ANSYS 2019 R1 High Frequency Update

1. Hybrid FEM-IE solver improvementsa. Critical for antenna-radome and radar module-fascia interactionb. Antenna blockage support for HFSS SBR+c. User defined transmission/reflection boundary for HFSS SBR+d. Faster mesh adapt for FEBI coupled FEM regionse. Improved HFSS-IE solutions with multiple excitationsf. Improved HFSS-IE MLFMM solve for geometries with fine geometric

detail

2. Enhancements for Layout based design; PCBs, packages and On-chip RFIC

a. Lump port de-embedding for non-rectangular port geometriesb. Improved mesh assembly for HFSS 3D Components in Layoutc. Via clustering and stack-up simplification for RFICd. PML support for HFSS 3D Layout ABC

3. HPC cluster and cloud simulation performance and managementa. Non-graphical script executionb. Model validation run-time improvementsc. Cached validation; automatically skip validation for currently validated

projects

4. EMIT integration into ANSYS Electronics Desktop

5. Improved dependent mesh solvea. Run frequency sweep directly from imported mesh

6. Improved performance for 3D encrypted componentsa. Faster loading and rendering with smaller memory footprint

7. Meshing improvements; Improved mesh robustness and feedback

What’s New for High Frequency in ANSYS 2019 R1

RF & Microwave

HFSS SBR+: HFSS Source Antenna Blockage

HFSS to SBR+ link: Blockage modeling

● Models scattering from linked source antenna geometry

● Tracks rays that have reflected off SBR+ geometry

● Antenna, or non-model geometry, set as SBR+ “blockage”

● Can be defined as perfectly reflecting or perfectly absorbing

Select objects, including non-model, from source horn geometry to represent blockage for SBR+ solve

• 5 GHz CP circular horn feed w 2m dish− Hybrid FEM-MoM: 6 GB, 25 min w 28 CPU cores

− SBR+: 0.1 GB, 5 min w 12 CPU cores

HFSS SBR+ Blockage Example

Reference Hybrid FEM-IE

Correctly capture sidelobe level with addition of blockage

User Defined Transmission/Reflection Boundaries

HFSS SBR+: Fresnel Coefficient Boundaries

● Use measured transmission/reflection data to model thin dielectrics

● Including multi-layers (e.g. paint)

● Defined as Fresnel table of Reflection/Transmission coefficient per angle

● Option to set the boundary as a perfect absorber

• Port solver impresses current distribution, J, onto lump port

• Surface integration of J upon port triangles returns inductance, L

HFSS Solutions: De-embedding port inductance numerically

Dashed results include de-embedded inductance

Currents on port

Microstrip line with trapezoidal lumped and wave port excitations

• Efficient adaptive mesh process− Eliminate explicit solve of source-free

IE regions

− Reduces resources for adaptive mesh

• Example: Automotive radar module behind dielectric fascia− 2 Tx, 6 Rx channels

− 2.5mm thick fascia

− 18mm spacing from array elements

Hybrid Solving Improvements

FEM Antennas in FEBI Volume

Fascia modeled as Dielectric IE Region

Fully coupled hybrid FEM-MoM solution

• Resources− 28 core workstation

− Max RAM usage 210 GB

• HFSS 2018.2− 62:26:14

• HFSS 2019 R1− 5:37:17

− 11X Speedup

• Identical results

Hybrid Solving Improvements, cont.

22.5° offset along Rx channels

HPC/Performance Improvements

Improve IE matrix solve with multiple excitations

● Performance tuning for IE fast solvers

● Amplified for designs with multiple excitations

● Up to 50% speed up for ACA

● Up to 300% speed up for MLFMM

Improve MLFMM for dense, localized mesh

● 2X speed up and 60% memory reduction observed

New options for improved hybrid performance

● Dependent mesh bypass option: Direct to frequency distribution

HFSS 3D Layout

3D Layout Capabilities and Performance

• New ECAD+MCAD mesh assembly processPhi is used when appropriate

Material overrides supported

Parallel ECAD meshing

➢Faster mesh generation

• Numerical de-embedding of non-rectangular lumped ports

HFSS

New: Full Assembly - ECAD + MCAD Mesh Assembly

Simulation

3D Layout 3D Layout: Full AssemblyMCAD

▪ Automated Mesh Creation▪ Accurate▪ Efficient

▪ Solve time independent of port count▪ Capture full network parameters for all nets

simultaneously with low computational overhead▪ Captures small and large features efficiently

▪ Small pitch traces, meandering traces, accurate coupling and isolation

Geometry changes can quickly be implemented, adaptive meshing gives confidence on every solution without user interaction

