8/13/2019 Asonika Presentation

1/38

Alexander Shalumov

ASONIKA

12/10/13

2013 Workshop on Accelerated

Stress Testing and Reliability

Accelerated Simulation of Thermal

and Mechanical Reliability of

lectronic !e"ices and #ircuits

Alexander Shalumov

Research Institute ASONIKA, Kovrov, RussianFederation

e$mail% A&S1'0()*+mail,ru

---,asonika,com

mailto:ALS140965@mail.rumailto:ALS140965@mail.ru

8/13/2019 Asonika Presentation

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Alexander Shalumov

ASONIKA

12/10/13

2013 Workshop on Accelerated

Stress Testing and Reliability

Dr. Alexander Shalumov is the Director General of the research

institute ASONIKA and the Chair of the InformationTechnoloies De!artment at the "ussian #residential Academ$ ofNational %conom$ and #u&lic Administration. Dr. Shalumov hasreceived several !restiious national a'ards in sciencetechnolo$ and is reconi(ed as a leader in the field ofinformation technolo$ and automated s$stems in "ussia. )ehas more than *++ !u&lications, includin - &oos. Durin thelast /+ $ears he 'as the su!ervisor of /0 #hD 'ors.

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Alexander Shalumov

ASONIKA

12/10/13

2013 Workshop on Accelerated

Stress Testing and Reliability

What is AS./AASONIKA is and automated sot!are s"stem or simulation o

electronic devices or #oth harmonic and random vi#rations osin$le and multi%le im%acts, linear acceleration and acoustic

noise, and stationar" and non&stationar" thermal eects' (he

%ro$ram calculates the num#er o c"cles to ailure under

mechanical loads, as !ell as, under c"clic thermal eects'

)ulti%le a%%roaches and models have #een used to estimate

relia#ilit" and to %redict %otential sources o ailure'

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Alexander Shalumov

ASONIKA

12/10/13

2013 Workshop on Accelerated

Stress Testing and Reliability

---,asonika,com

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Alexander Shalumov

ASONIKA

12/10/13

2013 Workshop on Accelerated

Stress Testing and Reliability

---,asonika,com

System AS./A structure

Analysis of thermal and mechanical

characteristics

printed-circuit boards:

ASONIKA-TM

Scheme

Scheme calculation: PSpice,

Mentor Graphics, OrCAD,

Altium Designere

Placing, trace:

PCAD, Mentor Graphics,

OrCAD,Altium Designere

Creation of drawings:

ProEngineer, Soli!or"s,

In#entor

Data control at modelling

ASONIKA-$M

PDIF,IDFSchemefile Characteristics

Analysis of mechanical durability

of cases, blocs: ASONIKA-M,ASONIKA-%

Analysis of thermal characteristics

of cases, blocs:

ASONIKA-T

Formation of cards of operating

conditions of electronic components:

ASONIKA-&

Analysis of indicators of reliability:

ASONIKA-'

I!"S, SA#

$

%

&

'

( ) * + $ $$

$'

$&

$%

Analysis of fatigue durability of designs of

printed-circuit boards and electronic

components at mechanical influences

ASONIKA-$ST

Analysis of electromagnetic

compatibility:

ASONIKA-EMC

$(

$)

Integrated database of

electronic components:

ASONIKA-'D

$*

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Alexander Shalumov

ASONIKA

12/10/13

2013 Workshop on Accelerated

Stress Testing and Reliability

Why AS./A is uniue1' ASONIKA has relia#le %h"sical models and data#ases o the re*uired

%ro%erties o all materials and com%onents'2' ASONIKA has sim%le intuitive interaces that are eas" to use #"

desi$ners or ra%id modelin$'3' ASONIKA considers eatures o %ro%erties o the materials a%%lied in

electronics, or exam%le, their nonlinear %ro%erties'+' ASONIKA is coom%ati#le !ith %o%ular A- s"stems and ormats.

A-, )entor ra%hics, OrA-, Altium -esi$nerer'

' ASONIKA has #een used #" Russian com%anies and universities ormore than 30 "ears' ASONIKAs data#ases have #een u%dated and ne!modules have #een develo%ed durin$ the last three decades'

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8/13/2019 Asonika Presentation

7/38Alexander Shalumov

ASONIKA

12/10/13

2013 Workshop on Accelerated

Stress Testing and Reliability

4o- AS./Acan helpslectronic devices are su#4ected to heat and

mechanical stress' Failures can cause various%ro#lems rom an inconvenience to a catastro%he'rediction o relia#ilit" !ithin ex%ected thermal and

mechanical eects is mandator" or manuacturin$ oan" electronic devices' (here is a $ro!in$ demand in

sot!are %ro$rams or ra%id simulation, !hich canrelia#l" %redict %otential %ro#lems, sources o ailures,

etc'

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8/13/2019 Asonika Presentation

