BalloonSat Assembly Manual

8/9/2019 BalloonSat Assembly Manual

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BalloonSat Assembly ManualLaACES Student Ballooning CourseAugust 2004 (revised 06/01/200 !

S. B. EllisonElectronics Development GroupDepartment of Physics and AstronomyLouisiana State UniversityBaton Rouge LA

"es#ri$tion

BalloonSat is a simple micro!controller "ased development "oard #hich serves as the platform for learning to useand apply the Paralla$ BAS%& Stamp micro!controller. BalloonSat includes additional memory an analog!to!digitalconverter a real time cloc' and large prototyping area. BalloonSat can "e used as a simple data ac(uisition systemin the la"oratory or integrated into a student designed "alloon payload #here it can serve as the payload flightcomputer.

BalloonSat is programmed #ith the Paralla$ %nc. BAS%& Stamp Editor using the PBAS%& language. PBAS%& isversion of the BAS%& language enhanced #ith a num"er of speciali)ed input*output +%*,- instructions #ell suited for data collection and control applications. he Stamp Editor runs on a personal computer #here user programs are#ritten edited and then do#nloaded to the BAS%& Stamp module. Several different versions of the BAS%& Stampare availa"le from Paralla$ %nc. BalloonSat uses the BS/P/0 module.

Ba#%ground

he BalloonSat design evolved from CanSat a pro1ect conceived "y Professor Bo" #iggs at Stanford University2sSpace Science Development La"oratory. he original CanSat included an au$iliary EEPR,3 memory chip for datastorage and a modem +modulator!demodulator- to allo# connection to an e$ternal radio transmitter and receiver.

he LaA&ES design for BalloonSat eliminates the modem of CanSat "ut provides a num"er of enhancementsincluding a 0!channel analog!to!digital converter voltage reference temperature sensor and 0 on!"oard LED4s foruse as visual indicators. CanSat provided pins for connecting e$ternal hard#are. BalloonSat retains these e$pansion

pins "ut provides a prototyping area #ith G5D and 6&& po#er "uses for use "y user provided components orcircuits.

&'eory o o$eration

,peration of BalloonSat is "est understood "y referring to the BalloonSat Bloc' Diagram and the BalloonSat schematic diagram. %ntegrated circuit U7 is the Paralla$ BS/P/0 micro!controller module. his module loo'ssome#hat li'e an integrated circuit "ut is actually a hy"rid containing several integrated circuits transistors and

passive components on the /0 pin dual!in!line carrier. his component alone #ith a suita"le po#er source andconnection to a personal computer running the Paralla$ soft#are is a self!contained microcomputer. he BAS%&Stamp module contains on!chip flash memory for program storage. ,nce programmed the BAS%& Stamp can "edisconnected from the personal computer. he BAS%& Stamp "egins e$ecution of its do#nloaded program on

po#er!up.

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)/*+ins+, -+1.

)/*+ins

+0 - +

BalloonSat Blo#% "iagram

he ma1or functional su"systems of BalloonSat are depicted in the "loc' diagram. he schematic diagram sho#s allthe components and electrical connections. he BAS%& Stamp and other integrated circuits all re(uire a cleansta"le ; maintains a constant ; datasheet and ma'e a careful estimate of the po#er re(uired "y any added electronics. Under some conditions U> may run hot. A heat sin' could "e re(uired tohelp maintain U> at a safe temperature.

he simplest %*, su"system consists of LED4s DS7 @ DS0. he individual LED4s are controlled "y %*, pins P0 P R0 and*or the LED4s might need to "e removed particularly if these pins are needed as input "its. he values of R7!R0 can "e changed if more or less current is desired.

he other peripherals EEPR,3 AD& and R & communicate #ith the BAS%& Stamp via a synchronous serialinterface. he "loc' diagram summari)es #hich %*, pins are used for each device. he BAS%& Stamp al#ays serves

89*87*/88: BalloonSat Assem"ly 3anual /

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as the master device in synchronous serial communication. he master initiates all operations and generates there(uired serial cloc' signal. 6arious protocols have "een esta"lished in the industry for doing synchronous serial%*,. Some common protocols are the %nter!%ntegrated &ircuit +%/ &- developed "y Phillips Semiconductor 3icro#irefrom 5ational Semiconductor Serial Peripheral %nterface +SP%- created "y 3otorola and the Dallas Semiconductor,ne ire protocol. &omponent datasheets #ill usually descri"e the protocol used in sufficient detail for #riting andde"ugging user programs. E$ample circuits and programs are often availa"le from the chip manufacturer4sdata"oo's or #e"sites.

