Preliminary Edition 2015 Microchip Technology Inc. page 1
BM23 Bluetooth®
Evaluation Board User’s Guide
BM23 BLUETOOTH
EVALUTATION BOARD USER’S GUIDE
Preliminary Edition 2015 Microchip Technology Inc. page 2
Index
Preface ........................................................................................................................................ 4
1 OVERVIEW .............................................................................................................................. 6
1.1 INTRODUCTION................................................................................................................................................ 6 1.2 BM23 EVALUATION BOARD FEATURES ........................................................................................................ 7 1.3 BM23 EVALUATION BOARD CONTENTS ........................................................................................................ 8 1.4 BM23 EVB KIT CONTENTS ............................................................................................................................ 10
2. Getting Started ..................................................................................................................... 11
2.1 INTRODUCTION.............................................................................................................................................. 11 2.2 HARDWARE REQUIREMENTS ...................................................................................................................... 11
2.2.1 Hardware Setup ................................................................................................................. 11
2.2.2 Using Evaluation Board .................................................................................................... 11
2.3 APPLICATION DEMONSTRATION ................................................................................................................. 11 2.3.1 AUDIO DEMONSTRATION (A2DP) ............................................................................. 11
2.3.2 HSP/HFP DEMONSTRATION ........................................................................................ 13
2.4 SOFTWARE CUSTOMIZATION .................................................................................................................... 14 2.4.1 UI Tool .............................................................................................................................. 14
2.4.2 DSP TOOL ........................................................................................................................ 19
2.4.4 EEPROM Parameters Update ........................................................................................... 27
2.5 MODULE CONFIGURATION ........................................................................................................................... 29
APPENDIX A. BM23 AUDIO EVALUATION BOARD SCHEMATICS ....................................... 30
BM23 BLUETOOTH
EVALUTATION BOARD USER’S GUIDE
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TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and
enhanced as new volumes and updates are introduced.
If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via
E-mail at [email protected]. We welcome your feedback.
Most Current Data Sheet
To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:
http://www.microchip.com
You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
• Microchip’s Worldwide Web site; http://www.microchip.com
• Your local Microchip sales office (see last page)
When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using.
Customer Notification System
Register on our web site at www.microchip.com to receive the most current information on all of our products.
Abbreviations List: AVRCP: Audio Video Remote Control Profile A2DP: Advanced Audio Distribution Profile HFP: Hands-free Profile HSP: Headset Profile NFC: Near Field Communication SPP: Serial Port Profile
BM23 BLUETOOTH
EVALUTATION BOARD USER’S GUIDE
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Preface
NOTICE TO CUSTOMERS
All documentation becomes dated, and this manual is no exception. Microchip tools and documentation are constantly evolving to meet customer needs, so some actual dialogs and/or tool descriptions may differ from those in this document. Please refer to our web site (www.microchip.com) to obtain the latest documentation available.
INTRODUCTION
This chapter contains general information that will be useful to know before using the
BM23. Items discussed in this chapter include:
Document Layout
Recommended Reading
The Microchip Web Site
Customer Support
Document Revision History
DOCUMENT LAYOUT
This user’s guide describes how to use the BM23 Bluetooth Evaluation Board. The document is organized as
follows:
Chapter 1. “Overview” – This chapter introduces the BM23 Bluetooth Evaluation Board and provides an
overview of various features.
Chapter 2. “Getting Started” – This chapter describes
The hardware components and setup of the BM23 Bluetooth Evaluation Board.
The application demonstrations of the BM23 Bluetooth Evaluation Board.
Software/Utility Requirements of the BM23 Bluetooth Evaluation Board.
Appendix A. “BM23 Audio Evaluation Board Schematics” – This appendix includes a schematic of the
BM23 Bluetooth Evaluation Board.
RECOMMENDED READING
This user’s guide describes how to use the BM23 Bluetooth Evaluation Board. Other useful documents are
listed below. The following Microchip documents are available and recommended as supplemental reference
resources:
STEREO Module Data Sheet (BM20/23 Data Sheet)
BM23 BLUETOOTH
EVALUTATION BOARD USER’S GUIDE
Preliminary Edition 2015 Microchip Technology Inc. page 5
MICROCHIP WEBSITE
Microchip provides online support via our web site at http://www.microchip.com. This website is used as a
means to make files and information easily available to the customers. Accessible by using your favorite
Internet browser, the website contains the following information:
Product Support – Data sheets and errata, application notes and sample programs, design resources,
user’s guides and hardware support documents, latest software releases and archived software
General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online
discussion groups, Microchip consultant programmer listing
Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of
seminars and events, listings of Microchip sales offices, distributors and factory representatives
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Customers should contact their distributor, representative or Field Application Engineer (FAE) for support.
