© 2020
From Technologies to Markets
Advanced Packaging Current
Trends & Challenges
9
ADVANCED PACKAGING PLATFORMS –Classification at System Integration Level
Wafer level Substrate/Strip level (Panel based) Panel level
Level 1 - Die
Interconnection
Substrate/
leadframe
Level 2 -
Packaging
Module
Level 3 -
No SMT needed
SiP/PoP, etc.
ED in PCB/Flex
ED in
laminate
Organic/
glass
substrate
etc.
Standard organic substrate
Flip-chip Wire-bond RDL
FIWLP FOWLP 3D/2.5DFOPLP
Silicon/
glass
bridge
Bump/
pillar
TSV/
TGV
Ceramic/
leadframe
and others
Advanced
organic
substrate
Mold
embeddingOrganic interposer
FC
WB
CSP
BGA Standard
BGA Advanced
LGA
BGA
LGA
CSP
Organic substrate Ceramic/
leadframe
and others
FC WB
AP platform
10©2018 | www.yole.fr | Status of the Advanced Packaging Industry 2018
ADVANCED PACKAGING MARKET SHARE EVOLUTION 2014-2025
Advanced Packaging revenue will almost equal to traditional packaging revenue by 2025.
In 2019, the AP market share was 42.6%. Due to strong momentum in AP market driven by mega trends, the share of
AP in the total semiconductor market is increasing continuously and will reach almost 50% of the market by 2025.
In 2014, AP market share was 38% and there is strong possibility that in 2026, AP market share will exceed that of
traditional packaging.
38.0%42.6%
49.4%
62.0%57.4%
50.6%
0.0%
10.0%
20.0%
30.0%
40.0%
50.0%
60.0%
70.0%
80.0%
90.0%
100.0%
2014 2015 2016 2017 2018 2019 2020 2021 2022 2023 2024 2025
Advanced Packaging revenue as % of total packaging
AP Other
$53B $85B
11©2018 | www.yole.fr | Status of the Advanced Packaging Industry 2018
Fan-out,
$3,046 M, 7%
Flip-chip,
$32,291 M,
77%
Fan-in ,
$2,491 M, 6%
ED, $149 M,
0.4%
3D stacking*,
$4,186 M, 10%
2025( $42.2B)
Fan-out,
$1,256 M, 5%
Flip-chip,
$23,938 M,
83%
Fan-in ,
$2,068 M, 7%
ED, $55 M,
0.2%
3D stacking*,
$1,466 M, 5%
2019( $28.8B)
ADVANCED PACKAGING REVENUE FORECAST 2019-2025
• NOTE:
• Values represent packaging services (assembly and test) and do not include FEOL Si die processing
• TSV* includes portion of package revenue not included in Flip-chip or fan-in
• The Advanced Packaging market was
worth ~$28.8B in 2019. It is
expected to grow at ~ 7%
CAGR2019-2025 to reach ~$42.2B in
2025.
• Highest revenue CAGR expected
from 2.5D / 3D stacking IC, ED (in
laminate substrate) and Fan-Out,
21%, 18% and 16%, respectively, as
high volume products further
penetrate the market: FO in mobile,
networking, automotive; 2.5D/3D TSV
in AI/ML, HPC, datacenters, CIS,
MEMS/sensors; ED in automotive
and medical.
Advanced Packaging REVENUE SPLIT by packaging platform
Flip-chip CAGR2018-2025 ~ 5.9%%
Fan-out CAGR2018-2025 ~ 16%
Fan-in WLP CAGR2018-2025~ 3.2%
3D Stacking CAGR2018-2025 ~ 21.3%
Embedded Die CAGR2018-2025 ~ 18%
CAGR ~7%
12
TECHNOLOGY ROADMAP: FROM NANO-SCALE TO MICRO-SCALE..
2015 2017 2019 2021 2023 2025
Assumed
Moore’s Law
Stacked Die
µBump Pitch (μm)
Die to Substrate
FC Bump Pitch (μm)
Substrate to Board
BGA Ball Pitch (μm)
22nm 14nm 10nm 7nm
28nm 14nm 10nm 7nm 5nm 3nm
20nm 16nm 10nm 7nm 5nm 3nm
20nm 14nm (licensed) Stopped
Adva
nce
d N
odes
Adva
nce
d P
ackag
ing*
16/14nm 10nm 7nm 5nm 3nm
200 to 150 μm 150 to 80 μm 60 to 40 μm <40 μm
400/350 μm 300 μm
Advanced Packaging is essential to bridge the scale-gap between die and PCBIndustry is looking into the growing importance of functional roadmap
Average trends based on technology and industry expectation
*Minimum dimension
2nm
95 to 48 μm 44 to 20 μm 20 to 10 μm
2nm
5nm
13©2018 | www.yole.fr | Status of the Advanced Packaging Industry 2018
TSMC
14%
Samsung Electronics
10%
ASE
9%
SPIL
8%
Intel
8%
Chip Bond
7%
JCET/JCAP
6%
Amkor/Nanium
6%
Powertech
4%
NEPES
4%
ChipMOS
4%
SK Hynix
3%
LBSemicon
2%
Global Foundries
2%
Others
4%
Winstek
1%
Huatian
1%
SJSemi
1%
Unisem
1%China WLCSP…
Texas Instrument…TFME
1%
Sony…
2019 ADVANCED PACKAGING WAFER SPLIT (300MM EQ WSPY)
ADVANCED PACKAGING 2019 WAFER SPLIT BY MANUFACTURER
TEN players, which includes 2 IDMs (Intel, Samsung), a foundry (TSMC), the top 5 global OSATs (ASE, SPIL, Amkor, PTI, JCET) together with Nepes and Chipbond, process approximately 75% of Advanced Packaging wafers.
