AN AVNET ELECTRONICS MARKETING PUBLICATION

VOLUME 1// ISSUE 3// OCTOBER 2013

Find Out How ARM® Architecture Fuels a Deep Ecosystem for Embedded Systems DesignsPAGE 06

When Should You Plan for Power in an FPGA System?PAGE 19

Learn More About the Consumerization of OEMsPAGE 46

Conferences, Trainings & SeminarsPAGE 48

Shop Smart for Your Processing & Power Solutions

© Avnet, Inc. 2013. All rights reserved. AVNET is a registered trademark of Avnet, Inc.Xilinx and Zynq are trademarks or registered trademarks of Xilinx, Inc.

MicroZed™ is a low-cost development board based on the Xilinx Zynq®-7000 All Programmable

SoC. Its unique design allows it to be used as both a stand-alone evaluation board for basic SoC

experimentation, or combined with a carrier card as an embeddable system-on-module (SOM).

This combined stand-alone/SOM approach can quickly move a design idea from concept

to production, making MicroZed the ideal platform for SoC based applications. MicroZed is

supported by a community website where users can download kit documentation and reference

designs as well as collaborate with other engineers also working on Zynq designs.

www.microzed.org

Low-cost development tool

Off-the-shelf SOM solution

Out-of-the-box Linux support

Easy migration from prototype to production

Welcome to the Family!

PRESIDENT’S MESSAGE

Processing and power. The brains and brawn on the board. Both are critical to its functionality and the design community has a lot of considerations surrounding both when making decisions for the next generation of products. We bring you food for thought.

This issue of AXIOM is dedicated to processing and power and in these pages we bring together a team of industry experts to talk about what you need to know in these areas. Avnet’s advanced architechtures expert Jim Carver gets to the heart of the ARM processor cores – explaining the history of ARM’s first offering through the current ecosystem of products, as well as and their functionality. And because no one likes to be in the dark, Chris Ammann explains why it is so critical for FPGA designers to plan for their board power at the beginning of the design process. Doug Geisler looks at how industrial OEMs have started to act like consumer electronics companies, or the “consumerization” of the market, and outlines the benefits and challenges to this new experience.

We round out this issue of AXIOM with the most current seminars and trainings to keep you up-to-date on what’s available. And, of course, we bring you the latest information on new products and technologies from our supplier partners and the resources you have available from Avnet Electronics Marketing. This is a comprehensive issue featuring component suppliers from a broad spectrum of our line card – with 21 supplier technologies mentioned from nearly A to Z, we go from Analog Devices Inc. to Renesas to Xilinx and many others in between!

There is something for everyone in this issue of AXIOM, and I hope you enjoy it. Feel free to drop us a line at axiom@avnet.com and tell us what you think about the publication; we’d love to hear your feedback!

Regards,

Ed Smith, Avnet Electronics Marketing Americas President

CONTENTS

Printed in the U.S.A.

SUBMISSIONSWe encourage prospective authors to submit articles. To obtain a copy of AXIOM article submission guidelines, please contact lara.levicki-lavi@avnet.com.

A X I O M

ARCHITECTURE FUELS DEEP

ECOSYSTEM FOR NEXT-GENERATION

EMBEDDED SYSTEMS

DESIGN

ARM®

6IN THIS ISSUE

46 FEATURE STORY

Consumerization of OEMs

10 PROCESSING PRODUCTS & SOLUTIONS

Check out the latest offerings from our leading line card manufacturers, including:

• Atmel • Freescale • Maxim • Microsemi • Renesas • Silicon Labs • Texas Instruments • Xilinx

48 TRAINING & EVENTS

Get up to speed about the latest technology, products and solutions

50 WHAT’S NEW

New product introductions

VOLUME 1 . ISSUE 3 . OCTOBER 2013

AV N E T E L E C T R O N I C S M A R K E T I N G

QUESTIONS, COMMENTS, SUGGESTIONSPlease forward your questions, comments and suggestions on this issue and for any future topics to axiom@avnet.com.

AXIOM IN YOUR IN-BOXSign up to receive AXIOM, or our other informative ePubs and eNewsletters, at www.avnetpreferencecenter.com.

DOWNLOAD AXIOMem.avnet.com/axiom

FOLLOW AVNET EM @avnetdesignwire facebook.com/avnetem

25 POWER PRODUCTS & SOLUTIONS

Everything you need to know about new and focus manufacturer products and solutions, highlighting design issues, solutions, innovations and trends. Learn more from:

Analog Devices Renesas Power One TDK-LambdaFairchild Semiconductor Freescale

OSRAM Opto Semiconductors

ON Semiconductor STMicroelectronics Toshiba Vishay NIC Components

BournsCarling Technologies TE Connectivity Molex AVX

19WHEN SHOULD YOU PLAN FOR POWER IN AN FPGA SYSTEM? RIGHT AT THE BEGINNING

ARM® Architecture Fuels Deep Ecosystem for

Next-Generation Embedded Systems Design

By Jim Carver, Director Technology, Tech Marketing, Avnet Electronics Marketing

Electronics systems manufacturers face a growing challenge in meeting specialized market requirements across an expanding range of embedded applications. In the past, systems design companies struggling to address disparate application requirements found themselves driven to correspondingly disparate processor architectures, each with their own development tools and resources. Today, however, engineers can find an extensive array of specialized processors — each designed with features tuned to specific application areas, yet all building on a common processor core from the ARM® family.

AVNET ELECTRONICS MARKETING 07

With its broad support for silicon, software and systems vendors, the ARM architecture lies at the heart of the industry’s richest, most broadly supported software and silicon ecosystem. Underlying this ecosystem, the ARM architecture ties together processor cores, memory and other system and peripheral IP — all intercommunicating through the standard ARM Advanced Microcontroller Bus Architecture (AMBA®).

ARM’s processor IP cores build on the classic RISC architecture with a broad array of specialized types created to serve specific application areas including embedded and general-purpose computing — each core type emphasizing different combinations of key operating characteristics and low power, high performance and dedicated hardware functionality.

Since the ARM6 core introduced in the early 1990s, ARM has enhanced the flexibility for incorporating ARM cores with the introduction of synthesizable cores in the late 1990s. With the introduction of the Cortex® family of cores in the mid 2000s, ARM delivered a range of cores able to support the broadest range of applications (Figure 1).

At the heart of TrustZone, each physical processor core provides two virtual cores that isolate secure from non-secure operations, using a special monitor mode to safely time-slice operations between the two virtual cores to ensure the protection of privileged operations while maintaining required performance levels (Figure 2).

Figure 1. The ARM Cortex family targets diverse application areas with specialized series such as the Cortex-A series (left), Cortex-R series (middle) and Cortex-M series (right). Source: ARM

Figure 2. ARM TrustZone augments Cortex-A series cores with security extensions that ensure isolation of secure operations from non-secure operations in virtual processor environments managed by a unique monitor mode in the physical core. Source: ARM

ARM Cortex-A series processors are designed to execute complex operating systems such as Linux, Android and Microsoft Windows, integrating a memory management unit (MMU) designed to address OS memory requirements.

ARM Cortex-R series embedded real-time processors are designed to deliver highly deterministic real-time behavior in a wide range of power sensitive applications. In many applications, these processors run a Real-Time Operating System (RTOS) alongside user-developed code. In this class of applications, the target design typically requires only a Memory Protection Unit (MPU) as opposed to the MMU available in Cortex-A series cores.

ARM Cortex-M series processors are optimized for deeply embedded designs that require the lowest possible power consumption, typically operating with application firmware to support the very specific requirements of the targeted embedded application.

ARM builds on the Cortex-M series architecture to provide specialized solutions such as the ARM SecurCore™ processor family, which includes dedicated hardware security features tuned to support secure embedded applications such as smartcards. In addition, ARM’s TrustZone® architecture builds on the Cortex-A series processors to provide hardware security extensions capable of supporting a trusted execution environment for secure applications and services.

08 AXIOM

Design AdvantagesFor systems manufacturers, this broad range of specialized cores enables systems designers to more easily address the varied requirements of individual subsystems in complex designs. For example, mobile computing system designers can draw on the unique capabilities of each member of the ARM family — dramatically simplifying development thanks to the use of a consistent instruction-set architecture across the multi-processor design (Figure 3). At the same time, the same members of the ARM family can serve in widely different applications such as smart meters (Figure 4).

Figure 3. An optimized mobile computing system design takes advantages of specialized functionality and performance of different member of the ARM family for example, resulting in an overall design that enjoys the development advantages of a single instructionset architecture without compromising requirements of individual subsystems. Source: ARM

Figure 4. Designers can combine ICs based on different members of the ARM processor to meet the diverse requirements of embedded applications such as smart meters for sensing, analysis and communications. Source: ARM

AVNET ELECTRONICS MARKETING 09

For IC manufacturers, the combination of ARM specifications, design resources and extensive ecosystems of IP and tools enables chip designers to focus on their unique value-add, sourcing supporting IP and tools from other ARM partners. ARM IP licensees combine specialized ARM processor cores with their own unique combinations of cores for DSP, video processing and peripherals configured for specific application requirements.

Tying the IP together, AMBA provides a standard interface specification that ensures compatibility between IP components from different design teams or vendors. AMBA encompasses a number of specifications such as AMBA ACE™ for sharing data, AMBA AXI4™ for multiple master architectures and ARM CHI for ensuring efficient operation in complex architectures. In aggregate, the ARM specifications help simplify IP integration, speeding complex design projects.

For IC manufacturers, ARM ties the various elements of an ARM-based chip design together in resources such as ARM System Design Kits (SDK) designed to shorten the learning curve needed to design ICs with the ARM architecture and reduce time to market for those ICs. For example, the Cortex-M SDK (CMSDK) includes reusable IP, hardware design examples and software examples designed to help designers quickly develop complex SoC designs.

ARM-based SolutionsTogether, the combination of high-performance core IP, system IP, third-party IP and specifications provides a very rich source for silicon manufacturers to create ARM-based SoCs for diverse application areas. Indeed, nearly 100 leading IC manufacturers have leveraged the ARM ecosystem to create processor families targeting key application areas. As a result, systems designers can choose from an extensive range of MCUs that combines different ARM cores with peripherals to serve specific markets.

Among other ARM-based MCUs, designers can find multiple product families such as the following:

• Atmel® SAM family of embedded processors features a wide range of offerings ranging from Cortex-A series families designed for cost-sensitive applications to flash MCUs based on Cortex-M series cores.

• Freescale Semiconductor’s i.MX family builds on ARM A series cores and other ARM cores to address embedded smart devices for consumer, automotive and industrial markets; its Kinetis line based on Cortex-M series cores address a wide range of energy-efficient embedded design requirements; and its QorIQ family combines Cortex-A series cores with dedicated communications and security IP for next-generation networking systems designs.

• STMicroelectronics bases its broad STM32 family of 32-bit flash MCUs on ARM cores with a number of families designed to meet specific requirements for performance and functionality — ranging from its entry-level STM32 F0 series based on the ARM Cortex-M0 to ARM Cortex-M4-based high-performance STM32 F4 MCUs with DSP and FPU functionality.

• Texas Instruments addresses different application markets with an extensive set of ARM-based MCU families such as its Tiva™ family for increased connectivity integration, Sitara™ family for embedded designs, DaVinci™ family for video applications, Hercules™ series for safety applications in medical and industrial markets, and OMAP™ platform for multimedia-rich mobile applications.

• The Zynq®-7000 All Programmable SoC from Xilinx offers designers the unmatched performance of a dual core processing subsystem based on the Cortex-A9 running up to 1 GHz, paired with a programmable logic subsystem containing block

memory, DSP blocks and high-performance interconnect. This processor subsystem includes a DDR3 memory controller, dual 10/100/1000 Ethernet MACs along with a full complement of standard peripherals offering engineers the best of both hard and soft logic functionality.

• ARM cores form the centerpiece in advanced FPGA SoCs that combine an ARM processor core with an FPGA fabric and specialized peripheral blocks. For example:

• The Microsemi SmartFusion™2 offers a unique combination of ARM-based MCU for high-performance software execution, DSP blocks for specialized computing and flash-based FPGA fabric for implementation of speed-critical algorithms. Along with on-chip SRAM, memory controllers, communications peripherals, the Microsemi FPGA SoC includes specialized security features including security-processing accelerators and secure storage needed in critical applications in industrial, military, aviation, communications and medical segments.

EMBEDDED MARKETPLACE BRINGING DEVELOPERS AND SOFTWARE VENDORS TOGETHER WITH SOLUTIONS THAT SUPPORT ARM ARCHITECTURE Working across the broad ARM hardware base, software in the ARM ecosystem spans the complete range of application development requirements. Engineers can find support for ARM-based development in familiar IDEs and draw on an extensive array of hardware development tools including emulators, logic analyzers, evaluation boards and reference designs for ARM-based design.

Along with development tools, the ARM ecosystem encompasses a broad range of software offerings including low-level software such as from BIOS, device drivers and board support packages as well as high-level systems software including RTOS, hypervisors and Java virtual machines. Available middleware offerings address a broad range of applications with libraries including audio and voice software, communications protocols, database, power management, security and video codecs, among others. At the application level, third-party software packages target specific requirements including applications in automotive, communications, consumer and industrial. ARM partners also provide a wide variety of training options for companies and individual engineers looking to explore more specific ARM-based solutions.

ConclusionsThe unique combination of standard processor core architectures and specification provides a rich environment for development of ARM-based design solutions and tools that continually expand the extensive ARM ecosystem of ICs, systems and software. As a result, designers can find ARM-based MCUs, tools and software able to meet an increasingly diverse set of market requirements. Drawing from this consistent ecosystem, engineers can rapidly build systems capable of addressing a broad set of designs ranging from deeply embedded smart devices to mobile systems and high-performance computing platforms. Contact your local Avnet Electronics Marketing’s sales representative to learn more about our ARM solutions portfolio or visit www.em.avnet.com/axiom_embeddedprocessing.

A X I O M

MANUFACTURER PRODUCTS & SOLUTIONS

10 AXIOM

PROBLEM • With developers demanding more computational power than ever before the Cortex®-M0+ market is rapidly growing.

SOLUTION • Atmel recently launched the SAM D20, based on the Cortex®-M0+. This family expands Atmel’s already formidable ARM®-based portfolio as it joins the Cortex-M3, Cortex-M4 and Cortex-A5.

• This new microcontroller series combines the performance and energy efficiency of an ARM Cortex-M0+ based MCU with an optimized architecture and peripheral set, offering a truly differentiated general-purpose lineup that is ideal for a wide range of low-power, cost-sensitive devices, including GPS trackers, appliance controllers, intelligent remotes and optical transceivers.

• Notable power-saving techniques include an event system that allows peripherals to communicate directly with each other without involving the CPU, while SleepWalking peripherals wake up the CPU only upon a pre-qualified event, thereby reducing overall power consumption.

• In terms of peripheral flexibility, a serial communication module (SERCOM) is fully software configurable to handle I2C, USART/UART and SPI communications. With multiple SERCOM modules on a device, designers can precisely tailor the peripheral mix to their applications.

• The SAM D20’s QTouch® Peripheral Touch Controller offers integrated hardware support for buttons, sliders, wheels and proximity. It also supports both mutual and self-capacitive touch (without the need for external components), while providing noise tolerance and self-calibration.

• Additional key hardware specs include a high-precision, 12-bit 350 ksps ADC and a 10-bit DAC, allowing switching between external and internal oscillators on the fly. There are eight 16-bit timer/counters; a 32-bit real time clock and calendar; 48 MHz operation (1.77 CoreMark/MHz), single-cycle IO access; and six serial communication modules (SERCOM) that can be configured to act as a USART, UART, SPI or I2C.