he BAS%& Stamp has a flash memory for storing the e$ecuta"le program and a limited amount of RA3 +randomaccess memory- for varia"les and data. he flash memory retains the program even if po#er is lost. he RA3 isvolatile data is lost on po#er failure. U/ a /0L&90 is an electrically!erasa"le!programma"le!read!only!memory+EEPR,3- integrated circuit. EEPR,3 is non!volatile "ut can "e erased and used again. 3ost EEPR,34s have alimited num"er of #rite cycles "efore it #ears outC "ut this is usually on the order of 8/ datasheet for voltage and current re(uirements. 5ote that this "ac'up "attery only serves the R &. heother system of BalloonSat still re(uire the 6&& supply for proper operation.

he DS7>8/ uses a simple three #ire serial interface. %*, pin P77 is used as a serial cloc'. %*, pin P78 is the "i!directional data line and %*, pin P7/ is a chip!select for the DS7>8/. Although BalloonSat has only U: connected

to these %*, pins the chip select function allo#s multiple peripherals to share the same cloc' and data lines as longas only one of the "ussed chips has its chip!select line asserted. U: re(uires crystal ?7 a >/.:9 'F) resonator asthe fre(uency determining element of its internal oscillator.

BalloonSat features an !"it Analog!to!Digital converter #ith an on chip 0!channel input multiple$er. his %&designated U0 is a 5ational Semiconductor AD&8 >0. he multiple$er allo#s up to 0 input voltages to "edigiti)ed "y a single AD&. An Analog Devices AD: 8 voltage reference integrated circuit provides a selecta"le /..8 volt reference for the AD&. umper 3P/ is provided on the BalloonSat printed circuit "oard for selecting thedesired reference level. Leaving the 1umper removed selects /.< 6. Placing a shorting 1umper at 3P> connects pin of U< to G5D selecting >.8 6 as the reference output. he AD: 8 has an internal temperature transducer providinga / m6* o& output. As sho#n in the "loc' diagram and schematic the E3P output from U< is amplified "y opampU9. Resistors R67 R< and R9 determine the voltage gain of this stage. 6aria"le resistor R67 can "e ad1usted "y asmall scre#driver for fine ad1ustments.

he output from U9 can "e connected to &h> of the AD&. ,n the BalloonSat "oard 1umper 3P> allo#s selectingeither the amplified temperature transducer signal or an e$ternal voltage source as the input to &h>. Pads are

provided on the circuit "oard for connecting inputs to the AD& channels. he safe voltage level for these signals is 8+G5D- up to the reference voltage +/.< or >.8-. E$ternal signal conditioning electronics may "e re(uired to interfaceother levels.

he AD&8 >0 communicates #ith the BAS%& Stamp #ith the 3%&R, %RE synchronous serial interface. %*, pinP70 is the serial cloc' pin P7> is the data line and P7< is the chip select. 5otice in the schematic that the D% +datain- and D, +data out- are "oth connected to P7>. he BAS%& Stamp under soft#are control #ill configure P7> asan input or an output depending upon #hether the AD& is "eing #ritten to or "eing read. %t #ould also "e possi"le to

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have separate data in and data out %*, lines "ut it is fre(uently necessary to conserve %*, pins particularly in largersystems.

BalloonSat can "e e$panded even further via connector P/. his optional feature allo#s a connecting e$ternalcircuitry to the BAS%& Stamp %*, pins. All of the %*, lines P8 through P7< G5D and 6&& are availa"le on P/.

hen designing devices #hich #ill interface to the BAS%& Stamp %*, pin usage must "e allocated to preventcontention of devices. %t is possi"le to have multiple % / & devices sharing the same hard#are %*, l ines if each devicehas a uni(ue % / & address. 3%&R, %RE devices can share cloc' and data lines "ut must have individual chip selectsto prevent "us contention. %t might "e necessary to disa"le some of BalloonSat s internal devices if they are notneeded for a given application. his #ill free %*, pins for use "y e$ternal peripherals. ,f course caution must "ee$ercised not to apply negative voltages or voltages greater than ;


