1 / 15 2021-01-15 | Document No.: AN139 www.osram-os.com Application Note OSCONIQ ® S product application note Abstract OSCONIQ ® S are new mid-power LEDs from OSRAM Opto Semiconductors for state-of-the-art professional requirements in a wide variety of general lighting applications ranging from shops, homes, industrial to hospitality, office spaces, outdoor and much more that are characterized by a long lifetime, high performance and best-in-class reliability. OSCONIQ ® S provides flexibility in forward voltage and luminous flux with a high lifetime even at high temperatures. In this application note presents a basic overview of the design and LED characteristic. In addition, the appropriate assembly, handling and solder pad design are recommended to enable great application design. Valid for: OSCONIQ ® S 3030 OSCONIQ ® S 5050 Author: Retsch Stefanie / Neoh Shau Yan Further information: For more detailed information and the latest product update visit www.osram.com/os or contact your local sales office to get technical assistance during the design-in phase. Application Note No. AN139
Transcript
1 / 152021-01-15 | Document No.: AN139
www.osram-os.com
Application Note
OSCONIQ® S product application note
Abstract
OSCONIQ® S are new mid-power LEDs from OSRAM OptoSemiconductors for state-of-the-art professional requirementsin a wide variety of general lighting applications ranging fromshops, homes, industrial to hospitality, office spaces, outdoorand much more that are characterized by a long lifetime, highperformance and best-in-class reliability. OSCONIQ® Sprovides flexibility in forward voltage and luminous flux with ahigh lifetime even at high temperatures. In this application notepresents a basic overview of the design and LED characteristic.In addition, the appropriate assembly, handling and solder pad design are recommendedto enable great application design.
Valid for:OSCONIQ® S 3030OSCONIQ® S 5050
Author: Retsch Stefanie / Neoh Shau Yan
Further information:For more detailed information and the latest product update visit www.osram.com/os or contactyour local sales office to get technical assistance during the design-in phase.
F. Application support and services ..........................................................................14
Premium Application Support Services ............................................................14
My Luminator ....................................................................................................14
A. Overview of OSCONIQ® S
The OSCONIQ® S product family comes with a standard footprint and is theideal choice for professional indoor and outdoor general lighting applicationssuch as shop, office, architectural and industrial lighting. Figure 1 and Figure 2shows the OSCONIQ® S 3030 and S 5050.
2 / 152021-01-15 | Document No.: AN139
www.osram-os.com
Figure 1: OSCONIQ® S 3030
Figure 2: OSCONIQ® S 5050
B. Features and design
The OSCONIQ® S with its EMC (epoxy molding compound) lead frame materialprovides far better lifetime and reliability performance than traditional PPA andPCT materials. An optimized phosphor, lead frame and chip design lift the LEDsto a new level of performance.
Figure 3: Design of OSCONIQ® S 3030
Figure 4: Design of OSCONIQ® S 5050
Cathode
Anode
Cathode
Anode
3 / 152021-01-15 | Document No.: AN139
www.osram-os.com
The LED has low thermal resistance and superior corrosion robustness. As thereis ESD protection included in the LED, which is able to withstand voltages of upto 8 kV, it is assigned to the category “ESD sensitive device” according to ANSI/ESDA /JEDEC JS-001 — HBM, Class 3B.
Apart from this, the OSCONIQ® S fulfills the current RoHS guidelines (EuropeanUnion and China), and therefore contains no lead or other hazardoussubstances.
C. Design considerations
Mechanical and optical design resources
Package outline: Refer to data sheet
To obtain CAD data and optical Rayfile, please visit here.
For more information on importing rayfiles and ray-measurement files of LEDsfrom OSRAM Opto Semiconductors, please click here.
Electrical connection
OSCONIQ® S consists of two electrical pads on the package: anode andcathode. Therefore the clearance and creepage distance between the traces iscritical to avoid flash-over or tracking between these electrical conductors.
There are absolute maximum electrical rated values that are specified in the datasheet and each device must be operated below the maximum rated values inorder to ensure its proper and reliable function.
Figure 5: PCB layout of single OSCONIQ® S 3030 LED on MCPCB
Figure 6: PCB layout of single OSCONIQ® S 5050 LED on MCPCB
The thermal measurement needs to be performed right next to the LED which isthe measuring point temperature, Tmp as shown in Figure 7 and Figure 8.
Figure 7: Measuring point temperature, Tmp for OSCONIQ® S 3030
Figure 8: Measuring point temperature, Tmp for OSCONIQ® S 5050
The Tmp of a predetermined location on the PCB in close contact to theOSCONIQ® S is measured by a thermocouple. Therefore, a thermally conductiveepoxy or solder is recommended to ensure good heat transfer from the board tothe thermocouple. The thermocouple must be in direct contact with the copperthermal pad, i.e. any solder mask must be removed first before mounting thethermocouple onto the PCB copper pad.