Atmel SAM D20E Atmel SAM D20G Atmel SAM D20J

14 15 16 17 14 15 16 17 18 14 15 16 17 18

Flash (KB) 16 32 64 128 16 32 64 128 256 16 32 64 128 256

SRAM (KB) 2 4 8 16 2 4 8 16 32 2 4 8 16 32

SERCOM(I2C, USART, SPI)

4 6 6

Timer/Counter 6 6 8

PWM channels 10 12 16

12-bit 350 ksps ADC 10 ch 14 ch 20 ch

10-bit 350 ksps DAC 1 ch 1 ch 1 ch

GPIO 26 38 52

Capacitive touch channels

Up to 60 Up to 120 Up to 256

Pin count 32 48 64

SAM D20 Family Brings the Best of MCUs to Cortex®-M0+ Devicesem.avnet.com/axiom_atlsamd20

M A N U FA C T U R E R P R O D U C T S & S O L U T I O N S

AVNET ELECTRONICS MARKETING 11

PROBLEM • The market for intelligent, multimedia-centric, touch-based devices is increasing exponentially. Tomorrow’s battery-powered smart devices, auto infotainment, in-flight entertainment systems, medical systems, personal and enterprise class intelligent control, data systems and new classes of devices never seen before now need to present data and user interface choices to the end user primarily through rich sound, video, voice, pictures and touch, rather than keyboards and mice.

• The need for manufacturers to quickly provide multiple devices to fit specific market segments or niches and provide their customers with a broader range of choices is rapidly increasing.

SOLUTION • The i.MX 6 series from Freescale was designed specifically to enable this new market by bringing together high-performance scalable multimedia processing, a software compatible family of five processors, all pin-compatible solutions with integrated power management so that a manufacturer can deploy a full portfolio of products with a single hardware design.

• Integrating one, two or four ARM® Cortex®-A9 cores running up to 1.2 GHz, these products represent the industry’s only ARM-based applications processor series featuring software, power and pin compatibility across single-, dual- and quad-core implementations.

• Product capabilities include dual-stream 1080p H.264 video processing for 3D class video decoding, Freescale’s Triple Play graphics architecture consisting of console-style 3D graphics with 200 MT/s for exceptional display resolution, separate 2D BLT engine for UI acceleration and separate 2D OpenVG engine for vector-based graphics.

TREND • As the trend for rich sound, video, voice, pictures and touch continues in industrial, consumer and automotive applications, Freescale continues to innovate with feature-rich processors that fulfill application needs.

i.MX 6 Series Applications Processor Block Diagram

i.MX 6 Series Applications Processorsem.avnet.com/axiom_frsiMX6

em.avnet.com/ axiom_frsiMX6

A X I O M

MANUFACTURER PRODUCTS & SOLUTIONS

12 AXIOM

PROBLEM • Low price point and ease-of-use requirements are critical for entry-level designs that are frequently a barrier to developers considering 32-bit microcontroller (MCU) solutions.

SOLUTION • The Kinetis KL02 family of 32-bit MCUs offers a new level of processing performance and energy efficiency for a range of applications and helping expand the Internet of Things (IoT).

• Applications may include portable consumer devices, sensing nodes, wearable devices and even ingestible healthcare sensing. As more of these products add intelligence and become part of the IoT ecosystem, designers need to maintain a small footprint, in terms of size and power consumption, while also delivering a level of connectivity users have come to expect from more traditional connected devices, such as tablets and smartphones.

• The tiny KL02 devices have a small appetite for power – six times more efficient than a leading competitor – making them ideal for ultra-small-form-factor and battery-powered products.

• Kinetis L series MCUs are powered by a 32-bit ARM® Cortex®-M0+ processor, for which Freescale was a lead partner in definition and development. The Kinetis KL02 MCU family builds upon the energy efficiency of the Cortex-M0+ core and reduces the power consumption of the Kinetis L series to an even lower entry point.

• The ultra-efficient KL02 family delivers 15.9 CM/mA and, like the other Kinetis MCUs, includes autonomous, power-smart peripherals – an ADC, UART and timer, 10 flexible power modes and wide clock and power gating to minimize power loss.

• A low-power boot mode reduces power spikes during the boot sequence or deep-sleep wakeup. This is useful for systems where battery chemistry limits the allowable peak current, such as those employing lithium-ion batteries frequently used in portable devices.

• The Kinetis KL02 family is supported by the FRDM-KL02Z Freescale Freedom development platform and Processor Expert software including an MQX™ Lite RTOS component, along with third-party development resources from the extensive ARM ecosystem.

Kinetis KL0 MCU Family Block Diagram

Kinetis® KL02 Microcontroller Familyem.avnet.com/axiom_frskinetis

M A N U FA C T U R E R P R O D U C T S & S O L U T I O N S

AVNET ELECTRONICS MARKETING 13

PROBLEM • Design engineers are looking for an MCU that features ARM® Cortex®-M in advanced 65 nm process technology that provides the right balance between higher performance and low power consumption.

Associated Products:

EK-TM4C123GXL LaunchPad Evaluat ion Ki tSOLUTION • The Tiva C Series ARM MCUs from TI provide a broad portfolio of connected

Cortex-M4F microcontrollers.• Designers who migrate to the Tiva C Series MCUs benefit from a balance between

the floating-point performance needed to create highly responsive mixed-signal applications and the low power architecture required to enable increasingly aggressive power budgets.

• The ARM Cortex-M4F with floating point accelerates math-intensive operations and simplifies digital signal processing implementations.

• The devices’ 12-bit ADC accuracy is achievable at the full 1 MSPS rating without any hardware averaging, eliminating performance tradeoffs.

• Range of pin-compatible memory and package configurations enables optimal selection of devices.

• Additional features include – Up to 256 KB Flash. – Up to 32 KB single-cycle SRAM. – Two high-speed 12-bit ADCs up to 1 MSPS. – Up to two CAN 2.0 A/B controllers. – Optional full-speed USB 2.0 OTG/Host/Device. – Up to 40 PWM outputs. – Serial communication with up to 8 UARTs, 6 I2Cs, 4 SPI/SSI. – Intelligent low-power design power consumption as low as 1.6 μA.

• Tiva C Series MCUs are supported by TivaWare™ for C Series software, designed specifically for those customers who want to get started easily, write production-ready code quickly, and minimize their overall cost of software ownership.

Tiva™ C Series Microcontrollersem.avnet.com/axiom_tislaunchpad

TM4C123x Temperatures 85°C 105°C

Up to 256 KB Flash

Up to 32 KB SRAM

ROM

Real-time JTAG

8× UART4× SSI/SPI

6× I C2

USB Full Speed(Host/Device/OTG)

6× 32-bit Timer/PWM/CCP6× 64-bit Timer/PWM/CCP

2× Watchdog Timer

LDO Voltage Regulator

Temperature Sensor

Precision Oscillator

DMA (32 ch)

16× PWM Outputs

2× Quadrature EncoderInputs

2× CAN

Comms Peripherals

Systick Timer

Battery-Backed HibernateRTC

2 KB EEPROM

12ch, 1 S/H 12-bit 1 MSPS ADC

Debug

Memory

System Modules

Power & Clocking

NVIC SWD/TETM

ARM®

Cortex®-M4FUp to 80 MHz

FPU MPU

3× Analog Comparators

12ch, 1 S/H 12-bit 1 MSPS ADC

AnalogControl Peripherals

TO SEETHE LATEST TIVA PRODUCTSFROM TI VISIT EM.AVNET.COM/ AXIOM_TISLAUNCHPAD

A X I O M

MANUFACTURER PRODUCTS & SOLUTIONS

14 AXIOM

PROBLEM • Motor control and other sensor based applications are driven by cost, device size, performance and ease of use.

SOLUTION • The C8051F85x/6x from Silicon Labs has a 25 MHz CPU that is 50% faster than other competing solutions. The CPU supports a highly-efficient enhanced 8051 pipelined architecture, allowing it to perform 70% of instructions in 1-2 system clock cycles. Additional interrupt priorities enable fast interrupt handling for real-time applications.

• High-performance analog capabilities include a 12-bit multi-channel analog-to-digital converter (up to 16 ADC channels available), two analog comparators with programmable hysteresis and response time, a precision internal voltage reference and a temperature sensor.

• Small package size, high level of integration and patented crossbar architecture provide for an extremely efficient implementation. The high level of integration eliminates the need for several external components such as a crystal, temperature sensor, level shifters and ADCs, further reducing BOM cost and PCB footprint. The innovative crossbar technology allows developers to choose their desired peripherals and provides flexibility in determining the pin location of those peripherals thus simplifying the layout.

• The easiest way to begin development with the C8051F85x/6x AEC-Q100 qualified, low-cost microcontroller family is with the fully functional C8051F850DK development kit. This comprehensive development kit is designed to give customers an out-of-box experience and comes with everything developers need to evaluate hardware and develop code.

• Additionally, the TOOLSTK-860-B-SK is offered as a low cost alternative for quick evaluation. It allows designers to develop and debug application firmware directly on the target C8051F85x/6x MCU using the Silicon Labs Integrated Development Environment (IDE). The ToolStick Base Adapter provides a USB debug interface and data communications path between a Windows PC and a target microcontroller.

TREND • Though use of 32-bit architectures is on the rise for many embedded applications, 8-bit solutions can offer smaller footprints, better cost and simplified development. It is important to understand the trade-offs with these options in considering the complete system solution.

• Peripheral subsystems are most critical in many low end control applications. These will become more sophisticated (analog, timers) taking the performance burden off of the core MCU.

C8051F85x/86x

C8051F85x/6x Microcontroller Familyem.avnet.com/axiom_sllmcu

Communication

MTU216-bit 6 ch

System

Analog

Memory

Zero-wait Flashup to 256KB

SRAMup to 24KB

Data Flash8KB

USB 2.0Host/Device/OTG

SCI/UART3 ch

I2C4 ch

GPIO

ADC12-bit 14 ch

Data Mgmt.DTC/DMA

Interrupt Cont. 16 levels

Clocks OSC PLL IRC

POR/LVD

DAC8-bit 2 ch

CMT16-bit 2 ch

Multifunction Pin Controller

Event LinkController

Safety CAC DOC CRC

SPI4 ch

Temp. Sensor

I-WDT

RTCCalendar

Timers

True Low Power™ RX100 MCUs, for Low-cost, High-performance ApplicationsThe RX100 is the RX Family’s new entry level 32-bit MCU, extending the RX portfolio to the low end of the spectrum in terms of pin count and flash memory size. This new family is a great fit for those who want to benefit from the higher performance RX 32-bit architecture at the lowest possible cost. The RX111 group is the market’s first 32-bit MCU to feature True Low Power, as well as fast wake-up, zero wait-state flash, multiple safety functions and integrated USB 2.0 host, device and OTG support.

Designed to support a broad range of markets, the new RX111 group delivers a combination of ultra-low-power consumption, on-chip connectivity and superior performance at attractive price points for low-end 32-bit embedded applications, including

mobile health care, smart meters, sensors/detectors, and industrial and building automation. It consumes only 350nA in sleep mode and snaps into full operation in just 4.8μs. Memory size ranges from 16KB to 128KB and compact, low-pin-count packages are available starting at 36 pins.

RX100 MCUs are great design choices for embedded systems that must minimize power consumption by running in sleep mode whenever possible, yet must wake up quickly whenever there is a need to per-form computing or control tasks. Renesas’ True Low Power capability offers designers the lowest possible power consumption across the entire temperature and voltage range, including all peripherals and Flash memory, while also providing maximum flexibility with multiple operational and sleep modes. Wake-up time in low-power mode ranges from less than 1μs to 4.8μs.

Wakeup�� 100μA/MHz*�� 350nA standby, 4.8μs wake-up

USB Connectivity�� Host, device and OTG

High Performance�� 3.08 CoreMark/MHz�� 50 DMIPS @ 32MHz�� Digital Signal Processing

Zero wait-state Flash�� 1KB Block size�� Erase/Write operation down to 1.8V�� BGO Data Flash (Programmable while code is executed)

Safety Features�� Built in safety features (CAC, DOC, I-WDT, GPIO)

�� Temperature sensor

Scalable�� Fully compatible with RX600 and RX200

�� Low Pin Count (36-100 pins), 16KB to 128KB

�� Multifunction Pin Controller (MPC)

RX111 Renesas Promotion Board (RPB) RX111 Renesas Starter Kit (RSK)

RSK Part Number: YR0K505111S000BEam.renesas.com/RSKRX111

RPB Part Number: YRPBRX111am.renesas.com/RPBRX111

The board was designed to showcase RX111 low power modes, featuring Pmod and energy harvesting connectors, and comes loaded with software and tools.

�� Integrated J-Link debugger�� Power measurement built in�� Applilet �� e2studio toolchain�� USB Demo

This complete RX111-based hardware/software platform for in-depth application design includes the E1 Debugger, a trial version of the e2studio and Renesas RX compiler and demonstration firmware.

Family/Group RX100 LPC11xx STM32L STM32F0 K10 KL0 EFM32G

CPU 32-bit (RX)

32-bit (Cortex-M0) (Cortex-M3) (Cortex-M0) (Cortex-M4) (Cortex-M0+) (Cortex-M3)

32-bit 32-bit 32-bit 32-bit 32-bit

Max. Frequency 32MHz 50MHZ 32MHz 48MHz 100MHz 48MHz 32MHz

Per

form

ance

DMIPS/MHz 1.56 0.85 1.03 0.85 1.25 0.93 1.25

MAC/DIV Yes No Yes No Yes No No

DSP Instructions Yes No No No Yes No No

Coremarks/MHz 3.08 1.62 2.17 1.62 2.19 1.77 2.17

Max. DMIPS* 50 45 33 38 125 45 40

Interrupt Latency

5 cycles (Fast interrupt)

16 cycles 12 cycles 16 cycles 12 cycles 16 cycles 12 cycles

Run μA/MHz (Lowest Number) 100 140 290 239 450 89 180

Lowest Power Mode with RTC on (μA)

0.6 0.22 (No RTC) 0.9 2.6

2.45 (VLLS1+

RTC)

0.96 (VLLS1+

RTC)0.9

Wake-up time from previous mode 5µs 56µs 2.6ms 8.05µs 134µs 93µs 2µs

RX100 versus 32-bit Cortex MCUs

TRUE LOW POWER™ RX100 MCUs FOR LOW-COST, HIGH-PERFORMANCE APPLICATIONS

Learn more at em.avnet.com/axiom_renrx100

A X I O M

MANUFACTURER PRODUCTS & SOLUTIONS

16 AXIOM

PROBLEM • Embedded networked systems control an ever-increasing amount of modern systems. Many systems are involved in controlling complex and sensitive installations and must not be compromised by cyber attacks. Such attacks could originate in the form of software code that has been altered to achieve a malicious goal, i.e., passing control to a third party or compromising a safety system.

• To ensure an embedded system is not at risk from these attacks it must be brought in to service via a secure boot process.

SOLUTION • The secure boot of a system is a multi-part process and relies on a “Root-of-Trust” — a hardware device that is immutably trusted and can perform the early stages of the boot process. One of the functions it must provide is the ability to ensure the software that will run in the next highest level is valid BEFORE it is executed. For a fully valid system, code in the “n-1” phase must always perform this check before code in phase “n” is executed. (See Figure 1).

