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ASECL Test ServiceASECL Test Service

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Full Range of IC Test Service includes Wafer Sortand Final Test

Fast Turn Around Time (one stop location) Quality System in place

ISO9002 / QS9000 / TS16949 Certification World class Wireline/Wireless/Bluetooth/Automotive

Test manufacturing facilities Expertise in various Analog/Logic/Mixed-Signal/

RF/WLAN ATE platforms Value Added Engineering/Manufacturing support

Why ASE Chung-Li (ASECL)Why ASE Chung-Li (ASECL)

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Full Range of IC Test ServiceFull Range of IC Test Service Wafer Sort –

6” thru 12”, Ambient/Hot,Ink/Inkless, Bumped Wafer

Laser Repair

Final Test –

Ambient/Hot/Cold full rangetemperature

Product Yield Analysis

Real time WIP & Quality

Control System

Electronic Yield Data

Lead Scan / TnR

Drop Ship

Information

Speed

Efficiency

AutomaticDatabase

ManagementNew

Product Introduction

Hard/SoftwareSustaining

PlatformOptimization

Test/Socket /Docking

DevelopmentAnalogAnalogMixed-SignalMixed-Signal

DSPDSPAutomotiveAutomotive

SOCSOCChip-SetChip-SetProbe Probe

ContinuousImprovement

Program

Cost Ownership

Quality

Standardization

Value PropositionValue Proposition

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ASECL ATE Tester PlatformASECL ATE Tester Platform

•SOC

•RF/ RF Mixed

•Analog/Mixed-Signal

•Digital

2004 2005 2006

LTX Fusion RF (HT)

Teradyne Catalyst (Gen3)

2.5GHz

6GHz

200 MHz

Credence Quartet

Teradyne J971

Teradyne J750

Teradyne A5XX VHF/UHF

LTX TS80/88 SZ M3650 Power

LTX Fusion HT

Teradyne Catalyst

Agilent93000 C400E

400 MHz

384/512 CH

Agilent HP93K RF (C200e)

Since 1987

Teradyne J750/MSO

Credence SC212/312

512 CH

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Future Tester RoadmapFuture Tester Roadmap

TimeTime

µProcessorNetwork processor

Enterprise switchPC graphics /

chipsetsWired networkingSet top / satellite

cable modemHard disk / DVR

DSLCD / DVD RW /

RAMCellular baseband

Cellular wirelessVideo / audio /

MPEGWiFi

BluetoothGPS

RFAutomotive power

Standard analogBattery

managementµControllersPLD / FPGA

RFIDSmart cards

Agilent93K (C / SD /RF)

Catalyst (RF)

J750

Quartet

SC312/212

Agilent93K ( PS / DD )

FLEX / FLEX+ (RF)

2005 - 2006

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Wafer Sort Equipment Wafer Sort Equipment (Prober(Prober))

•Electroglas ProberEG 4090/µ(6”/8”)

•TEL ProberTEL P12XL (8”/12”)

•SEMICS / OPUS-IISpec.

(6”/8”/12”)

6 inch to 12 inch wafersort in production

Multiple site sort(x1~x32) with fine pitch testcapability

Laser repair (ESI9830) inproduction

8” WLCSP (bumpedwafer probe) capability

Ink/inkless service

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Gravity Feed Test Handler - FTGravity Feed Test Handler - FT

•SOIC150/300mils•TSSOP173mils• SSOP209mils• SIP• MFP

Daymarc 717

MT9320

Available ! Multi-Test Sites : X1 ~ X8 Temperature : - 55 ℃ ~ + 155 ℃

SO1000

MT9918

SO1800

MT9928

New Handler Under Evaluation

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Pick and Place Test Handler - FTPick and Place Test Handler - FT

DELTA FLEX DELTA 1688

MT9510 NS6040 • S-DIP400mils• MFP• SOIC150mils• BGA/OMPAC• LGA/BCC• QFN/MLF• QFP• CLCC (Image Sensor)

NS7080

Available ! Multi-Test Sites : X1 ~ X8 Temperature : - 60 ℃ ~ + 160 ℃ DELTA CASTLE

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FT Handler CapabilityFT Handler Capability2001 / 2002 2003 2004 2005 2006

