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Cambridge University Press978-1-107-40878-4 - Materials Research Society Symposium Proceedings: Volume 968: Advanced Electronic PackagingEditors: Vasudeva P. Atluri, Sujit Sharan, Ching-Ping Wong and Darrel FrearFrontmatterMore information

http://www.cambridge.org/9781107408784

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MATERIALS RESEARCH SOCIETYSYMPOSIUM PROCEEDINGS VOLUME 968

Advanced ElectronicPackaging

Symposium held November 27-30, 2006, Boston, Massachusetts, U.S.A.

EDITORS:

Vasudeva P. AtluriIntel Corporation

Chandler, Arizona, U.S.A.

Sujit SharanIntel Corporation

Chandler, Arizona, U.S.A.

Ching-Ping WongGeorgia Institute of Technology

Atlanta, Georgia, U.S.A.

Barrel FrearFreescale Semiconductor, Inc.

Tempe, Arizona, U.S.A.

IMIRIS1Materials Research Society

Warrendale, Pennsylvania






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CONTENTS

Preface ix

Acknowledgments xi

Materials Research Society Symposium Proceedings xiii

JOINT SESSION:SYSTEM IN PACKAGE

* Silicon Based System-in-Package: Breakthroughs in Miniaturizationand 'Nano'-Integration Supported by Very High Quality Passivesand System Level Design Tools 3

Franck Murray, Francois LeCornec, Serge Bardy,Catherine Bunel, Jan Verhoeven, F.C.M. van den Heuvel,J.H. Klootwijk, and Fred Roozeboom

* Process and Material Requirements for Successful HeterogonousPassive Component Integration in RF System 13

Eric Beyne, Walter De Raedt, Geert Carchon, andPhilippe Soussan

* Through Wafer Interconnects—A Technology Not Only forMedical Applications , 23

Gereon Vogtmeier, Christian Drabe, Ralf Dorscheid,Roger Steadman, and Alexander Wolter

A Patch-Type Flexible Physiological Monitor on a Non-WovenMaterial 35

Wen-Yang Chang, Jin-Sheng Chang, Chun-Hsun Chu,Tzong-Che Ho, and Yu-Cheng Lin

An Approach for Characterizing Residual MechanicalStress Caused by Packaging Processes 43

Soeren Hirsch and Bertram Schmidt

ADVANCED PACKAGING/NANOTECHNOLOGY IN PACKAGING

Reactive Multilayer Foils for Silicon Wafer Bonding 51Xiaotun Qiu and Jiaping Wang

* Invited Paper






* Smart Lead-Free Solders via Shape-Memory AlloyReinforcement 57

Indranath Dutta, Bhaskar S. Majumdar, Tiandan Chen,Koh Choon Chung, and Bing Ye

Well-Aligned In Situ Formed Open-End Carbon Nanotubefor Device and Assembly Applications 63

Lingbo Zhu and Ching-Ping Wong

PHYSICAL BEHA VIOR INPACKAGING

* Massive Spalling of Intermetallic Compound in Lead-FreeSolder Joints 77

Su-Chun Yang, Cheng-En Ho, Chien-Wei Chang, andC. Robert Kao

* Effect of Zn Addition on the Interfacial Reactions BetweenCu and Lead-Free Solders 81

Su-Chun Yang, Cheng-En Ho, Chien-Wei Chang, andC. Robert Kao

Thermodynamics and Kinetics of Oxidation of PureIndium Solders 89

Harry Schoeller, Jongman Kim, Seungbae Park, andJunghyun Cho

A Novel PPF Technique—Sn-PPF: Effects of In SituFormation Cu-Sn-Ni Intermetallic Nano-Layer onElectronic Packaging Performances 95

Lilin Liu, Ran Fu, Deming Liu, and Tongyi Zhang

MECHANICAL BEHA VIOR INPACKAGING

* Compression Creep Behavior of the 95.5Sn-(4.3,3.9,3.8)Ag-(0.2, 0.6, 0.7)Cu Solders 103

Paul Vianco, Jerome Rejent, Alice Kilgo, and Joseph Martin

*Invited Paper

VI






Factors Affecting the Mechanical Propertiesof Cu/Electroless Ni-P/Sn-3.5Ag Solder Joints 117

Aditya Kumar, Zhong Chen, C.C. Wong,S.G. Mhaisalkar, and Vaidhyanathan Kripesh

Time-Lapse Measurements of Creep in Au-Sn Die Bonds 125Ryan Marinis, Adam Klempner, Peter Hefti,Ryszard Pryputniewicz, Thomas Marinis, andJoseph Soucy

