Board Assembly TWG

Champion: Assembly Materials: Keith Howell, Nihon Superior Repair & Rework: Jasbir Bath, Bath Consultancy Press-fit: Dennis Willie, Flextronics SMT Placement: Girish Wable, Jabil NPI: Michael Gerner, Plexus Chair & Co-chair: Dr. Paul Wang, Mitac Frank Grano, GE Participant: 51 from 33 companies

Rev.03 Dec. 5th, 2013 SMTA Silicon Valley Chapter Meeting At Cisco Systems, Bldg D, Pacific Pacific Room

1

International Electronics Manufacturing Initiative (iNEMI) • Not for profit, highly efficient R&D consortia since 1994

– Funded by Corporate memberships - Staffed globally in US, China, Japan & Ireland

• Membership includes 107 leading industry companies & organizations, representing

a cross section of our electronics manufacturing industry & supply chain

1

iNEMI Mission: Forecast and accelerate improvements in the Electronics Manufacturing

Industry for a sustainable future.

We Accomplish This By:

• Being the recognized leader at projecting future technology needs for the global supply

chain (iNEMI Technology Roadmap).

• Guiding and leveraging the strength of the consortium’s industry leading international

membership.

• Driving high impact collaborative R&D Results through constantly improving methodologies.

• Defining and implementing science based sustainable solutions in high impact areas

including the environment and health care.

• Influencing and leveraging key government agencies and labs (iNEMI Research Priorities

Document).

• iNEMI has currently 25 collaborative R&D projects and initiatives that address key

technology gaps

• Projects typically have 10-20 member companies/institutions

www.inemi.org

2

Some Definitions

• TWG - Technical Working Group

– Develops the roadmap technology chapters

– Presently 20 groups and chapters

• PEG – Product Emulator Group

– “Virtual Product”: future product attributes plus key cost and density drivers

• Portable / Consumer

• Office Systems

• High-End Systems

• Medical Products

• Automotive

• Aerospace/Defense

2

3

Methodology

3

Product

Needs

Technology

Evolution

GAP

Analysis Research

Projects

Competitive

Solutions

Roadmap

Industry Solution

Needed

Academia

Government

iNEMI

Members

Collaborate

No Work

Required

Available

to Market

Place

Global

Industry

Participation Disruptive

Technology

4

Statistics for the 2013 Roadmap

• > 650 participants -- Big Thanks to All Contributors!!

• > 350 companies/organizations

• 18 countries from 4 continents

• 20 Technology Working Groups (TWGs)

• 6 Product Emulator Groups (PEGs)

• > 1900 pages of information

• Roadmaps the needs for 2013-2023

• Workshops held in Europe (Berlin, Germany), Asia (Hong Kong, China) and North America (ECTC, San Diego) in June 2012

• A Full Global Perspective

• Available to iNEMI members on 12/22/12 at: www.inemi.org

• Shipping/Downloading to industry beginning April 4 at www.inemi.org

4

5

2013 Technology Working Groups (TWGs)

5

Organic PCB Board

Assembly Customer

Optoelectronics Large Area, Flexible Electronics

Energy Storage &

Conversion Systems

Modeling, Simulation,

and Design

Packaging

&

Component

Substrates

Semiconductor

Technology

Final

Assembly

Mass Storage (Magnetic & Optical)

Passive Components

Information

Management

Systems

Test, Inspection &

Measurement

Environmentally

Conscious

Electronics

Ceramic

Substrates

Thermal

Management

Connectors

MEMS/

Sensors

Red=Business Green=Engineering Aqua=Manufacturing Blue=Component & Subsystem

Solid State Illumination

Photovoltaics

6 6

Roadmap Development

Product Emulator Groups TWGs (20)

Med

ical P

rod

ucts

Au

tom

oti

ve

Defe

nse a

nd

Aero

sp

ace

Semiconductor Technology

Design Technologies

Manufacturing Technologies

Comp./Subsyst. Technologies

Modeling, Thermal, etc.

Board Assy, Test, etc.

Packaging, Substrates, Displays, etc.

Product Sector Needs Vs. Technology Evolution

Business Processes

Prod Lifecycle Information Mgmt.

