Date post: | 20-Jan-2017 |
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Brazilian Semiconductor Scenario and Opportuni3es
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Jacobus W. Swart
Imec, Leuven, Belgium and
UNICAMP, Campinas, Brazil
Outline 1. Introduc3on 2. Main Actors
1. Universi3es, Ins3tutes, INCT’s 2. IC Design Houses 3. Semiconductor Fabs 4. Value Chain Services
3. Government Support 4. The ASIC Ecosystem for Innova3on 5. Imec IC-‐Link 6. Conclusions 2
1. Indroduc3on • Brazil -‐ a fast adopter:
• R&D at ITA and USP in the 50’s • First plant by Philco in São Paulo for diodes and transistors in the 60’s
• Many back-‐end plants for discrete devices a]er the 60’s
• Microelectronics Labs: • LME/USP – end of 60’s • In the 70’s: LED and LPD at UNICAMP and CPqD
• Industries in the 80’s: • Discrete devices: Semikron, Aegis, Icotron + many back-‐end’s • IC’s: SID Microeletrônica (front-‐end, back-‐end, Design), Itaucom (back-‐end, Design), Elebra (Design)
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ROM 2 k Bit, 1978, nMOS (LME, EPUSP)
90’s
• Opening of boarders for import • Deindustrializa3on started • Increasing electronics trade deficit • But con3nuous R&D at academy.
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2000’s
• New industrial policies • New lows and incen3ves • Airac3on of new industries: front-‐end and back-‐end
• IC Brazil program: DH’s and training
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2. Main Actors
1. Universi3es, Ins3tutes, INCT’s 2. IC Design Houses 3. Semiconductor Fabs
4. Value Chain Services
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2. Main Actors – Universi3es & Ins3tutes • Fabrica3on: Materials and Processes
– Silicon based: USP, UNICAMP, UFRGS, UFPE – III-‐V based: USP, UNICAMP, PUC-‐RJ, UFMG – Ins3tutes: CBPF, CETENE, CTI, INPE and LNNano
• IC Design and EDA tool: – FEI, ITA, PUC-‐RS, UFAM, UFCG, UFMG, UFPE, UFPel,
UFPB, UFPR, UFRGN, UFRGS, UFRJ, UFSC, UFSM, UnB, UNESP, UNICAMP, UNIFEI, UNIPampa, Univali, USP
• Photonic IC – ITA, CTI, UNICAMP, USP and others
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Centro de Componentes Semicondutores – UNICAMP ( www.ccs.unicamp.br)
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Gap 120 nm
With resonant frequency of 1.55 µm Without resonant frequency
• control separately ion energy (RF power) and ion flux (µW power). • operate at low pressure (1-‐100 mTorr) ⇒ reduce ion surface spuiering • A 2.45GHz µW source generates the plasma at high power • A 13.56 MHz RF power source biases separately the sample chuck.
ECR (Electron Cyclotron Resonance)
ECR System
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E-‐beam lithography
Electron Lithography within 10 nm resolu3on;
Nano photonics; NanoFETs
Centro de Componentes Semicondutores – UNICAMP ( www.ccs.unicamp.br)
2.1 Main Actors – INCT networks • INCT NAMITEC
– 124 researches, 23 ins3tu3ons – Silicon micro and nanoelectronics systems – Concluded degrees (6.5 years): 120 PhD, 300 MSc – 600 papers ISI journals, 1500 papers at conferences
• INCT DISSE – 12 researchers, 8 ins3tu3ons – III-‐V semiconductor devices
• INCT INEO – 42 researchers, 26 ins3tu3ons – Organic electronics & optoelectronics
• FOTONICOM 12
2.2 Main Actors – IC Design Houses Ins2tu2on Aprox number of Designers Loca2on CEITEC 70 Porto Alegre CETENE 20 Recife Chipus 25 Florianópolis CIMATEC/Senai Salvador CPqD 30 Campinas CTI 30 Campinas DFChip 10 Brasília Eldorado 50 Campinas Idea! 12 Campinas LSITec 40 São Paulo NXP 145 Campinas SiliconReef 10 Recife Unitec 60 Ribeirão das Neves Von Braun 20 Campinas 13
2.2 Main Actors – Training Centers • One year intense training program – based on Cadence material and tools.
• One year on the job training • Support by MCTI through CNPq and FINEP • Two training centers:
– CT1 at UFRGS, Porto Alegre – CT3 at USP, São Paulo.
• Now in danger due to lack of budget.
