equipment.Local and company codes generally provide guidelines for line power installations. Adhere rigorouslyto all local and National Electrical Code (NEC) requirements for line power installations.

Solar power allows installation of the ROC in locations where line power is not available. The solarpanels and batteries must be properly sized for the application and geographic location to ensurecontinuous reliable operation. Information contained in the ROC/FloBoss Accessories InstructionManual (Form 4637) can help you determine the solar panel and battery requirements to fit yourapplication and location.

A site may have additional power requirements for radios, repeaters, and other monitoring devices.Power supply and converter accessories can minimize the number of separate power sources requiredfor an installation.

The ROC364 can operate from either a 12-volt or a 24-volt nominal power source. If 24-volttransmitter power is needed when operating on 12-volt power, the ROC364 requires an I/O ConverterCard option (see Section 5) to be installed. The ROC364 has a low-voltage cut-off circuit built in toguard against draining down power supply batteries.


1-6 Rev 5/02

1.3.5 Grounding Installation Requirements

Ground wiring requirements for line-powered equipment are governed by the National Electrical Code(NEC). When the equipment uses line power, the grounding system must terminate at the servicedisconnect. All equipment grounding conductors must provide an uninterrupted electrical path to theservice disconnect. This includes wire or conduit carrying the power supply conductors.

The National Electrical Code Article 250-83 (1993), paragraph c, defines the material andinstallation requirements for grounding electrodes.

The National Electrical Code Article 250-91 (1993), paragraph a, defines the materialrequirements for grounding electrode conductors.

The National Electrical Code Article 250-92 (1993), paragraph a, provides installationrequirements for grounding electrode conductors.

The National Electrical Code Article 250-95 (1993) defines the size requirements for equipmentgrounding conductors.

Proper grounding of the ROC helps to reduce the effects of electrical noise on unit operation and helpsprotect against lightning. Lightning Protection Modules are available to provide additional lightningprotection for field wiring inputs and outputs. Refer to Appendix A for more information aboutlightning protection. A surge protection device installed at the service disconnect on line-poweredsystems would also offer lightning and power surge protection for the installed equipment.

Telephone surge protectors should be installed for ROCs using modem communications cards.

All earth grounds must have an earth-to-ground rod or grid impedance of 25 ohms or less as measuredwith a ground system tester. The grounding conductor should have a resistance of 1 ohm or lessbetween the ROC enclosure ground lug and the earth ground rod or grid.

1.3.6 I/O Wiring Requirements

I/O wiring requirements are site and application dependent. Local, state, and NEC requirementsdetermine the I/O wiring installation methods. Direct buried cable, conduit and cable, or overheadcable are options for I/O wiring installations. Section 3 contains detailed information on connectingI/O wiring to the ROC.

1.4 POWER SUPPLY REQUIREMENTS

The power consumption of a ROC and related devices determines the requirements for either lineor solar power supplies. Table 1-1 and Table 1-2 provide information to assist in determining powersupply requirements.

Table 1-1 lists the power consumption of the ROC364 and the optional devices available for it. Includein the power consumption calculations of all device relays, meters, solenoids, radios, and other devices


Rev 5/02 1-7

which receive DC power from the ROC (excluding those connected to the I/O modules). Table 1-2 liststhe power consumption of the various I/O modules available.

For non-analog I/O, size the I/O module scaling resistors for optimal current to minimize current drainon the power supply. Refer to Section 3.

1.4.1 Determining I/O Channel Power Consumption

In estimating total I/O power requirements, the duty cycle of each I/O channel (I/O module) must beestimated. For a non-analog I/O channel, the duty cycle is essentially the percent of time that the I/Ochannel is active (maximum power consumption). For example, if a discrete output is active for 15seconds out of every 60 seconds, the duty cycle is:

Duty Cycle = Active time / (Active time + Inactive time)

Duty Cycle = 15 seconds / (15 seconds + 45 seconds) = 15 seconds / 60 seconds = 0.25

For an analog I/O channel, the duty cycle is approximated by estimating the percent of time that thechannel spends in the upper half of its range (span) of operation. For example, if an analog input wiredas a current loop (4 to 20 milliamp) device operates in the upper half of its range 75% of the time, then0.75 would be used as the duty cycle. If the analog channel generally operates around the midpoint ofits span, use 0.5 as the duty cycle.

To calculate the total power consumed by an I/O channel, first select either the 12 or 24 volt column inTable 1-1 or Table 1-2. Then, read the minimum (Pmin) and maximum (Pmax) power consumption valuefrom the table for the desired I/O channel. Use the following equation to calculate the powerconsumption for a channel with the duty cycle taken into account:

Power = (Pmax x Duty Cycle) + [Pmin (1 - Duty Cycle)]

Multiply this value by the quantity (Qty) of I/O channels with the same duty cycle and enter thecalculated value in the subtotal column. Repeat the procedure for all other I/O channels used. Totalthe values in the subtotal column in Table 1-2, and enter the value in the I/O Modules row of Table 1-1.


1-8 Rev 5/02

Table 1-1. Power Consumption of the ROC364 and Powered Devices

POWER CONSUMPTION (mW)SUB-

DEVICE 12V System 24V System QTY. DUTY TOTAL

Pmin Pmax Pmin Pmax USED CYCLE (mW)

MCU and I/O Module Rack 915 1705 1 N/A

I/O Converter Card1 230 N/A N/A

Local Display Panel 25 25 N/A

Serial Communications Card 135 135 N/A

Dial-up Modem Card 395 395 N/A

Leased Line Modem Card 110 110 N/A

Radio Modem Card 110 110 N/A

I/O Modules Total from Table 1-2 N/A N/A N/A

Radio (from Section 1.4.2) N/A N/A N/A

TOTAL

NOTE: 1. The power drawn by field devices connected to I/O modules is included in the Pmax figures in Table 1-2.


Rev 5/02 1-9

Table 1-2. Power Consumption of the I/O Modules

POWER CONSUMPTION (mW)SUB-

I/O MODULE 12V System 24V System QTY. DUTY TOTAL

Pmin Pmax2 Pmin Pmax

2 USED CYCLE1 (mW)

AI Loop 170 495 170 495

AI Differential 75 75 75 75

AI Source 110 305 130 470

AO Source 145 585 145 585

RTD Input (Pmin is at -50° C; Pmax is at100° C)

240 475 475 930

DI Isolated 1 10 1 10

DI Source 1 55 1 205

PI Isolated 1 30 1 30

PI Source 1 70 1 230

Low Level PI 1 45 1 45

SPI Isolated 1 10 1 10

SPI Source 1 55 1 205

DO Isolated 1 25 1 25

DO Source (Pmax is at 57 mA) 30 815 30 1585

DO Relay 12V 20 420 N/A N/A

DO Relay 24V N/A N/A 20 470

HART Interface Module 85 685 85 1285

TOTAL

NOTES: 1. For analog I/O channels, the Duty Cycle is the percent of time spent in the upper half of the operating range.2. The Pmax amount includes any power drawn by a ROC-powered field device such as a transmitter.

1.4.2 Determining Radio Power Consumption

In estimating power requirements for radios, the duty cycle for the radio must be estimated. The dutycycle is the percent of time the radio is transmitting (TX). For example, if a radio is transmitting 1second out of every 60 seconds, and for the remaining 59 seconds the radio is drawing receive (RX)power (P), the duty cycle is:

Duty Cycle = TX time / (TX time + RX time) = 1 second / 60 seconds = 0.0167


1-10 Rev 5/02

To calculate the total power consumed by a radio, obtain the power consumption values for transmitand receive from the radio manufacturer’s literature. Use the following equation to calculate the powerconsumption for a particular duty cycle:

Power = (PTX x Duty Cycle) + [PRX x (1 - Duty Cycle)]

Determine the power consumption for all radios that use power from the ROC, and enter the totalcalculated value in Table 1-1.

1.4.3 Totaling Power Requirements

To adequately meet the needs of the ROC system, it is important to determine the total powerconsumption, and to size solar panel and battery backup requirements accordingly. For total ROCpower consumption, add the device values in Table 1-1. Although Table 1-1 and Table 1-2 take intoaccount the power supplied by the ROC to its connected devices, be sure to add the power consumption(in mW) of any other devices used with the ROC in the same power system, but are not accountedfor in the tables.

Convert the total value in milliwatts (mW) to Watts by dividing it by 1000.

mW / 1000 = Watts

For selecting an adequate power supply, use a safety factor of 1.25 to account for losses and othervariables not factored into the power consumption calculations. To calculate the power supply safetyfactor (Psf), multiply the total power consumption (P) by 1.25.

Psf = P x 1.25 = _____ Watts

To convert power supply safety factor (Psf) to current consumption in amps (Isf), divide Psf by thesystem voltage (V), either 12 or 24 volts.

Isf = Psf / V = _____ Amps

1.5 STARTUP AND OPERATION

Before starting up the ROC, perform the following checks to ensure the unit is properly installed.

♦ Make sure the enclosure has a good earth ground.♦ Make sure the MCU is grounded at the power input connector.♦ Make sure all I/O module racks are grounded at the GND screw.♦ Make sure the MCU and I/O module racks are secured to the factory backplate.

♦ Ensure memory modules are seated in their connectors. If a FlashPAC is present, make sure noRAM modules are installed.

♦ Seat and secure all I/O modules in their sockets.


Rev 5/02 1-11

♦ Check the field wiring for proper installation.♦ Make sure the input power has the correct polarity.♦ Make sure the input power is fused at the power source.

Check the input power polarity before turning on the power switch. Incorrect polaritycan damage the ROC.

When installing units in a hazardous area, ensure that the components selected are labeledfor use in such areas. Change components only in an area known to be non-hazardous.Performing these procedures in a hazardous area could result in personal injury orproperty damage.

! NOTE: For proper startup, the minimum input voltage level must be 12.5 volts or more for a12-volt unit, and 25 volts or more for a 24-volt unit. Once the unit has been successfully started,the ROC continues to operate normally over the specified input voltage range. If you are unsureof the input voltage setting for your ROC, refer to the paragraphs on setting the input voltagejumpers in Section 2.

1.5.1 Startup

Apply power to the ROC364 by plugging in the power terminal block. The POWER indicator shouldlight to indicate that the applied voltage is correct. Then, the SYSTEM STATUS indicator should light,and stay lit, to indicate a valid reset sequence has been completed. After internal checks have beencompleted, both AUX PWR indicators should light. The startup sequence may take up to 5 seconds. Ifany of the indicators do not light, refer to the Troubleshooting details in Section 2 for possible causes.

1.5.2 Operation

Once startup is successful, configure the ROC to meet the requirements of the application. TheROCLINK Configuration Software User Manual describes in detail the procedure for configuring theROC. Once the ROC is configured and I/O is calibrated, it can be placed into operation.

Local configuration or monitoring of the ROC unit through its LOI port must beperformed only in an area known to be non-hazardous. Performance of these proceduresin a hazardous area could result in personal injury or property damage.

The ROC can be operated from a host system using ROCLINK software. Consult with your local salesrepresentative for more information on host system compatibility.


1-12 Rev 5/02

1.6 SERVICE BULLETINS

Service bulletins are issued on a monthly basis to provide information related to problems or upgradesto hardware and software products. Your local sales representative is responsible for ensuringcustomers receive these service bulletins as required. Contact your local sales representative for moreinformation.


Rev 5/02 2-1

SECTION 2MASTER CONTROLLER UNIT AND I/O MODULE RACK

2.1 SCOPE

This section describes the core of the ROC364 components, including the Master Controller Unit(MCU), the memory modules, the I/O Module rack, the backplate, and the front panel. In most cases,the two versions (with FlashPAC or with ROCPAC) of the ROC364 are identical in design andoperation. The descriptions and procedures in this section apply to both versions. In areas where theversions differ, the differences are noted. Topics covered include:

♦ Product Descriptions 2-1♦ Initial Installation and Setup 2-13♦ Connecting the MCU to Wiring 2-16♦ Troubleshooting and Repair 2-19♦ Specifications 2-26

2.2 PRODUCT DESCRIPTIONS

The following subsections describe components of the ROC364 unit: Master Controller Unit, FlashPACModules, ROCPAC Modules, RAM Modules, Diagnostic Inputs, I/O Module Rack, and Backplate.

2.2.1 Master Controller Unit

The Master Controller Unit (MCU) is the “brain” of the ROC. Figure 2-1 shows a front view of theMCU. The MCU consists of:

♦ NEC V25+ microprocessor ♦ I/O converter card connector♦ On-board memory ♦ I/O module rack connector♦ Memory module sockets (not used with FlashPAC) ♦ Diagnostic inputs♦ Operator interface port ♦ Auxiliary outputs♦ Local display port ♦ Status indicators♦ Communications ports ♦ Metal housing♦ Power fusing and terminations


2-2 Rev 5/02

DOC0119A

SYSTEMSTATUS

GND

AUX PWROUT 1

DC PWRIN

+--+

AUX PWROUT 2

AUX OUT 2

AUX OUT 1

--++

POWER

OPERATORINTERFACE

COM2 COM1 DISPLAY

ROC

REMOTE OPERATIONSCONTROLLER

FLASHPAC

RAMMEMORY EXPANSION

321

F3

F2

F1

AUX OUT 25A, 32 VDC

5A, 32 VDCAUX OUT 1

POWER2A S.B., 32 VDC

®

Figure 2-1. Master Controller Unit

The NEC V25+ is a 16-bit CMOS microprocessor featuring dual 16-bit internal data buses and a single8-bit external data bus. The unit can address up to one megabyte of memory and features high-speeddirect memory access.

The on-board memory on the main circuit board includes 128 Kbytes of battery-backed, random accessmemory (RAM) for storing data, and 32 Kbytes of electrically erasable programmable read onlymemory (EEPROM) for storing configuration parameters. Plug-in sockets are provided for theFlashPAC module or the ROCPAC and RAM modules. The ROC requires either a FlashPAC orROCPAC to operate. RAM modules are optional when you are using a ROCPAC module.

The operator interface connector provides direct communications between the ROC and the serial portof an operator interface such as a notebook computer. The interface gives you access to thefunctionality of the ROC.

The display connector links the MCU to an optional Local Display Panel (LDP), also called an LCDpanel. The LDP provides local monitoring of I/O and database parameters, as set up by using the con-figuration software. For a ROC with a FlashPAC, limited editing of parameter values can be performedwith the LDP; refer to Appendix B. The LDP can also be used to perform a cold hard start if the ROChas a FlashPAC or a ROCPAC that is Version 1.63 or greater (with the FlashPAC, the cold start usesfactory defaults; all AGAs, PIDs, FSTs, and user programs must then be restarted). To perform thecold start, press and hold down the left-most button of the LDP for 5 to 10 seconds during power-up.

The communications connectors labeled COM1 and COM2 allow electrical access to two optionalcommunications cards installed on the MCU board. The cards can provide serial data communications,modem, radio modem, or leased-line modem communications.

The I/O Converter Card connector accommodates the optional I/O Converter Card, which provides 24-volt transmitter power in 12-volt systems (see Section 5 for details). The connector uses a jumper whenthe converter card is not installed.

ROM


Rev 5/02 2-3

The I/O module rack connector provides the connection point for the first I/O module rack. Up to threeadditional I/O module racks are installed by plugging into a connector on the previous I/O rack.

Five diagnostic analog inputs are provided in the MCU and are dedicated to monitoring the following:

♦ Voltage of the input power to the ROC♦ Temperature of the MCU circuit board♦ Voltage for the transmitter supply output♦ Voltages for two auxiliary power outputs (ROC with ROCPAC only)

Power fusing is accessible from the front of the MCU. Fuses are used for the input power and auxiliarypower outputs. Terminal blocks located on the front panel provide terminations for the input andauxiliary output power. The source of auxiliary power is the input power, which can be a nominal 12 or24 volts, depending on the setting of jumpers located on the MCU circuit board (see Section 2.3.3).

Indicators are provided for system status, ROC power, and auxiliary power. The system statusindicator, when on, indicates the MCU is normal; when blinking, it indicates the MCU is not running;and when off, it indicates a missing or out-of-tolerance input voltage. The ROC and auxiliary powerindicators, when on, show that power is applied to the respective terminals.

The MCU is housed in a metal case that protects the electronics from physical damage. For protectionfrom outdoor environments, the unit must be housed in an approved enclosure.

2.2.2 FlashPAC Module

The FlashPAC module contains the operating system, the applications firmware, and communicationsprotocol, as well as memory storage for history logs and user programs. A FlashPAC module contains512 KB of flash read-only memory (ROM) and 512 KB of battery-backed Static Random AccessMemory (SRAM). A FlashPAC (or ROCPAC - see Section 2.2.3) module is required for the ROC tooperate. Back-up power for the RAM is provided by a self-contained lithium battery. Figure 2-2 showsa FlashPAC module.

The applications firmware consists of functions contained in flash ROM such as:

♦ AGA3 (1985 and 1992 algorithms) and AGA7 Flow Calculations, with metric conversion♦ PID Loop Control♦ Support for Function Sequence Tables (FSTs)♦ Communications Enhancement (includes dial-up RBX alarming)♦ Local Display Panel Enhancement (database point monitoring along with limited configuration

access)♦ Radio Power Control (new with FlashPAC Version 2.1)


2-4 Rev 5/02

ROC300 SERIES

VER: 2.10PATENT 5339425

FLASHPAC

®

DOC0292A

-------------

W20217X0012

Figure 2-2. Typical FlashPAC Module

The firmware is programmed into flash memory at the factory, but can be reprogrammed in the field,should the need arise. The application programs are configured by using ROCLINK ConfigurationSoftware. To configure Radio Power Control you need ROCLINK for DOS Version 2.10 or greater orROCLINK for Windows Version 1.00 or greater. The ROCLINK software also allows you to loaduser programs, such as the Modbus communications protocol, into the FlashPAC.

When used with ROCLINK software, a ROC with a FlashPAC module can save a configuration to diskas an .FCF file and later restore these configuration files back into a ROC with a FlashPAC. TheROCLINK software also provides a utility to upgrade from a ROCPAC to a FlashPAC. The configu-ration software includes diagnostic functions for viewing memory allocation and for loading programsinto flash memory.

! NOTE: RAM modules must not be installed in a ROC with a FlashPAC. If a RAM module ispresent, the ROC may not operate properly.

The RAM in a FlashPAC can store 87 history points, each holding 35 days of hourly values. Besidesstoring history data, the RAM in a FlashPAC stores user program data. The flash ROM portion of theFlashPAC is programmed with firmware at the factory; in addition, it can store user programsdownloaded through a communications port on the MCU. Flash memory is available for loading userprograms.

User programs that were previously used in ROCs with ROCPACs require modification by the supplierof the program in order to be used in a ROC with a FlashPAC. Keep in mind that the following userprograms are no longer needed, because they are permanently stored in the FlashPAC:


Rev 5/02 2-5

♦ 1992 AGA flow calculations♦ Communications Enhancement♦ Local Display Panel Enhancement

Table 2-3 (on page 2-7) shows how the ROC memory is allocated. Each memory location range (forexample, 00000 to 1FFFF) represents 128 Kbytes of memory.

Determining FlashPAC VersionTo determine the version of FlashPAC module installed in a ROC, you can either look at the label onthe module (you might need to remove the module retainer to see version number) or you can use theROCLINK Configuration Software to call up the System Information display. Look specifically at theVersion Name parameter. Note that the version may have been updated in the field by a download ofupgrade firmware into the module, so the label on the module might not be accurate.

2.2.3 ROCPAC Module

The ROCPAC module contains the operating system, the applications firmware, and communicationsprotocol. All ROCPAC modules, except for the RP1H module, contain both erasable programmableROM (EEPROM) and static random-access memory (SRAM). The RP1H module contains EPROMonly. A ROCPAC (or a FlashPAC--see Section 2.2.2) is required for the ROC to operate. Back-uppower for the RAM is provided by a self-contained lithium battery. The ROCPAC modules availablefor the ROC64 product are listed in Table 2-1.

Two types of ROCPAC modules are available for a ROC364, the first containing 128 Kbytes of read-only memory (ROM), and the second containing both the ROM and 128 Kbytes of random-accessmemory (RAM). Modules with a selection code prefixes of RPL contain the 128 Kbytes of battery-backed static random-access memory. The ROM portion of either type is programmed at the factorywhen the ROC is ordered. The RAM portion of the ROC can store user programs downloaded throughthe operator interface port on the MCU.

ROCs using a ROCPAC may require an additional RAM module (see Section 2.2.4) for user programsor history database storage. For user programs, select the RAM based on the availability of memory atthe location into which the program will be loaded.


2-6 Rev 5/02

Table 2-1. ROCPAC Selection Codes

ROC364Selection

CodeDescription

RPL1H

RPL2H

Operating System with Applications* and RAM

Operating System with Applications* and Modbus Protocol**

* Applications include AGA Flow Measurement and Reporting, PID Loop Control, and FST Control.

** Modbus Protocol is also available separately on disk for downloading to the RPL1H and RPS1H modules.

Determining ROCPAC VersionTo determine the version of ROCPAC module installed in a ROC, you can either look at the label onthe module (you might need to remove the module retainer to see version number) or you can use theConfiguration Software to call up the System Information display in ROCLINK software. Lookspecifically at the Version Name parameter.

2.2.4 RAM Modules

If the ROC uses a ROCPAC, up to three RAM expansion modules can be installed in memory slots 2,3, and 4. A RAM module can increase ROC memory by 128 Kbytes or 256 Kbytes for history data,communication protocol emulation programs, or other user programs. RAM modules provide memoryspace that exceeds the capacity of the on-board memory or RAM in a ROCPAC.

! NOTE: RAM modules must not be installed in a ROC with a FlashPAC. If a RAM module ispresent, the ROC may not operate properly.

RAM modules are required when the base RAM capacity of a ROC is inadequate or when a certainmemory region is required by an application. Back-up power is provided by a self-contained lithiumbattery. Table 2-2 lists the RAM modules available for the ROC364. Table 2-3 shows how the ROCmemory is allocated. Each memory location range (for example, 00000 to 1FFFF) represents 128Kbytes of memory.

Table 2-2. RAM Module Usage

RAM ModuleSelection Code

Quantity Size MemorySlot

RAM1H 1 128 KB 1RAM2H 2 128 KB 1 and 2RAM4H 1 256 KB 1, 2, or 3


Rev 5/02 2-7

Table 2-3. ROC Memory Map

Memory Location ROC300-Series withFlashPAC Module

ROC364 withROCPAC Module

How Used

00000 to 1FFFF

20000 to 3FFFF

40000 to 5FFFF

60000 to 7FFFF

Base RAM

RAM in FlashPAC

RAM in FlashPAC

RAM in FlashPAC

Base RAM

RAM1H or RAM4H

RAM2H or RAM4H

RAM4H

Alarm/Event Logs, etc.

History Data Area; in FlashPAC,part is for scratch-pad memory

History Data Area

History Data in FlashPAC;User Programs for ROCPAC

80000 to 87FFF

88000 to 9FFFF

A0000 to BFFFF

C0000 to DFFFF

E0000 to FFFFF

EEPROM (on-board)

Flash ROM

RAM in FlashPAC

Flash ROM

Flash ROM

EEPROM (on-board)

(unused)

RAM4H or RAMCH

RAM in ROCPAC(except RP1H)

Any ROCPAC

User Configuration Data

Operating System and Applications

User Program Data in FlashPAC;User Programs for ROCPAC

User Program Code in FlashPAC;User Programs for ROCPAC

Operating System Firmware

The 256-Kbyte RAM module is partitioned into two 128-Kbyte segments by setting switches located onthe side of the module. Table 2-4 shows how the switch settings affect the way the module is used.

Table 2-4. Switch Settings for 256 Kbyte RAM Module

1st 128 KbyteSEGMENT

2nd 128 KbyteSEGMENT

SWITCHSETTINGS*

1 2 3 4

MEMORYLOCATIONS

History Database 1 History Database 2 1 0 1 0 20000 - 3FFFF

40000 - 5FFFF

History Database 1 User Programs 1 0 0 1 20000 - 3FFFF

A0000 - BFFFF

User Programs History Database 2 0 1 1 0 60000 - 7FFFF

40000 - 5FFFF

User Programs User Programs 0 1 0 1 60000 - 7FFFF

A0000 - BFFFF

* Switches 1 and 2, or 3 and 4 must not be in position 1 concurrently.


2-8 Rev 5/02

Determining RAM Requirements (ROC with ROCPAC only)

The amount of RAM required for a particular ROC depends on how the RAM is used. For applicationprograms and communications protocols, it is only necessary to know how much memory theyconsume. Select the amount of RAM sufficient to meet the requirement. ROCs using a FlashPACalready have 512 Kbytes of RAM and do not use RAM modules. ROCs using a ROCPAC may need tohave RAM modules added for user programs or history database storage. For user programs, select theRAM based on the availability of memory at the location into which the program will be loaded.

For database storage, the amount of RAM required depends on the number of database points to bearchived and the number of days over which they are archived. Table 2-5 provides guidelines forselecting RAM for database storage.

For history database storage in a ROC with a ROCPAC, the RAM requirement depends on the numberof points and the number of days of archival. The maximum number of database points that can bearchived is 90; however, the number of days for which data can be archived is reduced in the BaseRAM (see Table 2-6).

Table 2-5. Estimating Database Memory Requirements

NUMBER OF ARCHIVEDDATABASE POINTS DAYS OF HOURLY DATA AMOUNT OF RAM**

1 to 11 35 012 to 30 386 / (Number of Points)* 0

30 additional 35 128 Kbytes60 additional 35 256 Kbytes

* Truncated to integer value.** Adding RAM will not increase the days of hourly data for the first 30 database points.

If all database points are configured for the maximum 35-day storage of hourly values:

♦ The base RAM can store values for 11 points.♦ 128 kilobytes of expansion RAM can store values for 30 additional points.♦ 256 kilobytes of expansion RAM can store values for 60 additional points.♦ The total number of points that can have values stored for 35 days is 71 points.

For example, if a ROC with a 128K RAM module is configured for the maximum number of databasepoints, then the number of days of storage for each point is:

♦ 12 days of hourly values for points 1 to 30 in the base RAM.♦ 35 days of hourly values for points 31 to 60 in the RAM module.


Rev 5/02 2-9

If a ROC with a 128K RAM module is configured for the maximum number of days (35) of storage ofhourly values, then:

♦ The base RAM can store values for 11 points.♦ The 128K RAM Module can store values for 30 points.♦ The total number of points that can have hourly values stored for 35 days is 41 points.

Table 2-6 shows the relationship between the number of database points configured and the number ofdays of hourly data that can be archived for the base RAM.

Table 2-6. Base RAM Database Point Relationship

NUMBEROF POINTS

DAYS OFHOURLY DATA

NUMBER OFENTRIES

1 to 11 35 84012 32 76813 29 69614 27 64815 25 60016 24 57617 22 52818 21 50419 20 48020 19 45621 18 43222 17 40823 16 38424 16 38425 15 36026 14 33627 14 33628 13 31229 13 31230 12 288


2-10 Rev 5/02

2.2.5 Diagnostic Inputs and Auxiliary Outputs

The ROC364 MCU board monitors the power input voltages and the board temperature with diagnosticanalog inputs designated as “E” points by the configuration software. The inputs can be calibrated by usingthe ROCLINK Configuration Software (see the appropriate ROCLINK User Manual for more information).ROCs with a FlashPAC have two discrete outputs for E3 and E4 instead of analog inputs.

For a ROC with a ROCPAC, the diagnostic inputs are:

♦ Transmitter voltage – E1♦ Power input voltage – E2♦ Auxiliary power #2 – E3♦ Auxiliary power #1 – E4♦ Circuit board temperature – E5

For a ROC with a FlashPAC, the diagnostic inputs and auxiliary outputs are:

♦ Transmitter voltage – E1♦ Power input voltage – E2♦ Auxiliary discrete output #1 – E3♦ Auxiliary discrete output #2 – E4♦ Circuit board temperature – E5

2.2.6 I/O Module Rack

The I/O module rack provides sockets for up to 16 I/O modules. Refer to Figure 2-3. A minimum ofone rack is required for any ROC connected to field I/O, and a maximum of four racks can beaccommodated. The first rack plugs directly into the I/O module rack connector on the bottom edge ofthe MCU. Additional racks plug into each other.

1 2 3 4 8765 9 14 15 1613121110

A B C CBA CBA CBA CBA CBA CBA CBA A B CA B CA B CA B C CBA CBA CBA CBA

MODULE RACK

GNDGND

A ®

DOC0030C

Figure 2-3. I/O Module Rack


Rev 5/02 2-11

2.2.7 Backplate

The ROC364 backplate is a mounting panel for an MCU and one or more I/O module racks.Backplates are available in three sizes to accommodate the indicated number of I/O racks: one rack,two racks, and three or four racks. Refer to Figure 2-4 for dimensions of the various backplates.

DIM A

DIM C

DIM

B

DIM

D

DIM G

MOUNTING STUD SIZE

DIM F

DIM E

DOC0243A

Figure 2-4. Backplate and Mounting Dimensions

DIM Maximum I/O Points16 32 64

A 12.40 11.60 11.25

B 11.34 21.46 28.58

C 13.34 13.00 12.25

D 13.12 22.26 29.38

E 3.94 3.94 4.06

F .38 .38 .50

G NO.10 5/16 5/16

DIM = Dimensions in inches


2-12 Rev 5/02

2.3 INSTALLATION

Component installation is normally performed at the factory when the ROC is ordered. However, themodular design of the ROC makes it easy to install and to change hardware configurations in the fieldas required. The following procedures describe installation of a ROC.

If you are installing the ROC364 into a ROC enclosure, fasten the backplate to the mounting studs ortapped mounting holes provided in the enclosure. If you installing the ROC364 on a wall panel or insome other enclosure, refer to Figure 2-4 for the recommended size and location of mounting studs.

For units that are currently in service, you must take certain precautions to ensure data is not lost,equipment is not damaged, and personnel are not exposed to electrical hazards. See the “Trouble-shooting and Repair” procedures in Section 2.5 for this information.

When installing units in a hazardous area, ensure that the components selected are labeledfor use in such areas. Change components only in an area known to be non-hazardous.Performing these procedures in a hazardous area could result in personal injury orproperty damage.

To add I/O modules, refer to Section 3. To add a communications card, refer to Section 4. If you needto install accessories for use with the ROC, such as a power supply or a Local Display Panel, refer tothe ROC/FloBoss Accessories Instruction Manual (Form A4637).

2.3.1 Mounting the Master Controller Unit to a Backplate

The master controller unit (MCU) and I/O module rack(s) are designed to be mounted to a factory-supplied backplate, which can be mounted inside an enclosure. The backplates are pre-drilled andtapped to accept the MCU and one to four I/O module racks. Refer to Figure 2-4.

To mount the MCU to a backplate:

1. Make sure the proper size backplate is being used for the number of I/O module racksto be installed.

2. Locate the alignment screws on the backplate and place the keyhole slots, located on thebase of the MCU, over the screw heads.

3. Slide the MCU over the alignment screws and secure in place with two 8-32 × 1 inch andtwo 8-32 × 2.25 inch screws.


Rev 5/02 2-13

2.3.2 Mounting an I/O Module Rack to a Backplate

Each I/O module rack has a male and female connector on opposite sides of the rack. The first I/O modulerack plugs directly into the MCU I/O module rack connector. Additional racks plug into each other.

To mount one or more I/O module racks to a backplate:

1. Insert the connector located on the edge of the first rack into the mating connector of theMCU. Align the rack with the mounting holes in the backplate and secure in place with five6-32 × 0.75 inch machine screws. Refer to Figure 2-4.