Mechanical Property Measurement of InterconnectMaterials by Magnetostrictive Sensors 133

Cai Liang, Leslie Mathison, and Barton C. Prorok

ELECTROMIGRATIONAND THERMALBEHA VIOR IN PACKAGING

Electric Current Induced Brittle Failure of Eutectic Lead andLead-Free Solder Joints with Electroless Ni-P Metallization 141

Aditya Kumar, Zhong Chen, C.C. Wong, S.G. Mhaisalkar,and Vaidhyanathan Kripesh

Evaluation of Void Formation Mechanism in Cu Thin Films;Separation of the Effect of Electron Wind Force and Stress 147

Yousuke Fujii, Masanori Tsutsumi, Junya Inoue, andToshihiko Koseki

Thermal Management in High-Density, Stacked-Die,Multi-Chip Modules 153

Thomas Marinis, Dariusz Pryputniewicz,Caroline Kondoleon, and Jason Haley

Advanced Thermal Interface Materials 161Yimin Zhang, Allison Xiao, and Jeff McVey

THIN FILMS AND ADHESIVESINPACKAGING

High Performance Conductive Adhesives for Lead-FreeInterconnects 169

Yi Li and Ching-Ping Wong

vn






Rational Design of Highly Filled Reactive Resins forElectronic Material Applications With MultiplePerformance Constraints 175

Daniel J. Duffy and Allison Xiao

Parylene-PDMS Bilayer Coatings for Microelectronic andMEMS Packaging.... 181

Hyungsuk Lee and Junghyun Cho

Surface Flatness and Interface Stability of Ni-P Film UsingNew Electroless Plating Method With the Emulsion ofSupercritical CO2 187

Hiroki Uchiyama, Masato Sone, Chiemi Ishiyama, andYakichi Higo

Effect of Crystallization on Adhesion Strength of ExternalElectrode in LTCC 193

Minji Ko, SooHyun Lyoo, Yongseok Choi,Hyungho Kim, Hosung Choo, Beomjoon Cho,and EunTae Park

Author Index 199

Subject Index 201

vin






PREFACE

Microelectronics packaging architecture evolutions are driven by silicon technologyadvancements; new form factors, and required used models and emerging technologies. High-performance mobile computer and communication systems will require higher I/O counts,greater density, lower cost, lighter weight and improved performance in the electronic package.Symposium V, "Advanced Electronic Packaging," held November 27-30 at the 2006 MRSFall Meeting in Boston, Massachusetts, focused on silicon technology dimension scaling andperformance improvement, Pb free or "green" assembly, and system in package (SIP) technologies.The first thrust translates into reduced silicon interconnect delay budget and the integration of themechanically weak low-k dielectrics with flip chip and wire bond packaging. The second thrust isfocused on alternative solder interconnects that are Pb-free and are typically stiffer with a highermelting temperature than eutectic Pb-based solders. SIP includes stacked 3-D thin die packaging,2-D organic flip chip multiple-chip packaging and emerging mixed 3-D silicon-to-silicon andsilicon-to-package integration with through silicon vias (TSV). In SIP, silicon can use differenttechnologies to achieve system level function with significantly improved performance at reducedcost. Thermo-Mechanical stresses caused by these three thrusts highlight the increasing challenges toimprove first level interconnects yield and reliability especially for non-hermetic organic packagesthat have high thermal expansion mismatch with silicon. The stress propagates from die-packagefirst level interconnects to silicon backend process and transistor performance and reliability.

The symposium explored the key thermo-mechanical failure modes and mitigating solutionsassociated with integration of silicon with weak interlayer dielectrics during assembly process,under bump metallurgy integrity with lead free assembly, and the impact of stress on die crackingand transistor performance in 3-D thin die stacking. The interaction of these failures with siliconand assembly materials, processes, and design features was also covered. The MRS Symposium VCall For Papers requested original papers to cover following session topics:

Far BE Silicon ProcessingAdvanced and Nano MaterialsInterconnect ReliabilityDesign-Materials InteractionsModeling: Thermal, Mechanicaland ElectricalWafer Level PackagingAdvanced Packaging Technology

Silicon-Package InteractionsPackage ReliabilityNovel Analytical Techniques3-D InterconnectsOptical and MEMS PackagingSystem in Package (SIP)Pb-free Solder Interconnects

The symposium is organized into seven major sessions, based on the responses received,including System in Package, Advanced Packaging, Physical Behavior in Packaging, MechanicalBehavior in Packaging, Electromigration and Thermal Behavior in Packaging, Nanotechnology inPackaging, and Thin Films and Adhesives in Packaging. Experts in the above fields were invitedto give keynote presentations in each of the sessions. The symposium had a total of 54 presentations.About 50% of the presenters submitted papers for inclusion in this symposium proceedings volume.The symposium proceedings is divided into six major sections following the order of the symposiumsessions with an exception of merging the "Advanced Packaging" and "Nanotechnology in Packaging"sections into a combined section titled "Advanced Packaging/Nanotechnology in Packaging."