Local sales offices are also available to help customers. A listing of sales offices and locations is included in
the back of this document. Technical support is available through the website at:
http://support.microchip.com
DOCUMENT REVISION HISTORY
Revision A (Aug 2015)
This is the initial released version of this document.
Revision 1.0 : Added details of V4 EVB
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1 OVERVIEW 1.1 INTRODUCTION This user’s guide describes the hardware and software setup for the BM23 Bluetooth
® Evaluation Board.
This board contains the hardware needed to evaluate the BM23 Bluetooth module. The BM23 module is
mounted to an evaluation board that demonstrates the module’s key features. The evaluation board contains:
PIC18 MCU and YAMAHA YDA174 DSP on board
12 push buttons to control audio playback
Status LEDs
The BM23 supports the following Bluetooth profiles: A2DP, AVRCP, and HFP/HSP
A2DP stereo audio (Sink mode support for Sub-Band Coding (SBC)),
AVRCP media player remote control
HFP/HSP for accepting a phone call support.
For data sheet and other details related to BM23 module, refer to the Microchip website at
http://www.microchip.com/bm23.
This chapter discusses the following topics:
BM23 Evaluation Board Features
BM23 Evaluation Board Contents and Part Details
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1.2 BM23 EVALUATION BOARD FEATURES The BM23 Evaluation Board has the following features:
It includes a Bluetooth module (BM23), MCU (PIC18) and DSP (YDA174) on the board for easy
function and feature demonstration.
BM23 module is a fully qualified Bluetooth version 4.1, fully compatible with Bluetooth version 3.0, 2.0,
1.2.
Embedded BM23 module with postage-stamp size form factor of 15 x 29 x 2.5 mm (include shielding
case)
Embedded Bluetooth stack profiles: A2DP, AVRCP, and HFP/HSP, Bluetooth SIG certified.
System gets power from 15V / 3A DC adapter for speaker application.
Environmentally friendly, RoHS compliant
Keypad matrix on board and controlled by MCU, easy for playback control (play/pause, Vol Up/Down,
forward/rewind, Next/previous track etc.).
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1.3 BM23 EVALUATION BOARD CONTENTS BM23 Evaluation Board contains the following components as shown in Figure 1-1 which describes the
evaluation board’s interfaces and connectors. Table 1-1 describes the various components of the evaluation
board.
FIGURE 1-1: BM23 EVALUATION BOARD
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MIC (JP23) ICSP (J5)
Pin Description Pin Description
1 MIC_P1 1 Reset
2 AGND 2 ICD3 power
3 MIC_N1 3 GND
4 PGD
5 PGC
6 NC
TABLE 1-1:BM23 EVALUATION BOARD HARDWARE
Hardware Component Description
BM23 Bluetooth® 4.1 Module
YDA174 DSP with internal digital amplifier
PIC18F85J10 16 bit MCU with 32k byte flash and 2048 bytes SRAM.
MCP2200 UART-USB converter chip
Micro USB Connector USB to UART for EEPROM R/W for BM23.
15V Adapter Jack Connect to 15V adapter (P2) for main power source of whole system.
Amplifier Audio Out Audio connector (JP6 / 7) from YDA174
Audio In Audio 3.5 mm jack for Mono microphone input(P6) and AUX input(P8)
Status LEDs Red and Blue LEDs show the pairing/connection status
MFB Button Switch to turn on/off BM23 module (SW24)
Play/Pause Button Button to play or pause the audio playback (SW31)
Previous Track Button Button to skip track backwards (SW23)
Next Track Button Button to skip track forwards(SW45)
Volume Up Button Button to increase volume (SW27)
Volume Down Button Button to decrease volume (SW28)
Pairing Button Button to make BM23 into pairing mode (SW34)
Sound Effect Button Button to change sound effect (SW35)
Reset Button Reset BM23 (SW10); Reset MCU (SW1)
1 2 3 1 2 3 4 5 6
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1.4 BM23 EVB KIT CONTENTS BM23 EVB kit include: BM23 EVB board, 15V adapter, micro USB cable and 2 speaker cables as shown in
Figure 1-2.