Temperature Range

Pick & Place Handler Delta 1688(ambient only)

NS7080(no cold temp)Delta EDGE(no cold temp)Delta Castle (new model)

Gravity Feed Handler Daymarc 717Tesec 8710

Multiple Test Site

Pick & Place Handler Delta 1688 NS7080Delta Castle

NS7080

Gravity Feed Handler Daymarc 717Tesec 8710

Socket Layout

Pick & Place Handler Delta 1688

Gravity Feed Handler Daymarc 717Tesec 8710

PnP Dual Site Pitch

PnP Quad Site Pitch 57.15 mm

PnP Octal Site Pitch

PnP x16 Site Pitch 30 x 60 mm (2x8)

28.58 mm (1x8)40~60 mm x 60~70 mm (2x4)

Daymarc 3287/ MT9320/ MT8588/ MT9918/ RASCO SO1000

40 ~ 57.15 mm (1x4)40 ~ 80 x 60 ~ 70 mm (2x2)

Delta Flex / MT9510NS6040 / Yokogawa

Delta FLEX (1x8)NS7080

Daymarc 3287/ MT9320/ MT8588/ MT9918/ RASCO SO1000

57.15 mm (2.25") ~ 80.0 mm 40.0 mm ~ 114.3 mm

Delta Flex / MT9510NS6040(no cold temp)

Yokogawa(no cold temp)

Daymarc 3287/ MT9320/ MT8588/ MT9918/ RASCO SO1000

Delta Flex / MT9510NS5040/6040

Room Temp - 55 ℃ ~ + 155 ℃

Single (X1) Dual (X2) / Quad (x4) / Octal (X8) Sixteen (X16)

Single (X1) Dual (1X2 & 2x1) , Quad (1x4 & 2x2) Octal (1X8 & 2x4) Sixteen (2x8)

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Model Manufacture Configuration / Capability GS-7100/ RVSI QFP/BGA/BCC BALL SCANNING, LS-7700 MARKING INSPECTION & T/R (ST-60) TSR80/T1100 Evertech MODULE (FULL INTEGRATION) CI9450 ICOS

AIS-3500EX AISI SOIC/QFP LEADS/TOP MARKINGINSPECTION

AIS-630 AISI QFP LEADS/TOP MARKING INSPECT,BGA & BCC TOP MARKING

•• SCANNERS, VISION and SCANNERS, VISION and TnRTnR Integration: Integration:

ASECL Inspection &ASECL Inspection & TnR TnR

TMBZ-NR ISMECA SOIC 150/300 MILS EMBOSS TnR

TMBU-GR/HS ISMECA QFP/BGA/BCC EMBOSS TnR

MP-200 ISMECA SOIC/MFP/TSSOP EMBOSS TnR ANDNT16 ISMECA TUBE TO TUBE OPTION

CI-G10 ICOS

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Bumped Wafer Sort Capability Bumped Wafer CP Data Flow Bumped Wafer Probing

Experience

ASECL Bumped Wafer ProbingASECL Bumped Wafer Probing

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WaferFab

BumpProcess

& VMBump

Wafer CP

InklessMapping

Bump Wafer O.Q.A.

Bump Wafer Singulation

Flip Chip Assy Process

Package Test

Package V/M Packing Shipping

ASECL Bump

ASECL Assy

ASECL F/T

ASECL W/S

Bump Wafer I.Q.A

ASECL W/S

Bumped Wafer Sort CapabilityBumped Wafer Sort CapabilityBumped Wafer Probing Process

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Station Equipment Outlook

2D/3D Auto Inspection Camtek Falcon 830

Wafer Sorter Recif SPP300

Laser Repair ESI-9830

Prober TEL P-12XLN+

Bumped Wafer Sort capabilityBumped Wafer Sort capabilityBumped wafer Sort Equipment

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Handling Carrier:

-- 6”, 8” Cassette, 12” FOUP

2D bump inspection &

active die area defects

(probe mark inspection include )

3D inspection for bump height,

coplanarity & other 3D defects

Map Integration

12”,8“& 6” Bump Wafer InspectionCAMTEK FALCON 830

Bumped Wafer Sort CapabilityBumped Wafer Sort Capability

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Handling Carrier:

- 6”, 8” Cassette, 12” FOUP

Hot and cold temperature, heatdissipation thermal systems.

