“Trends in Advanced Packaging Technologies ”
An IMAPS-UK view
Andy LongfordChair -IMAPS UK – 2007-9
PandA Europe1IMAPS UK - IeMRC Interconnection event December 2008
International Microelectronics And Packaging Society
“Everything in electronics between the chip and the system …”
Membership
• IMAPS is the largest Microelectronic packaging society in the world!
Individual 2453
Corporate 287
Int'l Affiliates 1136
Students 287
TOTALS 4163
Data; February 2008Trend is increasing membership
IMAPS-UK Membership
• IMAPS – UK is a registered ‘Charity’ organisation with an aim to interface Industry with Academia
• IMAPS - UK is a member of the UK Electronics Alliance(UKEA) – working as a Trade Association to support development of the UK industry
Individual 50
Corporate (33 x 2) 66
Academics 4
Students 2
Life members 8
TOTALS 130Data - September 2008Trend is increasing membership
IMAPS Future
Packaging Trends
• The Packaging market • Packaging in Europe• Trends in
– Technology– Values– Volumes
Courtesy – FICO NL
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IC Package units growth
Since the end of 2001, annual IC unit shipments have grown an astounding 120% from 68.5 billion in 2001 to 151.1 billion in 2007.
• 2007 = 151 bn - CAGR: 9.55%• 2012 = 261 bn
DCAWLPQFNDFNFBGABGAQFPSOTTSOPSOCCPGADIP
Source - Electronic Trends
Package Market - Summary
From 2007 – 2012 .... a 70% increase
Volumes – CAGR = 9.55%Value – CAGR = 11.46%
Average price is up 8.61%
..... Cost of packaging will increase
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Package Technology Drivers
•• ITRS Roadmaps ITRS Roadmaps ……•• Market Pull or Market Pull or ““envelopeenvelope”” pushpush•• Effect of package parameters Effect of package parameters ……•• Fabrication Infrastructure (design support?)Fabrication Infrastructure (design support?)•• Time to MarketsTime to Markets•• Ways to lower costWays to lower cost
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December 2008PandA Europe��
Package Types:
1. Plastic IC Packages2. Leadless IC3. Discretes4. Opto5. Advanced (Embedded & TSV)
6. Ceramics and Metal can7. MEMS (Cavity Plastic)
8. Custom (App Specific)
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Package Market shares
9%
20%
26%38%
2%
1% 3% 1% IC plast
IC leadless
Discrete
Opto
Adv pkg
Cer & Met
MEMs
Custom
2007 = 188 bn units
2012 = 295 bn units
package types
20%
19%31%
24%
1%
1% 3% 1%
Source – Electronic Trends / PandA
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Packaging in Europe
• Advanced Packaging• SiP & WLP• MEMs• PhotoVoltaics• Opto’s
Market generators
Sector Innovation Design Manufacturing Utilisation
Aerospace USA Europe Europe USA
Automotive Europe Europe Asia Europe
Broadcast Europe USA Asia Europe
Communications Europe USA USA USAComputing USA USA Asia USA
Consumer Asia Asia Asia Asia
Industrial Europe USA Asia Asia
Medical USA Europe Europe Europe
Military Europe USA Europe USA
Security Europe USA USA USA
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Source EPN / PandA
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Packaging Market in Europe
• Application Driven ....– Non Commercial
• Security, Medical, etc.
– Military – Aerospace• Hermetic, Hi-Rel
– Advanced designs• Phones, Sensors
• Inherently… Low Volume• Typically …. HIGH VALUE
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The European (Packaging) process
• Application design (ASP)• Prototype• Pre-production• Outsource Production
– Export Designs
Courtesy – MENTOR
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Europe’s Packaging Need …
– Capability Infrastructure of:• Design ....Mentor, Synopsis, Cadence, etc. all developing package
design software – based on SiP– Will add significant cost ...but achieve 1st time success
• Assembly ...New expertise is developing to address technology issues of advanced packaging
– Institutes (IMEC, Fhg IZM, etc.) offer cost effective programmes
• Equipment ...Europe continues to lead in design and supply of machinery to support new technology
– EVG, ASM, STS all offering WLP/TSV developments
• Facilities .... Limited large scale options, but a range of specialised units continue to provide necessary services.
– Development of volumes require outsourcing
Smaller – Faster – Cheaper ....but what are the defining trends?
