Amphenol M.2(NGFF) Connector Brochure

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Amphenol M.2(NGFF) Connector Brochure

M.2


M.2(NGFF) Introduction

The M.2 form factor is used for Mobile Add-In cards. It is a natural transition from the Mini Card and Half Mini Card to a smaller form factor both in size and volume.

M.2 (NGFF) supports multiple functions.


M.2 Connector Description:75 positions (67 active lines with 8 positions dedicated to mechanical keying)Single and Dual Mechanical keying allows for multiple standardsTwo rows of contacts @ 0.50mm pitch; bottom row staggered 0.25mm from top rowSupports multiple standard card widths (12mm, 16mm, 22mm and 30mm)Supports multiple standard card lengths (16mm, 26mm, 30mm, 38mm, 42mm, 60mm, 80mm and 110mm)

M.2 Module Description:M.2 specification standardizes multiple module sizes

• Allows for Single- or Dual-sided Components on modules• Allows for Connectorized or Soldered-Down modules

Will support multiple function add-in cards/modules• SATA or PCIe x2 fits “B” key for SSD, WWAN, other non-storage devices• PCIe x4 up to 4GB/s fitting “M” key modules for high performance SSD

M.2(NGFF) Introduction


M.2(NGFF) Application Fields

Smart TV

Server

Smart Networking

Tablet

PC/Ultrabook

Mobile Phone

GNNS/BT


M.2 Modular Card Overview

What type of Cards & applications use key A, E, B, M?Key Module Card Type Application

A 1630, 2230, 3030 Wireless: Wi-Fi,BT, NFC, & or WiGig

E 1630, 2230, 3030, Wireless: Wi-Fi,BT, NFC, & or GNSS

B 3042, 2230, 2242, 2260, 2280, 22110 WWAN+GNSS or SSD

M 2242, 2260, 2280, 22110 SSD, PCIe or SATA

Key G is designed for Non-M.2 compliant devices and future Memory interface.


M.2 Modular Card Overview

NOTE: KEY OPTION IS A REPRESENTATION ONLYAND DOES NOT PROHIBIT ADDITION OPTIONS

GENERAL TOLERANCE IS ± 0.15

TYPE 1630-xx-E

TOP SIDECOMPONENT

AREA

16.5

30

TYPE 3026-X

TOP SIDECOMPONENT

AREA

30

26

TYPE 2226-X

TOP SIDECOMPONENT

AREA

22

26

TYPE 1216-X

TOP SIDECOMPONENTAREA

12

16

TYPE 2230-xx-E

TOP SIDECOMPONENT

AREA

22

30

TYPE 3030-xx-A

TOP SIDECOMPONENT

AREA

30

30

TYPE 2242-xx-B-M

TOP SIDECOMPONENT

AREA

TOP SIDECOMPONENT

AREA

22

42

TYPE 3042-xx-B

TOP SIDECOMPONENT

AREA

30

42

TYPE 2260-xx-M

TOP SIDECOMPONENT

AREA

22

60

TYPE 2280-xx-B-M

TOP SIDECOMPONENT

AREA

22

80

22

110

TOP SIDECOMPONENT

AREA

TYPE 22110-xx-B-M


M.2 (NGFF) – Keying Configurations

MechanicalKey Assignment

Preferred & Optional Module Configurations


M.2(NGFF) Connector/ Module Supported Matrix


M.2 Module Card / Connector Height Recommendation

Mid Line Connector Height

Mid Line Single Sided Module

Mid Line Double Sided Module

4.2/ 3.2 / 2.8 H

Top Side Connector Height

Single Sided Module

2.5 / 2.3 H

Unit: mm

Double Sided ModuleTop Side

Bottom Side


M.2(NGFF) Connector Parametric Specifications






M.2(NGFF) Connector Triple Insertion Module Method

Step 1: Move the module against the housing's chamber

Step 2: Rotate the module to 20 degrees and insert it until the bottom of the connector

Step 3: Rotate the module to horizontal position by hand

Step 4: Fix the module with a PCB screw to secure the module


M.2(NGFF) Connector Module Fix

Stand-off

Screw


Amphenol M.2(NGFF) Connector P/N System

M D T XXX X XX XXX

XXX

Connector height

420 H=4.20 mm

275 H=2.75 mm

180 H=1.80 mm

…

X Connector key ID

A: key A

B: key B

E: key E

M: key M

…

XxPlating Spec

01 0.76 um Au

02 0.38 um Au

03 Gold flash

XXX

Sequence number

001

002

…

Series Code


M.2(NGFF) Connector Signal Integrity Measurement Results

1: Introduction This technical bulletin presents measured electrical performance data on

67pin M.2 PCIe connector using frequency domain vector network analyzer (VNA) and time domain reflectometer (TDR) test equipment. Measured parameters include calibrated S-parameters and TDR reflections due to impedance mismatch.

Measurement SetupFreq domain test equipment: Agilent N5230C 4-port VNAFreq domain test frequency range: 10MHz—20GHz (2000 points).Time domain test equipment: Tektronix DSA8200 with 80E04 module.Time domain test rise time: 50ps(20-80%).