• The SmartFusion®2 SoC FPGA provides the most advanced design and data security capabilities, starting with a robust root-of-trust device with secure key storage capability using the SoC FPGA industry’s only physically unclonable function (PUF) key enrolment and regeneration capability from Intrinsic ID.

• SmartFusion2 is also the only SoC FPGA resistant to differential power analysis (DPA) attacks using technology from Cryptography Research Incorporated (CRI) portfolio.

• Offering user access to a number of several encryption services such as AES-256 and SHA-256, this FPGA can also be used to store and compare the mechanism of validation.

• The operation of the SmartFusion2 SoC FPGA for a secure boot process is only used at select times — typically at startup and then possibly by diagnostics in the event of a failure in the system. By using the device as the programmable logic element, you get the validation function included without the need for an additional component.

• The FPGA integrates a non-volatile flash based FPGA with a full feature microcontroller subsystem, enhanced FPGA fabric and high speed serial and memory interfaces — making it ideal for logic functions that control the secure boot function.

• The FPGA fabric is composed of 4-input LUT logic elements and includes embedded memories and mathblocks for DSP processing capabilities.

TREND • The requirement for security in an embedded system is forever growing, but this need must be met while still meeting financial budgets. By using a SmartFusion2 SoC FPGA that is a hardware root-of-trust, it is possible to integrate the logic and secure boot functions into one device. This reduces the system component and real estate cost, and provides the secure boot function for free. SmartFusion2 devices are the only SoC FPGAs available that meet the requirements for a hardware root-of-trust.

Figure 1: A Secure Boot Process

Phase 0Immutable

Boot Loader

ValidatePhase 1 Code

ValidatePhase 2 Code

ValidatePhase 3 Code

ValidatePhase 4 Code

Phase 1

BIOS

Initial root-of-truststems from immutabletrusted hardware

Code for phases 1-n is validatedby already trusted system beforeexecution is transferred to it

Phase 2

OS Loader

Phase 3

OS

Phase 4

Application(s)

SmartFusion®2 SoC FPGAsem.avnet.com/axiom_mswsmartfusion2

The platform bar is a trademark of Texas Instruments. © 2013 TI

Texas Instruments is the approved and tested vendor for the analog solution around the Xilinx® FPGAs and CPLDs. TI works closely with Xilinx to recommend the best power management, clocking, data converter, and other analog solutions for a wide variety of applications.

Analog for Xilinx® FPGAsStreamline your Xilinx FPGA design with the latest from TI

To learn more about TI’s analog solutions for Xilinx FPGAs go to: em.avnet.com/axiom_tixilinxattach

• Temperature Sensors

• Power Reference Designs

• Power Solutions for Xilinx FPGAs

• Clocking Solutions for FPGAs

• ADCs and DACs

• Retimers and Redrivers

• Serial Digital Interface (SDI) Solutions

• Ethernet Solutions

ZedBoard™ provides an excellent starting point for both hardware and software designers interested in exploring the many uses of the Xilinx® Zynq®-7000 All Programmable SoC. The Maxim Integrated power architecture chosen for ZedBoard addresses the two highest priorities for the design: small size and low cost. Maxim meets these design parameters and delivers a solution that is compliant with the regulation accuracy, start up and sequencing requirements of the Xilinx Zynq-7000 AP SoC.

Maxim Integrated Power Architecture Featured on ZedBoard™

Optimize Design Size and Performance

Learn more at em.avnet.com/axiom_maximzedboard

AVNET ELECTRONICS MARKETING 19

WHAT YOU CAN EXPECT?Full-day, how-to training for FPGA & embedded systems designers

Multiple learning tracks including Xilinx Zynq™-7000 All Programmable SoC, 7 Series Applications, & Vivado™ Design Flow, based on the “A Generation Ahead Seminar Series” from Xilinx

Choose from a dozen hour long training courses devoted to design solutions for FPGA design & applications

Practical, real-world design examples with an emphasis on:• Xilinx ARM Processor solutions

• Processor debugging & operating system support

• Design tool flow and verification

• Memory interfaces

• Agile Mixed signal solutions

WHAT YOU CAN EXPECT?Full-day, how-to training for FPGA & embedded systems designers

Multiple learning tracks including Xilinx Zynq™-7000 All Programmable SoC, 7 Series Applications, & Vivado™ Design Flow, based on the “A Generation Ahead Seminar Series” from Xilinx

Choose from a dozen hour long training courses devoted to design solutions for FPGA design & applications

Practical, real-world design examples with an emphasis on:• Xilinx ARM Processor solutions

• Processor debugging & operating system support

• Design tool flow and verification

• Memory interfaces

• Agile Mixed signal solutions

As FPGAs continue to become increasingly powerful, adequately powering these devices becomes even more critical to unlock their full potential, yet often times the power design is left until nearly the end of the design process. The trend of lower voltages relative to shrinking process geometries is prevalent. Some of today’s devices now run at voltage levels under 1V. Lower voltage requirements for FPGAs and processors create additional challenges, especially at higher currents, that require serious attention when designing the power architecture for a new platform. It’s important to think about and plan for a power system at the outset of the design. Supply placement, passive component selection and PCB design become even more critical as voltage drops across components and even PCB traces and planes can introduce substantial error into your system.

It’s not uncommon for each FPGA family to consist of a wide range of products. The smallest FPGA may clock in at less than 100 MHz, and require less than 1 Amp of peak current for core logic, while the largest in the family may need 14 Amps or more for core logic clocked at 300 MHz. FPGAs with lower core voltage needs will require a large amount of current, which must be supplied with a low noise floor and a minimum amount of ripple voltage.

Why then isn’t power tackled immediately?FPGA-based board designers may not feel they have sufficient information. They face uncertainty, for example, about actual power requirements of the system since the gate-level design is usually not finalized before the hardware is generated. They also need to deal with dynamic load requirements, as load may move rapidly from an inactive, low current situation to a full processing state and the extent of these requirements may not be appreciated at the onset of design. Since FPGAs are more flexible than the power supply circuits that power them, it is beneficial to consider a worst-case power system at the beginning of the design process.

Once the FPGA family is selected, and the core logic supply voltage is set, tools are in place to determine the current consumption of the core logic on the FPGA manufacturer’s website and maximum current estimates can be found in FPGA power applications guides.

Power supply design challenges inherent in all designs boil down to cost, size, noise and efficiency, and the tradeoffs between the four. Power design is all about tradeoffs, there is no one golden solution for all applications. While industrial and medical markets typically

By Chris Ammann, Global Technical Marketing Engineer, Avnet Electronics Marketing

favor size over cost, wireless tends to favor low noise, handheld and battery applications usually prioritize efficiency, and in consumer apps cost tends to be king.

A key part of the design process is to determine the voltage requirements needed and the current requirements of each voltage rail. Xilinx provides assistance by making available power estimation spreadsheets for estimating the power requirements of an FPGA device, based on the required functionality of the FPGA. It is important that designers access and use these spreadsheets to ensure the use of appropriate power-supply and thermal-management components. A variety of power supply manufacturers offer complete power solutions for Xilinx FPGAs and have resources available to aid in device selection.

Avnet has worked with several power supply manufacturers to create a series of paper designs for different 7 Series and Zynq devices. These designs were created around realistic power budgets and are intended to provide a starting point for the overall power architecture selection of your system. The Avnet Power Solutions Video Series is an educational resource available to guide designers through the power-system maze. Covering such topics as power supply testing, component selection, technology overviews and more, the series is a collection of valuable tutorials designed to let you ramp up your designs rapidly.

FPGA development boards from Xilinx are designed with digitally controlled power supplies that make regulation adjustments to ensure supply voltages are within spec. The Mini Module Plus development system from Avnet uses a modular power supply that is available from multiple manufacturers. Remote voltage sensing is used on these power modules to achieve greater regulation accuracy at the load. Comprised of a modular MMP baseboard that supports an MMP FPGA/SoC module, an MMP power supply module, and a Low-Pin-Count (LPC) FPGA Mezzanine Card (FMC), the Mini Module Plus system provides flexibility for FPGA/SoC evaluation and prototyping. Each MMP component is sold separately so that designers can configure their Mini-Module Plus System to meet their particular prototyping needs. At the same time, a path exists for easy upgrading or migration through the replacement of the MMP FPGA or SoC module, while keeping the same MMP baseboard and MMP power module.

AVNET ELECTRONICS MARKETING 19

MMPFPGA/SoC

ModuleMMPPowerModule

MMP Baseboard II

FMCModule

(Optional)

Figure 1. MMP Baseboard II

The modular MMP allows designers to prototype and easily move the MMP FPGA/SoC module or MMP power module to a custom baseboard. By using off-the-shelf MMP FPGA/SoC or MMP power modules, risk is reduced by using a fully tested module.

An example is the Xilinx Zynq®-7000 All Programmable SoC Mini-Module Plus, a small system-on-a-module (SOM), with all the necessary functions and interfaces for a Zynq-7000 AP SoC system. The module can be combined with the Mini-Module Plus Baseboard II and a Mini-Module Plus Power Supply for an out-of-box development system ready for prototyping.

USB 2.0Connector

RJ45Connector

USBConnector

LVDS OSC @ 200 MHz

JX2Connector

4 GTXs and66 User I/0

JX1Connector

4 GTXs and 66 User I/O

PJTAG Header

PS Reset

Micro SD Card Socket

USB 2.0ULPI PHY

EthernetPHY

USB-UART

XC7Z045FFG900

ProcessingSystem

Power, GTX,

User I/O, and

Con�guration Signals

ProgrammableLogic

32 MB QSPI

1 GB DDR3

8 KB I2CEEPROM

Real-TimeClock

PS Clock @ 33 MHz

ProgrammableLVDS Clock

128 MB Flash

Figure 2. The Xilinx Zynq®-7000 All Programmable SoC Mini-Module Plus

The kit includes the Zynq-7000 AP SoC Mini-Module Plus with a Zynq-7000 AP SoC XC7Z045-1FFG900 FPGA and the Xilinx ISE® Design Suite: Embedded Edition (device locked to XC7Z045 FPGA)

Another example is the Kintex-7 FPGA Mini-Module Plus, a small system-on-a-module (SOM), with all necessary functions and interfaces for a Kintex-7 FPGA system. The FPGA module is a complete system on a module, packaging all the necessary functions needed for an embedded processor system onto a small footprint.

Crystal @19.2 MHz

EEPROM(16 KB)

USB 3.0Connector

ARM JTAGHeader

RJ45Connector

XADC Header

JX2Connector

4 GTXs and66 User 1/0

JX1Connector

4 GTXs and 66 User I/O

USB 3.0MAC/PHY

Kintex-7XC7K325T

orXC7K410T

FFG676

Power, GTX,

User I/O, and

Con�guration Signals

EthernetPHY

BPI64 MB Flash

256 MB DDR3

8 KB I2C EEPROM

ProgrammableLVDS Clock

LVDS OSC@200 MHz

LVCMOS OSC@50 MHz

MiscellaneousVoltage Regulaors

Figure 3. The Xilinx Kintex-7 FPGA Mini-Module Plus Block Diagram

The kit includes one Avnet Kintex-7 Mini Module Plus with a Kintex-7 K325T-1FFG676 or K410T-1FFG676 FPGA and a Xilinx ISE® Design Suite: Logic Edition Device locked to XC7K325T or XC7K410T and bundled with the Kintex-7 Mini-Module Plus.

The Avnet Power modules are available from several manufacturers. Each partner designed their board to meet a common set of design requirements, making them interchangeable to the user. Providing solutions from multiple partners allows the customer to choose their preferred vendor, as well as choosing the design implementation they feel most comfortable with. Since the intent was to have these power modules work with a variety of boards, the first step was creating a worst case power budget that could support all of our development board needs. After defining the system, the following table was created to represent the worst case current draw for each required rail.

Voltage Bank Voltage (V) Current (A) Tolerance

Vccint/Vccbram 1 6 3.00%

Vcco 1.5/1.35 4 5.00%

Vccaux/Vccaux_io/Vccadc/Vcco/MGTVccaux

1.8 6 5.00%

Vccaux_io 2 2 3.00%

Vcco 2.5 8 5.00%

Vcco 3.3 8 5.00%

MGTAVcc 1 6 3.00%

MGTAVtt/MGTAVTTrcal 1.2 4 2.50%

Figure 4. MMP Power Module requriements table

The table defines not only the voltages, currents and voltage banks they power, but also the overall tolerance the supplies needed to be designed to. With tolerance requirements down a low as 2.5%, extra design measures were needed to ensure regulation accuracy. In an ideal design scenario, the power supplies would be placed right next to the load they supply, however in our system architecture that placement was not feasible. As a result, remote sense capability was added, which senses the voltage at your load and makes regulation adjustments to maintain your set point. Remote sense is not trivial and adds its own set of unique challenges, but is one tool available to designers when optimal supply placement isn’t available. Design files are available for each power module as well so that these designs can be reproduced in customer applications.

AVNET POWER SOLUTIONS VIDEO SERIESwww.youtube.com/playlist?list= PL8GuerdulPltBrHsnLmSJtoj1xsg8XRWG

AVNET POWER DESIGN ZONEem.avnet.com/axiom_powerdesignzone

XILINX REFERENCE DESIGNSem.avnet.com/axiom_xlxpowerdesigns

AVNET KINTEX-7 KITem.avnet.com/axiom_xlxkintex7kit

AVNET ZYNQ-7000 MINI-MODULE PLUS DEVELOPMENT KITem.avnet.com/axiom_xlxzynq7000mmp

AVNET MINI-MODULE PLUS POWER MODULESem.avnet.com/axiom_avtpowermodules

20 AXIOM

Unlock Your System’s True

Potential

Xilinx® Zynq®-7000 AP SoC Mini-Module Plus System

© Avnet, Inc. 2013. All rights reserved. AVNET is a registered trademark of Avnet, Inc.Xilinx and Zynq are trademarks or registered trademarks of Xilinx, Inc.

The Xilinx® Zynq®-7000 All Programmable SoC Mini-Module Plus designed by Avnet, is a

small system-on-module (SOM) that integrates all the necessary functions and interfaces

for a Zynq-7000 AP SoC system. For development purposes, the module can be combined

with the Mini-Module Plus Baseboard II and a Mini-Module Plus Power Supply to provide an

out-of-box development system ready for prototyping. The modular concept also allows the

same Zynq-7000 AP SoC to be placed on a user-created baseboard, simplifying the user’s

baseboard design and reducing the development risk.

em.avnet.com/ axiom_MMP-7Z045-G

A X I O M

MANUFACTURER PRODUCTS & SOLUTIONS

22 AXIOM

PROBLEM • In today’s competitive market, all product providers strive to shorten product development time, reduce the overall cost and minimize technical risk. However, most products in the market require a high level of hardware complexity that challenges many developers in meeting the product development requirements.

SOLUTION • A System on Module (SoM) offers an innovative path to product development. It helps system designers and architects implement a fully customized product with custom interfaces and form factor without the overhead of a fully customized design. An off-the-shelf SoM can easily be integrated into a custom baseboard to create a fully customized end-product. This approach shortens product development time, reduces overall product development cost and minimizes technical risk.

• The Avnet Virtex®-5, Kintex®-7 and Zynq®-7000 All Programmable SoC series of Mini-Module Plus SoM offerings provide the ultimate programmable system that packages all the functionality required of an embedded processor system in a small form factor. These modules provide on-board CPU, RAM, Flash, USB, Ethernet, serial port and access to 132 user IOs along with eight high-speed Gigabit transceivers via the SoM connectors.

