Agile Manufacturing of Glass Carriers for Fan-OutDr. Jay ZhangBusiness Development Director, Corning Precision Glass Solutions
Presentation Outline
I. Introduction to Corning Precision Glass SolutionsII. Carrier requirements for fan-out
• Understanding in-process warp• Levers to control warp• Real-world customer challenges
III. Introducing Corning Advanced Packaging CarriersIV. Glass Considerations and Corning’s Agile Manufacturing PlatformV. Concluding Remarks
© 2019 Corning Incorporated .
© 2019 Corning Incorporated .
Corning Incorporated is one of the world’s leading innovators in materials science. For more than 165
years, Corning has applied its unparalleled expertise in glass science, ceramics, and optical physics to
develop products and processes that have transformed industries and enhanced people’s lives.
Founded: 1851
Headquarters: Corning, New York
Employees: ~ 46,000 worldwide
2017 Core Sales: $10.3 billion
Fortune 500 Ranking (2017): 298
v
Introduction to CorningWe understand the Periodic Table of a glass scientist
Network modifiers
Colorants
Fining agents(get rid of bubbles)
Glass formers
‘Backbone’ or network formers
Network modifierse.g. sodium or calcium
© 2019 Corning Incorporated .
Corning Precision Glass Solutions offers industry leading wafer and panel format glass-based solutions.
Our products help customers deliver increasingly demanding functionality and form factor requirements in consumer devices and
Internet of Things applications.
Through Glass Via Solutions*
Wafer-Level Optic Solutions
Augmented Reality Solutions
Wafer-Level Capping Solutions
Custom Glass Solutions
5
*Development program
Carrier Solutions
© 2019 Corning Incorporated .
Presentation Outline
I. Introduction to Corning Precision Glass SolutionsII. Carrier requirements for fan-out
• Understanding in-process warp• Levers to control warp• Real-world customer challenges
III. Introducing Corning Advanced Packaging CarriersIV. Glass Considerations and Corning’s Agile Manufacturing PlatformV. Concluding Remarks
© 2019 Corning Incorporated .
Understanding in-process warpCTE mismatch in carrier applications induces in-process warpAssuming bi-axial bending, the bending curvature due to CTE mismatch and high process temperature is:
( )( )( )( )
( )( ) ( )
g process room g g
gg 4 4 2 2g g g g
gg
6 ( )
112 2 3 2
11
s s s
sss s s s
ss
T T t t t t
E vE vt t t t t t t t
E vE v
α ακ
− − += −− + + + +
−−
: Young's modulus; : Poisson's ratio; : Glass thickness;: Coefficient of thermal expansion; : Temperature.
g: glass; s: semiconductor layers (MC + redistribution layers + die)
E tT
να
( )( )( )( )
( )( ) ( )
( )( )
2g process room g g
gg 4 4 2 2g g g g
gg
g22
g g
11 cos 1 cos2 2
3 ( )
114 2 2 3 2
11
1 0.75
1
s s s
sss s s s
ss
s s
s
LW R
L T T t t t t
E vE vt t t t t t t t
E vE v
E v tL TE v t
α κκ
α α
α
= − = −
− − +≈
−− + + + +
−−
−≈ ∆ ∆
−
L LRα κ= =1R κ=
and the warp is:
glass, , ,g g g gE v t α
, , ,s s s sE v t α semi
© 2019 Corning Incorporated .
Understanding in-process warpCTE mismatch in carrier applications induces in-process warp
© 2019 Corning Incorporated .
( )( )( )( )
( )( ) ( )
( )( )
2g process room g g
gg 4 4 2 2g g g g
gg
g22
g g
11 cos 1 cos2 2
3 ( )
114 2 2 3 2
11
1 0.75
1
s s s
sss s s s
ss
s s
s
LW R
L T T t t t t
E vE vt t t t t t t t
E vE v
E v tL TE v t
α κκ
α α
α
= − = −
− − +≈
−− + + + +
−−
−≈ ∆ ∆
−
glass, , ,g g g gE v t α
, , ,s s s sE v t α semi
Under typical fan-out conditions, in-process warp follows a simplified formula showing its dependence on:
1. CTE mismatch between glass and the composite semi material 2. Glass Young’s modulus 3. Square of glass thickness
Levers to control in-process warpDecreasing ∆CTE between carrier and semi
g s
g s
s
o oroom process
70GPa; 20GPa;0.22; 0.35;1.1mm; 0.15mm;
20 C; 250 C;g
E Ev vt t
T T
= =
= =
= =
= =
300mmL =
© 2019 Corning Incorporated .
Perfect CTE match is desirable, but not possible due to composite semi CTE changing in process
Levers to control in-process warpIncreasing the modulus of the carrier
s
g s
s
o
o oroom process
20GPa;0.22; 0.35;1.1mm; 0.15mm;
ΔCTE 1.0ppm/ C; 20 C; 250 C;
g
Ev vt t
T T
== =
= =
=
= =
300mmL =
© 2019 Corning Incorporated .
Warp is inversely proportional to the Young’s modulus of the carrier
Levers to control in-process warpIncreasing the thickness of the carrier
g s
g s
so
o oroom process
70GPa; 20GPa;0.22; 0.35;0.15mm;
ΔCTE 1.0ppm/ C; 20 C; 250 C;
E Ev vt
T T
= =
= =
=
=
= =
300mmL =
© 2019 Corning Incorporated .
