11

An Overview of US Display An Overview of US Display Consortium Activity in Flexible Consortium Activity in Flexible

and Printed Electronicsand Printed Electronics

Mark HartneyMark HartneyCTO, USDCCTO, USDC

IMAPS SymposiumIMAPS SymposiumSan Jose, CASan Jose, CA

November 15, 2007November 15, 2007

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ABOUT USDCABOUT USDC

NonNon--profit, Chartered in 1993profit, Chartered in 1993Industry consortium focused on preIndustry consortium focused on pre--competitive competitive R&D for the flat panel display (FPD) and flexible R&D for the flat panel display (FPD) and flexible microelectronics industriesmicroelectronics industries110 companies form the USDC with federal support from 110 companies form the USDC with federal support from the U.S. Army Research Laboratory (ARL) the U.S. Army Research Laboratory (ARL)

Display developers and manufacturersEquipment, materials and component suppliersDisplay integrators

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USDC’s MISSIONThe The missionmission of the USDC is to support member of the USDC is to support member companies and affiliates to companies and affiliates to build a world class, build a world class, competitive, display industrycompetitive, display industry..

USDC accomplishes this mission by USDC accomplishes this mission by supporting presupporting pre--competitive R&Dcompetitive R&D for our member companies, providing for our member companies, providing timely market and technical information, and forming timely market and technical information, and forming user groups with common goals.user groups with common goals.

Programs are Programs are directed toward the supply chain:directed toward the supply chain:equipment, materials & manufacturing technologies.equipment, materials & manufacturing technologies.

44

•

USDC TECHNICAL PROGRAM SCOPE

USDCUSDC’’s recent projects enhance manufacturing capability for:s recent projects enhance manufacturing capability for:Flexible substrate technologyFlexible substrate technology--tools tools Flexible substrate technologyFlexible substrate technology--materialsmaterialsOrganic light emitting diodes (OLEDs)Organic light emitting diodes (OLEDs)

All three tiers of industry are represented in consortium activiAll three tiers of industry are represented in consortium activitytydisplay usersdisplay usersdisplay manufacturers display manufacturers equipment, materials and components suppliersequipment, materials and components suppliers

Technical Program awards are costTechnical Program awards are cost--shared with the selected company shared with the selected company at a minimum of a 50/50 level at a minimum of a 50/50 level

Over $250M in development activity funded through this program tOver $250M in development activity funded through this program to o datedate

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ANNUAL EVENTS7th Annual Flexible

Microelectronics and Displays Conference Phoenix, AZ, January 21-24, 2008Objective:

Present the latest developments in technology and product applications Identifies technology gaps Constructs roadmaps, andProposes key technology development activities.

*NEW! 3-D Biz-ExSan Francisco, CA, September 18-19,2007Objective:

Address common industry needsPresent latest industry data (Insight Media)Latest innovations

Proceedings available from USDC

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41 Active R&D Projects - 62% Industry Cost Share

43%

40%

4%12% 1%

Specific Materials &Components / OLEDs

Flex Substrate Processing

Proj. & Microdisplay Tools& Components

Military User Group

Industry Data & Studies

USDC TECHNICAL PROGRAM SUMMARY

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R2R sputter sourceR2R sputter source$0.6M$0.6MCompleteCompleteKurt LeskerKurt Lesker

Organic passivation dielectricOrganic passivation dielectric$1.0M$1.0MUnderwayUnderwayHoneywellHoneywell

Linear area gate dielectric source & Linear area gate dielectric source & demonstrationdemonstration

$5.0M$5.0MCompleteCompleteSenceraSencera

Stainless Steel substrates for OLEDStainless Steel substrates for OLED$0.6M$0.6MCompleteCompleteECDECD

Flex substrate lamination adhesivesFlex substrate lamination adhesives$0.5M$0.5MUnderwayUnderwayNational National StarchStarch

Metallic powders for ink jetMetallic powders for ink jet$2.5M$2.5MUnderwayUnderwayCabotCabot

DescriptionCost*StatusCompany

$1.8M$1.8M

$0.7M$0.7M

HIL material develop & scaleHIL material develop & scale--upupCompleteCompleteDow Dow CorningCorning

