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DEPOSITION SYSTEMS FOR COMPOUND SEMICONDUCTORS
AIX R6 Metal Organic Chemical Vapor Deposition
CHINA
AIXTRON China Ltd.Phone +86 (21) 6445 3226Fax +86 (21) 6445 3742E-Mail [email protected]
KOREA
AIXTRON Korea Co., Ltd.Phone +82 (31) 783 2220Fax +82 (31) 783 4497E-Mail [email protected]
UNITED KINGDOM
AIXTRON Ltd.Phone +44 (1223) 519 444Fax +44 (1223) 519 888E-Mail [email protected]
GERMANY
AIXTRON SEPhone +49 (2407) 9030-0Fax +49 (2407) 9030-40E-Mail [email protected]
SWEDEN
AIXTRON ABPhone +46 (46) 286 8980Fax +46 (46) 286 8989E-Mail [email protected]
USA
AIXTRON Inc.Phone +1 (408) 747 7140Fax +1 (408) 752 0173E-Mail [email protected]
www.aixtron.comJAPAN
AIXTRON K.K.Phone +81 (3) 5781 0931Fax +81 (3) 5781 0940E-Mail [email protected]
TAIWAN
AIXTRON Taiwan Co., Ltd.Phone +886 (3) 571 2678Fax +886 (3) 571 2738E-Mail [email protected]
AIX R6
AIX R6 Process Control
LayTec Inside TTC
Dynamic Topside Temperature Control (TTC)
Eliminates temperature variation for increased reproducibility and yield
Enables shorter cycle time
Fast calibration by LayTec AbsoluT
LayTec MiniR / MiniRC
MiniR: refl ectance at 405 nm and 635 nm
MiniRC: adds optional high resolution wafer curvature mapping
Pyro400: adds optional 400 nm pyrometry
Modular layout, high data rate
3 x MiniR4 x TTC
DEPOSITION SYSTEMS FOR COMPOUND SEMICONDUCTORS
AIX R6 Metal Organic Chemical Vapor Deposition
CHINA
AIXTRON China Ltd.Phone +86 (21) 6445 3226Fax +86 (21) 6445 3742E-Mail [email protected]
KOREA
AIXTRON Korea Co., Ltd.Phone +82 (31) 783 2220Fax +82 (31) 783 4497E-Mail [email protected]
UNITED KINGDOM
AIXTRON Ltd.Phone +44 (1223) 519 444Fax +44 (1223) 519 888E-Mail [email protected]
GERMANY
AIXTRON SEPhone +49 (2407) 9030-0Fax +49 (2407) 9030-40E-Mail [email protected]
SWEDEN
AIXTRON ABPhone +46 (46) 286 8980Fax +46 (46) 286 8989E-Mail [email protected]
USA
AIXTRON Inc.Phone +1 (408) 747 7140Fax +1 (408) 752 0173E-Mail [email protected]
www.aixtron.comJAPAN
AIXTRON K.K.Phone +81 (3) 5781 0931Fax +81 (3) 5781 0940E-Mail [email protected]
TAIWAN
AIXTRON Taiwan Co., Ltd.Phone +886 (3) 571 2678Fax +886 (3) 571 2738E-Mail [email protected]
AIX R6
AIX R6 Process Control
LayTec Inside TTC
Dynamic Topside Temperature Control (TTC)
Eliminates temperature variation for increased reproducibility and yield
Enables shorter cycle time
Fast calibration by LayTec AbsoluT
LayTec MiniR / MiniRC
MiniR: refl ectance at 405 nm and 635 nm
MiniRC: adds optional high resolution wafer curvature mapping
Pyro400: adds optional 400 nm pyrometry
Modular layout, high data rate
3 x MiniR4 x TTC
METAL ORGANIC CHEMICAL VAPOR DEPOSITION
AIX R6
AIX R6
Product Overview
Automated carrier load and unload at high temperature
Continuous runs without maintenance
LayTec process control
Fast temperature cycles
User friendly operator interface
AIX R6
New Features
The new Close Coupled Showerhead MOCVD system fulfi lls your requirements for LED mass manufacturing. Equipped with numerous technical innovations the system enhances your competitiveness.
AIX R6 – 6 commitments to customer performance
Framework for LED production
Systematically lowest Cost of Ownership
Large reactor capacity 121x2 inch, 31x4 inch and 12x6 inch
Maximized throughput- Automation- Continuous runs- Reliability and uptime
Intrinsic yield and uniformity
Focus on user friendliness
User interface
Operator interface
Unmatched precursor effi ciency Intrinsic uniformity Dynamic process chamber height adjustment Wide process window
AIX R6
Typical Showerhead Technology
Reactor module
Transfer module
AIX R6
Cost of Ownership
AIX R6 is your fast route to outperform the CoO benchmark
Labor cost / Wafer
Fab cost / Wafer
Capital cost / Wafer
Chemical cost / Wafer
Dominant factors addressed with AIX R6
Throughput increase
Chemical cost decrease
Consumable cost decrease
Contact our local offi ce to experience your CoO benefi t
Consumables cost / Wafer
DEPOSITION SYSTEMS FOR COMPOUND SEMICONDUCTORS
AIX R6 Metal Organic Chemical Vapor Deposition
CHINA
AIXTRON China Ltd.Phone +86 (21) 6445 3226Fax +86 (21) 6445 3742E-Mail [email protected]
KOREA
AIXTRON Korea Co., Ltd.Phone +82 (31) 783 2220Fax +82 (31) 783 4497E-Mail [email protected]
UNITED KINGDOM
AIXTRON Ltd.Phone +44 (1223) 519 444Fax +44 (1223) 519 888E-Mail [email protected]
GERMANY
AIXTRON SEPhone +49 (2407) 9030-0Fax +49 (2407) 9030-40E-Mail [email protected]
SWEDEN
AIXTRON ABPhone +46 (46) 286 8980Fax +46 (46) 286 8989E-Mail [email protected]
USA
AIXTRON Inc.Phone +1 (408) 747 7140Fax +1 (408) 752 0173E-Mail [email protected]
www.aixtron.comJAPAN
AIXTRON K.K.Phone +81 (3) 5781 0931Fax +81 (3) 5781 0940E-Mail [email protected]
TAIWAN
AIXTRON Taiwan Co., Ltd.Phone +886 (3) 571 2678Fax +886 (3) 571 2738E-Mail [email protected]
AIX R6
AIX R6 Process Control
LayTec Inside TTC
Dynamic Topside Temperature Control (TTC)
Eliminates temperature variation for increased reproducibility and yield
Enables shorter cycle time
Fast calibration by LayTec AbsoluT
LayTec MiniR / MiniRC
MiniR: refl ectance at 405 nm and 635 nm
MiniRC: adds optional high resolution wafer curvature mapping
Pyro400: adds optional 400 nm pyrometry
Modular layout, high data rate
3 x MiniR4 x TTC