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ASSEMBL5 - Stage 1

BalloonSat #ill "e assem"led in t#o stages. %n Stage 7 assem"ly you #ill complete the "are essentials of BalloonSat including the BAS%& Stamp serial connection to the computer and the po#er supply section. his "asicconfiguration #ill "e tested "efore moving on to Stage /.

he follo#ing components are re(uired for Stage 7H

I BalloonSat printed circuit "oard I /0!pin D%P soc'et +for U7-I D7 75< 7= diode I &7 0: u electrolytic capacitor I &/ 8.7 uf monoceramic capacitor I &0 7< u electrolytic capacitor I &< 8.7 u monoceramic capacitor I &78 8.7 u monoceramic capacitor I 7 DB!= pc" mount connector I 3P7 0J/ header and 0 shuntsI / /!pin po#er connector and mating plug I U7 BS/P/0 BAS%& Stamp module

I U> L3>08 or : 8< ;< 6oltage Regulator %&+ & 5* 3 SA8E&5 LASSES *9:

Refer to the BalloonSat component layout diagrams and schematic diagrams.

nassembled BalloonSat +rinted Cir#uit Board (Com$onent side vie;!

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BalloonSat ;it' minimum re


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I Conne#tor ?1=Place the =!pin right angle connector onto the

"oard. 3a'e sure that all pins are protrudingthrough the "oard and that the connector is flatagainst the "oard "efore soldering.

> Conne#tor ?2/ has t#o pins in a plastic housing. he short

pin side is soldered into the printed circuit "oard. he long pin side is #here the matingconnector #ill attach.

> oltage 3egulator

he orientation of voltage regulator U> is veryimportant. he sil' screen layer on the printedcircuit "oard sho#s a rectangular outline corresponding to the metal flange of the the component. Be sure to orientthe regulator properly "efore soldering.

"iode

Diode D7 is polari)edK 3a'e sure to orient it properly. he "and indicating the cathode should match the "and onthe printed circuit "oard component outline.

I D7 75< 7 or 75< 7=

Ca$a#itors%nstall the follo#ing electrolytic capacitors. Be sure to observe $ro$er $olarity:

I &7 0: u I &0 7< u%nstall the follo#ing monolithic ceramic capacitors. Polarity is not important "ut try to orient the components so thattheir value mar'ings are visi"le and not o"scured "y other parts. Solder into place and trim the leads.

I &/ 8.7u I &< 8.7u I &78 8.7u

&est$oints

%t is useful to have convenient testpoints for connecting to G5Dand 6&&. BalloonSat has three locations for testpoints t#o for G5D and one for 6&&. Each of the testpoints is mar'ed "y asmall rectangle on the sil'screen layer and has t#o plated!thruholes. he t#o holes for each testpoint are electrically connected.Pins may "e soldered here or a loop of "are solid #ire can "eused. he #ire loop is convenient for attaching clips onmultimeter or oscilloscope leads.

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I estpoints +> locations-his completes the Stage 7 assem"ly of BalloonSat . 5ote that integrated circuit U7 +the BAS%& Stamp module- is

9*& installed at this time. A fe# tests #ill "e done "efore installing the BAS%& Stamp.

)nitial tests=Prior to installing the BAS%& Stamp micro!controller you #ill verifythat the po#er supply section is functioning properly. BalloonSatre(uires an e$ternal po#er source such as a la"oratory D& po#er supply capa"le of providing = to 7< 6D& at appro$imately 788milliamperes of current.

Use clip leads or fa"ricate a po#er ca"le to plug into / on the BalloonSat "oard. %t is suggested that you color code the leads so thatthe G5D or &,33,5 lead is BLA& and the ; lead is RED.

oltage #'e#%s %f the la"oratory po#er supply has current limiting set thecurrent limit to no more than 788 milliamperes and thevoltage to = volts. %f the po#er supply is not ad1usta"le anyvoltage from = to 7< 6D& is suita"le. urn on the po#er supply and measure the voltage at the ; pin of / on

BalloonSat . his is the voltage input to BalloonSat andshould "e "et#een = and 7< volts. 5e$t measure the voltage atthe 6&& testpoint on BalloonSat . %t should measure

"oard for defective or missing solder 1oints or other construction or #iring errors.

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*$erational &est

%nstall the BAS%& Stamp BS/P/0 module U7 into its soc'et. ?ou may need to gently form the leads to allo# thento fit easily into the soc'et. Be sure to identify pin 7 of the BAS%& Stamp module. Refer to the photographs andcomponent layout diagram for the proper orientation of U7 in the /0!pin soc'et. Press the chip firmly into thesoc'et.

