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Analysis of Plating Solutions

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CONTROL, ANALYSIS, AND TESTING CHEMICAL ANALYSIS OF PLATING SOLUTIONS by Charles Rosenstein AM.254 Ltd., Ho/on, lsraei and Stanley Hirsch Leeam Consultants Ltd., New Rochelle, N. Y Plating solutions must be routinely analyzed in order to maintain the recommended bath formulation and to preempt the occurrence of problems related to improper levels of bath constituents. Contaminant levels in the solutions must also be monitored. Manufacturers of plating systems establish optimum specifications to ensure maximum solution efficiency and uniformity of deposits. The various factors that cause the concentrations of bath constituents to deviate from their optimum values are as follows: I. drag-out: 2. solution evaporation; 3. chemical decomposition; and 4. unequal anode and cathode efficiencies A current efficiency problem is recognized by gradual but continuous changes in pH, metal content, or cyanide content (see Table 1). The techniques employed for the quantitative analysis of plating solutions are classified as volumetric (titrimetric), gravimctric, and instrumental. Volumetric and grnvimetric methods are also known as “wet” methods. The analyst must select the method that is best suited and most cost effective for a particular application. The wet methods outlined here are simple, accurate, and rapid enough for practically all plating process control. They require only the common analytical equipment found in the laboratory, and the instructions are sufficiently detailed for an average technician to follow without any difficulty. The determination of small amounts of impurities and uncommon Table I. Problems Caused by Unequal Anode and Cathode Effkiencies High pH High anode efficiency Low pH High cathode efficiency High metal content High anode ctfiaency Low metal content High cathode eff~aency Hl:h fret cyamde Low anode efficiency Low free cyamde High anode efficiency 518
Transcript
Page 1: Analysis of Plating Solutions

CONTROL, ANALYSIS, AND TESTING

CHEMICAL ANALYSIS OF PLATING SOLUTIONS

by Charles Rosenstein AM.254 Ltd., Ho/on, lsraei

and Stanley Hirsch Leeam Consultants Ltd., New Rochelle, N. Y

Plating solutions must be routinely analyzed in order to maintain the recommended bath formulation and to preempt the occurrence of problems related to improper levels of bath constituents. Contaminant levels in the solutions must also be monitored. Manufacturers of plating systems establish optimum specifications to ensure maximum solution efficiency and uniformity of deposits. The various factors that cause the concentrations of bath constituents to deviate from their optimum values are as follows:

I. drag-out: 2. solution evaporation; 3. chemical decomposition; and 4. unequal anode and cathode efficiencies

A current efficiency problem is recognized by gradual but continuous changes in pH, metal content, or cyanide content (see Table 1).

The techniques employed for the quantitative analysis of plating solutions are classified as volumetric (titrimetric), gravimctric, and instrumental. Volumetric and grnvimetric methods are also known as “wet” methods. The analyst must select the method that is best suited and most cost effective for a particular application.

The wet methods outlined here are simple, accurate, and rapid enough for practically all plating process control. They require only the common analytical equipment found in the laboratory, and the instructions are sufficiently detailed for an average technician to follow without any difficulty. The determination of small amounts of impurities and uncommon

Table I. Problems Caused by Unequal Anode and Cathode Effkiencies

High pH High anode efficiency Low pH High cathode efficiency High metal content High anode ctfiaency Low metal content High cathode eff~aency Hl:h fret cyamde Low anode efficiency Low free cyamde High anode efficiency

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Page 2: Analysis of Plating Solutions

metals should be referred to a competent laboratory, as a high degree of skill and chemical knowledge are required for the determination of these constituents.

Hull cell testing (see the section on plating cells elsewhere in this Guidehook) enables the operator to observe the quality of a deposit over a wide current density range.

VOLUMETRIC METHODS

When titrants composed of standard solutions are added to a sample that contains a component whose concentration is to be quantrtatively determined, the method is referred to as a volumetric method. The component to be determined must react completely with the titrant in stoichiometric proportions. From the volume of titrant required, the component’s concentration is calculated. The simplicity, quickness, and relatrvely low cost of volumetric methods make them the most widely used for the analysis of plating and related solutrons.

Volumetric methods involve reactions of several types: oxidation-reduction, acid-base, complexation, and precipitation. Indicators are auxiliary reagents, which usually signify the endpoint of the analysis. The endpoint can be indicated by a color change, formation of a turbid solution, or the solubilization of a turbid solution.

Some volumetric methods require little sample preparation, whereas others may require extensive preparation. Accuracy decreases for volumetric analyses of components found in low concentrations, as endpoints are not as easily observed as with the components found in high concentrations.

Volumetric methods are limited in that several conditions must be satisfied. Indicators should be available to signal the endpoint of the titration. The component-trtrant reaction should not be affected by interferences from other substances found in the solution.

GRAVIMETRIC METHODS

In gravimetric methods, the component being determined is separated from other components of the sample by precipitatron, volatilir.ation, or electroanalytical means. Precipitation methods are the most rmportant gravimetnc methods. The precipitate is uquallq a very slightly coluble compound of high purity that contains the component. The weight of the precipitate is determined after it is filtered from solution, washed, and dried. Gravimetric methods are used to supplement the available volumctrlc methods.

Limitations of gravimetric methods include the requirement that the precipitated component has an extremely low solubihty. The precipitate must al\o be of high purity and be easily filterable.

Species that are analyzed gravimetrically include chloride, sulfate, carbonate, phosphate, gold, and silver.

INSTRUMENTAL METHODS

Instrumental methods differ from wet methods in that they measure a physical property related to the composition of a rubstance, u herear wet methods rely on chemical reactmns. The selection of an instrument for the analysis of plating solutions 15 a difficult task. Analysts must decide if the cost is justified and if the analytical instrument is capable of analyzing for the required substances with a high degree of accuracy and precision. Instruments coupled to computers can automatically sample, analyze, and record results. Mathematical errors are minimized and sample measurements are more reproducible than with wet methods. Instrumental methods are also extremely rapid when compared with wet method<.

Unlike humans, instruments cannot judge. They cannot recognire improper sample preparation or interfering substances. Erroneous results are sometimes produced by electronic and mechanical malfunctions.

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Analytical instruments frequently used in the analysis of plating solutions can be categorized as spectroscopic. photometric, chromatographic, and electroanalytical. Spectro- scopic methods (flame photometry, emission spectrometry, X-ray fluorescence, mass spec- trometry. and inductively coupled plasma) are based on the emission of light. Photometric methods (spectrophotometry, calorimetry, and atomic absorption) are based on the absorption of light. Chromatographic methods (ion chromatography) involve the separation of substance\ for subsequent identification. Electroanalytical methods (potentiometry. conductometry, polarography, amperometry. and electrogravimetry) involve an electric current in the course of the analysis.

The instrumental methods. comprehensively reviewed below. are most applicable to plating environments.

SPECTROSCOPIC METHODS

Spectroscopy is the analysis of a substance by the measurement of emitted light. When heat. electrical energy, or radiant energy is added to an atom, the atom becomes excited and emits light. Excitation can be caused by a flame. spark, X-rays, or an AC or DC arc. The electrons in the atom are activated from their ground state to unstable energy shells of higher potential energy. Upon returning to their ground state, energy is released in the form of electromagnetic radiation.

Because each element contains atoms with different arrangements of outermost elec- trons, a distinct set of wavelengths is obtained. These wavelengths, from atoms of several elements, are separated by a monochromator such as a prism or a diffraction grating. Detection of the wavelengths can be accomplished photographically (spectrograph) or via direct-reading photoelectric detectors (spectrophotometers). The measurement of intensity emitted at a particular wavelength is proportional to the concentration of the element being analyzed.

An advantage of spectroscopy is that the method is specific for the element being analyzed. It permits quantitative analysis of trace elements without any preliminary treatment and without prior knowledge as to the presence of the element. Most metals and \ome nonmetals may be analyzed. Spectroscopic analysis is also useful for repetitive analytical work.

Disadvantages of spectroscopic analysis include the temperature dependence of intensity measurements, as intensity is very sensitive to small fluctuations in temperature. The accuracy and precision of spectrographic methods is not as high as some spectrophotometric methods or wet analyses. Spectrographic methods are usually limited to maximum element concen- trations of 3%. Additionally, semitivity is much smaller for elements of high energy (e.g.. zinc) than for elements of low energy (e.g., sodium).

Applications of spectroscopy include the analysis of major constituent!, and impurities in plating solutions, and of alloy deposits for composition.

Flame Photometry In flame photometry (FP), a sample in solution is atomized at constant air pressure and

introduced in its entirety into a flame as a fine mist. The temperature of the flame (1,800-3,100-K) is kept constant. The solvent is evaporated and the solid is vaporized and then dissociated into ground state atoms. The valence electrons of the ground state atoms are excited by the energy of the flame to higher energy levels and then fall back to the ground state. The intenhitie\ of the emitted spectrum lines are determined in the spectrograph or measured directly by a spectrophotometer.

The flame photometer is calibrated with standards of known composition and concen- tration. The intensity of a given spectral line of an unknown can then be correlated with the amount of an element present that emits the specific radiation.

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Physical interferences may occur from solute or solvent effects on the rate of transport of the sample into the flame. Spectral interferences are caused by adjacent line emissions when the element being analyzed has nearly the same wavelength as another element. Monochromators or the selection of other spectral lines minimiLe this interference. Ionization interferences may occur with the higher temperature flames. By adding a second ionizable element, the interference< due to the ionization of the element being determined are minimized.

An advantage of FP IS that the temperature of the flame can be kept more nearly constant than with electric sources. A disadvantage of the method is that the sensitivity of the flame wurce is many times smaller than that of an electric arc or cpark.

FP is used for the analysis of aluminum, boron, cadmium, calcmm, chromium, cobalt, copper, indium, Iron, lead, lithium, magnesium, nickel, palladium, platinum, potassium. rhodium, ruthenium, silver, sodium, strontium, tin, and rinc.

Emission Spectrometry In emission spectrometry (ES), a sample composed of a solid, cast metal or solution 1s

ewclted by an electric discharge such as an AC arc, a DC arc, or a spark. The sample is usually placed in the cavity of a lower graphite electrode, which 15 made positiv-e. The upper counterelectrode is another graphite electrode ground to a point. Graphite is the preferred electrode material because of Its abihty to withstand the high electric discharge temperatures. It is also a good electrical conductor and does not generate its own spectral lines.

The arc is started by touching the two graphite electrodes and then separating them The extremely high temperatures (J,OOGh,OOO“K) produce emitted radiation higher in energy and in the number of spectral lines than in flame photometry. Characteristic wavelengths from atoms of several elements arc separated by a monochromator and are detected hy \pectro- graphs or ?pectrophotometers. Qualitative identifuxtion i\ performed by using available charts and tables to identify the \pectrnl lines that rhe emission spectrometer sorts out according to their wavelength. The elements present in a rample can alw he quahtatlcrly determined by comparmg the spectrum of an unknown wnh that of pure samples of the elements. The density of the wakelengths is proportional to the concenwatwn of the clement being determined. Calibrations are done against standard samples.

ES is a useful method for the analysis of trdce metallic contdmmantr in plating barhu. Ihe “oxide” method is a common quantitative technique in ES. A sample of the plating bath is evaporated to dryness and then heated rn a muffle fwnace. The resultant oxides are mixed with graphite and placed in a praphlte electrode. Stand,wds are Gmilarly prepared dnd a I)( drc i5 used to excite the sample and Gandards.

X-ray Fluorescence X-ray fluorescence o(N) qwctrosc~~py is baaed on the cxcltatlon of wnpler hq an

X-ray source of sufficiently high energy, resulting in the cmi<>ion of Iluorcsccnt r.ldiatmn. lhe concentration of the element being determined IS proportional to the intsnsit> of ItS chartcterihtic N avelength. A I) pical XRF q)ectrometcr consists of an X-ray ~owcc. ;I detector, and a data analyzer.