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2.3 Main Actors – Semiconductor Fabs
Company Ac2vity Loca2on BrPhotonics Photonic IC’s Campinas CEITEC SA Front-‐end CMOS + Fabless Porto Alegre HTMicron Back-‐end memories São Leopoldo Mul3laser Back-‐end memories Extrema Semikron Power discrete devices Carapicuiba Smart Back-‐end memories A3baia SUNEW OPV Belo Horizonte Unitec Front-‐end CMOS Ribeirão das Neves
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2.4 Main Actors – Value Chain Aggregators
• Imec Representa3ve Office Brazil – access to foundries, packaging, tes3ng, logis3cs, consultancy, training
• FastCompany Brazil – represent ARM and Synopsys. • Other providers of services:
– directly abroad
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3. Governmental Support • Incen3ves lows:
– PADIS – Informa3cs Low – Lei do Bem – Portaria 950
• Project funds, loans and equi3es: – BNDES, BNDESPar – FINEP – FAPESP: PIPE and PITE programs – FUNTELL and other agencies. – Embrapii
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4. The ASIC Ecosystem for Innova3on
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ASICs – Applica3on Specific IC’s • ASICs are needed in many applica3ons :
– High volumes (consumer) – Portability (medical, consumer, ...) – Large SoC – Mixed Signal ICs – Low Power (Baiery applica3ons) – Sensor applica3ons – IoT – Confiden3ality – .... Those applica3ons where unit cost is not an issue at low volumes, ex. High-‐end servers, high performance computers, space, ...
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Use of FPGA vs ASIC • Economical only for few thousands of units • Technical solu3on only if power and size is no concern.
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Use of ASSP vs ASIC • Semiconductor market numbers 2012
• Brazil: product development mainly with ASSP • Great opportunity and importance for ASIC for similar to interna3onal innova3on level
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Semiconductor Market 2012
World US$ Bi1
% Brazil US$ Bi2
Total 299,9 100 5,1 ASSP 83,7 28 ~x ASIC 21,3 7,1 ~0,0x ASIC/ASSP ra3o 0,25 25 ~ 0
1 Gartner 2 ABINEE + MDIC
Up-‐coming revolu3on: power consump3on dilemma!!!
• Mobile products • Dependence on power harves3ng sources • Need for very low power ASICs (FPGA are not viable and ASSP are not op3mized for each case)
• Need for large quan3ty of skilled IC designers • Educa3on, training programs and MPW access is essen3al to par3cipate and be successful.
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Consumer, compu3ng, telecom and mobile have driven semiconductor usage
In terms of volume, they s3ll do today
Market Evolu3on
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Innova3on was driven mainly by large companies
SMEs in suppor3ng mode
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Security, Medical & Wearables, Smart Home, Smart Car, Vision, Industrial, and …. IoT The new growth markets
Segmenta3on and differen3a3on
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Very difficult to navigate for large companies
Playground for many SMEs
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“Innova.on is usually with people who are small and gi9ed with a good idea.”
Chris Neil, Maxim Senior Vice President, Industrial and Medical Solu.ons Group
• Innova3on in this new and segmented market is diverse
• Change occurs through collec3ve interac3on • SME’s apply collabora3ve research, and
find crea3ve funding methods • We observe a strong 2011-‐2015 increase in ASIC demand by SMEs, reversing a decade
long decline • Differen3a3on and IP protec3on provided by ASICs are main incen3ves • “Substream Innova2on” is the collec3ve SME innova3on ac3vity
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Observing substream flows
Radio access Automo2ve
Datacom
Connected
home
Imaging & Vision Systems
Security
Innovation Domains
Medical & Wearables
Industrial
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RF de
sign complexity
BB design complexity
.6
11ac
11ah
-‐MTC
2G 3G
11ad
11n
Playground for SME’s
Radio access
Micro projector
Drones
BSI
X ray
Strong center of vision expertise around Leuven
Touchless interac3on Video processor unit
IP camera Hyperspectral
Imaging and Vision Systems
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Medical & Wearables
… many of them developed by
SME’s
From “hearing aids” to a myriad of devices
ULP radios, and ULP design technology
for baiery operated wearables
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Medical & Wearables
(UK)
(F, HKG)
(NL)
(I)
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Industrial
Connected home
Source : Greenpeak, at GSA Munich 2014
Many technologies and more emerging Technology in essence “not yet” affordable
but….
25$ ultimate IoT module
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Industrial
Industrial
Li-‐Fi
Vehicle M2M Agricultural surveillance
Shelf tag labels
Localiza3on
Livestock Management
Smart shopping cart
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How can European SMEs be succesful?