Table 1 and Table 2 summarizes the thermal resistance values of the board andalso Tj to Tmp between the various PCB designs and technologies.
Table 1: Simulation result for OSCONIQ® S 3030 Rth with various dielectrics and copper foils
Table 2: Simulation result for OSCONIQ® S 5050 Rth with various dielectrics and copper foils
Figure 9: Rth Network for OSCONIQ® S
The typical thermal resistance Rth jmp between the junction and the measuringpoint for the OSCONIQ® S can be obtained from Table 1 and Table 2. With thisinformation, the junction temperature, Tj can be calculated according to thefollowing equation:
Where:
Tj is the junction temperature of the LED, °C
Tmp is the measuring point temperature on the PCB, °C
Table 1: Simulation result for OSCONIQ® S 3030 Rth with various dielectrics and copper foils
PCB technology Details Cu foilRth sb el (K/W)
Rth jmp el (K/W)
Ts
Tb
Tj
TmpRth sb el
Rth jmp el
Tj Tmp If Vf Rthjmp+=
6 / 152021-01-15 | Document No.: AN139
www.osram-os.com
Vf is the forward voltage of the system, V
Rth jmp el is the thermal resistance of the LED according to the data sheet, K/W
Chemical considerations
OSCONIQ® S stands out due to its superior corrosion robustness. However, theLED’s optical performance and stability may be affected by the presence ofundesired chemical conditions, arising from incompatible materials used for thepurpose of potting, coating, soldering, adhesion, etc. in a luminaire design.
When selecting material from the supplier it should always be taken intoconsideration that the materials are compatible with the LEDs used, particularlyin the luminaire system assembly, in order to prevent the LEDs from coming intocontact with incompatible chemicals.
It is highly recommended to avoid air-tight designs in order to allow any potentialform of chemical out-gassing to escape.
For further information please refer to the application notes “Chemicalcompatibility of LED” and “Preventing LED failure caused by corrosivematerials”.
D. Assembly & processing
Handling precautions
Following the general guidelines on the handling of LEDs, additional care shouldbe taken to minimize mechanical stress on the silicon encapsulation (see alsoapplication note “Handling of silicone resin LEDs”)
In general, all types of sharp objects (e.g. forceps, fingernails, etc.) should beavoided to prevent damage to the encapsulation, which could lead to thespontaneous failure of the LED.
For manual handling of the component, the use of vacuum tweezers isrecommended. The effective mechanical stress on the LED is minimized bymeans of soft rubber suction tips. The vacuum stylus functions in such a waythat a vacuum is created by pushing the button, similar to vacuum tweezers, withwhich the component (e.g. the LED) can be lifted
Figure 10: Examples of vacuum styluses for pick and place
If there is no alternative to the exceptional use of tweezers (anti-static), the LEDmust be picked and handled only at the epoxy mold compound.
Figure 11: Manual handling of LED
Pick and place
To avoid any damage during the pick-and-place process, the processparameters should conform to the package characteristics. The default settingsof the machine may be a good starting point. The placement force, for example,can be tested with 2.0 N at the beginning, but should be less than 2.0 N ifpossible. When placing the LED, the forces should be applied evenly over theentire area of the lens.
During machine setup, ensure to teach the camera the package image beforecontinue the pick and place process.
Figure 12: Package image of OSCONIQ® S 3030
Figure 13: Package image of OSCONIQ® S 5050
Figure 14 and 15 shows the recommended nozzle for the OSCONIQ® S 3030and S 5050.
Pick the LED only on the sides towards the bottom
Do not touch the silicone encapsulation
8 / 152021-01-15 | Document No.: AN139
www.osram-os.com
Figure 14: Recommended pick-and-place nozzle dimensions for OSCONIQ® S 3030
Figure 15: Recommended pick-and-place nozzle dimensions for OSCONIQ® S 5050
If a stickies issue occurred in some conditions during pick-and-place, it isrecommend to use nozzle of below material to overcome the stickies issue:
1. Nozzle head with Conductive Delrin material
2. Nozzle head with PU (Polyurethane) material
Storage
OSCONIQ® S are generally supplied on tape with dry pack. According to theOSRAM Opto Semiconductors standard, the LEDs should be factory-sealedwhen stored. The hermetic pack should only be opened for immediate mountingand processing, after which the rest of the LEDs should be repacked.
The LEDs (on PCBs) should not be stacked on top of each other, because anyforce applied to the mounted components may lead to damage. A properstorage system should be used (see Figure 10). In addition, assemblies shouldalso not be touched directly at the LED. Generally, all LED assemblies should beallowed to return to room temperature after soldering and before subsequenthandling or the next processing step.