2. If a second rack is required, insert the edge connector of the second rack into the edgeconnector of the first rack. Align the rack with the mounting holes in the backplate andsecure in place with five 6-32 × 0.75 inch machine screws.

3. If additional I/O module racks are required, repeat step 2.

2.3.3 Setting Voltage Jumpers in the MCU

The MCU board contains a set of three jumpers to select the nominal input voltage of either 12 or 24volts. The factory default setting is for 12-volt operation. To access the jumpers, proceed as follows:

1. Remove the four screws holding the upper MCU cover in place, and lift off the cover.Unplug any terminal blocks and connectors, remove the two screws securing the lowerMCU cover, and lift off this cover as well.

2. Position jumpers P1, P2, and P3 in either the 12-volt or 24-volt position, depending on thenominal value of the ROC input voltage. The jumpers are located just to the right of thepower status indicators.

! NOTE: The 12 and 24 volt designations indicate nominal voltage values only. Whenconnected for 12-volt operation, the actual input voltage required for the ROC to start up is 12.5volts dc. Once powered up, the minimum voltage required to sustain operation (low-voltagecut-off) is 10.8 volts dc. Likewise, when connected for 24-volt operation, the start-up voltagerequired is 25 volts dc, and the low-voltage cut-off is 21.4 volts dc.

3. Replace the covers, screws, and connectors removed in Step 1.

2.3.4 Installing a RAM Module

Use the following procedure to add a RAM module. This procedure assumes the first-time installationof a RAM module in an out-of-service ROC; for an in-service ROC, refer to the memory modulereplacement procedure in Section 2.5.6.

Equipment and Tools Required: None


2-14 Rev 5/02


! NOTE: FlashPACs contain built-in RAM and do not require RAM modules.

1. Remove the memory module retainer by unscrewing the two thumbscrews and sliding theretainer straight out over the ROCPAC module.

2. Remove and discard the foam insert that blocks the unused slot in the retainer.

Before installing a memory module, make sure the module connector pins are not bent.Bent pins can damage the mating connector. Do not attempt to straighten bent pins;instead, replace the module.

3. Align the key on the module socket with the key of the MCU socket; in this position, the“R” of “RAM” on the label should be closest to the I/O terminals. Carefully insert themodule in the socket and press it in firmly, but gently to seat the module. The moduleshould move inward slightly. Verify that the module is seated in the connector by gentlylifting up on the module. If it comes out easily, repeat the process.

4. Carefully position the retainer over the modules, and tighten the thumbscrews. Make surethat the sloped surface of the retainer is down.

5. If a 256-Kbyte RAM module is being installed, be sure to set the RAM module switches forthe desired memory allocations. See Table 2-4 for the proper settings.


Rev 5/02 2-15

2.4 CONNECTING THE MCU TO WIRING

The following paragraphs describe how to connect the ROC to power, ground, and communicationswiring. For connections to field devices through I/O modules, refer to Section 3. Note that the powerand I/O wiring terminal blocks accept up to 12-gauge AWG solid or stranded copper wire.

Recommendations and procedures described in the following paragraphs must be followed carefully toavoid damaging equipment.

2.4.1 Connecting Ground Wiring

Equipment Required: Flat-blade (1/8-inch wide) screwdriver

The ROC and related components must be connected to earth ground. These include the MCU,I/O module racks, system I/O devices, and the system power source. Each component connects toearth ground (typically an enclosure ground bar) using the grounding screw provided. The componentsshould be linked using an 18 AWG or greater conductor. The earth ground wire from the ROCenclosure ground bar to ground should be at least 12 AWG.

Ground wiring requirements are governed by the National Electrical Code (NEC) code or otherapplicable codes. Excerpts from the NEC code are contained in Section 1 of this manual.

For the ROC itself, connect the GND terminal on the power connector (see Figure 2-5) to the enclosureground with 12 AWG wire. The enclosure ground must be connected to an appropriate ground rod orgrid.

2.4.2 Connecting Main Power Wiring

Equipment Required: Flat-blade (1/8-inch wide) screwdriver

Power connections to the ROC are made at the master controller unit (MCU) through plug-in terminalblocks. Refer to Figure 2-5. It is important good wiring practice be used when sizing, routing, andconnecting power wiring. All wiring must conform to state, local, and NEC codes.

The power terminal blocks can accommodate a wide range of wire gauges up to 12 AWG. Use 18AWG wire or larger for all power wiring.

The DC PWR IN +/- terminals (see Figure 2-5) are used for connecting the ROC to a DC power source.The input voltage and current requirements of the ROC are given in Section 2.6. Before makingconnections, make sure the voltage selection jumpers are in the proper position for the voltagebeing used, and the hook-up polarity is correct.

The input power is fused at 2 amps by slow-blow fuse (F1), which is accessible through the front panel,and by a 3-amp fuse located on the MCU board.


2-16 Rev 5/02

DOC0123A

-

AUX PWROUT 2

+--+

DC PWRIN

AUX PWROUT 1

GND

Figure 2-5. Power Wiring Connections

2.4.3 Connecting Auxiliary Power Wiring

The AUX PWR OUT 1 and AUX PWR OUT 2 terminals provide switched power from the DC PWRIN terminals to an external device such as a radio. The AUX PWR OUT 1 and 2 terminals are switchedindependently of each other under software control (see below). Both sets of terminals are disabled ifthe watchdog timer times out. The watchdog timer resets the system when power voltage is not met orexceeds the limitations of the ROC. The two sets of AUX PWR OUT 2 terminals are internallyconnected in parallel. The output voltage and current supplied by these terminals is specified in Section2.6.

The switches employed in the auxiliary outputs are solid-state relays. They exhibit a voltage dropproportional to the current load, typically in the range of 0 to 2 volts dc. The relays can be controlledautomatically by means of an FST that has been set up to determine the switching conditions. If aROCPAC is installed, the auxiliary outputs are switched by using the Aux 1 and Aux 2 parameters inthe ROC flags. If a FlashPAC is installed, the auxiliary outputs are switched by using the Statusparameter of Discrete Output point E3 or E4. An LED indicator for each output is activated when therespective output is energized.

The AUX PWR OUT 1 and AUX PWR OUT 2 terminals are fused at 5 amps by fuses F2 and F3,which are accessible on the front panel.

2.4.4 Connecting Communications Wiring


Rev 5/02 2-17

The ROC has the flexibility to communicate to external devices using several different formats andprotocols. Connectors located on the front panel of the ROC provide both operator interfaceand data communications.

The OPERATOR INTERFACE connector is a serial EIA-232 port for communications to aconfiguration and monitoring device. This device is typically a personal computer, such as anotebook PC. A null modem cable (wires to pins 2, 3, and 5, with the wires between pins 2 and 3cross-connected) is normally used between the OPERATOR INTERFACE connector and the PC.Figure 2-6 shows the wiring for this PC port.

+10 VDC

RECEIVETRANSMIT

DTR

RTSGROUND

EIA-232

MCU

2 236419875

+10 VDC

DOC0244A

8

57

36419

PORTINTERFACEOPERATOR

3

5

2

LAPTOP

578914623

SERIALCOMMUNICATIONSPORT

Figure 2-6. Operator Interface Connector Wiring Schematic

The DISPLAY connector is a parallel port for dedicated communications to an optional Local DisplayPanel. The cable supplied with the Local Display Panel plugs into this connector.

Two data communications ports, labeled COM1 and COM2 on the front of the MCU, are also provided.These ports are activated through optional plug-in communications cards. Section 4 details the types ofcommunications cards available and has information on connecting wiring to the COM1 and COM2connectors.


2-18 Rev 5/02

2.5 TROUBLESHOOTING AND REPAIR

The troubleshooting and repair procedures help the technician identify and replace faulty boards andmodules. Refer to Section 3.5 for troubleshooting I/O modules; see Section 4.5 for troubleshooting andreplacing a communications card. Return faulty boards and modules to your Fisher Representative forrepair or replacement.

The following tools are required for troubleshooting:

♦ IBM-compatible personal computer♦ ROCLINK Configuration Software (for DOS) or ROCLINK for Windows Configuration

Software♦ Digital multimeter (DMM), Fluke 8060A or equivalent

The configuration software runs on the personal computer and is required for a majority of thetroubleshooting performed on the ROC. Refer to the RL101 ROCLINK Configuration Software UserManual (Form A6051) or the ROCLINK for Windows Configuration Software User Manual (FormA6091).

2.5.1 RAM Backup Procedure

Before removing power to the ROC, perform the following procedure to avoid losing the ROCconfiguration and other data stored in RAM (in the event that backup power is not working). .

To back up the ROC configuration, perform the following steps. User programs cannot be saved todisk from the ROC; if these are lost or corrupted, they need to be reloaded from their original disk filesas instructed in the appropriate ROCLINK User Manual.

1. Save the current configuration data to EEPROM by using the “Write to EEPROM” flag.This action saves most of the ROC configuration (but not logs or FST programs) into thepermanent memory accessed when a cold start is performed.

2. Save the current configuration data to disk by using the “Download” option. This actionsaves the ROC configuration (but not FSTs) to a disk file.

3. Save all historical database logs (Minute, Hourly, and Daily) to disk using the “Collect ROCData” function.

4. Save the event and alarm logs to disk using the “Collect ROC Data” function.

5. Save the FSTs to disk by using the Write FST function in the FST Editor. Instructions forusing the FST Editor are contained in the Function Sequence Table User Manual (FormA4625).


Rev 5/02 2-19

2.5.2 Indicators

The indicators, located on the front panel of the MCU, give a first-level indication of the operation ofthe ROC. Figure 2-7 shows the location of the indicators and Table 2-7 describes them.

The primary indicator that the MCU is operating normally is the SYSTEM STATUS indicator. Thisindicator should light within a few seconds after power is applied, and then remain lit. If the SYSTEMSTATUS indicator does not remain lit, refer to Table 2-7 for possible causes.

POWERAUX OUT 1AUX OUT 2

SYSTEMSTATUS

DOC0122A

Figure 2-7. MCU Status Indicators

Table 2-7. MCU Status IndicatorsINDICATOR LED MEANING

POWER On Power is applied to the MCU.Off The MCU does not have power. Possible causes are:

• Power not present at power terminals• Power switch is off if so equipped (older units only)• Defective power switch (older units only)• Fuse F1 is open• Fuse F4 is open• Polarity reversed

SYSTEM On Successful startup and the processor is running.STATUS Blinking The processor is not running and the controller is attempting to

restart. Possible low battery, bad ROCPAC, or bad FlashPAC.Off If the POWER indicator is on, indicates insufficient voltage is

available to power up the MCU.AUX OUT 1 On System voltage is present at the AUX PWR OUT 1 terminals.

Off Fuse F2 is open or the output has been disabled by the software.AUX OUT 2 On System voltage is present at the AUX PWR OUT 2 terminals.

Off Fuse F3 is open or the output has been disabled by the software.


2-20 Rev 5/02

2.5.3 Fuses

The types of fuses used for the ROC364 and their rating values are listed in Table 2-8.

Table 2-8. ROC Fuses

FUSE RATING USEF1 2 A, 32 Volt Slow Blow Main Power InputF2 5 A, 32 Volt Fast Acting Auxiliary Power Output 1F3 5 A, 32 Volt Fast Acting Auxiliary Power Output 2F4 3 A, Bussman GFA 3 Main Power Input (Safety)

Fuses F1, F2, and F3 are accessible from the MCU front panel. Fuse F4 is located on the MCU board and isaccessible only by removing the upper MCU cover. In most cases, a visual inspection of the fuses willindicate whether or not they are open (blown). If in doubt, the DVM can be used to check for continuity.

To remove fuses F1, F2, or F3 for inspection or replacement, proceed as follows:

1. Disconnect the ROC from its power source.

2. Insert a screwdriver into the slot in the fuse holder cap and rotate counterclockwise 1/4 turn.

3. Remove the screwdriver. The cap and fuse will spring out. Remove the fuse from the cap.

Reverse steps 1, 2, and 3 to install the fuse.

Fuse F4 is soldered to the MCU board. Removal and replacement of fuse F4 is normally performed atthe factory, since it requires removal of the MCU board from its housing. Refer to section 2.5.7 for aprocedure on removing the MCU assembly.

2.5.4 RAM and Real-Time Clock Batteries

There is a battery on the processor board (installed in position B1 or B2) that provides power to thereal-time clock and backup power for the RAM. If this battery fails, the clock will stop running andthe ROC364 will stop operating (the STATUS LED should be blinking). The battery is a 3.6-voltlithium type and is secured with a hold-down clip. Under normal usage, this battery should last 5 to 10years. However, if the ROC364 is powered down for long periods of time, battery life will beshortened.

To check the condition of the clock battery, install a new battery (see the following procedure) in theunused battery socket location on the processor board, remove the existing battery, and use a multi-


Rev 5/02 2-21

meter to measure the voltage at the terminals of the removed battery. Leave the new battery installed ifthe voltage of the old battery is less than 3.2 volts. If the old battery is still good, you can re-install itinto its socket and remove the new battery.

To install a clock battery into a functioning ROC364 (if power is applied, it can remain applied):

To avoid circuit damage when working inside the unit, use appropriate electrostaticdischarge precautions, such as wearing a grounded wrist strap.

1. Locate the unused battery socket (typically B2) on the processor board. Insert the new batteryin this position.

2. Remove the old battery from the other battery socket (typically B1) by sliding the hold-downclip to one side and lifting the battery from the board. If the clip does not readily rotate, youmay need to loosen the screw that secures it.

3. Move the hold-down clip to the new battery (tighten the clip screw if you loosened it in Step 2).

If the old battery was too weak to power the clock (the STATUS LED blinks when power is applied),you need to reset the clock and reload the configuration.

2.5.5 Calibrating the Diagnostic Inputs

The diagnostic inputs can be calibrated when needed by using the ROCLINK Configuration Software.Connect a personal computer (with the configuration software loaded) to the operator interface port onthe ROC364. Follow the calibration procedures for diagnostic analog inputs in the appropriateROCLINK User Manual.

2.5.6 Replacing a FlashPAC, ROCPAC, or RAM Module

A faulty FlashPAC or ROCPAC module can be suspected if the Status LED is blinking or if the ROC isnot communicating. A faulty memory module containing RAM can be suspected if the RAM fails toshow up on the ROCLINK software screens as being installed, or if data is being corrupted. To replacea memory module, perform the following procedure.

Equipment Required: Personal computer with ROCLINK software installed.



2-22 Rev 5/02

! NOTE: There is a possibility of losing the ROC configuration and historical data held in RAMwhile performing the following procedure. As a precaution, save the current configuration andhistorical data to permanent memory as instructed in Section 2.5.1.

During this procedure, all power will be removed from the ROC and devices powered bythe ROC. Make sure that all connected input devices, output devices, and processes willremain in a safe state, when power is removed from the ROC and when power is restoredto the ROC. An unsafe state could result in property damage.

1. Remove power by unplugging the power terminal block.

2. Remove the memory module retainer by loosening the two thumbscrews and sliding theretainer over the memory modules.

3. Lift up on the module and remove it from the socket.

Before installing a new memory module, make sure the module connector pins arestraight. Bent pins can damage the mating connector. Do not attempt to straighten bentpins; instead, replace the module.

4. Align the key on the module socket with the key of the MCU socket. Carefully insert themodule in the socket and press it in firmly, but gently to seat the module. The moduleshould move inward slightly. Verify that the module is seated into the connector by gentlylifting up on the module. If it comes out easily, repeat the process.

5. Ensure that the foam insert (for any unused slots) is properly seated in the module retainer.Making sure that the sloped surface of the retainer is down, carefully slide the retainer overthe memory modules and tighten the thumbscrews.

6. If a 256-Kbyte RAM module was replaced, be sure to set the RAM module switches thesame as the one that was removed (see Table 2-4 for the possible switch settings).

7. Plug in the five-terminal connector to restore power. If a ROCPAC or FlashPAC wasreplaced, a cold hard start (uses EEPROM values) will automatically be performed; this maytake up to a minute.

8. Using the configuration software, check the configuration data (including ROC displays)and FSTs, and load or modify them as required. Load and start any user programs asneeded.

9. Verify that the ROC performs as required.


Rev 5/02 2-23

10. If you changed the configuration, save the configuration data to EEPROM (permanentmemory). Also, if you changed the configuration (including the history database and ROCdisplays) or FSTs, save them to disk. See section 2.5.1 for more information on saving.

2.5.7 Replacing/Removing the MCU Assembly

Replace the MCU assembly as instructed in the following procedure.

! NOTE: There is a possibility of losing the ROC configuration and historical data held in RAMwhile performing the following procedure. As a precaution, save the current configuration andhistorical data to permanent memory as instructed in section 2.5.1.



1. Unplug the power connector from the ROC.

2. Unplug all connectors and terminal blocks from the MCU.

3. Loosen the four screws that secure the MCU case to the ROC backplate.

4. Move the MCU up to disengage it from the I/O module rack and to slide two keyhole slotsin the case backplate into position to fit over the heads of concealed alignment screws. Thenlift the MCU away from the ROC backplate.

5. If you are reasonably sure the memory modules are okay (keep in mind all RAM is normallycleared during factory servicing), you can remove them by unscrewing the two thumbscrewsof their retainer and gently pulling each one from its socket.

6. The MCU must be returned as an assembly (the MCU board must remain in the metal case)to your local sales representative for repair. If the ROC is equipped with one or twocommunications cards, the cards can be removed if desired before returning the MCUassembly. Follow the applicable procedure in Section 4.5 for removing these cards.

7. To install a new or repaired MCU assembly, reverse the procedure used for removal in theprevious steps.


2-24 Rev 5/02

8. Reconnect power to the ROC, such as by plugging in the power terminal block.

9. Using the configuration software, check the configuration data (including ROC displays)and FSTs, and load or modify them as required. Also, load and start any user programs asneeded.


11. If you changed the configuration, save the configuration data to EEPROM (permanentmemory). Also, if you changed the configuration (including the history database and ROCdisplays) or FSTs, save them to disk. See section 2.5.1 for more information on performingthese saves.


Rev 5/02 2-25

2.6 ROC364 SPECIFICATIONS

Specifications

PROCESSOR MEMORY

NEC V25+ running at 8 MHz.

On-Board: 128K battery-backed SRAM for data.32K EEPROM for configuration.FlashPAC: Plug-in module with 512K (352K used)Flash read-only memory (ROM) and 512K of battery-backed static RAM (SRAM).ROCPAC: One plug-in module with 128K EPROMand 128K battery-backed SRAM.RAM Expansion Option (for ROCPAC only):Three slots provided for 128K or 256K battery-backed SRAM plug-in modules.Memory Reset: Optional LDP permits a cold startinitialization when used during power-up.

OPERATOR INTERFACE PORT

EIA-232D (RS-232D) serial format for use withportable operator interface. Baud is selectable from300 to 9600. Asynchronous format, 7 or 8-bit(software selectable). Parity can be odd, even, ornone (software selectable). 9-pin, female D-shellconnector provided.

AUXILIARY OUTPUT POWER

Input power is software switched to two sets ofauxiliary output power terminals. Each output fusedfor 5 A maximum. Output voltage is 0 to 2 Vdc lessthan input voltage, depending on load.

I/O POWER CONVERTER (OPTIONAL)

Input: 11 to 16 Vdc, 15 mA with no load or shortedoutput.Output: 22 to 24 Vdc, up to 0.6 A for transmitterpower.

I/O CAPACITY

Up to 16 I/O channels per Module Rack. Up to 4Module Racks (64 I/O channels) per MCU.

ENVIRONMENTAL

Operating Temperature: -40° to 70° C (-40° to158° F).Storage Temperature: -50° to 85° C (-58° to185° F).Operating Humidity: To 95%, non-condensing.Transient Protection: Meets IEEE C37.90.1-1989.EMI Susceptibility: Meets IEC 801-2, level 3 andSAMA PMC 33.1-1978, 2-abc, 1% of reading.EMI Emissions: Meets FCC 47 CFR, Part 15,Subpart J, Class A verified.

TIME FUNCTIONS

Clock Type: 32 KHz crystal oscillator with regulatedsupply, battery-backed. Year/Month/Day andHour/Minute/Second.Clock Accuracy: 0.01%.Watchdog Timer: Hardware monitor expires after 1.2seconds and resets the processor. Processor restart isautomatic.

DIAGNOSTICS

These values are monitored: real-time clock/systemclock compare, AI module mid-scale voltage, DI moduledefault status, AO module D/A voltage, DO modulelatch value, I/O transmitter voltage, power input voltage,auxiliary output 1 & 2 voltage (ROCPAC only), MCUboard temperature.

POWER REQUIREMENTS

11 to 16 Vdc (12.5V to start up) or 22 to 30 Vdc (25V tostart up), jumper selectable. 1 watt typical, excludingI/O power.

DIMENSIONS

MCU: 2 in. D by 8 in. H by 12 in. W (51 mm by 203 mmby 305 mm). Add 1.5 in. (38 mm) to depth dimensionfor memory modules.Module Rack: 0.5 in. D by 5 in. H by 12 in. W (13 mmby 127 mm by 305 mm).Backplates: 16 Ga. steel.MCU w/one Module Rack: 12.25 in. W by 14 in. H(311 mm by 356 mm).MCU w/two Module Racks: 12.25 in. W by 22.25 in. H(311 mm by 565 mm).MCU w/three or four Module Racks: 12.25 in. W by29.25 in. H (311 mm by 743 mm).

WEIGHT

MCU: 5 lbs (2.3 kg) nominal.Module Rack: 1 lb (0.5 kg) nominal.Backplate: 3 to 6.5 lbs (1.4 to 3 kg).

ENCLOSURE

MCU metal chassis with 2-piece cover and ModuleRack case meet NEMA 1 rating.

APPROVALS

Approved by CSA for hazardous locations Class I,Division 2, Groups A, B, C, and D.


2-26 Rev 5/02


Rev 5/02 3-1

SECTION 3 — INPUT/OUTPUT MODULES

3.1 SCOPE

This section describes the Input/Output (I/O) Modules used with the ROC364 controller. This sectioncontains the following information:

♦ Module Descriptions 3-1♦ Initial Installation and Setup 3-6♦ Connecting the I/O Modules to Wiring 3-6♦ Troubleshooting and Repair 3-25♦ Removal, Addition and Replacement 3-33♦ I/O Module Specifications 3-35

3.2 MODULE DESCRIPTIONS

The I/O modules plug into the I/O module sockets and accommodate a wide range of process inputs andoutputs. The following modules are available:

♦ AI Loop♦ AI Differential♦ AI Source♦ AO Source♦ DI Source♦ DI Isolated♦ DO Source♦ DO Isolated♦ DO Relay♦ PI Source♦ PI Isolated♦ Slow Pulse Input Source♦ Slow Pulse Input Isolated♦ Low-Level Pulse Input♦ RTD Input♦ HART® Interface

Adjacent to each I/O module socket is a plug-in terminal block for field wiring connections. The plug-in terminal blocks permit removal and replacement of the modules without the need to disconnect fieldwiring. The ROC accommodates any number of modules in any combination up to the limit of the I/Omodule rack or board. Figure 3-1 shows a typical I/O module.


3-2 Rev 5/02

SENSITIVE

STATIC

DOC0034C

Figure 3-1. Typical I/O Module

3.2.1 Analog Input Loop and Differential Modules

The Analog Input Loop (AI Loop) and Analog Input Differential (AI Differential) modules are used formonitoring current loop and voltage output devices. Each AI module uses a scaling resistor for scalingloop current to achieve the proper input voltage.

The AI Loop module provides a source voltage for powering current loop devices and can also be usedas a single-ended voltage output. The AI Differential module monitors loop current or voltage inputfrom externally-powered devices and provides electrical isolation from the ROC power supplies.

3.2.2 Analog Input Source Module

The Analog Input Source (AI Source) module monitors current loop or voltage output devices. Themodule provides a regulated 10-volt source for powering a device, usually a low power transmitter, anduses a scaling resistor for converting loop current to input voltage.

3.2.3 Analog Output Source Module

The Analog Output Source (AO Source) module provides both a current and a voltage output forpowering analog devices. These outputs are isolated from each other and can be used simultaneously.


Rev 5/02 3-3

A scaling resistor is provided for setting the minimum loop resistance of the current loop to 0 ohms(installed) or 220 ohms (removed).

3.2.4 Discrete Input Source and Isolated Modules

The Discrete Input Source (DI Source) and Discrete Input Isolated (DI Isolated) modules monitor thestatus of relays, solid-state switches, or other two-state devices. Each module can accommodate onediscrete input.

Both types of modules provide an LED that lights when the input is active and use a scaling resistor forscaling the input range. Functions supported by both modules are: discrete latched input, discretestatus input, and time-duration input.

The source module provides a source voltage for dry relay contacts or for an open-collector solid-stateswitch. The isolated module accepts an external voltage from a powered two-state device and provideselectrical isolation from the ROC power supplies.

3.2.5 Discrete Output Source and Isolated Modules

The Discrete Output Source (DO Source) and Discrete Output Isolated (DO Isolated) modules providetwo-state outputs to energize relays and power small electrical loads. Each module provides onediscrete output.

Both types of modules use an LED to show the status of the output and are fused for protection againstexcessive current. Functions supported by both modules are: sustained discrete output, momentarydiscrete output, slow pulse-train output, and time-duration discrete output.

The source module supplies switched current-limited power to small loads. The isolated module acts asa solid-state normally-open switch for activating externally powered devices. The solid-state switch isoptically isolated from the power supplies in the ROC.

3.2.6 Discrete Output Relay Module

The Discrete Output Relay (DO Relay) module provides two sets of “dry” relay contacts to switchvoltages of up to 115 Volts ac. One set of contacts is normally open and the other set is normallyclosed. Two types of relay modules are available, one with a 12 Volts dc energizing coil and the otherwith a 24 Volts dc energizing coil.

An LED shows the status of the output. Functions supported by the module include: sustained discreteoutput, momentary discrete output, slow pulse-train output and time-duration discrete output. Themodule contacts are isolated from the ROC power supplies.


3-4 Rev 5/02

3.2.7 Pulse Input Source and Isolated Modules

The Pulse Input Source (PI Source) and Pulse Input Isolated (PI Isolated) modules count pulses frompulse-generating devices. Each module can accommodate one pulse input.

Both types of modules use an LED to show when the input is active and use a scaling resistor forscaling the input range. Input pulses are counted by a 16-bit counter capable of storing up to 6.5seconds of pulse counts for a 10-KHz input signal. Functions supported by both modules are:slow-counter input, slow rate input, fast counter input, and fast rate input.

The source module provides a source voltage for dry relay contacts or for an open-collector solid-stateswitch. The isolated module accepts an external voltage from a powered device and provides electricalisolation from the ROC power supplies.

3.2.8 Slow Pulse Input Source and Isolated Modules

The Slow Pulse Input Source (SPI Source) and Slow Pulse Input Isolated (SPI Isolated) modules countthe changes in the status of relays, solid-state switches, or other two-state devices. Each module canaccommodate one pulse input.

The modules provide an LED that lights when the input is active and use a scaling resistor for scalingthe input range. Functions supported are controlled by the ROC firmware. For example: raw pulseaccumulation, rate in engineering units (EUs), today’s total in EUs, or rate alarm.

The source module provides a source voltage for dry relay contacts or for an open-collector solid-stateswitch. The isolated module accepts an external voltage from a powered two-state device and provideselectrical isolation from the ROC power supplies.

3.2.9 Low-Level Pulse Input Module

The Low-Level Pulse Input module counts pulses from pulse-generating devices having a voltage rangeof 30 millivolts to 3 volts peak-to-peak. The module can accommodate one pulse input.

Input pulses are counted by a 16-bit counter that is capable of storing up to 22 seconds of pulse countsfor a 3 KHz input signal. The module provides electrical isolation between the input pulses and theROC power supplies.

3.2.10 RTD Input Module

The Resistance Temperature Detector (RTD) module monitors the temperature signal from an RTDsource. The module can accommodate one input from a two, three, or four-wire RTD source.


Rev 5/02 3-5

The active element of an RTD probe is a precision, temperature-dependent resistor, made from aplatinum alloy. It has a predictable positive temperature coefficient, meaning its resistance increaseswith temperature. The RTD input module works by supplying a small current to the RTD probe andmeasuring the voltage drop across it. Based on the voltage curve of the RTD, the signal is converted totemperature by the ROC firmware.

3.2.11 HART Interface Module

The HART Interface Module provides communications between a ROC and other devices using theHighway Addressable Remote Transducer (HART) protocol. The module has its own microprocessorand mounts in the I/O module sockets of a ROC.

The HART Interface Module communicates digitally to HART devices through the I/O terminationblocks associated with the module position. Each HART module contains two separate channels. Eachchannel polls all HART devices connected to it before the other channel is polled. Each channel can beconfigured to operate in either the point-to-point mode or the multi-drop mode. In the point-to-pointmode, each module channel supports one HART device.

In the multi-drop mode, each channel can support up to five HART devices for a total of ten devices foreach module. By using the multi-drop mode with multiple HART modules, up to 32 HART devices(limited by the software) can be supported by a single ROC.


3-6 Rev 5/02

3.3 INITIAL INSTALLATION AND SETUP

Each I/O module installs in the ROC in the same manner. Any I/O module can be installed into any I/Omodule socket. To install a module on a ROC that is not in service, perform the following steps. Foran in-service ROC, refer to Section 3.6.

Be sure to use proper electrostatic handling, such as wearing a grounded wrist strap, orcomponents on the circuit cards may be damaged.


1. Install I/O module by aligning the pins with the desired I/O module socket and pressinggently, but firmly straight down.

2. Tighten the module retaining screw.

3. Make sure a field wiring terminal block is installed in the socket adjacent to where the I/Omodule was installed. If a Lightning Protection Module is to be installed for this I/Ochannel, refer to Appendix A.

3.3.1 Calibrating an I/O Module

After an I/O module is installed, configure and calibrate the associated I/O channel as needed by usingthe ROCLINK Configuration Software.

3.4 CONNECTING THE I/O MODULES TO WIRING

Each I/O module is electrically connected to field wiring by a separate plug-in terminal block. Inaddition, the ROC enclosures provide a ground bus bar for terminating the sheath on shielded wiring.The following paragraphs provide information on wiring field devices to each type of I/O module.

The sheath surrounding shielded wiring should never be connected to a signal groundterminal or to the common terminal of an I/O module. Doing so makes the I/O modulesusceptible to static discharge, which can permanently damage the module. Connect theshielded wiring sheath to a suitable earth ground only.


Rev 5/02 3-7

3.4.1 Analog Input Loop Module

The Analog Input Loop module monitors either loop current or output voltage from field devices. Themodule provides source power at terminal A for the loop. The AI Loop module operates by measuringthe voltage at terminals B and C. For current loop monitoring, scaling resistor R1 generates a voltageacross terminals B and C that is proportional to the loop current (I). A 250-ohm scaling resistor (R1) issupplied by the factory (0.1%, 1/8W) to accommodate either 0-to-20 milliamp or 4-to-20 milliampcurrent loop transmitters. This translates to a maximum operating input voltage of 5 volts dc, which isthe upper limit of the module.

When using a transmitter with a maximum current requirement different than 20 milliamps, R1 shouldbe scaled to achieve full scale deflection at 5 volts dc. The formula for determining a new value of R1is given in Figure 3-2, where “I Maximum” is the upper end of the operating current range (such as0.025 amps for a 0 to 25 milliamp device).