Suppliers
FOUNDRIES
EDA
ASSEMBLY
TEST
IP
PBA/PCB
Large system
companies
Local m
arket
IDM Plessey, Philips,
Siemens, Nokia, ...
300 SMEs
Government support • Financial s3mula3on to innovate • Support training of good engineers at academia, R&D centers, design
houses, SMEs • Easy and affordable access to CAD tools and IC prototyping • Create VC friendly climate to create SMEs
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How can European SMEs be succesful?
300 SMEs
Suppliers
FOUNDRIES
EDA
ASSEMBLY
TEST
IP
PBA/PCB
Design houses & IP houses Large
system companies
Local m
arket
WORLD MAR
KET
5. Imec IC-‐LINK – ASIC services
• MPW and assembly services to universi3es and companies (called “Europrac3ce”)
• Access to TSMC technologies for prototyping and volume produc3on through VCA partnership with TSMC
• Prototyping and volume : Assembly and Test – Design services
• RTL or netlist to GDS2 place and route – physical design
– Over 500 IC tape-‐outs per year – PBA services, failure analysis and packaging design – Integrated photonic solu3ons (wafers & packaging) – First ac3vi3es in 1984
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Imec IC-‐link -‐ The team • 80 (now 95) people team of business developers, logis3c wizards
consultants and technical support experts – 25 in ASIC prototyping and manufacturing services – 25 in ASIC design services – 12 in assembly, test and qualifica3on – 10 in business development and technology consultancy – 8 in PCB/PBA services, failure analysis and advanced packaging design
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What our customers typically need
– Access to leading edge technology at affordable cost – Prototyping with MPW and MLM – Advise in technology selec3on – Flexibility in business model : from COT to FTK – Logis3cs and opera3on support – Assembly, test and cer3fica3on services – Trusted supply chain partner – PCB/PBA technology and design know how – Access to leading edge IP
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IC-‐link as service provider
Funding associations
Foundries and IC Technologies
IHP (Germany)
IHP SGB25V 0.25µ SiGe:C IHP SGB25VGOD 0.25µ SiGe:C IHP SG25H1 0.25µ SiGe:C IHP SG25H3P 0.25µ complementary SiGe:C IHP SG25H3 0.25µ SiGe:C IHP SG13B SiGe:C Bipolar/Analog IHP SG13S SiGe:C Bipolar/Analog/CMOS IHP SG13C SiGe:C CMOS 7M/MIM
ON Semi (Belgium + USA)
0.7µ CMOS A/D 2M 0.5µ CMOS A/D 3M 0.35µ CMOS A/D 5M 0.7µ CMOS A/D I2T100 0.7µ CMOS A/D I2T30 0.35µ CMOS A/D I3T80/50/25 0.5µ CMOS C5 EEPROM
0.8µ CMOS A/D 0.6µ CMOS A/D 3M 0.35µ CMOS A/D 4M 0.8µ CMOS 50V 0.35µ SiGe BiCMOS 4M 0.35µ CMOS 50V 0.35µ CMOS OPTO 0.18µ CMOS + HV
ams (Austria)
TSMC (Taiwan)
0.25µ CMOS L/MS/RF 0.18µ CMOS L/MS/RF 0.13µ CMOS L/MS/RF 90nm CMOS L/MS/RF 65nm CMOS L/MS/RF 40nm CMOS L/MS/RF
UMC (Taiwan)
0.25µ CMOS L/MMC/RF 0.18µ CMOS L/MMC/RF 0.13µ CMOS L/MMC/RF 90nm CMOS L/MMC/RF 65nm CMOS L/MMC/RF CIS : 0.18µ
ARM/Ar3san (USA)
Cell libraries and design kits for TSMC and UMC technologies
Faraday (Taiwan)
Cell libraries and design kits for UMC 0.25, 0.18, 0.13µ, 0.11µ, 90nm & 65nm CMOS
Selec3on criteria
Well-‐known foundry
Partnership
Flexible prototyping
Small + medium volume
Silicon photonics, MEMS Foundries
Si310-PH
PiezoMUMPs
MetalMUMPs
SOIMUMPs
PolyMUMPs
Si substrate
WaveGuide
SiO 2 Si
FiberCoupler PSV
ISIPP25G+
SG25_PIC
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High speed photonics
Low volume access at affordable cost
Prot
otyp
ing
cost
Launch flexibility
1
~0.8
~0.1
~0.025
Full Mask Size : ~ 20x30 mm
Any time
MPW Size : per sqmm MPW schedule
mini Size : per subblock Selected runs from MPW schedule
MPW
MPW MPW
MPW MPW
mini
mini MPW
Size : ~ 10x15 mm Any time
MLM
MLM
Source : TSMC
Schema2c Driven Layout
Layout
Device Models
GDS
Electrical simula2on
EM simula2on
Process varia2on simula2on
Electro-‐Op2cal simula2on
LVS
DRC
LFD
Op2cal proximity correc2on
Silicon Thickness (nm)
PROCESS DESIGN KIT: PDK
IP por|olio • TSMC IP por|olio
– Std cells, IOs, memory compilers, PLL, PHY’s, ... – Can be requested in TSMC online – Either free or under license agreement
• Imec IP – State of the art IP – Ranging from system IP to advanced building blocks, e.g.