15.6
5.4
2.8
Ø 23.2
SIPLACE 03055425
SIPLACE 3083400
Alternative nozzle dimensions:Outer dimension: Ø 5,0mmInner dimension: Ø 3,2mm
9 / 152021-01-15 | Document No.: AN139
www.osram-os.com
Figure 16: Proper storage system
Cleaning
From today's perspective, direct mechanical or chemical cleaning of theOSCONIQ® S products should be avoided. A wet cleaning process is also notapplicable to the OSCONIQ® S family, as the LED is not hermetically sealed. Dueto the open design, any cleaning liquids may penetrate the LED and result in thedegradation or failure of the component.
Dusty LEDs can be cleaned by using clean compressed air (e.g. spray can). Anycleaning agents and methods should be tested for suitability. As is the standardin the electronics industry, OSRAM Opto Semiconductors recommends low-residue or no-clean solder paste, so that PCB cleaning after soldering is notrequired.
E. Processing
The OSCONIQ® S is generally supplied in tape and reel format. Each reelcontains only one brightness group and one wavelength or color group.
The OSCONIQ® S is generally compatible with existing industrial SMTprocessing methods, so that current populating techniques can be used forassembly. For mounting the component, a standard reflow soldering processwith forced convection under standard N2 atmosphere is recommended, inwhich a typical lead-free SnAgCu metal alloy solder is used. Figure 17 shows thesolder requirements and temperature profile for the lead-free soldering of theOSCONIQ® S.
10 / 152021-01-15 | Document No.: AN139
www.osram-os.com
Figure 17: Temperature profile for lead-free reflow soldering according to JEDEC-JSTD-020
In this context, it is recommended to check the profile on all new PCB materialsand designs. The recommended temperature profile provided by the solderpaste manufacturer can be used as a good starting point. The maximumtemperature for the profile as specified in the data sheet should not beexceeded.
In general, it is recommended that all twisting, warping, bending and other formsof stress to the circuit board should be avoided after soldering in order to preventbreakage of the LED housing or solder joints. Therefore, separation of the circuitboards should not be performed manually, but should be carried out exclusivelywith a specially designed tool.
PCB type
PCBs are not only a mechanical substrate and electrical contact element for thecomponents, state-of-the-art circuit boards should also ensure the stabletemperature characteristics of the circuitry. Efficient heat dissipation is thereforerequired and the selection of appropriate materials and designs for the circuitboard is important.
Materials or composites with an insufficient thermal capacity and/or conductivitycan lead to a loss of reliability and/or result in limited operating parameters, sincethe heat generated may not be sufficiently dissipated. With an increasing dutycycle of the application, proper thermal design and management is paramount.
The junction temperature TJ of the LED is the relevant parameter for judging thesuitability of the thermal design. The maximum allowed junction temperatureTJ_max can always be found in the data sheet and should not be exceeded duringoperation. For further information please refer to the application note “Thermalmanagement of light sources based on SMD LEDs”.
In the SMT process, the solder paste is normally applied by stencil printing. Theamount to be applied as well as the quality of the paste deposits and the entireprinting are primarily influenced and determined by the design of the printingstencil. In the end, this also influences the solder quality, since effects such assolder bridges, solder spray and/or other soldering defects are largelydetermined by the design of the stencil apertures and the quality of the stencilprinting (e.g. positioning, cleanliness of the stencil, etc.). The stencils and theirapertures are thus specially laid out for the respective application. Therecommended design and dimensions of the stencil apertures for the solder padfor the OSCONIQ® S are shown in Figures 1x and Figure 1x.
Figure 18: Recommended solder pad and solder stencil for OSCONIQ® S 3030
Figure 19: Recommended solder pad and solder stencil for OSCONIQ® S 5050
Since the solder pad effectively creates the direct contact between the LED andthe circuit board, the design of the solder pad contributes decisively to theperformance of the solder connection. The design has an influence on the solderjoint reliability, the self-centering effect and heat dissipation.
In most cases, it is therefore advantageous to use the recommended solder pad,since it is individually adapted to the properties and conditions of the LED. Thecorresponding solder pad can be found in the data sheet of each LED.
In general, the requirements for good thermal management should be taken intoconsideration in the application when designing the solder pads. In the end, thismeans that when designing the solder pads, the copper area should be kept aslarge as possible. This serves to dissipate and spread the heat generated overthe PCB and is typically covered with a layer of solder resist.
12 / 152021-01-15 | Document No.: AN139
www.osram-os.com
When printing with a stencil, the amount of solder paste is determined by thethickness of the stencil. For OSCONIQ® S, a thickness of 120 μm is suitable.However, the stencil thickness used may also depend on the other SMDcomponents on the PCB.