HIL material develop & scaleHIL material develop & scale--upupCompleteCompletePlextronicsPlextronics

MATERIALS – SAMPLE OF USDC PROJECTS

FDC

FDC

FDC

CA

MM

FDC

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PROCESS – SAMPLE OF USDC PROJECTS

R2R Patterned conductive layersR2R Patterned conductive layers$1.0M$1.0MCompleteCompleteMicrocontinMicrocontinuumuum

R2R factory layout & cost modelR2R factory layout & cost model$0.2M$0.2MCompleteCompleteAbbie Abbie GreggGregg

DescriptionCost*StatusCompany

$1.7M$1.7M

$2.8M$2.8M

High Temp TFT on Clear PlasticHigh Temp TFT on Clear PlasticUnderwayUnderwayPrincetonPrinceton

SAIL process development SAIL process development UnderwayUnderwayHPHP

FDC

CA

MM

CA

MM

CA

MM

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METROLOGY –SAMPLE OF USDC

PROJECTS

R2R defect inspection toolR2R defect inspection tool$1.3M$1.3MUnderwayUnderwayECDECD

High Temperature WV Permeation High Temperature WV Permeation MeasurementMeasurement

$0.7M$0.7MCompleteCompleteGeneral General AtomicsAtomics

Demonstrate high sensitivity O2 Demonstrate high sensitivity O2 permeation measurement permeation measurement capabilitycapability

$0.3M$0.3MCompleteCompleteDukeDuke

DescriptionDescriptionCost*Cost*StatusStatusCompanyCompany

CA

MM

1010

Install USDC tool set at CAMMInstall USDC tool set at CAMM$3.8M$3.8MUnderwayUnderwayBinghamton Binghamton UniversityUniversity

Production scale, precision ink Production scale, precision ink jet printing system & materialsjet printing system & materials

$5.7M$5.7MCompleteCompleteLitrex,Spectra, Litrex,Spectra, AveciaAvecia

aa--Si Laser crystallizationSi Laser crystallization$3.8M$3.8MCompleteCompletePotomac Potomac PhotonicsPhotonics

Laser cutting toolLaser cutting tool$0.61$0.61CompleteCompleteApplied Applied PhotonicsPhotonics

Lithography aligner for webLithography aligner for web--based mfg. on plasticbased mfg. on plastic

$4.1M$4.1MUnderwayUnderwayAzoresAzores

Web coating platformWeb coating platform$6M$6MUnderwayUnderwayCHACHA

DescriptionCost*StatusCompany

EQUIPMENT – SAMPLE OF USDC PROJECTS

FDC

CA

MM

CA

MM

FDC

CA

MM

FDC

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Why RollWhy Roll--toto--Roll Manufacturing?Roll Manufacturing?

Supply Roll Take-Up Roll

Thin Film Deposition& Laser Processing Photolithography

Supply Roll Take-Up Roll

Wet ChemicalEtching & Cleaning

CoolingDrumLaser

R2R can lead to reductions in cost.R2R can enable new applications:

Inexpensive displaysLarge area displaysLow cost RFIDRemote sensors for military and commercial “Smart” fabricsLarge area lighting

Azores Photolithography

CHA High Vacuum Coater

Northfield R2R Handlers

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SelfSelf--Aligned Imprint LithographyAligned Imprint Lithography

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Princeton Princeton –– DuPont ProgramDuPont Program

•Higher Temperature Plastic Substrates

•Better transparency for visible spectrum

•Process optimization for a-Si TFTs

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Sigma Sigma -- NanoflakesNanoflakes

Novel approach to nanomaterials

Produces thin flakes of conductive material

Goal is to achieve high conductivity without losing optical transparency

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USDC Initiative onUSDC Initiative onFlexible, Large Area Electronics:Flexible, Large Area Electronics:

Transformational Technology Transformational Technology for Life Systemsfor Life Systems

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Flexible Large Area Electronics on the Flexible Large Area Electronics on the Human ScaleHuman Scale

The goal:The goal: produce high performance materials and devicesproduce high performance materials and devicesusing low cost manufacturing processesusing low cost manufacturing processes