Measurement Calibrationmethod: TRL calibration to the end of PCB Microstrip(De-embedding).

The calibration helps to remove the test fixture effects.Test results only included 67pin M.2 PCIe Connector with thefootprint and few PCB trace(0.7mm).

All S-parameter test results Re-normalized to 85ohm reference impedance.


2. High Speed Signal Assignment

Top layerpins row(pin1~67)

Bottom layerpins row(pin2~66)

Pin33GND

Pin35&37Diff Pair

Pin39GND

Pin41&43Diff Pair

Pin45GND

Pin32GND

Pin34&36Diff Pair

Pin38GND

Pin40&42Diff Pair

Pin44GND

Top layer pins row

Bottom layer pins row



3. Test Fixture PCB Layout

Notes:Microstrip length each is 40mm onboth motherboard and daughtercard.Microstrip substrate material is FR4,the DK is 4.2 and DF is 0.02.

Motherboard Daughtercard



4. DUT

Calibration Board for De-embeddingM.2 PCIe connector SI test fixture



5. Differential Return Loss

0 2 4 6 8 10 12 14 16 18 20-40

-35

-30

-25

-20

-15

-10

-5

0

frequency GHz

Mag

nitu

de in

dB

Differential Reflection

Top Layer Pins Row: MB SideTop Layer Pins Row: DC SideBottom Layer Pins Row: MB SideBottom Layer Pins Row: DC SideSignal Integrity Spec Rev1.0



6. Differential Insertion Loss

0 2 4 6 8 10 12 14 16 18 20-10

-9

-8

-7

-6

-5

-4

-3

-2

-1

0

frequency GHz

Mag

nitu

de in

dB

Differential Transmission

Top Layer Pins RowBottom Layer Pins RowSignal Integrity Spec Rev1.0



7. Differential NEXT

0 2 4 6 8 10 12 14 16 18 20-60

-50

-40

-30

-20

-10

0

frequency GHz

Mag

nitu

de in

dB

Differential Near end Crosstalk

In Top Layer Pins Row: MB SideIn Top Layer Pins Row: DC SideIn Bottom Layer Pins Row: MB SideIn Bottom Layer Pins Row: DC SideTop Layer to Bottom Layer: MB SideTop Layer to Bottom Layer: DC SideSignal Integrity Spec Rev1.0



8. Differential FEXT

0 2 4 6 8 10 12 14 16 18 20-60

-50

-40

-30

-20

-10

0

frequency GHz

Mag

nitu

de in

dB

Differential Far end Crosstalk

In Top Layer Pins Row: MB Side VictimIn Top Layer Pins Row: DC Side VictimIn Bottom Layer Pins Row: MB Side VictimIn Bottom Layer Pins Row: DC Side VictimTop Layer to Bottom Layer: MB Side VictimTop Layer to Bottom Layer: DC Side VictimSignal Integrity Spec Rev1.0



9. Differential Impedance

45.4 45.6 45.8 46 46.2 46.4 46.6 46.870

75

80

85

90

95

100

105Top Layer Pin35&37 Differential TDR @ Rise Time=50ps(20-80%)

Time (ns)

ohm

MotherBoard to DaughterCardDaughterCard to MotherBoard

Coaxial cable

SMA

PCB Trace

M.2 Connector

PCB Trace

Load

45.4 45.6 45.8 46 46.2 46.4 46.6 46.870

75

80

85

90

95

100

105Bottom Layer Pin34&36 Differential TDR @ Rise Time=50ps(20-80%)

Time (ns)

ohm

MotherBoard to DaughterCardDaughterCard to MotherBoard

Coaxial cable

SMA

PCB Trace

PCB Trace

M.2 Connector

Load

Impedance results met requirement of 85ohm connection system.



Amphenol M.2(NGFF) Connectors

M1.8, H2.8, H4.2 key ID A, B, E, M have been tooled up, drawings please refer to right side pdfs:

H2.8

H4.2

M1.8


M.2(NGFF) Connectors in board


• M.2 key A connector is suitable for applications that use wireless connectivity including Wi-Fi,

Bluetooth, NFC, and WiGig. Module card types include 1630, 2230 and 3030.

• M.2 key B connector is suitable for applications that use WWAN+GNSS or Solid State Storage

Devices (SSD). Module card types include 3042, 2230, 2242, 2260, 2280 and 22110.

• M.2 key E connector is suitable for applications that use wireless connectivity including Wi-Fi,

Bluetooth, NFC of GNSS. Module card types include 1630, 2230 and 3030.

• M.2 key M connector is suitable for applications that use Host I/Fs supported by either PCIe or

SATA, or Solid State Storage Devices (SSD). Module card types include 2242, 2260, 2280

Amphenol M.2(NGFF) Connectors - Key applications


SSD Storage Interface Roadmap

M.2 is the future!


Date post:	26-Nov-2021
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Amphenol M.2(NGFF) Connector Brochure

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