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Trends in packaging
• Technology• Values• Volumes• Locations
Development of Chip-substrate Technology
Units/lot Leadframes Substrates
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Sensors
Logic ICs
Memory
RF & ASIC
&
2010
Development of Advanced Packaging Technology
Units/lot
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Memory
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1980 1990 2000 2010 2020
Pac
kage
Siz
e
22ndnd GenerationGenerationBGABGA
33rdrd GenerationGeneration3D SiP3D SiP
44thth GenerationGenerationOpto/MEMSOpto/MEMS
11stst GenerationGenerationLF & TABLF & TAB
DIP
BB + Memory
CPU + Cache MemoryMemory
Stack
SOJ
PLCC
QFP PBGA
TBGA
FCBGA
MCP
PoP
WLCSPaWLP
aWLP (w/ Heat Slug/Shield)
aWLP (w/ Active Die& Passive)
aWLPoP
Resistor Ta2O5 capacitor Inductor PI capacitor
IPD/AIC
aEPS (Embedded Active & Passive)
EPS (Passive Circuit)
EPS (Embedded Discrete)
EDS
EDSi
MCM-EDS
Stacked EDS
IC
IC
IC
IC
Wireless Interconnect
Optical Interconnect
MEMS Devices
TCP
SOP
Stacked Die PiP
source - Jisso
Trends in Packaging
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Heterogeneous Integration to Maximize Utilization of Thickness Dimension
Assembly + Assembly + Substrate Assembly + IC (WLCSP)
PoP(Package-on-package)
EPS(Embedded Passive in Substrate)
aWLP(Fan-out WLCSP)
EDS(Embedded Die in Substrate)
IPD(Integrated Passive Device)
TSV - Via Last(Through Silicon Via)
PiP(Package-in-package)
Assembly + System(Wireless Connectivity Modules)
Emerging (Advanced) Technology
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TSV Trends
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Multi-level 3D IC(CPU + Cache + DRAM + Analog + RF + Sensor + I/O)
3D Stacked DRAM/Flash
2007 2009 2012 >2014
Logic (CPU + Cache Memory)Baseband
Via Size: 50 – 100 µm 5 - 30 µm 5 µm
CPU
Cache Memory
DRAM / NVM
Analog
RF Power
Sensor I/O
Sensor I/O
CMOS Image Sensor (Sensor + DSP + RAM)
Au Stud FC Bump Pitch
ITRS 65 nm Min Global Metal Pitch
1000
1
10
100
Vertical Device on CMOS
2 µm
FC SolderBump Pitch
Via Last Via First
Source - EMC-3D & ASE Data
Thi
ckne
ss In
terc
onne
ct M
inim
um P
itch
Dim
ensi
on (µ
m)
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Market trends 2007-2012:
1. Values2. Volumes
Package Market - DownturnCriteria:
-Recent Forecast Changes due to Economic pressures ....
- Market Uncertainties- No investment in “new” equipment
- Packaging “lags” IC build
Latest Estimates: 2009 – Flat to down 5%2010 – back on track 7-8% growth
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Packaging Trends ?
Source - Prismark
TO & DIP will not die
Package Market Values
0
2
4
6
8
10
12
14
16
bn $
IC P
last
IC Le
adles
s
Discret
eOpto
Adv P
kg
Cer & M
et
MEMs
Custo
m
20072012
Market $
2007 – 35 bn
2012 – 58 bn
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Advanced IC Packages
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source – Philips/Gartner
2012
13bn12.5 bn
Package Market volumes
45.0
40.055.0
45.0
0.51.00.8
1.0
32.1
65.0
75.6
112.5
7.0
0.8 2.0 0.5
2007 = 188 bn units
Source – Electronic Trends / PandA
IC plast
IC leadless
Discrete
Opto
Adv pkg
Cer & Met
MEMs
Custom
2012 = 295 bn units
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Sub- Contract packaging trend
Source – ASE Group
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IMAPS Future - Technology
Bill Bottoms
IMAPS Future - Technology
IMAPS Traditionally Very Strong in this region
We have to move up the pyramid
To Survive we are going to have to expand the portfolio of the society
New Initiatives for IMAPS ?
Lab on a ChipSolar
LED PackagingMaterials - Nano
What are the Implications For the Future of Micro Electronic
Packaging?• Embed passive and active die are here now. In the next few
years they will be in almost high density products– This changes the way PCB shop will do business– Will PCB shop become assemblers– Will the assemblers become PCB shops
• If we do move into the age of replication what happens to the massive factories we have now?– Do we stop chasing low cost labor?– Will today's assemblers have to open outlets in shopping malls?
• What will be the future of Pick and Place machine manufactures and today's passive component manufactures?
How Does IMAPS Stay Relevant
• On –line capabilities:
•As travel becomes more expensive we will need to move to more ‘on line’events
•Utilise more of the “IknowMicroelectronics”– IMAPS ‘on line’ library
• Develop University contacts ..– Student Paper awards- Publishing opportunities
• Develop better communications between Organisations, Chapters and Regions
• Develop key interest groups ….
……future directions
Everything about Chips in Systems ?
UK is still about the “Hybridisation” of …
• Sensors – Industrial / Military
• Medical Electronics
• Optical interconnection
• Energy Scavenging
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R&D ?…
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Time to Market• Research …
– 5 years typical to working innovation– typically 3 years funded in EU– 1-2 years seeding
• Development …– Minimum 3-5 years
• SoP …– 1-2 possible– Typically 5 years (Automotive qualification etc )
IDEA gestation – 15 years !
IMAPS Nordic – 15 September 2008 � ������������
……future directions ...
Everything about Chips in Systems ?
IMAPS (in Europe) is still about the “Hybridisation” of …
• Sensors – Industrial / Military
• Medical Electronics
• Optical interconnection
• Energy Scavenging
IMAPS Nordic – 15 September 2008 � �����������
……future initiatives ...
Linking Industry to Academia ...
Provide a vehicle to support NOW technology in Microelectronic packaging and interconnection…
• Skills Academy – To get Graduates into Industry
• Collaborative development programmes
• Industry Related “themes”
• Joint working groups and events with other organisations
• UKEA, xKTN, NMI and Government interaction.
International Microelectronics And Packaging Society (IMAPS)Everything in electronics between the chip and the system!
….. involved with …
•Interconnection
• Microelectronics
• Packaging
International Microelectronics And Packaging Society
“Everything in electronics between the chip and the system …”
Thank you for your attention
