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AIR-STRIKE - UCF Department of · PDF fileAIR-STRIKE Group 13 ... 4.1.1 General Hardware Block...

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  • Aerial Intruder Removal System for Tracking and Rendering Ineffective Knavish Enemies

    AIR-STRIKE Group 13

    Kevin Chau Scott Greenwald Andrew Kirk Christopher Walls

    May 1st, 2015

  • i

    Table of Contents 1.0 Executive Summary ..................................................................................... 1

    2.0 Project Description ....................................................................................... 3

    2.1 Project Motivation and Goals ...................................................................... 3

    2.2 Objectives ................................................................................................... 3

    2.3 Project Requirements and Specifications .................................................... 4

    2.3.1 Microcontroller Requirements ............................................................... 5

    2.3.1.1 Handling Input from Cameras ........................................................ 5

    2.3.1.2 Output to Motors ............................................................................ 6

    2.3.1.3 Output to Directed Energy System ................................................. 6

    2.3.1.4 External Interface Capabilities ....................................................... 6

    2.3.2 Image Capture Subsystem ................................................................... 6

    2.3.2 Directed Energy Subsystem ................................................................. 7

    2.3.3 System Controller Software .................................................................. 8

    2.3.4 External Interfacing Software ............................................................... 8

    3.0 Research ....................................................................................................... 9

    3.1 Existing Related Projects ............................................................................ 9

    3.2 Relevant Technologies................................................................................ 9

    3.2.1 Optical Targeting Systems ................................................................... 9

    3.2.1.1 Lockheed Martin JSF EOTS ........................................................ 10

    3.2.1.2 Raytheon MTS ............................................................................. 10

    3.2.2 Anti-Air Weaponry .............................................................................. 10

    3.2.3 Object Detection Systems .................................................................. 10

    3.3 System Processing ................................................................................... 11

    3.3.1 Single-Board Computers .................................................................... 11

    3.3.2 Field-Programmable Gate Array (FPGA) ............................................ 12

    3.3.3 Microcontroller .................................................................................... 14

    3.3.3.1 CC3100 SimpleLink Wi-Fi ............................................................ 18

    3.3.3.2 Bluetooth with the CC2560 .......................................................... 20

    3.4 Directed Energy System ........................................................................... 21

    3.4.1 Laser .................................................................................................. 21

    3.4.2 Collimating Optics............................................................................... 25

    3.4.3 Current Drivers ................................................................................... 26

  • ii

    3.4.4 Laser Host .......................................................................................... 27

    3.4.5 Laser Safety ....................................................................................... 28

    3.4.6 Safety Eyewear .................................................................................. 29

    3.4.7 Registering the Laser ......................................................................... 30

    3.5 Video Capture System .............................................................................. 31

    3.5.1 Pixy (CMUcam5) ................................................................................ 32

    3.6 Image Processing ..................................................................................... 33

    3.6.1 Edge Detection ................................................................................... 34

    3.6.2 Motion Detection ................................................................................ 35

    3.6.3 Object Recognition ............................................................................. 37

    3.7 Printed Circuit Board (PCB) ...................................................................... 37

    3.7.1 Component Packages ........................................................................ 38

    3.8 Communication Technology ..................................................................... 39

    3.8.1 Wi-Fi ................................................................................................... 39

    3.8.2 Bluetooth ............................................................................................ 40

    3.8.3 Wireless USB ..................................................................................... 40

    3.8.4 ZigBee ................................................................................................ 41

    3.9 Gimbal Assembly ...................................................................................... 42

    3.9.1 Gimbal Motors .................................................................................... 42

    3.10 Power Supply .......................................................................................... 44

    3.11.1 Power Sources ................................................................................. 44

    3.10.1.1 Batteries .................................................................................... 45

    3.10.1.2 Solar Power ............................................................................... 46

    3.10.1.3 Generators ................................................................................. 46

    3.10.1.4 AC Power .................................................................................. 46

    4.0 Hardware and Software Design .................................................................. 47

    4.1 General System Block Diagrams .............................................................. 47

    4.1.1 General Hardware Block Diagram - INCOMPLETE ........................... 47

    4.1.2 General Software Block Diagram ....................................................... 47

    4.2 Microcontroller Software ........................................................................... 48

    4.3 Image Capture Subsystem ....................................................................... 51

    4.4 Directed Energy System ........................................................................... 53

    4.4.2 Assemblage ....................................................................................... 54

    4.4.3 Specifications ..................................................................................... 54

  • iii

    4.5 Servo Control ............................................................................................ 54

    4.6 Communication Systems .......................................................................... 55

    4.6.1 Wi-Fi Controller .................................................................................. 55

    4.6.4 Byte Message API .............................................................................. 57

    4.7 PCB Design .............................................................................................. 62

    4.7.1 Schematics ......................................................................................... 62

    4.7.1.1 CC3200 PCB Design ................................................................... 62

    4.7.2 Board Layout ...................................................................................... 66

    4.7.3 PCB Housing ...................................................................................... 67

    4.8 Wireless Communication .......................................................................... 68

    4.9 External Interface ...................................................................................... 69

    4.10 Power Management ................................................................................ 70

    5.0 Design Summary ........................................................................................ 72

    6.0 Prototype Integration ................................................................................. 74

    6.1 Parts Acquisition and Cost ........................................................................ 74

    6.1.1 PCB Materials .................................................................................... 74

    6.1.1.1 PCB Bill of Materials .................................................................... 74

    6.1.2 PCB Assembly ................................................................................... 77

    6.2 Directed Energy Subsystem Assembly ..................................................... 77

    6.2.1 Directed Energy Housing .................................................................... 77

    6.2.2 Simulation for Housing using Finite

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