TREND • Today more system designers and architects rely on integrating an off-the-shelf SoM to their custom baseboard for implementing the processing engine and standard interfaces while using their engineering resources to focus on the company’s core competency and implementing customized interfaces on the baseboard. Using an off-the-shelf SoM results in a much simpler baseboard design, which shortens development time and reduces overall development costs.

Avnet Mini-Module Plus System on Modules

Xilinx Kintex-7 FPGA Mini-Module Plusem.avnet.com/axiom_avtkintex7kit

Xilinx Virtex-5 FTX Mini-Module Plusem.avnet.com/axiom_avtv5mmp

Xilinx Zynq-7000 AP SoC Mini-Module Plusem.avnet.com/axiom_avtzynq7000mmp

http://www.analog.com/Milcomm

A X I O M

MANUFACTURER PRODUCTS & SOLUTIONS

24 AXIOM

PROBLEM • How to communicate what new products are appropriate for broad market, and what are relevant supporting collateral for ADI’s new products.

• How to keep designers informed of new products relevant to their new designs.

SOLUTION • ADI issues a quarterly “Select” list of new products that Avnet fully stocks and supports.

• This Select list is promoted on Avnet’s site and updated quarterly, see em.avnet.com/axiom_ananewproducts.

THE FOLLOWING ARE JUST SOME OF THE NEWEST PRODUCT ANNOUNCEMENTS: • AD8232 Single-Lead Heart Rate Monitor Analog Front End

• AD8422 Low Power High Performance Instrumentation Amplifier

• ADuM3190/ADuM4190 Isolated Error Amplifiers with iCoupler® Technology

• AD7091 Low Power, 12-bit 1 MSPS SAR

• AD9102/AD9106 180 MSPS, Fully-Programmable Integrated Waveform Generators

• ADIS16228 Digital Triaxial MEMS Vibration Sensor with FFT Analysis and Storage

• ADP5052 Fully Integrated Quad Buck and LDO in LFCSP

• ADL5511 DC to 6 GHz Envelope and TruPwr™ RMS Detector

TREND • ADI will continue to release and promote New Products with Avnet to aid designers in their mission of making their new designs.

• ADI’s New Products will continue to be supported by eval boards, videos, reference circuits.

• Avnet will continue to promote and stock ADI’s New Products.

New Product Programem.avnet.com/axiom_ananewproducts

M A N U FA C T U R E R P R O D U C T S & S O L U T I O N S

AVNET ELECTRONICS MARKETING 25

PROBLEM • Today’s more advanced electronics demand higher power densities with shrinking board space and power budget.

SOLUTION • The ADP5052 from Analog Devices is the industry’s first integrated power management solution, integrating a Quad Buck and a general-purpose LDO, to provide a five-rail system power supply (4 x buck regulators and 1 x 200 mA LDO) from a 5 or 12 V input in an LFCSP (48 lead LFCSP 7 x 7 mm).

• All five regulator outputs can be fixed or adjustable via resistor programmable output voltages.

– Channel 1 and Channel 2 integrate high-side power MOSFETs and low-side MOSFET drivers. External NFETs can be used in low-side power devices to achieve an efficiency optimized solution and deliver a programmable output current of 1.2, 2.5 or 4 A. Combining Channel 1 and Channel 2 in a parallel configuration can provide a single output with up to 8 A of current. Channel 3 and Channel 4 integrate both high-side and low-side MOSFETs to deliver output current of 1.2 A.

– Channel 5: 200 mA low dropout (LDO) regulator.• The switching frequency can be programmed or synchronized to an external clock.

• Individual precision-enable pins allow easier power supply sequencing or adjustable UVLO threshold.

• ±1.5% output accuracy over full temperature range.

• 250 kHz to 1.4 MHz adjustable switching frequency.

• Always alive 5.1 V LDO supply for tiny load demand.

• Ideal for small cell base stations, medical, FPGA and processor, and security and surveillance applications.

• Dedicated power good pin.

TREND • As designs become smaller and smaller and power budgets becoming tighter customers are turning to more integrated and efficient power solutions to help support some of the higher functioning needs such as FPGA, embedded processors and digital basebands for applications such as small cell basestations (femtocell, picocelll and macrocell) and point-to-point applications to mention just a few.

ADP5052 Fully Integrated Quad Buck + LDOem.avnet.com/axiom_anaadp5052

Quad Buck Switching Regulator with LDO in LFCSP

1 Resistor programmable current limit (4 A, 2.5 A or 1.2 A). ADP5052 solution size only 28.3 mm x 21.2 mm.

A X I O M

MANUFACTURER PRODUCTS & SOLUTIONS

26 AXIOM

PROBLEM • Designs that need isolated data often need isolated power but lack the board space to do both in a cost effective manner.

Visit em.avnet.com/ axiom_anaisopower and register to qualify for one of three boards:

EVAL-ADUMQSEBZ$25 value

EVAL-ADUM5010EBZ$59 value

EVAL-ADuM5211EBZ$69 value

SOLUTION • The chip-scale transformers of Analog Devices’ proprietary iCoupler® technology not only isolate data, they can also be used to create isolated DC/DC converters integrated in a single package with data isolation – saving board space, reducing component count and lowering overall solution cost.

• Ideal for the following appications: power supply start-up bias and gate drives, isolated sensor interfaces, industrial PLCs and RS-232 transceivers.

TREND • Customers looking for options to large, bulky and expensive isolated DC/DC modules.

• Discrete solutions including optocouplers take up area, reduce reliability and take time to design.

isoPower® Integrated, Isolated DC/DC Converters em.avnet.com/axiom_anaisopower

Device 2.5 kVrms 3.75 kVrms Channel Directionality 10 K OEM Price

ADuM5010 X 0 $1.40

ADuM5210 X 2/0 $2.10

ADuM5211 X 1/1 $2.10

ADuM5212 X 0/2 $2.10

ADuM6010 X 0 $2.02

ADuM6210 X 2/0 $3.04

ADuM6211 X 1/1 $3.04

ADuM6212 X 0/2 $3.04

The Simple DC/DC family (RAA230xx) offers one or three PWM channels with switching frequency up to 2MHz and currents up to 3A, and one ultra-low power LDO for added efficiency and flexibility.

Simple DC/DCJ Compact designJ 2 or 4 channelsJ Integrated LDOJ Low power

Key FeaturesJ Power density up to 1.4 A/mm2

J Wafer-level chip-size package (WLCSP)J Light load efficiency for long battery lifeJ Integrated LDO version available

The mini-POL family (RAA20770X) achieves the industry‘s highest level of miniaturization and power density (up to 1.4 A/mm2) with six products with currents up to 15A.

Renesas Electronics offers a complete portfolio of Power Management Solutions for MCUs, SOCs, FPGAs and embedded systems.

mini-POL

mini-POL

Simple DC/DC– Ultra Small Package– Light Load Mode– High Efficiency – High Power Density

– Compact Design– 2 or 4 Channels– Integrated LDO– Low Power

16V

5.5V

3V

2.5V

Inp

ut

Vo

ltag

e

Output Current3A 15A

Products Ch CircuitInput

Voltage (V)

Output Voltage (V)

Output Current

Pack- age

Sequ-ence

Ultra Low Power Mode

Low Power Mode

RAA230211

2

ch1: DC/DC (Step-down)

ch2: LDO

3.0 - 5.5

1.8 (ch1, 2)ch1: 3A

ch2: 0.5A

20-pin6.4 x

6.5mmHTSSOP

Yes Yes (LDO) –

RAA230212 2.7 (ch1, 2)RAA230213 3.0 (ch1, 2)RAA230214 3.3 (ch1, 2)

RAA230215 Adj.1 (different voltage can be set between ch1, ch2)

RAA230401

4

ch1, ch3, ch4:

DC/DC (Step-down)

ch2: LDO

2.5 - 5.5

1.8 (ch1, 2) / 3.3 (ch3) / 1.2 or Adj.1) (ch4)

ch1: 0.5A

ch2: 0.1A

ch3: 1.5A

ch4: 1.5A

32-pin5x5mmVQFN

or32-pin

9x9mmTQFP

Outside2 –

Yes(Low

powermode

byfreq.

change)

RAA230402 2.5 (ch1, 2) / 3.3 (ch3) / 1.2 or Adj. (ch4)

RAA230403 3.0 (ch 1,2) / 3.3 (ch3) / 1.2 or Adj. (ch4)

RAA230404 3.3 (ch1,2) / 3.3 (ch3) / 1.2 or Adj. (ch4)

RAA230405 1.8 (ch1,2) / Adj. (ch3) / 1.2 or Adj. (ch4)

RAA230406 2.5 (ch1,2) / Adj. (ch3) / 1.2 or Adj. (ch4)

RAA230407 3.0 (ch1,2) / Adj. (ch3) / 1.2 or Adj. (ch4)

RAA230408 3.3 (ch1,2) / Adj. (ch3) / 1.2 or Adj. (ch4)

RAA230409 Adj. (ch1,2,3) / 1.2 or Adj. (ch4)

mini-POL Efficiency

Simple DC/DC Efficiency (4ch)4 Channel Evaluation Board

2 Channel Evaluation Board

Simple DC/DC Efficiency (2ch)Simple DC/DC Lineup

mini-POL Lineup

Key Features

1) Adjustable (by using external resistors) 2) Control ON/OFF of each channel by external signal

Part Name Features MAX Current

Input Voltage Package

RAA207700 No LDO15A

3V to 16V* CSP 35-pin

2.67 mm x 3.87 mmRAA207703 Built-in 5V LDO 5.5V to 16V**

RAA207701 No LDO10A

3V to 16V* CSP 30-pin

2.67 mm x 3.37 mmRAA207704 Built-in 5V LDO 5.5V to 16V**

RAA207702 No LDO5A

3V to 16V* CSP 20-pin

2.67 mm x 2.37 mmRAA207705 Built-in 5V LDO 5.5V to 16V**

* Separate 5V supply needed. ** With internal LDO, 4.5V to 16V with separate 5V supply.

mini-POL Evaluation Baord

TWO NEW FAMILIES OF LOW-POWER, HIGH-CURRENT DENSITY POWER MANAGEMENT ICs REDUCE COMPONENT COUNT AND BOARD AREA WHILE IMPROVING EFFICIENCY

Learn more at em.avnet.com/axiom_renpower

A X I O M

MANUFACTURER PRODUCTS & SOLUTIONS

28 AXIOM

PROBLEM • Industrial product designers face myriad applications that require an economically priced, compact power supply that provides fast prototyping.

• Charging system requirements demand a power supply that is flexible in meeting various output voltages, as well as difficult EMI and Safety standards.

SOLUTION • Power One’s ABC Series of open-frame power supplies, with its wide universal 90-264 Vac input range and high power density, is available from 40 up to 400 W of output power and a variety of single and multiple output voltages.

• The ABC150 converter features: – 150 W with air, 110 W convection rated. – Tiny 2 x 4 x 1.3 inch fits the smallest applications. – EN60950-1 2nd edition meets latest Safety standards. – Auxiliary 12 Vdc @ 0.5 A for fan or peripheral devices. – EMI to level B for both radiated and conducted emissions. – Stocking available through Avnet Electronics Marketing.

TREND • Technology advancements require power conversion devices to be as small as possible. • Reduced system airflow, with a preference towards no moving air.• System designers require power flexibility with system design.

ABC150 Industrial AC-to-DC Converterem.avnet.com/axiom_ponconverters

PROBLEM • Medical equipment designers require a high quality AC-to-DC converter with high convection rating to minimize fan use.• The power supply must also operate with high efficiency to reduce size and minimize temperatures in the system. • In addition, the converter must be able to meet the latest Emission and Safety Agency standards for medical equipment.

SOLUTION • Power One’s MBC series of efficient medical equipment open-frame power supplies utilizes a universal 90-264 Vac input range with active power factor correction (PFC) and 250 W of output power.

• The MBC300 converter features: – 300 W with air, 200 W convection rated. – Small 3 x 5 x 1.5 inch size. – 2 x MOPP safety spacing. – EN60601-1 3rd edition certifications. – Inhibit signal to improve efficiencies and minimize system temperatures. – Auxiliary outputs of 5 Vdc @ 2 A and 12 Vdc @ 0.5 A for flexibility. – EMI to level be for both conducted and radiated emissions

TREND • Convection rating is critical to eliminate fans with reduced system reliability and induced noise.• Small footprints allow designers to increase system functionality so that they can provide a superior product to their customers. • Meeting the latest Safety certifications reduce end system design and certification time, which allows customers to

get to market faster.• Reduced emissions meet system qualification standards.

MBC300 Medical AC-to-DC Converterem.avnet.com/axiom_ponconverters

M A N U FA C T U R E R P R O D U C T S & S O L U T I O N S

AVNET ELECTRONICS MARKETING 29

PROBLEM • Engineers like the power density of the HFE series, but often only need lower power levels (1600-2500 W). As the HFE series is plug in, the user has to either design a back plane or utilize a full 19” enclosure, which takes up system space.

• In addition, many 19” racks are not configurable to support different output voltages.

SOLUTION • TDK-Lambda introduced the RFE1600 series of stand-alone AC-DC 1600 W power supplies, available with output voltages of 12, 24, 32 and 48 V.

• These power supplies are based on the rack mounted HFE, but in place of the connector, the RFE has bus bars and terminal blocks for the output and input connectors, allowing regular cable harnesses to be used.

TREND • Bulky standalone industrial power supplies are now being replaced with smaller, higher efficiency units based on the latest technologies. Two or three units can be easily deployed in the system, mounted close to the load to minimize cable drops.

RFE Power Supply Seriesem.avnet.com/axiom_lmdpowersupplies

PROBLEM • Designers needing high wattage power supplies (10 kW+) often turn to power supplies designed for high volume server applications because of their low cost.

• Industrial equipment has longer product life cycles than datacom equipment, leading to potential end of life notices on power supplies when the original datacom customers change architecture.

• The life cycle for industrial products tends to be around 15 years, compared to 7 years for a server product.

SOLUTION • The HFE series of 1600 and 2500 W power supplies are designed as standard catalog products and are not based on the needs of a high volume OEM.

• The AC-DC HFEs are rack mounted and are paralleled to provide up to 10 kW in a 1U 19” enclosure.

• The units are available in 12, 24, 32 or 48 V outputs and have a similar set of mechanical and electrical specifications across the range.

TREND • Rack mounted plug in power supplies are now being used in many industrial applications due to their power density, availability and attractive pricing. This solution also gives redundant operation so a power supply failure will not shut down a system, and the failed module can be replaced while the system is still in use.

• Users are enhancing their systems with the added features of the HFE series, including PMBus communications, which allows remote read back and programming.

HFE Power Supply Seriesem.avnet.com/axiom_lmdpowersupplies

A X I O M

MANUFACTURER PRODUCTS & SOLUTIONS

30 AXIOM

PROBLEM • Smart meters connect the household to the smart grid, which in turn optimizes the production, distribution and usage of energy.

• Smart e-meters need the ability to remotely disconnect the loads from the grid to better manage the system during high demand usage or during a shortage of power sources. The function must be tolerant of the noisy environment of the smart meter as it is directly connected to the incoming feed from the grid and controlled by a micro-controller. The best solutions integrate service disconnect switches with accurate input filter timing, XOR input protection, the maximum output pulse-width to protect the relay, and the configurability of either following the input or to always put out a pre-defined maximum pulse width.