Po

rtab

le / C

on

su

me

r

Off

ice S

yste

ms

Hig

h-E

nd

Syste

ms

7

Optoelectronics and Optical Storage

Organic Printed Circuit

Boards

Magnetic and Optical Storage

Supply Chain

Management

Semiconductors

iNEMI

Information

Management

TWG

iNEMI

Mass Data

Storage TWG

iNEMI / IPC / EIPC / TPCA

Organic PWB

TWG

iNEMI / ITRS /

MIG/PSMA

Packaging

TWG

iNEMI

Board Assembly

TWG

Interconnect Substrates—Ceramic

iNEMI Roadmap

iNEMI

Optoelectronics TWG

Fourteen Contributing Organizations

iNEMI / MIG /

ITRS

MEMS

TWG

iNEMI

Passives TWG

8 8

Key Trends (2013 Roadmap)

9 9

Key Trends (2013 Roadmap)

10 10

Key Trends (2013 Roadmap)

11

Board Assembly of 3D IC Integration

System-in-Package (SiP) Challenges/Opportunities

12

Miniaturization: Passive components size

reduction

• From 2012 onwards the ‘M0201’ package will be introduced

• Dimensions: 0.2 x 0.1 mm

• This is half the size of a ‘01005’ package!

Sources: Murata, Rohm

13

Technology

Ma

turi

ty

Basic

R&D

Applied

R&D

Mass

Production

Commercia-

lization

Die

Stacking

with wire

bonds

Package

on

Package

Stacking

(PoP)

C2C, C2W,

W2W

Stacking

W2W

Stacking

Full swing production for memories.

Every 18 months one layer increase

Testing and yield challenges give

way for Package stacking

Active applied R&D is undertaken

by Research Institutes. System

level challenges are key. In the

phase of industrialization.

Still in Upstream research,

technological challenges such

as yield & device architecture

are key issues.

3D Integration Technology3D IC Packaging 3D IC Integration 3D Si Integration

3D Integration Technology

John H. Lau

14

Press-Fit TWG Scope

• Technologies for second level Board Assembly process

– Compliance press-fit Design

– Smaller Compliance Pins

– Placement & insertion

– Inspection

– Testing Challenges

– Repair

– Finish Hole size

– Environment Requirement

– Contact Relibaility

15

Press-Fit TWG Scope

• Technologies for second level Board Assembly process

16

Press-Fit TWG Scope

– Inspection

• 3D Automated Press-Fit Pin Profiling

Inspection

– Backplanes and PCBA

assemblies up to size 127x76cm

(50”x30”), 200K~500K pts/cm2 in

18 seconds

– Non-contact Confocal line sensor

scan then create 3D profile to

detect bent pin, pin crushed and

missing pin in quantitative value

17

Press-Fit TWG Scope

• Technologies for second level Board Assembly process – Compliance press-fit Design

– Smaller Compliance Pins

– Placement & insertion

– Inspection

– Testing Challenges

– Repair

– Finish Hole size

– Environment Requirement

– Contact Reliability

• Related press-fit reliability correlation with design and transportation stress

(case study)

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Repair and Rework TWG Scope

• Technologies for second level Board Assembly process – Rework and Repair Technology forecast

– Hand Solder and PTH Rework

– Rework of New/Non-Standard Components

– Site Dressing Rework Process

– Re-Attach Rework Process

19

Repair and Rework TWG Scope

• Technologies for second level Board Assembly process – Rework of Temperature Sensitive Devices

20

Repair and Rework TWG Scope

• Technologies for second level Board Assembly process – Rework and Repair Technology forecast

Area Array and Non-Standard Package Rework

Soldering

Process Parameter Units 2011 2013 2015 2017 2023

SnPb

Maximum package

size mm 50 50 55 60 75

Minimum package

size mm 5 2 1.5 1.5 1

Smallest type of

discretes being

reworked

- 0201

(Imperial)

0201

(Imperial)

01005

(Imperial)

0201

metric

0201

metric

Minimum re-

workable pitch mm 0.4 0.4 0.4 0.3 0.3

Target delta T across

solder joints °C <10 <10 <10 <10 <10

Typical rework

profile length (time) min 8 6 to 8 6 to 8 6 to 8 6 to 8

Time Above

Liquidus (TAL) sec 45-90 45-90 45-90 45-90 45-90

Number of allowable

area array reworks at

a specific location

# 3 3 3 3 3

Type of rework

(Conv./IR/Other)