I

CURRENT LOOPDEVICE

ROC-POWERED

I MAXIMUMR1 =

TO SELECT PROPER VALUE OF R1:

VS = SOURCE VOLTAGE FROM MODULE = 11 TO 30 VDC, 25 mA MAX

5 VOLTS

DOC0153J

+T

B

C–

A+

R1=250

I LIMIT

AI LOOP

VS+-

Figure 3-2. AI Loop Module Field Wiring for Current Loop Devices

Figure 3-3 shows a typical voltage signal input. Terminal B is the “+” signal input and terminal C is the“-” signal input. These terminals accept a voltage signal in the 0 to 5 volt range. Since terminal Cconnects to a signal ground (non-isolated), the analog input must be a single-ended. Ensure that noscaling resistor (R1) is installed when the module is used to sense a voltage signal.

+T

B

C–

A+

R1=OPEN

I LIMIT

AI LOOP

VS

SIGNAL = 1 TO 5 VDCSELF-POWEREDVOLTAGE DEVICE

DOC0153A(modified)

+-

Figure 3-3. AI Loop Module Field Wiring for Voltage Devices


3-8 Rev 5/02

3.4.2 Analog Input Differential Module

A schematic representation of the field wiring connections to the input circuit of the Analog InputDifferential module is shown in Figure 3-4, Figure 3-5, and Figure 3-6.

The Analog Input Differential module measures either output voltage (Vo) or loop current (I) fromexternally-powered devices only. The module operates by measuring the voltage between field wiringterminals B and C. The module input is semi-isolated from the ROC power supply and signalcommons.

When connecting voltage devices, the 5-volts input voltage limit of the module must not be exceeded.If the output of the field device is in the range of 0 to 5 volts dc, do not use a scaling resistor; ensurethat the supplied 250-ohm scaling resistor is removed. Refer to Figure 3-4 for connecting field deviceswith outputs of 5 volts dc or less.

For field devices with output voltages that exceed 5 volts dc, two scaling resistors, R1 and R2, arerequired (not supplied). Figure 3-5 shows how to connecting field devices with outputs exceeding 5volts dc and where to install scaling resistors (at least 1%, 1/8W). The equation for determining valuesof scaling resistors R1 and R2 is given in Figure 3-5. For example, if VO = 10 volts, and R1 = 250ohms, then R2 = 250 ohms. Note that R1 must be less than 4.5K ohms.

V = VOLTAGE FROM ANALOG DEVICE = 0 TO 5 VDC

SELF-POWEREDANALOG VOLTAGEDEVICE

o

-

Vo

+

DOC0155A

N/C

C-

B

A

+

200K

200K

R1 = OPENAI DIFF

Figure 3-4. AI Differential Module Field Wiring for Low Voltage Devices


R1 MUST BE LESS THAN 4.5K OHM (1.0K OHM TYPICAL)

R1(V - 5)

TO SCALE R1 AND R2 FOR:

o

R2 =o

5

DEVICEANALOG VOLTAGESELF-POWERED

-

oV

+

DOC0156A

N/C

R2C

B+

-

A

R1

200K

200K

AI DIFF

Figure 3-5. AI Differential Module Field Wiring for Higher Voltage Devices


Rev 5/02 3-9

For current loop devices, scaling resistor R1 generates a voltage across terminals B and C that isproportional to the loop current. When connecting current loop devices, the value of R1 must beselected such that the 5-volt input limit of the module is not exceeded under maximum operatingcurrent conditions. For 0 to 20 milliamp or 4 to 20 milliamp devices, the value of R1 would be 250ohms. In this case, you can use the 250-ohm (0.1%, 1/8W) scaling resistor supplied by the factory. Theformula for determining the value of R1 is given in Figure 3-6, where “I Maximum” is the upper end ofthe operating current range (such as 0.025 amps for a 0 to 25 milliamp device).

I

TO SELECT PROPER VALUE FOR R1:


I MAXIMUM

SELF-POWEREDCURRENT LOOPDEVICE

R1 =

o

–

Vo

+

5 VOLTS

DOC0154A

N/C

+B

C–

A

200K

200K

R1AI DIFF

Figure 3-6. AI Differential Module Field Wiring for Current Loop Devices


3-10 Rev 5/02


A schematic representation of the field wiring connections to the input circuit of the Analog InputSource module is shown in Figure 3-7 and Figure 3-8. The AI Source module is normally used tomonitor the voltage output of low-voltage transmitters, but it can be used for monitoring loop current.The module provides source power at terminal A for the loop. The Analog Input Source moduleoperates by measuring the voltage across terminals B and C. The module accepts a maximum inputvoltage of 5 volts dc, which is the upper operating limit of the module.

Figure 3-7 shows a typical voltage signal input. Terminal B is the positive (+) signal input and terminalC is the negative (-) signal input. These terminals accept a voltage signal in the 0 to 5 volt range. Sinceterminal C connects to common, the analog input can only be a single-ended input. Make sure noscaling resistor is installed when wiring the module for a voltage signal.

VOLTAGE DEVICE

ROC-POWERED+10Vdc

–

+

+10Vdc

+

–C

B

A V SRC

AI SRC

Vs

SIGNAL = 0 TO 5 Vdc

Figure 3-7. AI Source Module Field Wiring for Voltage Devices

The AI Source module can be used for monitoring loop current as shown in Figure 3-8. For currentloop monitoring, scaling resistor R1 generates a voltage across terminals B and C that is proportional tothe loop current (I). For example, a 250-ohm scaling resistor would accommodate either 0 to 20milliamp, or 4 to 20 milliamp current loop transmitters (the transmitter must be able to operate on 10volts dc or be powered from another source). This translates to a maximum operating input voltage of 5volts dc, which is the upper limit of the module. When using a transmitter with a maximum operatingcurrent requirement different than 20 milliamps, R1 should be sized to achieve full scale deflection at 5volts. The formula for determining a new value of R1 is given in Figure 3-8.

I

CURRENT LOOPDEVICE

ROC-POWERED

TO SELECT PROPER VALUE OF R1:Vs = SOURCE VOLTAGE FROM MODULE = 10 Vdc, 20 mA MAX

–

+ +10 Vdc

B

I MAXIMUMR1 =

5 VOLTS

C –

A+

R1

V SRC

AI SRC

Vs

Figure 3-8. AI Source Module Field Wiring for Current Loop Devices


Rev 5/02 3-11


A schematic representation of the field wiring connections to the output circuit of the Analog OutputSource module is shown in Figure 3-9 and Figure 3-10. The AO Source module can provide either loopcurrent or output voltage to non-powered field devices. The Analog Output Source module providesa 0- to 5.5-Volt output at terminal A, and a 0 to 30 milliamp current source output at terminal B.Terminal C is referenced to the ROC common.

Resistor R1 (0-ohm resistor supplied) helps keep the loop resistance within the operating range of themodule. Remove the 0-ohm resistor when the loop resistance between terminals B and C is less than100 ohms.

Terminals A and B are both active at the same time. Figure 3-9 shows wiring for a ROC-poweredcurrent loop device, and Figure 3-10 shows wiring for an output voltage to non-powered field devices.

R1=0

DOC0158A(Modified)

LEVEL

220

AO SRC

I

REMOVE RESISTOR R1 WHEN LOOPRESISTANCE IS LESS THAN 100 OHMS

I = 30 mA MAX

COM

+I

-C

B+

+VA

ROC-POWEREDLOOP DEVICE

Figure 3-9. Analog Output Source Module Field Wiring for Current Loop Devices

V

R1=0

LEVEL

DOC0159A

AO SRC

220

V = OUTPUT VOLTAGE FROM MODULE = 0 TO 5 VDC, 5 mAo

COM

+I

+V

+

C

B-

o

A

VOLTAGE DEVICEROC-POWERED

Figure 3-10. Analog Output Source Module Field Wiring for Voltage Devices

3.4.5 Discrete Input Source Module

A schematic representation of the field wiring connections to the input circuit of the Discrete InputSource module is shown in Figure 3-11.


3-12 Rev 5/02

The Discrete Input Source module is designed to operate only with non-powered discretedevices such as “dry” relay contacts or isolated solid-state switches. Use of the modulewith powered devices may cause improper operation or damage.

The Discrete Input Source module operates by providing a voltage across terminals B and C that isderived from internal voltage source Vs. When a field device, such as a set of relay contacts, isconnected across terminals B and C, the closing of the contacts completes a circuit which causes a flowof current between Vs and ground at terminal C. This current flow is sensed by the DI module, whichsignals the ROC electronics that the relay contacts have closed. When the contacts open, current flowis interrupted and the DI module signals the ROC electronics that the relay contacts have opened.

A 10-ohm scaling resistor (R1) is supplied by the factory and accommodates a source voltage (Vs)of 11 to 30 volts dc. The source voltage is the input voltage to the ROC. However, it is desirable tooptimize the value of R1 to reduce the current drain from the source or reduce the heat generated inthe module due to high source voltage. The formula for determining the value of R1 is given inFigure 3-11. For optimum efficiency, R1 should be scaled for a loop current (I) of 3 milliamps.

PULSE DEVICEROC-POWERED

VS = SOURCE VOLTAGE FROM MODULE = 11 TO 30 VDC

R1 + RW + 3.3K = LOOP RESISTANCE = 4.5K OHMS MAX

– RW – 3.3K

RW = RESISTANCE OF FIELD WIRING

TO OPTIMIZE SCALING RESISTOR R1:

I = LOOP CURRENT = 3 mA TYPICAL

R1 =I

I

RW

VS – 1

B

C –

A N/C

+

R1=10

3.3K

DI SRC

VS

DOC0143AModified

Figure 3-11. Discrete Input Source Module Field Wiring

3.4.6 Discrete Input Isolated Module

A schematic representation of the field wiring connections to the input circuit of the Discrete InputIsolated module is shown in Figure 3-12.

! NOTE: The Discrete Input Isolated module is designed to operate only with discretedevices having their own power source such as “wet” relay contacts ortwo-state devices providing an output voltage. The module is inoperativewith non-powered devices.


Rev 5/02 3-13

The Discrete Input Isolated module operates when a field device provides a voltage across terminals Band C of the module. The voltage sets up a flow of current sensed by the module which, in turn, signalsthe ROC electronics that the field device is active. When the field device no longer provides a voltage,current stops flowing and the DI module signals the ROC electronics that the device is inactive.

A 10-ohm scaling resistor (R1) is supplied by the factory and accommodates an external voltage (Vo) of11 to 30 Volts dc. However, it is desirable to optimize the value of R1 to reduce the current drain fromthe source or reduce the heat generated in the module due to high source voltage. The formula fordetermining the optimum value of R1 is given in Figure 3-12. For best efficiency, R1 should be scaledfor a loop current (I) of 3 milliamps.

–

+SELF-POWEREDDISCRETE DEVICE

3.3KN/C


VO = VOLTAGE FROM DISCRETE DEVICE = 11 TO 30 VDC




– RW – 3.3KR1 =

VO

VO – 1

I

RW

B

C

A

–

+

DOC0144A

R1=10DI ISO

I

Figure 3-12. Discrete Input Isolated Module Field Wiring

3.4.7 Discrete Output Source Module

A schematic representation of the field wiring connections to the output circuit of the Discrete OutputSource module is shown in Figure 3-13.

The Discrete Output Source module is designed to operate only with non-powered discretedevices such as relay coils or solid-state switch inputs. Using the module with powereddevices may cause improper operation or damage to occur.

The Discrete Output Source module provides a switched voltage across terminals B and C that isderived from internal voltage source Vs. A field device, such as a relay coil, is energized when theROC electronics provides a voltage at terminals B and C. When Vs is switched off by the ROCelectronics, the field device is no longer energized.


3-14 Rev 5/02

When using the Discrete Output Source module to drive an inductive load such as a relaycoil, a suppression diode should be placed across the input terminals to the load. Thisprotects the module from the reverse EMF spike generated when the inductive load isswitched off.

1 Amp

DOC0145A

+5V

DO SRC

VS

CONTROL

I LIMIT

B–

C –

N/C

+A

+DISCRETE DEVICEROC-POWERED

Figure 3-13. Discrete Output Source Module Field Wiring

3.4.8 Discrete Output Isolated Module

A schematic representation of the field wiring connections to the output circuit of the Discrete OutputIsolated module is shown in Figure 3-14.

! NOTE: The Discrete Output Isolated module is designed to operate only with discrete deviceshaving their own power source. The module is inoperative with non-powered devices.

The Discrete Output Isolated module operates by providing a low or high-output resistance to a fielddevice. When the field device provides a voltage across terminals A and B of the module, currenteither flows or is switched off by the DO Isolated module. The switching is controlled by the ROCelectronics.

1 Amp

DOC0146A(Modified)

CONTROL

DO ISO

+5V

B

TERMINAL A CONNECTION IS COMMONTERMINAL B CONNECTION TO BE MADE FOR NORMALLY OPEN APPLICATIONSTERMINAL C CONNECTION IS NO CONNECTVO = VOLTAGE FROM DISCRETE DEVICE = 11 TO 30 VDC, 1.0 A MAX

N/CC–

A

DISCRETE DEVICESELF-POWEREDVO

+COM

NO

Figure 3-14. Discrete Output Isolated Module Field Wiring


Rev 5/02 3-15


A schematic representation of the field wiring connections to the output circuit of the Discrete OutputRelay module is shown in Figure 3-15.

! NOTE: The Discrete Output Relay module is designed to operate only with discrete deviceshaving their own power source. The module will be inoperative with non-powered devices.

The Discrete Output Relay module operates by providing both normally-closed and normally-opencontacts to a field device. Normally-closed contacts use terminals B and C, and normally-open contactsuse terminals A and B. The status of the contacts (open or closed) is controlled by the ROC software.

There are two versions of the relay module. The 12-volt version (which has a 12-volt energizing coil)must be used when the ROC input voltage is a nominal 12 volts dc, and the 24-volt version (which hasa 24-volt energizing coil) must be used when the ROC input voltage is a nominal 24 volts dc.

TERMINAL A CONNECTION TO BE MADE FOR NORMALLY OPEN APPLICATIONSTERMINAL B IS COMMONTERMINAL C CONNECTION TO BE MADE FOR NORMALLY CLOSED APPLICATIONS

VO= VOLTAGE FROM DISCRETE DEVICE = 0 TO 30 VDC OR 0 TO 115 VAC, 5 A MAX

DO RLY

VS

DOC0147A

CONTROL

COM

NC

NO

C

B

A

DISCRETE DEVICESELF-POWERED

–

+

VO

Figure 3-15. Discrete Output Relay Module Field Wiring

3.4.10 Pulse Input Source Module

A schematic representation of the field wiring connections to the input circuit of the Pulse InputSource module is shown in Figure 3-16.

The Pulse Input Source module is designed to operate only with non-powered discretedevices such as “dry” relay contacts or isolated solid-state switches. Use of the modulewith powered devices may cause improper operation or damage to occur.


3-16 Rev 5/02

The Pulse Input Source module provides a voltage across terminals B and C that is derived frominternal voltage source Vs. When a field device, such as a set of relay contacts, is connected acrossterminals B and C, the opening and closing of the contacts causes current to either flow or not flowbetween Vs and ground at terminal C.

This interrupted, or pulsed current flow is counted and accumulated by the PI Source module whichprovides the accumulated count to the ROC electronics upon request.

A 10-ohm scaling resistor (R1) is supplied by the factory and accommodates a source voltage (Vs)of 11 to 30 volts dc and a pulse source with a 50% duty cycle. The source voltage is the input voltageto the ROC. However, it is desirable to optimize the value of R1 to reduce the current drain from thesource or reduce the heat generated in the module due to high source voltage. The formula fordetermining the value of R1 is given in Figure 3-16. For optimum efficiency, R1should be scaledfor a loop current (I) of 5 milliamps.

PULSE DEVICEROC-POWERED

VS = SOURCE VOLTAGE FROM MODULE = 11 TO 30 VDC


– RW – 2.2K




R1 =I

I

RW

VS – 1

B

C –

A N/C

+

R1=10

2.2K

PI SRC

VS

Figure 3-16. Pulse Input Source Module Field Wiring

3.4.11 Pulse Input Isolated Module

A schematic representation of the field wiring connections to the input circuit of the Pulse InputIsolated module is shown in Figure 3-17.

! NOTE: The Pulse Input Isolated module is designed to operate only with discrete devices havingtheir own power source such as “wet” relay contacts or two-state devices providing an outputvoltage. The module is inoperative with non-powered devices.

The Pulse Input Isolated module operates when a field device provides a voltage across terminals B andC of the module. The voltage sets up a flow of current sensed by the module. When the field device nolonger provides a voltage, current stops flowing.

This interrupted, or pulsed current flow is counted and accumulated by the PI module which providesthe accumulated count to the ROC electronics upon request. The PI module at maximum inputfrequency (10 KHz) should be set to read input pulses no more than once every 6.5 seconds.


Rev 5/02 3-17

A 10-ohm scaling resistor (R1) is supplied by the factory, which accommodates a field device withpulse amplitude (Vo) of 11 to 30 volts dc and a duty cycle of 50%. However, it is desirable to optimizethe value of R1 to reduce the current drain from the source or reduce the heat generated in the moduledue to amplitudes greater than 30 volts dc. The formula for determining the value of R1 is given inFigure 3-17. For optimum efficiency, R1 should be scaled for a loop current (I) of 5 milliamps.

+

–

SELF-POWEREDPULSE DEVICE


VO = VOLTAGE FROM PULSE DEVICE = 11 TO 30 VDC


– RW – 2.2K



R1 =

VO

VO – 1

I

RWC

B+

–

AN/C

DOC0149A

R1=10

2.2K

PI ISO

Figure 3-17. Pulse Input Isolated Module Field Wiring

3.4.12 Slow Pulse Input Source Module

A schematic representation of the field wiring connections to the input circuit of the Slow Pulse InputSource module is shown in Figure 3-18.

The Slow Pulse Input source module is designed to operate only with non-powered discretedevices such as “dry” relay contacts or isolated solid-state switches. Use of the modulewith powered devices may cause improper operation or damage to occur.

The Slow Pulse Input source module operates by providing a voltage across terminals B and Cthat is derived from internal voltage source Vs. When a field device, such as a set of relay contacts,is connected across terminals B and C, the closing of the contacts completes a circuit, which causes aflow of current between Vs and ground at terminal C.

This current flow is sensed by the SPI module, which signals the ROC electronics that the relaycontacts have closed. When the contacts open, current flow is interrupted and the SPI module signalsthe ROC electronics that the relay contacts have opened. The ROC software counts the number oftimes the contacts switch from open to closed, and stores the count. The software checks for the inputtransition every 50 milliseconds.

A 10-ohm scaling resistor (R1) is supplied by the factory that accommodates a source voltage (Vs) of11 to 30 volts dc. The source voltage is either the input voltage to the ROC or the output voltage of the


3-18 Rev 5/02

I/O Converter Card if one is installed (ROC364 only). However, it is desirable to optimize the value ofR1 to reduce the current drain from the source or reduce the heat generated in the module due to highsource voltage. The formula for determining the value of R1 is given in Figure 3-18. For optimumefficiency, R1 should be scaled for a loop current (I) of 3 milliamps.

DISCRETE DEVICE

ROC-POWERED

V = SOURCE VOLTAGE FROM MODULE = 11 TO 30 VDC

R1 + Rw + 3.3K = LOOP RESISTANCE = 4.5K OHMSMAXI = LOOP CURRENT = 3 mA TYPICAL

R = RESISTANCE OF FIELDWIRING

s

w

- R - 3.3K


R1 =V - 1

I

s

R w

N/C

w

C

B

A

-

+

DOC0151Modified

SPI SRC

3.3K

R1=10

VsI

Figure 3-18. Slow Pulse Input Source Module Field Wiring

3.4.13 Slow Pulse Input Isolated Module

A schematic representation of the field wiring connections to the input circuit of the Slow Pulse InputIsolated module is shown in Figure 3-19.

! NOTE: The Slow Pulse Input isolated module is designed to operate only with discrete deviceshaving their own power source such as “wet” relay contacts or two-state devices providing anoutput voltage. The module is inoperative with non-powered devices.

The Slow Pulse Input isolated module operates when a field device provides a voltage across terminalsB and C of the module. The voltage sets up a flow of current sensed by the module, which signals theROC electronics that the field device is active. When the field device no longer provides a voltage,current stops flowing and the SPI module signals the ROC electronics that the device is inactive. TheROC software counts the number of times the current starts flowing, and stores the count. The softwarechecks for the input transition every 50 milliseconds.

A 10-ohm scaling resistor (R1) is supplied by the factory, which accommodates an external voltage(Vo) of 11 to 30 volts dc. However, it is desirable to optimize the value of R1 to reduce the currentdrain from the source or reduce the heat generated in the module due to high source voltage. Theformula for determining the value of R1 is given in Figure 3-19. For optimum efficiency, R1 should bescaled for a loop current (I) of 3 milliamps.


Rev 5/02 3-19

+

-

DISCRETEDEVICE

SELF-POWERED

V = VOLTAGE FROM DISCRETE DEVICE = 11 TO 30 VDC

R1 + R + 3.3K = LOOP RESISTANCE = 4.5K OHMS MAX

R = RESISTANCE OF FIELDWIRING


o

w

- R - 3.3K


R1 =

VO

V - 1o

I

RW

w

C

B

A

+

-

N/C

DOC0152A

SPI ISO

3.3K

R1=10

I

w

Figure 3-19. Slow Pulse Input Isolated Module Field Wiring


A schematic representation of the field wiring connections to the input circuit of the Low-Level PulseInput module is shown in Figure 3-20. The field wiring connections are made through a separateterminal block that plugs in next to the module allowing replacement of the module withoutdisconnecting field wiring.

! NOTE: The Low-Level Pulse Input module is designed to operate only with pulse-generatingdevices having their own power source. The module does not work with non-powered devices.

The low-level Pulse Input module operates when a field device provides a pulsed voltage between 30millivolts and 3 volts peak-to-peak across terminals B and C of the module. The pulsed voltage iscounted and accumulated by the module, which provides the accumulated count to the ROC electronicson request. The low-level PI module at maximum input frequency (3 KHz) should be set to read inputpulses no more than once every 20 seconds.

SELF-POWEREDPULSE DEVICE

+

–

+

C

B–

AN/C

200K

200K

DOC0150A

PI LL

Figure 3-20. Low-Level Pulse Input Module Field Wiring Schematic


3-20 Rev 5/02


The RTD input module monitors the temperature signal from a Resistance Temperature Detector (RTD)sensor or probe. The RTD module is isolated, reducing the possibility of lightning damage. ALightning Protection Module (LPM) will not protect the RTD, but it helps protect the rack in which themodule is installed.

The RTD module needs to be calibrated while disconnected from the RTD probe; therefore, it may bemore convenient to perform calibration before connecting the field wiring. However, if the field wiringbetween the ROC and the RTD probe is long enough to add a significant resistance, then calibrationshould be performed in a manner that takes this into account.

3.4.15.1 Calibrating the RTD Module

The following instructions describe how to calibrate an RTD input channel for use with an RTD probehaving an alpha value of either 0.00385 or 0.00392 ohms/ohm/degree C. This procedure requires aresistance decade box with 0.01 ohm steps and an accuracy of ±1%. You also need a personalcomputer running ROCLINK Configuration Software. The configuration and calibration of this moduleis similar to the directions for the configuration and calibration of other I/O modules in the ROCLINKfor DOS User Manual (Form A6051) or the ROCLINK for Windows User Manual (Form A6091).

A4464821

1

AB

C

DECADE BOXRT

D WH

TC

WH

T

RE

D

BA

Figure 3-21. Calibration Setup

Table 3-1. Calibration Resistance Values

ALPHA -50º C 100º C

0.00385 80.31 OHMS 138.50 OHMS

0.00392 79.96 OHMS 139.16 OHMS

Note: Resistance values for RTD probes with other alpha values can be found in the temperature-to-resistance conversiontable for that probe.


Rev 5/02 3-21

1. Connect the decade box as shown in Figure 3-21.

2. Set the decade box to the -50° C resistance value corresponding to the RTD alpha value inTable 3-1.

3. Enter the value displayed for “Raw A/D Input” as the value for “Adj. A/D 0%” using theAnalog Inputs configuration screen for the RTD input (in ROCLINK software, see theAdvanced Features for these parameters).

4. Set the decade box to the 100° C resistance value given in Table 3-1.

5. Enter the value displayed for “Raw A/D Input” as the value for “Adj. A/D 100%” using theAnalog Inputs configuration screen for the RTD input.

6. Enter “-50” for “Low Reading EU”.

7. Enter “100” for the “High Reading EU”.

8. Press F8 to save the changes.

3.4.15.2 Connecting RTD Module Field Wiring

The RTD sensor connects to the RTD module with ordinary copper wire. To avoid a loss in accuracy,sensor wires should be equal in length, of the same material, and the same gauge. To avoid possibledamage to the RTD module from induced voltages, sensor wires should be kept as short as possible(typically 100 feet or less). A schematic representation of the field wiring connections to the inputcircuit of the RTD input module is shown in Figure 3-22, Figure 3-23, Figure 3-24, and Figure 3-25.

Two-wire RTDs are connected to module terminals A and B. Terminal B must be connected toterminal C, as shown in Figure 3-22.

I SRC+

-2-WIRE, 100 OHM

ROC-POWERED

RTD PROBE

RED

WHTB

WHTC

WHT

REDA

DOC4007AModified

RTD

Figure 3-22. RTD Input Module Field Wiring for Two-Wire RTDs

Three-wire RTDs have an active element loop and a compensation loop. The active element loopis connected across terminals A and B. The compensation loop is connected across B and C. Thecompensation loop helps increase the accuracy of the temperature measurement by allowing theRTD module to compensate for the resistance of hookup wire used between the probe and RTDmodule.


3-22 Rev 5/02

In operation, the RTD module subtracts the resistance between terminals B and C from the resistancebetween terminals A and B. The remainder is the resistance of only the active element of the probe.This compensation becomes more important as the resistance of the hookup wire increases withdistance between the probe and the ROC. Of course, in order to perform properly, the compensationloop must use the same type, size, and length of hookup wire as the active element loop.

The RTD module is designed for only one compensation loop, and this loop is not isolated from theactive element loop because terminal B is common to both loops. In the 3-wire RTD, the wires areconnected to module terminals A, B, and C, as shown in Figure 3-23.

It is important to match the color coding of the RTD probe wires to the proper module terminal,because the probe wire colors vary between manufacturers. To determine which leads are for thecompensation loop and which are for the active element, read the resistance across the probe wires withan ohmmeter. The compensation loop reads 0 ohms, and the RTD element reads a resistance valuematching the temperature curve of the RTD.

3-WIRE,100-OHM,RTD PROBE

WHT

WHT

RED

WHTC

RED

WHTB

A

DOC0161AModified

RTD

I SRC

Figure 3-23. RTD Input Module Field Wiring for Three-Wire RTDs

RTDs with 4 wires normally have the compensation loop separate from the active element loop toincrease the accuracy of the probe. Various colors are used for the probe wires. For example, someprobes have wire colors of red and white for the RTD element loop and black leads for thecompensation loop, while other probes use two red leads for the active element loop and two whiteleads for the compensation loop.

The connections in Figure 3-24 connect a 4-wire RTD with compensation loop to the 3-wire RTDmodule. The RTD module designed for 3-wire use does not permit a 4-wire RTD to provide anyadditional accuracy over a 3-wire RTD.

RED

4-WIRE RTDWITH COMPEN-SATION LOOP

WHT

WHT

RED

WHTC

RED

WHTB

A

RTD

I SRC

DOC4008A

Figure 3-24. RTD Input Module Field Wiring for 4-Wire RTD With Compensation Loop


Rev 5/02 3-23

Figure 3-25 shows the connections for a single-element, 4-wire RTD. The two leads for one side of theRTD are both red, and for the other side they are both white.

RED

4-WIRE RTDWITH SINGLEELEMENT

WHT

WHT

RED

WHTC

RED

WHTB

A

RTD

I SRC

DOC4009A

Figure 3-25. Field Wiring for 4-Wire, Single Element RTD


The HART Interface module allows the ROC to interface with up to 10 HART devices per I/O slot.The HART module provides “loop source” power (+T) on terminal A and two channels forcommunications on terminals B and C. The +T power is regulated by a current limit. If the powerrequired by all connected HART devices exceeds 40 milliamps (more than an average of 4 milliampseach), the total number of HART devices must be reduced.

The HART module polls one channel at a time. If more than one device is connected to a channel ina multi-drop configuration, the module polls all devices on that channel before it polls the secondchannel. The HART protocol allows one second per poll for each device, so with 5 devices per channelthe entire poll time for the module would be ten seconds.

In a point-to-point configuration, only one HART device is wired to each HART module channel.In a multi-drop configuration, two to five HART devices are connected to a channel. In either case,terminal A (+T) is wired in parallel to the positive (+) terminal on all of the HART devices, regardlessof the channel to which they are connected. Channel 1 (terminal B) is wired to the negative (-) terminalof a single HART device, or in parallel to the negative terminals of two to five devices. Likewise,channel 2 (terminal C) is wired to the negative (-) terminal of a single HART device, or in parallel tothe negative terminals of a second group of two to five devices. Refer to Figure 3-26.


3-24 Rev 5/02

HART MODULE

C

DOC0295A

B

A+

-HART DEVICE 1

ROC-POWERED +TI LIMIT

-

+

-

+

MUX MODEM

ROC-POWERED

HART DEVICE 2

ROC-POWERED

HART DEVICE 5 HART DEVICE

ROC-POWERED-

+

CHANNEL 1, MULTI-DROP MODE CHANNEL 2, POINT-TO-POINT MODE

Figure 3-26. Field Wiring for a HART Interface Module


The troubleshooting and repair help the technician identify and replace faulty modules. Faulty modulesmust be returned to your local sales representative for repair or replacement.

If an I/O point does not function correctly, first determine if the problem is with the field device or theI/O module as follows:


1. Isolate the field device from the ROC by disconnecting it at the I/O module terminal block.

2. Connect the ROC to a computer running ROCLINK configuration software.

3. Perform the appropriate test procedure described in the following paragraphs.

A module suspected of being faulty should be checked for a short circuit between its input or outputterminals and the ground screw on the termination card. If a terminal not directly connected to groundreads zero (0) when measured with an ohmmeter, the module is defective and must be replaced.


Rev 5/02 3-25

3.5.1 Analog Input Modules

Equipment Required: Multimeter

To determine if an Analog Input module is operating properly, its configuration must first be known.Table 3-2 shows typical configuration values for an analog input:

Table 3-2. Analog Input Module Typical Configuration Values

PARAMETER VALUE CORRESPONDS TO:

Adj. A/D 0 % 800 1 volt dc across Rs (scaling resistor R1)

Adj. A/D 100 % 4000 5 volts dc across Rs

Low Reading EU 0.0000 EU value with 1 volt dc across Rs

High Reading EU 100.0 EU value with 5 volts dc across Rs

Filtered EUs xxxxx Value read by AI module

When the value of Filtered Engineering Units (EU) is -25% of span as configured above, it is anindication of no current flow (0 mA), which can result from open field wiring or a faulty field device.

When the value of Filtered EUs is in excess of 100% of span as configured above, it is an indication ofmaximum current flow, which can result from shorted field wiring or a faulty field device.

When the value of Filtered EUs is between the low and high readings, you can verify the accuracy ofthe reading by measuring the voltage across scaling resistor Rs (Vrs) with the multimeter. To convertthis reading to the Filtered EUs value, perform the following:

Filtered EUs = [((Vrs - 1)/4) × Span] + Low Reading EU,where Span = High Reading EU - Low Reading EU

This calculated value should be within one-tenth of one percent of the Filtered EUs value measured bythe ROC. To verify an accuracy of 0.1 percent, read the loop current with a multimeter connected inseries with current loop. Be sure to take into account that input values can change rapidly, which cancause a greater error between the measured value and the calculated value.