MATERIALS

DEVICES

APPLICATIONS

Ubiquitous electronics on large sheets of plastic or other materials integrated into textiles, internal and external surfaces,

health care and consumer products

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Trends In Electronics SystemsTrends In Electronics Systems

Electronics products are Electronics products are becoming larger becoming larger –– no longer just no longer just ““micromicro”” or or ““nanonano””

Performance requirements Performance requirements (ruggedness, low(ruggedness, low--weight, power weight, power savings, shape) demand that savings, shape) demand that products be products be flexible and flexible and deformabledeformable

Transistors on plastictransparent substrate

(Penn State University)

Flexible solar cells on ultra-thin steel foil(Energy Conversion Devices)

Millions of transistors made on glass surface to control

display pixels

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Printed Electronics - TodayPrinted circuitryPrinted circuitry

ScreenScreenStencilStencil

Printed solder interconnectsPrinted solder interconnectsScreenScreenStencilStencilMicroMicro--dispensingdispensingJettingJetting

Microelectronics encapsulation Microelectronics encapsulation and flux dispensingand flux dispensing

MicroMicro--dispensingdispensingJettingJetting

Printed Flex Circuitry

Solder Interconnects

Encapsulation and Fluxing

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2424

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Intel 4044 ProcessorIntel 4044 Processor

Image courtesy: Intel website

• Introduced in Nov, 1971 • 2300 transistors• 10µm channel length• Composed of 5 layers• Four-bit microprocessor,

• Four-bit adder for doing additions• An accumulator for keeping track of partial sums• 16 registers for temporary storage

Image courtesy: Technologyevalngelist.com

Image courtesy: Intel website

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Circuit Performance Circuit Performance Semi Ink Mobility vs. Device FeaturesSemi Ink Mobility vs. Device Features

0.1

10

1000

10 5

10 7

10 9

10 -5 0.0001 0.001 0.01 0.1 1 10

Freq

uenc

y (H

z)

Mobility (cm2/V-s)

L= 50 um

L=100 um

L=10 um

L=1 um

FET Channel Dimensions

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Printed Electronics - TomorrowPrinted Energy Sources

Printed energy sourcesPrinted energy sourcesScreen Screen Flexo Flexo LithoLitho

Printed displaysPrinted displaysScreen Screen InkjetInkjetLaser induced forward Laser induced forward transfertransfer

Printed lightingPrinted lightingScreenScreen

Printed RFID antennaPrinted RFID antennaScreenScreenFlexoFlexoLithoLitho

Printed Lighting Printed RFID Antenna

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Convergence of Two WorldsConvergence of Two WorldsBirth of a New IndustryBirth of a New Industry

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Flexible Large Area Electronics on the Flexible Large Area Electronics on the Human ScaleHuman Scale

MaterialsNon-Crystalline MaterialsNanomaterialsFlexible substrates

Devices/Integration

MembranesSensors/DetectorsThin-film transistors

ProductsSmart Bandages & ClothingNeuro Prosthetic DevicesSensor Networks Solar Cells

ProcessesR2R Manufacturing Printing and PatterningPolymer/Organic Synthesis

MarketsMilitary/First RespondersMedicalAgriculture/Civil InfrastructureEnergy

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USDC Project SolicitationUSDC Project Solicitation2008 solicitation will be published this week 2008 solicitation will be published this week ––see our website www.see our website www.usdcusdc.org.org

White papers are due January 11, 2008White papers are due January 11, 2008Open on any topic, but specifies some topics of Open on any topic, but specifies some topics of interest to member companies, including:interest to member companies, including:

Web based multi-layer alignment tools and processing

• Web based coating and patterning technologies

• Non-lithographic patterning technology for roll to roll substrates

• In-line characterization tools

• Deposition and etch process for roll to roll.

• Flexible functional transparent films

• Stretchable Electronics Technologies

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Contact PointsContact Pointswww.www.usdcusdc.org.org

www.fpoelectronics.orgwww.fpoelectronics.org

Flexible Electronics and Display Conference,Flexible Electronics and Display Conference,Phoenix, AZPhoenix, AZ

Jan 21Jan 21--24, 200824, 2008