SOLUTION • Fairchild Semiconductor’s FAN3240 and FAN3241 solutions are designed to drive dual-coil polarized latching relays that connect and disconnect power in smart electronic meters, solar inverter, energy generation, and building and home control applications.

• 8 to 60 V operating range for use with 12, 24 or 48 V relays.

• Strong DC current to break through welded contacts without using external switches.

• Accurate timer pulses regardless of input pulse variations and glitches.

– Accurate input filter time (factory adjustable) and XOR input protection. – Accurate maximum output pulse width (factory adjustable).

• Output can follow input width or give maximum limit (mode factory adjustable).

• Internal thermal shutdown protection for switches.

• Single bias voltage design for the chip allows isolated and non-isolated designs.

• Inputs compatible with 3.3 or 5 V square-wave logic signals.

• Enable pin for operational flexibility.

• Small overall PCB footprint

TREND • With a smaller overall PCB footprint, the integrated FAN3240 and FAN3241 solutions save space and cost as well as add timers and protection functions to make the relay driving solutions safer and smarter in noisy environments.

Part Number Minimum Input Pulse Maximum Output Pulse Output Pulse Width Package

FAN3240TMX 15 ms 150 ms Follows input width SO-8L NB

FAN3241TMX 1 ms 30 ms Always maximum SO-8L NB

FAN324xTMX Factory adjustable (0.12 ms – 20 ms) Factory adjustable (1 ms – 350 ms) Factory adjustable between two modes SO-8L NB

Relays Driving Smart Meter Disconnect Switch

Integrated Dual-Coil Relay Drivers Simplify Smart-Meter Designem.avnet.com/axiom_fscrelaydrivers

M A N U FA C T U R E R P R O D U C T S & S O L U T I O N S

AVNET ELECTRONICS MARKETING 31

PROBLEM • Design engineers need a sensing solution with local computing and sensors management capability in an open, easy-to-use architecture.

SOLUTION • Freescale’s Xtrinsic MMA955xL and Xtrinsic FXLC95000L are breakthrough, intelligent, motion-sensing devices that integrate a 3-axis MEMS accelerometer and a 32-bit ColdFire® MCU.

• Xtrinsic family features include:

– 1.71 to 1.89 V supply voltage – Output data rate (ODR) 488 Hz – ±2 g, 4 g, 8 g configurable dynamic ranges available – 14/12/10/8 bit resolution available

• The user’s firmware, together with the hardware device, can make system-level decisions required for sophisticated applications, such as gesture recognition, pedometer, and e-compass tilt compensation and calibration.

• The embedded microcontroller allows sensor integration, initialization, calibration, data compensation, and computation functions to be added to the platform, thereby offloading those functions from the host processor.

• Total system power consumption is significantly reduced because the application processor stays powered down for longer periods of time.

• The Xtrinsic MMA955xL family offers 16 K Flash, 2 K RAM.

• The Xtrinsic FXLC95000L offers 128 K Flash, 16 K RAM.

• The Xtrinsic FXLC95000CL hardware is user-programmable to create an intelligent high-precision, flexible, motion-sensing platform, and the device is programmed and configured with CodeWarrior Development Studio for Microcontroller (Eclipse IDE).

• The FXLC95000 platform can act as an intelligent sensing hub and a highly configurable decision engine. Using the Master I2C or SPI module, the FXLC95000 platform can manage secondary sensors such as pressure sensors, magnetometers and gyroscopes.

TREND • The marketplace trend is to fuse sensor capabilities with other functions creating combination devices, solutions that have not been seen before.

FXLC95000CL Xtrinsic Intelligent Motion Sensing Platform

SPI SlaveInterface

16 KB ROM

128 KB Flash Memory16 KB RAM

BKGD/MS

RGPIO [15:0]16

16

88

RESET B

SP_SCR[PS]

System IntegrationModule

Analog Front End

INT_I

Trim

Drive circuit ADC

3-AxisAccelerometer

Transducer

Control andMailbox

Register SetI2C SlaveInterface

Internal Clock DomainExternal Clock Domain

SDAO

SCL0

MOSISCLKSSB

ColdFire V1

Reduced ProductPlatform

Freescale Technology

Programmable Delay Block16

SPI MasterMOSI, MISO

SCLK2, SSB216

Flash Controller16

Clock Module (16 MHz)8

Two-Channel TPM8

16-bit Modulo Timer8

2 x 8 Port Control8

I2C Master SDA1, SCL18

TemperatureSensor

TemperatureSensor

C2V

MISO

Interrupt Controller

Freescale Xtrinsic Sensorsem.avnet.com/axiom_frssensors

A X I O M

MANUFACTURER PRODUCTS & SOLUTIONS

32 AXIOM

PROBLEM • Compact and energy efficient LEDs are needed for indoor, outdoor and architectural lighting applications.

SOLUTION • The compact OSLON® SSL 80 and 150 offer beam angles optimized for use with lenses and reflectors. This revolutionary feature, combined with a broad range of color temperatures and color rendering indexes, opens up new possibilities for cost-effective, sustainable lighting solutions.

• A full color portfolio is available — from Deep Blue 450 nm to Hyper-Red 645 nm.

• With a footprint of only 3 x 3 mm, this is one of the smallest high-power lensed LEDs on the market today, enabling compact LED arrays and maximizing flux over area.

• OSLON SSL 80 and 150 can be driven up to 1000 mA while OSRAM’s latest power chip technology remains efficient even at the highest drive currents.

• A low thermal resistance of 7 K/W ensures cool running and a highly efficient product.

• A lifetime of more than 50,000 hours is easily obtainable, even at high drive currents.

OSLON® SSL LEDem.avnet.com/axiom_oososlon

PROBLEM • Powerful, narrow color binning with perfect color quality LEDs are needed for indoor lighting applications.

• Compact, environmentally friendly LEDs that feature low thermal resistance are desired for portable lighting designs.

• Robust, long lasting and energy efficient LEDs are required for outdoor lighting applications.

SOLUTION • OSLON® Square from OSRAM Opto Semiconductors provides the most compact, high-power LED in its class.

• With a maximum driving current of 1.5 A and a broad range of color rendering indexes, the OSLON Square product family is perfect for a large variety of indoor, outdoor and portable applications.

• OSLON Square is available in different color temperatures from warm white 2400 to cool white 6500 K. OSRAM’s fine white binning system covers the area of 2-step MacAdams ellipse, ensuring perfect color consistency for all lighting applications.

• With a footprint of only 3 x 3 mm, the OSLON Square is one of the smallest high-power LEDs on the market.

• White reflective layer of the package allows more useable lumens in the application.

• With robust thermal management, lifetimes of more than 50,000 hours are easily obtained – even at high driving currents.

OSLON® Square LEDem.avnet.com/axiom_oososlon

M A N U FA C T U R E R P R O D U C T S & S O L U T I O N S

AVNET ELECTRONICS MARKETING 33

PROBLEM • As portable end products like smartphones continue to evolve, engineers need a sensor that measures reflections to detect horizontal and vertical movements, enabling users to simply flick through photos, or other usable features, without even touching the display.

SOLUTION • The SFH 7770 E6 from OSRAM Opto Semiconductors combines the functions of a digital ambient light sensor with those of a digital proximity sensor.

• The ambient light sensor, which closely matches the sensitivity of the human eye, features high accuracy from 0.03 – 65,000 lx, a low temperature coefficient of photosensitivity, insensitivity to 50-60 Hz flickering and excellent linearity.

• The device determines the ambient brightness, detects the presence of an object nearby (with horizontal or vertical movements) or whether the object is moving closer or further away.

• By using two or three IR LEDs instead of one, it is possible to detect gestures with measurements repeated within milliseconds.

• The proximity sensor is capable of driving a maximum of three IR LEDs with up to 200 mA and features a detection range of up to 300 mm. In addition, it is optimized for 850 nm emitters and is insensitive to ambient light.

• With the high sensitivity of the SFH 7770 E6, the entire cover can now be made of colored plastic with only minimal loss of sensor detection range. As a result, there is no longer any need for transparent windows.

• SFH 7770 E6 is contained in a small 2.8 x 2.8 x 0.9 mm package.

• I²C bus interface features 100 kbit/s, 400 kbit/s and 3.4 Mbit/s.

• Measurement modes are programmable as stand-by, triggered and free-running.

• There is very low power consumption in stand-by mode.

TREND • As the trend to increase user functionality in mobile phones, cameras, PDAs, notebooks, consumer products and automotive applications continue to expand and include new features like touch free control, OSRAM Opto Semiconductors is at the forefront of the industry by providing the extremely small size and low power consumption SFH 7770 E6 two-in-one proximity and ambient light sensor.

SFH 7770 E6 Two-in-One Digital Sensorem.avnet.com/axiom_oosdigitalsensors

A X I O M

MANUFACTURER PRODUCTS & SOLUTIONS

34 AXIOM

PROBLEM • Automotive battery voltage distribution is subject to significant voltage transient events in Start/Stop applications.

• To maintain reliable operation, point of load DC/DC regulators have minimum input voltage requirements. Boost voltage converters are commonly used in front of DC/DC regulators to convert a low input voltage to a higher voltage.

SOLUTION • ON Semiconductor’s NCV8876 factory adjustable non-synchronous boost controller with automatic wake up and shutdown function supplies a minimum output voltage during start-stop conditions to counteract any sag in a vehicle’s battery voltage.

• The device is enabled when the supply voltage drops below 7.3 V, then boost operation is initiated once this voltage goes under 6.8 V.

• Protection features include cycle-by-cycle current limiting, thermal shutdown (with a 170 °C threshold) and hiccup-mode over-current protection.

• Targeted for the automotive segment, the device is ideal for instrument clusters, radios, navigation systems, engine control units and lighting applications.

• The AEC qualified device, available in an SOIC-8 package, offers a simple design solution offering reduction of component count and design cost.

• Support tools include NCV887601 Evaluation Board, Excel-based design aids and design verification using PSPICE large signal average behavioral modeling.

• Features:

– 2 V to 45 V operation. – Logic output switch monitoring. – -40 to 150 °C operation. – ±2.0% output voltage accuracy over temperature. – Low shutdown current (<11 µA typ.). – Adjustable current limit, internal soft-start and slope compensation. – Peak current mode control.

Automotive Grade Non-Synchronous Boost Controller em.avnet.com/axiom_onsboostcontroller

M A N U FA C T U R E R P R O D U C T S & S O L U T I O N S

AVNET ELECTRONICS MARKETING 35

PROBLEM • Providing multiple voltages needed for many small and portable applications while maintaining high efficiency in a minimum space with the fewest external components.

SOLUTION • ST’s low dropout (LDO) regulators offer an optimal combination of low dropout voltage, low quiescent current, fast transient response, low noise and good ripple rejection.

• Depending on the application requirements, LDOs have been optimized for:

– Ultra low dropout down to 50 mV – Low quiescent current down to 1.4 µA – Low noise/high PSRR down to 6.3 µVRMS – Miniature packages offer space savings to minimize board space. Devices ion these packages are particularly

well suited for smart phones, health and fitness monitoring, Bluetooth and remote and other small portable electronic devices.

Ultra Low Dropout Linear Regulatorsem.avnet.com/axiom_stmpowermesh

PROBLEM • Power electronics designers are looking to improve the reliability and efficiency in applications like welding, solar inverters, UPS, induction heating and SMPS.

SOLUTION • The revolutionary V series of IGBTs from STMicroelectronics guarantees a max junction temperature (Tj max) of 175 ˚C, increasing device reliability and lifetime.

• Featuring tail-less turn off waveforms and co-packing a very fast freewheeling diode tailored for very low Eon, the new V series offers several benefits in high switching frequency applications demanding superior efficiency, such as welding, solar inverters, induction heating, UPS, PFC and SMPS.

• This series has been designed to meet the requirements for higher efficiency and reliability in power. Additional features include:

– Positive VCE(sat) temperature coefficient allow safer paralleling operation. – Very high speed switching. – Low saturation voltage: VCE(sat) = 1.85 V (typ.) @ IC = ICN. – Low thermal resistance. – Co-packed tailored diode. – UL Recognized TO-220F package.

600 V Series IGBTsem.avnet.com/axiom_stmpowermesh

mains

DC buses

24 V12 V5 V

DC-DCPOST-REGULATION

LDOs,Switching Controllers

or Converters

5 V3.3 V1.2 V......2.5 V........

ASICs

Audio Amps

µC

Memory

RF

...

External adapteror

internal AC/DC

A X I O M

MANUFACTURER PRODUCTS & SOLUTIONS

36 AXIOM

PROBLEM • Increases in output power result in efficiency loss and temperature increases.

• Space limitation due to downsizing and density growth.

SOLUTION • Toshiba’s DTMOS IV SuperJunction MOSFETs deliver a combination of high conduction and switching efficiency, small die area and high breakdown voltage that conventional devices cannot achieve.

• Small packages sizes provide designers with greater flexibility to optimize energy efficiency and power density.

• Optimized switching characteristics: easy to control, low EMI.

• Wide on-resistance RDS(ON) 0.9 to 0.018 Ω max range.

• Improved RDS(ON) x area.

• Packages include: DPAK, IPAK, D2PAK, 8 x 8 mm DFN, I2PAK, TO-220, TO-220SIS, TO-247, TO-3P(N) and TO-3P(L).

600 V DTMOS IV SUPERJUNCTION MOSFETS

Current Rating (A)

RDS(ON) max. (Ω)

DPAK(TO-252)

IPAK(TO-253)

I2PAK(TO-262)

D2PAK(TO-263)

8 x 8 mmDFN TO-220 TO-220SIS TO-3P

(N) TO-247 TO-3P(L)

Qg(nC)

Ciss(VDS=300 V)

(pF)

5.4 0.9 TK5P60W TK5Q60W TK5A60W 10.5 380

6.2 0.75 – 0.82

TK6P60W(0.82 Ω)

TK6Q60W(0.82 Ω) TK6A60W 12 390

7 0.6 TK7P60W TK7Q60W TK7A60W 13 490

8 0.5 TK8P60W TK8Q60W TK8A60W 16 530

9.8 0.38 – 0.43

TK10P60W(0.43 Ω)

TK10Q60W(0.43 Ω) TK10V60W TK10E60W TK10A60W 20 700

11.5 0.3 – 0.34

TK12P60W(0.34 Ω)

TK12Q60W(0.34 Ω) TK12V60W TK12E60W TK12A60W TK12J60W 25 890

15.8 0.19 TK16C60W TK16G60W TK16V60W TK16E60W TK16A60W TK16J60W TK16N60W 38 1350

20 0.155-0.17 TK20C60W TK20G60W TK20V60W

(0.17 Ω) TK20E60W TK20A60W TK20J60W TK20N60W 50 1700

30.8 0.088–0.098

TK31V60W(0.098 Ω) TK31E60W TK31A60W TK31J60W TK31N60W 86 3000

38.8 0.065 TK39A60W TK39J60W TK39N60W 110 4100

61.8 0.04 TK62J60W TK62N60W 180 6500

100 0.018 TK100L60W 360 15000

SuperJunction MOSFETs Deliver Ultra-Low RDS(ON) mosfet.toshiba.com

M A N U FA C T U R E R P R O D U C T S & S O L U T I O N S

AVNET ELECTRONICS MARKETING 37

PROBLEM Mechanical relays suffer from contact wear and• are highly susceptible to shock and vibration.

• suffer from contact bounce.

• offer limited electrical and noise isolation.

• generate electrical and acoustic noise.

SOLUTION PCB implemented MOSFET based SSR solutions from Vishay• remove contacts and moving parts.

