Technical Internship Program (TIP)By:

Utkarsh Tiwari71208120038

Mba-Tech-ExTC (4’th Year)

BHABHA ATOMIC RESEARCH CENTRE (BARC)

At Control & Instrumentation Division (CnID)

‘DIGITAL THERMOMETER AND FAST NETWORK

BUSES’

Using ATMEGA 16 Major Components include:1. 16 x 2 LCD2. LM 35 Temperature

sensor3. Microcontroller

ATMEAGA 164. Capacitors 5. Resistances

DIGITAL THERMOMETER

Using AT89C51Major components include:

1. 16 x 2 LCD2. LM 35 Temperature Sensor3. ADC 08044. Resistances 5. Capacitors6. Microcontroller AT89C51

DIGITAL THERMOMETER

Has a built in Analog to Digital convertor (ADC)

Has built in Clock Frequencies of 1,2,4 & 8

MHz

Requires external Analog to digital convertor i.e.

ADC0804Requires an external

oscillator to operate in the desired frequency.

ATMEGA 16 AT89C51

SELECTING THE I.C

ATMEGA 16 AT 89C51

CIRCUIT CONFIGURATION

Highlights: More accurate than a

Thermistor. Low self-heating. Operates within a

temperature range of -55 to 150 degree Celsius.

Has a scale factor of 0.01 per degree Celsius.

TEMPERATURE SENSOR LM 35

Displays the ambient temperature through a LCD display At Bhabha Atomic Research Centre (BARC), the reactors

are used at very high temperatures Temperature sensitive reactions take place in great

numbers on a daily basis Due to the sensitive and extreme conditions of working,

it becomes impossible to physically measure the temperature using a regular temperature measuring device.

Hence a microcontroller operated temperature sensor is used.

ABOUT THE DIGITAL THERMOMETER

FAST Networking Buses: USB 2.0/3.0 IEEE 1394 JESD 204 PCI Express TEST JTAG 1149

STUDY PROJECT

• Universal Serial Bus (USB) is an industry standard developed in the mid-1990s that defines the cables, connectors and communications protocols used in a bus for connection, communication, and power supply between computers and electronic devices.

• The Universal Serial Bus (USB) has become commonplace on other devices, such as smartphones, PDAs and video game consoles.

USB

USB 2.0 was released in April 2000.

Adding a higher maximum signaling rate of 480 Mbit/s called ‘High Speed’.

It also added the ‘No Dead Battery’ provision, which allows devices to temporarily draw 100 mA current after they have been attached.

USB-On-The-Go-makes it possible for two USB devices to communicate with each other without requiring a separate USB host

USB 2.0

USB 3.0 standard was released in November 2008, defining a new Super-Speed mode.

A USB 3.0 port, usually colored blue, is backward compatible with USB 2.0 devices and cables.

The new Super-Speed bus provides a fourth transfer mode with a data signaling rate of 5.0 Gbit/s, in addition to the modes supported by earlier versions.

USB 3.0

IEEE 1394 is an interface standard for a serial bus for high-speed communications and isochronous real-time data transfer.

The 1394 interface is comparable to USB though USB has more market share.

In IEEE 1394, 80% of the bus is reserved for isochronous cycles, leaving asynchronous data with a minimum of 20% of the bus.

In an aircraft, for instance, Isochronous devices include control of the rudder, mouse operations and data from pressure sensors outside the aircraft. All these elements require constant, uninterrupted bandwidth.

IEEE 1394

The JESD204 and the JESD204B are revision data converter serial interface standard that were created through the Joint Electron Device Engineering Council (JEDEC)

JEDEC is accredited by ANSI and maintains liaisons with numerous standards bodies throughout the world.

The purpose of their creation was to standardize and reduce the number of data inputs/outputs between high-speed data converters and other devices, such as FPGAs (field-programmable gate arrays).

Fewer interconnects simplifies layout and allows smaller form factor realization without impacting overall system performance.

JESD 204

Peripheral Component Interconnect Express, officially abbreviated as PCI-e, is a high speed serial computer expansion bus standard designed to replace the older PCI, PCI-X, and AGP bus standards.

The PCI Express link between two devices can consist of anywhere from one to 32 lanes.

In a multi-lane link, the packet data is striped across lanes, and peak data throughput scales with the overall link width.

PCI

o The Joint Test Action Group (JTAG) is an electronics industry association formed in 1985 for developing a method of verifying designs and testing printed circuit boards after manufacture.

o JTAG implements standards for on-chip instrumentation in Electronic Design Automation (EDA) as a complementary tool to digital simulation.

o The JTAG standards have been extended by many semiconductor chip manufacturers with specialized variants to provide vendor-specific features.

o There are two different standards/ types of JTAG i.e. 1.Daisy-chained JTAG (IEEE 1149.1) 2.Reduced pin count JTAG (IEEE 1149.7)

JTAG 1149

According to IEEE Standard 1149.1, the test bus interface consists of:

1. One test pulse input (TCKI)2. One test pulse output (TCKO)3. One test data output (TDO)4. Two test data inputs (TDI0,

TDI1)5. Two test mode select outputs

(TMS0, TMS1)6. Four lines, which can be

used as further TMS outputs (TMS2–TMS5)

TEST BUS

The architecture of TBC consists of the following 6 blocks:

1. Sequence block2. Serial block3. Event block4. Counter block5. Command block6. Host block

TEST BUS ARCHITECTURE

I was able to learn a lot about the importance played by the Instrumentation department in achieving successful functioning of any organization by this opportunity of interning at the Control Instrumentation Department. The future of the industrial automation environment holds the potential for installation of many different networks that yield information to improve operations and profitability.The plethora of choices makes decisions difficult, It’s important to have a strategy going forward.Networks are proliferating, not only in offices and commercial environments but also in factory aid manufacturing processes and throughout the enterprise.

CONCLUSION

• Books, Journals, Papers:1. David M Pozar, Microwave engineering.2. Danny Causey, PIC microcontroller and Embedded system3. Mazdi.M.A, The 8051 microcontrollers and Embedded systems.4. Texas Instrument application Report-August 2000.• Websites:1. www.engineersgarage.com2. www.avr-tutorial.com3. www.en.wikipedia.org4. www.atmel.com5. www.avrfreaks.net

REFERENCES

THANK YOU!!