FIGURE 1-2: BM23 EVB KIT
1) 15V adapter: main power source of the whole system.
2) USB cable: micro USB cable can connect to P3 of BM23 EVB board to do firmware update on
BM23.
3) Speaker cable: connect speaker to BM23 EVB J6 and J7.
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2. Getting Started 2.1 INTRODUCTION This chapter describes how the BM23 Evaluation Board works. Certain hardware and utilities are essential to
support the evaluation/development of demo applications. This chapter discusses the following topics:
Hardware Requirements
Software/Utility Requirements
Module Configuration
2.2 HARDWARE REQUIREMENTS
2.2.1 Hardware Setup To setup the evaluation hardware, perform the following steps:
1. Make sure pin 1 / 2 / 3 of “SW9” in “Off / Off / On” to make system in application mode.
2. Connect the speaker line to the amplifier output connector (J6 / 7).
2.2.2 Using Evaluation Board 1. Connect 15V adapter P2.
2. Connect speaker to J6 and J7.
3. Long press MFB button (SW24) to turn-on and enter pairing mode. The status LEDs will blink.
4. Press and hold Pairing button (SW34). Blue and Red LED will flash alternately. Release the Pairing
button. Now the BM23 Evaluation board is discoverable.
5. Turn on Bluetooth device manager on a host device (PC or smartphone), the host device will
display a list of discoverable Bluetooth devices. Select the BM23-002 EVB and connect with it.
6. If the pairing with the device is successful, BM23 evaluation board is connect to the host device.
Once connected, BM23 evaluation board enables Advanced Audio Distribution Profile (A2DP) for
audio playback and Audio Video Remote Control Profile (AVRCP) for player control.
7. Play music and the host device and listen the music on the speaker. This will demonstrate A2DP.
8. If host device is cell phone, call you cell phone from another phone. Accept the incoming phone call
on your paired and connected cell phone. This will demonstrate HFP.
2.3 APPLICATION DEMONSTRATION
2.3.1 AUDIO DEMONSTRATION (A2DP) In this demonstration, user can play an audio stream on both BM23 evaluation boards using a computer or
smartphone. The following are the steps to perform the demonstration.
1. Connect BM23 evaluation board to a host device (PC or smartphone) that has an audio source.
2. Connect speakers to BM23 evaluation board J6 / 7.
3. Open the audio source on the host device. Microchip recommends using media player (e.g. Microsoft
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Media Player, iTunes, and Android).
4. Start the audio stream on the media player.
When BM23 evaluation board is connected to an audio source compatible with Bluetooth AVRCP, the
following audio control buttons can be used:
Control the volume of audio output (Vol+ (SW27), Vol- (SW28)).
Go to the previous track(SW23)
Go to the next track(SW45)
Start / stop playing the current track (SW31).
FIGURE 1-2: BM23 EVALUATION BOARD AUDIO CONTROL BUTTONS
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2.3.2 HSP/HFP DEMONSTRATION In this demonstration, user can explore the hands-free profile setting to receive an incoming voice call from a
paired smartphone. This demonstration requires a microphone. It would be good to use a PC
headset/microphone (with two-plugs). The following are the steps to perform the demonstration.
1. Connect the speakers / microphone to BM23 evaluation board’s audio out connector (J6/7) and MIC
input (P6) respectively.
2. Connect BM23 evaluation board to a smartphone that supports the A2DP and HFP/HSP Bluetooth
profiles.
3. From another one phone, initiate a call to the smartphone that is paired with BM23 evaluation board. The
A2DP stream pauses and the ringtone plays on the speakers.
4. Click button “MFB” on BM23 evaluation board to accept the incoming call.
5. Once phone call is terminated, A2DP stream resumes.
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2.4 SOFTWARE CUSTOMIZATION User can customized UI and DSP settings according to their requirements. These settings can then be merged along with patch code to create IISC patch file (*.ipf). This patch file then programmed into EEPROM. Process of patch file creation is given below. Tools needed for customization
UI Tool: user can use this tool to create customize Bluetooth behavior like button functionality, Bluetooth name etc.
DSP Tool: user can use this tool to modify audio parameter.
MPET Tool: user can use this tool to merge UI, DSP and patch code. Details about Patch code will be provided latter section.
EEPROM Tool: user can use this tool to upgrade the merged parameter into EEPROM of BM23.
