SUPERIOR TECHNOLOGYFOR SINTERING, SOLDERING, DIFFUSION AND CVD
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ATV Technologie GmbH
BSET EQ History • Founded in 1996 • HQ in Antioch, CA• East Coast Office, Philadelphia, PA• Engineering• R&D • Process Development • Manufacturing• In-House Machine Shop• Customer tailored solutions ©2018 BSET EQ. www.bsetplasmas.com 1
ATV History • Founded in 1972
• HQ in Vaterstetten (near Munich)
• Engineering department
• R&D department
• Process department
• SW department
• In-House flexible production (In Cleanroom)
• Customer tailored solutions
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Product Portfolio
SRO series IR Vacuum reflow Rack and Table top systems
i-Line Automated Vacuum Reflow System for Mass Production
SRO-706 MEMSlid sealing/getter activation system
PHP-603 LTCCSintering Press
PEO seriesFast ramping multipurpose quartz tube furnaces
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IR LPCVD/ALD/RTASystems SRO-TCB Thermal
Compression Reflow System
RV series Diamond Scribers
SRO-7XX Series
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SRO-700 Tabletop Reflow System
SRO-714/716 Stand Alone
Reflow System
SRO-700 Tabletop
• Basic entry level Table Top System • Based on original SRO-704 chamber • R&D Applications • Pilot Line Applications (Low Volume) • Reflow Soldering • RTA • Brazing • Cold Wall Chamber Technology • IR Heating • HCOOH atmosphere feature included in
standard system configuration
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SRO-700
SRO-700 Features
• Flux, Flux-Less and Solder Paste • HCOOH Standard • Direct IR Heating • Multiple Monitoring TCs • Process Temp. 450°C up to700°C • Ramp-up Rate 3.5K/sec. • Ramp-down Rate 2K/sec. • 100 Step Recipe Program
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SRO-700 Series Options
• Spring Pin Array (Mounted into the Chamber Lid)
• Customer tailored Substrate Fixture
• Graphite Heater Plate
• Spring Clamps on Hot Plate
• Lid Lock
• Diaphragm/Scroll Pump, or Turbo Pump
• Closed Loop Water Chiller/Heater
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SRO-714/716 Series
• R&D Applications
• Pilot Line Production
• Reflow Soldering
• RTA
• Brazing
• Cold Wall Chamber Technology
• IR Heating
• Vacuum (Optional)
• High Vacuum (Optional)
• HCOOH (Optional)
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SRO-714/716 Series Features
• Flux, Flux-Less and Solder Paste • HCOOH Enriched Atmosphere • Direct IR Heating • Multiple TC Monitoring • Process Temp. Up to 450°C • Ramp-up Rate 3.5K/sec. • Automatic Lid• Ramp-down Rate 2K/sec. • 100 Step Recipe Program
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SRO-714/716 Series Technical Data
• Footprint 38”L x 28”W x 53”H • Heated Area:
• SRO-714 - 9” x 8.5”• SRO-716 - 12” x 12”
• Heating Zones: • SRO-714 - 2• SRO-716 - 3
• Heating Method: • SRO-714 - 8 Lamp Array• SRO-716 - 12 Lamp Array
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SRO-714/716 Series Options • Spring Pin Array (Mounted into the Chamber Lid) • Customer tailored Substrate Fixture • Lift Pins • Spring Clamps on Hot Plate • Formic Acid enriched Atmosphere • Flux management • Diaphragm/Scroll/Turbo Pump < 5x10-6mbar • H2O/ O2 Analyzing • H2 and N2H2 Safety Features • Gas Plasma Atmosphere • RGA/Mass Spectrometer • Closed Loop Water Chiller/Heater • Top Heater• Glove Box integration
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Up to 300 mm Single wafer processing:Up to 50 K/secondWith flux management: photo shows easily exchangeable flux hood in chamber lid which is part of flux management system
Options overview
Options: SRO-700 SRO-714 SRO-716Formic Acid HCOOH Yes Yes YesVacuum Yes Yes YesCustom Tooling Yes Yes YesOverpressure No Yes YesFlux Management No No YesTop Heater No Yes YesHydrogen Operation (up to 100%) No Yes YesHigh Temperature (up to 700°C) Yes Yes YesHigh Temperature (up to 750°C) No Yes YesSwap Plates No Yes YesIn-Line Operation No Yes YesNo Wafer/Plate Movement during Cooling No Yes Yes
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Specification Overview
Specification SRO-700 SRO-714 SRO-716
Max. Temperature 700°C 750°C 750°C
Heated Area 9" x 8.5" 9" x 8.5" 12" x 12"
Wafer Size 200 mm 200 mm 300 mm
Uniformity (85% of heated area, edge exclusion 15mm) <2-3% <1% <1%
He Leak Rate < 5x10-8mbar x l/sec < 5x10-9mbar x l/sec < 5x10-9mbar x l/sec
Max. Vacuum < 5.0 x10-5mbar x l/sec < 5,0 x10-6mbar x l/sec < 5,0 x10-6mbar x l/sec
Chamber Height 100 mm 40 - 100 mm 40 - 100 mm
Chamber Locking Manual Automatic Locking Automatic Loading
Lid Opening/Closing Manual Automatic Automatic
Flow Control Manual Flow Meter MFC MFC
Control T/C T/C in Hot Plate Touch T/C Touch T/C
Chamber Cooling Vertical Gas Flow Horizontal Gas Flow Horizontal Gas Flow
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Sample Applications
• IGBT • Power Semiconductors • Sensors • MEMS Devices • DIE Attach• High Power LED • Hybrid Assemblies • Flip Chip • Package Sealing • MMIC‘s • CPV Laser Bars
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