8/38Alexander Shalumov

ASONIKA

12/10/13

2013 Workshop on Accelerated

Stress Testing and Reliability

---,asonika,com

Speci() a name (or the pro*ect Select + moel to import(ransient thermal 5 ati$ue anal"sis in ASONIKA

8/13/2019 Asonika Presentation

9/38Alexander Shalumov

ASONIKA

12/10/13

2013 Workshop on Accelerated

Stress Testing and Reliability

---,asonika,com

uarter-s)mmetr) moel o( PC' 'GA Pac"age

8/13/2019 Asonika Presentation

10/38Alexander Shalumov

ASONIKA

12/10/13

2013 Workshop on Accelerated

Stress Testing and Reliability

---,asonika,com

Speci() initial temperature (or entire

moel ./0 egrees C1

This temperature -ill be also used as a

reference temperature

for thermal stress calculation

Select e2ternal sur(aces an set the

thermal conition3 con#ection anraiation .(rom these sur(aces1 to the

en#ironment

Specify film coefficient5 emissi"ity5 "ie- factor

and ambient temperature "alues

8/13/2019 Asonika Presentation

11/38Alexander Shalumov

ASONIKA

12/10/13

2013 Workshop on Accelerated

Stress Testing and Reliability

---,asonika,com

Sur(aces 4ith thermal conitions 5ecome meshe

Symmetry planes should not ha"e thermal

conditions

Select the #olume .that represent the

silicon chip1 an set it as a heat po4ersource

8/13/2019 Asonika Presentation

12/38Alexander Shalumov

ASONIKA

12/10/13

2013 Workshop on Accelerated

Stress Testing and Reliability

---,asonika,com6or transient thermal anal)sis

heat po4er source can 5e time epenent

In%ut heat %o!er vs time

curve'

In this exam%le t!o

thermal c"cles are

modeled' (ime de%endentheat %o!er !ill cause

c"clic tem%eratures and

stresses' "clic thermal

stresses are used or

ati$ue calculation

.ne thermal 6heat po-er7 cycle has range of 8$18 Watt 62$',* Watt for uarter symmetry model7

8/13/2019 Asonika Presentation

13/38Alexander Shalumov

ASONIKA

12/10/13

2013 Workshop on Accelerated

Stress Testing and Reliability

---,asonika,com

Set material properties (or all parts o( the moel 6or soler

5alls the (ollo4ing parameters 4ill 5e use3

8/13/2019 Asonika Presentation

14/38Alexander Shalumov

ASONIKA

12/10/13

2013 Workshop on Accelerated

Stress Testing and Reliability

---,asonika,com

&un automatic 6E mesh generation

proceure

Set solution parameters

Specify the end time of the analysis5

the time integration step and the

number of thermal cycles contained

in the solution inter"al

8/13/2019 Asonika Presentation

15/38Alexander Shalumov

ASONIKA

12/10/13

2013 Workshop on Accelerated

Stress Testing and Reliability

---,asonika,com

(!o ar#itrar" nodes !ere selected (em%erature vs time curves or t!o nodes

Temperature 7 time cur#e at noes

8/13/2019 Asonika Presentation

16/38Alexander Shalumov

ASONIKA

12/10/13

2013 Workshop on Accelerated

Stress Testing and Reliability

---,asonika,com

Stress-time cur#e

(!o ar#itrar" nodes !ere selected Stress vs time curves or t!o nodes

20 3 k h l d

8/13/2019 Asonika Presentation

17/38Alexander Shalumov

ASONIKA

12/10/13

2013 Workshop on Accelerated

Stress Testing and Reliability

---,asonika,com

6atigue plot

lot sho!s minimum ati$ue lie 6+1'7 thermal c"cles8 in solder #alls

2013 W k h A l d

8/13/2019 Asonika Presentation

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Alexander Shalumov

ASONIKA

12/10/13

2013 Workshop on Accelerated

Stress Testing and Reliability

(he dura#ilit" o an electronic com%onent de%ends on the time toati$ue&ailure o the com%onent terminals and its residual lie' (ime toati$ue&ailure under harmonic vi#rations is $iven #".

---,asonika,com

fNt .//

=

m

ma0

-1/

=

NN

( ) ( )

+

=

dSm

tm

mm .%

-%

%2%

A%

(he num#er o c"cles to ati$ue&ailure under harmonic vi#rations is $iven #".

(ime to ati$ue&ailure o the com%onent terminals under random loadin$can #e ound

2013 W k h A l t d

8/13/2019 Asonika Presentation

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Alexander Shalumov

ASONIKA

12/10/13

2013 Workshop on Accelerated

Stress Testing and Reliability

---,asonika,comAS./A$M Subsystem of the analysis of volumetric constructions of electronic

equipment on mechanical influences

2013 W k h A l t d

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Alexander Shalumov

ASONIKA

12/10/13

2013 Workshop on Accelerated

Stress Testing and Reliability

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#./!9#T./

#./TA#T 4AT :#4A/;

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T4RMA& RSSTA/#

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S.9R# .= TM?RAT9R

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