Automotive ADAS MPSoC Roadmap on GF FDSOI technology SOI...

Automotive ADAS MPSoC Roadmap on GF FDSOI technology

SOI Consortium Santa Clara, Apr. 26th, 2018

Dr. Jens Benndorf MD, COO Dream Chip

Dream Chip Technologies GmbH

Dream Chip Technologies

DCT Company Profile

Dream Chip Technologies …

• Positioned as a Fabless Semiconductor Engineering Company for medium to large SoC designs covering the whole range from Architecture, Specification, Design, Verification to GDSII with a strong focus on Vision Processing

• Technologies: 130nm, 40nm, 28nm, 22nm FDX, 14/16nm FF • 75 Employees/ 65 Engineers with 10 … 20 years SoC design experience • Based in Hanover (HQ) and Hamburg, Germany • Member of Silicon Saxony/ Germany • Cadence Design Center Partner for Tensilica



Source: Texas Instruments

Assisted Driving requires Cameras, Radar, Lidar and Ultrasonic



Use Cases

I/Os

Mem

ory

4x Video InVideo Out

4x ISP

2x ARM Cortex-R5

4x ARM Cortex-A534x Tensilica

Vision P6

InterconnectI/Os

Mem

ory


4x ISP

2x ARM Cortex-R5

4x ARM Cortex-A53

Interconnect

4x Tensilica Vision P6



Use Case #1: Digital Mirroring

Source:



Use Case #2 : 360 deg Top View Camera



Use Case #3 : Pedestrian detection via HOG and CNNs



MPSoC Chip Architecture

I/Os

Mem

ory


4x ISP

2x ARM Cortex-R5


Vision P6

InterconnectI/Os

Mem

ory


4x ISP

2x ARM Cortex-R5

4x ARM Cortex-A53

Interconnect




SDIP Roadrunner 2 (TO Jan. 2017)



Floorplan

IVP: Pixel Level

Memory IF

Memory IF

Lock-Step

ARM A53: Object L.

• Tape-Out on Jan. 10th, 2017

• Global Foundries – 22 FDX GF – externally adjustable BIAS voltage – 8x8 mm (64 mm^2)

• Calculation Power – ARM Cortex A53 quad core – 4x Tensilica Vision P6 – optimized for ADAS and CNN – 4x video-in, 1x video-out

• MCM package – DIE + 2x DDR4 on Silicon interposer



CNN capabilities

I/Os

Mem

ory


4x ISP

2x ARM Cortex-R5


Vision P6

InterconnectI/Os

Mem

ory


4x ISP

2x ARM Cortex-R5

4x ARM Cortex-A53

Interconnect




• Convolutional Neural Network (CNN) benchmark − Speedup of 64 through VP6 optimization − VP6: 330 CNNs / s @ 750 MHz, 4 W − Core-i5: 83 CNNs/s @ 2,6 GHz, 45 W

• 360°Surround View − VP6: 30 fps @ 750 MHz, ~4 W − Intel GPP: 8 fps @ 4x3,4 GHz, ~65 W

➢ Tensilica Vision P6 architecture (512b SIMD, 5-way VLIW, DMA, Gather-Scatter) fits to common Computer Vision use cases

Intel GPP Tensilica VP6

x45 x61

CNN and Top View Performance Benchmarks



AlexNet performance comparisonVision P6 (¼ SDIP)

Ceva XM6(IP planned)

Nvidia X1(SoC)

Clock rate 1.1 GHz 1.5 GHz 690 MHz

Multipliers 256 128+512 256

GMAC 282 395 176

AlexNet runtime 5.2 ms 3.7 ms 15 ms

AlexNet throughput 192 fps* 268 fps** 67 fps***

AlexNet throughput normalized to 1.1 GHz 192 fps 196 fps 106 fps

*: Source: Cadence Design Systems **: extrapolated from CEVA presentation “Fifth-Generation CEVA Imaging & Vision Silicon IP”***: Source: Nvidia white paper “GPU-Based Deep Learning Inference: A Performance and Power Analysis” (single batch)



Power Analysis (no power optimization)



MPSoC Chip / Starter Kit

I/Os

Mem

ory


4x ISP

2x ARM Cortex-R5


Vision P6

InterconnectI/Os

Mem

ory


4x ISP

2x ARM Cortex-R5

4x ARM Cortex-A53

Interconnect




System in Package Design

System-on-Module features • 4GB LP-DDR4 3200 RAM

Interfaces • Four 300MB/s video inputs • One 300MB/s video output • Gigabit Ethernet



Assembling the SOM...

Overview • Power management and

measurement • Chip power supplies included

Benefits • Reduced application-specific

baseboard complexity • Interfaces customizable to

application requirements



Demo

I/Os

Mem

ory


4x ISP

2x ARM Cortex-R5


Vision P6

InterconnectI/Os

Mem

ory


4x ISP

2x ARM Cortex-R5

4x ARM Cortex-A53

Interconnect




ELIV2017/AutoSense 2017/GTC2017



MWC 2018

■Pedestrian Detection based on CNN technology executed on two Vision P6 processors at MWC 2018



Whats Next?

I/Os

Mem

ory


4x ISP

2x ARM Cortex-R5


Vision P6

InterconnectI/Os

Mem

ory


4x ISP

2x ARM Cortex-R5

4x ARM Cortex-A53

Interconnect




VP Roadmap



SDIP Roadmap

Roadrunner 14x VP6, 4xSensors1024 MACs0.6 TMAC/s175 GMAC/W64mm2

Roadrunner 24x VP6, 4xSensors1024 MACs0.7 TMAC/s175 GMAC/W64mm2, 22nmFDX

Veyron 2xVP6, 2xVC5, 4xSens.2.5 kMACs2 TMAC/s0.8 TMAC/W90mm2, 22nm FDX

Chiron 2xVP6, NG C5, 8xHDR ISPs16 kMACs48 TMAC/s3-4 TMAC/W2-2.5 TMAC/mm2130mm2, 12nm FDX

Oct. 2016 Jan. 2017 Jul. 2018 Dec. 2019 Time

Perfo

rman

ce



Thank You! Please contact

[email protected]

Dream Chip Technologies GmbH Steinriede 10

D-30827 Garbsen/Hannover Germany

+49-5131-90805-120

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