Advantagr~ of XRF include the nondestructive nature *If the X-ray\ on the tample. XRF is useful in measuring the major constituents of platrng baths wch ;I- cadmium. chrommm. cobalt, gold, nickel, silver, tin, and lint. I>~~ad\:cnta~es of ?rRF ~ncludc its lack of wn\itl\tt) as compared with ES.

X-ray spectroscopy ih alw used to measure the thichnetr of a plated deposit. ‘The X-ray detector is placed on the wavelength of the element bring meawred. rhe surface of the deposit is exposed to an X-ray source and the intensity of the element ~a\rlrngth is measured. A calibration cur\e is cowtructed for intensity against thickness for a particular deposit. Coating compositions can also be determined by XRF.

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Mass Spectrometry In mass spectrometry (MS), gases or vapors derived from liquids or solids are bombarded

by a beam of electrons in an ionization chamber, causing ionization and a rupture of chemical bonds. Charged particles are formed, which may be composed of elements, molecules, or fragments. Electric and magnetic fields then separate the ions according to their mass to charge ratios (m/r). The amount and type of fragments produced in an ionization chamber. for a particular energy of the bombarding beam, are characteristic of the molecule; therefore, every chemical compound has a distinct mass spectrum. By establishing a mass spectrum of several pure compounds, an observed pattern allows identification and analysis of complex mixtures.

The mass spectrum of a compound contains the masses of the ion fragments and the relative abundances of these ions plus the parent ion. Dissociation fragments will always occur in the came relative abundance for a particular compound.

MS is applicable to all substances that have a sufficiently high vapor pressure. This usually includes substances whose boiling point is below 450°C. MS permits qualitative and quantitative analysis of liquids, solids, and gases.

Inductively Coupled Plasma Inductively coupled plasma (ICP) involves the aspiration of a sample in a stream of

argon gas, and then its ionization by an applied radio frequency field. The field is inductively coupled to the ionized gas by a coil surrounding a quartz torch that supports and encloses the plasma. The sample aerosol is heated in the plasma, the molecules become almost completely dissociated and then the atoms present in the sample emit light at their characteristic frequencies. The light passes through a monochromator and onto a detector.

The high temperature (7,OOO”K) of the argon plasma gas produces efficient atomic emission and permits low detection limits for many elements. As with atomic absorption (AA), ICP does not distinguish between oxidation states (e.g., Cr” and Crhi) of the same element-the total element present is determined. Advantages of ICP include complete ionization and no matrix interferences as in AA. ICP allows simultaneous analysis of many elements in a short time. It is sensitive to part-per-billion levels.

Disadvantages of ICP include its high cost and its intolerance to samples with greater than 3% dissolved solids. Background corrections usually compensate for interferences due to background radiation from other elements and the plasma gases. Physical interferences, due to viscosity or surface tension, can cause significant errors. These errors are reduced by diluting the sample. Although chemical interferences are insignificant in the ICP method, they can be greatly minimized by careful selection of the instrument’s operating conditions. by matrix matching, or by buffering the sample.

ICP is applicable to the analysis of major components and trace contaminant, in plating solutions. It is also useful for waste-treatment analysis.

PHOTOMETRIC METHODS

Photometric methods are based on the absorption of ultraviolet (200-400 nm) or visible (400-1,000 nm) radiant energy by a species in solution. The amount of energy absorbed is proportional to the concentration of the absorbing species in solution. Absorption is determined spectrophotometrically or calorimetrically.

The sensitivity and accuracy of photometric methods must be frequently checked by testing standard solutions in order to detect electrical, optical, or mechanical malfunctions in the analytical instrument.

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Spectrophotometry and Colorimetry

S~~e~rropllotonzer~~ involves analysis by the measurement of the light absorbed by a solution. The absorbance is proportional to the concentration of the analyte in solution. Spectrophotometric methods are most often used for the analysis of metals with concentra- tions of up to 2%.

Spectrophotometers consist of a light source (tungsten or hydrogen), a monochromator, a sample holder, and a detector, Ultraviolet or vjisible light of a definite wavelength is used as the light source. Detectors are photoelectric cells that measure the transmitted (unabsorbed) light, Spectrophotometers differ from photometers in that they utilirc monochromators. whereas photometers use filters to isolate the desired wavelength region. Filter\ isolate a wider band of light.

In spectrophotometric titrations, the cell containing the analyte solution is placed in the light path of a spectrophotometer. Titrant is added to the cell with stirring. and the absorbance is measured. The endpoint is determined graphically. Applications of this titration include the analysis of a mixture of arsenic and antimony and the analysis of copper with ethylene diamine tetra acetic acid (EDTA).

The possibihty of errors in spectrophotometric analyses is increased when numerous dilutions are required for an analysis.

Colorirner~~ involves comparing the color produced by an unknown quantity of a substance with the color produced by a standard containing a known quantity of that substance. When monochromatic light passes through the colored solution, a certain amount of the light, proportional to the concentration of the substance, will be absorbed. Substances that are colorless or only slightly colored can he rendered highly colored by a reaction with special reagents.

In the standard series calorimetric method. the analytc solution is diluted to a certain volume (usually 50 or I00 ml) in a Ncsslcr tube and mixed. The color of the solution is compared with a series of standards similarly prepared. The concentration of the analyte equals the concentration of the standard solution whose color it matches exactly. Colors can also be compared to standards via a colorimctcr (photometer), comparator. or apcctropho- tometer.

The possible errors in calorimetric measurements may arise from the following sources: turbidity, sensitivity of the eye or color blindness, dilutions. photometer filter\. chemical interferences, and variation\ in temperature or pH.

Photometric methods arc available for the analysis of the following analytes:

Anodizing solutions: Fe, Cu. Mn Brass solutions: Fe Cadmium solutions: Fe, Ti. Zn. Cu. Ni Chromium solutions: Cr, Fe, Ni, Cu, SC Acid copper solutions: Cl, Fe Alkaline copper solutions: Fe, Se Gold solutions: Au. Ni, In, Co. Cu, Fe, PO, Iron solutions: Mn, NH, Lead and tin-lead solutions: Pb Nickel solutions: Cr. Cu. Zn, Fe. Co, NH, Palladium solutions: Pd. Cr. NH, Platinum solutions: Pt Rhodium solutions: Rh Silver solutions: Ni. Cu. Sb Acid tin solutions: Fe. Cu Alkaline tin solution\: Cu. Pb, Zn

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Acid zinc solutions: Cu. Fe Alkaline zinc solutions: Cu, Fe Wastewater: Ohi. Ni, Cu, Fe, Zn, Ph. Al, B, NO,, NO?, PO,. Cl. CN, wetting agents.

Atomic Absorption Metals in plating and related solutions can be readily determined by AA spectropho-

tometry. Optimum ranges, detection limits, and sensitivities of metals vary with the various available instruments.

In dire&os@rrtiort atontic crb.sor/,tiort (DAAA) analysis, the flame (usually air- acetylene or nitrous oxide-acetylene) converts the sample aerosol into atomic vapor. which absorbs radiation from a light source. A light source from a hollow cathode lamp or an electrodeless discharge lamp is used, which emits a spectrum specific to the element being determined. The high cost of these lamps is a disadvantage of the AA method. A detector measures the light intensity to give a quantitative determination.

DAAA is similar to flame photometry in that a sample is aspirated into a flame and atomized. The difference between the two methods is that tlame photometry measures the amount of emitted light. whereas DAAA measures the amount of light absorbed by the atomized element in the flame. In DAAA. the number of atoms in the ground state is much greater than the number of atoms in any of the excited states of the spectroscopic methods. Consequently, DAAA is more efficient and has better detection limits than the spectroscopic methods.

Spectral interferences occur when a wavelength of an element being analyzed is close to that of an interfering element. The analysis will result in an erroneously high measurement. To compensate for this interference, an alternate wavelength or smaller slit width is used.

When the physical properties (e.g.. viscosity) of a sample differ from those of the standard, matrix interferences occur. Absorption can be enhanced or suppressed. To overcome these interferences, matrix components in the sample and standard are matched or a release agent, such as EDTA or lanthanum, is added.

Chemical interferences are the most common interferences encountered in AA analysis. They result from the nonabsorption of molecularly bound atoms in the flame. These interferences are minimized by using a nitrous oxide-acetylene flame instead of an air-acetylene flame to obtain the higher flame temperature needed to dissociate the molecule or by adding a specific substance (e.g., lanthanum) to render the interferant harmless. Chemical interferences can also be overcome by extracting the element being determined or by extracting the interferant from the sample.

The sensitivity and detection limits in AA methods vary with the instrument used, the nature of the matrix, the type of element being analyzed, and the particular AA technique chosen. It is best to use concentrations of standards and samples within the optimum concentration range of the AA instrument. When DAAA provides inadequate sensitivity. other specialized AA methods, such as graphite fur-nace AA, cold vapor AA, or hydride AA. are used.

In ~rr@n’tr furnace AA (GFAA). the flame that is used in DAAA is replaced w’ith an electrically heated graphite furnace. A solution of the analyte is placed in a graphite tube in the furnace, evaporated to dryness, charred, and atomized. The metal atoms being analyzed are propelled into the path of the radiation beam by increasing the temperature of the furnace and causing the sample to bc volatilized. Only very small amounts of sample are required for the analysis.

GFAA is a very sensitive technique and permits very low detection limits. The increased sensitivity is due to the much greater occupancy time of the ground state atoms in the optical path as compared with DAAA. Increased sensitivity can also be obtained by using larger sample volumes or by using an argon-hydrogen purge gas mixture instead of nitrogen, Because of its extreme sensitivity. determining the optimum heating times. temperature. and matrix modifiers is necessary to overcome possible interferences.

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Interferences may occur in GFAA analysis due to molecular absorption and chemical effects. Background corrections compensate for the molecular absorption interference. Specially coated graphite tubes minimize its interaction with some elements. Gradual heating helps to decrease background interference, and permits determination of samples with complex mixtures of matrix components.

The GFAA method has been applied to the analysis of aluminum, antimony, arsenic, barium, beryllium, cadmium, chromium, cobalt, copper, iron, lead, manganese, molybdenum, nickel, selenium, silver, and tin.

Cold vapor atomic absorprion (CVAA) involves the chemical reduction of mercury or selenium by stannous chloride and its subsequent analysis. The reduced solution is vigorously stirred in the reaction vessel to obtain an equilibrium between the element in the liquid and vapor phases. The vapor is then purged into an absorption cell located in the light path of a spectrophotometer. The resultant absorbance peak is recorded on a strip chart recorder.

The extremely sensitive CVAA procedure is subject to interferences from some organics, sulfur compounds, and chlorine. Metallic ions (e.g., gold, selenium), which are reduced to the elemental state by stannous chloride, produce interferences if they combine with mercury.

Hydride atomic absorpfion (HAA) is based on chemical reduction with sodium borohydride to selectively separate hydride-forming elements from a sample. The gaseous hydride that is generated is collected in a reservoir attached to a generation flask, and is then purged by a stream of argon or nitrogen into an argon-hydrogen-air flame. This permits high-sensitivity determinations of antimony, arsenic, bismuth, germanium, selenium, tellu- rium, and tin.

The HAA technique is sensitive to interferences from easily reduced metals such as silver, copper, and mercury. Interferences also arise from transition metals in concentrations greater than 200 mg/L and from oxides of nitrogen.

Ion Chromatography In ion chromatography (IC), analytes are separated with an eluent on a chromatographic

column based on their ionic charges. Because plating solutions are water based, the soluble components must be polar or ionic; therefore, IC is applicable to the analysis of plating and related solutions.

Ion chromatographs consist of a sample delivery system, a chromatographic separation column, a detection system, and a data handling system.

IC permits the rapid sequential analysis of multiple analytes in one sample. The various detectors available, such as W-visible, electrochemical, or conductivity, allow for specific detection in the presence of other analytes. IC is suitable for the analysis of metals, anionic and cationic inorganic bath constituents, and various organic plating bath additives. It is also used for continuous on-line operations.

Interferences arise from substances that have retention times coinciding with that of any anion being analyzed. A high concentration of a particular ion may interfere with the resolution of other ions. These interferences can be greatly minimized by gradient elution or sample dilution.