If the calculated value and the measured value are the same, the AI module is operating correctly.

3.5.2 Analog Output Modules


3-26 Rev 5/02

The Analog Output module is a source for current loop or voltage devices. Two test procedures areprovided to verify correct operation. Use the first procedure to check current loop source installationsand the second procedure to check voltage source installations.

3.5.2.1 Check Current Loop Source Installations

Equipment Required: MultimeterPersonal Computer running ROCLINK Software

1. Taking appropriate precautions, disconnect the field wiring going to the AO module terminations.2. Connect a multimeter between the B and C terminals of the module and set the multimeter to

measure current in milliamps.3. Using ROCLINK software, put the AO point associated with the module under test in Manual mode

(scanning disabled).4. Set the output to the high EU value.5. Verify a 20-milliamp reading on the multimeter.6. Calibrate the analog output high EU value as needed by increasing or decreasing the “Adj D/A

100% Units”.7. Set the output to the low EU value.8. Verify a 4-milliamp reading on the multimeter.9. Calibrate the analog output low EU value by increasing or decreasing the “Adj D/A 0% Units” as

needed.10. Enable scanning for the AO point, remove the test equipment, and reconnect the field device.11. If possible, verify the correct operation of the AO module by setting the high and low EU values as

before (scanning disabled) and observing the field device.

3.5.2.2 Check Voltage Source Installations


To check operation of the Analog Output module powering a voltage device, use the followingprocedure.

1. If the resistance value (R) of the field device is known, measure the voltage drop (V)across the device and calculate the output EU value using the following formula.

EU value = [((1000V/R - 4)/16) × Span] + Low Reading EU,where Span = High Reading EU - Low Reading EU

2. Compare the computed value to the output EU value measured by the ROC with ROCLINKsoftware. It is normal for the reading to be several percent off, depending on the accuracy toleranceof the device and how rapidly changes occur in the output value.

3. Calibrate the analog output EU values by increasing or decreasing the “Adj D/A % Units” asneeded.


Rev 5/02 3-27

4. If the analog output is unable to drive the field device to the 100% value, confirm the +V (1 to 5volts) voltage is present at the field device.

♦ If the voltage is present and the device is not at the 100% position, the resistance value of thedevice is too large for the +V voltage. A field device with a lower internal resistance shouldbe used.

♦ If the voltage is not present at the field device, but it is present at field wiring terminal B,there is excessive resistance or a break in the field wiring.

3.5.3 Discrete Input Source Module

Equipment Required: Jumper wire

Place a jumper across terminals B and C. The LED on the module should light and the status as read bythe ROCLINK software should change to “1”. With no jumper on terminals B and C, the LED shouldnot be lit and the status should be “0”. If the unit fails to operate, make sure a correct value for themodule resistor is being used.

3.5.4 Discrete Input Isolated Module

Equipment Required: Voltage generator capable of generating 11 to 30 V dcPersonal Computer running ROCLINK Software

Supply an input voltage across terminals B and C. The LED on the module should light and the status,as read by ROCLINK software, should change to “1”. With no input on terminals B and C, the LEDshould not be on and the status should be “0”. If the unit fails to operate, make sure a correct value forthe module resistor is being used.

3.5.5 Discrete Output Source Module


Place the Discrete Output in manual mode using ROCLINK software. With the output status set to “0”,less than 0.5 volts dc should be measured across pins B and C. With the output status set to “1”,approximately 1.5 volts dc less than the system voltage (Vs-1.5) should be measured across terminals Aand B. If these values are not measured, check to see if the module fuse is open, verify the module iswired correctly, and verify the load current requirement does not exceed the 57-milliamp current limitvalue of the module.


3-28 Rev 5/02

3.5.6 Discrete Output Isolated Module


Place the Discrete Output in manual mode using ROCLINK software. Set the output status to “0” andmeasure the resistance across terminals A and B. No continuity should be indicated. Set the outputstatus to “1” and measure the resistance across terminals A and B. A reading of 15K ohms or lessshould be obtained.



Place the Discrete Output in manual mode using ROCLINK software. Set the output status to “0” andmeasure the resistance across terminals B and C. A reading of 0 ohms should be obtained. Measure theresistance across terminals A and B. No continuity should be indicated. Set the output status to “1”and measure the resistance across terminals B and C. No continuity should be indicated. Measure theresistance across terminals A and B. A reading of 0 ohms should be obtained.

3.5.8 Pulse Input Source and Isolated Modules

Equipment Required: Pulse GeneratorVoltage GeneratorFrequency CounterJumper wire

For both types of modules, there are two methods of testing. One method tests high-speed operation,and the other method tests low-speed operation.

! NOTE: When checking the operation of the Pulse Input Source and Isolated modules, ensure thescan rate for the pulse input is once every 6.5 seconds or less as set by ROCLINK software.

To verify high-speed operation, connect a pulse generator having sufficient output to drive the moduleto terminals B and C. Connect a frequency counter across terminals B and C. Set the pulse generatorto a value equal to, or less than 10 KHz, and set the frequency counter to count pulses. Verify the countread by the counter and the count read by the ROC are the same using ROCLINK software.

To verify low-speed operation of the source module, alternately jumper across terminals B and C. Themodule LED should cycle on and off, and the accumulated count should increase.


Rev 5/02 3-29

To verify low-speed operation of the isolated module, alternately supply and remove an input voltageacross terminals B and C. The module LED should cycle on and off, and the total accumulated countshould increase.

3.5.9 Slow Pulse Input Source Module


To verify low-speed operation of the source module, connect and remove a jumper across terminals Band C several times to simulate slow switching. The module LED should cycle on and off and theaccumulated count should increase.

3.5.10 Slow Pulse Input Isolated Module


To verify low-speed operation of the isolated module, alternately supply and remove an input voltageacross terminals B and C. The module LED should cycle on and off and the total accumulated countshould increase.


Equipment Required: Pulse GeneratorFrequency CounterPersonal Computer running ROCLINK software

! NOTE: When checking the operation of the Low-Level Pulse Input module, ensure that the scanrate for the pulse input is once every 20 seconds or less as set by ROCLINK software.

To verify operation, connect a pulse generator, with the pulse amplitude set at less than 3 volts, toterminals B and C. Then, connect a frequency counter across terminals B and C. Set the pulsegenerator to a value equal to, or less than 3 KHz, and set the frequency counter to count pulses. Verifythat the count read by the counter and in the count read by the ROC are the same using ROCLINKsoftware.


3-30 Rev 5/02


The RTD module is similar in operation to an AI module and uses the same troubleshooting and repairprocedures. The RTD module can accommodate two-wire, three-wire, or four-wire RTDs. If two-wireRTDs are used, terminals B and C must be connected together. If any of the input wires are broken ornot connected, ROCLINK software indicates the “Raw A/D Input” value is either at minimum (lessthan 800) or maximum (greater than 4000) as follows:

♦ An open at terminal A gives a maximum reading.♦ An open at terminal B gives a minimum reading.♦ An open at terminal C gives a minimum reading.

To verify the operation of the RTD module, disconnect the RTD and connect a jumper betweenterminals B and C of the RTD module. Next, connect either an accurate resistor or decade resistancebox with a value to give a low end reading across terminals A and B. The resistance value required canbe determined by the temperature-to-resistance conversion chart for the type of RTD being used. UseROCLINK software to verify that the “Raw A/D Input” value changed and reflects the 0% A/D value.Change the resistance to reflect a high temperature as determined by the temperature-to-resistanceconversion chart. Verify that the “Raw A/D Input” value changed and reflects the 100% A/D value.


The HART Interface Module provides the source for the HART devices and uses two test procedures toverify correct operation. Use the first procedure to check the integrity of the loop power and the secondto verify communications.

3.5.13.1 Verify Integrity of Loop Power

Equipment Required: Multimeter

1. Measure voltage between terminals A and B to verify channel 1.

2. Measure voltage between terminals A and C to verify channel 2.

The voltage read in both measurements should reflect the value of +T less the voltage drop of theHART devices. Zero voltage indicates an open circuit in the I/O wiring, a defective HART device, or adefective module.

3.5.13.2 Verify Communications

Equipment Required: Dual-trace Oscilloscope


Rev 5/02 3-31

In this test, the HART module and the ROC act as the host and transmit a polling request to each HARTdevice. When polled, the HART device responds. In this test, you use the oscilloscope to observe theactivity on the two HART communication channels. Note that there is normally one second from thestart of one request to the start of the next request.

1. Attach one input probe to terminal B of the HART module and examine the signal for a pollingrequest and response for each HART device connected to this channel.

2. Attach the other input probe to terminal C and examine the signal for a polling request and responsefor each HART device connected.

3. Compare the two traces; signal bursts should not appear on both channels simultaneously.

Keep in mind that each device on one channel is polled before the devices on the other channel arepolled. If a channel indicates no response, this could be caused by faulty I/O wiring or a faulty device.If the HART module tries to poll both channels simultaneously, this could be caused by a defectivemodule, in which case the module must be replaced.

3.6 REMOVAL, ADDITION, AND REPLACEMENT

3.6.1 Impact on I/O Point Configuration

When an I/O module is replaced with the same type of I/O module, it is not necessary to reconfigurethe ROC. Modules which are treated as the same type are:

♦ Discrete input isolated and source modules♦ Discrete output isolated, source, and relay modules♦ Analog input loop, differential, and source modules, and RTD input modules♦ Pulse input isolated and source modules♦ Slow pulse input isolated and source modules

If a module is to be replaced with one of the same type (see above), but some of its configurationparameters need to be changed, you can use ROCLINK software to make the changes off-line or on-line. If you want to minimize “down time,” before you replace the module, you can make the neededchanges (except for ROC display and FST changes) off-line by first saving the ROC configuration todisk. Modify the disk configuration, replace the module, and then load the configuration file into theROC.

To make changes on-line, replace the module, proceed directly to the configuration display for theaffected point, and modify parameters as needed. Remember to consider the impact on FSTs and otherpoints that reference the affected point.

Any added modules (new I/O points) start up with default configurations. Even though adding amodule, removing a module, or moving a module to a new position in the ROC does not directly affectthe configuration of other I/O points, it can affect the numbering of I/O points of the same type.This, in turn, can impact an FST or higher-level point because the referencing of I/O points is done by a


3-32 Rev 5/02

sequence-based point number. For example, if you have AI modules installed in slots A7, A10, andA11, adding another AI module in slot A8 changes the point numbers of the analog inputs for modulesin slots A10 and A11.

! NOTE: If one or more FSTs, or higher level points (such as a PID loop or AGA Flow), have beenconfigured in the ROC, be sure to reconfigure them according to the changes in I/O modules.Operational problems will occur if you do not reconfigure the ROC.

3.6.2 Removing/Installing an I/O Module

Use the following procedure to remove/install an I/O module. The procedure is performed usingROCLINK Configuration Software.

There is a possibility of losing the configuration and historical data held in RAM whileperforming the following procedure. As a precaution, save the current configuration andhistorical data to permanent memory as instructed in Section 2.5.




1. Refer to Section 2.5 concerning RAM backup procedures.

2. Disconnect the input power, such as by unplugging the 5-terminal connector.

3. Perform one of the following steps, depending on whether the module is to be removed orinstalled:

a) If removing the module, loosen the module retaining screw and remove the module bylifting straight up. It may be necessary to rock the module gently while lifting.


Rev 5/02 3-33

b) If installing the module, insert the module pins into the module socket. Press the modulefirmly in place. Tighten the module retaining screw.

4. After the module is removed/installed, reconnect the input power.

5. Check the configuration data (including ROC displays) and FSTs, and load or modify themas required. Load and start any user programs as needed.

6. Read Section 3.6.1 on I/O point configuration. If you increased or reduced the number ofHART modules or changed their relative position, perform a warm start to cause the HARTprogram to recognize the changes. Configure the HART points accordingly.


8. If you changed the configuration, save the configuration data to permanent memory.

9. If you changed the configuration, including the history database, FSTs, and ROC displays,save them to disk. See Section 2.5.2 for more information on saving files.

3.7 I/O MODULE SPECIFICATIONS

The specifications for the various I/O modules are given in this section.

3.7.1 Analog Input Modules—Loop and Differential

Loop Module Specifications

FIELD WIRING TERMINALS

A: Loop Power (+T)

B: Analog Input (+)

C: Common (-)

INPUT

Type: Single-ended, voltage sense. Current loopwith scaling resistor (R1).

Loop Current: 0 to 25 mA maximum range. Actualrange depends on scaling resistor used.

Voltage Sensing: 0 to 5 Volts dc, softwareconfigured.

Accuracy: 0.1% of full scale (20 to 30°C). 0.5% offull scale (-40 to 70°C)

INPUT (CONTINUED)

Impedance: Greater than 400K ohms (withoutscaling resistor).

Normal Mode Rejection: 50 dB @ 60 Hz.

POWER REQUIREMENTS

Loop Source: 25 mA maximum, from ROC orFloBoss power circuits or I/O converter card (Vs = 11to 30 Vdc).

Module: 4.9 to 5.1 Volts dc, 6 mA maximum; -4.5 to-5.5 Volts dc, 2 mA maximum (supplied by ROC).

ISOLATION

Not isolated. Terminal C tied to power supplycommon.


3-34 Rev 5/02

Differential Module Specifications


A: Not used.

B: Positive Analog Input (+)

C: Negative Analog Input (-)

INPUT

Type: Voltage sense. Externally-powered currentloop sensing with scaling resistor (R1).

Voltage: 0 to 5 Volts dc, software configured.

Accuracy: 0.1% of full scale (20 to 30°C). 0.5% offull scale (-40 to 70°C).

INPUT (CONTINUED)

Normal Mode Rejection: 50 dB @ 60 Hz.

Impedance: Greater than 400 Kohms (withoutscaling resistor).

POWER REQUIREMENTS

4.9 to 5.1 Volts dc, 6 mA maximum; -4.5 to -5.5 Voltsdc, 2 mA maximum (supplied by ROC).

INPUT ISOLATION

Greater than 400 Kohms input to power supplycommon.

Common Specifications

SCALING RESISTOR

250 ohm (supplied) for 0 to 20 mA full scale. 100ohm for 0 to 50 mA (externally-powered only).

RESOLUTION

12 bits.

FILTERSingle pole, low-pass, 40 millisecond time constant.

CONVERSION TIME30 microseconds typical.

VIBRATION20 Gs peak or 0.06 in. double amplitude, 10 to2,000 Hz, per MIL-STD-202, method 204,condition F.

MECHANICAL SHOCK1500 Gs 0.5 mS half sine per MIL-STD-202,method 213, condition F.

CASESolvent-resistant thermoplastic polyester, meetsUL94V-0. Dimensions are 15 mm D by 32 mm H by43 mm W (0.60 in. D by 1.265 in. H by 1.69 in. W), notincluding pins.

ENVIRONMENTALMeets the Environmental specifications of the ROC orFloBoss unit in which the module is installed, includingTemperature, Humidity, and Transient Protection.

WEIGHT37 grams (1.3 ounces).

APPROVALSApproved by CSA for hazardous locations Class I,Division 2, Groups A, B, C, and D.


Rev 5/02 3-35


Specifications


A: 10 VdcB: Analog InputC: Common

INPUT

Type: Single-ended, voltage sense; can be currentloop if scaling resistor (not supplied) is used.

Voltage: 0 to 5 Vdc, software configurable.

Resolution: 12 bits.

Accuracy: 0.1% of full scale (20 to 30 °C); 0.5% offull scale (-40 to 65 °C).

Impedance: Greater than 400 kilo-ohms (withoutscaling resistor).

Normal Mode Rejection: 50 db @ 60 Hz.

SOURCE POWER9.99 to 10.01 Vdc, 20 mA maximum.

POWER REQUIREMENTS4.9 to 5.1 Vdc, 6 mA maximum; -4.5 to -5.5 Vdc, 2mA maximum (all supplied by ROC).

INPUT ISOLATIONNot isolated. Terminal C is tied to power supplyground.

SURGE WITHSTANDMeets IEEE 472 / ANSI C37.90a.

FILTER

Single pole, low-pass, 40 msec time constant.

CONVERSION TIME30 microseconds typical.

VIBRATION20 Gs peak or 0.06 in. double amplitude, 10 to 2,000Hz, per MIL-STD-202 method 204 condition F.

MECHANICAL SHOCK

1500 Gs 0.5 mS half sine per MIL-STD-202, method213, condition F.

CASESolvent-resistant thermoplastic polyester, meetsUL94V-0. Dimensions 0.6 in. D by 1.265 in. H by1.690 in. W (15 mm by 32 mm by 43 mm), notincluding pins.

ENVIRONMENTALMeets the Environmental specifications of the ROCor FloBoss in which the module is installed,including Temperature, Humidity, and TransientProtection.

WEIGHT1.3 ounces (37 grams).

APPROVALS



3-36 Rev 5/02


Specifications

FIELD WIRING TERMINALSA: Voltage OutputB: Current OutputC: Common

VOLTAGE OUTPUTType: Voltage source.Range: 1 to 5 Vdc with 0 to 5.25 Vdc overranging.25 mA maximum.

Resolution: 12 bits.Accuracy: 0.1% of full-scale output (from 20 to30°C). 0.5% of full-scale output (-40 to 65°C).Settling Time: 100 µseconds maximum.Reset Action: Output goes to zero percent outputor last value (software configurable) on power-up(warm start) or on watchdog timeout.

CURRENT OUTPUT

Type: Current loop.

Range: 4 to 20 mA with 0 to 22 mA overranging,adjusted by scaling resistor. A 0-ohm resistor issupplied.

Loop Source: 11 to 30 Vdc, as supplied by ROCfor “+T” power (typically 24 Vdc).

Loop Resistance at 12 Vdc: 0 ohms minimum,250 ohms maximum.

Loop Resistance at 24 Vdc: 200 ohms minimum,750 ohms maximum.

Resolution: 12 bits.

Accuracy: 0.1% of full-scale output (20 to 30°C).0.5% of full-scale output (-40 to 65°C).

Settling Time: 100 microseconds maximum.

Reset Action: Output goes to zero percent outputor last value (software configurable) on power-up(warm start) or on watchdog timeout.

POWER REQUIREMENTS

Module Alone: 24 mW typical.

Module w/Current Loop: 400 mW @ 4 mA outputto 590 mW @ 20 mA output.

OUTPUT ISOLATION


VIBRATION

20 Gs peak or 0.06 in. double amplitude, 10 to 2,000Hz, per MIL-STD-202, method 204, condition F.

MECHANICAL SHOCK

1500 Gs 0.5 ms half sine per MIL-STD-202, method213, condition F.

WEIGHT

37 grams (1.3 ounces) typical.

CASE

Solvent-resistant thermoplastic polyester, meetsUL94V-0. Dimensions are 15 mm D by 32 mm H by43 mm W (0.6 in. D by 1.265 in. H by 1.69 in. W), notincluding pins.

ENVIRONMENTAL

Meets the Environmental specifications of the ROCor FloBoss in which the module is installed, includingTemperature, Humidity, and Transient Protection.

APPROVALS



Rev 5/02 3-37

3.7.4 Discrete Input Modules—Source and Isolated

Source Module Specifications


A: Not usedB: Discrete device source/signalC: Common

INPUT

Type: Contact sense.Range: Inactive, 0 to 0.5 mA. Active, 2 to 9 mA.Source Voltage: 11 to 30 Vdc.Source Current: Determined by source voltage (Vs),loop resistance (Rl), and scaling resistor (Rs, 10 ohmsupplied):

I = (Vs - 1)/(3.3K + Rl + Rs)

POWER REQUIREMENTS

Source Input: 9 mA maximum from ROC orFloBoss power circuits or I/O converter card (VS=11to 30 Vdc).

Module: 4.9 to 5.1 Vdc, 1 mA maximum (suppliedby ROC or FloBoss).

INPUT ISOLATION


Isolated Module Specifications


A: Not used.B: Positive discrete input.C: Negative discrete input.

INPUT

Type: Two-state current sense.Range: Inactive; 0 to 0.5 mA. Active; 2 to 9 mA.Current: Determined by input voltage (Vi), loopresistance (Rl), and scaling resistor (Rs, 10 ohmsupplied):

I = (Vi - 1)/(3.3K + Rl + Rs).Maximum Voltage: 30 Vdc forward, 5 Vdcreverse.

POWER REQUIREMENTS

4.9 to 5.1 Vdc, 1 mA maximum (supplied by ROC).

INPUT ISOLATION

Insulation: 100 megohm minimum, input to output,and input or output to case.

Voltage: 4,000 Vac (RMS) minimum, input to output.

Capacitance: 6 pF typical, input to output.


INPUT

Loop Resistance (Rl): 4.5 Kohms maximum.

Frequency Response: 0 to 10 Hz maximum, 50%duty cycle.

Input Filter (Debounce): Software filter is theamount of time that the input must remain in theactive state to be recognized.

VIBRATION

20 Gs peak or 0.06 in. double amplitude, 10 to2,000 Hz, per MIL-STD-202, method 204,condition F.

MECHANICAL SHOCK

1500 Gs 0.5 mS half sine per MIL-STD-202,method 213, condition F.

WEIGHT

37 grams (1.3 ounces).

CASE

Solvent-resistant thermoplastic polyester, meetsUL94V-0. Dimensions are 15 mm D by 32 mm H by43 mm W (0.60 in. D by 1.27 in. H by 1.69 in. W), notincluding pins.

ENVIRONMENTAL

Meets the environmental specifications of the ROC orFloBoss unit in which the module is installed, includingTemperature, Humidity and Transient Protection.

APPROVALS



3-38 Rev 5/02

3.7.5 Discrete Output Modules—Source and Isolated



A: Not Used (No Connect)B: Positive (to field device)C: Negative

OUTPUT

Type: Solid-state relay, current sourced, normally-open.Active Voltage: 11 to 30 Vdc provided.Active Current: Limited to 57 mA.Inactive Current: Less than 100 microAmperes with30 Vdc source.Frequency: 0 to 10 Hz maximum.

POWER REQUIREMENTS

Output Source: 11 to 30 Vdc, 57 mA maximumfrom ROC or FloBoss power circuits or I/O convertercard.

Module: 4.9 to 5.1 Vdc. 1 mA in “Off” state; 6 mA in“On” state.

OUTPUT ISOLATION




A: Positive (field device power)B: NegativeC: Not Used (No Connect)

OUTPUT

Type: Solid-state relay, normally-open.Active Voltage: 11 to 30 Vdc.Active Current: Fuse-limited to 1.0 Ampscontinuous at 75°C (167°F), externally supplied.Inactive Current: Less than 100 microAmperes at30 Vdc.Frequency: 0 to 10 Hz maximum.

POWER REQUIREMENTS

4.9 to 5.1 Vdc. 1 mA in “Off” state; 6 mA in “On”state.

OUTPUT ISOLATION


Voltage: 4,000 Vac (RMS) minimum, input tooutput.



VIBRATION


MECHANICAL SHOCK


CASE

Solvent-resistant thermoplastic polyester, meetsUL94V-0. Dimensions are 15 mm D by 32 mm H by43 mm W (0.6 in. D by 1.265 in. H by 1.690 in. W),not including pins.

ENVIRONMENTAL

Meets the Environmental specifications of the ROCor FloBoss unit in which the module is installed,including Temperature, Humidity, and TransientProtection.

WEIGHT

37 grams (1.3 ounces) typical.

APPROVALS



Rev 5/02 3-39


SpecificationsFIELD WIRING TERMINALS

A: Normally-open contactsB: CommonC: Normally-closed contacts

OUTPUT

Type: SPDT dry relay contact.

Maximum Contact Rating (Resistive Load): 30Vdc, 4 Amps; 125 Vac, 4 Amps; 250 Vac, 2 Amps.

Frequency: 0 to 10 Hz maximum.

OUTPUT ISOLATION


Voltage: 3,000 Vac (RMS) minimum, input tooutput.

POWER REQUIREMENTS

12 VDC Version: 4.9 to 5.1 Vdc, 1 mA for module.12 Vdc, 25 mA for relay coil (energized) typical.

24 VDC Version: 4.9 to 5.1 Vdc, 1 mA for module.24 Vdc, 12.5 mA for relay coil (energized) typical.

VIBRATION

20 G peak or 0.06” double amplitude, 10-2000 Hz perMIL-Std-202, Method 204, Condition F.

MECHANICAL SHOCK

1500 G 0.5 mS half sine per MIL-Std-202, Method213, Condition F.

WEIGHT

37 grams (1.3 oz.).

CASE

Solvent-resistant thermoplastic polyester, meetsUL94V-0.

Dimensions are 15 mm D by 32 mm H by 43 mm W(0.6 in. D by 1.265 in. H by 1.69 in. W), not includingpins.

ENVIRONMENTAL

Meets the Environmental specifications of the ROC orFloBoss in which the module is installed, includingTemperature, Humidity and Transient specifications.

APPROVALS



3-40 Rev 5/02

3.7.7 Pulse Input Modules—Source and Isolated



A: Not usedB: Pulse input/source voltageC: Common

INPUT

Type: Contact sense.Source Voltage: 11 to 30 Vdc.Range: Inactive, 0 to 0.5 mA. Active, 3 to 12 mA.Source Current: Determined by source voltage(Vs), loop resistance (Rl) and scaling resistor (Rs):

I = (Vs - 1)/(2.2K + Rl + Rs)

POWER REQUIREMENTS

Source Input: 11 to 30 Vdc, 6 mA maximum fromROC power suppler I/O converter card.Module: 4.9 to 5.1 Vdc, 1 mA maximum (supplied byROC or FloBoss).

INPUT ISOLATION




A: Not usedB: Positive pulse inputC: Negative pulse input

INPUT

Type: Two-state, current-pulse sense.Range: Inactive; 0 to 0.5 mA. Active; 3 to 12 mA.Input Current: Determined by input voltage (Vi),loop resistance (Rl) and scaling resistor (Rs):

I = (Vi - 1)/(2.2K + Rl + Rs)

POWER REQUIREMENTS

4.9 to 5.1 Vdc, 2 mA maximum (supplied by ROCor FloBoss).

INPUT ISOLATION

Insulation: 100 MΩ minimum, input to output, andinput or output to case.Voltage: 4,000 Vac (RMS) minimum, input tooutput.Capacitance: 6 pF typical, input to output.


INPUT

Scaling Resistor (Rs): 10 ohm supplied (see InputCurrent equation to compute other value).Frequency Response: 0 to 12 KHz maximum, 50%duty cycle.Input Filter: Single-pole low-pass, 10 microsecondtime constant.

VIBRATION


MECHANICAL SHOCK


WEIGHT

37 grams (1.3 oz.).

CASE



ENVIRONMENTALMeets the Environmental specifications of the ROCor FloBoss unit in which the module is installed,including Temperature, Humidity, and TransientProtection.

APPROVALS



Rev 5/02 3-41

3.7.8 Slow Pulse Input Modules—Source and Isolated


FIELD WIRING TERMINALSA: Not usedB: Input/source voltageC: Common

INPUTType: Contact sense.Range: Inactive; 0 to 0.5 mA. Active; 2 to 9 mA.Source Voltage: 11 to 30 Vdc.Source Current: Determined by source voltage(Vs), loop resistance (Rl), and scaling resistor (Rs):I = (Vs - 1)/(3.3K + Rl + Rs)

POWER REQUIREMENTSSource Input: 11 to 30 Vdc, 9 mA maximum fromROC power supply or I/O converter card.Module: 4.9 to 5.1 Vdc, 1 mA maximum (supplied byROC).

INPUT ISOLATIONNot isolated. Terminal C tied to power supplycommon.


FIELD WIRING TERMINALSA: Not usedB: Positive inputC: Negative input

INPUT

Type: Two-state current sense.Range: Inactive: 0 to 0.5 mA. Active: 2 to 9 mA.Current: Determined by input voltage (Vi), loopresistance (Rl), and scaling resistor (Rs):I = (Vi - 1)/(3.3K + Rl + Rs)

Maximum Voltage: 30 Vdc forward, 5 Vdcreverse.

POWER REQUIREMENTS

4.9 to 5.1 Vdc, 1 mA maximum (supplied by ROC).INPUT ISOLATION

Insulation: 100 megohm minimum, input to output,and input or output to case.Voltage: 4,000 Vac (RMS) minimum, input to output.Capacitance: 6 pF typical, input to output.


INPUT

Loop Resistance (Rl): 4.5 kilohm maximum forbest efficiency.Scaling Resistor (Rs): 10 ohm supplied (seeequation above to compute other value).Frequency Response: 0 to 10 Hz maximum, 50%duty cycle.Input Filter (Debounce): 50 milliseconds.

VIBRATION

20 Gs peak or 0.06 in. double amplitude, 10 to2,000 Hz, per MIL-STD-202 method 204, conditionF.

MECHANICAL SHOCK

1500 Gs 0.5 ms half sine, per MIL-STD-202method 213, condition F.

WEIGHT

1.3 ounces (37 grams).

CASE

Solvent-resistant thermoplastic polyester, meetsUL94V-0. Dimensions: 15 mm D by 32 mm H by 43mm W (0.6 in. D by 1.265 in. H by 1.690 in. W), notincluding pins.

ENVIRONMENTAL

Meets the Environmental specifications of the ROCor FloBoss in which the module is installed, includingTemperature, Humidity, and Transient Protection.

APPROVALS



3-42 Rev 5/02

3.7.9 Pulse Input Module—Low Level

Specifications

MODULE RACK TERMINALS

A: Not usedB: Positive pulse inputC: Negative pulse input

INPUT

Type: Two-state, voltage-pulse sense.

Active Range: 30 mV minimum to 3 V maximum,peak-to-peak.

Frequency Response: 0 to 3 kHz, 50% duty cycle.

Impedance: 500 kilohms.

VIBRATION

20 Gs peak or 0.06 in. double amplitude, 10 to2,000 Hz, per MIL-STD-202, method 204,condition F.

MECHANICAL SHOCK


CASE


Dimensions: 15 mm D by 32 mm H by 43 mm W(0.60 in. D by 1.27 in. H by 1.69 in. W), not includingpins.

POWER REQUIREMENTS

4.9 to 5.1 Vdc, 2 mA maximum (supplied by ROC orFloBoss).

INPUT ISOLATION

Insulation: 10 megohm minimum, input or output tocase.Voltage: 4,000 Vac (RMS) minimum, input tooutput.


WEIGHT


ENVIRONMENTAL

Meets the Environmental specifications of the ROCor FloBoss unit in which the module is installed,including Temperature and Surge specifications.

APPROVALS



Rev 5/02 3-43


Specifications


A: RTD “Red” Input.

B: RTD “White” Input.

C: RTD “White” Input (3- or 4-wire).

INPUT

RTD Type: 100 Ω, platinum, with a temperaturecoefficient of 0.3850*, 0.3902, 0.3916, 0.3923, or0.3926 Ω/°C.

Temperature Range: Fixed at -50 to 100°C (-58 to212°F).

Excitation Current: 0.8 mA.

Impedance: 4 MΩ minimum.

Filter: Single pole, low pass, 4 Hz corner frequency.

RESOLUTION12 bits.

ACCURACY

± 0.1% of Input Temp. Range at Operating Temp.from 23 to 27°C.± 0.45% of Input Temp. Range at Operating Temp.from 0 to 70°C.± 0.8% of Input Temp. Range at Operating Temp.from -20 to 0°C.

LINEARITY

± 0.03% ± 1 LSB independent conformity to astraight line.

POWER REQUIREMENTS11 to 30 Vdc, 38 mA maximum, supplied by ROC orFloBoss power supply.

VIBRATION20 Gs peak or 0.06 in. double amplitude, 10 to 2,000Hz, per MIL-STD-202, method 204, condition F.

