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ASECL Test ServiceASECL Test Service
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Full Range of IC Test Service includes Wafer Sortand Final Test
Fast Turn Around Time (one stop location) Quality System in place
ISO9002 / QS9000 / TS16949 Certification World class Wireline/Wireless/Bluetooth/Automotive
Test manufacturing facilities Expertise in various Analog/Logic/Mixed-Signal/
RF/WLAN ATE platforms Value Added Engineering/Manufacturing support
Why ASE Chung-Li (ASECL)Why ASE Chung-Li (ASECL)
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Full Range of IC Test ServiceFull Range of IC Test Service Wafer Sort –
6” thru 12”, Ambient/Hot,Ink/Inkless, Bumped Wafer
Laser Repair
Final Test –
Ambient/Hot/Cold full rangetemperature
Product Yield Analysis
Real time WIP & Quality
Control System
Electronic Yield Data
Lead Scan / TnR
Drop Ship
Information
Speed
Efficiency
AutomaticDatabase
ManagementNew
Product Introduction
Hard/SoftwareSustaining
PlatformOptimization
Test/Socket /Docking
DevelopmentAnalogAnalogMixed-SignalMixed-Signal
DSPDSPAutomotiveAutomotive
SOCSOCChip-SetChip-SetProbe Probe
ContinuousImprovement
Program
Cost Ownership
Quality
Standardization
Value PropositionValue Proposition
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ASECL ATE Tester PlatformASECL ATE Tester Platform
•SOC
•RF/ RF Mixed
•Analog/Mixed-Signal
•Digital
2004 2005 2006
LTX Fusion RF (HT)
Teradyne Catalyst (Gen3)
2.5GHz
6GHz
200 MHz
Credence Quartet
Teradyne J971
Teradyne J750
Teradyne A5XX VHF/UHF
LTX TS80/88 SZ M3650 Power
LTX Fusion HT
Teradyne Catalyst
Agilent93000 C400E
400 MHz
384/512 CH
Agilent HP93K RF (C200e)
Since 1987
Teradyne J750/MSO
Credence SC212/312
512 CH
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Future Tester RoadmapFuture Tester Roadmap
TimeTime
µProcessorNetwork processor
Enterprise switchPC graphics /
chipsetsWired networkingSet top / satellite
cable modemHard disk / DVR
DSLCD / DVD RW /
RAMCellular baseband
Cellular wirelessVideo / audio /
MPEGWiFi
BluetoothGPS
RFAutomotive power
Standard analogBattery
managementµControllersPLD / FPGA
RFIDSmart cards
Agilent93K (C / SD /RF)
Catalyst (RF)
J750
Quartet
SC312/212
Agilent93K ( PS / DD )
FLEX / FLEX+ (RF)
2005 - 2006
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Wafer Sort Equipment Wafer Sort Equipment (Prober(Prober))
•Electroglas ProberEG 4090/µ(6”/8”)
•TEL ProberTEL P12XL (8”/12”)
•SEMICS / OPUS-IISpec.
