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29 Years of Quality Reputation29 Years of Quality Reputation
Additive Circuits (S) Pte LtdAdditive Circuits (S) Pte Ltd
70 Different Board Type per Week!
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A Technology Company A Technology Company
Your Reliable Partner in Accelerating DesignYour Reliable Partner in Accelerating Design
Leading Supplier of PCBLeading Supplier of PCB
ACS Capabilities : up to 32 Layers
: 200mils thick board
: High Aspect Ratio 25:1
: 3.5mils/3.0mils trace/spacing
: fine pitch: 0.4mm
: 5% Tolerance Impedance Control
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CertificationsCertifications
ISO 14001:2004Environmental Management System
Certificate No. CI/11720IE
OHSAS 18001:2007Occupational Health & Safety Management System
Certificate No. CI/11720IO
Underwriters Laboratories IncApproval File No. E87228
ISO 9001:2008Quality Management SystemCertificate No. CI/11720IQ
A Technology Company A Technology Company
Your Reliable Partner in Accelerating DesignYour Reliable Partner in Accelerating Design
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SafetySafety ComplianceCompliance
IECQ - Hazardous Substance Process Management System
EICC – Electronic Industry Code Standard
A Technology Company A Technology Company
Your Reliable Partner in Accelerating DesignYour Reliable Partner in Accelerating Design
www.ewww.e--additiveadditive--circuits.comcircuits.com
A Technology Company A Technology Company
Your Reliable Partner in Accelerating DesignYour Reliable Partner in Accelerating Design
Artwork Receiving Material Preparation
Pre Production
PTH Outer layer Imaging
Plating, Strip & Etch
CNC Drilling
Multi-layers?
Middle Inspection (Outer layer)
Solder Mask & Silkscreen
QC Inspection
Electrical test
(based on customer
request)
CNC RoutingQA Inspection
Gold Finger Plating
Store/ Delivery
NoYes
Inner layer Etching
Middle Inspection (Inner layer)
Multi-bondInner Layer Imaging
Mass Lamination
Multi-Layers
Bevelling
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MLB (Multi-Layer Board)
– Automatic alignment target drill for inner layer
– Automatic alignment target drill with X-Ray
– Mass press (innerlayerthin cores pressed together with prepreg) Press M/CPress M/C
Before pressBefore press After pressAfter press
A Technology Company A Technology Company
Your Reliable Partner in Accelerating DesignYour Reliable Partner in Accelerating Design
Capability:
Thick board: 200milsThick board: 200mils
High layer count: 32 layers High layer count: 32 layers
WarpageWarpage : 1.0%: 1.0%
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DrillingDrilling
RoutingRouting
DrillDrill
RoutRout
A Technology Company A Technology Company
Your Reliable Partner in Accelerating DesignYour Reliable Partner in Accelerating Design
CNC Department
Capability:
Min Drill size: 0.15mm +/Min Drill size: 0.15mm +/--3mils3mils
Max drill size: 6.50mm+/Max drill size: 6.50mm+/--3mils3mils
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A Technology Company A Technology Company
Your Reliable Partner in Accelerating DesignYour Reliable Partner in Accelerating Design
Before PTHBefore PTH After PTHAfter PTH
DMSE LineDMSE Line
PTH LinePTH Line
PTH (Plated Thru Hole)
– Electroless copper plating
– DMSE
• Direct Metallization
Ethylenedioxythiophene
• For High Aspect Ratio
Capability:
High aspect ratio: 25:1High aspect ratio: 25:1
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Dryfilm (Image Transfer)
– CCD auto registration for inner layer Artwork
– Collimated/High resolution exposure
– Fine line width
ExposureExposure
LaminationLamination
After ExposureAfter Exposure
After DevelopingAfter Developing
After LaminationAfter Lamination
A Technology Company A Technology Company
Your Reliable Partner in Accelerating DesignYour Reliable Partner in Accelerating Design
Capability:
Min trace width / spacing: 3.5 / 3.0milsMin trace width / spacing: 3.5 / 3.0mils
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Plating
– Cu plating
– Ni plating
– Au plating line
– ENIG line
– OSP line
ENIG lineENIG line
Cu / Ni platingCu / Ni plating Gold plating lineGold plating line
OSP lineOSP line
A Technology Company A Technology Company
Your Reliable Partner in Accelerating DesignYour Reliable Partner in Accelerating Design
Finishing Capability:Ni Ni EE’’lyticlytic Plating: 350uPlating: 350u”” max max
Au Au EE’’lyticlytic Plating : 5~50uPlating : 5~50u””
Selective Au Selective Au EE’’lyticlytic Plating: 80Plating: 80uu”” max max
ENIG:ENIG: 120u120u””<Ni>200u<Ni>200u”” , 2u2u””<Au>5u<Au>5u””
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Etching
– Alkaline etching
– Acid etching
Alkaline EtchingAlkaline Etching
Acid EtchingAcid Etching
After EtchAfter EtchBefore EtchBefore Etch
A Technology Company A Technology Company
Your Reliable Partner in Accelerating DesignYour Reliable Partner in Accelerating Design
Capability:Max copper thickness: 4ozMax copper thickness: 4oz
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Plug hole process
– Nonconductive paste
A Technology Company A Technology Company
Your Reliable Partner in Accelerating DesignYour Reliable Partner in Accelerating Design
Plugging M/CPlugging M/C Sanding M/CSanding M/C After plugAfter plug After sandingAfter sanding
Capability:
One side flatnessOne side flatness
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Coating Measurement
Instrument CMI XRX 950
Fischerscope MMS PC
Copper Measuring System
Automatic Optical Inspection
& Verification System
A Technology Company A Technology Company
Your Reliable Partner in Accelerating DesignYour Reliable Partner in Accelerating Design
Inspection & VerificationInspection & Verification
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Electrical Testing Machine
(Flying Probe)
A Technology Company A Technology Company
Your Reliable Partner in Accelerating DesignYour Reliable Partner in Accelerating Design
Inspection & VerificationInspection & Verification
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Additive Circuits (S) Pte LtdAdditive Circuits (S) Pte Ltd
Questions