IC has been applied to the analysis of the following analytes in plating and related solutions:

Merals: Aluminum, barium, cadmium, calcium, trivalent and hexavalent chromium, cobalt, copper, gold, iron, lead, lithium, magnesium, nickel, palladium, platinum, silver, tin, zinc.

Ions: Ammonium, bromide, carbonate, chloride, cyanide, fluoborate, fluoride, hypophos- phite, nitrate, nitrite, phosphate, potassium, sodium, sulfate, sulfide, sulfite.

Acid Mixtures: Hydrofluoric, nitric, and acetic acids. Organics: Brighteners, surfactants, organic acids.

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ELECTROANALYTICAL METHODS

Electroanalytical methods involve the use of one or more of three electrical quantities+urrent, voltage, and resistance. These methods are useful when indicators for a titration are unavailable or unsuitable. Although trace analysis may be done quite well by spectroscopic or photometric methods, electroanalytical methods offer ease of operation and relatively lower costs of purchase and maintenance.

Potentiometry Potentiometry involves an electrode that responds to the activity of a particular group of

ions in solution. Potentiometric methods correlate the activity of an ion with its concentration in solution.

In potentiometric titrations, titrant is added lo a solution and the potential between an indicator and reference electrode is measured, The reaction must involve the addition or removal of an ion for which an electrode is available. Acid-base titrations are performed with a glass indicator electrode and a calomel reference electrode. The endpoint corresponds to the maximum rate of change of potential per unit volume of titrant added.

Advantages of potentiometric titration5 include irs applicability to colored. turbid, or fluorescent solutions. It is also useful in situations where indicators are unavailable.

The sensitivity of potentiometric titrations is limited by the accuracy of the measuxment of electrode potentials at low concentrations. Solutions that arc more dilute than 10 ’ N cannot be accurately titrated potentiometrically. This is because the experimentally measured electrode potential is a combined potential. which may differ appreciably from the true electrode potential. The difference between the true and experimental electrode potentials ia due to the residual current. which arises from the presence of electroactive trace impurities.

The direct potentiometric measurement of single ion concentrations is done with ion selective electrodes (ISEa). The ISE develops an electric potential in response to the activity of the ion for which the electrode is specific. ISEs are available for measuring calcium, copper, lead, cadmium, ammonia, bromide, nitrate, cyanide, sulfate, chloride, fluoride, and other cations and anions.

Cation ISEs encounter interferences from other cations, and anion ISEs encounter interferences from other anions. Theae interferences can be eliminated by adjusting the sample pH or by chelating the interfering ions. ISE instructions must be reviewed carefully to determine the maximum allowable levels of interferants, the upper limit of the single ion concentration for the ISE, and the type of media compatible with the particular ISE.

Some of the solutions that can be analyzed by potentiometric methods are:

Anodizing solutions: Al, H$O,, CIHLOJ. CrO,, Cl Brass solutions: Cu, Zn, NH,, CO, Bronze solutions: Cu. Sn. NaOH, NaCN, Na&O, Chromium solutions: Cr, Cl Cadmium solutions: Cd, NaOH. NaCN, Na?CO, Acid copper solutions: Cl Alkaline copper solutions: NaOH, NaCN, Na&O, Gold solution,: Au. Ag. Ni. Cu Lead and tin/lead solutions: Ph. Sn, HBF, Nickel solutions: Co. Cu, Zn. Cd, Cl. H,BO, Silver solutions: Ag, Sb, Ni Acid tin solutions: Sn. HBF,, H,SO, Alkaline tin aolutiona: Sn, NaOH. NaCO,. Cl Zinc solutions: Zn

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Conductometry Electrolytic conductivity measures a solution’s ability to carry an electric current. A

current is produced by applying a potential between two inert metallic electrodes (e.g., platinum) inserted into the solution being tested. When other variables are held constant, changes in the concentration of an electrolyte result in changes in the conductance of electric current by a solution.

In conductometric titrations, the endpoint of the titration is obtained from a plot of conductance against the volume of titrant. Excessive amounts of extraneous foreign electrolytes can adversely affect the accuracy of a conductometric titration.

Conductometric methods are used when wet or potentiometric methods give inaccurate results due to increased solubility (in precipitation reactions) or hydrolysis at the equivalence point. The methods are accurate in both dilute and concentrated solutions, and they can also be u5ed with colored solutions.

Conductometric methods have been applied to the analysis of Cr. Cd, Co, Fe, Ni, Pb, Ag, Zn, CO,, Cl, F, and SO,.

Polarography In polarography, varying voltage is applied to a cell consisting of a large mercury anode

(reference electrode) and a small mercury cathode (indicator electrode) known as a dropping mercury electrode (DME). Consequent changes in current are measured. The large area of the mercury anode precludes any polarization. The DME consists of a mercury reservoir attached to a glass capillary tube with small mercury drops falling slowly from the opening of the tube. A saturated calomel electrode is sometimes used as the reference electrode.

The electrolyte in the cell consists of a dilute solution of the species being determined in a medium of supporting electrolyte. The supporting electrolyte functions to carry the current in order to raise the conductivity of the solution. This ensures that if the species to be determined is charged, it will not migrate to the DME. Bubbling an inert gas, such as nitrogen or hydrogen, through the solution prior to running a polarogram, will expel dissolved oxygen in order to prevent the dissolved oxygen from appearing on the polarogram.

Reducible ions diffuse to the DME. As the applied voltage increases, negligible current flow results until the decomposition potential is reached for the metal ion being determined. When the ions are reduced at the same rate as they diffuse to the DME, no further increases in current occur, as the current is limited by the diffusion rate. The half-wave potential is the potential at which the current is 50% of the limiting value.

Polarograms are obtained by the measurement of current as a function of applied potential. Half-wave potentials are characteristic of particular substances under specified conditions. The limiting current is proportional to the concentration of the substance being reduced. Substances can be analyzed quantitatively and qualitatively if they are capable of undergoing anodic oxidation or cathodic reduction. As with other instrumental methods, results are referred to standards in order to quantitate the method.

Advantages of polarographic methods include their ability to permit simultaneous qualitative and quantitative determinations of two or more analytes in the same solution. Polarography has wide applicability to inorganic, organic, ionic, or molecular species.

Disadvantages of polarography include the interferences caused by large concentrations of electropositive metals in the determination of low concentrations of electronegative metals. The very narrow capillary of the DME occasionally becomes clogged.

Polarographic methods are available for the following solutions:

Anodizing solutions: Cu, Zn, Mn Brass solutions: Pb, Cd, Cu, Ni, Zn Bronze solutions: Pb, Zn, Al, Cu. Ni Cadmium solutions: Cu, Pb, Zn, Ni

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Table II. Reactions That Can Be Analyzed by Amperometry

Fluoride Gold Nickel Lead Bromide CttlCilltll Cadmium Chloride

Lead mtrate Hydroquinone Dimethylglyoximc Sodium tluoride Silver nmnte EDTA EDTA Silver nimte EDTA

Potassium chloride Sulfuric acid Chloride Chloride Nitric acid Ammonia Ammonia Nitric acid Weak acid

Chromium solutions: Cu, Ni, Zn, Cl, SO, Acid copper solutions: Cu. Cl Alkaline copper solutions: Zn, Fe, Pb, Cu Gold solutions: Au, Cu, Ni, Zn, In, Co, Cd Iron solutions: Mn Lead and tin-lead solutions: Cu, Cd, Ni, ‘Zn, Sb Nickel solutions: Cu. Pb, Zn, Cd, Na, Co, Cr, Mn Palladium solutions: Pd, Cr” , CT”+ Rhodium solutions: Rh Silver solutions: Sb, Cu, Cd Acid tin solutions: Sn4+, Cu, Ni, Zn Alkaline tin solutions: Pb, Cd, Zn, Cu Acid zinc solutions: Cu. Fe, Pb, Cd Alkaline zinc solutions: Pb. Cd, Cu Wastewater: Cd Cu Cr’+, Ni, Sn, Zn 1 3

Amperometry Amperometric titrations involve the use of polarography as the basis of an electrometric

titration. Voltage applied across the indicator electrode (e.g., DME or platinum) and reference electrode (e.g., calomel or mercury) is held constant and the current passing through the cell is measured as a function of titrant volume added. The endpoint of the titration is determined from the intersection of the two straight lines in a plot of current against volume of titrant added. Polarograms are run to determine the optimum titration voltage.

Amperometric titrations can be carried out at low analyte concentrations at which volumetric or potentiometric methods cannot yield accurate results. They are temperature independent and more accurate than polarographic methods. Although amperometry is useful for oxidation-reduction or precipitation reactions, few acid-base reactions are determined by this method.

Some of the reactions that can be analyzed by amperometric methods are given in Table II.

Electrogravimetry In electrogravimetry, the substance to be determined is separated at a fixed potential on

a preweighed inert cathode, which is then washed, dried. and weighed. Requirements for an accurate electrogravimetric analysis include good agitation, smooth adherent deposits, and proper pH, temperature, and current density.

531

Page 12: Analysis of Plating Solutions

Table III. Molarities and Normalities of Standard Solutions

EDTA C,,,H,,0,N2Na2.?H,0 Ferrous ammonium xdt’atc FeSO,(NH,),SO,6H,O Hydrochloric acid HCI Iodine ‘2 Potaswm dichromatc K,Cr,O, Potassium iodide-iodaw KILKl03 Potassium permanpanate KMnO, Potassium thiocyanats KSCN Silver nitrate AgNO, Sodium hydroxide NaOH Sodium thiosulfate Na&O,.SH,O

EDTA. rthylenr dl;*mlne tem dCr,l‘ :K,d.

Advantages of electrogravimetry include its ability to remove quantitatively most common metals from solution. The method does not require constant supervision. Disadvan- tages include long electrolysis times.

Some of the metals that have been determined clectrogravimetrically are cadmium. cobalt, copper. gold, iron. lead. nickel, rhodium, silver. tin, and zinc.

SAMPLING

Analyses are accurate only when the sample is truly representative of the solution being analyzed. Each tank should have a reference mark indicating the correct level for the solution, and the bath should always be at this level when the sample is taken. Solutions should be stirred before sampling. If there is sludge in the tank. the solution should be stirred at the end of the day and the bath allowed to stand overnight, taking the sample in the morning.

Solutions should be sampled by means of a long glass tube. The tube is immersed in the solution, the thumb is placed over the upper open end. and a full tube of solution is withdrawn and transferred to a clean, dry container. The solution should be sampled at a minimum of IO locations in the tank to ensure a representative sample. A quart sample is sufficient for analysis and Hull cell testin g, and any remaining solution can be returned to its tank.

STANDARD SOLUTIONS, REAGENTS, AND INDICATORS FOR WET METHODS

Standard solutions, reagents, and indicators can be purchased ready-made from labora- tory supply distributors. Unless a laboratory has the experience and high degree of accuracy that is required in preparing these solutions, it is recommended that they be purchased as prepared solutions. Preparations for all the solutions are given here to enable technicians to prepare or recheck their solution?.

A standard solution is a solution with an accurately known concentration of a substance used in a volumetric analysis. Standardiration of standard solutions requires greater accuracy than routine volumetric analyses. An error in standardization causes errors in all analyses that are made with the solution: therefore. Primary Standard Grade chemicals should be used to standardize standard solutions.

The strengths of standard solutions are usually expressed in terms of normality or molarity. Normalities of standard solutions and their equivalent molarities are listed in Table III. The methods to standardize all the standard solutions required for the analysis of plating and related solutions are listed in Table IV.

532

Page 13: Analysis of Plating Solutions

Indicators are added to solutions in volumetric analyses to show color change or onset of turbidity, signifying the endpoint of a titration. The indicators required for all of the analyses and their preparations are listed in Table V. Analytical Grade chemicals should be used in preparing analytical reagents (Table VI) and Reagent Grade acids should be used (Table VII). When chemicals of lesser purity are used, the accuracy of the results will be diminished.

Tables VIII through XII provide specific methods for testing the constituents of electroplating. electroless. and anodizing baths, as well as acid dips and alkaline cleaners.