MECHANICAL SHOCK1500 Gs 0.5 mS half sine, per MIL-STD-202,method 213, condition F.

ENVIRONMENTALMeets the Environmental specifications of the ROCor FloBoss in which the module is installed,including Temperature and Humidity specifications.

WEIGHT37 grams (1.3 oz.).

CASESolvent-resistant thermoplastic polyester, meetsUL94V-0.




3-44 Rev 5/02


Specifications


A: Loop Power (+T)B: Channel 1 (CH1)C: Channel 2 (CH2)

CHANNELS

2 HART-compatible channels, which communicate viadigital signals only.Mode: Half-duplex.Data Rate: 1200 BPS asynchronous.Parity: Odd.Format: 8 bit.Modulation: Phase coherent, frequency shift keyed(FSK) per Bell 202.Carrier Frequencies: Mark 1200 Hz, Space 2200 Hz,± 0.1%.

HART MODULES AND DEVICES SUPPORTED

Up to 6 HART Modules and 32 HART devicesmaximum.Point-to-Point Mode: 2 HART devices per Module (1per channel).Multi-drop Mode: Up to 10 HART devices perModule (5 per channel).

LOOP POWER

Total power supplied through module for HARTdevices is 20 mA per channel at 10 to 29 Vdc. EachHART device typically uses 4 mA.

POWER REQUIREMENTS

Loop Source: 11 to 30 Vdc, 40 mA maximum fromROC/FloBoss power supply or ROC364 I/O convertercard.Module: 4.9 to 5.1 Vdc, 17 mA maximum.

WEIGHT

48 g (1.7 oz) nominal.CASE

Solvent-resistant thermoplastic polyester, meetsUL94V-0. Dimensions: 15 mm D by 51 mm H by43 mm W (0.60 in. D by 2.00 in. H by 1.69 in. W),not including pins.

VIBRATION

20 Gs peak or 0.06 in. double amplitude, 10 to2,000 Hz, per MIL-STD-202 method 204 conditionF.

MECHANICAL SHOCK

1500 Gs 0.5 mS half sine per MIL-STD-202,method 213, condition F.

ENVIRONMENTAL

Meets the Environmental specifications of the ROCor FloBoss unit in which the module is installed,including Temperature and Surge specifications.

APPROVALS



Rev 5/02 4-1

SECTION 4 — COMMUNICATIONS CARDS

4.1 SCOPE

This section describes the communications cards used with the Remote Operations Controllers. Topicscovered are:

♦ Product Descriptions 4-1♦ Initial Installation and Setup 4-8♦ Connecting the Communications Cards to Wiring 4-13♦ Troubleshooting and Repair 4-21♦ Specifications 4-23

4.2 PRODUCT DESCRIPTIONS

The communications cards provide communications between the ROC and a host system or externaldevices. The communications cards install directly onto the MCU board and activate a communicationsport when installed. The following cards are available:

♦ EIA-232 Serial Communications Card♦ EIA-422/485 Serial Communications Card♦ Radio Modem Communications Card♦ Leased-Line Modem Communications Card♦ Dial-Up Modem Communications Card


4-2 Rev 5/02

4.2.1 EIA-232 Serial Communications Card

The EIA-232 communications cards meet all EIA-232 specifications for single-ended, asynchronousdata transmission over distances of up to 50 feet. The EIA-232 communications cards provide transmit,receive, and modem control signals. Normally, not all of the control signals are used for any singleapplication.

Figure 4-1. EIA-232 Serial Communications Card

The current EIA-232 communications card includes LED indicators that display the status of the RXD,TXD, DTR, DCD, CTS, and RTS control lines. LED indicators are detailed in Table 4-1.

U4

U3

U5

RP

2

RP

1 Y1

C17

C18

CR

3

DT

R

CR

6C

R5

CR

4

CT

SR

TS

DC

D

CR

2C

R1

RX

DT

XD U6

COM PORTSRS-232

FB5

C12

C13

C2

U1

FB1

U2

C1

C3

C5

FB4

FB2

FB3

1 2

30

J1

3021

P1

C4

CR10CR9CR8CR7

21

30J2

C15

1 230

P2

R12

R11

R14

C6

C8

C7

C11

C10

C9

R8

R7

R10R9

DOC0234A

LED Indicators


Rev 5/02 4-3

Table 4-1. Communications Card LED Indicators

LED STATUS AND ACTIVITY

RXD The RXD receive data LED blinks when data is being received. The LED is onfor a space and off for a mark.

TXD The TXD transmit data LED blinks when data is being transmitted. The LED ison for a space and off for a mark.

DTR The DTR data terminal ready LED lights when the modem is ready to answer anincoming call. When DTR goes off, a connected modem disconnects.

DCD The DCD data carrier detect LED lights when a valid carrier tone is detected.

CTS CTS indicates a clear to send message.

RTS The RTS ready to send LED lights when the modem is ready to transmit.

RI The RI is the ring indicator LED light.

DSR The DSR is the data set ready indicator LED light.

OH The OH is the off hook indicator LED light. A dial tone has been detected and thetelephone line is in use by your modem.

NOTE: The last three LED indicators are used only on the dial-up modem communications card.

4.2.2 EIA-422/485 Serial Communications Card

The EIA-422/485 communication cards meet all EIA-422/485 specifications for differential,asynchronous transmission of data over distances of up to 4000 feet. The EIA-422 drivers are designedfor party-line applications where one driver is connected to, and transmits on, a bus with up to tenreceivers. The EIA-485 drivers are designed for true multi-point applications with up to 32 drivers and32 receivers on a single bus. Refer to Figure 4-2.

! NOTE: EIA-422 devices cannot be used in a true multi-point application where multiple driversand receivers are connected to a single bus and any one of them can transmit or receive data.


4-4 Rev 5/02

Figure 4-2. EIA-422/485 Serial Communications Card

The current EIA-422/485 communications card includes LED indicators that display the status of theRXD, TXD, and RTS control lines. LED indicators are detailed in Table 4-1. The card has one jumper(P3) that applies to the EIA-422 mode. The default setting of this jumper allows a multi-dropconfiguration, such as is normally possible with EIA-485 communications. Refer to Section 4.4.2 formore information.

LED Indicators


Rev 5/02 4-5

C18

U7

Y2

U6

U5

1 230

P8

30

21

J2

U10

U9

R23

LEASED LINE/RADIO MODEMC27

R24

R25

C26

CR

6

Y1

RP

1R

TS

RP

2

C28

COM PORTS

C29

FB5C25

C23

C24

C22

FB6 P7

3

5

7

1

R20

R16

R6

R15

R18R19

R22R21

C17

CR8

CR7

R17

3021

P1

U3

U1

2W 2C9

30

21

J1

FB3

FB2

FB4

C8

C6C5

U4

CR

1C

R2

CR

3C

R4

CR

5

TX

DD

CD

CT

SD

TR

RX

D

C7

C11C10

C13

C14

W1

C12

GND

4W

4W2W

4W2W

ISO

R10

R9

R12

R7

R8

R11

4

24

P6

C16

R14R13

C15

P5

4

2

P4

4

2

C1

FB1

U2

R1

R2

C2

C4

P3 R26 R

5

T2T1

C19

U8

C20 C21

VR6VR5VR4VR3

VR2VR1

P2

1

DOC0247A

4.2.3 Radio Modem Communications Card

The Radio Modem Communications Card sends and receives full-duplex or half-duplex, asynchronousFrequency Shift Keyed (FSK) signals to the audio circuit of a two-way radio. The modem incorporatesa solid-state push-to-talk (PTT) switch for keying the radio transmitter. Refer to Figure 4-3.

LED indicators on the card show the status of the RXD, TXD, DTR, DCD, CTS, and RTS controllines. LED indicators are detailed in Table 4-1.

When the card is used in a ROC with a FlashPAC, the modem automatically hangs up after aconfigured period of communications inactivity. Refer to either the ROCLINK for DOS User Manual(Form A6051) or ROCLINK for Windows User Manual (Form A6091) for configuration information.

There is one jumper (P6) that determines whether the PTT signal is isolated or grounded. Refer toSection 4.3.2 for more information.

Figure 4-3. Radio Modem Communications Card

LED Indicators


4-6 Rev 5/02

DOC0246A

R6

R17

CR7CR8

T1

R23

C15

C17

C16R13R14

R21

R22

R19R18

U9

U10

R7

R11

R12

R8

R9

R10

U4

FB4

Y1

C26

C29R

25

C28C27

LEASED LINE/RADIO MODEMCOM PORTS

U5

R24

C8

CR

4

DC

D

CR

6C

R5

RP

1R

TS

CT

S

RP

2

CR

3C

R2

CR

1

TX

DD

TR

RX

D

U6

U7

FB5

C23

C24

C25

C22

FB6

Y2 C18

W1

C11

C10

C12

C14

C13

R20

R16

R15

C5

U1

FB1

C1

C6

FB2

FB3

30

21

J1

3021

P1

C7

R5

C4

R26

R1

C2

U2

ISO

2W4W

2W4W

2W4W

GND

C9 U3

4

P4

P5

P6

42

24

P3

2

42

R2

30

21

J2

1 230

P8

3

P7

7

5

1

C19

VR6VR5

U8

C20 C21

VR2VR1

T2

VR3VR4

1

P2

4.2.4 Leased-Line Modem Communications Card

The Leased-Line Modem Communications Card is a 202T modem that is FCC part 68 tested for usewith leased-line or private-line telephone networks. Refer to Figure 4-4. Two or four-wire, half or full-duplex asynchronous operation is supported at a software selectable 300, 600, and 1200 baud to Belland CCITT standards.

LED indicators on the card show the status of the RXD, TXD, DTR, DCD, CTS, and RTScontrol lines. LED indicators are detailed in Table 4-1.

The leased-line card has three jumpers that permit either two-wire or four-wire operation. Refer toSection 4.3.2 for information on setting these jumpers.

Figure 4-4. Leased-Line Modem Communications Card

LED Indicators


Rev 5/02 4-7

4.2.5 Dial-Up Modem Communications Card

The Dial-up Modem Communications Card supports V.32 bis, V.32, V.22 bis, V.22, V.21, Bell 212A and103 communications with auto-answer/auto-dial features. The modem card is FCC part 68 approved for usewith public-switched telephone networks (PSTNs). The FCC label on the card provides the FCCregistration number and the ringer equivalent. The modem card has automatic adaptive and fixedcompromise equalization, eliminating the need to adjust pots or move jumpers during installation and setup.Refer to Figure 4-5.

The modem card interfaces to two-wire, full-duplex telephone lines using asynchronous operation atdata rates of 600, 1200, 2400, 4800, 9600 or 14.4 Kbps. The card interfaces to a PSTN through anRJ11 jack. The modem can be controlled using industry-standard AT command software. A 40-character command line is provided for the AT command set, which is compatible with EIA documentTR302.2/88-08006.

When the card is used in a ROC with a FlashPAC, the modem automatically hangs up after aconfigured period of communications inactivity. Automated dial-up alarm reporting capabilities arepossible with the FlashPAC. Refer to either the ROCLINK for DOS Configuration Software UserManual (Form A6051) or ROCLINK for Windows Configuration Software User Manual (Form A6091)for configuration information.

LED indicators on the card show the status of the RXD, TXD, DTR, DSR, RI, and OH control lines.Refer to Table 4-1. The modem card also provides RS-232 level output signals for an analyzer. Whenactivated as described in Section 4.4.5, these signals are available at the COMM port connector on thefront panel.

COMPORTSDIAL-UP MODEM

TXD

DSR

OH

RI

DTR

RXD

FB8

C18

U7

U6

C4

FB4

U2

U3

RP1

CR4

CR5

CR6

CR7

CR2

CR3

C16 C17

J2

P3

U8

R2

R1

C15

C19

R3

C12

U5

FB7

Y1

C14

C5

C11

C9

FB6

C13

C6

U4

C10

C8FB5

C7

J1

P1

U1

C3

FB2C1

FB1 FB3

C2

P2

PTR1

PTR2

CR1

DOC0389A

Figure 4-5. Dial-up Modem Communications Card

LEDIndicators


4-8 Rev 5/02


Installation of communications cards is normally performed at the factory when the ROC is ordered.However, the modular design of the ROC makes it easy to change hardware configurations in the field.The following procedures assume the first-time installation of a communications card in a ROCthat is currently not in service. For units currently in service, refer to the procedures in Section 4.5,“Troubleshooting and Repair.”



4.3.1 Installing Communications Cards

All communications cards install into the ROC in the same manner. To install a communications card,proceed as follows:

1. Remove the screws that hold the MCU upper cover in place, and lift off the cover. It may benecessary to first remove the memory module retainer.

2. Install the communications card onto the MCU board, with the COM PORTS arrow on thecard pointing down. Plug the card into its mating connectors on the MCU board and pressgently until the connectors firmly seat.

3. Install the retaining screw to secure the card. For dial-up and leased-line communicationscards, continue with step 4; otherwise, proceed to step 6.

4. Remove one of the two plastic plugs on the right-hand side of the ROC chassis and installthe phone jack in the hole, being sure to use the square shim that accompanies theinstallation kit. Figure 4-6 shows the jack location.

5. Connect the jack cable to the P2 connector on the communications card. You may discardthe square shim that accompanies the installation kit.


Rev 5/02 4-9

RJ11 Phone Jack

Figure 4-6. Phone Jack Location

! NOTE: If you are installing a dial-up or leased-line modem card, it is recommended that youinstall a telephone-style surge protector between the RJ11 jack and the outside line.

6. If you are installing a radio or leased-line modem card, be sure to set the jumpers on the cardin the proper position as described in Table 4-2 and to set the output attenuation level asdescribed in Table 4-3.

7. If a second communications card is to be installed, repeat steps 2 through 6; only this time,install the card on top of the first communications card instead of on the MCU board.

8. Reinstall the upper MCU cover and retainer.

9. After installing the communications card(s), apply the LED identification decal(s) to thewindow on the front cover. Figure 4-7 shows the decal location.

10. Refer to Section 4.4 for information on connecting wiring to the various types of communi-cations cards.


4-10 Rev 5/02

RAD/PLRXD

TXD

DTR

DCD

CTS

RTS

RTS

CTS

DCD

DTR

TXD

RXDRAD/PL

DOC0118A

1ST DECAL2ND DECAL

COM 1

COM 2

Figure 4-7. Location of LED Identification Decals

4.3.2 Setting Modem Card Jumpers

The leased-line and radio modem cards make use of jumpers to select certain operational modes. Thesejumpers must be properly positioned for the modem to operate correctly. Table 4-2 shows the operatingmodes and the associated jumper positions for the cards. Refer to Figure 4-3 and Figure 4-4 for jumperlocations.

The leased-line modem card is set at the factory for 2-wire operation. To use it for 4-wire operation,jumpers P3, P4, and P5 must be placed in the positions indicated in Table 4-2.

The radio modem card uses jumper P6 to enable power control for keying a radio. The jumper eithergrounds or isolates the push-to-talk (PTT) return line. Jumper P6 has a default setting of GND(ground), but it can be set to ISO (isolated) to achieve a floating PTT- if the radio circuit requires it.

Table 4-2. Jumper Positions for the Modem Cards

Leased-Line Modem Jumpers

Mode P3 P4 P52-Wire (default) 2W 2W 2W

4-Wire 4W 4W 4W

Radio Modem Jumper

Mode P6 – –PTT Grounded (default) GND – –

PTT Isolated ISO – –


Rev 5/02 4-11

4.3.3 Setting Modem Card Attenuation Levels

The output attenuation of the leased-line and radio modem cards is set at the factory to 0 dB (noattenuation). This level can be reduced, as necessary, to better match the modem output to the line orradio. The adjustment is made by plugging a resistor into the card at the location labeled R2. Refer toFigure 4-8. Table 4-3 lists resistor values and the amount of attenuation they provide.

Table 4-3. Radio and Leased-Line Modem Card Attenuation Levels

ATTENUATION(dB)

R2 VALUE(Ohms)

ATTENUATION(dB)

R2 VALUE(Ohms)

-2 205 K -12 15.8 K-4 82.5 K -14 11.5 K-6 47.5 K -16 8.66 K-8 30.9 K -18 6.65 K-10 21.5 K -20 5.11 K

NOTES: 1. All resistor values are nominal; 1% 1/4W resistors are acceptable.2. Attenuation for leased or private-line operation or for a GE MCS radio is normally 0 dB;

in this case, no resistor is needed.3. Attenuation for a GE TMX radio is typically -20 dB.4. Attenuation for an MDS radio is typically -10 dB.

R2

COM PORTS

Figure 4-8. Location of Sockets for Attenuation Resistor

Attenuation Resistor


4-12 Rev 5/02

4.4 CONNECTING COMMUNICATIONS CARDS TO WIRING

Signal wiring connections to the communications cards are made through the communications portconnector and through TELCO (RJ11) connectors supplied with certain modem cards. Theseconnections are summarized in Table 4-4 and detailed in Sections 4.4.1 to 4.4.5.

Failure to exercise proper electrostatic discharge precautions (such as wearing a groundedwrist strap) may reset the processor or damage electronic components, resulting ininterrupted operations.

Table 4-4. ROC300-Series Communications Card Signals

Comm. Card | Port Pin 1 2 3 4 5 6 7 8 9

EIA-232 CARD DCD RX TX DTR COM DSR RTS CTS RI

EIA-422/485 CARD,422 Usage

RX- RX+ TX+ TX-

EIA-422/485 CARD,485 Usage

OUT- OUT+

RADIO MODEM RXA TXA COM PTT+ PTT-

LEASED-LINEMODEM, COMM Port,4-wire Private Line

TIP2 RING2 RING1 TIP1

LEASED-LINEMODEM, RJ11 Port,2-Wire Operation

TIP(RED)

RING(GRN)

LEASED-LINEMODEM, RJ11 Port,4-Wire Operation

TIP2(BLK)

TIP1(RED)

RING1(GRN)

RING2(YEL)

DIAL-UP MODEM,RJ11 Port

TIP(RED)

RING(GRN)

DIAL-UP MODEM,COMM Port (outputonly for analyzer)

SPK RXD TXD DTR COM RI SHUTDOWN

+5V DSR


Rev 5/02 4-13

4.4.1 EIA-232 Communications Card Wiring

Figure 4-9 shows the relationship between the EIA-232 signals and pin numbers for the communi-cations port 9-pin connector.

COMM PORTEIA-232

EIA-232 CARD

TX

RTS

CTS

DTR

DSR

RX

D

D

R

R

D

R

19

22

15

23

18

20

24

17

P2

21

DOC0169B

TRANSMIT

COM

RTS

CTS

DTR

DSR

RECEIVE

DCD

RI

R

R

DCD

RI

33

5

7

8

9

1

4

6

7

5

8

9

1

4

6

2 2

Figure 4-9. EIA-232 Wiring Schematic


4-14 Rev 5/02

4.4.2 EIA-422/485 Communications Card Wiring

Figure 4-10 shows the signals and pin numbers for the communications port 9-pin connector. Wiringshould be twisted pair cable, one pair for transmitting and one pair for receiving. Jumper P4 controlsthe RTS transmit functions in the EIA-422 mode. Jumper P4 has a default setting of RTS for multi-drop communications. Placing jumper P4 in the ON position enables the card to continuously transmit.The load resistor on jumper P3 should be normally in the N/L position, unless it’s an end device on aRS-422/485 multi-drop communication link.

Figure 4-11 shows the relationship between the EIA-485 signals and pin numbers for the communi-cations port 9-pin connector. Wiring should be twisted-pair cable.




Rev 5/02 4-15

4.4.3 Radio Modem Communications Card Wiring

The following signal lines are used with most radios:

Comm. Port Signal Line Description4 TXA Transmit data3 RXA Receive data7 PTT+ Push-to-talk switch8 PTT- Push-to-talk return (may be grounded)5 COM ROC power supply ground

The radio modem uses a jumper (P6) to determine the use of the PTT return line. The setting of thisjumper is described in Section 4.3.2.

The radio modem board is shipped without a resistor installed in the R2 position. To modify theattenuation level, select a resistor as directed by Table 4-3 and insert it in the R2 position.

Figure 4-12 shows the relationship between the radio modem signals and pin numbers for thecommunications port 9-pin connector.

COMM PORT

RADIO

DCDINTERFACE

SHUTDOWN

DTR

RTS

8

2

3

5

6

TTL/RS232

RXD

TXD

1

7

4

P7+5V

TRANSMIT LEVEL

RECEIVE LEVEL

R10

RTS

W1

R2 OPEN

ISO

PTT

P6GND

15

19

22

20

23

17

21

18

24

DOC0242AModified

PTT1

PTT2PTT-

COM

PTT+

RXA

TXA

RXA

TXA

P8

RADIO MODEM CARD

9 9

5

8

7

3

2

1

4

8

5

7

3

2

1

4

6 6

Figure 4-12. Radio Modem Wiring Schematic

The following signals, used only for monitoring or connecting to an analyzer, are available at connectorP7 located at the bottom edge of the card. These signals are normally not active. To activate the


4-16 Rev 5/02

signals, SHUTDOWN (pin 8) must be grounded by connecting a jumper between pin 8 and pin 2. Allunused signals can be left unterminated.

P7Terminal Function

1 +5 VOLTS DC2 COM3 DCD4 TXD5 DTR6 RTS7 RXD8 SHUTDOWN

4.4.4 Leased-Line Modem Communications Card Wiring

The Leased-Line Modem Card interfaces to a leased line through the RJ11 jack. Refer to Section 4.3.2for jumper settings (P3, P4, and P5) and Section 4.3.3 for attenuation resistor (R2) values. The signalspresent depend on the mode of operation of the card, either 2-wire or 4-wire, as follows:

RJ11 OPERATING MODETERMINAL 2-Wire 4-Wire

BLK (Not used) Tip2RED Tip Tip1GRN Ring Ring1YEL (Not used) Ring2

Figure 4-13 shows the wiring connections to the card.

4W

P5

P4

DCDINTERFACE

SHUTDOWN

DTR

RTS

82

356

TTL/RS232

4W2W

2W4W

RXD

TXD

174

P7

ACCESS

DATA

ARRANGEMENT

P32W

4TXTA TXTA

RXTB

TXTB

TXA

RXA

TXTB

15

2220

24

COM

TXTB

RXTB

19

1817

2321

12

RXA

TXTA

TXA

RXTB

RXTA

RXTA RXTA3

DOC0215TJ

RING1

TIP2

RING2

TIP1

COMM PORT

123496785

RJ11LEASED-LINE MODEM CARD

LEASEDLINE

5432

123496785

Figure 4-13. Leased-Line Modem Wiring Schematic


Rev 5/02 4-17

The 9-pin COMM connector mounted on the ROC can be used to connect the modem to a private line.This connector is not FCC approved and cannot be used for leased-line operation. The signals presentare:

COMM MODE OF OPERATIONPort 2-Wire 4-Wire

1 -- Tip22 -- Ring26 Ring Ring19 Tip Tip1

The following signals, used only for monitoring or connecting to an analyzer, are available at connectorP7 located at the bottom edge of the card. These signals are normally not active. To activate thesignals, SHUTDOWN (pin 8) must be grounded to pin 2 using a jumper. All unused signals can be leftunterminated.

P7Terminal Function

1 +5 VOLTS DC2 COM3 DCD4 TXD5 DTR6 RTS7 RXD8 SHUTDOWN

4.4.5 Dial-Up Modem Communications Card Wiring

The dial-up modem card interfaces to a PSTN line through the RJ11 jack with two wires. The signalspresent at the RJ11 connector are:

RJ11 OPERATING MODETERMINAL (2-Wire)

GRN RingRED Tip

Figure 4-14 shows the relationship between the dial-up modem signals and pin numbers for theRJ11 and COMM port connectors.

! NOTE: Be careful to avoid shorting the +5 volt supply (pin 8 on the COMM port connector) tocommon (pin 5) or to any ground when wiring to the COMM port. Grounding pin 8 causes theROC to halt operation and data may be lost once a restart is initiated.


4-18 Rev 5/02

123496785

DIAL-UP MODEM CARD

INTERFACE

TTL/RS232

MODEM

20

15

RXD

DSR

RI

DTR

TXD

SPK

TIP

RING

24

22

19

18

17

21

23

1

4

3

2

4

2

1

3RED

YEL

GRN

BLK

+5V

DOC0216J

SHUTDOWN

RI

TXD

DSR

DTR

RXD

SPK

P3

P2

COM

RJ11

PSTN

SHUTDOWN

NC

NC

10K

+5V

+5V

3

4

2

5COMM PORT

123496785

Figure 4-14. Dial-Up Modem Wiring Schematic

The following signal lines (output only) are available at the COMM port for wiring to an analyzer ormonitor:

COMM Port Signal Line Description1 SPK Speaker2 RXD Receive data3 TXD Transmit data4 DTR Data terminal ready5 COM Common6 RI Ring indicator7 SHUTDOWN Disable signal lines8 +5V 5-volt dc power9 DSR Data set ready


Rev 5/02 4-19


The communications cards have no user-serviceable parts. If a card appears to be operating improperly,verify that the card is set up according to the information contained in Section 4.3, “Initial Installationand Setup.” If it still fails to operate properly, the recommended repair procedure is to remove thefaulty card and install a working communications card. The faulty card should be returned to your localsales representative for repair or replacement.

4.5.1 Replacing a Communications Card

If you are installing a communications card for the first time, refer to Section 4.3. To remove andreplace a communications card on an in-service ROC, perform the following procedure. Be sure toobserve the cautions to avoid losing data and damaging equipment.

! NOTE: There is a possibility of losing the ROC configuration and historical data held in RAMwhile performing the following procedure. As a precaution, save the current configuration andhistorical data to permanent memory as instructed in Section 2.5.



During this procedure, all power will be removed from the ROC and devices powered bythe ROC. Ensure all connected input devices, output devices, and processes remain in asafe state when power is removed from the ROC and also when power is restored to theROC. An unsafe state could result in property damage.

1. To avoid losing data, perform backups as explained in Section 2.5.

2. Disconnect power to the ROC, such as by unplugging the 5-terminal power connector.

3. Remove the screws that hold the upper cover in place, and lift off the cover. It may benecessary to first remove the memory module retainer.

4. If the communications card is a dial-up or leased-line modem card, unplug the phone jackcable from board connector P2.

5. Remove the retaining screw from the middle of the communications card. Using a rockingmotion to disengage the connectors, pull the card free from the main circuit board (or fromthe card below, if there are two cards).


4-20 Rev 5/02

6. If there are two communications cards, and you need to replace the bottom card, repeat steps4 and 5. Remove the retaining screw from the middle of the communications card. Using arocking motion to disengage the connectors, pull the card free from the main circuit board.

7. To reinstall a communications card, orient the card with the COM PORTS arrow pointingdown. Plug the card into its mating connectors and gently press until the connectors firmlyseat. Install the retaining screw to secure the card.

8. For a dial-up or leased-line modem card, connect the phone jack cable to the boardconnector P2.

9. If a second modem card was removed, repeat the previous two steps.

10. If you are installing a replacement modem card, be sure to set the jumpers on the card in theproper position (see Section 4.3.2) and to set the output attenuation level (see Section 4.3.3).

11. Reinstall the cover and retainer.

12. Reconnect power to the ROC, such as by plugging in the 5-terminal power connector.

13. Use the configuration software to check the configuration data (including ROC displays)and FSTs, and load or modify them as required. Also, load and start any user programs asneeded.


If you changed the configuration, save the configuration data to permanent memory. Also, if youchanged the configuration (including the history database and ROC displays) or FSTs, save them todisk. See Section 2.5.1 for more information on performing saves.


Rev 5/02 4-21

4.6 COMMUNICATIONS CARD SPECIFICATIONS

The following tables list the specifications for each type of communications card.

4.6.1 Serial Communications

Specifications

EIA-232D CARD

Meets EIA-232 standard for single-ended datatransmission over distances of up to 15 m (50 feet).Data Rate: Selectable from 300 to 9600 bps.Format: Asynchronous, 7 or 8-bit (softwareselectable) with full handshaking.Parity: None, odd, or even (software selectable).

EIA-422/485 CARD

Meets EIA-422 and EIA-485 standard for differentialdata transmission over distances of up to 1220 m(4000 feet). As many as 10 devices can beconnected on an EIA-422 bus; as many as 32devices can be connected together on an EIA-485bus.Data Rate: Selectable from 300 to 9600 bps.Format: Asynchronous, 7 or 8-bit (softwareselectable).Parity: None, odd, or even (software selectable).Termination Load: 140-ohm, jumper selectable.

LED INDICATORS

Individual LEDs for RXD, TXD, DTR, DCD, CTS,and RTS signals (not all apply to EIA-422/485communications).

POWER REQUIREMENTS

4.75 to 5.25 Vdc, 0.15 W maximum (supplied byROC/FloBoss).

ENVIRONMENTAL

Same as the ROC or FloBoss in which the card isinstalled. Refer to the respective ROC or FloBossspecifications sheet.

DIMENSIONS

25 mm H by 103 mm W by 135 mm L (1 in. H by4.05 in. W by 5.3 in. L).

WEIGHT

80 g (3 oz) nominal.

APPROVALS



4-22 Rev 5/02

4.6.2 Radio Modem Communications

Specifications

OPERATION

Mode: Full or half-duplex, direct connection to radio.

Data Rate: Up to 1200 baud asynchronous (softwareselectable).

Parity: None, odd, or even (software selectable).

Format: Asynchronous, 7 or 8 bit (softwareselectable).

Modulation: Phase coherent, frequency shift keyed(FSK).

Carrier Frequencies: Mark 1200 Hz ± 0.1%; Space2200 Hz ± 0.1%.

Input Impedance: 20 kilohms, unbalanced.

Output Impedance: 600 ohms balanced.

RTS-to-Transmission Delay: Configurable in 10 msincrements (50 ms for ROCs with ROCPAC).

Sensitivity: -35 dBm.

PTT Signal: Isolated, solid-state switch.

LED Indicators: TXD, RXD, DTR, DCD, CTS, andRTS.

POWER REQUIREMENTS

4.75 to 5.25 Vdc, 0.11 W typical (supplied by ROC).

ENVIRONMENTAL

Operating Temperature: -40 to 75ºC (-40 to 167ºF).

Storage Temperature: -50 to 85ºC (-58 to 185ºF).

Operating Humidity: To 95% relative, non-condensing.

DIMENSIONS

25 mm H by 103 mm W by 135 mm L (1 in. H by 4.05in. W by 5.3 in. L).

WEIGHT

100 g (3.6 oz) typical.

APPROVALS



Rev 5/02 4-23

4.6.3 Leased-Line Modem Communications

Specifications

OPERATION

Mode: Full or half-duplex on 2-wire or 4-wire privatechannel (compatible with Bell 202T).

Data Rate: Up to 1200 baud asynchronous (softwareselectable).


Format: Asynchronous, 7 or 8 bit (softwareselectable).

Modulation: Phase coherent, frequency shift keyed(FSK).

Carrier Frequencies: Mark 1200 Hz ± 0.1%; Space2200 Hz ± 0.1%.

Input Impedance: 600 ohm balanced transformerinput.

Output Impedance: 600 ohm balanced transformeroutput.


Sensitivity: -35 dBm.

Maximum Output Level: 0 dBm nominal into 600ohms.

LED Indicators: TXD, RXD, DTR, DCD, CTS, andRTS.

Surge Protection: Conforms to FCC part 68.

Certification: FCC Part 68 tested.

Connector: RJ11 type.

POWER REQUIREMENTS

4.75 to 5.25 Vdc, 0.11 W typical (supplied by ROC).

ENVIRONMENTAL

Operating Temperature: -40 to 75ºC (-40 to 167ºF).



