Backend Turnkey
Services
Gary Liu
UMC\TPES
May 27, 2015
UMC © 2015
Agenda
2
• IoT Backend Features & Requirement
• Testing Solutions Development & Services
• Packaging Solutions Development & Services
• Value-Added Backend Turnkey Services
• Summary
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IoT Backend Features & Requirement
3
• IoT Applications & Component Features
• IoT Component Testing Requirements
• IoT Component Packaging Requirements
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IoT Applications & Component Features
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Smart Car
Smart Band
STEP
Smart Watch
Smart TV
Smart Glasses
Smart Phone
IoT / Wearable MEMS Memory PMIC AP / MCU RF
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IoT Component Testing Requirements
• Automotive as a microcosm of IoT applications
• Comprehensive test solution & program development services
• –40C to 125C probing solution ready for automotive devices testing
• MEMS testing needs joint development
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MEMS Memory PMIC AP / MCU RF
8/12” Wafer
Hardware Design
High Parallelism
High Frequency
High Temp. 100C
Low Temp. –40C
Stimulator
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IoT Component Packaging Requirements
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MEMS Memory PMIC AP / MCU RF
Wire Bond
Flip Chip
WLP
SiP / MCP
PoP
2.5D TSI / 3D TSV
• Comprehensive solutions by joint development with OSATs
• Wire Bond and Flip Chip solution ready for Automotive devices
• Experienced SiP packaging development for various IoT applications
• 2.5D TSI in production, 3D TSV in engineering process
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Testing Solutions Development & Services
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• Testing Development & Services
• Major Tester Solutions
• Professional Testing Solution Development
• Automotive Testing Solutions
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Testing Development & Services
• Test Solution Development
• Align with customer for tester platform
• Program development & validation
• Test hardware design
• Multi-DUT migration
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• Yield Management
• Fast yield analysis & diagnosis
• Best-in-class FA capability
• Volume Production
• Real-time data feedback
• Yield monitor
• SBC* implementation
* SBC : Statistical Bin Control
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Major Tester Solutions
• Experienced on diversified tester solutions development for customer
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Vendor
Application
Tester Model
Memory Consumer Computing Communication
SR
AM
eF
las
h
DT
V /
ST
B
FP
GA
MC
U
LC
D-D
CIS
PM
IC
HD
D
GP
U
CP
U
AP
/ B
B
4G
/ L
TE
2.5
G /
3
G
WIF
I /
BL
E
UFlex / UFlex-HD
J750 / J750Ex
IP750Ex
HP93K / PinScale
ND1 / 2 / 3 / 4
T5335P / T5371 / T5377
D10
Quartet / SC312
3650 / 3650EX
3380
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Professional Testing Solution Development
• Excellent and diverse experience in program development
• Professional hardware design and probe card making
• Experienced translation from simulation patterns to ATE vectors
• Expedited validation thru remote access tester
• Quick silicon validation and wafer level cycling service
• Proactive customized test / alert report for yield monitoring
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Product Specs
Simulation Patterns
Test Plan
Pad Information
Production
Program Coding
Pattern Conversion
Hardware Design
Probe Card Making
Program Debugging
1st Silicon Validation
Recipe Optimization
Characterization by
Corner Wafers
Expansion
Correlation
Testing Optimization
Version Management
Test / Alert Report
Validation Development Engagement
Typically 2 weeks from coding to 1st silicon program debugging.
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Automotive Testing Solutions
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Development
Validation
Production
• −40C~200C ATE ready for production
• Early IP verification in high temp. conditions
• High temp. probe card & accessory design
• Dedicated EDA system for outlier screening
• Dedicated machine for automotive device
• Dedicated licensed engineers & operators
• Data traceability > 15 years
• BOAC probing window verification
• Probing & cleaning recipe optimization
• Characterization & correlation by corner
wafers
* BOAC : Bond Over Active Circuit
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Packaging Solutions Development & Services
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• IoT Component Packaging Solutions
• Automotive Package Requirement & Solutions
• Packaging Solution Development & Service
• 2.5D TSI Development Achievement
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IoT Component Packaging Solutions
• Key Features
• Small Form Factor
• Low Power
• High Performance
• Multi-Function
• Turnkey service by ecosystem for IoT packaging solutions
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Application Component Package Type
Wire Bond Flip Chip WLP SiP / MCP POP TSV / TSI
Smart Watch
Smart Glasses
Smart Band
Logic (MCU)
Memory
PMIC
RF (BLE/WiFi)
MEMS
• Requirement
• Fine Pad Pitch & Small Pad Open
• Wire Material: Au Cu or Ag
• Bump Material : Eu LF Cu Pillar
• SiP Integration (Heterogeneous)
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Automotive Package Types & Requirement