(Other is Laser and

Vapor Phase

Rework)

% 85/15 85/15 85/15 80/20 70/20/10

Type redress

approach (Non

Contact/SolderWick)

% 20/80 20/80 20/80 30/70 40/60

Type of medium

deposit for BGA

component rework

(Paste on PCB/Paste

on Part/Flux only)

(See Note)

% 40/40/20 40/40/20 40/40/20 40/40/20 40/40/20

21

Expanded Rework Section (Pb-Free)

Pb-free

Maximum

package size mm 50 50 55 60 75

Minimum package

size mm 5 2 1.5 1.5 1

Smallest type of

discretes being

reworked

- 0201

(Imperial)

0201

(Imperial)

01005

(Imperial)

0201

metric

0201

metric

Minimum re-

workable pitch mm 0.4 0.4 0.4 0.3 0.3

Target delta T

across solder

joints

°C <10 <10 <10 <10 <10

Typical rework

profile length

(time)

min 8 8 8 8 8

Time Above

Liquidus (TAL) sec 60 - 90 60 - 90 60 - 90 60 - 90 60 - 90

Number of

allowable area

array reworks at a

specific location

# 3 3 3 3 3

Type of rework

(Conv./IR/Other)

(Other is Laser

and Vapor Phase

Rework)

% 85/15 85/15 85/15 80/20 70/20/10

Type redress

approach (Non

Contact/Solder

Wick)

% 20/80 20/80 20/80 30/70 40/60

Type of medium

deposit for BGA

component rework

(Paste on

PCB/Paste on

Part/Flux only)

(See Note)

% 40/40/20 40/40/20 40/40/20 40/40/20 40/40/20

Note: The use of solder paste or tacky flux will depend on the type of component being reworked.

Paste is typically used to reduce the affect of component warpage causing Head-in-Pillow component

soldering defects during BGA and PoP part rework. In terms of ease of use and speed of rework, tacky

flux is used more even though it may have an affect first pass yield. The percentages mentioned for

Paste versus Flux medium are for BGA rework and will vary dependent on the type of part being

reworked.

22

Repair and Rework TWG Scope

• Technologies for second level Board Assembly process – Hand soldering and PTH Rework

Assembly Materials TWG

Chair: Keith Howell,

Nihon Superior

24

Assembly Materials TWG Scope

• Technologies for second level Board Assembly process

– SMT solder pastes

– BGA rework pastes

– Wave bar solder

– Wave solder fluxes

– Repair / manual soldering materials

– Underfills

– Die attach materials

– Encapsulants

– Conformal coatings

25

Assembly Materials Drivers

Increasing Component Complexity

• Increasing package density

– Smaller components with lower stand-off

– Rework and cleaning challenges

• Low component stand-off height will challenge underfill chemistries

– Fill time and voiding requirements

• Lower joint heights affect solder joint reliability

– Opportunities for new interconnect technologies and materials

• BGA components become thinner resulting in component warpage

– Head-in-pillow (HiP) defects are expected to become more prevalent

• Introduction of smaller chip components 01005 (0402 metric)

– Solder pastes to be more thermal resistant to prevent oxidation and graping defects

26

Assembly Materials Drivers

Energy Costs

• Lower energy consuming processes may become more

prevalent

• Low temperature alloy technologies to meet the market

drive for lower energy consumption in SMT

manufacturing

– Desire to lower process temperatures for higher

reliability of the PCB substrates and components

27

Assembly Materials Drivers

Environmental Concerns

• RoHS exemptions

– Telecommunications expiration in 2014 which will drive the conversion to lead-free in 2013-2015 time-frame.