All these tools can be obtained from www.microchip.com/bm23 or through FAE.
2.4.1 UI Tool Step1. Open UI tool
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Step2. Load appropriate default UI setting (included in UI tool package) or previous saved file.
Step3. Click “Edit” to modify the settings.
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Step4. In the main settings, profile can be enabled/disabled by checking/unchecking the box as shown below.
Click “Next” for other setting.
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Step5. You can do system and functional setting in these pages.
Click “Help” you can get more detail information.
Step6. After finish parameter selection, click “Finish” button and a message will remind you check EEPROM
size on your system.
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Step7. Click “Save” button to save these UI parameters as a “.txt” file
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2.4.2 DSP TOOL Step1. Open DSP tool
Step2. Select IC version ““IS2020_XXX_SHS” (XXX is the version of chip, e.g. IS2023S-002)
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Step3. You can setup all voice and audio function in these pages.
Step4. Click “Save” button to save these DSP parameters as a “.txt” file after finish all DSP
setting.
BM23 BLUETOOTH
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2.4.3 MERGE TOOL Step1. Open MPET tool, click “Next” to set up.
Step2. Select “UI Patch Only” to use full EEPROM table to merge UI and DSP parameter.
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Step3. Select the bin file (full EEPROM table) and click “Next”
Step4. If the bin file includes UI/DSP/patch code, you can see them as shown in the above figure. If you want to keep any one of them in your customization, you can select that and use “pull down” button (2) to add them to merge list. For adding customized parameters, you can use add button (+) (3) to add new parameters (e.g. UI/DSP parameters), into tool to merge with EEPROM table.
BM23 BLUETOOTH
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Step5. Select output path and choose a file name for the merged EEPROM table.
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Step6. Click “Next” and choose Merge Default Bin to Patch (Patch File, *.ipf) as shown in the following picture and then Click “Next”. “Generate” button to generate the new EEPROM table.
BM23 BLUETOOTH
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Step7. Click Generate button
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Step8. Select all as shown below and then click Next.
Step9. Now you have a merged patch file (*.ipf file).
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2.4.4 EEPROM Parameters Update
Step1. Make sure SW9 in “ROM TEST” mode. Mode switch (1/2/3 – on/off/on) Step2. Connect EVB “P1” port and PC by USB cable. LED1 & LED2 on EVB will keep lighting. Step3. Run the E2PROM_tool.exe program and a window will be come up as below
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Step4. Specify the COM Port (1). Click IC/Module (2) Identify to know IC version of BM23. This is useful to
