A&R Template 4.4

Procedural Review Voting Sheet

2010 Cycle 7

REGION: Japan

COMMITTEE: Silicon Wafer Committee

EVENT: SEMICON Japan 2010

DATE OF MEETING: 2010/12/02

PLACE OF MEETING: Makuhari Messe, Chiba, Japan

COMMITTEE CO-CHAIRS: Naoyuki Kawai/University of Tokyo, Tetsuya Nakai/SUMCO

SEMI STAFF: Akiko Yamamoto

A&R Voter: Name/Company

Date: 200X/MM/DD

I. Document Number & Title

Document 4760A

New Standard: Mechanical Specification for Front-Opening Shipping Box Used to Transport and Ship 450 mm Wafers

II. Tally (Staff to fill in)

Voting Tally: As-cast tally after close of voting period

A minimum of 60% of the voting interests that have voting members within the technical committee must return votes. (Regulations 9.6.1)

Return

Distribution

Return Rate

Yellow

51

85

=

60.0%

>=60%

Lilac & Others

16

----------------------------------------------------------------------------------

Total Vote

67

Reject

6

Accept

17

A&R

Not approved

Reason:

III. Rejects

Reject 1 (Akira Kashimoto/ Shin-Etsu Polymer)

Negative 1 of Reject 1

Negative

Referenced Section

Table 1

z21

z21

Z21

Reason

Negative

Wafer Plane Tolerance needs to be 0.75mm instead of 0.5mm.

Rationale

1) SEMI Standard has to lead the industry feasible.

2) Most experienced plural number of 300mm FOSB manufacturers insist on0.75mm. In addition, ISB TF and Si Wafer Committee regarded the contention is technically persuasive in July this year.

3) Plural number of Robot manufacturers

indicate that they can transfer wafers

from 0.75mm Wafer Plane Tolerance

450FOSB to 0.5mm wafer Plane

Tolerance FOUP as shown in page 3 or

5 of the attached file.

C:\@KASHIMOTO\

@300mm Prime & 450mm\100830ITG-J(Pitch Budget)\20100830_ITG-J Report r0.3.ppt

It means the 0.75mm does not prevent

the feasibility of 450mm industry.

4) No carrier manufacturer has proved that 0.5mm Wafer Plane Tolerance 450mm FOSBs with required purity are manufacturable. Carrier manufacturers who agree with 0.5mm Wafer Plane Tolerance should prove or provide technically persuasive explanation.

5) Once 450FOSB Standard is published with 0.5mm of wafer plane tolerance, robot manufactures will develop on it. However, 450mm FOSB for prime or test wafers shipment will probably not be available and thus the robot development on 0.5mm of wafer plane tolerance will come to nothing. This is sad.

Withdrawal

No withdrawal made

GO TO Related section

X

Withdrawal document received by staff on November 25, 2010.

GO TO Final ( (A)

Related

Motion and Reason

Related is mutually agreed upon.

*This motion can be appended to the motion for Persuasive (See Persuasive Section)

Negative is related (needs over 1/3 votes to pass)

Negative is not related (needs 2/3 or more votes to pass)

Reason

XXXX

Motion by/2nd by

Name (Company)/Name (Company)

Discussion

Result of Vote (check ONE)

XX-XX

[Negative is related] > 1/3

GO TO Persuasive

[Negative is not related] < 2/3

2/3=< [Negative is not related]

GO TO Final ( (B)

Persuasive

Motion and Reason

Negative is related and persuasive (needs over 1/3 votes to pass)

Negative is related and not persuasive (needs 2/3 or more votes to pass)

Reason

XXXX

Motion by/2nd by

Name (Company)/Name (Company)

Discussion

Result of Vote (check ONE)

XX-XX

[Negative is related and persuasive] > 1/3

GO TO Final ( (E)

[Negative is related and not persuasive] < 2/3

2/3= 1/3

GO TO Persuasive

[Negative is not related] < 2/3

2/3=< [Negative is not related]

GO TO Final ( (B)

Persuasive

Motion and Reason

Negative is related and persuasive (needs over 1/3 votes to pass)

Negative is related and not persuasive (needs 2/3 or more votes to pass)

Reason

XXXX

Motion by/2nd by

Name (Company)/Name (Company)

Discussion

Result of Vote (check ONE)

XX-XX

[Negative is related and persuasive] > 1/3

GO TO Final ( (E)

[Negative is related and not persuasive] < 2/3

2/3= 1/3

GO TO Persuasive

[Negative is not related] < 2/3

2/3=< [Negative is not related]

GO TO Final ( (B)

Persuasive

Motion and Reason

Negative is related and persuasive (needs over 1/3 votes to pass)

Negative is related and not persuasive (needs 2/3 or more votes to pass)

Reason

XXXX

Motion by/2nd by

Name (Company)/Name (Company)

Discussion

Result of Vote (check ONE)