We hope this proceedings is of value and use for you. We appreciate your valuable feedback!!!

Vasudeva P. Atluri, Ph.D.Sujit Sharan, Ph.D.Ching-Ping (C.P.) Wong, Ph.D.Darrel Frear, Ph.D.

March 2007











ACKNOWLEDGMENTS

The symposium organizers would like to thank the MRS 2006 Fall Meeting Chairs,Dr. Babu Chalamala (Indocel Technologies, Inc.), Dr. Louis J. Terminello (LawrenceLivermore National Laboratory), and Dr. Helena Van Swygenhoven (Paul Scherrer Institute)for inviting us to organize the MRS 2006 Fall Symposium V, "Advanced Electronic Packaging,"and to publish the proceedings. The support received from all of the MRS staff is very muchappreciated. The organizers convey their special thanks to all presenters including invited speakersfor attending the symposium and giving presentations in their area of expertise which made thesymposium very useful to the attendees. The invited speakers included, in alphabetical order:

Dr. Ashish Asthana (Vice President, Intelleflex Corp.), Dr. Bill Bottoms (CEO, Third MillenniumTest Solutions - 3MTS), Dr. Nikhilesh Chawla (Associate Processor, Arizona State University),Dr. William Chen (Senior Advisor, ASE), Dr. Indranath Dutta (Professor, Naval PostgraduateSchool), Dr. Sungho Jin (Professor, Univ. of California, San Diego), Dr. Z.L. Wang (Professor,Georgia Institute of Technology), Dr. C. Robert Kao (Professor, National Central Univ., Taiwan),Dr. Ravi Mahajan (Senior Principal Engineer, Intel Corp.), and Dr. King-Ning Tu (Professor,Univ. of California, Los Angeles). Special thanks are also extended to the authors for submittingthe manuscripts for inclusion in the symposium proceedings. Last but not least, the support givenby the Graduate Student Assistants: Grace Yi Li (Georgia Institute of Technology) and Ichiro Fujii(The Pennsylvania State University), etc. is very much appreciated. It was a pleasure workingwith the MRS 2006 Fall Symposium W ("Heterogeneous Integration of Materials for PassiveComponents and Smart Systems") organizers in setting up and delivering the "System in Package"joint session, and editing the manuscripts submitted to that session. The joint tutorial on Topicsin Advanced Electronic Packaging—Integrated Passives, 3-D Integration, Polymers, and

Integration Challenges, by the Symposium V, W, and Y organizers was very well received withan average of about 50 attendees. The instructors included Yukio Sakabe (Murata ManufacturingCo., Ltd., Japan), Peter Ramm (Fraunhofer Institute IZM), C.P. Wong (Georgia Institute ofTechnology), Vasudeva P. Atluri (Intel Corporation), and Sujit Sharan (Intel Corporation).Special thanks to them all for delivering high-quality tutorials. The support given by the MRS2006 Fall Symposium W and Y organizers is very much appreciated. The organizers includedJuan C. Nino (University of Florida), Fred Roozeboom (NXP Research), Susan Trolier-McKinstry(The Pennsylvania State University), Paul Muralt (Swiss Federal Institute of Technology),David LaVan (Yale University), Chris Bower (RTI International), Phil Garrou (RTI International),Kenji Takahashi (Toshiba Corporation), and Peter Ramm (Fraunhofer Institute IZM).

MRS Fall 2006 Symposium V Graduate Student Award Winners

Special monetary awards of $400, $325, and $275 are given to three student presenters whohave shown originality in their technical work, and for their overall presentations skills. Thewinners in the order of rank are:

First Prize ($400.00):Student Name and Affiliation: Grace Yi Li, Materials Science and Engineering, Georgia

Institute of Technology, Atlanta, GA.Paper No. and Title: V7.1 - High Performance Conductive Adhesives for Lead-free

InterconnectsNote: Grace Yi Li was a MRS 2006 Fall Meeting Graduate

Student Award (GSA) finalist and a silver medal winner.