NOTE:
• This pie chart represents superpositions of all Advanced Packaging platforms (Fan-in/Fan-out WLP, Flip-chip including 2.5D/3D and
embedded die.
• Flip-chip values are entered as total capacity, fan-in, fan-out, 3D stacking and embedded die as total production.
• Flip-chip production values were not available by customer – global utilization is at ~85-90% of capacity.
31.2 M
300 mm eq.
©2018 | www.yole.fr | Status of the Advanced Packaging Industry 2018
14©2018 | www.yole.fr | Status of the Advanced Packaging Industry 2018Status of Advanced Packaging Industry 2020 | Report | www.yole.fr | ©2020
FINANCIAL OVERVIEW FOR TOP 25 OSATS
Revenue in 2019
©2018 | www.yole.fr | Status of the Advanced Packaging Industry 2018
Top OSATs with heavy investments
were creating a disparity with the rest
of the pack.
Top 8 OSATs now include 3
manufacturer HQ-ed in China.
UTAC maintained its 8th spot.
Companies in the tail are at a higher
risk if there is no differentiated
technology or IP for merger and
acquisition as an exit strategy.
Large OSATs were separated from the rest.
Top 8 OSATs continued with heavy investment in CapEx and R&D.
**Note: SPIL included in ASE figures from 2019 onwards
8,456
4,053
3,285
2,209
1,169
1,085
848
710
678
675
582
484
405
399
398
339
334
314
289
286
267
264
247
223
157
ASE (rev w/SPIL & w/o USI)
Amkor
JCET Group
Powertech Technology
Tongfu Microelectronics
Tianshui Huatian Microelectronics
King Yuan Electronics
UTAC
Chipbond Technology
ChipMOS Technologies
Orient Semiconductor Electronics
SFA semicon
Hana Micron (Rev w/o Hana Materials)
Greatek Elec
AOI Electronics
Carsem
Sigurd Microelectronics
Formosa Advanced Technologies
Nepes Corporation
Unisem Berhad
Ardentec
Inari Amertron Berhad
Tong Hsing
Walton Advanced Engineering
Lingsen Precision Industries
TOP 25 OSAT ranking by 2019 revenue [$M]
Players not within the Top 8 rankings need to catch up.
Otherwise, they risk being acquired or incurring losses in business.
TSMC ranks between 3rd &4th
If counted separately, SPIL revenue in 2019 is $2.88B,
which will place it as 4th among global OSATs.
‹#›©2018 | www.yole.fr | Status of the Advanced Packaging Industry 2018
SEMICONDUCTOR SUPPLY CHAIN - 2020
System / ProductSub-Module /
Sub-systemsDesign & Assembly
Design of chip & package
Wafer Level Packaging« Middle -end »
SiliconManufacturing
« Front-end »
Package Assembly & Final
Test« Back-end »
Front-end related
materials suppliers
FE related
equipment suppliers
BE Packaging materials
suppliers
BE Packaging equipment
suppliers
Fab-less
IC players
IDMs (Integrated Device Manufacturers)
WLP houses (no need for traditional substrate)
PCB suppliers
SMT material suppliers
SMT equipment suppliers
Package substrate
laminate suppliers
Substrate material suppliers(FR4, BT resin, Cu clad, etc.…)
Wafer foundries
Fab-light players (outsourcing + focused investment in manufacturing & critical IP)
Wafer Bumping houses PCB houses with Embedded die capability
Passive components,
connectors, etc.
OEMs(Original
Equipment
Makers)
Semiconductor production chain
PCB and substrate component suppliers
Equipment/materials suppliers
Passive components, connectors etc.
OSATs
Integrated wafer / package manufacturing foundries
OSATs with module/EMS capability
ODM / EMS / DMS
‹#›©2018 | www.yole.fr | Status of the Advanced Packaging Industry 2018
MOBILITY ACROSS SEMICONDUCTOR SUPPLY CHAIN AT VARIOUS LEVELS
Supply chain is undergoing changes at various levels to
adjust to changing business environment.. However, some of
them have successfully managed to expand in new
business model & have huge impact across IC
manufacturing chain while others have failed to take off.
In order to expand the business and
explore new areas, players in
semiconductor supply chains are
moving to different business models
17
OSATS PACKAGING BUSINESS CANNIBALIZATION TREND
Total IC packaging business:
$67B (2019)
Traditional
PackagingAdvanced
Packaging
Foundries
EMS/ODM
players
Substrate /
PCB suppliers
• Packaging / assembly business was
traditionally domain of OSATs & IDMs.
• Players from different business models
viz. Foundries, substrate/PCB suppliers,
EMS/DM are entering the assembly
/packaging business & cannibalizing
the OSAT business.