XX-XX

[Negative is related and persuasive] > 1/3

GO TO Final ( (E)

[Negative is related and not persuasive] < 2/3

2/3= 1/3

GO TO Persuasive

[Negative is not related] < 2/3

2/3=< [Negative is not related]

GO TO Final ( (B)

Persuasive

Motion and Reason

Negative is related and persuasive (needs over 1/3 votes to pass)

Negative is related and not persuasive (needs 2/3 or more votes to pass)

Reason

XXXX

Motion by/2nd by

Name (Company)/Name (Company)

Discussion

Result of Vote (check ONE)

XX-XX

[Negative is related and persuasive] > 1/3

GO TO Final ( (E)

[Negative is related and not persuasive] < 2/3

2/3= 1/3

GO TO Persuasive

[Negative is not related] < 2/3

2/3=< [Negative is not related]

GO TO Final ( (B)

Persuasive

Motion and Reason

Negative is related and persuasive (needs over 1/3 votes to pass)

Negative is related and not persuasive (needs 2/3 or more votes to pass)

Reason

XXXX

Motion by/2nd by

Name (Company)/Name (Company)

Discussion

Result of Vote (check ONE)

XX-XX

[Negative is related and persuasive] > 1/3

GO TO Final ( (E)

[Negative is related and not persuasive] < 2/3

2/3= 1/3

GO TO Persuasive

[Negative is not related] < 2/3

2/3=< [Negative is not related]

GO TO Final ( (B)

Persuasive

Motion and Reason

Negative is related and persuasive (needs over 1/3 votes to pass)

X

Negative is related and not persuasive (needs 2/3 or more votes to pass)

Reason

Doc. 4982 NEW STANDARD: MECHANICAL INTERFACE SPECIFICATION FOR 450 mm FOSB LOAD PORT has already been approved by NA PI&C Committee considering different door closure force, so that it is not a technical reason.

Motion by/2nd by

Yasuhiro Shimizu (Consultant)/ Sadao Kumai (Consultant)

Discussion

None.

Result of Vote (check ONE)

11-0-4

[Negative is related and persuasive] > 1/3

GO TO Final ( (E)

[Negative is related and not persuasive] < 2/3

2/3==60%>=90%

Lilac & Others16

----------------------------------------------------------------------------------

Total Vote67

Reject6

Accept17

Sheet2

Sheet3

_1352817172.xlsSheet4

Sheet1

Accepts(Accepts + Valid Rejects)

Approval Rate=17/17=100.0%>=90%

Sheet2

Sheet3

_1349527858.ppt

ITG Japan Report R0.3

Pitch Budget for FOSB

Aug 30th, 2010

ITG Japan

FOUP Wafer Pitch Table

*

ITG-J report

(test data of vibration)

2.5 mm OK

1.94mm NG

Varies

(W Robot suppliers estimates)

Min. 3.5mm

Max. 4mm

Wafer related Budget

4.75mm

Grand Total

Min. 11.95 mm

Max. 12.45mm

Budget for Wafer Robot

Carrier related Budget

1.2mm

Backside Contact

Vacuum E/E

Shipping Box Wafer Pitch Table

Budget for Wafer Robot

Wafer related Budget

1.9mm

Carrier related Budget

1.7mm

Varies

(W Robot suppliers estimates)

Min. 7.50mm

Max. 8.70mm

Perimeter Support

Edge Grip E/E

Deflection Under Gravity : 0.85mm

Tolerance of Wafer Planes : 1.5mm

Grand TotalPitch Budget

Min. 11.10 mm

Max. 12.30mm

Back up

Latest Pitch Table

Deflection Under Gravity : 0.85mm

SUMCO Input

Entegris Input

Maximum Wafer Sag

0.0301=0.765mm

ITG-JInputby ISMI Single Crystal/Sintered Wafer

Item

Description

Pitch

Budget

Lift

Budget

Pitch

Budget

Lift

Budget

Pitch

Budget

Lift

Budget

2

Thickness

of Wafer

0.95

0.95

0.95

0.95

0.95

0.95

3

Deflection

under Gravity

0.85

0.00

0.85

0.00

0.85

0.00

4

Process

Induced Warp

0.00

0.00

0.00

0.00

0.00

0.00

5

Initial

Warp

0.10

0.10

0.10

0.10

0.10

0.10

6

Tolerance

of wafer planes

1.50

1.50

1.50

1.50

1.50

1.50

7

Carrier

Placement Error

0.20

0.20

0.20

0.20

0.20

0.20

8

EE

Structure

2.00

3.50

0.00

3.00

0.00

9

EE

Wafer Contact Pads

2.50

2.50

0.00

2.50

0.00

10

EE

Curve w/o wafer

1.00

0.24

0.00

0.20

0.00

11

EE

Curve w/ wafer

0.00

1.00

0.00

1.12

0.70

12

Inclination

of Robot Motion

2.00

2.00

2.00

2.00

3.00

3.00

13

Vibration

of EE (P-P)