prevent IC version mismatch.
Step5. Press ”Browse” (3) to choose the *.ipf file (created in section 2.4.3) and click Write(4)
Step6. After data update is completed, remove USB cable and make SW9 to “ROM APP”(mode Switch 1/2/3 off/off/on) mode and power cycle.
EVB will be using new setting from EEPROM. Follow section 2.0 to see the effect of parameter
customization.
BM23 BLUETOOTH
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2.5 MODULE CONFIGURATION
2.5.1 Mode Settings Setting in Mode Switch:
Mode SW9 Setting Switch 9 PIN Definition
ROM Test Mode
1: ON (P2_0: LOW) 2: OFF (P2_4: HIGH) 3: ON (EAN: HIGH)
Application Mode
1: OFF (P2_0: HIGH) 2: OFF (P2_4: HIGH) 3: ON (EAN: HIGH)
BM23 BLUETOOTH
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APPENDIX A. BM23 AUDIO EVALUATION BOARD SCHEMATICS EVB block diagram
Key Button Matrix:
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MIC
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BM23 BLUETOOTH
EVALUTATION BOARD USER’S GUIDE
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C2
30
.1u
/16
V
R2
010K
1 2
RS
T_
N
R2
1470
12
BM23 BLUETOOTH
EVALUTATION BOARD USER’S GUIDE
Preliminary Edition 2015 Microchip Technology Inc. page 33
TP
11
TP
21
TP
31
TP
41
TP
51
TP
61
TP
71
TP
81
TP
91
TP
101
TP
111
TP
121
J6
HD
R 1
x2
1 2
U18
MC
P1824T
VIN
1
SH
DN
3A
DJ
4
VO
UT
5
GN
D2
J7
HD
R 1
x2
1 2
R124
3K
/1%
1 2
R125
10K
1 2 (0.41V)
(RT9179
pin compatible)
DS
P/M
CU
IN
TE
RF
AC
E
U17
AP
L1117-3
3V
C
ADJ/GND1
OUT2
IN3
3V
3
C15
10u/1
6V
C16
10u/1
6V
C14
10u/1
6V
C17
10u/1
6V
1V
8
G
G
X2
XTL571300-L
118-0
45
41
32
SLK
0_D
SP
DT0_D
SP
1V
8
C10
1u/5
0V
DS
P_IC
_N
OU
TM
L
R93
100K
1 2
C96
0.1
u/1
6V
R4
47K
1 2
C97
1u/5
0V
1V
8
1V
8
OU
TP
L
3V
3D
SP
_S
LE
EP
C98
0.1
u/1
6V
C6
1u/1
6V
R94
1M
1 2
R95
220
12
DS
P_P
RO
T_N
R15
4K
71 2
R97
4K
7
1 2
3V
3
DS
P_P
1_2
3V
3
C100
10u/1
6V
DC
_A
MP
DS
P_P
1_3
3V
3
C11
0.1
u/1
6V
DS
P_IR
Q_N
OU
TP
R
C101
10p/5
0V
C102
10p/5
0V
3V
3
R99
47K
1 2
3V
3
C1
0.1
u/1
6V
R100
47K
1 2
DS
P_M
UTE
C103
0.1
u/1
6V
OU
TM
R
P2
DC
-JA
CK
1 2 3
DGND
3V
3
YDA174A30
U2
YD
A174A
30
DV
DD
18
1
GP
IO6
2
GP
IO5
3
GP
IO4
4
GP
IO3
5
DV
SS
6
GP
IO2
7
GP
IO1
8
GP
IO0
9
PLLV
DD
10
IC_N
11
PLLV
SS
12
XIN13
XOUT14
IOVDD15
SCL16
SDA17
DVDD1818
IRQ_N19
OPEN20
PROT_N21
SLEEP_N22
MUTE_N23
TESTr24
OP
EN
36
PV
DD
PL
35
OU
TP
L34
PV
SS
L33
OU
TM
L32
PV
DD
ML
31
PV
DD
MR
30
OU
TM
R29
PV
SS
R28
OU
TP
R27
PV
DD
PR
26
OP
EN
25
EP49
GPIO748
IOVDD47
GPIO846
GPIO945
GPIO1044
GPIO1143
TESTb42
DVSS41
OPEN40
DVSS39
REFA38
AVSS37
R12
100K
1 2
DC
_A
MP
RF
S0_D
SP
+
C32
1000u/5
0V
1 2
DC
_A
MP
(15V)
OU
TM
L
OU
TP
L
SP
KO
UT
C25
0.1
u/5
0V
C106
0.1
u/5
0V
C107
0.2
2u/1
6V
C134
1u/5
0V
DC
_A
MP
C8
1u/5
0V DC
_A
MP
I2S
IN
TE
RF
AC
E
DT0_D
SP
RF
S0_D
SP
SLK
0_D
SP
DR
0_D
SP
R17
33
12
R118
33
12
TF
S0_D
SP
R22
33
12
R18
33
12
R19
33
12
Board
Nam
e
Siz
eTitle
Rev
Date
:S
heet
of
P/N
DS
P_Y
DA
174
4.0
BM
23 E
VB
B
68
Wednesday
, July
22,
2015
0360
5F, N
o.5,
Indu
stry
E. R
d. V
II, H
sinc
hu S
cien
ce P
ark,
Hsin
chu C
ity
30078,
Taiw
an
TE
L.