• VOC-free fluxes

• Lack of RoHS regulation in US

– Conversion from SnPb to lead-free soldering material has been slower than previously predicted

– Most consumer electronics are now lead-free worldwide but industrial products for the US, aerospace, and military remain SnPb

28

• Higher fluxing power or activity to compensate for the poorer wetting as a

result of the higher surface tension of lead-free solders while mitigating tin

whiskers (due to possible corrosion) and electrical reliability concerns of

the flux on the board

• Higher fluxing capacity and lower corrosion to support the use of a finer

solder powder printing

• Greater oxidation resistance and improved wetting for the reduction of

head-in-pillow component soldering defects, mainly due to component or

board warpage

• Greater oxidation resistance to support 260°C reflow and further

miniaturized solder paste deposits, with minimal use of halogen

containing compounds in the flux

Assembly Materials R&D Needs

29

• Alloy development which promotes the formation of finer microstructures

hence a more smooth and higher reliability solder joint

• Water soluble chemistries to support cleaning requirements with 260°C

reflow

• No clean chemistries to support 260°C reflow with increased ability for

ICT probing

• No clean chemistries which are compatible with conformal coating

systems

• Flux residue compatible with vapor phase fluids to reduce contamination

of the fluids

• Low viscosity dipping paste for Package-on-Package as finer pitch

components are introduced

• Low voiding paste formulations for thermally conductive components

Assembly Materials R&D Needs

30

Assembly Materials Gaps

Parameter Definition 2011 2013 2015 2017 2023

SAC/ SAC/ SAC/ SAC/ SAC/

Modified SnCu/ Modified SnCu/ Modified SnCu/ Modified SnCu/ Modified SnCu/

Low Ag SAC Low Ag SAC Low Ag SAC Low Ag SAC Low Ag SAC

Alloy (Low Temp) Low Temp Low Temp

Alloy (Lead-free)

High Temp>260C

Halogen-free

SAC/ SAC/ SAC/ SAC/ SAC/

Modified SnCu/ Modified SnCu/ Modified SnCu/ Modified SnCu/ Modified SnCu/

Low Ag SAC Low Ag SAC Low Ag SAC Low Ag SAC Low Ag SAC

VOC Free

Halogen free

SAC/ SAC/ SAC/ SAC/ SAC/

Modified SnCu/ Modified SnCu/ Modified SnCu/ Modified SnCu/ Modified SnCu/

Low Ag SAC Low Ag SAC Low Ag SAC Low Ag SAC Low Ag SAC

Repair Gel/Pasty

Fluxes

Flux-cored Solder

WireMore Benign Left on Board Left on Board

Repair Gel/Tacky

FluxesMore Benign Left on Board Left on Board

Repair Liquid Fluxes More Benign Left on Board Left on Board

Wave Solder Flux

Flux-cored Solder

WireAlloy

Repair Liquid

Fluxes

High Temp

Bar Solder

Solder Paste

High Temp High Temp High Temp

Alloy

High Temp

Alloy

31

Assembly Materials Gaps

Parameter Definition 2011 2013 2015 2017 2023

Thermal

conductivity critical

Matched CTE

capability

High thermal

(polymer based)

paste

>30 W/m-K >50 W/m-K >100 W/m-K >100 W/m-K >100 W/m-K

JEDEC L2 @260 JEDEC L1 @260 JEDEC L1 @260 JEDEC L1 @260 JEDEC L1 @260

65 nm tech 65 nm tech 45 nm tech 45 nm tech32 and below nm

tech

Pre-applied polymer

DA to siliconJEDEC L3 @260 JEDEC L2 @260

JEDEC L2A

@260

JEDEC L2A

@260JEDEC L1 @260

Repair Adhesives Polymer Based

JEDEC L1 @260

JEDEC L1 @260

JEDEC L1 @260

JEDEC L1 @260

JEDEC L1 @260

Lead-free

compatibility

JEDEC +260 reflow,

large die, paste

JEDEC L1 @260 JEDEC L1 @260 JEDEC L1 @260

Compatibility with

Low-k ILD, paste

JEDEC L1 @260

Die Attach

Preforms

Die Attach

Adhesives

Lead-free

compatibility

JEDEC +260 reflow,

small die, paste

JEDEC L1 @260

32

Assembly Materials Gaps Parameter Definition 2011 2013 2015 2017 2023

Underfills

Lead-free FC in

package (Laminate)