DIMENSIONS25 mm H by 103 mm W by 135 mm L (1 in. H by 4.05in. W by 5.3 in. L).WEIGHT

135 g (4.7 oz) typical.

APPROVALS



4-24 Rev 5/02

4.6.4 Dial-Up Modem Communications

Specifications

OPERATION

Mode: Full-duplex 2-wire for dial-up PSTN (Bell 212compatible).

Data Rate: Up to 14.4K bps asynchronous (softwareselectable).


Format: 8, 9, 10, or 11 bits, including start, stop, andparity (software selectable).

Modulation: V.32 and V.32 bis, V.21 and 103, binaryphase-coherent FSK; V.22 and 212A, and V.22 bis.

Transmit Carrier Frequencies: Originate, 1200 Hz ±0.1%; Answer, 2400 Hz ± 0.1%.

Receive Carrier Frequencies: Originate, 2400 Hz ±7 Hz; Answer, 1200 Hz ± 7 Hz.

Transmit Amplitude: -1 dB typical.

Telephone Line Impedance: 600 ohm typical.


Receiver Sensitivity: Off-to-On threshold, -45 dBm.On-to-Off threshold, -48 dBm.

Maximum Output Level: 0 dBm nominal into 600ohms.

LED Indicators: TXD, RXD, DTR, DSR, RI, and OH.

Surge Protection: Conforms to FCC part 68 andDOC.

Surge Isolation: 1000 Vac and 1500 volt peak.

Certification: FCC Part 68 approved.

Connector: RJ11 type.

POWER REQUIREMENTS4.5 to 5.5 Vdc, 0.4 W maximum (supplied by ROC).

ENVIRONMENTALOperating Temperature: -40 to 75ºC (-40 to 167ºF).



DIMENSIONS25 mm H by 103 mm W by 135 mm L (1 in. H by 4.05in. W by 5.3 in. L).

WEIGHT130 g (4.6 oz) typical.



Rev 5/02 5-1

SECTION 5 — I/O CONVERTER CARD

5.1 SCOPE

This section describes the I/O Power Converter Card optionally available for the ROC364 RemoteOperations Controller. Topics covered include:

♦ Product Description♦ Initial Installation and Setup♦ Troubleshooting and Repair♦ Specifications

5.2 PRODUCT DESCRIPTION

The I/O Power Converter Card, which mounts on the MCU board, is used when the ROC is poweredfrom a 12-volt power supply and 24 volts dc is required to power field transmitters (see Table 5-1). Amaximum of twenty five 4-to-20 milliamp loops can be accommodated by the card. If more thantwenty five current loops need to be accommodated, a separate 24-volt dc power supply must be used.

Figure 5-1 shows the I/O converter card.

Q1

L1

C3

RP1

Q2

RP2

U2

CR1

R3

R6

R4

CR2

C2 C4

U1

1

P1

DOC0124A

Figure 5-1. I/O Converter Card

Table 5-1. I/O Converter Card Requirements


5-2 Rev 5/02

MCU INPUT VOLTAGE(Vdc)

ARE 4 TO 20 mA LOOPSUSED?

IS A CONVERTERNEEDED?

12 No No

12 Yes Yes

24 No No

24 Yes No


The I/O converter card is normally installed at the factory when the ROC is ordered. However, themodular design of the ROC makes it easy to change the hardware configuration in the field. Thefollowing procedure assumes a first-time installation. For units currently in service, certain precautionsmust be taken to assure that data is not lost and equipment is not damaged. See the "Troubleshootingand Repair" procedures for more information.



To install the converter card, proceed as follows:

1. Remove the four screws securing the MCU upper cover in place, and then lift off the cover.It may be necessary to first remove the memory module retainer.

2. Locate connector J1 on the MCU board. If a shorting plug is plugged into J1, remove it.

3. Grasp the I/O converter card by its edges and position the card connector over connector J1on the MCU board. Push down firmly, but gently, to seat the card into the connector.

4. Secure the card in place using three 6-32 screws.

5. Reinstall the MCU cover and retainer.


The troubleshooting and repair procedures are designed to help the technician identify and replacefaulty boards and modules. Faulty boards and modules should be returned to your local salesrepresentative for repair or replacement.


Rev 5/02 5-3

First indications of possible I/O Converter Card failure are when:

♦ More than one I/O device fails to operate properly.♦ The value for diagnostic analog input +T (Point E1) as read by the configuration software is

less than 22 volts dc.

If the reading is questionable, the voltage may be confirmed by measuring the voltage at terminal “A”of any analog input loop module.

Follow the procedure below to help ensure data is not lost and equipment is not damaged duringreplacement of an I/O Converter Card.

5.4.1 Replacing an I/O Converter Card

If you are installing an I/O Converter Card for the first time, refer to section 5.3. To remove andreplace a converter card on an in-service ROC, perform the following procedure. Be sure to observethe cautions to avoid losing data and damaging equipment.

NOTE: There is a possibility of losing the ROC configuration and historical data held in RAMwhile performing the following procedure. As a precaution, save the current configuration andhistorical data to permanent memory as instructed in Section 2.5.



During this procedure, all power will be removed from the ROC and devices powered bythe ROC. Ensure that all connected input devices, output devices, and processes willremain in a safe state when power is removed from the ROC and also when power isrestored to the ROC. An unsafe state could result in property damage.

1. Disconnect power from the ROC364, such as by unplugging the power terminal block.

2. Remove the screws that hold the MCU upper cover in place, and then lift off the cover.It may be necessary to first remove the memory module retainer.

3. Remove the three screws securing the I/O Converter Card. Using a rocking motion todisengage the card from its connector, pull the card free from the MCU board.

4. To reinstall an I/O Converter Card, orient the card over connector J1 on the MCU board sothat plug P1 will fit into it. Gently press until the connector firmly seats.


5-4 Rev 5/02

5. Install the three 6-32 retaining screws to secure the card to the MCU board.

6. Reinstall the MCU cover and retainer.

7. Reconnect power to the ROC, such as by plugging in the power terminal block.

8. Using the configuration software, check the configuration data (including ROC displays)and FSTs, and load or modify them as required. Also, load and start any user programs asneeded.


10. If you changed the configuration, save the configuration data to EEPROM. Also, if youchanged the configuration (including the history database and ROC displays) or FSTs, savethem to disk. See Section 2.5.1 for more information.

5.5 SPECIFICATIONS

Specifications

IINPUT

11 to 16 Vdc, 15 mA with no load or shorted output.

OUTPUT

22 to 24 Vdc, up to 0.6 A for transmitter power.

ENVIRONMENTAL

Same as the ROC364 unit. See the specifications inSection 2.6.

DIMENSIONS

63 mm W by 76 mm L (2.45 in. W by 3 in. L).


Rev 5/02 A-1

APPENDIX A — LIGHTNING PROTECTION MODULE

A.1 SCOPE

This appendix describes the Lightning Protection Module (LPM) used with the ROC364 RemoteOperations Controller. Topics covered include:

♦ Product Description♦ Initial Installation♦ Connecting the Module to Wiring♦ Troubleshooting and Repair♦ Specifications

A.2 PRODUCT DESCRIPTION

Figure A-1 shows a front and side view of the module. The LPM is designed to prevent damage to I/Omodules and to built-in I/O circuitry from any high-voltage transients that may occur in field wiring.The LPMs plug into the field wiring I/O termination sockets located on the ROC termination card.

The LPM provides screw terminals for connecting to field wiring. It has sockets for plugging in a rangeresistor, especially when used with built-in I/O. The module also provides a ground wire forconnection to the enclosure ground bar.

Figure A-1. Lightning Protection Module

In general, it is recommended a LPM be used to protect the circuitry for each field input or output. AnLPM can be used with any type of input or output as long as the normal operating range of the input oroutput is less than the clamping release voltage of the LPM. The LPM cannot be used with a 120 volt

DOC0138A

SIDE VIEW

LPM-2

FRONT VIEW

BUILT-IN FIELD WIRINGTERMINATION BLOCK

CONNECT GREEN WIRETO ENCLOSURE GROUNDBAR OR GROUND LUG

I/O WIRING


A-2 Rev 5/02

ac signal on a DO Relay Module. The LPM is most often used with analog and pulse inputs. TheLPM has little effect with an RTD module; however, the LPM protects the I/O rack and other modules.

A.3 INITIAL INSTALLATION

The LPM plugs into any of the field terminal block sockets located next to the I/O module slots on thetermination card. To add an LPM to protect an I/O module, AI/PI channel or a built-in analog I/Ochannel, perform the following steps. Refer to Figure A-2.

I/O WIRING

CONNECT GREEN WIRE TO ENCLOSURE

CO

NN

EC

TG

RE

EN

WIR

ET

OE

NC

LOS

UR

E

I/OW

IRIN

G

GROUND BAR OR GROUND LUG

GR

OU

ND

BA

RO

RG

RO

UN

DLU

GSTATUS

AUX

INTERFACE COMMRESET

T T

AI DI/PIAI DI/PI

-+

DO

COM

NO

DSPL

GND

NO

COM

+BAT

-BAT

+ -+ -+ -

REMOTE OPERATIONS CONTROLLER

ROC312

+S

-S

+S

-S

7

8

9

C

B

A

12

FLA

SH

PA

C

A

B

C

A

B

C

A

B

C

A

B

C

12

11

10

LPM

-2

LPM-2

®

LPM312

Figure A-2. Lighting Protection Module Installation


Rev 5/02 A-3

If you are installing an LPM on a ROC currently in service, and there is a field deviceconnected to the I/O channel that will receive the LPM, make sure the field device will notbe left in an undesirable state when it is disconnected from the ROC. An unsafe statecould result in property damage.

Do not use the lightning protection module with 120-volt ac signals.

1. Unplug the field wiring termination block from the channel for which the LPM is goingto be installed.

2. Plug the LPM into the field wiring terminal block socket located in step 1.

3. Connect the LPM ground wire to the ground bus bar. The ground bar must be connected toa good earth ground. Do not use the power system ground for this connection.

4. Transfer any field wiring from the unplugged termination block to the built-in terminationblock on the LPM.

A.4 CONNECTING THE LPM TO WIRING

There is a one-to-one correspondence between the LPM terminals and the terminals of the I/O channelbeing protected. If you are connecting field wiring to the LPM, refer to the I/O wiring information inthis instruction manual.

NOTE: The LPM module provides sockets for a plug-in range (scaling) resistor. These sockets,which are internally connected to the module’s middle and right-most screw terminals, must be usedwhen installing a range resistor for a built-in analog input channel. For an analog input module orany other module using a scaling resistor, either the sockets on the I/O module or on the LPM maybe used for the scaling resistor.

The LPM module provides a ground wire for connection to the enclosure ground bar or ground lug. Theenclosure ground bar or ground lug must in turn be connected to a good earth ground. Do not use thepower system ground for this connection.

A.5 TROUBLESHOOTING AND REPAIR

The Lightning Protection Modules function by shunting the high voltage transients through gasdischarge tubes to the ground lead. In the event of an I/O signal failure, verify the signal is notinterrupted by the LPM. Proceed to the troubleshooting and repair procedures for I/O in previoussections of this manual.

Before removing an LPM, make sure all devices and processes remain in a safe state. Remove theLPM and disconnect the field wiring. Remove any range resistors from the LPM. With a digital


A-4 Rev 5/02

multimeter, verify continuity through each connector socket to the corresponding field wiring terminal.If there is no continuity, replace the LPM.

With a digital multimeter, check each of the input terminals for continuity to the ground lead. If the testshows continuity to the ground lead, replace the LPM.

A.6 LPM SPECIFICATIONS

Specifications

ELECTRICAL

Series Resistance: 10 ohms from input to output,each terminal.

DC Clamping Voltage: 72 to 108 Volts.

100 V/ms Impulse Clamping Voltage: 500 Voltsmaximum.

Clamping Release Voltage: 52 Volts minimum.

10 KV/microsecond Impulse Clamping Voltage:900 Volts maximum.

Surge Life: Module can withstand 300 surges of 10to 1000 microseconds duration at 500 Ampsminimum.

Insulation Resistance: 10,000 Megohm minimum.

Capacitance: 1.0 picofarad maximum @ 1 MHz,each terminal.

CASE

Material: ABS polycarbonate thermoplastic.

Dimensions: 17 mm H by 21 mm W by 40 mm D (0.65in. H by 0.84 in. W by 1.58 in. D).

Length of Ground Wire: 1.2 m (48 in.) nominal.

SURGE WITHSTAND

Meets surge requirements IEEE C62.31.

ENVIRONMENTALMeets the Environmental specifications of the ROC unitin which the module is installed, including Temperature,Humidity, and Transient Protection.WEIGHT


APPROVALS



Rev 5/02 B-1

APPENDIX B — LOCAL DISPLAY PANEL

B.1 SCOPE

This appendix describes the Local Display Panel used with the ROC364 controllers. Topics coveredinclude:

♦ Product Description♦ Installation♦ Operation — Function Keys and Displays♦ Troubleshooting and Repair♦ Specifications

B.2 PRODUCT DESCRIPTION

The Local Display Panel (LDP) is an ASCII terminal with a 4-line by 20-character liquid crystaldisplay (LCD) and a 4-key keypad. Refer to Figure B-1. The unit mounts in the door of a ROCenclosure and displays a variety of point data. If the ROC has a FlashPAC installed, then the LDP canalso be used to change the value of numeric parameters (see Section B.4.12). These are parameters thathave been previously selected using the ROCLINK software, as described in the ROCLINKConfiguration Software User Manual (Form A6051) or the ROCLINK for Windows ConfigurationSoftware User Manual (Form A6091).

The LDP communicates to the ROC and receives its power through the DSPL or DISPLAY connectorlocated on the front panel of the ROC. The display panel allows you to view the point configurationand related point data values on-site without requiring a personal computer.

The display panel uses both menu and point displays to convey ROC information. The menu displayseither list other displays or they list point displays. The point displays provide current, relevantinformation specific to a point.

The LDP permits a cold hard start on newer ROCs. To initiate a cold hard start, press and hold the left-most display button for 5 to 10 seconds during ROC power-up. Note that for ROCs with a FlashPAC(and some recent versions of ROCPACs), this action restarts the ROC from factory defaults for allpoint and communications parameters. All AGAs, PIDs, FSTs, and user programs will need to berestarted (re-enabled) after this cold start; however, event log, alarm log, and history data is preserved.


B-2 Rev 5/02

Figure B-1. Local Display Panel

B.3 INSTALLATION

A kit is available for field installations of the Local Display Panel (LDP) in a ROC enclosure thatcontains cutouts for the display panel in the door. If you have an older ROC enclosure without thecutouts, you can order a new door with cutouts. A kit is available, with a cutout template, for mountingthe local display panel in other enclosures. The Local Display Panel kits FSACC-1/LCDWH (white),/LCDAH (ANSI 61 gray), and /LCDRH (regal gray) include the following items:

Description QuantityLCD Sub-Assembly 1Window 1Gasket 1Display CoverAssembly

1

6-32 × .25 Screws 26-32 Hex Nuts 3Flat Wire Clips 2RTV Sealant 1Cable Assembly 1

Refer to Figure B-2 for how these parts fit together. Note that the panel is also referred to as the LCD.

>I/O SYS FSTAGA PID MSGDB TNK LCD

UP DOWN ENTER MENU


Rev 5/02 B-3

SCREW

DISPLAYCOVER ASSEMBLY

PRE-PUNCHED DOOR(NOT INCLUDED)

CABLEASSEMBLY

GASKETWINDOW

HEXNUT

LCDSUB-ASSEMBLY

Figure B-2. LDP Parts Orientation

Use the following steps to install the display panel.

1. Inspect the kit and verify that there are no missing parts.

2. Remove the cutout cover from the enclosure door.

3. Place two small drops of RTV sealant on the LCD sub-assembly to hold the window inplace while installing the panel. Refer to Figure B-3.


B-4 Rev 5/02

TAB UP

RTV

LCD SUB-ASSEMBLY

WINDOW

RTV

Figure B-3. LCD Sub-Assembly

4. Remove the protective paper from the window and place the window in the cavity.

5. Place a small bead of RTV (approximately 1/16" wide) onto the gasket surface. Align thegasket holes to the door studs with the RTV facing the door and press into place. Refer toFigure B-4.

INSIDE VIEW OF DOOR

GASKET

HOLES RTV

GASKET

DOORSTUDS

Figure B-4. LCD Inside View of Door


Rev 5/02 B-5

6. Place a small bead of RTV (approximately 1/16" wide) around the edge of the window.Refer to Figure B-5.

LCD SUB-ASSEMBLY

WITH WINDOW

HOLESINSIDE VIEW

OF DOORRTV

Figure B-5. LCD RTV Installation

7. Position the LCD sub-assembly over the door studs and press into place.

8. Fasten the LCD sub-assembly with the hex nuts provided in the kit.

9. Attach the display cover to the outside of the enclosure door with the two screws provided inthe kit.

10. Connect the display cable assembly to the display port of the ROC. Use the flat wire clips tohold the cable in place. Make sure the cable does not interfere with the door.

B.4 OPERATION

B.4.1 Function Keys

The user operates the display panel with the four function keys located below the display area. Each oneof the four keys relates to a function key label displayed above the key on the bottom line of the displayarea. For proper operation of the LDP on ROCs with a ROCPAC, press the keys of the keypaddown for approximately one second to allow enough time for the software to recognize thekeystroke. Table B-1 lists the labels for the keys and the functions they provide.


B-6 Rev 5/02

Table B-1. Function Key Labels and Descriptions

LABEL DESCRIPTION

UP Moves the cursor (>) up one line at a time. If pressed and held for 5 to 10seconds on ROC power-up, ROC performs a cold hard-start.

DWN or DOWN Moves the cursor (>) down one line at a time.

ENTER Activates the selection pointed to by the cursor and shows a menu or pointdisplay. In the event there are no points to display, the current menu displayremains and the cursor returns to the beginning of the list.

MENU Returns to the menu display last used.

SCAN Monitors a point display in an updating mode. For a ROC with a ROCPAC,by pressing the SCAN key (the label then changes to AUTO), the display isupdated with current values from the ROC every 3 seconds for a duration of 2minutes. After 2 minutes have elapsed, the display ceases to update values(reverts to a “hold” mode) and the key label changes back to SCAN. For aROC with a FlashPAC, by pressing the SCAN key (the label then changes toHOLD), the display is updated with current values from the ROC everysecond, and the display automatically scrolls through all points of the selectedtype at a rate of about 4 seconds per configured point. This scrolling modecontinues until the HOLD key is pressed.

NEXT Brings up the next display if multiple displays exist. When NEXT is pressed atthe end of the list, the first display in the list is brought up. This key is disabledduring the SCAN mode.

PREV Brings up the previous display if multiple displays exist. When PREV ispressed at the head of the list, the first display in the list remains displayed.This key is disabled during the SCAN mode.

AUTO This key applies only to ROCs with a ROCPAC. It stops the values on thedisplay from being updated, functioning as a “hold” mode. When the key ispressed, the AUTO label changes to SCAN.

HOLD This key applies only to ROCs with a FlashPAC. It stops the display fromscrolling between points (but values continue to be updated once per second),holding the display at the current point. When the key is pressed, the HOLDlabel changes to SCAN.

ESC Available only when in an edit mode, this key cancels the current action andreturns the last display.

INC Increments the displayed character to the next character (when “9” is reached,it starts over at “0”). Used to enter a password or to enter numeric valueswhen editing parameters.

EDIT Brings up a display prompting the user to enter a value.


Rev 5/02 B-7

B.4.2 Display Format

The local display panel provides the user with menu, point, system information, and user configureddisplays. The main menu display provides a list of other displays and allows the user to select a displayfor viewing. Figure B-6 shows the main menu display.

>I/O AGA FSTSYS PID MSGDB TNK LCD

UP DWN ENTER MENU

Figure B-6. Typical Main Menu Display

The menu displays have lists of items for selection. The UP or DWN function keys move the cursor (>)through the menu list. After moving the cursor to the desired item, press the ENTER function key. Ifthe item exists in the ROC configuration, a new display for the selected item appears. This display maybe another menu or an information display. If the item does not exist, the cursor moves to the start ofthe menu display list.

To return to the previous menu, press the MENU key. To return to the main menu, press the menu keyuntil the main menu displays. The following paragraphs describe in detail the various displays availableon the panel.

B.4.3 Main Menu Display

The main menu provides the user nine menu selections. Table B-2 describes the menu items. Thesubsequent subsections provide detail for the various main menu selections.


B-8 Rev 5/02

Table B-2. Main Menu Items of the Local Display Panel

MENU DESCRIPTION

I/O Provides a menu from which the user can select monitored values from thefive I/O groups: discrete inputs, discrete outputs, analog inputs, analogoutputs, and pulse inputs.

SYS Provides four displays of system parameters and related information.

DB Provides a menu for viewing points in the history database.

AGA Provides a point display for each configured AGA point.

PID Provides a point display for each configured PID point.

TNK Provides a point display for each configured tank point (appears only forROCs with a ROCPAC).

FST Provides a point display for each configured FST point.

MSG Provides a point display for each configured FST message point.

LCD Provides eight displays that the user defines with the ROCLINK configurationsoftware. For a FlashPAC ROC, it provides a menu that the user can use toselect viewing or editing of parameters.

B.4.4 I/O Menu Display

The local display panel returns the I/O menu display after it is selected from the main menu. Refer toFigure B-7. The I/O menu allows you to select point displays from the various I/O groups configured inthe ROC. Move the cursor with the UP or DWN keys and press the ENTER key to select the desiredI/O group. If the selected I/O group does not have any points configured in the ROC, the I/O menuremains displayed and the cursor moves to the beginning of the list. To return to the main menu, pressthe MENU key.

>DI'S AO'SDO'S PI'SAI'S

UP DWN ENTER MENU

Figure B-7. I/O Menu Display

The point displays provide current information specific to a point selected from the I/O group list. Forexample, the point display for an analog input shows the associated tag, units, point number, alarm state,and the process variable expressed in engineering units.

Table B-3 identifies the I/O types available from the I/O menu. For further information about the pointparameters, see the configuration software user manual.


Rev 5/02 B-9

Table B-3. I/O Menu Point Types

PARAMETER DESCRIPTION

DI Provides a point display for each configured discrete input.

DO Provides a point display for each configured discrete output.

AI Provides a point display for each configured analog input.

AO Provides a point display for each configured analog output.

PI Provides a point display for each pulse configured input.

B.4.4.1 Discrete Input Point Display

The display shown in Figure B-8 is a typical display for each discrete input point. For a ROC with aROCPAC, use the NEXT and PREV keys to move between the discrete inputs configured in the ROC.For a ROC with a FlashPAC, use the HOLD key to stop the display from automatically scrollingbetween points. To return to the I/O menu display, press the MENU key. The discrete input pointdisplay shows the parameters listed in Table B-4.

Dis DI #1 PT# A13OFF EU 0.00ACC 160461SCAN NEXT PREV MENU

Figure B-8. Discrete Input Point Display


B-10 Rev 5/02

Table B-4. Discrete Input Point Display Parameters


Point Tag ID A 10-character identifier for the discrete input.

Point Number The module rack letter and number of the discrete input (point) asinstalled in the system.

Status The state of the discrete input. “OFF” in the field shows that the input isoff or that a switch is open. “ON” shows that the input is on or that aswitch is closed. The Status value can be changed in the manual modeto lock an input to either the “OFF” or “ON” state.

EU Value Used only when the discrete input is configured as a timed durationinput. This value is calculated at scan period intervals using the 0%count, 100% count, low reading EU, high reading EU, and TDI countparameters.

Accumulator The number of positive (“0” to “1”) transitions of the discrete input.

B.4.4.2 Discrete Output Point Display

Each selected discrete output returns a display similar to the one in Figure B-9. For a ROC with aROCPAC, use the NEXT and PREV keys to move between the discrete outputs configured in the ROC.For a ROC with a FlashPAC, use the HOLD key to stop the display from automatically scrollingbetween points. To return to the I/O menu display, press the MENU key. The discrete output pointdisplay shows the parameters listed in Table B-5.

Dis DO #1 PT# A1OFF EU 50000.00ACC 160862SCAN NEXT PREV MENU

Figure B-9. Discrete Output Point Display


Rev 5/02 B-11

Table B-5. Discrete Output Point Display Parameters


Point Tag ID A 10-character identifier for the discrete output.

Point Number The module rack letter and number of the discrete output (point) asinstalled in the system.

Status The state of the discrete output. “OFF” in the field indicates that theoutput is off or that the relay is open. “ON” indicates that the output ison or that the relay is closed.

EU Value Used only when discrete output is configured as a timed duration output.The output value is calculated from EU Value using the 0% Count,100% Count, Low Reading EU, High Reading EU parameters.

Accumulator The number of positive (“0” to “1”) transitions of the discrete output.

B.4.4.3 Analog Input Point Display

Figure B-10 shows a typical analog input display. For a ROC with a ROCPAC, use the NEXT andPREV keys to move between the analog inputs configured in the ROC. For a ROC with a FlashPAC,use the HOLD key to stop the display from automatically scrolling between points. To return to the I/Omenu display, press the MENU key. The analog input point display shows the parameters listed inTable B-6.

AI #1EU -50.00 PT#ALM 00000011 A2SCAN NEXT PREV MENU

Figure B-10. Analog Input Point Display


B-12 Rev 5/02

Table B-6. Analog Input Point Display Parameters


Point Tag ID A 10-character identifier for the analog input.

Units A 10-character identifier for the engineering units assigned to the analoginput.

EU Value The value in engineering units.

Point Number The module rack letter and number of the analog input (point) asinstalled in the system.

B.4.4.4 Analog Output Point Display

Each selected analog output returns a display similar to the one in Figure B-11. For a ROC with aROCPAC, use the NEXT and PREV keys to move between the analog outputs configured in the ROC.For a ROC with a FlashPAC, use the HOLD key to stop the display from automatically scrollingbetween points. To return to the I/O menu display, press the MENU key. The analog input pointdisplay shows the parameters listed in Table B-7.

AO DefaultEU 4.00 PT#ALM 00000000 A8SCAN NEXT PREV MENU

Figure B-11. Analog Output Point Display


Rev 5/02 B-13

Table B-7. Analog Output Point Display Parameters


Point Tag ID A 10-character identifier for the analog output.

Units A 10-character identifier for the engineering units assigned to the analogoutput.

EU Value The output value in engineering units.

Point Number The module rack letter and number of the analog output (point) asinstalled in the system.

B.4.4.5 Pulse Input Point Display

The display shown in Figure B-12 is a typical display for each pulse input point. For a ROC with aROCPAC, use the NEXT and PREV keys to move between the pulse inputs configured in the ROC. Fora ROC with a FlashPAC, use the HOLD key to stop the display from automatically scrolling betweenpoints. To return to the I/O menu display, press the MENU key. The pulse input point display showsthe parameters listed in Table B-8.

Dis FCI #1 CountsEU 0.00 PT#ALM 00000000 A4SCAN NEXT PREV MENU

Figure B-12. Pulse Input Point Display

Table B-8. Pulse Input Point Display Parameters


Point Tag ID A 10-character identifier for the pulse input.

Units A 10-character identifier for the engineering units assigned to the pulseinput.

EU Value If the rate flag has been set to rate, then the EU/time will be displayed.If accumulation was selected, then the EUs accumulated since contracthour will be displayed.

Point Number The module rack letter and number of the pulse input (point) as installedin the system.


B-14 Rev 5/02

B.4.5 SYS Parameter Displays

The main menu selection SYS provides four displays showing current system parameters. For a ROCwith a ROCPAC, use the NEXT and PREV keys to move between the four system parameter displays.For a ROC with a FlashPAC, use the HOLD key to stop the automatic scrolling among the four displays.To return to the main menu display, press the MENU key.

B.4.5.1 SYS Parameter Display 1

Figure B-13 shows a typical SYS parameter display 1. Table B-9 describes the parameters returned inSYS display 1.

Remote Oprtns CntrlrADDR 1 GROUP 214:52:12 6/24/97SCAN NEXT PREV MENU

Figure B-13. SYS Parameter Display 1

Table B-9. SYS Parameter Display 1


Station Name 20-character identifier for the location of the ROC.

Station Address Number identifying the ROC address.

Station Group Number identifying the ROC group.

Time and Date The current time and date kept by the real- time clock of the ROC.


SYS parameter display 2 shown in Figure B-14 provides information about the ROC firmware.Table B-10 describes the parameters returned in SYS display 2.

W68067X0012 Ver 2.00Fisher FAS ROC300Nov 26 13:35:20 1997SCAN PREV NEXT MENU



Rev 5/02 B-15

Table B-10. SYS Parameter Display 2


Version Identifies the part number and version of the firmware in the ROC.

Firmware Identifies Fisher Controls International as creator of the firmware.

Creation Identifies the time and date that the firmware was created.


Figure B-15 shows a typical SYS Parameter Display 3. This display informs the operator whichinput/output types are in manual mode. If all I/O points are in manual mode, then ALL CLEAR isreplaced with AIS AOS DIS DOS PIS (AIS = analog inputs, AOS = analog outputs, DIS = discreteinputs, DOS = discrete outputs, PIS = pulse inputs).

MANUAL MODE AT:ALL CLEAR

SCAN NEXT PREV MENU



Figure B-16 shows a typical SYS Parameter Display 4. This display informs the operator whichcategory of I/O point types are in an alarm condition (AIS = analog inputs, AOS = analog outputs, DIS =discrete inputs, DOS = discrete outputs, PIS = pulse inputs). For a ROC with a ROCPAC, use theNEXT and PREV keys to move to another SYS parameter display. For a ROC with a FlashPAC, usethe HOLD key to stop the SYS parameter display from scrolling. To find the specific I/O point that is inalarm, go to the I/O point displays and scroll through all the points of the indicated type while looking atthe Alarm Code.

If no I/O point is in alarm, then ALL CLEAR is displayed. If all I/O point types are in alarm, then AISAOS DIS DOS PIS is displayed.

ALARM CONDITION AT:ALL CLEAR


B-16 Rev 5/02

SCAN NEXT PREV MENU


B.4.6 DB Menu Display

Selecting DB from the main menu returns a display similar to the one in Figure B-17. The local displaypanel function keys NEXT and PREV provide access to historical database points for the base RAM, theRAM1, or the RAM2 area. Position the cursor next to the desired RAM area and then press the ENTERkey to select it. There are 30 points possible in each RAM area; the point numbering begins at #1 withineach area. On ROCs with a ROCPAC, if a RAM module is not installed for RAM1 or RAM2, then nopoints will be displayed. To return to the main menu display, press the MENU key.

>BASERAM1RAM2

UP DWN ENTER MENU

Figure B-17. DB Menu Display

The display shown in Figure B-18 is a typical display for each historical database point. For a ROC witha ROCPAC, use the NEXT and PREV keys to move between the historical database points configuredin the ROC. For a ROC with a FlashPAC, use the HOLD key to stop the display from automaticallyscrolling between points. To return to the DB menu display, press the MENU key. The DB pointdisplay shows the parameters listed in Table B-11.


Rev 5/02 B-17

+T DB#1CUR VAL 23.38

SCAN NEXT PREV MENU

Figure B-18. DB Point Display

Table B-11. DB Point Display Parameters


Point Tag ID A 10-character identifier for the database point.

Point Point for the selected RAM area. Point number can be 1 through 30 foreach RAM area.

Current Value The current value read for use by the historical database.

B.4.7 AGA Point Displays

The parameters for each AGA point are viewed in three sequential displays. Display 1 contains thecurrent flow rate and alarm. Display 2 contains the volume accumulation for today and yesterday.Display 3 contains the energy accumulation for today and yesterday. For a ROC with a ROCPAC, usethe NEXT and PREV keys to move between the three AGA displays. For a ROC with a FlashPAC, usethe HOLD key to stop the display from automatically scrolling between displays. To return to the mainmenu display, press the MENU key.