SAFETY

As with any laboratory procedure, the accepted safety rules for handling acids, bases, and other solutions should be followed. Acids are always added to water. not the reverse. Mouth pipettes should not be used for pipetting plating solutions. Safety glasses should always be worn, and care should be exercised to avoid skin and eye contact when handling chemicals. A fume hood should be used when an analytical method involves the liberation of harardoua or annoying fumes. Laboratory staff should be well versed in the fir&t-aid procedures required for various chemical accidents.

DETERMINATION OF CATHODE EFFICIENCY

The procedure for determining cathode efficiency, using the setup pictured in Fig. I, is as follows:

I. Connect the copper coulometer in series with the test cell. 2. The copper coulometer solution should contain 30 or/gal copper sulfate pentahydrate

and 8 oz/gal sulfuric acid. 3. Use the same anodes, temperature, and agitation in the test solution that are used in

the plating bath. 4. Plate at 0.4 A (30 A/ft’) for a minimum of IO minutes. 5. Rinse both cathodes, dry in acetone, and weigh.

weight in gram5 of test metal X valence of test metal in bath X 3177 Ic Cathode Efficiency =

weight in grams of copper metal X atomic weight of test metal

Test Solution Copper Coulometer

Page 14: Analysis of Plating Solutions

Tabl

e IV

. St

anda

rdiz

atio

n of

Sta

ndar

d So

lutio

ns

Solu

/io~i

0.1

M

ED

TA

37.0

B

Nal

EDTA

.2H

,0

per

liter

H

,O

0.1

N H

CI

Y m

l 36

%

HC

I pe

r bt

er

H,O

1.

0 N

H

CI

X9

1111

36%

H

CI

per

Rer

r~c”

” (T

o he

rrd

dd

,,I o

t-ckr

li,

\r~d)

5.0

8 C

CO

, di

rwlv

ed

m

I:3

HC

I an

d di

lute

d tu

500

m

l in

a

volu

met

ric

tlask

. P

ipet

te

20.m

l ra

mpl

e,

add

100

ml

H,O

, *’

IO

m

l pH

IO

huf

ferfe

r. and

EBT

po

wder

.

0.2

0” N

a2C

0,.

I25

ml

H,O

. an

d br

omoc

reso

l gr

een.

2 0

g N

a,C

O,.

I25

ml

H,O

, an

d br

orno

cres

ol

gree

n.

liter

H,O

0.

1 N

I,

12.7

g l

l. 24

.0

g K

I pe

r lit

er

H,O

0.01

N

H

g(N

O&

I.0

83

g H

pO.

5 m

l 50

%

HN

O,

per

liter

HJ

I 0.

1 N

K

I-KIO

, 3.

6 g

KIO

,. I.0

g

NaO

H,

IO.0

g

KI

per

hter

H

z0

0 2

g A

s20q

, 20

ml

I .O

N N

aOH

, ge

ntly

he

at u

ntd

As,

O,

diaw

lves

, co

ol,

add

phen

olph

thal

ein.

I.0

N

H

CI

adde

d fro

m

pink

to

col

orle

ss.

100

ml

H1O

. I

ml

cont

. H

Cl.

2 2

hica

rhon

ate

adde

d sl

owly

, an

d st

arch

w

lutm

n.

7.5

g K

CI

disw

lwxi

in

Hz0

an

d dd

utrd

to

I.0

00

ml

m a

vol

umet

ric

f&k.

P

ipet

te

2.m

l sa

mpl

e,

add

100

ml

H,O

, an

d I5

m

l 20

%

trich

lonx

lcet

ic

actd

.

In S

Wm

l fla

sk

add

0.20

g

Sn.

I0

0 m

l co

ne

HC

I, 2

drop

\ S

bCI,

wlu

tion.

le

t st

and

at r

oom

te

mpe

ratu

re

1111

diw

Tlve

d.

Add

I8

0 m

l H

,O,

j-in

fold

ed

“U-s

hape

d ni

ckel

\tr

~p.

and

5.0

g re

duce

d iro

n po

wde

r S

lopp

er

lla\k

w

th

rubb

er

wpp

er

fitte

d w

ith

‘/l-in

. gl

ass

tuhc

~m

tnrr

vxl

into

a

aatu

rntc

d N

aHC

O,

solu

tmn.

H

eat

wlu

tion

on

hot-

plat

e to

hod

ta

r 20

mm

ute\

an

d th

en

plac

e in

coo

ling

tank

an

d al

low

to

co

ol

to 1

’oom

tcm

prnl

ture

. M

ake

sure

gi

n\\

outle

t tu

be

is

~mrm

rwd

III t

he

NaH

CO

,. R

emw

e st

oppe

r an

d ad

d rta

rch

wlu

tion.

Trrrm

r

ED

TA

Red

-blu

e

HC

I B

lue-

gree

n

HC

I

Col

orle

ss-b

lue

H@

0,)2

KI-K

ID,

Col

orle

ss-b

lue

M

ED

TA

= (W

I C

aCO

, x

1111

\wlp

le)l

(ml

ED

TA

X

50.0

5)

N

HC

I =

(M.t

Na,

CO

,)/

(IllI

x

0.05

299)

N

HC

I =

,wt

Nal

CO

,)/

(ml

x 0.

0529

9)

N

I2 =

(w

r A

\?03

1 (m

l X

11

.039

46)

N Hg

(NO

,),

= (w

t K

CI

x m

l r~

Inpl

c)i(m

l H

_s(N

O),)

~ X

74.

56)

N

KI-K

IO,

= (w

t S

ll)/(

rnl

x 0.

05Y

34S

)

Page 15: Analysis of Plating Solutions

Tabl

e IV

. St

ands

rdiz

atiu

n d

Ybnd

rrd

Solu

tions

(c

um.)

.s0f

rd0R

Ti

trant

C

olor

C

hang

e

Cul

cula

riom

(m

l, N.

M

-titm

t; wt

-sam

ple

in g

ram

s)

0.1

N KM

nO,

3.2

g KM

nO,

per

liter

Hz0

0.1

N KS

CN

9.7

g KS

CN

per

liter

W

0.1

AsNO

, 17

.0 I

: Ag

NO,

per

liter

HI0

0.1

N Na

OH

4.0

g Na

OH

per

liter

H,O

I .O

N Na

OH

4U.U

g N

aOH

per

liter

I&O

0.1

N Na

,S,O

., 25

.0 g

N+S

,O,+

H,

0 pe

r lite

r Ii,

0

0. I

N Th

(NO,

), 14

.0 g

l’h

(NO&

,4HL

0 pe

r lite

r H,

O

Heat

KM

nO,

solu

tion

to n

ear

bodi

ng

fu

30 m

inut

es

and

let

stand

ov

ernig

ht.

Filte

r th

roug

h a

aintcr

cd

glass

cru

cible.

Th

en,

to

stand

ardiz

e:

add

0.2

g IV

a,C,

O,,

200

ml

H,O,

30

ml

20%

H,

SO,,

beat

fo

185-

195’F

.

KMnO

,

0.3

I: AS

, 15

ml

50%

HN

O,,

100

ml

l&O,

an

d FA

S.

KSCN

0.2

t: Na

CI,

125

ml

H,O,

so

d K,

CrO,

.

0.5

g po

tass

ium

hydr

ogen

ph

thsla

te

(KHC

,H,O

,j,

125

ml

H,O,

an

d ph

enol

phth

alei

n.

4.0

g po

tawu

m

hydr

ogen

ph

tbal

ate

(KHC

,H,O

,),

I25

ml

H,O,

an

d ph

enol

phth

alei

n ind

icato

r.

Add

0.1

g N&

O.,

to N

&O,

solut

ton

and

let

stand

fo

r 24

hou

rs.

To s

tand

ardiw

ad

d 0.

12

g KI

O,,

2 g

KI,

25 m

l HZ

O,

and

8 m

l 10

% H

CI.

Titra

te

to l

ight

qe

llow

with

N+

S20,

an

d ad

d 2

ml

starch

so

lutio

n.

5.0

g Na

F dis

wlvc

d in

H,O

an

d Jd

uted

to

1,U

UU m

l in

a v

olum

etric

tla

sk.

Pipe

tte

l&m

l sa

mpl

e,

add

100

ml

H,O.

al

izarin

ind

icato

r, 2%

HN

U,.

dnrp

wisc

fro

m

pink

to y

ellu

w,

and

3 m

l flu

orid

e bu

ffer.

AiW

x

NaOH

NaOH

mNo

3),

Color

less-

pink

Color

less-

red

Yello

w-re

d

Color

less-

pink

Color

less-

pink

Blue

-colo

rless

Yello

w-pi

nk

NKM

nO,=

wt

Na

,C,O

,)/

(ml

X 0.

0670

)

N KS

CN

= (w

t Ag

)/ (m

l X

0.10

787)

N Ag

NO,

= (w

t N&

l)/

(ml

X 0.

0584

5)

N Na

OH

= W

~W

W,)/

(m

l x

0.20

422)

N

NaOH

=

(wt

KHC,

H,O,

)/ (m

l X

0.20

122)

N

N&O,

=

(wt

KIO,

)/(m

l x

0.03

567)

N =

(WI

NaF

per

liter)/

(ml

X 4.

1998

)

Page 16: Analysis of Plating Solutions

Table V. Indicators for Analyses

I .O g sodium alirarm sulfonate. I .nnO ml HzO. 0.4 g bromocresol green, 1,000 ml H,O, 0 5 ml I .O N NaOH. 0.4 8 bromocresnl purple, I.000 ml HzO. I .O ml I .O N NaOH. 2.0 s Eriochrome Black T, I98 ~0 NaCI. 5.0 g Eriochrome Black T, 150 ml methanol. 100 ml trlethanolamlne. SO p ferrous ammoGum wlfntc, 950 ml HLO. In ml cwt. HNO,. 20 g KJrO,. 9X0 ml H,O. 1 .O s methyl orange (sodium \altL I.000 ml H,O. 2.0 g murexide. 198 g NaCI. I .O g peroxyacetal nitrate. I.000 ml methanol. I.0 g phenolphthalein. 500 ml cthsnol. 500 ml HzO. IO.0 g ?tarch. 1.000 ml hot H,O, 0.5 ml formaldehyde. IO0 ml sulfa oran,q. IO g NaCN. 845 ml H>O.

40 g nmmon~um oxalate, 960 ml HzO. IO s dimethylglyoxime. I.000 ml ethanol. 01solve 40 g monochloroacetic aad in 400 ml Hz0 and divide the

solutmn m two equal parts. Add phenolphthalein to one pal-t alld titrate with I .O N NaOH f~rwn coIorlew to pink Mix both parts and add HZ0 to 1,000 ml.

100 g KF dirsolved in 1,000 ml HzO. Neutralize to pH 7.0 with I .O N NaOH.

IO0 g NaCN, 900 ml H,O. I35 g Na,SO,, 950 ml &O 3SO ml cont. NH,OH, S4 g NH,CI, 625 ml H20. I00 ml cont. HCI. 250 ml cont. HC,H,O,. 200 ml ethanol.

4.50 ml H,O. 200 g Kochelle wits, X00 ml H?O. 2.0 g SbCI,. 100 ml 50% HCI. IO s AgNO,, 95 ml H,O. I00 g sodium sulfite, 950 ml H,O. Ad,ju\t to pH 9.0 with I.0 N

NaOH or I.0 N HCI. Solution ha\ a I-week shelf hfe. IS0 g tartaric acid, 950 ml H20.

Table VII. Properties of Reagent Grade Acids

ACId F,mmrlu

Acetic HC,H,OZ Fluoboric HBF, FllWllC HCHO, Hydrobromlc HBI Hydrochloric HCI Hydrofluoric HF Nitric HNO, Phosphoric HJ-3, Sulfuric H,SO,

Wf ‘2

99 .o 48.0 98.0 48.0 36.0 70.0 70.0 85.0 93.0

Specific Gruvirv (60°F)

I .oso I.365 I .220 1.490 I.181 I .256 I.420 I.690 I.835

Porrr~dr/Gall,m

X.76 I I .3X in.17 Il.43

9.87 IO.48 1 I XJ 13.09 IS.30

536

Page 17: Analysis of Plating Solutions

Tabl

e VI

II.