BGA balls only

JEDEC L3 @

260, BGA balls

only

JEDEC L2 @

260, BGA balls

only

JEDEC L1

@260, FC bump

and BGA balls

JEDEC L1

@260, FC bump

and BGA balls

JEDEC L1

@260, FC bump

and BGA balls

Lead-free FC in

package (ceramic),

BGA balls only

JEDEC L1 @260,

BGA balls only

JEDEC L1

@260, BGA

balls only

JEDEC L1

@260, FC bump

and BGA balls

JEDEC L1

@260, FC bump

and BGA balls

JEDEC L1

@260, FC bump

and BGA balls

Low K ILD JEDEC L3 @260 JEDEC L2 @260 JEDEC L2 @260 JEDEC L2 @260 JEDEC L2 @260

90 nm tech 65 nm tech 45 nm tech 45 nm tech 45 nm tech

Pre-applied FC JEDEC L3 @260 JEDEC L2 @260JEDEC L2A

@260

JEDEC L2A

@260

JEDEC L2A

@260

Large Die 25 mm Low K 25 mm low K 30 mm low K 30 mm low K 30 mm low K

Lead-freeCompatible with

Lead-free residues

Compatible with

Lead-free

residues

Compatible with

Lead-free

residues

Compatible with

Lead-free

residues

Compatible with

Lead-free

residues

VOC-free 5-10%Increasing

Volume

Halogen-free 5-10%Increasing

Volume

Fillers Small Quantiites Small Quantiites Large Quantities Large Quantities Large Quantities

Printed Electronics Available

Imprint

TechnologiesAvailable

Reworkablle ReworkableCSP

Conformal

Coatings

Nano-materials

Pre-applied Lead-

freeReworkable Reworkable

33

Assembly Materials R&D Priorities

Solder Paste

• Next generation of solder materials for lower cost and processing temperatures

– Replacement of SAC, modified SnCu, and low silver SAC alloys

• Better characterization of the reliability trade-offs with lower silver SAC alloys and SAC (Sn3-

4Ag0.5Cu) and modified SnCu alloys.

– Silver content increases resistance to thermal cycling, while reducing silver improves

drop shock resistance

– New interconnect technologies deploying nano-materials to support decreased pitch and

increased interconnect frequencies.

• Improvement in printing technology and material development

– 0.3mm pitch CSP, 01005[0402 metric] chip, LGA/QFN/MLF, and Package-on-Package

(PoP) components

• Effect of the percentage of voiding on the thermal and electrical reliability on QFN/MLF

components.

• Process optimization of paste-in-hole or pin-in-paste with or without solder performs on thick

boards as alternatives to wave soldering

• Improved reflow wetting performance with halogen-free fluxes

34

Assembly Materials R&D Priorities

Wave Flux

• Halogen-free material which provides good hole-fill on thick boards

• Reduced residue fluxes for thick boards with improved pin testability for ICT

• Development of fluxes with benign residues without heat activation in the solder

• VOC-free (water based) no-clean wave fluxes with good hole-fill on thicker boards for lead-free wave soldering and low solder balling

• Improved flux formulations which exceed the electro-migration requirements in J-STD-004

Repair Flux

• Improvements in tacky fluxes for CSPs

• Development of fluxes with benign residues without heat activation in the solder

35

Assembly Materials R&D Priorities

Die Attach Materials

• Thermal and moisture resistant polymers

• Formulation adjustments for new lead-free solder masks

• Low thermal resistance materials

• Alternative fillers and fiber technology to improve thermal performance

• Non silver fillers to reduce cost

• Lower temperature cure to reduce assembly cost and reduce warpage for stress sensitive applications

36

Assembly Materials R&D Priorities

Conformal Coatings

• Conformal coating materials / processes which are compatible with lead-free solder materials / processes, to help mitigate lead-free issues such as tin whisker formation

• Need for investigating the compatibility and wetting of conformal coatings with various lead-free materials (mold compounds, solders, solder mask…)

• Development of a halogen-free parylene that can help mitigate tin whisker issues and be compatible with the lead-free, no clean flux systems.