• eliminate noise generating arcing.

• offer up to 5000 V or isolation in an SOP4 package.

TREND • Industrial controls and appliances are finding mechanical relays to be less and less compatible for the increasing demand of high reliability, small package sizes and more intelligent solutions for low power microcontroller-based systems. The VOM1271 allows engineers to design highly reliable solid state solutions in extremely small packages that can be driven directly from microcontroller-based digital circuits, all while providing an extremely high level of isolation and decoupling from lethal voltages and noise.

Isolated, High-Voltage MOSFET Driver with Integrated Fast Turn-Off Circuit em.avnet.com/axiom_vismosfets

PROBLEM • Switch mode power supplies (SMPS) in many applications need to work with higher efficiency levels as power and current levels increase.

SOLUTION • Vishay Siliconix E Series SuperJunction MOSFETs offer better conduction and switching losses compared to different high-volume production silicon technology on the market today. The E Series achieves this new standard of performance by minimizing gate charge (Qg), gate-to-source charge (Qgs), gate-to-drain charge (Qgd), output capacitance/charge (Coss/Qoss) and on-resistance (Ron) in a way optimized for power conversion applications.

TREND • There is a move away from a one-size-fits-all FOM for MOSFETs used in power conversion applications. Instead of just looking at on-resistance multiplied by typical gate charge, the new trend is toward more topology-specific analysis that takes into account additional specifications of the device, such as gate-to-source charge (Qgs), gate-to-drain charge (Qgd), and output capacitance/charge (Coss/Qoss). These do a better job of representing the actual losses that occur within the MOSFET. More than ever, device development continues to be a multi-variable balancing of specifications to achieve optimum performance.

Redefining the Figure of Merit (FOM) for MOSFETs in Power Conversion Applicationsem.avnet.com/axiom_vismosfets

A X I O M

MANUFACTURER PRODUCTS & SOLUTIONS

38 AXIOM

PROBLEM • Power designs place increased demand upon over-current and over-voltage circuit protection components.

Associated Series:

NVRNFVCNCT

SOLUTION • Expanded circuit protection product offerings from NIC Components include safety agency approved SMT fuses and leaded (LDD) varistors.

• The newly released NVR series of large disc metal oxide varistors (MOVs) provide fast-acting absorption of transient energy on 50 or 60 Hz power circuits, with rated operation to 1000 VAC.

• Recently added NFVC series of SMT chip fuses feature fast-acting, high inrush withstanding performance in industry-standard 6125 (2410) case sizes, with current ratings up to 20 A and voltage ratings up to 125 VDC.

• Both series are UL safety agency (USA & Canada) listed.

TREND • Rapid development for mobile devices is driving demand for high-performance circuit protection into smaller component sizes.

• For AC circuit applications, standard format LDD MOVs continue to see requirements to provide high energy transient absorption at low cost.

• While fast acting chip fuses are seen as commodity type product with strong requirements and a wide range of design-in, engineers can expect to see an increase in trend towards resettable fuse technologies verses traditional one-time use components.

Over Voltage & Current Protectionem.avnet.com/axiom_nicprotection

PROBLEM • Power supplies and convertors require high performance from reduced size components. Associated Series:

NPISNPIMNSPE

SOLUTION • NIC’s use of alternative and new technologies focus upon the best-in-performance of low ESR capacitors and power inductors.

• Polymer hybrid construction NSPE series of aluminum electrolytic capacitors provide 10X improvement in ESR and impedance at low operating temperatures, compared to standard liquid construction, while offering higher voltage ratings and lower leakage current benefits when compared to solid polymer construction.

• Transition to automated component production process in multilayer, shielded and metal composite inductors provides high current performance with lower unit costs.

• Offering over 20 different case size variations, down to 2 x 2 mm footprints, NIC’s power inductor offering provides power supply designers with a wide range of component solutions for any power design.

TREND • Continued trend towards increased performance in the smallest component sizes will increase use of alternative technologies to meet the demands of power designs.

• Development of expanded hybrid capacitor technologies focus on meeting the requirements of next-generation power designs. Automated component production assembly allows reduction in component size, while at the same time increasing performance, quality, and in the end, reducing costs.

Power Passives by Designem.avnet.com/axiom_nicprotection

BUILD YOUR OWN PASSIVE PEFORMANCE KIT TODAY!EM.AVNET.COM/ AXIOM_ NICPROTECTION

M A N U FA C T U R E R P R O D U C T S & S O L U T I O N S

AVNET ELECTRONICS MARKETING 39

PROBLEM • Excessive voltage levels across TVS diodes limit their effectiveness in protecting vulnerable integrated circuits (ICs).

• Keeping the cost of the protection circuit low while also providing adequate protection without degrading performance is a significant challenge.

Associated Products:

CDSOD323-T03CCDSOD323-T05CDSOS323-T05CCDSOD323-T05LCCDSOT23-S2004SM51589LPT61020L

SOLUTION • The Bourns family of dual channel TCS™ HSPs work in conjunction with an overvoltage protection device and the ESD structure of an IC to minimize the energy absorbed by the IC during a surge event.

• The voltage level at the IC input/output (IO) is determined by the response of its ESD structure to the limited current through the TCS HSP rather than the response of the TVS diode to the surge event.

• Each device in the TCS HSP family provides up to 40 V of isolation between the overvoltage protector and the IO of the protected IC. This allows the use of low-cost rail clamp diodes to the supply and ground instead of higher cost TVS diodes.

• The low series impedance of the TCS HSP has a minimal impact on performance. The series resistance between channels is well-matched.

• Use the links below to access the Bourns® TCS™ HSP training video, as well as two informative white papers:

• www.bourns.com/TrainingDetail.aspx?name=tcs_training

• www.bourns.com/data/global/pdfs/tcs_vdsl_white_paper.pdf

• www.bourns.com/data/global/pdfs/Bourns_TCS_GBE_White_Paper.pdf

Transient Current Suppressor (TCS™) High-Speed Protectors (HSPs)em.avnet.com/axiom_bnstcs

InterfaceRequiringProtection

To Connector1/2 TCS-DL004-XXX-WH

OvervoltageDeviceCDSOD323-T05C

PEAK

SURG

E CUR

RENT

(A)

PEAK VOLTAGE AT INTERFACE (V)

20

18

16

14

12

10

8

6

4

2

00 2 4 6 8 10 12 14 16 18 20

“Ideal” diode response of a TVS Diode with the TCS™ HSP device at the interface requiring protection

CDSOD323-T05CIDEAL DIODE (5.5 V)NEW APPROACH

The above graph compares the surge response of a TVS diode and Bourns’ new approach, which uses a TCS™ HSP device/overvoltage protection device combination, to that of an ideal diode. Note, when the new approach is used, the voltage at the protected interface is almost independent of the peak surge current and the voltage across the overvoltage device.

A X I O M

MANUFACTURER PRODUCTS & SOLUTIONS

40 AXIOM

MS-Series Circuit Breakerem.avnet.com/axiom_clgcircuitbreaker

PROBLEM • Datacom systems require maximum circuit protection to ensure continued data transmission services.

• Power distribution units and rack systems are limited to confined spaces, and traditional circuit breakers take up too much valuable space and are sensitive to ambient temperature.

• Circuit protection products must comply with all industry regulations.

SOLUTION • The L-Series high-performance, compact hydraulic-magnetic circuit breaker from Carling provides up to 240 VAC ratings protection regardless of ambient temperature.

• Its low profile design is ideally suited for the rigors and confined spaces found in today’s telecom/datacom power distribution units and rack systems.

• With TUV certification, EN60934 approval and as a UL 489 Listed circuit breaker, the L-series exceeds current worldwide telecom and datacenter capability requirements.

TREND • The telecom/datacom industry will continue to require optimum circuit protection in innovative packages that promote spatial reduction objectives while improving performance.

PROBLEM • Military grade power generation and communication equipment requires reliable circuit protection products that ensure continuous equipment performance and functionality.

• Harsh environments demand sealed and temperature stable circuit protection.

• Military communication equipment requires rugged, high performance components in a compact design.

SOLUTION • The MS-Series was designed in accordance with the requirements of MIL-PRF-39019F, MIL-PRF-55629 and MIL STD 202, making it the best compact COTS circuit protection product available.

• The MS-Series is an environmentally sealed, hydraulic/magnetic circuit breaker that withstands extreme temperatures, shock and vibration.

• Its compact size and reliability make it ideal for ruggedized communication equipment and other mission critical equipment.

TREND • The military equipment industry requires reliable, high-performance components that withstand the most demanding operation environments.

• COTS (Commercial-Off-The-Shelf) products offer cost-effective solutions while meeting military requirements.

L-Series Circuit Breakerem.avnet.com/axiom_clgcircuitbreaker

M A N U FA C T U R E R P R O D U C T S & S O L U T I O N S

AVNET ELECTRONICS MARKETING 41

Economy Power (EP) II & 2.5 Connectorsem.avnet.com/axiom_tycepconnectors

PROBLEM • Connectors with Terminal Position Assurance (TPA) plug housings and molded TPA devices are needed to help prevent terminal back-out.

• Reduced connector size helps deliver power to a PC board when space is at a premium.

Associated Products:

AMP CT ConnectorsSignal Double Lock ConnectorsAMP Power Series Connectors

SOLUTION • EP II and EP 2.5 connectors help prevent terminal back-out with TPA terminal plug housings and molded TPA devices.

• A positive external locking latch helps ensure complete system mating.

• Anti-snag feature helps prevent wire from snagging on the latch.

• Polarization tabs help prevent mismating with corresponding header.

• These connectors are designed to mate with current designs and newly designed EP headers, allowing inventory standardization.

TREND • Support mechanical and electrical reliability with a positive locking latch and TPA device

Power Triple Lock Connectorsem.avnet.com/axiom_tyctriplelockconnectors

PROBLEM • Improved connector mating and latching provides performance assurance for improved power and signal applications.

Associated Products:

Universal MATE-N-LOK ConnectorsCommercial MATE-N-LOK ConnectorsPower Key ConnectorsEconomy Power I I Connectors

SOLUTION • TE Connectivity’s power triple lock connectors provide cap and plug mating confirmation with audible latch.

• These connectors eliminate wire snags with ribs designed to protect the latch.

• They ensure connector system engagement in high vibration applications with optional Connector Position Assurance (CPA).

• And, they confirm contacts are fully seated while providing an added measure against contact backout with optional Terminal Position Assurance (TPA).

TREND • Increased reliability and functionality, security and ease of use.

A X I O M

MANUFACTURER PRODUCTS & SOLUTIONS

42 AXIOM

IMPACT Connectorsem.avnet.com/axiom_tycimpact

PROBLEM • Difficulty in finding connectors that are designed for increased speed and density to help meet future system upgrades and next generation requirements of data networking and telecommunications equipment.

Associated Products:

STRADA Mesa Mezzanine ConnectorsICCON Power ConnectorsMini SAS HD Interconnect

SOLUTION • TE Connectivity’s IMPACT connectors feature a unique broad-edge coupled design that utilizes low impedance, localized ground return path in an optimized differential pair array.

• Differential pairs are tightly coupled and surrounded by ground structures to isolate the pairs, reducing crosstalk and increasing overall bandwidth performance with minimal performance variance.

• The backplane header construction on IMPACT connectors offers air pockets selectively placed in the header floor to isolate signal pairs.

TREND • Offers value add approach of speed, density, cost and long term reliability for next generation application requirements

MULTI-BEAM XLE Connectorsem.avnet.com/axiom_tycmultibeam

PROBLEM • Industry demands for higher power capabilities in the same amount of PCB space.

• Connectors often feature limited power.

Associated Products:

MULTIGIG RT 2-R ConnectorsMid-Range PCB RelaysET Power Connectors

SOLUTION • MULTI-BEAM XLE connectors provide for greater angular mis-alignment between mating connectors.

• Their hot-pluggable contacts allow for high power rated at 75 A/low power rated at 40 A – that’s 35% more power over other connectors in the same space.

• The connectors feature sequenced contacts for mate-first-break-last operation.

• They achieve up to 500 mating cycles with high durability design.

• Meet industry reliability requirements for telecom equipment.

• Dissipate heat with ventilated housings.

• Provide lower contact resistance with redundant contact points.

• Accommodate a variety of configurations with a modular tooling platform design.

TREND • Higher current carrying capability in the same connector footprint.

M A N U FA C T U R E R P R O D U C T S & S O L U T I O N S

AVNET ELECTRONICS MARKETING 43

PROBLEM • Finding a relay that is specifically developed to meet the requirements of IEC 60669 with up to 16 A/250 V AC rated load. The key requirement of this standard is the ability to switch high inrush currents from lighting loads.

Associated Products:

Corcom FB Series F i l tersMini IO ConnectorsUniversal MATE-N-LOK ConnectorsCoolSpl ice Connectors

SOLUTION • The RTX relay not only solves the above problem, but it also features high inrush capability due to its tungsten pre-make contact and silver tin oxide carry/break contact.

• 16 A/250 VAC make and break capacity according to IEC 60699-1.

• Energy efficient with the bi-stable (lathing) DC coil system utilizing one or two coils.

• Reinforced insulation helps provide additional safety protection.

• Small product dimensions of 29.1 x 12.7 x 16 mm to meet industry standard.

• RoHS compliancy and cadmium free design meet market requirements.

TREND • Saves energy with bi-stable DC coil system.

• Provides additional safety protection with reinforced insulation.

Power PCB RTX Relaysem.avnet.com/axiom_tycrtx

PROBLEM • How to integrate communication, signal and power transmission of locally controlled motors within a single compact rectangular connector, all while providing significant space savings in comparison with traditional rectangular industrial connectors.

Associated Products:

Universal MATE-N-LOK ConnectorsHTS Heavy Duty ConnectorsTerminal Blocks & Str ipsDynamic Series Connectors

SOLUTION • Motorman connectors feature the compact size of a traditional rectangular connector and hybrid construction (power, communication, signal), and integrate the needed communication, signal and power transmission within a single connector.

• All signals are bundled into one interface which means only one cable for the customer.

• Offers space for two 4-pin Ethernet sockets, five power sockets, five signal sockets and one protection earth contact.

• Spacious, side internal access assists easy and safe configuration.

TREND • Reduction of space and costs due to integration of communication, signal and power transmission of locally controlled motors within a single compact rectangular connector.

Motorman Connectorsem.avnet.com/axiom_tycmotorman

A X I O M

MANUFACTURER PRODUCTS & SOLUTIONS

44 AXIOM

PROBLEM • Integrating Power over Ethernet (PoE) controller circuitry, magnetics and Ethernet connectivity into an electronic device is a challenging undertaking that can cause lengthy product release delays.

• Until now, PoE power device designs required the entire circuit to be laid out on the PC board, increasing space constraints, adding multiple discrete components and intensifying engineering efforts.

SOLUTION • The PoE Plus Integrated PDJack™ connector provides a drop-in single port solution that includes all PoE functionality within the connector – eliminating PoE circuitry on the PCB.

• Up to 75% board space saving versus discrete component solution.

• IEEE802.3at compliant operating detection and classification.

• Gigabit Ethernet magnetics with common-mode choke designed to operate with industry-leading PHY chip vendors at 10/100/1000 Mbps.

• Drop in solution offering reduced design risk and greater opportunity for time to market release.

• Isolated 12 V DC-DC drop down reference design available.

TREND • PoE-enabled networks are now prevalent offering centralized and managed, safe power and communications solutions for low power applications.

• Network connected devices are increasingly being powered by PoE, including video surveillance, VOIP phones, Wireless Access Points and thin clients.

