Low voiding with CVP-390 Solder Paste ALPHA ® CVP-390 Lead-Free, Zero Halogen* Solder Paste delivers low voiding, excellent first pass ICT pin test yields and excellent electrical reliability for fine feature printing challenges. ALPHA ® CVP-390 also delivers: • Outstanding reflow process window, capable of 175-180°C soak for 60 seconds • Coalescence on 180μm paste deposit sizes • Reduced head in pillow defects • Exceeds IPC 7905 Class III Voids for soak profile and low voiding on large areas deposits • Compatible with both SAC305 and SACX Plus ® alloys. Low-Ag alloys provide better drop shock vs. high-Ag alloys. High voiding with competitor solder paste Pad A 1200 1000 800 600 400 200 0 Pad B Pad C Leading Paste Number of hits <10 ohm ALPHA ® CVP-390 Pad D Pad A Pad B Pad C Pad D Pin Test Yield ALPHA ® CVP-390 LEAD-FREE, ZERO HALOGEN* SOLDER PASTE * Zero Halogen is defined as no halogen intentionally added to the formulation. HIGHER YIELDS TOUGHER ELECTRONIC ASSEMBLIES LONG-TERM RELIABILITY
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Low voiding with CVP-390 Solder Paste
ALPHA® CVP-390 Lead-Free, Zero Halogen* Solder Paste delivers low voiding, excellent fi rst pass ICT pin test yields and excellent electrical reliability for fi ne feature printing challenges. ALPHA® CVP-390 also delivers:• Outstanding refl ow process window,
capable of 175-180°C soak for 60 seconds
• Coalescence on 180µm paste deposit sizes
• Reduced head in pillow defects
• Exceeds IPC 7905 Class III Voids for soak pro fi le and low voiding on large areas deposits
• Compatible with both SAC305 and SACX Plus® alloys. Low-Ag alloys provide better drop shock vs. high-Ag alloys.
High voiding with competitor solder paste
Pad A
1200
1000
800
600
400
200
0Pad B Pad C
Leading Paste
Num
ber
of
hits
<10
ohm
ALPHA® CVP-390
Pad D Pad A Pad B Pad C Pad D
Pin Test Yield
ALPHA® CVP-390 LEAD-FREE, ZERO HALOGEN* SOLDER PASTE
* Zero Halogen is defi ned as no halogen intentionally added to the formulation.
HIGHERYIELDS
TOUGHERELECTRONICASSEMBLIESELECTRONICASSEMBLIES
LONG-TERM RELIABILITY
Global Headquarters300 Atrium Drive Somerset, NJ 08873 USATel: +1-814-946-1611
European HeadquartersUnit 2, Genesis Business ParkAlbert Drive, Woking, Surrey, GU21 5RWUKTel: +44 (0) 1483 758400
Asia/Pacifi c8/F, Paul Y. Centre, 51 Hung To RoadKwun Tong, KowloonHong KongTel: 852-3190-3100
AlphaAssembly.com
PERFORMANCE SUMMARY
PROCESS BENEFIT CVP-390 PROPERTY PERFORMANCE CAPABILITY
Print Process Window
Fine feature print defi nition
Excellent print defi nition and consistent volumetric performance to 0.3mm (12 mil)• down to 180µm (8mil) diameter• 0.4mm (16mil) pitch QFP• Min area ratio of 6
Temperature window Capable of printing in temperatures form 20-32°C (68-90°F)
Tack/stencil life Long tack and stencil life
Print speed range Wide process window from 25-150mm/sec (1-6”/sec)
Refl ow Yield
Peak refl ow temperature 235 to 245°C (optimal recommended: <240°C)
Resistance to voids Meet IPC 7905 Class III requirements
Resistance to cold and hot slump Preferable J-STD-004A and JIS Level 2
Flux residue cosmetics Clear
Solder spread 80%
Random solderballs Preferable J-STD-004A and JIS Level 2
Flux residue characteristics Pin testable and pass JIS Cu corrosion test
Electrical Reliability
SIR Meets/exceeds JIS, J-STD-004B and Bellcore requirements
Environmental Halogen content Zero halogen, no halogen intentionally added
For more information about ALPHA® CVP-390 Lead-Free, Zero Halogen Solder Paste, please contact your Alpha Representative.
9990
8070 6050403020
105
32
1
0.1
SACX® Plus 305 Paste
Per
cent
0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Drop Shock Failure PerformanceSACX Plus® vs. 305 Paste
ALPHA® CVP-390 Lead-Free, Zero Halogen* Solder Paste delivers low voiding, excellent fi rst pass ICT pin test yields and excellent electrical reliability for fi ne feature printing challenges.
ALPHA® CVP-390 LEAD-FREE, ZERO HALOGEN* SOLDER PASTE
