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PlX'l'URiNG APPARATUS U.S. Patent 5,871,629. Feb. 16, 1999 K. W. Watts, assignor to IBM Corp., Armonk, N. Y. A method of releasably securing and electrically grounding a pin grid array during electrolytic plating, the pin grid aray having adjacent rows of pins each sepa- rated by a gap. .UCIIIODlPOsmoN PIIOCUS U.S. Patent 5,871,630. Feb. 16, 1999 R.N. Bhattacharya et aI., assignors to Davis, Joseph & Negley, Austin, Texas A method for preparation of cop- per-indi um-galli urn -diselenide precursor films by electrodeposi- tion for fabricating high efficiency solar cells. ACIDIC 'liN PLA'II_ BA'IM U.S. Patent 5,871,631. Feb. 16, 1999 M. Ichiba et al., assignors to NKK Corp. and LeaRonal Japan Inc., Tokyo An acidic bath for electroplating tin to a continuously moving steel sheet, the bath comprising a diva- lent tin salt of an organic sulfonic acid using at least one organic sulfonic acid selected from the group consisting of alkanesulfonic acid and alkanolsulfonic acid; an antioxidant; and a brightening agent comprising additive ingre- dients prepared by adding oxypro- pylene to polyoxyethylene glycol. WAS'nWAnil TllUTMIINT PROCESS U.S. Patent 5,871,648. Feb. 16, 1999 S.D. Allen and L.R. Lyman, assignors to Environmental Chemistries Inc., Salt Lake City A process for removing metal con- taminants from large volumes of wastewater comprising treating a wastewater stream containing a metal contaminant with an or- ganic or inorganic coagulant, wherein the coagulant reacts with the metal contaminant to form a particulate having a size greater than 5 microns; passing the treated wastewater through a mi- crofiltration membrane having a pore size in the range from 0.5 to 5 microns, wherein the treated wastewater flow rate is in the range from 700 to 1,500 gallons per square foot of membrane per day such that the metal contami- nant is removed from water pass- ow you can Eliminate Racking of Semi-Conductors, Electronic Parts etc. by Barrel Plating with C ·\ttc Copper Plated Plastic Balls. Ball are reu able - de igned for all type of metal. • Campi tely Copper Plated • Contains 0 Lacquer • Every Ball is Perfectly Round - Has 0 Hole • Ball are Lightweight Ea ily Sifted Out MC opper-Plated Plastic Ball replace heavy plating or bur- nishing media and mak barrel plating of small or d licate part po ible. Highly condudive and light in weight, CMC balls rush. ion the produd to prevent damag , re triO interlocking, and help to keep flat parts from sticking together. Features include precision round, sizes from 1.1 to 18 mm diameters, and easy sifting. The balls are ideal for barrel plating, semiconductor and precision eleorical contad to fine articles for ('ven metal distribution, are reusable and can be refined for pre- CiOUS metal. Sample on reuqest. PLASTIC METHODS CO. 20 West 37th St., 7th Fir.' ew York, Y 10018 Phone: 212-695-0070 • Fax: 212-967-5015 Circle 017 on reader information card November 1999 CUSTOMIZED FORMULATIONS AND SERVICE FOR ... • Metalworking Fluids • Metal Finishing • Anodizing • Process VWater Treatments ... TO REDUCE YOUR OPERATING COSTS! u.s, OWNED AND OPERATED FOR OVER 45 YEARS WAUKEGAN. ILLINOIS (847) 336-8100 (800) 228-4646 FAX: (847) 336-8518 VISIT OUR WEB SITE AT www.coral.com Circle 021 on reader information card 101