I U7 BS/P/0 Basic Stamp 3odule.Place four shorting 1umpers on 3P7. hese configure the "uilt!in serial port of the BAS%& Stamp to communicate

#ith the serial port on the computer.

I Shorting 1umpers placed on 3P7 +0 positions on 3P7-

&'e inal test or t'e Stage 1 BalloonSat is to veri y #ommuni#ation ;it' t'e BAS)C Stam$ Editor

%nstall the Paralla$ BAS%& Stamp Editor on a suita"le personal computer. he BAS%& Stamp Editor can "edo#nloaded from Paralla$ %nc. + ;;;=$aralla@=#om! . 6ersion /./ #as current as of 8 *7:*/88


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2,utput a count to the de"ug screen each second

2MNS A3P BS/PO 2S A3P directive +specifies a BS/P-

cycles 6AR ord 26aria"le to store counted cycles.

cycles 8 DEBUG &LS QBalloonSat starting...Q &R LoopH cycles cycles ; 7 PAUSE 7888 DEBUG Q&ycleH Q DE& cycles &R G, , Loop

E AM+LE +3* 3AM

Programs can "e #ritten and do#nloaded to the BAS%& Stamp. ype in the simple BAS%& program e$ample sho#n "elo# or #rite you may #rite your o#n program. Do#nload and Run.

?ou should see BalloonSat #riting to the de"ug #indo# each second #ith the incremented value of the varia"lecyclesC

Although BalloonSat is functional at this point its capa"ilities are rather limited. Stage / assem"ly #ill complete BalloonSat "y adding several useful peripherals.



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Assembly - Stage 2

&omplete the assem"ly of BalloonSat "y installing the remaining components on the printed circuit "oard. Refer tothe schematic diagram component layout diagram and photographs as needed. &hec' off the "o$es "elo# ascomponents are installed.

)C So#%ets

%nstall integrated circuit soc'ets on the BalloonSat "oard. he sil' screen outline on the "oard sho#s the properorientation for the notch in the soc'et. Solder one pin at each diagonally opposite corner and chec' that the soc'et isflat against the "oard. %f necessary carefully reheat the corner pins #hile pressing the soc'et against the "oard. Becareful not to "urn your fingersK Do not insert the integrated circuits into the soc'et at this time.

I U/ Soc'et + !in- I U0 Soc'et +70!pin-

I U< Soc'et + !pin- I U9 Soc'et + !pin-

I U: Soc'et + !pin-?um$er eaders

BalloonSat can "e configured for different options "y placing suita"le shorting 1umpers or shunts at locations 3P73P/ and 3P>. ?ou should already have soldered the 0J/ header into the "oard at location 3P7. Suita"le

headers can no# "e installed at locations 3P/ and 3P>.

I 3P/ +/!pin header- I 3P> +>!pin header-A shorting 1umper can no# "e plugged onto the header at location 3P/. he presence or a"sence of a 1umperselects the A*D converter reference voltage. See the datasheets for the AD: 8 and AD&8 >0 for details.

A shorting 1umper can "e installed at location 3P> to select the signal source for channel > of the A*D converter.&hannel > can "e connected to either the on!"oard temperature sensor or to a user supplied source.

Ca$a#itors

%nstall the follo#ing electrolytic capacitors. Be sure to observe $ro$er $olarity:

I &: 7< u I &/8 7< u%nstall the follo#ing monolithic ceramic capacitors. Polarity is not important "ut try to orient the components so thattheir value mar'ings are visi"le and not o"scured "y other parts. Solder into place and trim the leads.

I &9 8.7u I & 8.7u I &77 8.7u I &> 8.7u

I &7/ 8.7u I &7> 8.7u I &/7 8.7u



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S)+ So#%ets and 3esistor 9et;or%s

Single %nline Pac'age +S%P- soc'ets should "e installed at locations R57 and R5/. %f necessary 78!pin S%P soc'etscan "e fa"ricated from a /8!pin machined pin D%P +dual inline pac'age- soc'et "y carefully cutting a#ay the plasticin the middle of the soc'et. Place the soc'et flat against the "oard and solder the end pins only. 6erify that the soc'etis flat against the "oard "efore soldering the other pins. 5otice that the soc'ets are not polari)ed "ut the resistor

net#or's are. Pin 7 of the resistor net#or's are typically mar'ed #ith a dot or "and. his Pin 7 mar' should matchthe pin 7 designation on the printed circuit "oard a small s(uare on the component sym"ol.