Test

M

etho

ds

for

Elec

tropl

atin

g So

lutio

ns

Erus

c C

uCN

(M

etho

d I)

2 m

l

CuC

N

(Met

hod

11)

2 m

l

Zn(C

N),

5 m

l

NaC

N

or

5 m

l KC

N

NaO

H or

5

ml

KOH

Na,C

O,

or

IO m

l

KG’,

IS m

l co

nt.

HNO

,. he

at t

o bl

ue c

olor

, IO

0 m

l H,

O,”

cont

. NH

,OH

to d

eep

blue

, he

at t

o 14

0°F.

an

d ad

d PA

N.

0.1

M

EDTA

100

ml

HzO

. 15

ml

cow.

HN

O,,

heat

to

0.1

N N&

O,

blue

col

or

and

disa

ppea

ranc

e of

bro

wn

fum

es,

NH,O

H to

dee

p bl

ue.

acet

ic ac

id

to l

ight

bl

ue,

5 g

KI.

Titra

te

with

N&

O,

to p

ale

yello

w.

add

5 m

l st

arch

so

lutio

n,

cont

inue

tit

ratin

g to

col

orle

ss.

IO0

ml

H,O

, 10

ml

pH

IO b

uffe

r, EB

T po

wder

, an

d I5

ml

10%

for

mal

dehy

de.

0. I

M E

DTA

100

ml

H,O

an

d 10

ml

IO%

KI

. 0.

1 N

AgNO

,

25 m

l Hz

0 an

d 5

ml

culfo

-ora

nge.

1.

0 N

HCI

100

ml

hot

H,O

, 35

ml

10%

Ba(

NO&.

al

low

to

set

tle.

filte

r. wa

sh

filte

r tw

ce

with

ho

t H,

O,

trans

fer

filte

r pa

per

and

prec

ipita

te

to a

bea

ker.

add

lo0

ml

H,O

, an

d m

ethy

l or

ange

.

I .O

N H

Cl

Purp

le-g

reen

C

uCN

(&

gal)

= 2.

985

X M

X

[2

X C

uCN

m

l -

0.8

X Zn

(CN)

, m

l]

Blue

-col

orle

ss

CuC

N

(or/g

al)

= m

l X

5.97

1 X

N

Red

-blu

e Zn

(CN)

, (o

~iga

l) =

ml

X 3.

131

X M

Cle

ar-tu

rbid

N

aCN

(o

z/ga

l) =

ml

X 2.

614

X N

KCN

to

&gal

) =

ml

X 3.

473

X N

Ora

nge-

yello

w Na

OH

(o&a

l) =

ml

X 1.

067

X N

KOH

(or/g

al)

= m

l X

1.49

6 X

N

Ora

nge-

pmk

Na,C

O,

(or/g

al)

= m

l X

0.70

7 X

N

K&O

, (o

71gz

.l) =

m

l X

0.92

1 X

N

Page 18: Analysis of Plating Solutions

Tubl

e VW

. Te

st

Met

l~u&

fu

r El

wtru

plat

ing

Sulu

tiuns

~w

~r.)

Burt1

KNaC

,H,0

,.4H

20

Btw

n~e

Cu

(Met

hod

I)

Heag

enrs

Su

rnpl

e Si

re

(To

be d

ied

in u

&r

liste

d)

Titru

nt

Col

or

Cha

nge

Cal

cula

tions

(m

l. iV

. M

-tirr

unt)

5 m

l 25

ml

20%

H,

SO,.

filte

r, wa

sh

tIa%

k an

d 0.

1 N

KMnO

, Co

lorle

ss-p

ink

KNaC

,H,0

,,~4H

aO

(ozl

gal)

= fil

ter

pape

r tw

ice

each

with

H,

O,

and

ml

X 1.

250

X N

boil

the

colle

cted

fit

trate

5

min

utes

,

2 m

l 15

ml

cont

. HN

Os,

he

at t

o bl

ue c

olor

, 0.

I M

ED

TA

Purp

le-g

reen

C

u (o

z/ga

l) =

ml

X 4.

236

X M

lo

0 m

l H,

O,

cont

. NH

,OH

to d

eep

blue

. he

at t

o Ill

O’F

an

d dd

PA

N.

Cu

(Met

hod

II)

Sn

2 m

l 10

0 m

l H,

O.

I5 m

l co

rm.

HNO

,, he

at t

o bl

ue c

olor

an

d di

sapp

eara

nce

of b

rown

fu

mes

, NH

,OH

to d

eep

blue

, ac

etic

acid

to

lig

ht

blue

, 5

g KI

. Ti

trate

w

ith

Na,S

,O,

to p

ale

yello

w,

add

5 m

l st

arch

so

lutio

n,

cont

inue

tit

ratin

g to

col

orle

ss.

0. I

N N

a,S?

O,

Blue

-col

orle

ss

Cu

(ozl

gal)

= m

l X

4.23

6 X

N

5 m

l 10

0 m

l H

20.

50 m

l co

nt.

HCI,

3.0

g iro

n 0.

1 N

KI-K

IO,

Cle

ar-b

lue

Sn (

or&I

) =

ml

X I.5

113

X N

powd

er

in 5

00.m

l tla

sk.

Stop

per

flask

w

ith

stop

per

litte

d w

ith

a gl

ass

tube

Im

mer

sed

in a

bea

ker

fille

d w

ith

satu

rate

d bi

carb

onat

e so

lutio

n.

Hea

t ge

ntly

til

l iro

n di

ssol

ves.

C

ool

to r

oom

te

mpe

ratu

re,

mak

ing

sure

ou

tlet

tube

is

imm

erse

d in

bic

arbo

nate

so

lutio

n.

Add

10 m

l st

amh

solu

tion

and

bica

rbon

ate

durin

g tit

ratio

n.

NaC

N

or

KCN

5

ml

IO0

ml

Ha0

an

d IO

ml

IOKI

. 0.

1 N

AgNO

, C

lear

-turb

id

NaC

N

(&ga

l) =

ml

X 2.

614

X N

KCN

(o

r/gal

) =

ml

x 3.

473

x N

NaO

H or

KO

H 5

ml

25 m

l Hz

0 an

d S

ml

rullo

-ora

nge.

I .

o N

tic1

Ora

nge-

yello

w Na

OH

(otig

al)

= m

l x

I.067

x

N KO

H (o

z./g

al)

= m

l X

I.496

X

N

Page 19: Analysis of Plating Solutions

Tabl

e VI

II.

Test

M

etho

ds

for

Elec

tropl

atin

g So

lutio

ns

(con

t.)

Bat

h S

ump/

e S

ix!

NaJO

, or

IO

ml

K&O

,

KNaC

,H,0

,.4H

I0

Cud

miu

m

Cym

ide

Cd

Tota

l an

d Fr

ee N

aCN

NaO

H

NnJO

,

5 m

l

2 m

l

5 m

l

s m

l

10 m

l

100

ml

hot

HzO

, 35

ml

10%

Ba(

NO&,

al

low

to

set

tle,

filte

r, wa

sh

filte

r tw

ice

with

ho

t H,

O,

trans

fer

filte

r pa

per

and

prec

ipita

te

to a

bea

ker,

add

100

ml

H20

an

d m

ethy

l or

ange

.

25 m

l 20

%

H,SO

,, fil

ter,

wash

fla

sk

and

filte

r pa

per

&ice

ea

ch w

ith

H,O

. an

d bo

il th

e co

llect

ed

filtra

te

5 m

inut

es.

100

ml

H,O

, 10

ml

pH

IO b

uffe

r, EB

T po

wder

, an

d IS

ml

10%

for

mal

dehy

de.

100

ml

HzO

, 15

ml

cow.

NH

,OH,

an

d IO

ml

10%

KI.

25

ml

HZ0

and

5 m

l su

lfa-o

rang

e.

IO0

ml

hot

HZO

, 3.

5 m

l 10

% B

a(NO

&,

allo

w

to s

ettle

, fil

ter,

wash

filt

er

twce

w

ith

hot

HzO

, tra

nsfe

r fil

ter

pape

r an

d pr

ecip

itate

to

a b

eake

r, ad

d 10

0 m

l H,

O

and

met

hyl

oran

ge.

100

ml

H20

, IO

ml

pH

IO h

uffc

r, EB

T po

wder

, an

d 15

ml

10%

for

mal

dehy

de.

1.0

N HC

I

0.1

N KM

nO,

0.1

M E

DTA

0.1

N Ag

NO,

I .O

N H

CI

I .O N

HCI

0.1

M E

DTA

Ora

nge-

pmk

NaJO

, (a

dgal

) =

ml

x 0.

707

x N

KLCO

, (o

&d)

= m

l x

0.92

1 X

N

Colo

rless

-pin

k KN

aC,H

,0,.4

H20

(o

r/gal

) =

ml

X 1.

250

X N

Red

-blu

e C

d (o

r/gal

) =

ml

x 7.

493

X M

Cle

ar-tu

rbid

To

tal

NaC

N

(ozl

gal)

= m

l X

2.61

3 X

N Fr

ee

NaC

N

(or/g

al)

= To

tal

NaC

N

- 1.

744

X C

d O

rang

e-ye

llow

NaO

H (o

zlga

l) =

ml

X I.0

67

X N

Ora

nge-

pink

Na

JO,

(w/g

al)

= m

l X

0.70

7 X

N

Red

-blu

e C

d (w

/gal

) =

ml

x 7.

493

X M

Page 20: Analysis of Plating Solutions

3

Page 21: Analysis of Plating Solutions

Tabl

e VI

II.

Test

M

etho

ds

for

Elec

tropl

atin

g So

lutio

ns

(um

r.)

Co/~

/w

Cw

mid

e C

uCN

(M

etho

d I)

CuC

N

(Met

hod

II)

25 m

l 10

0 m

l H

,O.

100

ml

rcdu

cmg

solu

tion.

ho

i1 3

0 m

inut

es,

rem

ove

from

he

at,

add

SO

ml

10%

B

a(N

O?)

,, 10

0 m

l ho

t H

,O.

Allo

w

aolu

tmn

to

wnd

fo

r 31

1 ho

urs,

he

at

solu

tion

to

bolh

ng.

Filte

r in

tar

ed

Goo

ch

cruc

ible

, w

ash

prea

pita

te

wth

ho

t H

:O,

dry

in o

ven

at 1

10°C

. co

ol

,n

dew

catn

r an

d w

afh.

SO

, (d

pall

= (w

eigh

t tn

:rn

ms

of

prec

ipita

te)

x 2.

195

5 m

l 10

0 m

l H

,O,

I.0

N

NaO

H

to p

H

7.5.

0.

I N

Th(

NO

,),

Yel

low

-pin

k F

(o-r

&d)

=

ml

X

0.50

7 X

N

usin

g a

pH

met

er

prev

ious

ly

stan

dard

tzed

to

pH

7.

0.

Add

10

%’

AgN

O,

solu

tion

until

th

e dl

sapp

eartw

ce

of

the

yrlln

w

colo

r af

ter

scttl

inf

of

the

prec

ipita

te,

flltc

r, w

ash

prcc

iput

e,

swe

filtr

ate.

A

dd

Alir

arm

In

dica

tor.

2%

HN

O,

till

colo

r of

w

lutio

n ch

ange

s fro

m

pink

to

yel

low

. A

dd

3 m

l tlu

orld

c hu

ffer.

2 m

l IS

ml

cont

. H

NO

,. he

at t

o bl

ue

C&

II-.

100

~ml H

>O,

cont

. N

H,O

H

to d

eep

hluc

. hu

t to

14

0°F.

an

d ad

d P

AN

.

0.1

M

ED

TA

PW

ple-

prW

l C

uCN

(o

&d)

=

ml

X 5

.971

X

M

2 m

l 10

0 m

l H

ZO.

IS m

l co

w.

HN

O,.

heat

to

bl

ue c

olor

an

d di

sapp

eara

nce

of

brow

n fu

mes

, N

H,O

H

to d

eep

blue

. ac

etic

ac

td

to l

ight

bl

ue,

5 g

KI.