XI






Second Prize ($325.00):Student Name and Affiliation: Kevin Anthony Grossklaus, Materials Science and Engineering,

Purdue University, West Lafayette, IN.Paper No. and Title: V6.7 - Examination of the Melting Point of Sn Nano-Particles

for Nanosolder Applications

Third Prize ($275.00):Student Name and Affiliation: Youbo Lin, DEAS, Harvard University, Cambridge, MA.Paper No. and Title: V4.9 - Fracture of Organosilicate Glass Coatings at Low

Temperature

xn






MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS

Volume 947E—Responsive Soft Matter—Chemistry and Physics for Assemblages, Films and Forms,R.A. Vaia, J. Genzer, G.H. McKinley, N. Tabiryan, 2007, ISBN 978-1-55899-904-6

Volume 948E— Structure, Processing and Properties of Polymer Nanofibers for Emerging Technologies,2007, ISBN 978-1-55899-905-3

Volume 949E— Smart Dielectric Polymer Properties, Characterization and Their Devices, V. Bharti, Z. Cheng,Q.M. Zhang, Y. Bar-Cohen, G.M. Sessler, 2007, ISBN 978-1-55899-906-0

Volume 950E—Biosurfaces and Biointerfaces, 2007, ISBN 978-1-55899-907-7Volume 95 IE—Nanofunctional Materials, Nanostructures and Novel Devices for Biological and Chemical

Detection, A. Zribi, C. Li, L. Nagahara, M. Willander, 2007, ISBN 978-1-55899-908-4Volume 952E—Integrated Nanosensors, B. Ash, 2007, ISBN 978-1-55899-909-1Volume 953E—Fibrillar Aggregates as Materials—Assembly, Properties and Applications, M. Upmanyu,

L. Mahadevan, C. MacPhee, J.V. Selinger, 2007, ISBN 978-1-55899-910-7Volume 954E—Biofilm-Material Interactions—New Tools, Technologies and Opportunities, M. Libera,

T. Camesano, B. Kreiswirth, P. Li, R.G. Richards, 2007, ISBN 978-1-55899-911-4Volume 955E—Advances in III-V Nitride Semiconductor Materials and Devices, C.R. Abernathy, H. Jiang,

J.M. Zavada, 2007, ISBN 978-1-55899-912-1Volume 956— Diamond Electronics—Fundamentals to Applications, P. Bergonzo, R. Gat, R.B. Jackman,

C.E. Nebel, 2007, ISBN 978-1-55899-913-8Volume 957— Zinc Oxide and Related Materials, J. Christen, C. Jagadish, D.C. Look, T. Yao, F. Bertram,

2007, ISBN 978-1-55899-914-5Volume 958— Group IV Semiconductor Nanostructures—2006, L. Tsybeskov, D J. Lockwood, C. Delerue,

M. Ichikawa, A.W. van Buuren, 2007, ISBN 978-1-55899-915-2Volume 959E—Quantum Dots—Growth, Behavior and Applications, E.A. Stach, C.R. Taylor, Z.M. Wang,

Q-K. Xue, 2007, ISBN 978-1-55899-916-9Volume 960E—Self Assembly of Nanostructures Aided by Ion- or Photon-Beam Irradiation—Fundamentals

and Applications, R. Kalyanaraman, U. Valbusa, Z. Zhang, 2007, ISBN 978-1-55899-917-6Volume 96IE—Nanostructured and Patterned Materials for Information Storage, Z.Z. Bandic, M. Rooks,

R. Berger, T. Ando, 2007, ISBN 978-1-55899-918-3Volume 962E—Nanoscale Magnets—Synthesis, Self-Assembly, Properties and Applications, J. Fassbender,

J. Chapman, C.A. Ross, 2007, ISBN 978-1-55899-919-0Volume 963E—Nanowires and Carbon Nanotubes—Science and Applications, P. Bandaru, M. Endo,

LA. Kinloch, A.M. Rao, 2007, ISBN 978-1-55899-920-6Volume 964E—Meta-Materials at the Milli-, Micro- and Nanoscale, R. Ramprasad, J. Page, P. Renaud,

P. Mangat, 2007, ISBN 978-1-55899-921-3Volume 965E—Organic Electronics—Materials, Devices and Applications, F. So, G.B. Blanchet, Y. Ohmori,