-55OC~150OC

A high-accuracy and high-forceresistance stage for optimalcontact.

Full automation, capable ofhandling CIM/FA,

12”,8“& 6” Wafer ProberTEL P-12 XLN+

Bumped Wafer Sort CapabilityBumped Wafer Sort Capability

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Wafer Size: 200mm,300mm

Accuracy 0.18um

Minimum Spot size 1.6um

Laser Wavelength 1.3um

Available fuse type

Poly fuse ,Copper Fuse

Aluminum Fuse

Laser Repair SystemESI-9830

Bumped Wafer Sort CapabilityBumped Wafer Sort Capability

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Bumped Wafer Inspection CapabilityBumped Wafer Inspection Capability

MissingBump

Big / Small BumpBump Diameter

Bump Shift Bump Bridge

Satellite Bump Damaged Bump

* 2D Bump Inspection & Metrology *

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* 3D Bump Inspection & Metrology *

Bump Height

Tall BumpShort Bump

Coplanarity

Bumped Wafer Inspection CapabilityBumped Wafer Inspection Capability

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EDC &Data Judgment

REC &Sorting IQA Circuit

Probing

WO

Factory Work (MES)WS

Packing &Packing QAOQA Shippin

g

FRP

MP1T

Wafer Lot and data inputSINF data import form ASE Bumpinghouse or other fab.

IQA data querySystem check the flag for SINFdata available or not, and processinspection by August

Data convert to probing useCompare the SINF file the DPW andconvert to prober usable map file. Data convert to OQA use

Use map transfer tools convert theprober source map to SINF format forAugust using.Auto load the OQA result and save asprober source map format for dataprocess, which would bring out thereports in the following.

Bumped Wafer Sort Data FlowBumped Wafer Sort Data Flow

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• Probing Target: Solder Bump /8”

• Platform: Teradyne J750• DUT: 16 Site ( 4 x 4 )• Max. Pin Count: 448 pin• Min. Pitch: 200 um• Probe Card Type: Cobra(Wire) /

Flat-Tip

Bumped Wafer Probing Experience(I)-Bumped Wafer Probing Experience(I)-Wire TypeWire Type

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• Probing Target: Solder Bump / 8”• Platform: Teradyne J750• DUT: 16 Site ( 4 x 4 )• Max Pin Count: 576 pin• Min. Pitch: 150 um• Probe Card Type: Cobra(MLO/MLC) / Flat-Tip

Bumped Wafer Probing Experience(II)-Bumped Wafer Probing Experience(II)-MLO/MLC TypeMLO/MLC Type

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• Probing Target: Solder Bump• Platform: Catalyst RF• Max. Pin Count: 168 pin• Min. Pitch: 500 um• Probe Card Type: VS2(MLO/MLC) / Crown-Tip• Benefit: Better Contact Solution for RF Testing

Bumped Wafer Probing Experience(III)-Bumped Wafer Probing Experience(III)-WLCSP SolutionWLCSP Solution

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2004 2005 2006 2007Calendar

RF BandwidthRF BandwidthI/OI/O

1.2 G / 2 pins 5 G / 4 pins3 G / 4 pins 10 G / 4 pins

140 um / 1500 pins 100 um / 2500 pins120 um / 2000 pins 90 um / 3000 pins

Min. MembraneMin. MembranePitch/Pin CountPitch/Pin Count

Min. EpoxyMin. EpoxyPitch/PinPitch/Pin

CountCount

Assessment 45 um / 1500 pins50 um / 800 pins 40 um / 1500 pins

Solder Bump & Copper Bond Pads

Solid Copper bond pads

Al Cap. Copper Bond Pads

Slotted Copper bond pads

Min. CobraMin. CobraPitch/Pin CountPitch/Pin Count

Low K / Cu PadsLow K / Cu PadsProbingProbing

40 um / 800 pins 35 um / 1000 pins40 um / 1000 pins 30 um / 1200 pins

P/Card Roadmap for Bump & Al PadP/Card Roadmap for Bump & Al Pad

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