Warp is inversely proportional to carrier thickness squared, but returns diminish beyond 1mm
Levers to control in-process warp∆CTE is part of fan-out reality
s
g s
s
o oroom process
20GPa;0.22; 0.35;1.1mm; 0.15mm;
20 C; 250 C;=300mm.
g
Ev vt t
T TL
== =
= =
= =
© 2019 Corning Incorporated .
Higher Young’s modulus helps overcome the ∆CTE mismatch challenge
Real-world customer challengesAdditional considerations
Product• CTE mismatch is unavoidable due to different materials
added during fan-out• Very high YM may introduce failure modes not yet well
understood• Too high a carrier thickness limits the Z-height of the package
Material availability and consistency• Long lead times for carrier samples result in delayed
package development• Changes in carrier material during MP ramp may create
issues
Real-world customer challengesCustomer selection of ideal carrier CTE may take more than a year
Research & Development Mass Production (MP)
Customer Challenges
Vendor/Material Requirements
• Identifying CTE• Iterate design
• Multiple CTEs fast• Fine granularity of available
CTEs
6-9 months
Small volume test cycles
• Finalize CTE• Lock in design
• Quick turnaround of chosen CTE
• Flexibility to go back to small volume design changes
• Reliable supply of MP volume with consistent material properties
• Ability to ramp quickly• Ability to work with customer
to finalize and deliver the specs
6-9 months +3-4 months
Small volume test cycles CTE finalization
6-9 months +3-4 months
Small volume test cycles CTE finalization
>6 months
Presentation Outline
I. Introduction to Corning Precision Glass SolutionsII. Carrier requirements for fan-out
• Understanding in-process warp• Levers to control warp• Real-world customer challenges
III. Introducing Corning Advanced Packaging CarriersIV. Glass Considerations and Corning’s Agile Manufacturing PlatformV. Concluding Remarks
© 2019 Corning Incorporated .
Introducing Advanced Packaging CarriersUp to 40% reduction in customers’ in-process warp
Fine granularity of CTEs
High stiffness
4-6 week sample lead time
© 2019 Corning Incorporated .
We’ve tailored our glass carriers by Young’s Modulus and CTE to meet customers’ requirements for advanced packaging
Youn
g’s
Mod
ulus
(GP
a)
CTE (ppm/oC)
Corning Carrier Solutions
NEW Advanced Packaging Carriers
Standard Glass Carriers
© 2019 Corning Incorporated .
70.0
75.0
80.0
85.0
90.0
95.0
3 4 5 6 7 8 9 10 11 12 13
90-95
85-90
80-85
75-80
70-75
65-70
Optimized for Chip-First Optimized for Chip-Last
Standard Glass Carriers
NEW Advanced Packaging Carriers
Introducing Corning Advanced Packaging CarriersDemonstration of high stiffness in Corning’s carriers
© 2019 Corning Incorporated .
Watch this video at: http://www.corning.com/worldwide/en/products/advanced-optics/product-materials/PrecisionGlassSolutions/advanced-packaging-carriers.html
Introducing Corning Advanced Packaging CarriersSimulation results after PMC: Typical vs. Corning Advanced Packaging Carrier
Typical carrier
Corning Advanced Packaging Carrier
© 2019 Corning Incorporated .
20% reduction in in-process warp
Source: ASMPT
Introducing Corning Advanced Packaging CarriersDemonstration of the impact of in-process warp on chucking
Watch this video at: http://www.corning.com/worldwide/en/products/advanced-optics/product-materials/PrecisionGlassSolutions/advanced-packaging-carriers.html
© 2019 Corning Incorporated .
Presentation Outline
I. Introduction to Corning Precision Glass SolutionsII. Carrier requirements for fan-out
• Understanding in-process warp• Levers to control warp• Real-world customer challenges
III. Introducing Corning Advanced Packaging CarriersIV. Glass Considerations and Corning’s Agile Manufacturing PlatformV. Concluding Remarks
© 2019 Corning Incorporated .
Introducing Corning Advanced Packaging CarriersCombining core strengths to support fan-out industry requirements
Glass science expertise
© 2019 Corning Incorporated .
Customer Stage
Supply high quantity of selected carrier
Understand material
requirements
Develop high YM glass in
multiple CTEs
Deliver multiple CTE samples in 4-6 weeks
Research & Development Mass Production
Agile Manufacturing Platform
Component Expansion Modulus
SiO2 ↓ ↓Al2O3 ↓ ↑B2O3 ↓ ↓Li2O ↑ ↓Na2O ↑ ↓K2O ↑ ↓MgO ↑CaO ↑TiO2 ↑ZrO2 ↑
Corning glass science expertiseThese components determine the properties of glass for fan-out
Positive impact for FONeutral impact for FONegative impact for FO
© 2019 Corning Incorporated .
Network modifiers
Colorants
Fining agents(get rid of bubbles)
Glass formers
Corning glass science expertiseExample of glass development for CTE range of 7.5-10 ppm/oC
• High accuracy of regression model designed for CTE space provides high confidence in predicted CTE based on glass composition
• We can control batch materials to hit CTE within +/- 0.1 ppm/oC
© 2019 Corning Incorporated .
Introducing Advanced Packaging CarriersUp to 40% reduction in customers’ in-process warp
© 2019 Corning Incorporated .
Thank you! Contact me at [email protected] for more information
Fine granularity of CTEs
High stiffness
4-6 week sample lead time