2007, ISBN 978-1-55899-922-0Volume 966E—Ferroelectrics and Multiferroics, V. Gopalan, J-P. Maria, M. Fiebig, C-W. Nan, 2007,

ISBN 978-1-55899-923-7Volume 967E—Advances in In Situ Characterization of Film Growth and Interface Processes, V. Matias,

R. Hammond, G. Rijnders, D. Schlom, 2007, ISBN 978-1-55899-924-4Volume 968— Advanced Electronic Packaging, V.P. Atluri, S. Sharan, C.P. Wong, D. Frear, 2007,

ISBN 978-1-55899-925-1






MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS

Volume 969— Heterogeneous Integration of Materials for Passive Components and Smart Systems, 2007,ISBN 978-1-55899-926-8

Volume 970— Enabling Technologies for 3-D Integration, C.A. Bower, P.E. Garrou, P. Ramm, K. Takahashi,2007, ISBN 978-1-55899-927-5

Volume 97IE—Hydrogen Storage Technologies, J-C. Zhao, I.M. Robertson, S-I. Orimo, 2007,ISBN 978-1-55899-928-2

Volume 972— Solid-State Ionics—E. Traversa, T.R. Armstrong, C. Masquelier, Y. Sadaoka, 2007,ISBN 978-1-55899-929-9

Volume 973E— Mobile Energy, A. Nathan, G. Amaratunga, M. Nookala, L.G. Scanlon, E. Morinobu, 2007,ISBN 978-1-55899-930-5

Volume 974E—Solar Energy Conversion, M. Beard, 2007, ISBN 978-1-55899-931-2Volume 975E—Mechanics of Biological and Bio-Inspired Materials, K. Katti, C. Hellmich, C. Viney,

U. Wegst, 2007, ISBN 978-1-55899-932-9Volume 976E—Size Effects in the Deformation of Materials—Experiments and Modeling, E. Lilleodden,

P. Besser, L. Levine, A. Needleman, 2007, ISBN 978-1-55899-933-6Volume 977E—Processing-Structure-Mechanical Property Relations in Composite Materials, L. Thilly,

N.R. Moody, A. Misra, P.M. Anderson, M. Kumar, 2007, ISBN 978-1-55899-934-3Volume 978E—Multiscale Modeling of Materials, R. Devanathan, M.J. Caturla, A. Kubota, A. Chartier,

S. Phillpot, 2007, ISBN 978-1-55899-935-0Volume 979E—Thermodynamics and Kinetics of Phase Transformations in Inorganic Materials, C. Ambromeit,

P. Bellon, J-L. Bocquet, D.N. Seidman, 2007, ISBN 978-1-55899-936-7Volume 980— Advanced Intermetallic-Based Alloys, J. Wiezorek, C.L. Fu, M. Takeyama, D. Morris,

H. Clemens, 2007, ISBN 978-1-55899-937-4Volume 98IE—Structural and Refractory Materials for Fusion and Fission Technologies, J. Aktaa, M. Samaras,

M. Serrano de Caro, M. Victoria, B. Wirth, 2007, ISBN 978-1-55899-938-1Volume 982E—Electron Microscopy Across Hard and Soft Materials, TJ. Balk, A. Minor, A. Porter, J. Plitzko,

2007, ISBN 978-1-55899-939-8Volume 983E—Focused Ion Beams for Analysis and Processing, W. MoberlyChan, H. Colijn, R. Langford,

A. Marshall, 2007, ISBN 978-1-55899-940-4Volume 984E—Magnetic Resonance in Material Science, J. Herberg, Y. Wu, P. Grandinetti, S. Hayes, I. Farnan,

2007, ISBN 978-1-55899-941-1Volume 985— Scientific Basis for Nuclear Waste Management XXX, D.S. Dunn, C. Poinssot, B. Begg, 2007,

ISBN 978-1-55899-942-8Volume 986— Actinides 2006—Basic Science, Applications and Technology, K.J.M. Blobaum, E.A. Chandler,

L. Havela, M.B. Maple, M.P. Neu, 2007, ISBN 978-1-55899-943-5Volume 987— Materials Research at High Pressure, M.R. Manaa, A.F. Goncharov, R.J. Hemley, R. Bini,

2007, ISBN 978-1-55899-944-2Volume 988E—Solid-State Chemistry of Inorganic Materials VI, R. Seshadri, J.W. Kolis, D.B. Mitzi,

M.J. Rosseinsky, 2007, ISBN 978-1-55899-945-9

Prior Materials Research Society Symposium Proceedings available by contacting Materials Research Society






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