(6”/8”/12”)
6 inch to 12 inch wafersort in production
Multiple site sort(x1~x32) with fine pitch testcapability
Laser repair (ESI9830) inproduction
8” WLCSP (bumpedwafer probe) capability
Ink/inkless service
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Gravity Feed Test Handler - FTGravity Feed Test Handler - FT
•SOIC150/300mils•TSSOP173mils• SSOP209mils• SIP• MFP
Daymarc 717
MT9320
Available ! Multi-Test Sites : X1 ~ X8 Temperature : - 55 ℃ ~ + 155 ℃
SO1000
MT9918
SO1800
MT9928
New Handler Under Evaluation
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Pick and Place Test Handler - FTPick and Place Test Handler - FT
DELTA FLEX DELTA 1688
MT9510 NS6040 • S-DIP400mils• MFP• SOIC150mils• BGA/OMPAC• LGA/BCC• QFN/MLF• QFP• CLCC (Image Sensor)
NS7080
Available ! Multi-Test Sites : X1 ~ X8 Temperature : - 60 ℃ ~ + 160 ℃ DELTA CASTLE
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FT Handler CapabilityFT Handler Capability2001 / 2002 2003 2004 2005 2006
Temperature Range
Pick & Place Handler Delta 1688(ambient only)NS7080(no cold temp)
Delta EDGE(no cold temp)Delta Castle (new model)
Gravity Feed Handler Daymarc 717Tesec 8710
Multiple Test Site
Pick & Place Handler Delta 1688 NS7080Delta CastleNS7080
Gravity Feed Handler Daymarc 717Tesec 8710
Socket Layout
Pick & Place Handler Delta 1688
Gravity Feed Handler Daymarc 717Tesec 8710
PnP Dual Site Pitch
PnP Quad Site Pitch 57.15 mm
PnP Octal Site Pitch
PnP x16 Site Pitch 30 x 60 mm (2x8)
28.58 mm (1x8)40~60 mm x 60~70 mm (2x4)
Daymarc 3287/ MT9320/ MT8588/ MT9918/ RASCO SO1000
40 ~ 57.15 mm (1x4)40 ~ 80 x 60 ~ 70 mm (2x2)
Delta Flex / MT9510NS6040 / Yokogawa
Delta FLEX (1x8)NS7080
Daymarc 3287/ MT9320/ MT8588/ MT9918/ RASCO SO1000
57.15 mm (2.25") ~ 80.0 mm 40.0 mm ~ 114.3 mm
Delta Flex / MT9510NS6040(no cold temp)
Yokogawa(no cold temp)
Daymarc 3287/ MT9320/ MT8588/ MT9918/ RASCO SO1000
Delta Flex / MT9510NS5040/6040
Room Temp - 55 ℃ ~ + 155 ℃
Single (X1) Dual (X2) / Quad (x4) / Octal (X8) Sixteen (X16)
Single (X1) Dual (1X2 & 2x1) , Quad (1x4 & 2x2) Octal (1X8 & 2x4) Sixteen (2x8)
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Model Manufacture Configuration / Capability GS-7100/ RVSI QFP/BGA/BCC BALL SCANNING, LS-7700 MARKING INSPECTION & T/R (ST-60) TSR80/T1100 Evertech MODULE (FULL INTEGRATION) CI9450 ICOS
AIS-3500EX AISI SOIC/QFP LEADS/TOP MARKINGINSPECTION
AIS-630 AISI QFP LEADS/TOP MARKING INSPECT,BGA & BCC TOP MARKING
•• SCANNERS, VISION and SCANNERS, VISION and TnRTnR Integration: Integration:
ASECL Inspection &ASECL Inspection & TnR TnR
TMBZ-NR ISMECA SOIC 150/300 MILS EMBOSS TnR
TMBU-GR/HS ISMECA QFP/BGA/BCC EMBOSS TnR
MP-200 ISMECA SOIC/MFP/TSSOP EMBOSS TnR ANDNT16 ISMECA TUBE TO TUBE OPTION
CI-G10 ICOS
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Bumped Wafer Sort Capability Bumped Wafer CP Data Flow Bumped Wafer Probing
Experience
ASECL Bumped Wafer ProbingASECL Bumped Wafer Probing
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WaferFab
BumpProcess
& VMBump
Wafer CP
InklessMapping
Bump Wafer O.Q.A.
Bump Wafer Singulation
Flip Chip Assy Process
Package Test
Package V/M Packing Shipping
ASECL Bump
ASECL Assy
ASECL F/T
ASECL W/S
Bump Wafer I.Q.A
ASECL W/S
Bumped Wafer Sort CapabilityBumped Wafer Sort CapabilityBumped Wafer Probing Process
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Station Equipment Outlook
2D/3D Auto Inspection Camtek Falcon 830
Wafer Sorter Recif SPP300
Laser Repair ESI-9830
Prober TEL P-12XLN+
Bumped Wafer Sort capabilityBumped Wafer Sort capabilityBumped wafer Sort Equipment
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Handling Carrier:
-- 6”, 8” Cassette, 12” FOUP
2D bump inspection &
active die area defects
(probe mark inspection include )
3D inspection for bump height,
coplanarity & other 3D defects
Map Integration
12”,8“& 6” Bump Wafer InspectionCAMTEK FALCON 830
Bumped Wafer Sort CapabilityBumped Wafer Sort Capability
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Handling Carrier:
- 6”, 8” Cassette, 12” FOUP
Hot and cold temperature, heatdissipation thermal systems.