Titra

te

wth

N

a,S

,O,

to p

ale

yello

w.

add

5 m

l st

arch

w

lutio

n,

cont

inue

tit

ratin

g to

col

orle

u.

0.1

N N

a,S

,O,

Blu

e-co

lorle

ss

CuC

N

(w/g

al)

= m

l X

5.9

71

X

N

Page 22: Analysis of Plating Solutions

E N

Tabl

e VI

II.

Test

M

etho

ds

for

Elec

tropl

atin

g So

lutio

ns

(wn~

.)

NaC

N

or

KCN

NaO

H 01

KO

H

KNnC

,H,0

;4H

20

Cu

(Met

hod

II)

5 m

l

5 m

l

IO m

l

5 m

l

2 m

l

2 m

l

IO m

l

2 m

l

I00

ml

H,O

an

d IO

ml

IO%

KI

.

25 m

l Hz

0 an

d 5

ml

aulfo

-ora

nge.

I00

ml

hot

H,O

, 35

ml

10%

Ba

(NO

,)>.

~110

~ tu

set

tle.

filte

r, wa

sh

filte

r tw

ice

with

ho

t HZ

O.

trans

fer

filte

r pa

per

and

prec

ipita

te

to a

bea

ker,

add

100

ml

H,O

, an

d m

ethy

l or

ange

.

2S m

l 20

%

H2S

0,,

filte

r, wa

sh

flask

an

d fil

ter

pape

r tw

ice

each

with

Hz

O.

and

bow

l the

col

lect

ed

filtra

te

5 m

inut

es.

100

ml

H,O

, co

w.

NH,O

H to

dee

p bl

ue,

heat

to

140-

F.

and

add

PAN

IO0

ml

HLO

, NH

,OH

to d

eep

blue

, ac

ctw

acid

to

light

blu

e,

5 g

KI.

Titra

te

with

N&

O,

to p

ale

yello

w,

add

5 m

l st

arch

w

lutio

n,

cont

inue

tit

ratin

g to

W

lWl%

S.

IO0

ml

Hz0

and

met

hyl

oran

ge.

100

ml

H,O

co

nt.

NH,O

H to

dee

p bl

ue.

heat

to

140°

F an

d ad

d PA

N.

0.1

N Ag

NO,

I .O

N H

CI

I .O

N H

CI

0.1

N KM

nO,

0.1

M E

DTA

0. I

N N

a2S2

0,

I .O

N N

aOH

0.1

M E

DTA

Clea

r-tttr

btd

Ora

nge-

yello

w

Ora

nge-

pink

Colo

rless

-pin

k

Purp

le-g

reen

Blue

-col

orla

s

Red-

pree

n

NCN

(w/g

al)

= m

l X

2.61

4 X

N KC

N

(w/g

al)

= m

l x

3.47

3 X

N

NaO

H (o

ziga

ll =

ml

x I.0

67

x N

KOH

(ozi

fal)

= m

l X

1.49

6 X

N

Na,C

O,

(~&V

I) =

ml

X 0.

707

X N

KJO

,. et

c K,

CO,

(o//g

al)

= m

l x

ll.Y2

1 X

N

KNaC

,H,O

,.4H,

O

(w/g

al)

= m

l x

I.250

X

N

Cu

(o&l

) =

ml

X 4.

236

X M

CU

BF,),

i&

gal)

= C

u X

3.73

Cu

(ozl

gal)

= m

l x

4 2%

X

N

lOO

r/,

HBF

, (o

z/.&

) =

ml

X I.1

71

X N

Cu

(or/g

al)

= m

l X

4.2X

1 X

M

Page 23: Analysis of Plating Solutions

Tabl

e VI

II.

Test

M

etho

ds

for

Elec

tropl

atin

g So

lutio

ns

(con

r.)

Bat

h S

ampl

e S

ize

Rea

gent

s (T

o he

add

ed

in o

rder

lis

ted)

Ti

VfW

U

Col

or

Cha

nge

Cal

cula

tions

(m

l. N

. M

-titra

nt)

Cu

(Met

hod

II)

2 m

l

Tota

l P,

O,

5 m

l

100

ml

H,O

, NH

,OH

to d

eep

blue

, ac

e-

0.1

N Na

,S>O

, Bl

ue-c

olor

less

tic

aci

d to

lig

ht b

lue,

5

g KI

. Ti

trate

w

ith

Na&O

, to

pal

e ye

llow

, ad

d 5

ml

star

ch

solu

tion,

co

ntin

ue

titra

ting

to c

olor

less

. 10

0 m

l H,

O,

1.0

N H

Cl

drop

wise

to

pH

I .

O N

NaO

H 3.

8 (u

se p

H

met

er

stan

dard

ized

at

pH

4.

0),

back

-titra

te

with

1.

0 N

NaO

H if

pH

3.8

is ov

ersh

ot,

stir

5 m

inut

es

and

mak

e su

re p

H

is 3.

6-3.

8,

add

50 m

l 20

%

ZnSO

, (a

djus

ted

to p

H

3.8)

and

stir

IO

m

inut

es.

Titra

te

slow

ly

with

st

inin

g us

ing

1 .O

N N

aOH

to p

H

3.8

(not

e th

ese

ml

NaO

H us

ed f

or

calc

ulat

ion)

.

10 m

l 20

0 m

l Hz

O,

boili

ng

chip

s,

50 m

l 20

%

NaO

H III

Kje

ldab

l fla

sk.

Atta

ch

flask

to

th

e di

still

atio

n ap

para

tus

with

th

e co

llect

ion

tube

fro

m

the

cond

ense

r im

mer

sed

m a

bea

ker

cont

aini

ng

100

ml

satu

rate

d H,

BO?

solu

tion.

Bo

il fla

sk

and

diqt

dl

over

10

0 m

l. Re

mov

e be

aker

an

d ad

d m

ethy

l or

ange

.

0.1

N HC

I Ye

llow

-red

Cop

per

sulfa

te

Cu

(Met

hod

I) 2

ml

100

ml

HzO

, co

nt.

NH,O

H to

dee

p bl

ue,

heat

to

140°

F.

and

add

PAN

. 0.

1 M

ED

TA

Purp

le-g

reen

Cu

(Met

hod

II)

2 m

l 10

0 m

l H,

O.

NH,O

H to

dee

p bl

ue,

acet

ic ac

id

to l

ight

bl

ue,

5 g

KJ.

Titra

te

with

Na

,S,O

, to

pal

e ye

llow

, ad

d 5

ml

0.1

N N&

O,

BIIE

COlO

TkSS

star

ch

solu

tion,

co

ntin

ue

titra

ting

to

colo

rless

.

Cu

(oz/

gal)

= m

l X

4.23

6 X

N

Tota

l P,

O,

(oz/

gal)

= m

l X

2.32

X

N +

Cu

X 1.

37

Rat

io

= [T

otal

P,

O,

(oz/

gal)l

lCu

Cod

gal)

29%

NH

, (o

z/ga

l) =

ml

x 0.

80

x N

Cu

(&ga

l) =

ml

X 4.

236

X M

C

uS0,

.5H

z0

(oz/

gal)

= C

u X

3.93

Cu

(w/g

al)

= m

l X

4.23

6 X

N

W

Page 24: Analysis of Plating Solutions

r

4

-2

Page 25: Analysis of Plating Solutions

545

Page 26: Analysis of Plating Solutions

t

Page 27: Analysis of Plating Solutions

Tabl

e VI

II.

Test

M

etho

ds

for

Elec

tropl

atin

g So

lutio

ns

(mu.

)

-

Ni

NaS

CN

Nick

el

Fluo

bnm

fr N

i HP%

Nick

el

Strik

e N

i

HC

I

Nick

el

Sulfa

mut

e N

i

NiB

rz

NiC

12.6

H,0

WC

’,

2 m

l

10 m

l

2 m

l

IO m

l

2 m

l

10 m

l

2 m

l

5 m

l

20 m

l

IO m

l

100

ml

H,O

, IO

ml

cow

N

H,O

H,

and

mur

exid

e po

wde

r.

100

ml

H,O

, 15

ml

20%

H

$O,,

and

FAS

in

dica

tor.

100

ml

HzO

, IO

ml

cow

. N

H,O

H,

and

mur

exid

e po

wde

r.

25 m

l H

20,

5.0

g m

anni

tol,

and

brom

ocre

sol

purp

le.

100

ml

H,O

, 20

ml

cont

. N

H,O

H,

and

mur

exid

e po

wde

r.

IO

ml

HZ0

an

d m

ethy

l or

ange

.

100

ml

HzO

, 20

m

l co

nt.

NH

,OH

, an

d m

urex

ide

pow

der.

100

ml

H,O

an

d K

,CrO

,.

100

ml

HZ0

an

d K

ZCrO

,.

25 m

l H

ZO.

5.0

g m

anni

tol,

and

hrom

ocre

sol

purp

le.

Titra

nr

Col

or

Chu

n@?

Cal

culu

tions

(m

/, N,

M-ri

tmnr

)

0.1

M

ED

TA

0.1

N

AgN

O,

0.1

M

ED

TA

I .O

N N

aOH

0.1

M

ED

TA

1 .O

N

NaO

H

0.1

M

ED

TA

0.1

N

AgN

O,

0. I

N

AgN

O,

I .O

N

NaO

H

Ora

nge-

purp

le

Red

-col

orle

ss

Ni

(w/g

al)

= (m

l E

DTA

fo

r N

i -

ml

ED

TA

for

Zn)

X

3.91

4 X

M

NaS

CN

(o

z./g

al)

= m

l X

I.0

81

X

N

Ora

nge-

purp

le

Gre

en-p

urpl

e

Ora

nge-

purp

le

Red

-yel

low

/gre

en

Ora

nge-

purp

le

Yel

low

/gre

en-r

ed

Yel

low

/gre

twed

Gre

en-p

urpl

e

Ni

(or/g

al)

= m

l X

3.

914

X M

H,BO

, (“

z/ga

l) =

ml

x 0.

824

x N

Ni

(o&

gal)

= m

l X

3.

914

X M

36%

H

CI

(tl

oz./g

al)

= m

l X

I.1

IS

x

N

NI

(oz/

pal)

= m

l x

3.91

4 x

M

NiB

r,

(oz1

gal)

= m

l X

2.

914

X

N

NiC

l,.6H

z0

(ozl

gal)

= m

l x

0.79

2 x

N

H,B

O,

(oz.

/gal

) =

ml

X

0.82

4 X

N

Page 28: Analysis of Plating Solutions

c

0

548

Page 29: Analysis of Plating Solutions

Tabl

e VI

II.

Test

M

etho

ds

for

Elec

tropl

atin

g So

lutio

ns

(con

t.)

Rut

h S

amD

Ie S

ix7

Rea

gent

s (T

o be

add

ed

in o

rder

lis

ted)

Ti

rrun

t C

olor

C

hann

e C

alcu

lutim

r (m

l. N

, M

-titru

nt)

Pal

ladi

um

Pd

Pla

tinum

Pl

Rho

dium

R

h

IO m

l IO

ml

cont

. HN

O,,

heat

unt

d sy

rupy

, IO

m

l co

nt.

HNO

,, he

at t

o on

set

of b

oilin

g.

Add

250

ml

H,O

, co

ol,

slow

ly

add

40

ml

dim

ethy

lgly

oxim

e so

lutio

n,

allo

w

solu

tion

to s

tand

at

leas

t 2

hour

s,

filte

r th

roug

h N

o. 3

por

osity

ta

red

cruc

ible

, wa

sh

prec

ipita

te

with

H

20.

Dry

in o

ven

at 1

IO’C

, co

ol

m d

esicc

ator

, an

d w

eigh

.

IO m

l 10

ml

cont

. HC

I, he

at u

ntil

syru

py,

100

ml

H,O

, 5

g so

dium

ac

etat

e,

1 m

l co

nt.

form

ic

acid

, he

at a

t l4

0’F

for

5 ho

urs,

fil

ter,

wash

pr

ecip

itate

w

ith

hot

H,O

. Pl

ace

filte

r pa

per

and

Pt p

reci

pita

te

in

tare

d po

rcel

ain

cruc

ible

, dr

y sl

owly

w

ith

Buns

en

burn

er,

char

fil

ter

pape

r, dr

y Pt

pr

ecip

itate

at

hig

h te

mpe

ratu

re

for

30

mm

utes

. C

ool

in d

esicc

ator

an

d w

eigh

.