Incl.

in #12

Incl.

in #12

Incl.

in #12

Incl.

in #12

Incl.

in #12

Incl.

in #12

14

Teaching

and alignment

Incl.

in #12

Incl.

in #12

Incl.

in #12

Incl.

in #12

Incl.

in #12

Incl.

in #12

15

EE

Roll Error

Incl.

in #12

Incl.

in #12

Incl.

in #12

Incl.

in #12

Incl.

in #12

Incl.

in #12

16

Desired

Safety Margin

0.00

0.00

0.00

0.00

0.00

0.00

17

Thickness

of Wafer Support

0.00

4.00

0.00

4.00

0.00

4.00

18

TOTAL

11.10

9.75

11.84

9.87

12.30

10.45

D

A

B

Line Description

Pitch

Budget

"A"

Lift

Budget

"A"

Pitch

Budget

"B"

Lift

Budget

"B"

Pitch

Budget

"C"

Lift

Budget

"C"

Pitch

Budget

"D"

Lift

Budget

"D"

Pitch

Budget

"E"

Lift

Budget

"E"

Pitch

Budget

"F"

Lift

Budget

"F"

2 Thickness

of Wafer

0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95

3 Deflection

under

Gravity

0.50 0.00 0.50 0.00 0.40 0.00 0.16 0.00 0.30 0.00 0.20 0.00

4 Process

Induced

Warp

3.20 1.60 3.20 1.60 3.20 1.60 3.20 1.60 3.20 1.60 3.20 1.60

5 Initial Warp 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.00 0.20 0.10 0.10 0.00

6 Tolerance

of wafer

planes

1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00

7 Carrier

Placement

Error

0.20 0.20 0.20 0.20 0.20 0.20 0.20 0.20 0.20 0.20 0.20 0.20

8 EE

Structure

3.50 0.00 3.00 0.00 3.00 0.00 2.86 0.00 3.00 0.00 3.11 0.00

9 EE Wafer

Contact

Pads

0.20 0.00 0.50 0.00 0.50 0.00 0.75 0.00 1.00 0.00 0.47 0.00

10 EE Curve

w/o wafer

0.00 0.00 0.20 0.00 0.00 0.00 0.00 0.00 0.20 0.00 0.00 0.00

11 EE Curve

w/ wafer

0.00 1.00 0.00 1.00 0.00 0.80 0.00 0.80 0.00 0.00 0.00 0.80

12 Inclination

of Robot

Motion

1.50 1.50 1.20 1.20 0.00 0.00 Incl.

in #13

Incl.

in #13

0.30 0.00 Incl.

in #13

Incl.

in #13

13 Vibration

of EE (P-

P)

0.00 0.00 0.20 0.20 0.75 0.75 0.52 0.69 0.20 0.00 0.91 1.29

14 Teaching

and

alignment

1.00 1.00 1.10 1.10 0.80 0.80 1.00 1.00 0.40 1.00 0.00 0.00

15 EE Roll

Error

0.50 0.50 0.50 0.50 0.10 0.10 0.07 0.07 0.20 0.00 0.00 0.00

16 Desired

Safety

Margin

0.50 0.50 0.50 0.50 0.30 0.30 0.00 0.00 1.00 0.00 0.00 0.00

17 Thickness

of Wafer

Support

0.00 4.00 0.00 4.00 0.00 4.00 4.00 0.00 4.00 0.00 4.00

18 TOTAL

13.15 12.35 13.15 12.35 11.30 11.10 10.80 10.31 12.15 TBD 10.14 9.84

Rorze

Hirata

Daihen

Rorze

Hirata

Daihen

Rorze

Hirata

Daihen

Rorze

Hirata

Daihen

Empty

12.0

10.60

11.34

11.80

9.10

8.67

8.90

10.60

11.34

11.80

12.30

11.87

12.10

Wafer

12.0

9.25

9.37

9.95

9.25

8.80

8.85

9.25

9.37

9.95

10.85

10.40

10.45

12.0

10.10

10.84

11.30

8.60

8.17

8.40

10.10

10.84

11.30

10.20

9.77

10.00

Empty

12.0

11.10

11.84

12.30

9.60

9.17

9.40

11.10

11.84

12.30

12.80

12.37

12.60

Wafer

12.0

9.75

9.87

10.45

9.75

9.30

9.35

9.75

9.87

10.45

11.35

10.90

10.95

12.0

10.35

11.09

11.55

8.85

8.42

8.65

10.35

11.09

11.55

10.45

10.02

10.25

MAC

No Warp

No Warp

No Warp

Warped

Edge Grip EE

Vacuum

}

0.5

}

0.75

Edge Grip EE

Vacuum

Wafer

Plane

Tolerance

Wafer

Pitch

Wafer

Pitch

First Wafer Height

First Wafer Height

FOSB

Target

Value

Carrier Type

Handling Type

Wafer

Robot Supplier