• Designs in telecommunication, industrial and commercial applications are becoming more complex due to the embedded circuitry and power requirements.

Magnetic Jacks – PoE Plus Integrated PDJack™ Connectorem.avnet.com/axiom_mlxpdjack

PROBLEM • Mid-range power applications now require connectors that can achieve higher mating cycles and higher current without increasing the connector’s footprint to meet industry reliability requirements.

SOLUTION • Rated up to 1500 mating cycles and 13.0 A per circuit, the Molex Mini-Fit® Plus HMC crimp terminals are produced from a proprietary, high-current alloy.

• The terminal’s patented, elongated dimple design provides a longer wipe length and increased contact area over standard Mini-Fit terminals.

• The Mini-Fit Plus HMC female crimp terminals are used with existing Min-Fit receptacle and plug housings and can be used with existing Mini-Fit and Mini-Fit Plus headers, eliminating the need for additional crimp housings and headers.

TREND • Medical, appliance and power supply device manufacturers are seeking commercially available products that meet industry reliability requirements for higher current. The Mini-Fit Plus HMC terminals achieve the greatest durability and current per circuit without increasing the design footprint.

Mini-Fit® Plus HMC (High Mating Cycle) Crimp Terminals

M A N U FA C T U R E R P R O D U C T S & S O L U T I O N S

AVNET ELECTRONICS MARKETING 45

PROBLEM • Power systems ranging from milliwatts to megawatts require myriad, reliable power products.

SOLUTION • AVX provides a full spectrum of power solutions from RF broad-band DC block for power amplifiers, to DC hold-up and pulse-power supercapacitors – covering all ranges of power filtering and decoupling applications in between. The following are just a few examples of AVX’s product offerings:

• GX Ultra Broadband DC Blocks. The GX Series was developed specifically to address DC blocking issues from 160 KHz (-3 dB roll-off) to 40 GHz. Most applications will experience resonance-free insertion loss of <0.5 dB thru at least 40 GHz. Using AVX’s patented precision thin film termination process, the device is designed to be completely orientation insensitive with a standard EIA 0201 footprint to minimize board space requirements. Both Ni/Sn and Ni/Au terminations are available to cover a wide range of attachment processes. All GX parts are RoHS compliant.

• Advanced Ceramic Capacitors for Switch-Mode Power Supplies. High speed SMPS place high demands on the capacitors used in the input or output filters of Resonant DC?DC or Pulse Modulated DC/DC converters. AVX has developed several MLC capacitor styles for these switcher applications. These capacitors have been extensively tested and characterized and found to have almost ideal performances to meet the stringent requirements of these applications. The standard SM series is extremely configurable, with six footprint options, each of which has stacking options from one to five units tall, covering a wide CV range in X7R dielectric. SMPS capacitors are also available in several alternate package types and supplied to commercial, automotive, MIL-PRF and space level specifications.

• FB/FE DC Link Polypropylene Film Capacitors. For higher current industrial applications, the FB series (2-leaded) and FE series (4-leaded) use a non-impregnated metallized polypropylene dielectric specially treated to have a very high dielectric strength in operating conditions up to 100 °C. These capacitors have been designed for PCB mounting, and their performance characteristics make them a viable alternative to aluminum electrolytic technology due to much lower ESR and much higher surge voltage capability (dv/dt).

• BestCap® Pulse Supercapacitors. Representing the latest in pulse-supercapacitor technology, BestCap addresses conventional supercapacitor limitations - high ESR in the tens of Ohms range and high capacitance loss when required to supply very short duration current pulses. In BestCap, a unique proton polymer membrane is used – proton mobility is orders of magnitude greater than organic molecules and gives charge-transfer characteristics similar to the “dielectric” capacitor technologies noted above. This results in small size BestCap having the equivalent capacitance value of a much larger aluminum electrolytic capacitor or capacitor bank.

Advanced Power Solutionsem.avnet.com/axiom_avxpower

GX01 Series - Insertion Loss (S21)

0.4 8 16

(Typical)

3224 40-2.50

-2.00

-1.50

-1.00

-0.50

0.00

0.50

1.00

1.50

2.00

2.50

Frequency (GHz)

B A

D

6.35(0.250)MIN.

0.508 (0.020) TYP.

±0.254 (0.010)1.397 (0.055)

2.54 (0.100) TYP.

2.54 (0.100) MAX0.635 (0.025) MIN.

E

C

0.254(0.010)TYP.

CHIP SEPARATION0.254 (0.010) TYP.

Advanced Ceramic Capacitors for Switch-Mode Power Supplies.

Consumerization of OEMs The

47

By Doug Geisler, Business Development Team Manager for Avnet’s Embedded Software and Services Group (ESSG)

Consumerization can mean many different things to different audiences. For me, it is the changing expectations in the industrial space that are the direct result of some of the technology available in the consumer space, such as cell phones and tablets. The changing consumer expectation is causing an increase in pressure to be placed on industrial OEMs to up their game and bring new products to market more quickly. Consumers are carrying an iPhone or Android device to work, and then looking at industrial machines whose interface, features, ease of use and overall user experience seems to be from 20 years ago.

The interesting part for me is that the OEMs that feel this pressure may have a perfectly good product with no shortcomings at all. The issue is not that there is a problem with their product, but rather a whole new set of expectations are being placed on them by users. User perceptions of the devices are such that if they see a user interface (UI) that appears to be old, they believe the underlying device is old and ineffective compared with something that carries a ‘slicker’ interface.

So where is all this change taking an OEM? There is certainly no right or wrong answer. Some industries are less impacted by the consumer affect, and simply speeding up their design cycles will be enough to stay at the forefront of technology in their industry. And for other OEMs that feel the consumerization effects more acutely, the answer may be to go with the “join ‘em” trend.

READ MORE ABOUT THIS TOPIC IN

The Executive’s Guide to BYOand the Consumerization of ITA FREE EBOOK FROM ZDNET + TECHREPUBLIC ATwww.zdnet.com/the-executives-guide-to-byod-and-the-consumerization-of-it-free-ebook-7000010871/

Over the last 10-20 years, there have been these perception vs. reality judgments happening in the electronics business. But the cell phone and tablet markets alone have accelerated this dramatically. So what is an OEM to do when their product design cycles are 3-5 years compared to design cycles of consumer products that are measured in months? I have noticed OEMs fall into one of two major camps.

The “Hurry Up” CampThis group seems to think that all they need to do is cut their design cycles, move faster and all will be good. The challenge with this is that the entire company, the processes, the people, the product requirements, etc. are all built on certain assumptions that can only be sped up so fast. These people, processes and requirements take time. Industrial products are intended to last life cycles of many years, unlike the two years and trash seen by consumers. The “Hurry Up” folks are still trying to win the battle by taking the existing processes and just speeding them up.

Quicker and less expensive to implement than some other options.

OEMs are limited with how much incremental gain they can achieve. They will quickly reach a point of diminishing returns.

Benefits

Challenge

The “If You Can’t Beat ‘Em, Join ‘Em” CampInteresting wisdom is forcing some into this camp, whether management likes it or not. This type of approach at least acknowledges that there are limitations to speeding up an existing system that may be better serviced by changing the rules all together. But often, these OEMs are hugely affected by the consumer space and are being forced in this direction. As an example of this group, medical instrument companies are being asked to develop iPad applications and interfaces for their machines. Why? Because doctors already carry iPads and know how to use them. If the OEM wants to add product features that will be successfully received by their most influential audience (i.e. doctors), the OEMs need to be able to tell customers that “There’s an app for that!”  In essence, the OEMs need to leverage an infrastructure that they did not sell (i.e. the consumer devices owned by their product users).

Can bring new products and features to market quickly, and at a lower cost since it relies on the customer’s own hardware. Customers are also more likely to perceive the OEM as being progressive.

The OEM is likely to have to find external expertise to write the applications. OEMs will be subject to shorter life cycles of the consumer hardware and will need to make more frequent and constant revisions to software for continued support.

Benefits

Challenge

expert resources

If you’re an OEM looking for expert resources on  application development  for smartphones, tablets or other devices, Avnet’s Embedded Software & Services Group (ESSG) can help you reduce time to market and stay focused on your core solutions, while eliminating the fixed costs of adding new headcount.

Contact services@avnet.com to get started

TRAINING & EVENTS

A X I O M

48 AXIOM

Analog Devices Design Conference 2013• October through December dates throughout N. America.

• Analog Devices and event partners Xilinx and MathWorks invite you to a one-day conference featuring leading industry experts presenting complete signal chain and system-ready solutions for your most complex design challenges.

• Technical sessions delivered by experts, live demo exhibition of ADI, partner and sponsor technology solutions, and collaboration on complex ecosystems involving analog, FPGAs/embedded processing and software modeling tools.

REGISTER em.avnet.com/axiom_anadesigncon2013

ES Live• October 3, 2013 at the Hyatt Regency Hotel, Downtown Boston, Massachusetts.

• Professionals can discuss their sourcing and supply chain requirements in a relaxed atmosphere.

• Over 55 exhibitors.

REGISTER em.avnet.com/axiom_eslive

Xilinx and Avnet Electronics Marketing’s Smarter Vision Workshop• October 3, 2013, afternoon session, at Westford Regency Inn & Conference Center in Westford, Massachusetts, following

Embedded Vision Summit.

• This course introduces students to SoC application development with a specific focus on embedded vision using the Xilinx Vivado® Design Suite to target the Xilinx Zynq®-7000 All Programmable SoC.

• The hands on labs will use a camera design, implemented with Vivado IP Integrator and SmartCORE™ IP cores. The student will be guided on how to move a software OpenCV algorithm to hardware using Vivado High-Level Synthesis and included video libraries.

REGISTER em.avnet.com/axiom_smartervisionworkshop

Embedded Vision Summit• October 2, 2013 at the Westford Regency Inn and Conference Center in Westford, Massachusetts

• Technical educational forum for engineers interested in incorporating visual intelligence into electronic systems and software

REGISTER www.embedded-vision.com/summit/oct2013/overview

T R A I N I N G & E V E N T S

AVNET ELECTRONICS MARKETING 49

Designing with Freescale Seminar Series• October through December dates throughout N.America.

• Instructor-led training courses enable embedded engineers to accelerate the development of innovative end products using Freescale technologies.

• These free technical training seminars, offered over one or two days, provide hands-on workshops, updates on the latest Freescale and ecosystem technologies as well as real-world demonstrations from Freescale and its ecosystem partners.

REGISTER em.avnet.com/axiom_designing-with-freescale

Texas Instruments Technology Days 2013• October through December dates throughout N. America.

• See the latest cutting-edge analog and digital technologies across a wide range of applications.

• Hear in-depth insights, receive hands-on training and walk away with samples and discounted tools to help solve your technical design challenges and accelerate your time-to-market.

REGISTER em.avnet.com/axiom_ti-techdays-2013

Connecting the Internet of Things Using TI Wireless Technology SpeedWay™ Design Workshop• October through December dates throughout N. America.

• These full day workshops are designed to help customers kick start the development of WiFi, BT/BTLE and 802.15.4 enabled Internet of Things (IoT) applications.

• Using a system level approach, customers will receive an overview of TI’s wireless technologies, education on the applications spaces for different protocols and enjoy an extensive hands-on demo experience into WiFi connectivity. In addition, available development tools, technical documentation, product road maps, reference designs and third-party programs will be covered.

REGISTER em.avnet.com/axiom_ti-connecting-to-IoT

AND, DON’T MISS THE UPCOMING

• Training for the ZedBoard-based Motor Control Kit featuring Analog Devices

• Power Forum 2013

Check out these events and more at em.avnet.com/axiom_training

WHAT’S NEW

A X I O M

50 AXIOM

em.avnet.com/axiom_npityc

em.avnet.com/axiom_npitis

Murata Power Solutions MTE1 & MVAC400 ConvertersThe MTE1 highly efficient series of isolated 1 W single output DC-DC converters is suitable for a broad range of industrial and automation applications. The MVAC400 power converter models accommodate the universal AC input voltage range from 90 to 264 VAC with active power factor correction (PFC) and active inrush protection.

em.avnet.com/axiom_npicdt

Panasonic Passive DevicesPanasonic manufactures passive components such as capacitors, resistors and inductors in a broad range of technologies that can be used in the most demanding applications. Panasonic’s industry leading capacitor technologies offer a broad range of capacitors from aluminum electrolytic to new hybrid products; resistors have a wide range of features and specifications including conventional thick film chip resistors or specialized type; and electromechanical products detect user input and other menu or function selections and generate an electrical output to notify the internal circuitry.

em.avnet.com/axiom_npipic

Silicon Labs Timing CMEMS® OscillatorsSilicon Labs offers a comprehensive portfolio of CMEMS oscillators, which are MEMS-based replacements of crystal oscillators. These devices feature any frequency from 32 kHz to 100 MHz (single, dual, quad, any-frequency) and are available in an industry-standard footprint of 2 x 2.5, 2.5 x 3.2 or 3.2 x 5mm.

em.avnet.com/axiom_npisll

TAIYO YUDEN Multilayer Ceramic Capacitors (MLCCs)TAIYO YUDEN has added a new high-reliability application series (AEC-Q200 qualified) to its existing MLCC product line up. This series combines advanced materials and processing technologies to produce a wide range of high-performance MLCCs for high-reliability market applications.

em.avnet.com/axiom_npityu

TE Connectivity Solderless LED SocketThis small, low profile, flexible LED holder provides a quick and easy solderless connection to the Citizen Electronics Co. CLL array family. The low cost, straight forward design provides reliable power connection, mechanical attachment and proper thermal hold down force necessary for the LED array.

Texas Instruments CC2538 ZigBee®/IEEE 802.15.4 SoCThe CC2538 delivers the industry’s first ZigBee single-chip solution with integrated ARM® Cortex®-M3 microcontroller (MCU) for smart energy infrastructure, home and building automation, and intelligent lighting systems.

N E W P R O D U C T I N T R O D U C T I O N S

AVNET ELECTRONICS MARKETING 51

Infineon Authentication SolutionsAs the leader for hardware-based security with extensive knowledge of embedded control requirements, Infineon enables customers to build security models based on best-in-class hardware in customized solutions. Learn more about Infineon’s OPTIGA™ Trust family, authentication and brand protection products and solutions.

em.avnet.com/axiom_npiinf

ITT 38999 Composite and 5015 Firewall Interconnect SolutionsThe D38999 series III composite KJB is a lightweight standard circular connector ideal for use in military and aerospace environments. The 5015 Firewall spin lock variable angle back shell enables straight, 45° and 90° cable terminations with the same part.

em.avnet.com/axiom_npiitt

Microchip 16-bit PIC® MCUsMicrochip’s 16-bit PIC24 MCUs and dsPIC® Digital Signal Controllers provide designers with an easy upgrade path from 8-bit PIC MCUs and a cost-effective option to 32-bit MCUs. The broad product line includes everything from eXtreme Low Power microcontrollers to high performance digital signal controllers.

em.avnet.com/axiom_npimcc

Microsemi IGLOO®2 FPGAsMicrosemi’s IGLOO2 FPGAs, targeted at the cost-optimized FPGA market, integrate fourth generation flash-based FPGA fabric and high performance communications interfaces on a single chip. The IGLOO2 FPGAs offer a cost optimized FPGA with best-in-class feature integration coupled with the lowest power, highest reliability and most advanced security in the industry.

em.avnet.com/axiom_npimsw

em.avnet.com/axiom_npiavt

em.avnet.com/axiom_npimlx

MicroZed™ Evaluation KitMicroZed is a low-cost development board based on the Xilinx Zynq®-7000 All Programmable SoC. Its unique design allows it to be used as both a stand-alone evaluation board for basic SoC experimentation, or combined with a carrier card as an embeddable SOM. This kit includes the MicroZed board, micro USB cable, 4 GB μSD card, Xilinx Vivado® Design Edition license voucher (device locked to 7Z010) and a Getting Started Card.