Normally, the values in these AGA displays can only be viewed by the user; however, with the propersoftware and a user-entered password, orifice plate values can be edited. For a ROC with a ROCPAC, aspecial user program must be loaded; for a ROC with a FlashPAC, this program is pre-loaded. If theprogram is present, the display shown in Figure B-20 appears. Select either VIEW (see sections B.4.7.1to B.4.7.3) or Plate Change (see section B.4.7.4).

>VIEWPlate Change

UP DOWN ENTER MENU

Figure B-19. AGA Menu Display

B.4.7.1 AGA Point Display 1


B-18 Rev 5/02

Figure B-20 shows a typical AGA point display 1. Table B-12 describes the parameters shown on anAGA point display 1.

AGA1CUR RATE 5003.34ALM 00000000SCAN NEXT PREV MENU

Figure B-20. AGA Point Display 1

Table B-12. AGA Point Display 1 Parameters


Point Tag ID A 10-character identifier for the AGA point.

Flow Rate The current instantaneous flow rate in volume units/day.


Figure B-21 shows a typical AGA point display 2. The AGA point display 2 shows the parameterslisted in Table B-13.

AGA1 MCFCUR TTL 622.07Y'DAY TTL 0.00SCAN NEXT PREV MENU





Flow Accumulation The accumulated volume since contract hour.

Flow Accumulationfor Yesterday

The accumulated volume for the day prior to contract hour.


Rev 5/02 B-19


Figure B-22 shows a typical AGA point display 3. The AGA point display 3 shows the parameterslisted in Table B-14.

AGA1 MMBTUCUR TTL 644.99Y'DAY TTL 0.00SCAN NEXT PREV MENU





EnergyAccumulation

The accumulated energy since contract hour.

EnergyAccumulationfor Yesterday

The accumulated energy for day prior to contract hour.

B.4.7.4 Entering Plate Change Information

Selecting Plate Change from the AGA Menu Display returns the display shown in Figure B-23. Thisdisplay prompts the user to enter a four-digit password.

! NOTE: Information describing how to set up the passwords can be found in the ROCLINKConfiguration Software User Manual (Form A6051) for Version 2.0/2.1 software or ROCLINKfor Windows Configuration Software User Manual (Form A6091).

ENTER PASSWORD

****INC NEXT ENTER ESC

Figure B-23. Plate Change Password Display

The password prompt appears as four asterisks (*) which represent the four characters of the password.To change an asterisk to a password character, press the INC (increase) key until the correct character


B-20 Rev 5/02

appears. Once the correct character appears, press the NEXT key to move right to the next asterisk anduse the INC to display the correct character. Continue this procedure for each asterisk until all fourpassword characters are displayed. Then, press the ENTER key to enter the password.

If the password is valid, a new display appears, prompting you to select an AGA point. Use the PREVand NEXT keys to display the desired AGA point, and then press the ENTER key. Use ESC to returnto the AGA menu display.

Upon selecting an AGA point, a display appears (see Figure B-24) showing the amount of time allowedbefore the LDP reverts to a view-only mode. You can edit the number of minutes by pressing the EDITkey or accept the default of 10 minutes. When you press the ENTER key, the display changes to showthe time remaining. When the new plate is installed, press DONE to continue on to editing the platesize.

Time Out (Minutes)

10EDIT ENTER ESC

Figure B-24. Time Out Display

If the orifice size has not changed, press the DONE key. A new display appears as shown in Figure B-25. To change the orifice size, you can use the DEC and INC keys to change the size in 1/8-inchincrements, or you can use the EDIT key to enter the exact size.

Plate Size = 4.000

DEC INC DONE EDIT

Figure B-25. Plate Size Editing Display

If you press EDIT, the prompt appears as eight digits representing the size of the orifice. To change adigit, press the INC key until the correct numeral (or decimal point) appears. Once the correct numberappears, press the NEXT key to move right to the next digit and use the INC to display the correctnumeral. Continue this procedure for each digit. Then, press the ENTER key to enter the new value.If the value is different than the old value, a prompt asks you to verify that this value should be writtento EEPROM (permanent memory). If you press YES, an entry is generated in the event log and you arereturned to the AGA menu display. If you press NO, you exit the Plate Change routine without achange being registered to EEPROM.


Rev 5/02 B-21

B.4.8 PID Point Displays

The display shown in Figure B-26 is a typical display for each PID point. For a ROC with a ROCPAC,use the NEXT and PREV keys to move between the PIDs configured in the ROC. For a ROC with aFlashPAC, use the HOLD key to stop the display from automatically scrolling between points. Toreturn to the main menu display, press the MENU key. The PID point display shows the parameterslisted in Table B-15.

PID #1 PRISP 0.00 MANPV 0.00 OUT 0.00SCAN NEXT PREV MENU

Figure B-26. PID Point Display

Table B-15. PID Point Display Parameters


Point Tag ID A 10-character identifier for the PID point.

Loop Status Indicates the running state of the PID; “OVR” for override or “PRI” forprimary.

Setpoint The setpoint for the PID loop displayed.

Control Type The operating mode, either “AUTO” or “MAN”.

ProcessVariable

The input for the PID loop displayed.

Output The corrected output for the PID loop displayed.


B-22 Rev 5/02

B.4.9 TNK Point Displays (ROC with ROCPAC only)

Each selected tank point returns a display similar to the one in Figure B-27. The local display panelfunction keys NEXT and PREV provide access to all the tank points configured in the ROC. To updatethe data on the display, press the SCAN key and the display updates every three seconds for a durationof two minutes. To return to the main menu display, press the MENU key. The tank point displayshows the parameters listed in Table B-16.

TANK1LEVEL 0.00VOLUME 0.00SCAN NEXT PREV MENU

Figure B-27. TNK Point Display

Table B-16. TNK Point Display Parameters


Point Tag ID A 10-character identifier for the tank point.

Fluid Level The current liquid level in the tank measured in engineering unitsdivided by the specific gravity.

Volume The calculated tank volume net gain or loss since contract hour.

B.4.10 FST Point Displays

Figure B-28 shows a typical FST point display. For a ROC with a ROCPAC, use the NEXT and PREVkeys to move between the FSTs configured in the ROC. For a ROC with a FlashPAC, use the HOLDkey to stop the display from automatically scrolling between points. To return to the main menudisplay, press the MENU key. Table B-17 lists the FST point display parameters.

FST SEQ# 1Status: OFF

SCAN NEXT PREV MENU

Figure B-28. FST Point Display


Rev 5/02 B-23

Table B-17. FST Point Display Parameters


Point Tag ID A 10-character identifier for the FST point.

Status Indicates the current state of the FST; “OFF”, “RUNNING”, or“TRACE”.

B.4.11 MSG Point Displays

Each selected FST message point returns a display similar to the one in Figure B-29. For a ROC with aROCPAC, use the NEXT and PREV keys to move between the FST messages configured in the ROC.For a ROC with a FlashPAC, use the HOLD key to stop the display from automatically scrollingbetween points. To return to the main menu display, press the MENU key. The MSG point displayshows the parameters listed in Table B-18.

THIS IS AN EXAMPLE FST MESSAGE Arg2 valFST SEQ# 1 -8888.00SCAN NEXT PREV MENU

Figure B-29. MSG Point Display

Table B-18. MSG Point Display Parameters


Message 30-character text specified by argument 1 of the FST MSG command.

Point Tag ID 10-character identifier for the FST Registers point being displayed.

Argument 2Value

The current value of the parameter specified by argument 2 of the FSTMSG command.

B.4.12 LCD Point Displays

LCD points consist of various ROC point parameters, which are selected by using the LCD Setupdisplay in the ROCLINK configuration software. Refer to the ROCLINK Configuration Software UserManual (Form A6051) or the ROCLINK for Windows Configuration Software User Manual (FormA6091). Eight LCD points are possible, each of which can have three parameter values displayed.Each parameter value is preceded by a user-entered description.

Normally, the values in these LCD points can only be viewed by the user; however, with the propersoftware and a user-entered password, these values can be edited. For a ROC with a ROCPAC, a


B-24 Rev 5/02

special user program must be loaded; for a ROC with a FlashPAC, this program is pre-loaded. If theprogram is present, the display shown in Figure B-30 appears. Select either VIEW (see sectionB.4.12.1) or EDIT (see section B.4.12.2).

>VIEWEDIT

UP DWN ENTER MENU

Figure B-30. LCD Menu Display

B.4.12.1 Viewing LCD Parameter Values

Each LCD point display consists of three lines, each with a 10-character text field and the value of apoint parameter. There are eight LCD point displays available to the user. The display shown in FigureB-31 is a typical display for each LCD point.

If the ROC has the LCD program loaded, you must first select VIEW from the LCD Menu Display. Fora ROC with a ROCPAC, use the NEXT and PREV keys to move between the LCD points configured inthe ROC. For a ROC with a FlashPAC, use the HOLD key to stop the display from automaticallyscrolling between points. To return to the main menu display, press the MENU key.

FST1 REG6= 0.000.000.00

SCAN NEXT PREV MENU

Figure B-31. LCD Point Display

B.4.12.2 Editing LCD Parameter Values

Selecting EDIT from the LCD Menu Display returns the display shown in Figure B-32. This displayprompts the user to enter a four-digit password.

! NOTE: Information describing how to set up the passwords can be found in the ROCLINKConfiguration Software User Manual (Form A6051) or the ROCLINK for WindowsConfiguration Software User Manual (Form A6091).

The password prompt appears as four asterisks (*) which represent the four characters of the password.To change an asterisk to a password character, press the INC (increase) key until the correct characterappears. Once the correct character appears, press the NEXT key to move right to the next asterisk anduse the INC to display the correct character. Continue this procedure for each asterisk until all four


Rev 5/02 B-25

password characters are displayed. Then, press the ENTER key to enter the password.

ENTER PASSWORD

****INC NEXT ENTER ESC

Figure B-32. LCD Password Display

If the password is valid, the Initial Parameter Display shown in Figure B-33 appears and you canproceed to edit the LCD parameters. If a valid password has not been entered, the LCD menu is againdisplayed. To return to the LCD menu or escape from entering a password, press the ESC key.

One parameter display is provided for each of the 24 available LCD parameters. To move between theparameter displays, use the NEXT and PREV keys. To change a parameter, press the EDIT key. Toreturn to the LCD Menu display, press the MENU key.

FST REG#6= 20.00

PREV NEXT EDIT MENU

Figure B-33. Initial Parameter Display

Selecting EDIT from the Initial Parameter Display causes the Parameter Editing Display to appear asshown in Figure B-34. This display prompts the user to enter a new value for the parameter.

FST REG#6= 20.00

±20.00000INC NEXT ENTER ESC

Figure B-34. Parameter Editing Display

The parameter prompt appears as up to eight characters representing the value of the parameter. Tochange a digit to the desired numeral, press the INC key until the correct numeral appears. Once thecorrect number appears, press the NEXT key to move right to the next digit and use the INC to displaythe correct numeral. Continue this procedure until all digits are displayed. The sign (+ or -) can also bechanged as needed. Then, press the ENTER key to enter the new value. If the value is different thanthe old value, an entry is generated in the event log.


B-26 Rev 5/02

! NOTE: IF you want the changed values to be saved to permanent memory (EEPROM), useROCLINK configuration software.

To exit from editing an LCD parameter and return to the Initial Parameter Display, press the ESC key.

B.5 TROUBLESHOOTING AND REPAIR

A Local Display Panel that does not function normally should be returned to your local salesrepresentative for repair or replacement.

B.6 LDP SPECIFICATIONS

Local Display Panel Specifications

DISPLAY

4-line by 20-character LCD. Display size 1 by 3-inch.Temperature compensated for constant contrast.

PUSHBUTTONS

Four contact-type with weather-proof membranecover.

PORTS

Connects to DISPLAY or DSPL port on ROC withcable supplied (2 ft. and 7.5 ft. lengths available).

POWER REQUIREMENTS

4.75 Vdc to 5.25 Vdc, 2.5 mA nominal, and -4.50 to-5.25 Vdc, 2.0 mA nominal, both supplied by ROC.

DIMENSIONS

20 mm D by 127 mm W by 133 mm H (0.8 in. D by 5in. W by 5.25 in. H).

ENVIRONMENTAL

Operating Temperature: -20 to 70°C (-4 to 160°F).Storage Temperature: -50 to 85°C (-58 to 185°F).Operating Humidity: To 95% relative humidity,non-condensing.EMI Emissions: Meets FCC Class A requirementswhen installed in a metallic ROC enclosure withcable in a conduit, shielded or inside enclosure.

WEIGHT

0.77 kg (1.7 lb) nominal.

APPROVALS



Rev 5/02 C-1

APPENDIX C — I/O SIMULATION

C.1 SCOPE

This appendix describes how to simulate inputs and outputs to verify the proper operation of the ROC.The simulations make use of the various types of I/O modules available for the ROC. Topics coveredare:

♦ Analog Outputs to Analog Inputs

♦ Analog Outputs to a Meter

♦ Discrete Outputs to Discrete Inputs

♦ Discrete Outputs to Pulse Inputs

♦ Potentiometer to Analog Inputs

♦ Switch to Discrete Inputs

♦ Switch to Pulse Inputs

C.2 ANALOG OUTPUTS TO ANALOG INPUTS

The analog output source module simulates a transmitter by feeding a 4 to 20 mA current to either ananalog input loop module or an analog input differential module. Figure C-1 and Figure C-2 showwiring connections.

LEVEL

AO SRC

B220

COMC

R1=0

+I

+VA I LIMIT

AI LOOP

B

C

A

-

R1=250

+

+T

DOC0176A

Vs

+

-

Figure C-1. Current Loop — AO Source Module to AI Loop Module


C-2 Rev 5/02

LEVEL

AO SRC

+

-

N/C

BCOM

220

C

+I

+V

R1=0

A

C

A

B

DOC0177A

AI DIFF

200K

R1=OPEN

200K

Figure C-2. Current Loop — AO Source Module to AI Differential Module

The analog output source module simulates a transmitter feeding a 0 to 5 volt dc signal to an analoginput differential module. Figure C-3 shows wiring connections.

LEVEL

AO SRC

B220

COMC

R1=0

+I

+VA

AI DIFF

C

A

B- 200K

R1=250

+

N/C

200K

DOC0178A

Figure C-3. Voltage Input — AO Source Module to AI Differential Module

C.3 ANALOG OUTPUTS TO AMMETER

Figure C-4 and Figure C-5 show how to use a meter to check an analog output source module bydirectly reading the current or voltage from the module.

R1=0

DOC0179A

LEVEL

AO SRC

220COM

C

+I

+VA

BAMPS+

-

Figure C-4. Current Loop — AO Source Module to Ammeter


Rev 5/02 C-3

R1=0

DOC0180A

LEVEL

AO SRC

BCOM

220

C

+V

+I

AVOLTS

+

-

Figure C-5. Voltage Output — AO Source to Voltmeter

C.4 DISCRETE OUTPUTS TO DISCRETE INPUTS

Figure C-6 shows how to use a discrete output source module to simulate a device transmitting adiscrete voltage level to a discrete input isolated module.

I LIMIT

CONTROL

+5V

+

–C

B

1 Amp

N/CA

C

B

A+

-

R1=10

N/C

DOC0181A

DI ISO

3.3K

DO SRC

Figure C-6. DO Source Module to DI Isolated Module

Figure C-7 shows how to use a discrete output isolated module to simulate relay contacts to a discreteinput source module.

CONTROL

+5V

DO ISO

N/C

1 Amp

NO

COM

C

A

B

C

B

A

–

+

N/C3.3K

R1=10

DOC0182A

Vs

DI SRC

+

-

Figure C-7. DO Isolated Module to DI Source Module


C-4 Rev 5/02

C.5 DISCRETE OUTPUTS TO PULSE INPUTS

Figure C-8 shows how to use a discrete output source module to simulate a device transmitting pulses(such as turbine meter) to a pulse input isolated module.

CONTROL

I LIMIT

+5VSSR

1 Amp

–

N/C

+B

C

A

B

C

A

R1=10

–

N/C

+

DOC0183A

PI ISO

2.2K

DO SCR

Figure C-8. DO Source Module to PI Isolated Module

Figure C-9 shows how to use a discrete output isolated module simulate a relay contact to a pulse inputsource module.

CONTROL

DO ISO

+5V

1 Amp

N/C

NO

COM

B

C

A

B

C

A

–

+

N/C2.2K

R1=10

DOC0184A

Vs

PI SRC+

-

Figure C-9. DO Isolated Module to PI Source Module


Rev 5/02 C-5

C.6 POTENTIOMETER TO ANALOG INPUTS

Figure C-10 shows how to use a potentiometer to simulate a transmitter feeding a 4 to 20 milliampcurrent signal to an analog input loop module.

Vs = 24 VDC: R2 = 1K OHMS

Vs = 12 VDC: R2 = 390 OHMS

5K OHMS

R2

C -

B

A

+

+T

R1=250

DOC0185A

I LIMIT

AI LOOP

Vs

Figure C-10. Potentiometer Input to AI Loop Module

Figure C-11 shows how to use a potentiometer and power source to simulate a transmitter feeding a4 to 20 milliamp current signal to an analog input differential module.

AUX PWR = 24 VDC, R2 = 20K OHMS

AUX PWR = 12 VDC, R2 = 8.2K OHMS

AUX PWR OUT 1

R2

-

+

5K OHMS200K

200KB

C -

A

+

N/C

R1=OPEN

DOC0186A

AI DIFF

Figure C-11. Potentiometer Input to AI Differential Module


C-6 Rev 5/02

C.7 SWITCH TO DISCRETE INPUTS

Figure C-12 shows how to use a switch and power source to simulate a device transmitting a discretevoltage level to a discrete input isolated module.

AUX PWR OUT 1

–

+SWITCH

B

C–

AN/C

+

R1=10

DOC0187A

DI ISO

3.3K

Figure C-12. Switch Input to DI Isolated Module

Figure C-13 shows how to use a switch to simulate relay contacts to a discrete input source module.

SWITCH

R1=10

C-

B

A

+

N/C3.3K

DOC0188A

DI SRC

Vs

Figure C-13. Switch Input to DI Source Module


Rev 5/02 C-7

C.8 SWITCH TO PULSE INPUTS

Figure C-14 shows how to use a switch to simulate relay contacts to a pulse input source module.

AUX PWR OUT 1

-

SWITCH+

C

B-

+

AN/C

R1=10

DOC0190A

PI ISO

2.2K

Figure C-14. Switch to PI Source Module

Figure C-15 shows how to use a switch and power supply to simulate a device transmitting discretepulses (turbine meter) to a pulse input isolated module.

SWITCH

R1=10

C

B-

+

AN/C

2.2K

DOC0189A

PI SRC

Vs

Figure C-15. Switch to PI Isolated Module


C-8 Rev 5/02


Rev 5/02 G-1

GLOSSARY OF TERMS

AA/D — Analog to Digital.AGA — American Gas Association.AWG — American Wire Gauge.AI — Analog Input.AO — Analog Output.Analog — Analog data is represented by a continuous variable, such as an electrical current signal.AP — Absolute Pressure.API — American Petroleum Institute.Area — A user defined grouping of database entities.ASCII — American Standard Code for Information Interchange.Attribute — A parameter that provides information about an aspect of a database point. For example,

the alarm attribute is an attribute that uniquely identifies the configured value of an alarm.

BBTU — British Thermal Unit, a measure of heat energy.Built-in I/O — I/O channels that are fabricated into the ROC or FloBoss and do not require a

separate module. Also called “on-board” I/O.

CCoil — Digital output, a bit to be cleared or set.COM1 — Communications port on the ROC364 that may be used for host communications. On

the FloBoss 407 and FloBoss 500-series, this Comm port is built-in for RS-232 serialcommunications.

COM2 — Communications port on the ROC364 or FloBoss 407 that may be used for hostcommunications.

COMM — Communications port on the ROC306 or ROC312 that may be used for hostcommunications.

Configuration — Refers either to the process of setting up the software for a given system or theresult of performing this process. The configuration activity includes editing the database,building schematic displays and reports, and defining user calculations. Typically, thesoftware setup of a device that can often be defined and changed. Can also mean thehardware assembly scheme.

CPU — Central Processing Unit.CRC — Cyclical Redundancy Check.CSA — Canadian Standards Association.CTS — Clear to Send modem communications signal.

DD/A — Digital to Analog.DB — Database.dB — Decibel. A unit for expressing the ratio of the magnitudes of two electric signals on a

logarithmic scale.


G-2 Rev 5/02

DCD — Data Carrier Detect modem communications signal. Also, Discrete Control Device — Adiscrete control device energizes a set of discrete outputs for a given setpoint and matches thedesired result against a set of discrete inputs.

Deadband — A value that is an inactive zone above the low limits and below the high limits. Thepurpose of the deadband is to prevent a value such as an alarm from being set and clearedcontinuously when the input value is oscillating around the specified limit. This alsoprevents the logs or data storage location from being over-filled with data.

DI — Discrete Input.Discrete — Input or output that is non-continuous, typically representing two levels such as on/off.DO — Discrete Output.DMM — Digital multimeter.DP — Differential Pressure.DSR — Data Set Ready modem communications signal.DTR — Data Terminal Ready modem communications signal.Duty Cycle — Proportion of time during a cycle that a device is activated. A short duty cycle

conserves power for I/O channels, radios, etc.DVM — Digital voltmeter.DVS — Dual-Variable Sensor. Provides static and differential pressure inputs to a FloBoss 503

Flow Manager.

EEDS — Electronic Static Discharge.EEPROM — Electrically Erasable Programmable Read Only Memory, a form of permanent

memory.EFM — Electronic Flow Metering or Measurement.EIA-232 — Serial Communications Protocol using three or more signal lines, intended for short

distances.EIA-422 — Serial Communications Protocol using four signal lines.EIA-485 — Serial Communications Protocol requiring only two signal lines. Can allow up to 32

devices to be connected together in a daisy-chained fashion.EMF — Electro-motive force.EMI — Electro-magnetic interference.ESD — Electro-static discharge.EU — Engineering Units. Units of measure, such as MCF/DAY.

FFirmware — Internal software that is factory-loaded into a form of ROM. In the ROC or FloBoss,

the firmware supplies the software used for gathering input data, converting raw input datacalculated values, storing values, and providing control signals.

FlashPAC — ROM and RAM module that contains the operating system, applications firmware,and communications protocol in a ROC300-Series unit.

Flash ROM — A type of read-only memory that can be electrically re-programmed. It is a form ofpermanent memory (needs no backup power). Also called Flash memory.

FloBoss — A specialized Remote Operations Controller (ROC), Fisher Control’s microprocessor-based unit that provides remote monitoring and control.

Force — Write an ON/OFF, True/False, or 1/0 value to a coil.FM — Factory Mutual.FPV — Supercompressibility Factor.


Rev 5/02 G-3

FSK — Frequency Shift Keyed.FST — Function Sequence Table, a type of program that can be written by the user in a high-level

language designed by Fisher Controls.

GGFA — Ground Fault Analysis.GND — Electrical ground, such as used by the ROC power supply.GP — Gauge Pressure.

HHART — Highway Addressable Remote Transducer.Holding Register — Analog output number value to be read.hw — Differential pressure.

I, JIC — Industry Canada, more recently known as Measurement Canada, which grants custody

transfer approvals on certain ROC and FloBoss units. IC can also mean “integrated circuit.”ID — Identification.IEC — Industrial Electrical Code.IEEE — Institute of Electrical and Electronic Engineers. The Open System Interconnection (OSI)

reference model and an international standard for the organization of local area networks(LANs) established by the International Standards Organization (ISO) and the IEEE.

IMV — Integral Multiplier Value.

Input — Digital input, a bit to be read.

Input Register — Input numeric value to be read.I/O — Input/Output.I/O Module — Module that plugs into an I/O slot on a ROC or FloBoss to provide an I/O channel.

See Section 3 of the instruction manual for a listing of available types of I/O modules.IRQ — Interrupt Request. Hardware address oriented.IV — Integral Value.

KKbytes — Kilobytes.kHz — Kilohertz.

LLCD — Liquid Crystal Display. Display only device used for reading data.LDP — Local Display Panel. A display-only device that plugs into a ROC300-series unit via a

parallel interface cable. The LDP consists of a 4-line by 20-character alphanumeric displayand four pushbuttons used to access information stored by the ROC.

LED — Light-emitting diode.LOI — Local Operator Interface. Refers to the serial (RS-232) port on the ROC or FloBoss

through which local communications are established, typically for configuration softwarerunning on a PC.

LPM — Lighting Protection Module. Use this module to provide lightning and power surgeprotection for ROCs and FloBoss units.

LRC — Longitudinal Redundancy Checking error checking.


G-4 Rev 5/02

MmA — Milliamp(s); one thousandth of an ampere.MC — See IC.MCU — Master Controller Unit.Modbus — A popular device communications protocol developed by Gould-Modicon.Modular I/O — I/O channels provided on a ROC using I/O modules. See I/O Module.MMBTU — Million British Thermal Units.MPU — Microprocessor Unit.MVS — Multi-Variable Sensor. The MVS provides differential pressure, static pressure, and

temperature inputs to the FloBoss 407 for orifice flow calculation.mV — Millivolts, or 0.001 volt.mW — Milliwatts, or 0.001 watt.

NNEC — National Electrical Code.NEMA — National Electrical Manufacturer’s Association.

OOH — Off-Hook modem communications signal.Off-line — Accomplished while the target device is not connected (by a communications link). For

example, off-line configuration is configuring a ROC in a electronic file that is later loadedinto the ROC.

Ohms — Units of electrical resistance.On-line — Accomplished while connected (by a communications link) to the target device. For

example, on-line configuration is configuring a ROC while connected to it, so that currentparameter values are viewed and new values can be loaded immediately.

OP — Operator Port; see LOI.Opcode — Type of message protocol used by the ROC to communicate with the configuration

software, as well as host computers with ROC driver software.

P, QParameter — A property of a point that typically can be configured or set. For example, the Point

Tag ID is a parameter of an Analog Input point. Parameters are normally edited by usingconfiguration software running on a PC.

Pf — Flowing pressure.PC — Personal computer.P/DP — Pressure/Differential Pressure.PI — Pulse Input.PID — Proportional, Integral, and Derivative control feedback action.PIT — Periodic Timer Interrupt.Point — Software-oriented term for an I/O channel or some other function, such as a flow

calculation. Points are defined by a collection of parameters.Point Number — The rack and number of an I/O point as installed in the ROC system.Point Type — The point type attribute defines the database point to be one of the possible types of

points available to the system. The point type determines the basic functions of a point.Preset — Number value previously determined for an register.


Rev 5/02 G-5

PRI — Primary PID control loop.PSTN — Public switched telephone network.PT — Process Temperature.PTT — Push-to-talk signal.Pulse — Transient variation of a signal whose value is normally constant.PV — Process variable or process value.

RRack — For a ROC, a rack is a row of slots into which I/O modules may be plugged. The rack is

given a letter to physically identify an I/O channel location, such as “A” for the first rack.Built-in I/O channels are assigned a rack identifier of “A,” while diagnostic I/O channels areconsidered to be in rack “E”.

RAM — Random Access Memory. In a ROC or FloBoss, it is used to store history, data, most userprograms, and additional configuration data.

RBX — Report-by-exception. In a ROC or FloBoss, it always refers to spontaneous RBX in whichthe ROC contacts the host to report an alarm condition.

RFI — Radio frequency interference.RI — Ring Indicator modem communications signal.ROC — Remote Operations Controller, Fisher Control’s microprocessor-based unit that provides

remote monitoring and control.ROCLINK — Configuration software used to configure ROC or FloBoss units to gather data, as

well as most other functions.ROCPAC Module — ROM and RAM module that contains the operating system, applications

firmware, and communications protocol in a ROC300-Series unit.ROM — Read-only memory. Typically used to store firmware. Flash memory.RTC — Real-time clock.RTD — Resistance Temperature Detector.RTS — Ready to Send modem communications signal.RTU — Remote Terminal Unit.RTV — Room Temperature Vulcanizing, typically a sealant or caulk like silicone rubber.RXD — Received data communications signal.

SSAMA — Scientific Apparatus Maker’s Association.Script — A uncompiled text file (such as keystrokes for a macro) that is interpreted by a program to

perform certain functions. Typically, scripts can be easily created or edited by the end-userto customize the software.

Soft Points — A type of ROC point with generic parameters that can be configured to hold data asdesired by the user.

SP — Setpoint, or Static Pressure.SPI — Slow Pulse Input.SPK — Speaker.SRAM — Static Random Access Memory. Stores data as long as power is applied; typically

backed up by a lithium battery or supercapacitor.SRBX – Spontaneous Report-By-Exception. Refer to RBX.SVA — Signal Value Analog.SVD — Signal Value Discrete.


G-6 Rev 5/02

T-ZTDI — Timed Discrete Input, or Time Duration Input.TDO — Timed Discrete Output, or Time Duration Output.Tf — Flowing temperature.TLP — Type (of point), Logical (or point) number, and Parameter number.TXD — Transmitted data communications signal.