• So]ware Defined Radio IP • Low power ADC
– Various process technologies including state of the art – Deliveries and business models tuned to your need
• 3rd party IP – Preferred pricing for some 3rd party IP providers
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Assembly services – Access to best in class packaging houses
• Prototypes
• Produc3on volumes
– Imec team of assembly specialists • Selec3on, customiza3on of package, simula3ons, ...
– Wide range of produc3on and prototype packages • Plas3c and ceramic • Open tool: QFN, aQFN (Mul3 row), QFP, CQFP, ... • Customized packaged: xxBGA, WLCSP, aWLP, ...
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Test and qualifica3on – Test hardware and so]ware development – Debugging and characteriza3on – Qualifica3on & Failure analysis – Produc3on volume tes3ng – Yield op3miza3on – Near-‐sourcing for efficient test program
development and small volumes produc3on :
– Global partners for high volume projects :
– Qualifica3on experience mainly in Aerospace [ESCC9000, ESCC2269000], Industrial and Medical
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Test facility and capabili3es
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Hatina
Teradyne Microflex Quad Site
Teradyne I-flex Teradyne J750
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Broaden your mind Strengthen your skills discover our por|olio @ www.imecacademy.be
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Home About Find training Training calendar Quick links & FAQ Contact Home About Find training Training calendar Quick links & FAQ
Version: 15.2.0.153 Powered by Cornerstone OnDemand, Inc. ©2000-2014
All Rights Reserved. Terms - Privacy - Cookies
CMOSProcess stepsPackaging & 3DMemoriesMicrosystems & MEMSMaterialsModelingCharacterization &reliability
PhotonicsBeyond CMOS
Digital designAnalog & RFElectronics design &manufacturing
Modeling of circuits &systems
EnergyBiomedical systemsVision systemsWireless systemsSensor systemsLarge Area Electronics
GET TO KNOW IMEC
INNOVATION AND RESEARCH MANAGEMENT
Search
REGISTER for our newsletter For full offer LOGIN
▸ Established in 1984 ▸ Largest independent R&D ins3tute in Europe ▸ Total 2015 revenue of 415 M€
▸ > 2400 people ▸ published 998 prominent scien3fic papers
▸ filed a record number of 180 European patents
IMEC
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Office USA San Francisco
Belgium Leuven The Netherlands Eindhoven
China Shanghai Office Japan
Tokyo Taiwan
Hsinchu India
Bangalore
Worldwide presence
Office Brazil Campinas
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IMEC ac3vi3es
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MEMS, Sensors,
Photonics
HETEROGENEOUS INTEGRATION
Lithography Devices Interconnects
CORE CMOS FLEXIBLE ELECTRONICS
INTERNET OF HEALTHY THINGS
BAN Life sciences
INTERNET OF POWER
Photovoltaics Power devices
INTERNET OF THINGS
Sensing & connectivity solutions
INDUSTRIALISATION FOUNDRY ACCESS TO >300 SMEs AND >700 ACADEMIA TAPES-OUT MORE THAN 500 IC DESIGNS PER YEAR
Imec IC-link
6. Conclusions • A considerable semiconductor ecosystem has developed in Brazil.
• Governmental industrial policies and incen3ves are of paramount importance for the deployment of the semiconductor sector.
• The new uprising markets offer great opportunity for development of new components and products for Brazilian enterprises, also SME’s.
• Access to interna3onal broad range of technologies and services are needed to fulfill the needs for innova3ve and compe33ve products.
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• Contacts: – [email protected], – [email protected]
• Sorry for possible mistakes and/or omissions. • Acknowledgment to Carl Das and Paul Malisse from IMEC for sharing some slides
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