886-3
-5778385
RF
S0
SC
LK
0TF
S0
DR
0D
T0
D15
CD
SL4148
21
D14
CD
SL4148
21
DC
_A
MP
D17
CD
SL4148
21
D16
CD
SL4148
21
L4
L22uH
12
L3
L22uH
12
DS
P_P
RO
T_N
DS
P_M
UTE
DS
P_S
LE
EP
DS
P_IR
Q_N
DS
P_IC
_N
DS
P_M
UTE
DS
P_S
LE
EP
DS
P_IC
_N
DS
P_P
1_3
DS
P_P
1_2
DS
P_P
1_2
DS
P_P
1_3
DS
P_P
RO
T_N
DS
P_IR
Q_N
C104
0.1
u/5
0V
C105
0.1
u/5
0V
C30
0.2
2u/1
6V
OU
TM
R
OU
TP
R
L6
L22uH
12
L5
L22uH
12
+
C133
1000u/5
0V
1 2
BM23 BLUETOOTH
EVALUTATION BOARD USER’S GUIDE
Preliminary Edition 2015 Microchip Technology Inc. page 34
MC
U_
P7
0M
CU
_P
71
R1
22
3K
12
R1
23
3K
12
HC
I_R
XD
HC
I_TXD
G
D
SQ2
STS
23
06
312
R1
26
2K
1 2
R1
27
1K
1 25V
RS
T_
N
RS
T_
PIC
18
G
D
SQ3
STS
23
06
312
ICD
3_P
WR
RS
T_
N
R1
28
1K
1 2
(Reset PIC18 when connect to USB)
(Reset BT when connect to ICD3)
JP
33
JP
1x2 1
2
PG
D
RE
SE
T
3V
3
PG
C
J5
JP
1x6
1 2 3 4 5 6 ICSP
Boa
rd N
am
e
Siz
eTitle
Re
v
Da
te:
Sheet
of
P/N
MC
U_P
IC18
4.0
BM
23 E
VB
B
78
We
dn
esd
ay
, Ju
ly 2
2,
201
5
0360
5F, N
o.5,
Indu
stry
E. R
d. V
II, H
sinc
hu S
cien
ce P
ark,
Hsin
ch
u C
ity
300
78
, Ta
iwa
nTE
L.
8
86
-3-5
77
83
85
ICD
3_P
WR
C4
10p
/50V
(MFB/RX_IND)
(TX_IND)
(UART_TXD)
(UART_RXD)
C1
25
0.1
u/2
5V
C1
26
0.1
u/2
5V
X4
XTA
L-3
2.7
68
KH
Z
12
3
DP
1D
P-4
21
C1
14
15p
/50V
C1
20
15p
/50V
T1
OS
O
T1
OS
I
DP
2D
P-4
21
C3
10p
/50V
PIC18F85J10
U1
3
PIC
18F
85J1
0
RH
2/A
18
1
RH
3/A
19
2
RE
1/A
D9
/WR
/P2C
3
RE
0/A
D8
/RD
/P2D
4
RG
0/E
CC
P3/P
3A
5
RG
1/T
X2
/CK
26
RG
2/R
X2
/DT2
7
RG
3/C
CP
4/P
3D
8
MC
LR
9
RG
4/C
CP
5/P
1D
10
VS
S11
VD
DC
OR
E/V
CA
P12
RF
7/S
S1
13
RF
6/A
N1
114
RF
5/A
N1
0/C
VR
EF
15
RF
4/A
N9
16
RF
3/A
N8
17
RF
2/A
N7
/C1
OU
T18
RH
7/A
N1
5/P
1B
19
RH
6/A
N1
4/P
1C
20
RH5/AN13/P3B21
RH4/AN12/P3C22
RF1/AN6/C2OUT23
ENVREG24
AVDD25
AVSS26
RA3/AN3/VREF+27
RA2/AN2/VREF-28
RA1/AN129
RA0/AN030
VSS31
VDD32
RA5/AN433
RA4/T0CKI34
RC1/T1OSI/ECCP2/P2A35
RC0/T1OSO/T13CKI36
RC6/TX1/CK137
RC7/RX1/DT138
RJ4/BA039
RJ5/CE40
RJ2
/WR
L60
RJ3
/WR
H59
RB
0/I
NT0
/FL
T0
58
RB
1/I
NT1
57
RB
2/I
NT2
56
RB
3/I
NT3
/EC
CP
2/P
2A
55
RB
4/K
BI0
54
RB
5/K
BI1
53
RB
6/K
BI2
/PG
C52
VS
S51
OS
C2
/CL
KO
50
OS
C1
/CL
KI
49
VD
D48
RB
7/K
BI3
/PG
D47
RC
5/S
DO
146
RC
4/S
DI1
/SD
A1
45
RC
3/S
CK
1/S
CL
144
RC
2/E
CC
P1/P
1A
43
RJ7
/UB
42
RJ6
/LB
41
RH1/A1780
RH0/A1679
RE2/AD10/CS/P2B78
RE3/AD11/P3C77
RE4/AD12/P3B76
RE5/AD13/P1C75
RE6/AD14/P1B74
RE7/AD15/ECCP2/P2A73
RD0/AD0/PSP072
VDD71
VSS70
RD1/AD1/PSP169
RD2/AD2/PSP268
RD3/AD3/PSP367
RD4/AD4/PSP4/SDO266
RD5/AD5/PSP5/SDI2/SDA265
RD6/AD6/PSP6/SCK2/SCL264
RD7/AD7/PSP7/SS263
RJ0/ALE62
RJ1/OE61
C1
27
0.1
u/2
5V
RE
SE
T
DS
P_
PR
OT_
ND
SP
_IR
Q_N
DSP_P1_3
MC
U_
P4
4M
CU
_P
45
MC
U_
P4
6
DSP_MUTE
DSP_P1_2
SW
1S
W-T
AC
T
12
34
RESET
3V
3
C1
28
0.1
u/2
5V
R1
12
100
/1%
12
DSP_SLEEP
MCU_P72
P77
DSP_IC_N
MF
B
P0_0
(Audio AMP Enable)
(RESET_n)
P3_0
P1_5
(LINE_IN_DET)
3V
3
3V
3
3V
3
X3
X4
P-1
6M
HZ
4132
C1
29
0.1
u/2
5V
3V
3P
GD
PG
C
P20
C1
30
0.1
u/2
5V
P17
C1
31
10u
/16V
R1
13
10K
/1%
12
RS
T_
PIC
18
T1OSOT1OSI
BM23 BLUETOOTH
EVALUTATION BOARD USER’S GUIDE
Preliminary Edition 2015 Microchip Technology Inc. page 35
P77
SOUND
EFFECT
PAIRING
P77
R3
P77
MC
U_P
71
MC
U_P
71
MFB
VOL-
PLAY/PAUSE
VOL+
C1
BU
TT
ON
MC
U_P
45
MC
U_P
70
MC
U_P
72
R1
R0
R2
MC
U_P
71
MC
U_P
72
MC
U_P
70
R1141