I S%P Soc'et at R57 I S%P Soc'et at R5/I Resistor 5et#or' R57 +78 - I Resistor 5et#or' R5/ +78 -

3esistors

R7 R/ R> and R0 are mounted vertically to save space on the printed circuit "oard. Bend one resistor lead ta'ingcare not to damage the "ody of the resistor. %nsert into "oard and solder.

I R7 /./ I R/ /./ I R> /./ I R0 /./ Resistors R< and R9 are mounted flat against the printed circuit assho#n "y the sil'screen component outline.

I R< 7./ I R9 9./ LE" s "S1D"S4

,rient the LED cathode +flatted side or short lead- to#ards the edge of

the "oard. he anode +long lead- is ne$t to the associated resistor. ry to mount the LED4s neatlyC all the sameheight and aligned #ith each other.

> DS7 LED > DS/ LED > DS> LED > DS0 LED

ariable 3esistor

Place varia"le resistor R67 flat against the circuit "oard. Solder only one pin. 3a'e sure the part is flat against the "oard then solder the remaining pins. ,rient R67 so that the scre#driver ad1ustment shaft matches the sym"ol onthe sil'screen component outline.

I R67 /.:9 'F)

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)ntegrated Cir#uits

he BAS%& Stamp module U7 should already "e in its soc'et. 6oltage regulator %& U> #as installed in Stage 7. heremaining %&4s can no# "e installed into their respective soc'ets. Refer to the BalloonSat schematic and layoutdiagrams for component locations. All integrated circuits must "e properly oriented.

I U/ /0L&90 I U0 AD&8 >0

I U< AD: 8 I U9 AD /8 +or ,P8:-

I U: DS7>8/

*$tional Com$onents

BalloonSat provides space for connecting e$ternal electronics at locations PL PF and P/. he type of connection#ill depend upon the re(uirements for your application. &onnections could "e made "y soldering #ires directly tothe "oard or "y mounting suita"le connectors at these locations.

oltage C'e#%s

Repeat the voltage chec's that #ere done at the Stage 7 assem"ly.

Pin 5o. E$pected 6alue 3easured 6alue

U7!/7 < 6 +6&&-U7!/> 8 6 +G5D-U/! < 6U0!70 < 6U

6erify that voltage reference U< is operating properly. Pin 9 of U< an AD: 8 is the reference output.

3easure the voltage at U< pin 9 #ith respect to G5D. ith 1umper 3P/ open the voltage at U< pin 9 should "e/.

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BalloonSat bill of materialsQTY Reference Designator Description

1 C1 47 uF 25wvdc radial lead electrolytic, 3.5mm lead spacing10 C2,C3,C5,C6,C ,C10,C11,C12,C13,C21 0.1uF monoceramic, radial 0.1! lead spacing3 C4,C7,C20 15 uF 10"#$C electrolytic capacitor, radial 2mm lead spacing1 $1 1%5 1& 'c(ott)y diode, $*+35 pac)age4 $'1,$'2,$'3,$'4 ed - $ 0.1 lead spacing1 /1 $ +&F connector, pc mount 0& 'l C 311 /2 $16601 ate or /2, p n $16131 / 1 4 8 2 pin (eader 0.1! pin spacing1 / 2 1 8 2 pin (eader 1 / 3 1 8 3 pin (eader 1 1, 2, 3, 4 2.29 1 4 " 5: a;ial lead resistor 1 5 1.29 1 4" 5: a;ial lead resistor 1 6 6.29 1 4" 5: a;ial lead resistor 2 %1, %2 109 esistor networ), '< 10 pac)age1 #1 500 o(m varia le resistor 32&&" pac)age (see Activity P4)1 2 2 ; 10 pin (eader or 2 8 10 s(rouded (eader = optional component1 C rinted circuit oard, -'> p n ' 121 >1 '2 24 '


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BalloonSat Schematic Diagram


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89*87*/88: BalloonSat Assem"ly 3anual 7:

BalloonSat &omponent Placement Diagram +Sil' Screen ,verlay-

BalloonSat &opper Layers +Red op &opper Blue Bottom &opper -

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BalloonSat Assembly Manual

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