25 m

l 2

g M

g tu

rnin

gs,

cont

. HC

I dr

opwi

se.

Whe

n al

l M

g di

ssol

ves,

ad

d 0.

5 g

Mg

tum

mgs

an

d HC

I dr

opwi

se

to e

nsur

e co

mpl

ete

prec

ipita

tion

of R

h.

Filte

r so

lutio

n in

tar

ed G

ooch

cr

ucib

le

cont

aini

ng

fiber

glas

s fil

ter

pape

r, wa

sh

prec

ipita

te

with

ho

t Hz

O,

dry

in o

ven

at

I IO

’C,

cool

in

des

iccat

or

and

wei

gh.

Pd (

g/L)

=

(wei

ght

in g

ram

s of

pr

ecip

itate

) X

3 I .6

7

Pt (

g/L)

=

(wet

ght

in g

ram

s of

pr

ecip

itate

) X

100.

0

Rh

(g/L

) =

(wei

ght

in g

ram

s of

pr

ecip

itate

) X

40.0

WO,

or IO

ml

100

ml

H,O

an

d m

ethy

l or

ange

. I .

O N

NaO

H R

ed-y

ello

w/g

reen

10

0% H

,SO

, (g

/L)

= m

l X

4.90

4 X

N

E!

HP%

10

0% H

,PO

, (g

/L)

= m

l X

9.80

0 X

N

W

Page 30: Analysis of Plating Solutions
Page 31: Analysis of Plating Solutions

Tabl

e VI

II.

Test

M

etho

ds

for

Elec

tropl

atin

g So

lutio

ns

(con

t.)

Buth

SIld

+

Keu,

Lynr

s - Sm

ple

six

(To

be a

dded

bt

ord

er-

liste

d)

Titru

nt

Col

or

Cllu

n,~r

~‘

dulu

tions

(m

l, N

, M

-trtm

t)

2 11

11

In 5

00-m

l fla

sk

add

sam

ple,

III

0 m

l 0.

1 N

KI-K

IO,

Cok

IrleS

S-bl

Ue

SnJ+

(o

/gal

) =

ml

X 3.

Y.56

X N

-

cow.

H

Cl,

2 dr

ops

ShC

I, so

lotlo

n.

Add

S”L+

IX0

ml

H>O

. Si

n.

fold

ed

‘V-s

hape

d ni

ckel

st

rip

and

5.0

g re

duce

d no

n po

wder

. St

oppe

r fla

sk

with

ru

hhet

<t

oppe

r fit

ted

wth

%

-in.

&is\

tu

be

lmm

erae

d in

to a

sat

urat

ed

NaHC

O,

wlu

tion.

H

eat

solw

on

on h

ot p

late

to

hoi1

for

20 m

inut

es

and

then

pla

ce i

x co

olin

g ta

nk

and

allo

w

to c

ool

to r

oom

te

mpe

ratu

re.

Mak

e W

C gl

ass

outle

t tu

hc

IS u

mne

rsed

in

the

NRU

CO,.

Rem

ove

stop

per

and

add

star

ch

aolu

tirn.

HBF

, IO

ml

Free

H,B

O,

IO m

l

100

ml

HLO

an

d m

ethy

l or

ange

. I.0

N

NaO

H C

lear

-turb

id

100%

HBF

, (o

r/gal

) =

ml

X

I.171

X

N

100

ml

H20

, IO

ml

Na2

S0,

solu

tion.

Ti

trate

to

pH

7.0

, us

ing

a pH

m

eter

pr

evio

usly

stan

dard

ized

to

pH

7.0

. Ad

d S

g m

anm

tol,

titra

te

from

pH

7.

0 to

pH

X.

0 (m

l Na

OH

requ

ired

for

thin

ste

p w

e us

ed

for

the

calc

ulat

ion)

.

I .tl

N Na

OH

H,BO

, (o

r/gal

) =

ml

X 0.

824

X N

Page 32: Analysis of Plating Solutions

Tin

Sran

nate

K

ZSn0

,.3H

Z0

Naz

S”0

,.3H

z0

5 m

l 10

0 m

l H

,O.

50

ml

cont

. H

CI.

3.0

g iro

ll 0.

I N

K

I-KIO

, C

OlO

ibS-

blue

K

,Sn0

,.3H

I0

(cr//

g;d)

=

“~1

X

3.98

6 X

po

wde

r in

S

W-m

l tla

sk.

Sro

pper

lla

sk

N

with

st

oppe

r fit

ted

with

a

glas

s tu

be

Na,

Sn0

,.3H

10

Wga

ll =

imm

crsc

d in

a b

eake

r fil

led

with

m

l x

3.5%

x

N

KO

H

NaO

H

Tin

Sulfu

te

snso

,

S”4’

satu

rate

d bi

carb

onat

e so

lutio

n.

Hea

t ge

ntly

til

l iro

n di

ssol

ves.

C

ool

IO r

o+)ln

te

mpc

rattu

rc,

mak

ing

sure

ou

tlet

tuhr

is

im

mer

sed

in b

icar

bona

te

solu

tion.

A

dd

10 m

l st

arch

so

lutio

n an

d bi

carb

onat

e du

ring

titra

tion.

5 m

l 25

ml

H,O

an

d S

ml

sulfo

-ora

nge

1.0

N

HC

I O

rang

e-ye

llow

K

OH

(o

x&l)

= “1

1 X

I.1

96

X

N

NuO

H

(o/&

al)

=- “

11 X

1.

067

X

N

5 m

l 10

0 m

l H

20,

25 m

l 50

%

HC

I, IO

ml

star

ch

solu

tion,

ad

d bi

carb

onat

e du

ring

titra

tion.

0.1

N

KI-K

IO.,

Col

orle

ss-b

lue

SnS

O,

(oz.

/gel

) r

ml

X

‘.X63

X

N

S

””

(oz.

/gal

) =

SnS

O,

x 0.

5.53

2 m

l In

SW

-ml

fla.k

ad

d sa

mpl

e.

100

ml

0.1

N

KI-K

IO,

Col

orle

ss-b

lue

Sn4

+ (o

Ilgal

) =

cont

. H

CI,

2 dr

ops

SbC

I, so

lutio

n.

Add

m

l x

3.95

6 X

N

.-

Sn”

18

0 m

l l-1

,0.

5-i”.

fo

lded

“U

’-sha

ped

nick

el

strip

an

d 5.

0 g

redu

ced

imn

pow

der.

Sto

pper

fla

sk

with

ru

bber

st

oppe

r fit

ted

with

%

-in.

glas

s tu

be

imm

erse

d in

to

a sa

tura

ted

NaH

CO

, so

lutio

n.

Hea

t so

lutio

n on

ho

t-pl

ate

to

boil

for

20

min

utes

an

d th

en

plac

e in

co

olin

g ta

nk

and

allo

w

IO c

ool

to

room

te

mpe

ratu

re.

Mak

e su

re

glas

s ou

tlet

tube

is

im

mer

sed

in t

he

NaH

CO

,. K

rmov

e st

oppe

r an

d ad

d st

arch

so

lutio

n.

Page 33: Analysis of Plating Solutions

Tabl

e VI

II.

Test

M

etho

ds

for

Elec

tropl

atin

g So

lutio

ns

(wm

.J

HZS

O,

100

ml

H,O

, 25

ml

amm

oniu

m

oxal

ate

solu

tion,

an

d m

ethy

l or

ange

. I .

O N

N

aOH

R

ed-

100%

H

:SO

, (o

r/gal

) =

ml

X

0.65

4 or

anpc

/yel

low

%

v

H,S

O,

= m

l X

0.

279

X

N

100

ml

H,O

, 25

m

l S

O6

HC

I, IO

ml

star

ch

0.1

N

KI-K

IO,

Col

orle

\\-bl

ue

St?

(w

&al

) =

ml

X

3.95

6 x

N

sufu

t~on

, ad

d bu

rbon

ate

durin

g te

non

St?

+ 2

ml

In

St&

ml

flask

ad

d sa

mpl

e,

I00

ml

cow

. H

CI,

2 dr

ops

SbC

I, so

Iut\w

. A

dd

180

ml

H,O

, 5-

in.

fold

ed

“Wsh

aped

ni

ckel

st

rip

and

5.0

g re

duce

d ~r

nn

pow

der.

Sto

pper

fla

sk

with

ru

bber

st

oppe

r flt

ted

wth

%

-in.

glas

s tu

be

Imm

ened

in

to

;t ut

urat

ed

NaH

CO

, w

lutio

n.

Hea

t so

lutio

n on

hot

-pla

te

to

boil

I’or

20

min

utes

an

d th

en

plac

e m

co

olin

g ta

nk

and

allo

w

to c

ool

to w

orn

tem

pera

ture

. M

ake

cure

gl

a\\

outle

t tu

be

is i

mm

erse

d in

the

NaH

CO

,. R

emw

e st

oppe

r an

d ad

d \ta

rch

\oI~

t~m

~.

0.1

N

KI-K

IO,

Col

orle

ss-b

lue

Sn”

(o

&al

) =

ml

x 7.

956

X N

-

Sn“

Ph

2 m

l 5

ml

cow

. H

NO

,, he

at t

ill

sym

py.

cool

an

d ad

d:

25 m

l R

oche

lle

solu

tmn,

IS

m

l co

nt.

NH

,OH

, 15

ml

10%

N

aCN

an

d E

BT

solu

tion.

0. I

M

ElIT

.4

Red

-blu

e P

b to

rigal

) =

1111

X

13.X

13 X

M

HBF

, IO

ml

100

ml

H,O

. I .

O N

N

aOH

C

lcsr

-tul-h

id

1004

H

BF,

(o

ziga

l) =

ml

X

I.171

X

N

Page 34: Analysis of Plating Solutions

E

554

Page 35: Analysis of Plating Solutions

555

Page 36: Analysis of Plating Solutions

The Technology of Anodizing Aluminum,

Third Edition by A. II? Brace

410 pages $210.00

NE WEDITION This valuable book has been completely re- edited and considers signifi- cant new developments in anodizing technology. The expanded volume will satisfy the anodizer who requires more detailed technology. After an introduction, the reader is presented with practi- cal application of the new technology, and the nature of the industry with capital investment appraisal, budget- ing, and cost control. An excellent summary of anodiz- ing technologies in clear lan- guage encompassing the advice of exierienced technicians.

Send Orders to: METAL FINISHING

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Page 37: Analysis of Plating Solutions

557

Page 38: Analysis of Plating Solutions

is

a3 Ta

ble

X.

Test

Met

hods

fo

r An

odizi

ng

Solu

tions

IO

ml

of

stoc

k IO

ml

sam

ple

intc

50

0 m

l vo

lum

etric

. P

ipet

te

IO m

l of

st

ock,

ad

d 10

0 m

l H

,O,”

2 g

amm

oniu

m

hiflu

orid

e,

15 m

l co

nt.

HC

I, IS

ml

IO%

K

l, an

d st

arch

so

lutio

n.

0.1

N

Na,

S,O

, B

lU+W

M~\

~ 00

, (o

zlga

l) =

ml

x 22

.219

X

N

Free

00

,

Sdj

iirric

To

tal

H,S

O,

Free

H

,SO

,

25 m

l

s m

l 5

ml

l(X)

ml

H,O

. Ti

trate

to

pH

3.

05,

usin

g a

pH

met

er

prev

tous

ly

stan

dard

ized

to

pH

4.

0.

100

ml

H20

an

d ph

enol

phth

alei

n.

100

ml

HIO

. IO

ml

KF

solu

tion,

an

d ph

rnol

phth

alrin

.