• Automotive package must endure extreme stress in harsh conditions
• Various categories apply different package type with different Grades
• AEC-Q100 Grade 0~3 packaging solutions are ready in major OSATs
* AEC: Automotive Electronics Council
Engine Control
Driving Control
Comfort
Infotainment
Motor Driver, PMIC
Safety
• HSOP • HQFP
Grade 0 ~ 1
• HSOP • HQFP
• TQFP • QFN
Grade 0 ~ 1
• HSOP • HQFP
• TQFP • QFN
Grade 1 ~ 3
• HSOP • HQFP
• TQFP • QFN
• PBGA • FCBGA
• SiP / MCP
Grade 1 ~ 3
• HSOP • HQFP
• TQFP • QFN
• PBGA • FCBGA
• SiP / MCP
Grade 1 ~ 3
• HSOP • HQFP
• TQFP • QFN
Grade 0 ~ 1
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Automotive Package Solutions
• Diversified automotive grades packaging solution in major OSATs
• Early CPI qualification in grade 0 level before production
• Joint development for customer’s application with OSAT
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OSATs Package Solution
HSOP HQFP TQFP QFN PBGA FCBGA SiP / MCP
ASE
Amkor
J-Devices
JCET / jcap
NFME
SPIL
: Grade 0, : Grade 1, : Grade 2~3
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Packaging Solution Development & Service
• Early CPI Qual ensure package quality for every tech. nodes
• Experienced mass production & quality management
• Professional simulation & PFA capability enable quick yield ramping
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Customer UMC Backend Ecosystem Solution
Customer
Requirement
Mass Production Quality Management Total Package
Solutions
• GDS & Netlist
• Package Requirement
• BD*, Substrate & Bump
Mask Design & Tooling
• Verify FAB, OSATs BKM /
BOM
• Dedicated Package
Engineering Service
• SPC Trend Chart
• PFA & CIP
• Quality Monitor
• Regular Audit
• Yield Improvement
• Cycle Time Reduction
• PCN Management
* CPI: Chip Package Interaction, BD: Bonding Diagram
CPI Qualification Package Design
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2.5D TSI Development Achievement
• Leading foundry with 2.5D TSI in Production
• 3+ customers in production, 5+ customers in engineering engagement
• “Outstanding Performance Award” by customer
• Various Reliable TSI Solutions
• High production flexibility in proven ecosystem
• Passed wafer & package level reliability test
• Collaboration with OSATs for FEoL/MEoL/BEoL
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Device TSI size
(mm2) Stacked die
A 500~600 Heterogeneous
(3 top dies)
B 700~800 Homogeneous
(4 top dies)
C 800~900 Heterogeneous
(5 top dies)
FEoL
TSV + FSRDL
MEoL BEoL
Dies Stacking + FCBGA UBM / Cu Pillar
Wafer Thinning
TSV Reveal
BSRDL / C4 Bump TSV reveal
Cu Pillar
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Value-Added Backend Turnkey Services
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• Automotive Quality Management
• Testing Data Automation & Yield Management
• Multiple FA & Inhouse Wafer Sort Sites
• Worldwide Backend Ecosystem
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Automotive Quality Management
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Process • NPI
• FMEA
• Control Plan
• MSA
• SPC
• PPAP
Production • ZD CIP
• 100% AVI
• Dedicate Machine
• Dedicate License
• Rework Control
People/Mindset
• ZD culture
5+ years
• Quality Assurance
• Operator Level
Management
System Management
• SYL
• SBL
• PAT
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Real Time Data Automation System
UMC Inhouse
OSATs
1hr
WIP/Yield
Feedback
MES
EDA 2 min
WIP/Yield
Feedback
FTP Site
Summary File
Map File
Inkless File
STDF/OTDF
Hold Lot Report
Customized Report
Real-time
WIP Status
Logistic Report
Yield Report
EDA Analysis
Worldwide Customer
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Proactive Yield Management
Yield Trend Chart
Composite Wafer Map
In-line Data Link
Electrical Analysis
Physical Analysis Memory Bitmap
Logic Scan Diagnosis
Yield to WAT Correlation
Continue Yield
Improvement
Automatic Test
Yield Monitor
Failure Mode
Analysis EFA & PFA
Continuous Yield
Improvement
Scan Diagnosis
Memory Fail Bit Map CP Bin Map
ATE Data Log Failure Analysis
Transmission Electron
Microscopy (TEM)
Poly-TEM
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Fab 8C
Fab 8AB
Fab 8D
12A
12i
8N
6A
8E
8S
8F
World Class FA Services
• Proactive electrical & physical analysis to identify causes
• Professional & efficient FA at multi-site FA labs help yield learning
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Singapore
Hsinchu
SuZhou
Tainan
UMC © 2015
• Inhouse CP facility close to Fabs
• Timely engineering analysis for
quick yield enhancement
• All sites TS16949 are certified
• Hsinchu Site since 1997
• Tainan Site since 2003
• Singapore Site since 2005
Multiple Inhouse Wafer Sort Sites
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Singapore
12i
Hsinchu
8” Fabs
Tainan
12A
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Worldwide Backend Ecosystem
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• Experienced geographic OSATs turnkey management for customers
J-Device Amkor STATSChipPAC
ChipBond UTAC Ardentec GT
ASE Amkor SPIL KYEC
SPIL ChipMore KLT UTAC
JCET / jcap NFME ASE Amkor
ASE Ardentec PTI
Bump
WLP CP Package FT
UMC © 2015
Summary
• IoT & Automotive Backend Solutions Ready for Ramping
• Testing Solutions Development & Services
Fulfill IoT & Automotive Requirements
• Packaging Solutions Development & Services
Enable IoT & Automotive Quick Production
• Take Advantage of UMC’s Backend Turnkey Services to
Mutually Prosper
25
UMC © 2015
Thank You !
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