-55OC~150OC
A high-accuracy and high-forceresistance stage for optimalcontact.
Full automation, capable ofhandling CIM/FA,
12”,8“& 6” Wafer ProberTEL P-12 XLN+
Bumped Wafer Sort CapabilityBumped Wafer Sort Capability
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Wafer Size: 200mm,300mm
Accuracy 0.18um
Minimum Spot size 1.6um
Laser Wavelength 1.3um
Available fuse type
Poly fuse ,Copper Fuse
Aluminum Fuse
Laser Repair SystemESI-9830
Bumped Wafer Sort CapabilityBumped Wafer Sort Capability
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Bumped Wafer Inspection CapabilityBumped Wafer Inspection Capability
MissingBump
Big / Small BumpBump Diameter
Bump Shift Bump Bridge
Satellite Bump Damaged Bump
* 2D Bump Inspection & Metrology *
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* 3D Bump Inspection & Metrology *
Bump Height
Tall BumpShort Bump
Coplanarity
Bumped Wafer Inspection CapabilityBumped Wafer Inspection Capability
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EDC &Data Judgment
REC &Sorting IQA
CircuitProbing
WO
Factory Work (MES)WS
Packing &Packing QAOQA
Shipping
FRP
MP1T
Wafer Lot and data inputSINF data import form ASE Bumpinghouse or other fab.
IQA data querySystem check the flag for SINFdata available or not, and processinspection by August
Data convert to probing useCompare the SINF file the DPW andconvert to prober usable map file. Data convert to OQA use
Use map transfer tools convert theprober source map to SINF format forAugust using.Auto load the OQA result and save asprober source map format for dataprocess, which would bring out thereports in the following.
Bumped Wafer Sort Data FlowBumped Wafer Sort Data Flow
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• Probing Target: Solder Bump /8”
• Platform: Teradyne J750• DUT: 16 Site ( 4 x 4 )• Max. Pin Count: 448 pin• Min. Pitch: 200 um• Probe Card Type: Cobra(Wire) /
Flat-Tip
Bumped Wafer Probing Experience(I)-Bumped Wafer Probing Experience(I)-Wire TypeWire Type
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• Probing Target: Solder Bump / 8”• Platform: Teradyne J750• DUT: 16 Site ( 4 x 4 )• Max Pin Count: 576 pin• Min. Pitch: 150 um• Probe Card Type: Cobra(MLO/MLC) / Flat-Tip
Bumped Wafer Probing Experience(II)-Bumped Wafer Probing Experience(II)-MLO/MLC TypeMLO/MLC Type
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• Probing Target: Solder Bump• Platform: Catalyst RF• Max. Pin Count: 168 pin• Min. Pitch: 500 um• Probe Card Type: VS2(MLO/MLC) / Crown-Tip• Benefit: Better Contact Solution for RF Testing
Bumped Wafer Probing Experience(III)-Bumped Wafer Probing Experience(III)-WLCSP SolutionWLCSP Solution
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2004 2005 2006 2007Calendar
RF BandwidthRF BandwidthI/OI/O
1.2 G / 2 pins 5 G / 4 pins3 G / 4 pins 10 G / 4 pins
140 um / 1500 pins 100 um / 2500 pins120 um / 2000 pins 90 um / 3000 pins
Min. MembraneMin. MembranePitch/Pin CountPitch/Pin Count
Min. EpoxyMin. EpoxyPitch/PinPitch/Pin
CountCount
Assessment 45 um / 1500 pins50 um / 800 pins 40 um / 1500 pins
Solder Bump & Copper Bond Pads
Solid Copper bond pads
Al Cap. Copper Bond Pads
Slotted Copper bond pads
Min. CobraMin. CobraPitch/Pin CountPitch/Pin Count
Low K / Cu PadsLow K / Cu PadsProbingProbing
40 um / 800 pins 35 um / 1000 pins40 um / 1000 pins 30 um / 1200 pins
P/Card Roadmap for Bump & Al PadP/Card Roadmap for Bump & Al Pad
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