Rev 5/02 I-1

TOPICAL INDEX

Numerics12-volt power ................................................................1-524-volt power ................................................................1-5

AA/D............................................................................... G-1Active Time...................................................................1-7AGA............................................................................. G-1AGA Point Displays................................................... B-17

Display 1 ............................................................... B-18Display 2 ............................................................... B-18Display 3 ..................................................... B-19, B-20

AI ................................................................................. G-1Analog.......................................................................... G-1Analog I/O Channel ......................................................1-7Analog Inputs................................................................2-3

Diagnostic ............................................................... 2-10Differential ...............................................................3-2Differential Wiring ...................................................3-8Loop .........................................................................3-2Loop Wiring .............................................................3-7Point Display......................................................... B-11Point Display Parameters ..................................... B-12Source.......................................................................3-2Source Wiring.........................................................3-10Troubleshooting......................................................3-25

Analog OutputsAnalog Outputs to Analog Inputs ............................ C-1AO Source to AI Differential as Current Loop........ C-2AO Source to AI Differential as Voltage Input........ C-2AO Source to AI Loop as Current Loop.................. C-1AO Source to Ammeter ........................................... C-2AO Source to Voltmeter .......................................... C-3Checking Voltage Source Installations ...................3-26Point Display......................................................... B-12Point Display Parameters ..................................... B-13Source.......................................................................3-2Source Wiring......................................................... 3-11Troubleshooting......................................................3-26

Antenna .........................................................................1-4AO................................................................................ G-1AP ................................................................................ G-1API ............................................................................... G-1Area .............................................................................. G-1ASCII ........................................................................... G-1AT Command ................................................................4-7Attenuation Levels

Communications Cards .......................................... 4-11Attribute........................................................................ G-1AUTO...........................................................................B-6AUX OUT 1................................................................2-19AUX OUT 2................................................................2-19AUX PWR .................................................................. 1-11

AUX PWR OUT 1 ...................................................... 2-16AUX PWR OUT 2 ...................................................... 2-16Auxiliary Outputs........................................................ 2-16Auxiliary Power Indicators ........................................... 2-3Auxiliary Power Outputs .............................................. 2-3Auxiliary Power Wiring .............................................. 2-16

BB1................................................................................ 2-20B2................................................................................ 2-20Backplate .............................................................1-3, 2-11

Dimensions............................................................. 2-11Installation.............................................................. 2-11Mounting the I/O Module Rack ............................. 2-13Mounting the MCU to a Backplate ........................ 2-12

Backup ProcedureRAM ...................................................................... 2-18

Base RAM Database Point Relationship....................... 2-9Battery......................................................................... 2-20Battery Backup............................................................ 1-10Bell and CCITT standards............................................. 4-6BTU ............................................................................. G-1Built-in I/O................................................................... G-1Bulletins ...................................................................... 1-12

CCalibrating the Diagnostic Inputs................................ 2-21Calibration

I/O Modules ............................................................. 3-6RTD Module .......................................................... 3-20

CCITT standards ........................................................... 4-6Circuit Board Temperature............................................ 2-3Class I ........................................................................... 1-4Clock........................................................................... 2-20Clock Batteries............................................................ 2-20Coil............................................................................... G-1Cold.............................................................................. B-1Cold Start ...................................................................... 2-2COM1 ..........................................................2-2, 2-17, G-1COM2 ..........................................................2-2, 2-17, G-1COMM................................................................4-17, G-1Communications Cards ..........................................2-2, 4-1

Attenuation Levels ................................................. 4-11Dial-up Modem........................................................ 4-6EIA-232.................................................................... 4-2EIA-422/485 ............................................................ 4-3Installation................................................................ 4-8Jumpers .................................................................. 4-10Leased-Line Modem ................................................ 4-6LED Indicators ......................................................... 4-3Product Descriptions ................................................ 4-1Radio Modem........................................................... 4-5Replacing ............................................................... 4-19Specifications ......................................................... 4-21


I-2 Rev 5/02

Troubleshooting......................................................4-19Wiring.....................................................................4-12

Communications Connectors ........................................2-2Communications Wiring .............................................2-16Computer.....................................................................2-17Computer, for operator interface ...................................2-2Configuration ......................................................1-11, G-1

I/O Point .................................................................3-31Connecting Auxiliary Power Wiring ...........................2-16Connecting Communications Wiring ..........................2-16Connecting Ground Wiring .........................................2-15Connecting Main Power Wiring..................................2-15Connecting the MCU to Wiring ..................................2-15Control Type............................................................... B-21Controller Components Mounted on the Backplate ......1-3Converter Card..............................................................2-2CPU.............................................................................. G-1CRC.............................................................................. G-1Creation...................................................................... B-15CSA.............................................................................. G-1CTS .......................................................................4-3, G-1Current Loop

AO Source Module to AI Differential Module........ C-2AO Source Module to AI Loop Module.................. C-1AO Source to Ammeter ........................................... C-2

Current ValueHistorical Database ............................................... B-17

DD/A............................................................................... G-1Database

DB Menu Display.................................................. B-16Memory Requirements .............................................2-8Point Relationship ....................................................2-9Points........................................................................2-8Storage......................................................................2-8

dB................................................................................. G-1DB................................................................................ G-1DC power ......................................................................1-7DC Power Source........................................................2-15DC PWR IN +/-...........................................................2-15DCD ......................................................................4-3, G-2Deadband ..................................................................... G-2Decade Box.................................................................3-21Determining FlashPAC Version ....................................2-5Determining I/O Channel Power Consumption ............1-7Determining Radio Power Consumption ......................1-9Determining ROCPAC Version.....................................2-6DI ................................................................................. G-2Diagnostic Analog Inputs ..............................................2-3Diagnostic Inputs ........................................................2-10

Calibrating..............................................................2-21Dial-up Modem Communications Cards ......................... 4-6

Wiring.....................................................................4-17Differential Pressure..................................................... G-4Discrete ........................................................................ G-2Discrete Inputs

Isolated..................................................................... 3-3Isolated Troubleshooting........................................ 3-27Isolated Wiring....................................................... 3-12Point Display........................................................... B-9Point Display Parameters ......................................B-10Source ...................................................................... 3-3Source Troubleshooting ......................................... 3-27Source Wiring......................................................... 3-11

Discrete OutputsDiscrete Outputs to Discrete Inputs......................... C-3Discrete Outputs to Pulse Inputs ............................. C-4DO Isolated to DI Source........................................ C-3DO Isolated to PI Source......................................... C-4DO Source to DI Isolated........................................ C-3DO Source to PI Isolated......................................... C-4Isolated..................................................................... 3-3Isolated Troubleshooting........................................ 3-28Isolated Wiring....................................................... 3-14Point Display......................................................... B-10Point Display Parameters ......................................B-11Relay ........................................................................ 3-3Relay Troubleshooting ........................................... 3-28Relay Wiring .......................................................... 3-15Source ...................................................................... 3-3Source Troubleshooting ......................................... 3-27Source Wiring......................................................... 3-13

Display Connector ........................................................ 2-2DISPLAY connector ................................................... 2-17Display Format............................................................. B-7Display Panel, Local ..................................................... 2-2Division 2...................................................................... 1-4DMM ........................................................................... G-2DO................................................................................ G-2DP ................................................................................ G-2Dry Relay Contacts ................................................3-3, 3-4DSR.......................................................................4-3, G-2DTR ......................................................................4-3, G-2Duty Cycle ............................................................1-7, G-2DVM ............................................................................ G-2DVS ............................................................................. G-2DWN............................................................................B-6

EE1 to E5 Points............................................................. 2-10E3 and E4 Aux. Points......................................... 2-10, 2-16EEPROM ..................................................................... G-2

Electrically Erasable Read Only Memory................ 2-2EIA-232 ....................................................................... G-2EIA-232 Communications Cards .................................. 4-2

Wiring .................................................................... 4-13EIA-232 Port............................................................... 2-17EIA-422 ....................................................................... G-2EIA-422/485 Communications Cards ........................... 4-3

Wiring .................................................................... 4-14EIA-485 ....................................................................... G-2Electrically Erasable Read Only Memory

EEPROM ................................................................. 2-2


Rev 5/02 I-3

EMF ............................................................................. G-2EMI .............................................................................. G-2Enclosure.......................................................................1-3ENTER.........................................................................B-6Environmental Requirements........................................1-3Environments ................................................................2-3ESD.............................................................................. G-2Estimating Database Memory Requirements ................2-8EU ................................................................................ G-2EUs..............................................................................3-25Exposure........................................................................1-3

FF1 Fuse ........................................................................ 2-20F2 Fuse ........................................................................ 2-20F3 Fuse ........................................................................ 2-20F4 Fuse ........................................................................ 2-20Figure 1-1......................................................................1-3Figure 2-1......................................................................2-2Figure 2-2......................................................................2-4Figure 2-5....................................................................2-10Figure 2-6.................................................................... 2-11Figure 2-7....................................................................2-16Figure 2-8....................................................................2-17Figure 2-9....................................................................2-19Figure 3-1. Typical I/O Module....................................3-2Figure 3-10. Analog Output Source Module Field Wiringfor Voltage Devices ................................................... 3-11

Figure 3-11. Discrete Input Source Module Field Wiring...................................................................................3-12

Figure 3-12. Discrete Input Isolated Module Field Wiring...................................................................................3-13

Figure 3-13. Discrete Output Source Module FieldWiring........................................................................3-14

Figure 3-14. Discrete Output Isolated Module FieldWiring........................................................................3-14

Figure 3-15. Discrete Output Relay Module Field Wiring...................................................................................3-15

Figure 3-16. Pulse Input Source Module Field Wiring3-16

Figure 3-17. Pulse Input Isolated Module Field Wiring3-17

Figure 3-18. Slow Pulse Input Source Module FieldWiring........................................................................3-18

Figure 3-19. Slow Pulse Input Isolated Module FieldWiring........................................................................3-19

Figure 3-2. AI Loop Module Field Wiring for CurrentLoop Devices...............................................................3-7

Figure 3-20. Low-Level Pulse Input Module Field WiringSchematic ..................................................................3-19

Figure 3-21. Calibration Setup ....................................3-20Figure 3-22. RTD Input Module Field Wiring for Two-Wire RTDs.................................................................3-21

Figure 3-23. RTD Input Module Field Wiring for Three-Wire RTDs.................................................................3-22

Figure 3-24. RTD Input Module Field Wiring for 4-WireRTD With Compensation Loop .................................3-22

Figure 3-25. Field Wiring for 4-Wire, Single ElementRTD........................................................................... 3-23

Figure 3-26. Field Wiring for a HART Interface Module................................................................................... 3-24

Figure 3-3. AI Loop Module Field Wiring for VoltageDevices........................................................................ 3-7

Figure 3-4. AI Differential Module Field Wiring for LowVoltage Devices........................................................... 3-8

Figure 3-5. AI Differential Module Field Wiring forHigher Voltage Devices............................................... 3-8

Figure 3-6. AI Differential Module Field Wiring forCurrent Loop Devices ................................................. 3-9

Figure 3-7. AI Source Module Field Wiring for VoltageDevices...................................................................... 3-10

Figure 3-8. AI Source Module Field Wiring for CurrentLoop Devices............................................................. 3-10

Figure 3-9. Analog Output Source Module Field Wiringfor Current Loop Devices.......................................... 3-11

Figure 4-1...................................................................... 4-2Figure 4-10.................................................................. 4-14Figure 4-11.................................................................. 4-14Figure 4-12.................................................................. 4-15Figure 4-13.................................................................. 4-16Figure 4-14.................................................................. 4-18Figure 4-2...................................................................... 4-4Figure 4-3...................................................................... 4-5Figure 4-4...................................................................... 4-6Figure 4-5...................................................................... 4-7Figure 4-6...................................................................... 4-9Figure 4-7.................................................................... 4-10Figure 4-8.................................................................... 4-11Figure 4-9.................................................................... 4-13Figure 5-1...................................................................... 5-1Figure A-1 .................................................................... A-1Figure A-2 .................................................................... A-2Figure B-1 .................................................................... B-2Figure B-10 .................................................................B-11Figure B-12 ................................................................ B-12Figure B-14 ................................................................ B-13Figure B-16 ................................................................ B-14Figure B-17 ................................................................ B-14Figure B-18 ................................................................ B-15Figure B-19 ................................................................ B-16Figure B-2 .................................................................... B-3Figure B-20 ................................................................ B-16Figure B-21 ................................................................ B-17Figure B-22 ................................................................ B-17Figure B-23 ................................................................ B-18Figure B-25 ................................................................ B-18Figure B-26 ................................................................ B-19Figure B-27 ................................................................ B-19Figure B-28 ................................................................ B-20Figure B-29 ................................................................ B-20Figure B-3 .................................................................... B-4Figure B-30 ................................................................ B-21Figure B-31 ................................................................ B-22Figure B-32 ................................................................ B-22Figure B-33 ................................................................ B-23


I-4 Rev 5/02

Figure B-34 ................................................................ B-24Figure B-35 ................................................................ B-24Figure B-36 ................................................................ B-25Figure B-37 ................................................................ B-25Figure B-38 ................................................................ B-25Figure B-4 .................................................................... B-4Figure B-5 .................................................................... B-5Figure B-6 .................................................................... B-7Figure B-7 .................................................................... B-8Figure B-8 .................................................................... B-9Figure B-9 .................................................................. B-10Figure C-1 .................................................................... C-1Figure C-10 .................................................................. C-5Figure C-11 .................................................................. C-5Figure C-12 .................................................................. C-6Figure C-13 .................................................................. C-6Figure C-14 .................................................................. C-7Figure C-15 .................................................................. C-7Figure C-2 .................................................................... C-2Figure C-3 .................................................................... C-2Figure C-4 .................................................................... C-2Figure C-5 .................................................................... C-3Figure C-6 .................................................................... C-3Figure C-7 .................................................................... C-3Figure C-8 .................................................................... C-4Figure C-9 .................................................................... C-4Firmware ..............................................2-3, 2-5, B-15, G-2Flash ROM................................................................... G-2FlashPAC........................................................4-5, 4-7, G-2FlashPAC Module .........................................................2-3

Determining Version.................................................2-5Replacing................................................................2-21Selection Codes ........................................................2-6

FloBoss ........................................................................ G-2Flow Accumulation .................................................... B-18

Yesterday............................................................... B-18Flow BTU Accumulation ........................................... B-19

Yesterday............................................................... B-19Flow Rate ................................................................... B-18Fluid Level ................................................................. B-22FM................................................................................ G-2Force ............................................................................ G-2Frequency Shift Keyed

FSK ..........................................................................4-5FSK .............................................................................. G-3FST............................................................................... G-3FST Point Display ...................................................... B-22Function Keys .............................................................. B-5Function Sequence Table ........................................... B-22Fuse .............................................................................2-15Fuses ....................................................................2-3, 2-20

GGauges of wire ............................................................2-15GFA.............................................................................. G-3GND....................................................................2-15, G-3GP ................................................................................ G-3

Ground Wiring ............................................................ 2-15Grounding

Requirements ........................................................... 1-6Group A......................................................................... 1-5Group B......................................................................... 1-5Group C......................................................................... 1-5Group D ........................................................................ 1-5

HHART........................................................................... G-3HART Interface Module ............................................... 3-5

Troubleshooting ..................................................... 3-30Wiring .................................................................... 3-23

Hazardous Location Approval....................................... 1-4Highway Addressable Remote Transducer - HART...... 3-5Historical Database

Current Value ........................................................ B-17Holding Register .......................................................... G-3hw................................................................................. G-3

II/O ................................................................................ G-3

Input/Output ............................................................. 1-2I/O Channel

Power Consumed ..................................................... 1-7I/O Channel Power Consumption ................................. 1-7I/O Converter Card .........................................1-5, 2-2, 5-1

Installation and Setup............................................... 5-2Product Description.................................................. 5-1Replacing an I/O Converter Card............................. 5-3Requirements ........................................................... 5-1Specifications ........................................................... 5-4Troubleshooting and Repair ..................................... 5-2

I/O MenuDisplay .................................................................... B-8Point Types ...............................................................B-9

I/O Module Rack..................................................2-3, 2-10Mounting................................................................ 2-13

I/O Modules................................................................... 3-1Calibration................................................................ 3-6Common Specifications ......................................... 3-33Illustration ................................................................ 3-2Installation................................................................ 3-6Point Configuration................................................ 3-31Removing and Installing ........................................ 3-32Replacing ............................................................... 3-31Troubleshooting ..................................................... 3-24Wiring ...................................................................... 3-6

I/O Simulation.............................................................. C-1I/O Wiring Requirements .............................................. 1-6ID ................................................................................. G-3IEC............................................................................... G-3IEEE............................................................................. G-3IMV.............................................................................. G-3Inactive Time ................................................................ 1-7Indicators .............................................................2-3, 2-19Input ............................................................................. G-3


Rev 5/02 I-5

Input Power ...................................................................2-3Input Register ............................................................... G-3Input Voltages............................................................... 2-10Inputs

Calibrating- Diagnostic ..........................................2-21Diagnostic ..............................................................2-10

Installation...................................................................2-12Installation

Communications Cards ............................................4-8Ground Wiring..........................................................1-6I/O Module-Power Off ...........................................3-32I/O Modules .............................................................3-6Local Display Panel ................................................ B-2LPM ........................................................................ A-2Power Requirements ................................................1-5RAM Modules........................................................2-13

Installation Guidelines ..................................................1-2IRQ............................................................................... G-3ISO ............................................................................... G-3IV ................................................................................. G-3

JJumpers

Communications Cards ..........................................4-10P3 4-10P4 4-10P5 4-10P6 4-10P7 4-15, 4-17

Jumpers in the MCU ...................................................2-13

KKbytes .......................................................................... G-3Kbytes of On-Board Memory .......................................2-2kHz............................................................................... G-3

LLAN ............................................................................. G-3LCD.............................................................................. G-3LCD Panel.....................................................................2-2LCD Point Displays ................................................... B-23LDP .......................................................................2-2, G-3Leased Line Modem......................................................2-2Leased-Line Modem Communications Card

Attenuation Levels ................................................. 4-11Jumpers ..................................................................4-10

Leased-Line Modem Communications Cards ...............4-6Wiring.....................................................................4-16

LED.............................................................................. G-3LED Indicators

Communications Cards ............................................4-3LEDs ...........................................................................2-19Lightning Protection Module

Installation............................................................... A-2LPM ........................................................................ A-1Specifications .......................................................... A-4

Troubleshooting ...................................................... A-3Wiring ..................................................................... A-3

Local Display Panel .............................................2-2, 2-17Display Format........................................................ B-7DM Menu Display................................................. B-16Installation............................................................... B-2LDP ......................................................................... B-1Main Menu Items .....................................................B-8

Location Requirements ................................................. 1-4LOI............................................................................... G-3Loop Status ................................................................ B-21Low-Level Pulse Input.......................................3-19, 3-29

Troublshooting ....................................................... 3-29Low-Voltage Cut-off ............................................1-5, 2-13LPM ............................................................................. G-3

Lightning Protection Module .................................. A-1LRC.............................................................................. G-3

MmA ............................................................................... G-4Main Controller Unit

MCU ........................................................................ 1-2Main Menu Display ..................................................... B-7Main Power Wiring..................................................... 2-15Master Controller Unit .................................................. 2-1MCU .....................................................................2-1, G-4

Connecting the MCU to Wiring ............................. 2-15Main Controller Unit................................................ 1-2Product Description.................................................. 2-1Replacing/Removing.............................................. 2-23

MCU Status Indicators................................................ 2-19Memory......................................................................... 2-2

Estimating Requirements ......................................... 2-8RAM Requirements ................................................. 2-8

Memory ModuleReplacing ............................................................... 2-21

MENU..........................................................................B-6Message ..................................................................... B-23Microprocessor ............................................................. 2-2Modbus ........................................................................ 2-4Modem.......................................................................... 2-2

Dial-up Communications Cards ............................... 4-6Leased-Line Communications Cards ....................... 4-6Radio Communications Cards.................................. 4-5Surge Protection ....................................................... 1-6

Modem CardsAttenuation Levels ................................................. 4-11Jumpers .................................................................. 4-10

Modular I/O ................................................................. G-4Module Rack............................................................... 2-10Monitoring .............................................................2-2, 2-3Mounting an I/O Module Rack to a Backplate............ 2-13Mounting the MCU to a Backplate ............................. 2-12MPU............................................................................. G-4MSG Point Displays................................................... B-23mV ............................................................................... G-4MVS............................................................................. G-4


I-6 Rev 5/02

mW............................................................................... G-4

NNational Electrical Code

NEC..........................................................................1-5NEC.............................................................................. G-4NEMA.......................................................................... G-4NEMA 3 ........................................................................1-3NEXT...........................................................................B-6Nominal Power Source .................................................1-5Non-analog I/O..............................................................1-7Notebook Computer .............................................2-2, 2-17

OOff-line......................................................................... G-4OH.........................................................................4-3, G-4Ohms ............................................................................ G-4On-line ......................................................................... G-4Opcode ......................................................................... G-4Operation............................................................1-10, 1-11Operator Interface .........................................................2-2OPERATOR INTERFACE..........................................2-17Operator Interface Connector Wiring Schematic ........2-17OSI ............................................................................... G-3Outdoor Environments ..................................................2-3Output

PID Loop............................................................... B-21Outputs ..........................................................................2-3

PP/DP ............................................................................. G-4P1, P2, & P3 Voltage Jumpers.....................................2-13P3 .........................................................................4-4, 4-14P3 Jumper....................................................................4-10P4 ................................................................................4-14P4 Jumper....................................................................4-10P5 Jumper....................................................................4-10P6 Jumper....................................................................4-10P7 Jumper...........................................................4-15, 4-17Parallel Port.................................................................2-17Parameter ..................................................................... G-4PC................................................................................. G-4Periodic Timer Interrupt ............................................... G-4Personal Computer ......................................................2-17Pf.................................................................................. G-4PI .................................................................................. G-4PID ............................................................................... G-4PID Loop

Output.................................................................... B-21PID Point Displays..................................................... B-21

Parameters ............................................................ B-21Pin 2 ...................................................................4-16, 4-17Pin 8 ...................................................................4-16, 4-17PIT ............................................................................... G-4Plate Change .............................................................. B-19Pmax .............................................................................1-7

Pmin .............................................................................. 1-7Point ............................................................................. G-4Point Number ............................................................... G-4Point Type .................................................................... G-4Points .................................................................. 2-8, B-17

Configuration ......................................................... 3-31Relationship Database.............................................. 2-9Tag ID ..........................................................B-17, B-18

Polarity........................................................................ 1-11Port Connectors........................................................... 2-17Potentiometer Input to AI Differential Module ............ C-5Potentiometer Input to AI Loop Module ...................... C-5Potentiometer to Analog Inputs.................................... C-5Power

Installation Requirements......................................... 1-5Radio Consumption.................................................. 1-9Requirements ........................................................... 1-5Surge Protection Device........................................... 1-6Voltage Requirements ............................................ 2-13

Power Connections ..................................................... 2-15Power Consumption of the I/O Modules....................... 1-9Power Consumption of the ROC364 and PoweredDevices........................................................................ 1-8

Power Consumption, Total............................................ 1-7Power Fusing ................................................................ 2-3Power Indicators ........................................................... 2-3Power LED.................................................................. 2-19Power Outputs............................................................... 2-3Power Outputs, Auxiliary.............................................. 2-3Power Requirements ................................................... 1-10Power Source ................................................................ 1-5Power Supply Requirements ......................................... 1-6Power Wiring .............................................................. 2-15

Auxiliary ................................................................ 2-16Power Wiring Connections ......................................... 2-16Preset............................................................................ G-4Pressure........................................................................ G-4PREV ...........................................................................B-6PRI ............................................................................... G-5Process Variable ......................................................... B-21Processor....................................................................... 2-2Product Overview ......................................................... 1-2Psf ............................................................................... 1-10PSTN............................................................................ G-5PT................................................................................. G-5PTT .............................................................................. G-5Public Switched Telephone Networks

PSTNs ...................................................................... 4-6Pulse............................................................................. G-5Pulse Inputs

Isolated..................................................................... 3-4Isolated Troubleshooting........................................ 3-28Isolated Wiring....................................................... 3-16Low-Level .....................................................3-19, 3-29Point Display......................................................... B-13Point Display Parameters ......................................B-13Source ...................................................................... 3-4Source Troubleshooting ......................................... 3-28


Rev 5/02 I-7

Source Wiring.........................................................3-15Push-to-Talk

PTT.........................................................................4-10PV ................................................................................ G-5

RRack ............................................................................. G-5Radio ...........................................................................1-10

Power Consumption .................................................1-9Radio Modem................................................................2-2Radio Modem Communications Card

Attenuation Levels ................................................. 4-11Jumpers ..................................................................4-10

Radio Modem Communications Cards .........................4-5Wiring.....................................................................4-15

Radio Power Control....................................................2-3RAM ............................................................................ G-5

Backup Procedure ..................................................2-18Database Point Relationship.....................................2-9Random Access Memory..........................................2-2

RAM and Real-Time Clock Batteries .........................2-20RAM Module

Determining RAM Requirements.............................2-8Installation..............................................................2-13Replacing................................................................2-21Switch Settings.........................................................2-7

RAM Modules........................................................2-2, 2-6RAM Modules and Their Use .......................................2-6RAM4 ...........................................................................2-6Random Access Memory

RAM.........................................................................2-2RBX ............................................................................. G-5Real-Time Clock Batteries ..........................................2-20Remote Operations Controllers - ROC .........................1-1Repair .................................................................2-18, 3-24Replacing

I/O Modules ...........................................................3-31Replacing a FlashPAC Module ...................................2-21Replacing a RAM Module ..........................................2-21Replacing a ROCPAC Module....................................2-21Replacing an I/O Converter Card..................................5-3Replacing/Removing the MCU Assembly ..................2-23Resistance Temperature Detector - RTD Input..............3-4Resistor .........................................................................3-3Resistors ........................................................................1-7Restart

Cold Start..................................................................2-2RFI ............................................................................... G-5RI...........................................................................4-3, G-5ROC ............................................................................. G-5ROC Accessories Instruction Manual

Form A4637 .............................................................1-5ROC and Auxiliary Power Indicators............................2-3ROC Fuses ..................................................................2-20ROC Memory Map .......................................................2-7ROC364

Product Overview.....................................................1-2

Specifications ......................................................... 2-25ROCLINK.................................................................... G-5ROCPAC Module...........................................2-2, 2-5, G-5

Determining Version ................................................ 2-6RAM Backup Procedure ........................................ 2-18Replacing ............................................................... 2-21Selection Codes........................................................ 2-6

ROM ............................................................................ G-5RP1H Module ............................................................... 2-5RPL ............................................................................... 2-5RTC.............................................................................. G-5RTD.............................................................................. G-5RTD Inputs.................................................................... 3-4

Calibration.............................................................. 3-20Field Wiring ........................................................... 3-21Troubleshooting ..................................................... 3-30Wiring .................................................................... 3-21Wiring ...........................................................3-20, 3-21

RTS .......................................................................4-3, G-5RTU.............................................................................. G-5RX

Receive..................................................................... 1-9RXD......................................................................4-3, G-5

SSAMA.......................................................................... G-5Scaling Resistor ............................................................ 3-3Scaling Resistors........................................................... 1-7SCAN...........................................................................B-6Serial Data Communications......................................... 2-2Serial Port ..................................................................... 2-2Service Bulletins ......................................................... 1-12Setpoint ...................................................................... B-21Setting Voltage Jumpers in the MCU.......................... 2-13SHUTDOWN.....................................................4-16, 4-17Site Requirements ......................................................... 1-4Slow Pulse Inputs

Isolated..................................................................... 3-4Isolated Troubleshooting........................................ 3-29Isolated Wiring....................................................... 3-18Source Troubleshooting ......................................... 3-29Source Wiring......................................................... 3-17

Slow-blow Fuse .......................................................... 2-15Soft Points.................................................................... G-5Solar

Panels ....................................................................... 1-4Solar Panel Sizing ....................................................... 1-10SP................................................................................. G-5Specifications

I/O Modules ........................................................... 3-33Lightning Protection Module .................................. A-4ROC364 ................................................................. 2-25

SPI................................................................................ G-5SPK .............................................................................. G-5SRAM .......................................................................... G-5SRBX........................................................................... G-5Startup ......................................................................... 1-11


I-8 Rev 5/02

Voltage Requirements.............................................2-13Startup And Operation.................................................1-10Station Address........................................................... B-14Station Group ............................................................. B-14Station Name.............................................................. B-14Surge Protection Device................................................1-6SVA .............................................................................. G-5SVD.............................................................................. G-5Switch

Switch Input to DI Isolated Module ........................ C-6Switch Input to DI Source Module.......................... C-6Switch to Discrete Inputs ........................................ C-6Switch to PI Isolated Module .................................. C-7Switch to PI Source Module.................................... C-7Switch to Pulse Inputs ............................................. C-7

Switch Settings for 256 Kbyte RAM Module ...............2-7SYS Parameter Displays ............................................ B-14

Display 1 ............................................................... B-14Display 2 ............................................................... B-14Display 3 ............................................................... B-15Display 4 ............................................................... B-15

System Status .............................................................. 1-11SYSTEM STATUS......................................................2-19System Status Indicator.................................................2-3

TTable 1-1 .......................................................................1-8Table 1-2 .......................................................................1-9Table 2-1 .......................................................................2-6Table 2-2 .......................................................................2-6Table 2-3 .......................................................................2-7Table 2-4 .......................................................................2-7Table 2-5 .......................................................................2-8Table 2-6 .......................................................................2-9Table 2-7 .....................................................................2-19Table 2-8 .....................................................................2-20Table 3-1. Calibration Resistance Values ...................3-20Table 3-2. Analog Input Module Typical ConfigurationValues ........................................................................3-25

Table 4-1 .......................................................................4-3Table 4-2 .....................................................................4-10Table 4-3 ..................................................................... 4-11Table 4-4 .....................................................................4-12Table 5-1 .......................................................................5-1Table B-1...................................................................... B-6Table B-10 .................................................................. B-15Table B-11 .................................................................. B-17Table B-12 .................................................................. B-18Table B-13 .................................................................. B-18Table B-14 .................................................................. B-19Table B-15 .................................................................. B-21Table B-16.................................................................. B-22Table B-17 .................................................................. B-23Table B-18 .................................................................. B-23Table B-2 ...................................................................... B-8Table B-3 ...................................................................... B-9Table B-4 .................................................................... B-10

Table B-5 .....................................................................B-11Table B-6 .....................................................................B-12Table B-7 .....................................................................B-13Table B-8 .....................................................................B-13Table B-9 .....................................................................B-14Tank ........................................................................... B-22TDI............................................................................... G-6TDO ............................................................................. G-6Temperature .................................................................. 2-3Temperature of ROC .................................................... 2-10Terminal Blocks ............................................................ 2-3Terminations

Power ....................................................................... 2-3Tf.................................................................................. G-6Time and Date ............................................................ B-14Timer Interrupt ............................................................. G-4TLP .............................................................................. G-6TNK Point Display..................................................... B-22Totaling Power Requirements ..................................... 1-10Troubleshooting .......................................................... 2-18

Analog Inputs......................................................... 3-25Analog Outputs ...................................................... 3-26Communications Cards .......................................... 4-19Discrete Input Isolated ........................................... 3-27Discrete Input Source............................................. 3-27Discrete Output Isolated......................................... 3-28Discrete Output Relay ............................................ 3-28Discrete Output Source .......................................... 3-27HART Interface Module......................................... 3-30I/O Modules ........................................................... 3-24I/O Simulation......................................................... C-1Lightning Protection Module .................................. A-3Low-Level Pulse Input Isolated ............................. 3-29Pulse Inputs ............................................................ 3-28RTD Input .............................................................. 3-30Slow Pulse Input Isolated....................................... 3-29

Turbine Meter .............................................................. C-7TX

Transmitting ............................................................. 1-9TXD ......................................................................4-3, G-6

U

UP ................................................................................B-6

VVersion ....................................................................... B-15Version Name Parameter........................................2-5, 2-6Voltage .................................................................1-11, 2-3Voltage Input

AO Source Module to AI Differential Module........ C-2Voltage Jumpers in the MCU ...................................... 2-13Voltage Output

AO Source Module to Voltmeter............................. C-3Volume ....................................................................... B-22


Rev 5/02 I-9

WWatchdog Timer ..........................................................2-16Wire Gauges................................................................2-15Wiring ................................................................2-15, 2-16

Analog Input Differential Module............................3-8Analog Input Loop ...................................................3-7Analog Input Source...............................................3-10Analog Output Source ............................................ 3-11Auxiliary Power .....................................................2-16Communications Cards ..........................................4-12Dial-up Modem Communications Cards................4-17Discrete Input Isolated............................................3-12Discrete Input Source ............................................. 3-11Discrete Output Isolated.........................................3-14Discrete Output Relay ............................................3-15

Discrete Output Source .......................................... 3-13EIA-232 Communications Cards ........................... 4-13EIA-422/485 Communications Cards .................... 4-14Ground ................................................................... 2-15Ground Wiring Installation....................................... 1-6HART Interface Module......................................... 3-23I/O Modules ............................................................. 3-6Leased-Line Modem Communications Cards ........ 4-16Lightning Protection Module .................................. A-3Pulse Input Isolated ................................................ 3-16Pulse Input Source.................................................. 3-15Radio Modem Communications Cards .................. 4-15RTD Input .....................................................3-20, 3-21Slow Pulse Input Isolated....................................... 3-18Slow Pulse Input Source ........................................ 3-17

Wiring Requirements .................................................... 1-6


I-10 Rev 5/02

If you have comments or questions regarding this manual, please direct them to your local sales representative orcontact:

Emerson Process ManagementFlow Computer DivisionMarshalltown, IA 50158 U.S.A.Houston, TX 77065 U.S.A.Pickering, North Yorkshire UK Y018 7JAWebsite: www.EmersonProcess.com/flow

Date post:	11-May-2017
Category:	Documents
Upload:	docrafi
View:	246 times
Download:	0 times

A4193_ROC364

Documents