0K
/1%
12
C61
1u/1
6V
MC
U_P
70
<< PRV
C0
MC
U_P
72
MC
U_P
44
C132
1u/1
6V
R116
10K
/1%
12
SW
22
TS
08M
-PF
21
SW
23
TS
08M
-PF
21
SW
24
TS
08M
-PF
21
SW
34
TS
08M
-PF
21
SW
27
TS
08M
-PF
21
SW
31
TS
08M
-PF
21
SW
28
TS
08M
-PF
21
SW
35
TS
08M
-PF
21
SW
39
TS
08M
-PF
21
SW
45
TS
08M
-PF
21
SW
40
TS
08M
-PF
21
SW
38
TS
08M
-PF
21
SW PT
P77
C2
MC
U_P
70
R1151
0K
/1%
12
MC
U_P
71
C63
1u/1
6V
FWD >>
MC
U_P
72
MC
U_P
46
3V
33V
33V
3
Board
Nam
e
Siz
eTitle
Rev
Date
:S
heet
of
P/N
MC
U_B
UT
TO
N4.0
BM
23 E
VB
A
88
Monday
, July
27,
2015
0360
5F
, N
o.5
, In
dustr
y E
. R
d. V
II, H
sin
chu S
cie
nce P
ark
,
Hsin
chu C
ity
30078,
Taiw
an
TE
L.
886-3
-5778385
Worldwide Sales and Service
AMERICAS Corporate Office 2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
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Tel: 678-957-9614
Fax: 678-957-1455
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Tel: 774-760-0087
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Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
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Tel: 216-447-0464
Fax: 216-447-0643
Dallas Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit Novi, MI
Tel: 248-848-4000
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Indianapolis
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Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
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Tel: 949-462-9523
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ASIA/PACIFIC
Asia Pacific Office
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Tel: 852-2943-5100
Fax: 852-2401-3431
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Fax: 61-2-9868-6755
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Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
China - Shanghai Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
ASIA/PACIFIC
India - Bangalore Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
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Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
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Tel: 91-20-3019-1500
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Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Korea - Daegu Tel: 82-53-744-4301
Fax: 82-53-744-4302
Korea - Seoul Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
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Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Taiwan - Kaohsiung Tel: 886-7-213-7830
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Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
EUROPE
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen Tel: 45-4450-2828
Fax: 45-4485-2829
France - Paris Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Dusseldorf Tel: 49-2129-3766400
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Germany - Pforzheim Tel: 49-7231-424750
Italy - Milan Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Venice Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Poland - Warsaw
Tel: 48-22-3325737
Spain - Madrid Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
2015 Microchip Technology Inc. Advance Information page 32