+ All Categories

Booklet

Date post: 13-Mar-2016
Category:
Upload: micropacks-micropacks
View: 212 times
Download: 0 times
Share this document with a friend
Description:
Micro-PackS, R&D platform - Smart Object Innovation
Popular Tags:
3
Key ¿gures • Started in 2006 • Technology areas : micropacka- ging, printed electronics, charac- terization & failure analysis, RF pre-certification and diagnosis, component security • 600 m² clean room facilities • 200 m² characterization laboratories Mission To serve industrial and academic innovation • by sharing Expertise and state- of-the art R&D equipments • with easy access for SMEs and startups Micro-PackS, R&D platform Smart Object Innovation
Transcript
Page 1: Booklet

Key gures

• Started in 2006• Technology areas : micropacka-ging, printed electronics, charac-terization & failure analysis, RF pre-certifi cation and diagnosis,component security • 600 m² clean room facilities• 200 m² characterizationlaboratories

Mission

To serve industrial and academic innovation

• by sharing Expertise and state-of-the art R&D equipments

• with easy access for SMEs and startups

Micro-PackS, R&D platformSmart Object Innovation

Page 2: Booklet

To serve and support

Innovative academic Labs High-Tech Startups & SME’s Industrial companies

TRACEABILITYMOBILITY & SECURITY

Printed electronics

• Inkjet printing and Serigraphy• Process validation and prototyping • Flexible substrate

Micropackaging prototyping

• Process validation and prototyping• Pre-industrial production• Standard and fl exible packaging

Sharing

• Equipment• Skills• Innovation costs and risks

Innovation

• New generation of smart objects• High tech processes available• Cycle development acceleration

Added values

• Intelectual property service• Client retained ownership• Close cooperation• Access to professional networks

www.pf-micropacks.

Types of delivered services

Equipment access & expertise or complete integrated service

On demand Prepaid packages Membership

ENVIRONMENT HEALTH & WELLNESS

RF pre-certi cation and diagnosis

• Identifi cation card and passport• NFC Mobile phone, transport and payment• HF and UHF RFID tag and reader

Component security

• Advanced attack tool • Tamper resistant circuit validation

Package characterization and failure analysis

• Metrology • Imaging (X-ray, SEM, AFM, acoustic…)• Electrical, chemical & material parameters• Climatic characterization

.org

Page 3: Booklet

Staff of ce, clean rooms and security laboratoryCentre of Microelectronics in Provence, GardanneEcole nationale supérieure des Mines de Saint-Etienne880, route de mimetF-13541 GardanneFRANCE

HF/NFC laboratoryISEN Toulon (IM2NP)Maison des TechnologiesPlace Georges PompidouFRANCE

UHF laboratoryAix-Marseille Université (IM2NP)Universitary Polytechnics school of MarseilleMicroelectronics and Telecommunications DepartmentTechnopôle de Château-Gombert38, rue Fréderic Joliot-CurieF-13451 Marseille cedex 20FRANCE

Contact

Tel: 04 42 61 66 00FAX: 04 42 61 65 [email protected]

[email protected] realization thanks to F2I-UIMM support

A SCS competitiveness cluster platform,Coordinated by ARCSIS

FRANCE

A SCS titi l t l tf

Réa

lisat

ion :

NC

N C

omm

unic

atio

n

mberte Contact

Tel: 04 42FAX: 04 4contact@p

www.pf-micropacks.org


Recommended