I ..I

N

NaO

H

Col

orle

ss-p

ink

I .O

N

NaO

H

Col

orle

w-p

ink

I .O

N

NaO

H

Col

orle

wpi

nk

Free

00

, (o

r/gal

) =

ml

X

0.53

3 X

N

Tota

l H

,SO

, (c

&ga

l) =

ml

X

1.30

8 X

N

Fr

ee

H,S

O,

(oz&

al)

= m

l X

1.

308

X

N

Al

Al

(or/g

al)

= (m

l N

aOH

fo

r To

tal

H$O

, -

ml

NaO

H

for

free

H,S

O,)

X

0.24

0 X

N

Page 39: Analysis of Plating Solutions

Tabl

e XI

. Te

st

Met

hods

fo

r Ac

id

Dips

an

d El

ectro

polis

hing

So

lutio

ns

HW,O

,

“&“&

“,~

(Citr

ic ac

id)

HBF

,

HCI

HF

HNO

,

W’O

,

H2S

0,

HNO

, +

HF

H3P

0,

+ H$

O,

H$O

, +

10 m

l

IO m

l

IO m

l

IO m

l

2s

IO m

l

IO m

l

IO m

l

IO m

l I

ml

IO m

l

IO m

l

100

ml

HZO

” an

d ph

enol

phth

alei

n.

100

ml

H20

an

d ph

enol

phth

alei

n.

100

ml

H,O

an

d m

elhy

l or

ange

.

IO0

ml

HLO

an

d m

ethy

l or

ange

.

100

ml

Hz0

and

phen

olph

thal

ein.

(N

ote:

us

e pl

astic

la

hwar

e.)

100

ml

HZ0

and

met

hyl

oran

ge.

100

ml

Hz0

and

met

hyl

oran

ge.

IO0

ml

H,O

an

d m

ethy

l or

ange

100

ml

HZ0

and

met

hyl

oran

ge.

IO0

ml

H,O

. Al

irarin

, I .

O N

NaO

H to

pi

nk.

2% H

NO,

drop

wisc

bo

rn

pink

to

ye

llow

, 3

ml

fluor

ide

buffe

r.

100

ml

H,O

an

d m

ethy

l or

ange

. Ad

d ph

enol

phth

alei

n to

the

sol

utio

n ab

ove.

I00

ml

H,O

an

d m

ethy

l or

ange

.

I .O

N N

aOH

I .O

N N

aOH

I .O

N N

aOH

I .O

N N

aOH

I .O

N N

aOH

1 .O

N N

aOH

I .O

N N

aOH

I .O

N N

aOH

I .O

N N

aOH

0. I

N Th

(NO

,),

I .O

N N

aOH

I .O

N N

aOH

I .O

N N

aOH

Colo

rless

-pm

k

Colo

rless

-pin

k

Red

-yel

low

/gre

en

Red

-yel

low

/gre

en

Col

orle

wpi

nk

Red

-yel

low

/gre

en

Red

-yel

low

/gre

en

Red-

ycllo

wlgr

een

Red

-yel

low

/gre

en

Yello

w-p

ink

Ked-

yello

w/g

reen

Pu

rple

-red

Red

-yel

low

/gre

en

‘70

wt H

C,H,

O,

(100

%)

= (m

l X

0.60

05

X N)

/s.g

. so

lutio

n o/

c wt

H C

H 0

3

6 i

7 .H,

O

= (m

l X

0.70

05

X N

1h.g

. w

lutm

n %

wt

HBF

, (1

00%

) =

(ml

X 0.

8781

X

N)/s

.g.

solu

tion

Q wt

HCI

(1

00%

) =

(ml

X 0.

3646

X

N)/s

.g.

solu

tion

‘% w

t HF

(1

00%

) =

(ml

x 2.

001

x N)

/wt

s/c w

t HN

O,

(100

%)

= (m

l ‘*

0.63

01

X N)

/s.g

. so

lutio

n ‘h

wt

H,PO

, (1

00%

) =

(ml

Y 0.

9800

x

N&g

. so

lutio

n %

, wt

HISO

, (1

00%

) =

(ml

X 0.

4904

X

N)/a

.g.

solu

tion

A m

l B

ml

5’4 w

t HN

O,

(100

%)

= [(A

m

l X

N ~

IO X

B m

l X

N)

X 0.

6301

]/~.

wlu

tion

% w

t HF

(10

01)

= (B

ml

X 20

.006

X

N)/s

.g.

solu

tion

A m

l B

ml

D/ w

t H,

SO,

(100

%)

= ((A

m

l ~

B m

l) X

0.49

04

X N]

/s.g

. so

lutio

n B

wt

H,PO

, (1

00%

) =

(B m

l x

0.98

00

X N)

/s.g

. so

lutio

n %

wt

H$O

, (1

00%

) =

(ml

x 0.

4904

x

N)ls.

g.

solu

tion

Page 40: Analysis of Plating Solutions

IX

560

Page 41: Analysis of Plating Solutions

NQ

O

25 m

l N

a2C

0,

+ N

aOH

IO

ml

IO m

l

NaO

H

+ N

aCN

10

ml

NaO

H

NaC

N

IO m

l N

aZC

O,

+ N

aCN

Ill

m

l IO

ml

NaJ

O,

+ N

a,P

O,

IO m

l

Na,

PO

, +

NaC

N

+ N

azS

i0,.5

Hz0

IO

ml

10 m

l

IOU

ml

HLO

” an

d m

ethy

l or

ange

IO

0 m

l H

,O

and

sulfa

or

ange

. 10

0 m

l H

z0

and

met

hyl

oran

ge.

100

ml

H,O

an

d su

lfa

oran

ge.

I .O

N

HC

I

100

ml

H,O

an

d IO

ml

IO%

K

l. III

0 m

l H

,O

and

met

hyl

oran

ge.

100

ml

H,O

an

d IO

ml

10%

K

I.

0.1

N

AgN

O,

I .O

N

HC

I 0.

1 N

A

gNO

,

IS0

ml

H,O

an

d m

ethy

l or

ange

.

Boi

l ab

ove

solu

lron

5 m

inut

es,

cool

. an

d ad

d ph

enol

phth

alei

n.

150

ml

H,O

an

d m

ethy

l or

ange

Boi

l ah

ove

solu

tion

5 m

inut

es,

cool

. an

d ad

d ph

enol

phth

alei

n.

IOU

ml

Hz0

an

d IO

m

l 10

%

KI.

I .O

N

HC

I I .

O N

H

CI

I .O

N

HC

I

I .U

N

HC

I

I .O

N

NaO

H

I .O

N

HC

I

I .U

N

NaO

H

(1.1

N

AgN

O,

Yel

low

-ora

ngci

rcd

Ora

nge-

yello

w

Yel

low

-ora

nge/

red

Ora

nge-

yello

w

Cle

ar-tu

rbid

Y

ello

w-o

rang

e/re

d C

lear

-turb

id

Yel

low

-ora

nge/

red

Ycl

low

oran

gc/re

d

Col

orle

s-pi

nk

Cle

ar-tu

rbid

Na,

O

(w&

al)

= m

l X

0.

165

X

N

B m

l A

m

l N

a,C

O,

(n/g

al)

= (A

m

l ~

B

ml)X

0.

707

X

N

NaO

H

(or/g

al)

= B

m

l X

0.

533

X N

N

aOH

(w

/gal

) :

ml

X

0.53

3 X

N

NaC

N

(@cd

) =

ml

X

I.307

X

N

A

m

l B

ml

NaC

N

(wig

nl)

= B

ml

X

I.307

X

N

Na2

C01

(r

v/ga

l) =

(A

ml

X

N

- B

ml

X

N)

X

0.70

7 A

m

l

B

ml

Na,

PO

, (n

/gal

) =

B m

l X

2.

I X

6X

N

Na,

CO

, (w

/gal

) =

(A

ml

X N

~

2 X

B

m

l X

N

) X

0.

707

A

ml

B

ml

c 11

11

Na,

PO

, (w

/gal

) =

B m

l X

2.

186X

N

N

aCN

(u

/gal

) =

C

ml

X

1.30

7 X

N

Naz

SiO

,.SH

ZO

(w/g

~l)

= (A

m

l X

N

~

2 X

B

ml

X

N

C m

l X

N

) X

1.

414

Page 42: Analysis of Plating Solutions

562

Page 43: Analysis of Plating Solutions

Table XIII. Alternate Method for Chromic Acid

Drjirees BuumP O~/@lI-cro ( De~wes BuuntP

I .so 2.1 19.00 2.00 2.8 19.50 2.50 3.4 20.00 3.00 4.1 20.50 3.50 4.8 21.00 4.00 5.5 2 I so 4.50 6.2 22.00 5.00 6.8 22.50 5.50 7.5 23.00 6.00 8.2 23.50 6.50 8.9 24.00 7.00 9.7 24.50 7.50 10.4 2.5.00 8.00 I I.1 25.50 X.50 Il.9 26.00 9.00 12.6 26.50 9.50 13.4 27.00

I 0.00 14.2 27.X) IO.50 IS.0 28.00 II.00 15.x 28.50 I I.50 16.5 29.00 12.00 17.3 29.X) 12.X) I x.2 30.00 I3.00 19.1 30.50 13.50 19.8 31.00 14.00 20.4 31.50 14.50 21.2 32.00 IS.00 22.0 32.50 IS.50 22.9 33.00 16.00 23.7 33.50 16.50 24.5 34.00 17.00 2.5.4 34.50 17.50 26.3 35 .oo I x.00 27.2 35.50 IX.50 28. I 36.00

Pmxdure: I. Cool the solution to room temperature after tating. 2. Dctemine the demity 01 the soluuon with a F&m& hydrometer. 3. Read the or/gal OS chrrmmw aud (CrOj) corre~pondm~ to thl\ dcmily

od#lI-Cro~,

29.0 29.8 30.6 31.5 32.4 33.3 34.2 3.5.1 36.0 37.1 3x.2 39. I 40.0 40.9 41.9 42.9 44.0 4.5 .o 46.0 47.1 48.2 49.2 SO.2 51.5 52.7 54.0 55.2 56.3 57-S 58.7 60.0 61.2 62.3 63.5 64.X

Chromium Plating by R. Weiner and A. W&r&y 239 pages $115.00

A thorough and well-written book on both decorative and engineering (hard) chromium plat- ing, it will be of interest to anyone engaged in production chromium plating and also to stu- dents, researchers, and design engineers. Anyone contemplating the installation of chromium plating facilities will find it of special value.

Send Orders to: METAL FINISHING., 660 White Plains Rd., Tarrytown, NY 10591-5153

For faster service, call (914) 333-2578 or FAX your order to (914) 333-2570

All book orders rnasf be prepaid. Please include $5.00 shipping md handling for delivery of each book via UPS to addresses in rhe U S., 1110.00 for each book shipped express to Cmada; md $20.00 for each book shipped express to all other countries.

563

Page 44: Analysis of Plating Solutions

Table XIV. Alternate Method for Copper Sulfate

1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0

2.x 14.5 24.7 3.5 IS.0 25.7 4.3 15.5 26.8 5.1 16.0 27.8 5.9 16.5 2x.x 6.1 17.0 29.x 7.4 17.5 30.8 x.2 18.0 31.x 9.0 IX.5 32.X 9.x 19.0 33.x

10.6 19.5 34.9 I I.5 20.0 35.9 12.3 20.5 37.0 13.1 21.0 38.1 13.9 21.5 39.2 14.8 22.0 40.4 15.7 22.5 41.6 16.6 23.0 42.x 17.5 23.5 43.9 18.3 24.0 IS.0 19.2 24.5 46. I

20.0 25.0 47.3 21.0 25.5 3x.5 21.9 26.0 49.7 22.9 26.5 51.0 23.X 27.0 52.3

Printed Circuits Handbook, Fourth Edition by CF. Coombs, Jr. 914 pages $90.00

This how-to book is a must for the practioner’s technical shelves and is required reading for anyone involved with the everyday PI-ohlrms arising in p rimed circuit manufacture. All aspects of the fabrication process are considered.

Send Orders to: METAL FINISHING, 660 White Plains Rd., Tarrytown, NY 10591-5153 For faster srrwce, call (914) 333-2578 or FAX pour order to (914) 333-2570

564


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