• Conformal coatings for high temperature electronics and components

• Evaluation of vapor phase thin conformal coatings for various MEMS applications

• Development of composite conformal coatings materials for better barrier properties and mitigation of tin whiskers

37

Assembly Materials R&D Priorities

Nanotechnology • As the electronics industry moves forward with miniaturization and

increasing functionality, there is an escalating demand on materials performance used in the manufacture of materials used in electronics assembly

– One such method of improving the performance of some materials is the use of nanomaterials and nano-structured materials

• The US National Nanotechnology Initiative is now 11 years old; initiatives in Europe and Asia started at about the same time when the benefits of nanotechnology for a wide range of applications was recognized

• Bearing in mind the fact that it takes 7-10 years from invention for a non-disruptive new product to gain market, we are just starting to see the first applications of non-semiconductor nanotechnology reaching the market and can expect considerable growth in this sector in the next few years

38

At least one dimension in the range 1-100nm

(US National Nanotechnology Initiative, www.nano.gov)

1 nanometre = 10-9

m

= 0.000,000,001m

= 0.001µm

≈ 0.00004 mil

A nanometre is - a billionth of meter

- a thousandth of a micron

- 4 hundred thousandths of a “mil”

Nanotechnology - Size

39

1m Solder Sphere Nano Particle

12mm x 12mm

Nanotechnology - Size

40

Assembly Materials R&D Priorities

Nanotechnology

• Small nm fillers being introduced for specific performance improvements

– Mechanical strength / toughness improvements, optical clarity in filled systems, etc

• One of the most rapid areas of nanoparticle adoption is printed electronics

– Paste with nano-sized silver particles is used for solar panel interconnects, RFID and antennas as well as a range of other applications

• Next evolution beyond fillers is in commercial nano and near nano coatings

– High-release stencil coatings

– High-performance waterproofing of consumer electronics

41

Assembly Materials Concerns

• The unpredictability of the effect of potential regulations regarding conflict minerals from the Democratic Republic of the Congo (DRC) to meet Section 1502 of the Dodd-Frank Act

– The burden and cost of compliance as well as its impact on the supply and pricing of tin, the major constituent in lead-free solders

• Possible regulations affecting soldering materials, the European Commission’s REACH (Registration, Evaluation, Authorization, and Restriction of Chemical substances) law

– Technology need for higher fluxing power or activity to address the need for lead-free wetting improvement

– The possibility of additional substances being included in the REACH restriction may limit formulators

• Further understanding of lead-free solder material metallurgy, processability, and long term reliability

– Impact on the long term reliability

– Alloys with Increased reliability

Summary/Next Steps

43

Strategic Concerns

• Restructuring from vertically integrated OEMs to multi-firm supply

chains

– Resulted in a disparity in R&D Needs vs. available resources

• Critical needs for R&D

– Middle part of the Supply Chain is least capable of providing resources

• Industry collaboration

– Gain traction at University R&D centers, Industry consortia, “ad-hoc”

cross-company R&D teams

• The mechanisms for cooperation throughout the supply chain must

be strengthened.

– Cooperation among OEMs, ODMs, EMS firms and component

suppliers is needed to focus on the right technology and to find a way

to deploy it in a timely manner

• Collaboration is iNEMI’s Strength; We play an important role

44

Paradigm Shifts

• Need for continuous introduction of complex multifunctional products to address converging markets favors modular components or SiP (2-D & 3-D):

– Increases flexibility

– Shortens design cycle

• Cloud connected digital devices have the potential to enable major disruptions across the industry:

– Major transition in business models

– New Power Distribution Systems for Data Centers

– Huge data centers operating more like utilities (selling data services)

– Local compute and storage growth may slow (as data moves to the cloud)

– “Rent vs. buy” for software (monthly usage fee model)

• Rapid evolution and new challenges in energy consuming products such as SSL, Automotive and more

• Sensors everywhere – MEMS and wireless traffic!

• “More Moore” (scaling of pitch) has reached its forecast limit and must transition to heterogeneous integration - “More Than Moore”.

45

The Next iNEMI Deliverables Are Key:

Addressing the Gaps

• Technology continues to move at a faster rate of change

• Driven in many cases by short life cycle low cost yet high volume

product

• Many of these “cool new things” don’t port well or quickly to high

reliability markets such as automotive, medical, or high end

networking

• The next key deliverables from iNEMI are the 2013 Technical Plan

(available only to members) and the 2013 Research Priorities

• Effective usage and coordination behind both these documents will

be key to continued industry progress and growth

• Look for them in late 2013

– The iNEMI TIG’s, Technical and Research Committees are actively

working them NOW!

Questions

www.inemi.org Email contacts:

Chuck Richardson Chuck.richardson@inemi.org

Grace O’Malley gomalley@inemi.org

Bill Bader Bill.bader@inemi.org