2D Cross section of mesh

Automatically generated mesh shown on PCB

Simulation Setup Example: Multi-die Laminate

➢ Assembly and meshing technology significantly speeds up simulation setup time

➢ 12 Filters, two SMD (as HFSS 3D Components), one Laminate

1. Component Creation via Scripted Automation – 7x faster• 3D: 21m• Layout w Mesh Assembly: 3m (Laminate/BAW + SMD)

2. Assembly Creation – 5x faster• 3D: 9m + Validation (~13m)• Layout w Mesh Assembly: 2m + Validation (<2m)

3. Project Opening – 5x faster• 3D: 4m• Layout w Mesh Assembly: 45s

4. Initial Mesh – 1.6x (~850k tets)1. 3D: 1h9m 2. Layout w Mesh Assembly: 44m

5. Adaptive Mesh – 1.2x1. 3D: 186m (144GB RAM)2. Layout w Mesh Assembly: 156m

• 2019 R1 Flow Improvements

− HFSS Layout 3D with Mesh Assembly

• Faster initial mesh time

• Faster user experience

− Non-graphical Script Execution (Beta)

− Reduction in 3D Component size-on-disk

− Reduced 3D Validation Time

Representative design only

HFSS 3D Layout Improvements

• Far Field + Post-Processing Enhancements➢ Consistent with HFSS 3D

➢ PML Support

• Enhancements for on-chip inductor modeling➢ Dielectric Stackup Simplification

➢ Via clustering

EMIT, Circuit and System

EMIT Design in ANSYS Electronics Desktop (Beta)

• Introduction of EMIT system solver in Electronics Desktop

• Schematic-based editors

• Integrated Analysis & Results window

• Complete EMIT data visualization and diagnostics

EMIT Design in ANSYS Electronics Desktop (Beta)

• New Design Type: EMIT− Example application: Desense

EMIT Integrated Analysis and Post Processing EMIT/HFSS Dynamic Link

EMIT Component Library

EMIT Schematic

• Frequency dependent data can be provided via a table or file‐ Supports CTLE and touchstone standard 2.0 file format

• Source can be adopted and used in 3D layout

• Useful for conducted and radiated emission

• Coupled via dynamic link to field solvers (e.g. HFSS)

Frequency Dependent Sources in Circuits

Electronics Cooling

Icepak: Two-Way Coupling with HFSS, Maxwell, Q3D

• New Coupled Simulation Controller in Icepak Design➢ User specified “Number of Coupling Iterations”

➢ Options to “continue” Icepak iterations during coupling

➢ Single controller per design

• Updates to EM losses in each coupling iteration

• Multiple EM Losses supported

• Icepak-Optimetrics Integration

Desktop and MCAD

Electronics Desktop Language Localization

• Ribbons, Main menus, Right click menus and Project Manager

• Future work to include dialogs, profile, messages and progress

• Icepak and Maxwell ‐ Japanese translation introduced in 2019 R1

Electronics Desktop Enhancements

• Non graphical script execution➢ Beta option in 2019 R1

• DX optimizers in Optimetrics➢ Direct optimization

• Mesh feedback for multiple mesher types

Electronics Desktop Graphics and Animation

• High Resolution image export➢ Available through GUI

➢ *.png export for lossless compression

• WebM video export for animations➢ High quality

➢ Compatible with HTML5 based web browsers

• Improved animation with Optimetrics➢ Animate from right click of Parametric or DoE

Desktop Performance Improvements‐ 3D Component performance improvements➢ ACIS data in binary

➢ Improves for large models:

▪ Component insert time 3x – 4x faster

▪ Reduced file size and peak memory

➢ Galileo Board Example: 6s vs 24s and 20MB vs. 30 MB

‐ Model validation➢ Improved intersection checks

➢ Particular improvement for layout designs

Model Validation Time 2018.2 Validation Time 2019 R1

Model 1 24 hr + 10 mins

Model 2 16.5 hr 51 mins

Model 3 8 hr mins 48 mins

Model 4 30 mins 44 secs

Electronics Desktop 3D Modeler Improvements

‐ Generate History➢ Generate history for 3D primitive shapes

➢ Automatically generate history after simplification

➢ Parameterize imported or simplified objects

‐ Enhanced “Measure” Command➢ Detailed information for cylinders, planes, arcs etc.

‐ Independent instances for 3D components➢ Selectively edit to new designs

‐ 3D Modeler ACIS version updated to 28.2‐ Updated CAD version support:➢ CATIA V62018

➢ Creo 5.0

➢ SolidWorks 2018

➢ Siemens NX 12

➢ Autodesk Inventor 2019

➢ Parasolid 31