Molex GbX I-Trac Backplane Connector SystemThe MTE1 highly efficient series of isolated 1 W single output DC-DC converters is suitable for a broad range of industrial and automation applications. The MVAC400 power converter models accommodate the universal AC input voltage range from 90 to 264 VAC with active power factor correction (PFC) and active inrush protection.

Your Express Connection to Power Products.1.800.408.8353

Dedicated Support ResourcesDedicated team of product and material specialists, business development managers, field application engineers (FAEs) and regional power specialists help customers select and source power supplies.

InventoryMassive online power SKU aggregation with access to the widest and deepest inventory in the channel.

Design Chain SupportRegional Power Specialists, FAEs and Featured Web Promotions highlight new Power products and Technology Trends.

Technology CoverageWhether a design requires an off-the-shelf or a custom solution, Avnet has the technical expertise and value-add services to meet any design requirement.

Specialized IP&E Web FeaturesAvnet is a VAR partner of Emerson Network Power, Power-One and TDK-Lambda Americas.

Supply Chain SupportLeveraging internal competencies of global warehousing, logistics and asset management with objective, industry-wide data, Avnet helps customers introduce and sustain cost-effective, differentiated products.

With Avnet Express, in addition to the largest electronics catalog on the web, you’ll have access to these Power resources:

To view our full catalog, visit AvnetExpress.com and click on ‘Power Supplies’ or ‘Power Management’ in the Products dropdown menu.

Avnet Express: Your one-stop resource for power solutions!

13-AVN-0602_power-axiom_v2.indd 1 7/26/13 4:08 PM

AVNET ELECTRONICS MARKETING 53

WHAT’S NEW

A X I O M

7-inch Zed Touch Display KitThis kit includes everything you need to develop products with interactive GUIs and touchscreen capabilities. The kit combines an 800 x 480 WVGA TFT-LCD display with an industrial projective capacitive touch sensor, I2C-based touch controller, LED backlight supply and all the necessary cables.

em.avnet.com/axiom_npiavt2

Advantech Interactive Digital SignageThe Advantech Ubiquitous Touch Computer (UTC) 5 Series of all-in-one computers ensures the successful delivery of dynamic content in any application, from retail point-of-sale to factory automation. With 15.6”, 21.5” and now 32” displays available, they provide scalable computing options including AMD® T40E, Intel® Atom D2550, and Intel® Core™ i7 and their front panel complies with IP65 protection standard.

em.avnet.com/axiom_npiati

AMD G-Series SoCAMD is transforming the embedded computing experience with the combination of a CPU, integrated GPU and IO controller onto a single chip. The benefits of using this small form factor SoC include lower power design, high-performance parallel processing, stunning HD multimedia, error-correction code (ECC) memory support and a scalable, flexible platform.

em.avnet.com/axiom_npiamd

Amphenol Connex Fixed Length RF Cable AssembliesThe Connex cable assemblies are available in standard lengths with common connector styles and cable types. Fixed length RF cable assemblies are available with AMC, BNC, MMCX, MCX, N Type, SMA, SMB and other commercially available RF connector series.

em.avnet.com/axiom_npiaao

em.avnet.com/axiom_npiana

Analog Devices Field Instrument SolutionsDesigning field instruments that include additional processing and diagnostic capability within the constraints of power budget and board space can be challenging. Save time with Analog Devices’ field instrument reference circuits, engineered and tested by Analog Devices’ technology and application experts.

em.avnet.com/axiom_npidgi

Digi International ConnectCardBased on the Freescale i.MX28 processor family, the ConnectCard for i.MX28 is an ideal embedded platform solution for connected applications in medical and healthcare, energy, transportation and industrial/building automation. It offers easy design integration and unique peripheral/interface flexibility in an extremely compact and cost-effective form factor.

A X I O M

A QUICK GLANCE

54 AXIOM

Links and page references to the big ideas and industry trends, products, solutions, trainings and more featured in this issue.

BIG IDEAS AND INDUSTRY TRENDSARM® Architecture Fuels Deep Ecosystem for Next-Generation Embedded Systems Design . . . .  6em.avnet.com/axiom_embeddedprocessing

Consumerization of OEMs . . . . . . . . . . . . . . . .  46www.zdnet.com/the-executives-guide-to-byod-and-the-consumerization-of-it-free-ebook-7000010871/

When Should You Plan for a Power in an FPGA System? . . . . . . . . . . . . . . . . . . . . . . . . .  19em.avnet.com/axiom_powerdesignzone

MANUFACTURER PRODUCTS & SOLUTIONSAnalog Devices Software Defined Radio Kit . . .  23analog.com/milcomm

Analog Devices Innovative New Products . . . . .  24em.avnet.com/axiom_ananewproducts

Analog Devices ADP5052 Fully Integrated Quad Buck + LDO . . . . . . . . . . . . . . . . . . . . . .  25em.avnet.com/axiom_anaadp5052

Analog Devices isoPower® Integrated Isolated DC/DC Converters. . . . . . . . . . . . . . . . . . . . . .  26em.avnet.com/axiom_anaisopower

Atmel® SAM D20 ARM® Cortex®-M0+ Microcontrollers . . . . . . . . . . . . . . . . . . . . . . . .  10em.avnet.com/axiom_atlsamd20

Avnet Mini-Module Plus System on Modules . . .  22em.avnet.com/axiom_avtkintex7kit

AVX Advanced Power Solutions . . . . . . . . . . . .  45em.avnet.com/axiom_avxpower

Bourns Dual Channel Transient Current Suppressors . . . . . . . . . . . . . . . . . . . . .  39em.avnet.com/axiom_bnstcs

Carling Technologies L & MS Series Circuit Breakers . . . . . . . . . . . . . . . . . . . . . . . .  40em.avnet.com/axiom_clgcircuitbreaker

Fairchild Semiconductor Integrated Dual-Coil Relay Drivers . . . . . . . . . . . . . . . . . . . . . . . . . .  30em.avnet.com/axiom_fscrelaydrivers

Freescale i.MX 6 ARM® Cortex® Processors . . . .  11em.avnet.com/axiom_frsiMX6

Freescale Kinetis KL02 ARM® Cortex® Microcontrollers . . . . . . . . . . . . . . . . . . . . . . . .  12em.avnet.com/axiom_frskinetis

Freescale Xtrinsic Sensors . . . . . . . . . . . . . . . . .  31em.avnet.com/axiom_frssensors

Maxim Integrated Power Architecture featured on ZedBoard™ . . . . . . . . . . . . . . . . . . . . . . . . .  18em.avnet.com/axiom_maximzedboard

Microchip Digitally Enhanced Power Analog . . .  55microchip.com/depa

Microsemi SmartFusion®2 SoC FPGAs . . . . . . .  16em.avnet.com/axiom_mswsmartfusion2

Microsemi Leading-Edge Semiconductor System Solutions . . . . . . . . . . . . . . . . . . . . . . .  57www.microsemi.com

MicroZed™ Development Board . . . . . . . . . . . . .  2microzed.org

Molex Mini-Fit® Modular Jacks . . . . . . . . . . . . .  44em.avnet.com/axiom_mlxpdjack

MANUFACTURER PRODUCTS & SOLUTIONS, CONTINUED

NIC Components Fuses, Varistors and Power Passives . . . . . . . . . . . . . . . . . . . . . . . . .  38em.avnet.com/axiom_nicprotection

ON Semiconductor Automotive Grade Non-Synchronous Boost Controller . . . . . . . . . .  34em.avnet.com/axiom_onsboostcontroller

OSRAM Opto Semiconductors OSLON SSL & Square LEDs . . . . . . . . . . . . . . . . . . . . . . . . . .  32em.avnet.com/axiom_oososlon

OSRAM Opto Semiconductors SFH 7770 E6 Digital Sensor . . . . . . . . . . . . . . . . . . . . . . . . .  33em.avnet.com/axiom_oosdigitalsensors

Power One MCB300 and ABC150 Converters . .  28em.avnet.com/axiom_ponconverters

Renesas RX100 32-bit MCUs . . . . . . . . . . . . . .  15em.avnet.com/axiom_renrx100

Renesas Power Management ICs . . . . . . . . . . .  27em.avnet.com/axiom_renpower

Silicon Labs C8051F85x/6x Microcontroller Family . . . . . . . . . . . . . . . . . . .  14em.avnet.com/axiom_sllmcu

STMicroelectronics IGBTs & LDO Linear Regulators . . . . . . . . . . . . . . . . . . . . . . .  35em.avnet.com/axiom_stmpowermesh

TDK-Lambda HFE & RFE Power Supplies . . . . . .  29em.avnet.com/axiom_lmdpowersupplies

TE Connectivity Power Triple Lock Connectors . . . . . . . . . . . . . . . .  41, 56em.avnet.com/axiom_tyctriplelockconnectors

TE Connectivity Economy Power II & 2.5 Connectors . . . . . . . . . . . . . . . . . . . . . . . .  41em.avnet.com/axiom_tycepconnectors

TE Connectivity MULTI-BEAM XLE Connectors . .  42em.avnet.com/axiom_tycmultibeam

TE Connectivity IMPACT Connectors . . . . . . . . .  42em.avnet.com/axiom_tycimpact

TE Connectivity Motorman Connectors . . . . . . .  43em.avnet.com/axiom_tycmotorman

TE Connectivity Power PCB RTX Relays . . . . . . .  43em.avnet.com/axiom_tycrtx

Texas Instruments Tiva™ C Series Microcontrollers . . . . . . . . . . . . . . . . . . . . . . .  13em.avnet.com/axiom_tislaunchpad

Texas Instruments Analog Products for Xilinx FPGAs . . . . . . . . . . . . . . . . . . . . . . . . . .  17em.avnet.com/axiom_tixilinxattach

Toshiba SuperJunction MOSFETs . . . . . . . . . . . .  36mosfet.toshiba.com

Vishay MOSFETs and MOSFET Drivers . . . . . . .  37em.avnet.com/axiom_vismosfets

Xilinx® Zynq®-7000 All Programmable SoC Mini-Module Plus System . . . . . . . . . . . . . . . . .  21em.avnet.com/axiom_mmp-7z045-g

TRAINING & EVENTSAnalog Devices Design Conference 2013 . . . . .  48em.avnet.com/axiom_anadesigncon2013

Designing with Freescale . . . . . . . . . . . . . . . . .  49em.avnet.com/axiom_designing-with-freescale

TRAINING & EVENTS, CONTINUED

Embedded Vision Summit . . . . . . . . . . . . . . . . .  48embedded-vision.com/summit/oct2013/overview

ES LIVE 2013 . . . . . . . . . . . . . . . . . . . . . . . . . .  48em.avnet.com/axiom_eslive

Smarter Vision Design Workshop . . . . . . . . . . .  48em.avnet.com/axiom_smartervisionworkshop

Texas Instruments Technology Days 2013 . . . . .  49em.avnet.com/axiom_ti-techdays-2013

Connecting the Internet of Things using TI Wireless Technology SpeedWay™ Design Workshop . . . .  49em.avnet.com/axiom_ti-connecting-to-IoT

WHAT’S NEW7-inch Zed Touch Display Kit . . . . . . . . . . . . . . .  53em.avnet.com/axiom_npiavt2

Advantech Interactive Digital Signage . . . . . . . .  53em.avnet.com/axiom_npiati

AMD Embedded G-Series SOC . . . . . . . . . . . .  53em.avnet.com/axiom_npiamd

Amphenol Connex Fixed Length RF Cable Assemblies . . . . . . . . . . . . . . . . . . . .  53em.avnet.com/axiom_npiaao

Analog Devices Field Instrument Solutions . . . . .  53em.avnet.com/axiom_npiana

Digi International ConnectCard . . . . . . . . . . . .  53em.avnet.com/axiom_npidgi

Infineon Authentication Solutions . . . . . . . . . . .  51em.avnet.com/axiom_npiinf

ITT 38999 Composite and 5015 Firewall Interconnect Solutions . . . . . . . . . . . . . . . . . . .  51em.avnet.com/axiom_npiitt

Microchip 16-bit PIC® Microcontrollers . . . . . . .  51em.avnet.com/axiom_npimcc

Microsemi IGLOO®2 FPGAs . . . . . . . . . . . . . . .  51em.avnet.com/axiom_npimsw

MicroZed™ Evaluation Kit . . . . . . . . . . . . . . . . .  51em.avnet.com/axiom_npiavt

Molex GbX I-Trac Backplane Connector System .  51em.avnet.com/axiom_npimlx

Murata Power Solutions MTE1 & MVAC400 Converters . . . . . . . . . . . . . . . . . . .  50em.avnet.com/axiom_npicdt

Panasonic Passive Devices . . . . . . . . . . . . . . . .  50em.avnet.com/axiom_npipic

Silicon Labs CMEMS® Oscillators . . . . . . . . . . .  50em.avnet.com/axiom_npisll

TAIYO YUDEN Multilayer Ceramic Capacitors. .  50em.avnet.com/axiom_npityu

TE Connectivity Solderless LED Socket . . . . . . . .  50em.avnet.com/axiom_npityc

Texas Instruments CC2538 ZigBee®/ IEEE 802.15.4 SoC . . . . . . . . . . . . . . . . . . . . . .  50em.avnet.com/axiom_npitis

RESOURCESAvnet Express Power Solutions . . . . . . . . . . . . .  52AvnetExpress.com

The Microchip name and logo, and MPLAB are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. All other trademarks mentioned herein are the property of their respective companies. ©2013 Microchip Technology Inc. All rights reserved. DS25169A. ME1058Eng02.13D

For more information, go to: www.microchip.com/depa

GET STARTED IN 3 EASY STEPS:

1. Evaluate the MCP19111 using thelow-cost ADM00397 board

2. Combine with SMPS-optimized MCP87xxx MOSFETs

3. Customize DC/DC conversion tomatch your application

Combine the flexibility and I2C communication of digital DC/DC power conversion, with the speed, performance and resolution of analog-based control, by using Microchip’s new MCP19111 power management controller.

The MCP19111 is a new hybrid, mixed-signal controller which combines analog and digital power management into a single chip. By integrating an analog-based PWM controller, a Flash-based 8-bit PIC® microcontroller, and MOSFET drivers for synchronous, step-down applications, the MCP19111 enables configurable, high-efficiency power conversion.

With transient performance of analog power conversion, the MCP19111 eliminates the need for a high-MIPS microcontroller or a high-speed A/D converter, minimizing solution cost and power consumption.

To support even higher efficiency, the MCP19111 can be used to drive Microchip’s latest MCP87xxx high-speed, SMPS-optimized MOSFETs. These logic-level 25V MOSFETs offer a low Figure of Merit (FOM) with on-state resistance from 1.8 mΩ to 13 mΩ to deliver higher DC/DC power conversion efficiency.

The world’s first digitally enhanced power analog controller New analog-based power management controller with integrated microcontroller

http://www.em.avnet.com/en-us/design/featuredpromotions/Pages/New-Products-from-TE-Connectivity.aspx?TAB=Power&cmp=tyc-ext-axm-triplelock-oct2013

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