Figure 20: 3D image for 120 μm solder paste
Voids
For a good thermal connection and a high board level reliability, it isrecommended that voids and bubbles should be eliminated in all solder joints.The total elimination of voids, particularly for the larger thermal pad, is difficult.Therefore, the design of the stencil aperture is crucial for the minimization ofvoids.
The recommended design openings in the stencil enable the out-gassing of thesolder paste during the reflow soldering process and also serve to regulate thefinal solder thickness. Therefore, a typical solder paste coverage of 60 % – 80 %is recommended.
In industry standards such as IPC-A-610 D or J-STD-001D (which only refer tosurface mount area array components such as BGA, CSP, etc.) the amount ofvoids (verified by the x-ray pattern) should be less than 25 %.
Figure 21: X-ray image of a solder joint of OSCONIQ® S 3030
The limit of the acceptable voiding can vary for each application and depends onthe power dissipation and the total thermal performance of the system, which iseffected by the PCB materials used.
13 / 152021-01-15 | Document No.: AN139
www.osram-os.com
F. Application support and services
Premium Application Support Services
Premium Application Support Services (PASS) offers commercial businessesaccess to OSRAM Opto Semiconductors’ application engineering expertise,resources and lab services, supported by an a la carte program that you canmold to your own product or system needs.
PASS can be accessed through a dedicated web page, where you can requestservices through a dynamic menu featuring simulation, prototypes, LED dataand system metrology services. You give us your specifications, and we willmeasure, simulate, prototype and evaluate your project and identify issues andsolutions before you proceed to final implementation.
Make it good, make it fast, make it easy — with PASS.
For further information, please visit https://www.osram.com/os/pass/index.jsp
My Luminator
My Luminator is an online tool that simplifies your luminaire design by selectingthe right LEDs and it’s parameter. It helps engineers and lighting designers tofind GL products from OSRAM Opto Semiconductors that optimally fit the needsof their luminaire design.
The functionality of the interface is user-friendly, simple to handle and enablescustomers to quickly initiate the light source selection of the luminaire design.They only need few information to start with the comprehensive planning and toobtain good results with essential output.
Don't forget: LED Light for you is your place tobe whenever you are looking for information orworldwide partners for your LED Lightingproject.
www.ledlightforyou.com
ABOUT OSRAM OPTO SEMICONDUCTORS
OSRAM, Munich, Germany is one of the two leading light manufacturers in the world. Its subsidiary, OSRAMOpto Semiconductors GmbH in Regensburg (Germany), offers its customers solutions based on semiconduc-tor technology for lighting, sensor and visualization applications. OSRAM Opto Semiconductors has produc-tion sites in Regensburg (Germany), Penang (Malaysia) and Wuxi (China). Its headquarters for North Americais in Sunnyvale (USA), and for Asia in Hong Kong. OSRAM Opto Semiconductors also has sales offices th-roughout the world. For more information go to www.osram-os.com.
DISCLAIMER
PLEASE CAREFULLY READ THE BELOW TERMS AND CONDITIONS BEFORE USING THE INFORMA-TION SHOWN HEREIN. IF YOU DO NOT AGREE WITH ANY OF THESE TERMS AND CONDITIONS, DONOT USE THE INFORMATION.
The information provided in this general information document was formulated using the utmost care; howe-ver, it is provided by OSRAM Opto Semiconductors GmbH on an “as is” basis. Thus, OSRAM Opto Semicon-ductors GmbH does not expressly or implicitly assume any warranty or liability whatsoever in relation to thisinformation, including – but not limited to – warranties for correctness, completeness, marketability, fitnessfor any specific purpose, title, or non-infringement of rights. In no event shall OSRAM Opto SemiconductorsGmbH be liable – regardless of the legal theory – for any direct, indirect, special, incidental, exemplary, con-sequential, or punitive damages arising from the use of this information. This limitation shall apply even ifOSRAM Opto Semiconductors GmbH has been advised of possible damages. As some jurisdictions do notallow the exclusion of certain warranties or limitations of liabilities, the above limitations and exclusions mightnot apply. In such cases, the liability of OSRAM Opto Semiconductors GmbH is limited to the greatest extentpermitted in law.
OSRAM Opto Semiconductors GmbH may change the provided information at any time without giving noticeto users and is not obliged to provide any maintenance or support related to the provided information. Theprovided information is based on special conditions, which means that the possibility of changes cannot beprecluded.
Any rights not expressly granted herein are reserved. Other than the right to use the information provided inthis document, no other rights are granted nor shall any obligations requiring the granting of further rights beinferred. Any and all rights and licenses regarding patents and patent applications are expressly excluded.
It is prohibited to reproduce, transfer, distribute, or store all or part of the content of this document in any formwithout the prior written permission of OSRAM Opto Semiconductors GmbH unless required to do so in ac-cordance with applicable law.
