Aerial Intruder Removal System for Tracking and Rendering Ineffective Knavish Enemies

AIR-STRIKE Group 13

Kevin Chau Scott Greenwald Andrew Kirk Christopher Walls

May 1st, 2015

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Table of Contents 1.0 Executive Summary ..................................................................................... 1

2.0 Project Description ....................................................................................... 3

2.1 Project Motivation and Goals ...................................................................... 3

2.2 Objectives ................................................................................................... 3

2.3 Project Requirements and Specifications .................................................... 4

2.3.1 Microcontroller Requirements ............................................................... 5

2.3.1.1 Handling Input from Cameras ........................................................ 5

2.3.1.2 Output to Motors ............................................................................ 6

2.3.1.3 Output to Directed Energy System ................................................. 6

2.3.1.4 External Interface Capabilities ....................................................... 6

2.3.2 Image Capture Subsystem ................................................................... 6

2.3.2 Directed Energy Subsystem ................................................................. 7

2.3.3 System Controller Software .................................................................. 8

2.3.4 External Interfacing Software ............................................................... 8

3.0 Research ....................................................................................................... 9

3.1 Existing Related Projects ............................................................................ 9

3.2 Relevant Technologies................................................................................ 9

3.2.1 Optical Targeting Systems ................................................................... 9

3.2.1.1 Lockheed Martin JSF EOTS ........................................................ 10

3.2.1.2 Raytheon MTS ............................................................................. 10

3.2.2 Anti-Air Weaponry .............................................................................. 10

3.2.3 Object Detection Systems .................................................................. 10

3.3 System Processing ................................................................................... 11

3.3.1 Single-Board Computers .................................................................... 11

3.3.2 Field-Programmable Gate Array (FPGA) ............................................ 12

3.3.3 Microcontroller .................................................................................... 14

3.3.3.1 CC3100 SimpleLink Wi-Fi ............................................................ 18

3.3.3.2 Bluetooth with the CC2560 .......................................................... 20

3.4 Directed Energy System ........................................................................... 21

3.4.1 Laser .................................................................................................. 21

3.4.2 Collimating Optics............................................................................... 25

3.4.3 Current Drivers ................................................................................... 26

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3.4.4 Laser Host .......................................................................................... 27

3.4.5 Laser Safety ....................................................................................... 28

3.4.6 Safety Eyewear .................................................................................. 29

3.4.7 Registering the Laser ......................................................................... 30

3.5 Video Capture System .............................................................................. 31

3.5.1 Pixy (CMUcam5) ................................................................................ 32

3.6 Image Processing ..................................................................................... 33

3.6.1 Edge Detection ................................................................................... 34

3.6.2 Motion Detection ................................................................................ 35

3.6.3 Object Recognition ............................................................................. 37

3.7 Printed Circuit Board (PCB) ...................................................................... 37

3.7.1 Component Packages ........................................................................ 38

3.8 Communication Technology ..................................................................... 39

3.8.1 Wi-Fi ................................................................................................... 39

3.8.2 Bluetooth ............................................................................................ 40

3.8.3 Wireless USB ..................................................................................... 40

3.8.4 ZigBee ................................................................................................ 41

3.9 Gimbal Assembly ...................................................................................... 42

3.9.1 Gimbal Motors .................................................................................... 42

3.10 Power Supply .......................................................................................... 44

3.11.1 Power Sources ................................................................................. 44

3.10.1.1 Batteries .................................................................................... 45

3.10.1.2 Solar Power ............................................................................... 46

3.10.1.3 Generators ................................................................................. 46

3.10.1.4 AC Power .................................................................................. 46

4.0 Hardware and Software Design .................................................................. 47

4.1 General System Block Diagrams .............................................................. 47

4.1.1 General Hardware Block Diagram - INCOMPLETE ........................... 47

4.1.2 General Software Block Diagram ....................................................... 47

4.2 Microcontroller Software ........................................................................... 48

4.3 Image Capture Subsystem ....................................................................... 51

4.4 Directed Energy System ........................................................................... 53

4.4.2 Assemblage ....................................................................................... 54

4.4.3 Specifications ..................................................................................... 54

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4.5 Servo Control ............................................................................................ 54

4.6 Communication Systems .......................................................................... 55

4.6.1 Wi-Fi Controller .................................................................................. 55

4.6.4 Byte Message API .............................................................................. 57

4.7 PCB Design .............................................................................................. 62

4.7.1 Schematics ......................................................................................... 62

4.7.1.1 CC3200 PCB Design ................................................................... 62

4.7.2 Board Layout ...................................................................................... 66

4.7.3 PCB Housing ...................................................................................... 67

4.8 Wireless Communication .......................................................................... 68

4.9 External Interface ...................................................................................... 69

4.10 Power Management ................................................................................ 70

5.0 Design Summary ........................................................................................ 72

6.0 Prototype Integration ................................................................................. 74

6.1 Parts Acquisition and Cost ........................................................................ 74

6.1.1 PCB Materials .................................................................................... 74

6.1.1.1 PCB Bill of Materials .................................................................... 74

6.1.2 PCB Assembly ................................................................................... 77

6.2 Directed Energy Subsystem Assembly ..................................................... 77

6.2.1 Directed Energy Housing .................................................................... 77

6.2.2 Simulation for Housing using Finite