Achieve top results with uncompromised acceleration.
The Aurora® Hi√e HPC systems are optimized to accelerate workloads, offering performance, energy efficiency, density and flexibility like never before.They allow the best adaptation to applications, accelerating them with the configuration that minimizes time to solution.
Why Aurora Hi√e?
Optimized for accelerated workloads. Designed to fit the application needs, the Hi√e supports multiple accelerated configurations that push the workload speed up to the topEnergy efficiency. Optimized architecture and direct hot liquid cooling to maximize Flops/watt and minimize the data center PUE.
Modularity / flexibility. Allows the best fit to business needs thanks to a choice of configurable modules Bridge to the future. Intel and ARM-64 based nodesSuperb RAS. Based on Eurotech embedded/ruggedized technology.
Features
Highest density. >1 PFlops / rackExtreme efficiency > 5 GFlops/Watt
Best Flexibility. A choice of modules for different configurations
Low power CPU. Intel and ARM-64 based nodesAcceleration. Multiple accelerators per CPU
Liquid cooling. Entirely cooled with the Aurora Direct Hot Water Cooling
Scalability. Scale over hundreds of accelerators
Silence. No fans needed
Aurora The Ultimate Accelerated Computing Solution
: High Velocity HPC SystemsAurora Hi√e is a line of complete and robust HPC systems, built on an innovative supercomputing architecture that allows acceleration, optimization and flexibility. Entirely hot water cooled, highly dense and compact, provided with software stack and monitoring tools, the Hi√e series delivers a quality, reliable HPC solution.
The Hi√e architectureThe system building block
is the Aurora Hi√e module, an innovative form factor, hot
water cooled enclosure supporting different configurations of the components.
Modules provide computation and control functionality (Intel or ARM processor), acceleration (Intel Phi or
Nvidia GPU) and additional functionality of storage and visualization, using sub-modules in the same form factor.
The modules are logical nodes of a large system. The nodes are hosted in the Aurora Hi√e rack
in any combination up to 128 per cabinet. The High Speed Interconnect allows
scaling to any size system with density over 1 PFlop/s DP per m2
*supported on ARM
AURORA SOFTWARE STACK
Programming tools and libraries
Intel Cluster StudioMPSS,NVIDIA CUDAGNU Compiler Collection*
Cluster Management Bright Cluster ManagerxCAT*
Communication librariesIntel MPI Open MPIMVAPICH2
File systemsLustreBeeGFSNFS
Mathematical libraries FFTW* Monitoring and security
NagiossGangliaAurora monitoringEurotech ESS
DebuggersTotal ViewIntel debuggersGNU GDB
Operating system
CentOS*Scientific Linux*Red HatSUSEUbuntu*
Resource managers and schedulers
Altair PBS ProfessionalTORQUE/MAUISLURM*
DriversAurora DriversAccelerator DriversOFED
Typical applications running on Hi√e include:Oil&Gas (seismic), Life Science (Molecular Dynamics, Quantum Chemistry, NGS), Medical Imaging, Rendering, Deep Learning, Computational Finance, Data Analytics, CAE, Physics (LQCD).
Applications
New water cooling technology
Silent, lighter and more compact
Aurora Hi√e is entirely water cooled with the improved 2nd generation of the acknowledged Aurora Direct Hot Water Cooling. This new water cooling technology, lighter and more compact, allows higher packaging density and higher effectiveness in heat extraction, maximizing efficiency and minimizing infrastructural costs. Thanks to water cooling, the systems contain no fans or other moving parts and are completely silent.
Save time energy and space
Acceleration
Hi√e can be delivered with 4 GPUs or 4 coprocessors per single CPU node, a configuration that has been proven suitable and capable to accelerate a wide range of applications.
Energy efficency
Hi√e uses low power Intel E3-12xx v3 processors or Applied Micro X-Gene ARM-64 processors combined with GPUs or coprocessors, with all components hot water cooled to maximize efficiency at system and data center level.
Density
Thanks to direct water cooling, the innovative architecture and the barebones assembly, Aurora Hi√e boasts an extraordinary computational density with more than 1 PFlop/s per rack.
Hi√e supports different combinations of PCIe modules that can add accelerations, storage, video processing and other capabilities to the system.
Processor 1 x Intel Xeon E3-12xx v3
Accelerators 4 x Intel Phi
Interconnects 1 x IB FDR (2 ports)
Processor 1 x Applied Micro 64 bit ARM
Accelerators 4 x Intel Nvidia Tesla K40
Interconnects 1 x IB FDR (2 ports)
Processor Intel Xeon E3-12xx v3 or ARM 64 bit
Sub-modules PCIe cards of different functionality (NVMe, accelerators, storage, video cards...)
EXAMPLES OF CONFIGURATION
Processor 1 x Intel Xeon E3-12xx v3
Accelerators 4 x NVIDIA Tesla
Interconnects 1 x IB FDR (2 ports)
Specifications
SYSTEM
Energy efficiency > 5 GFlops/Watt
Peak Performance DPUp to 750 TFlop/s DP per rack (Nvidia K40) - 880 TFlop/s per rack with GPU Boost Up to 1 PFlop/s DP per rack (Nvidia K80) - 1.5 PFlop/s per rack with GPU BoostUp to 4.5 PFlop/s SP per rack (Nvidia K80) - 1.5 PFlop/s per rack with GPU Boost
Architecture Up to 128 nodes per rack
Cooling Aurora Direct Liquid Cooling
Reliable, Available, Serviceable (RAS)
Soldered memory, no fans, no hot spotsMonitoring of system and cooling loop Hot swap nodesEurotech ESS safety software
Power (peak) 166 kW fully loaded
Rack dimensions (H x W x D) 2200 x 880 x 1300 mm
NODE
Peak Performance DPUp to 5.9 TFlop/s DP (Nvidia K40) - 6.8 TFlop/s with GPU Boost Up to 7.7 TFlop/s DP (Nvidia K80) - 11.8 TFlop/s with GPU BoostUp to 23 TFlop/s SP (Nvidia K80) - 35 TFlop/s with GPU Boost
Processor E3-12xx v3 – TDP up to 84WApplied Micro ARM 64-bit processor
Coprocessors and Accelerators
NVIDIA® Tesla® K40, K80, M60Intel® Xeon Phi™ 7120x AMD® Firepro™NVIDIA GeForce GTX M980 NVMe storage cards
Soldered high reliability memory 32 GB DDR3 (8GB per processor core)
Storage 1 x 1 TB half slim 1.8” SATA SSD
Interconnect and Networks 2 x FDR = 112 Gbit/s
I/O front panel
2 x 1GigE (1 x 10 GigE on ARM version)2 x USB1 x VGA2 x FDR Infiniband
Information in this document is provided in connection with Eurotech products. Except as provided in Eurotech’s terms and conditions of sale for such products, Eurotech assumes no liability whatsoever, and Eurotech disclaims any express or implied warranty relating to sale and/or use of Eurotech products, including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right.
Specifications and features subject to change without notice. All trademarks and tradenames are the property of their respective owners.
Copyright © 2014 EUROTECH. All rights reserved.Hi√e
For queries, quotations and ordering a development kit, please contact sales at: [email protected] www.eurotech.com/aurora