© MASSTART
MASSTART Consortium
Data Center Interconnects - Towards Mass Manufacturing, 6th October 2020
ioNext, a glass-based platform complementing Silicon Photonics
Adrien BILLATSales and Application Manager, Teem Photonics SA, France
www.masstart.eu
virtual conference session:Data Center Interconnects – Towards Mass Manufacturing
online / October 6th 2020 / 4 – 7pm
http://www.masstart.eu/
ioNext, a glass-based platform complementing Silicon Photonics
Adrien BILLAT – Sales and Application ManagerOctober 5th, 2020
CONFIDENTIELConfidential2
Teem Photonics – Corporate background
1998
Pioneer in erbium-dopedwaveguide amplifiers
2005
2000 2012
Introduction of glass-based components and sub-systems for
telrcommunications
Acquisition of the Q–switch microchip laser portfolio
from Lumentum
10,000 lasers shipped worldwide
2016
Introduction of WAFT –interposers for SiPh
coupling
Established in 1998Spin-off from Schneider ElectricEnters the telecommunication
market for FTTH applicationsStrong R&D team, several patents
2020
First PDK release
2018
ioNext product line
CONFIDENTIELConfidential3
ioNext, a unique photonics process on glass
Value proposal
Glass technology• Large optical bandwidth: 400 – 2000 nm• Ultra-low propagation loss: 0.05 – 0.12 dB/cm• Low PDL: < 0.1dB• Low temperature dependence: 0.01 nm/K
ioNext specific• Low fiber coupling loss : < 0.2dB• Compactness : radius of curvature 800µm• 2.5D waveguide engineering
ioNext Process flow dB
CONFIDENTIELConfidential4
ioNext, a complete photonics platform
Splitters 1xN (up to 512)
Taps
Couplers
Taper/Mode converters
MUX/DEMUX
Interferometers (MZ, MMI, Michelson)
Waveguide crossing
Design
Manufacturing
CONFIDENTIELConfidential5
2.5D building blocks
Spot size converter Extended optical library
Spot size converter
Surface interactionDepth modulation
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WAFT: three coupling solutions
Edge coupling Top coupling Evanescent coupling
Low loss solutionCompatible with WDM
Wafer level incompatibleAlignment accuracy
Compatible with grating couplersWafer level compatibility
Grating coupler lossWDM-limited
Low loss solutionCompatible with WDMAlignment tolerantWafer level compatibility
BEOL constraint
CONFIDENTIELConfidential7
Large pitch adaptation
High channel count uniformityMFD matching to PIC edge couplers
EC-WAFT series for facet coupling
FAU
EC-WAFTPIC
Insertion loss (incl. fiber-array) < 0.7 dBPIC side MFD 4x3 μm (1/e²)PIC-side pitch >25 μmSM and PM fiber-compatible
127
µm
25 µ
m
64 channels
CONFIDENTIELConfidential8
Low profile solution for grating couplers
TC-WAFT series for top coupling
• Packaging
• Wafer-level PIC testing(edge-coupling)
FAU
TC-WAFT
PIC
CONFIDENTIELConfidential9
EV-WAFT series for evanescent coupling
Evanescent coupling to SiN-on-Si waveguide layer:• Broadband and single-mode in O-band and C-band• Low loss (< 1.5 dB from fiber to SiN)• Low PDL (< 0.2 dB)• Alignment tolerant
From Binda et al, EMPC 2019
CONFIDENTIELConfidential10
EV-WAFT: a broadband and alignment-tolerant solutionMinimum Insertion Loss and Polarization
Dependent Loss over a broad spectral bandAn alignment-tolerant solution:
-tolerant to lateral offset
-tolerant to proximity error
CONFIDENTIELConfidential11
Fiber to chip assembly services
Fiber Array (FA)SMF or PM fiber250µm or 127µm pitch
ioNext chipPolarization maintaining waveguides250µm or 127µm pitch
Fiber to chip assemblyUp to 64 fibers per FA Insertion loss uniformity
CONFIDENTIELConfidential12
ioNext building blocksBuilding block Key spec VIS NIRStraight waveguide
CONFIDENTIELConfidential13
Advanced PICs and hybrid modules• Er-doped lasers and amplifier modules• E-O modulation• AWGs• …
PassiveMUX
DFB laser
amplifier
Amplified 1550nm laser
VIS interferometric combiner
From E. Huby et al, 2019
Integrated Er-waveguide amplifier
-40
-35
-30
-25
-20
-15
-10
-5
0
193000 193500 194000 194500 195000
Tran
smis
sion
(dB
)
Frequency (GHz)
Thank you for your [email protected]
CONFIDENTIALThis document contains proprietary information and is the property of teem PHOTONICS and is transmitted in
confidence. Neither receipt nor possession confers or transfers any right to reproduce, use or disclose in whole or in part, data contained herein for any purpose, without the prior written consent of an officer of teem PHOTONICS.
© MASSTART
MASSTART Consortium
Data Center Interconnects - Towards Mass Manufacturing, 6th October 2020
Acknowledgement
Co-funded by the Horizon 2020Framework Programme of the European Union
MASSTART project is co-funded by the Horizon 2020 Framework Programme of the European Union with Grant Agreement Nr. 825109. https://cordis.europa.eu/project/rcn/219912/factsheet/enMASSTART project is an initiative of the Photonics Public Private Partnership www.photonics21.org#Photonics@Photonics21@PhotonicsEU#H2020
www.masstart.eu
#MASSTART
Disclaimer: The information, documentation and figures available in this deliverable are written by the MASSTART Consortium Partners under co-funding by Horizon 2020 Framework Programme of the European Union (Grant agreement ID: 825109) and do not necessarily reflect the view of the European Commission. The information in this document is provided “as is”, and no guarantee or warranty is given that the information is fit for any particular purpose. The reader uses the information at his/her sole risk and liability.
Copyright © 2020 the MASSTART Consortium. All rights reserved. This document may not be copied, reproduced or modified in whole or in part for any purpose without written permission from the MASSTART Consortium. In addition to such written permission to copy, reproduce or modify this document in whole or part, an acknowledgement of the authors of the document and all applicable portions of the copyright notice must be clearly referenced.
https://cordis.europa.eu/project/rcn/219912/factsheet/enhttp://www.photonics21.org/http://www.masstart.eu/
ioNext, a glass-based platform complementing Silicon PhotonicsTeem Photonics – Corporate backgroundioNext, a unique photonics process on glassioNext, a complete photonics platform2.5D building blocksWAFT: three coupling solutionsEC-WAFT series for facet couplingTC-WAFT series for top couplingEV-WAFT series for evanescent couplingEV-WAFT: a broadband and alignment-tolerant solutionFiber to chip assembly servicesioNext building blocksAdvanced PICs and hybrid modulesThank you for your attention�[email protected]
09.pdfioNext, a glass-based platform complementing Silicon Photonics
