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f Important Notice on Product SafetyDANGER - RISK OF ELECTRICAL SHOCK OR DEATH - FOLLOW ALL INSTALLATION INSTRUCTIONS.
The system complies with the standard EN 60950 / IEC 60950. All equipment connected to the system must
comply with the applicable safety standards.Hazardous voltages are present at the AC power supply lines in this electrical equipment. Some components may
also have high operating temperatures.Failure to observe and follow all installation and safety instructions can result in serious personal injury
or property damage.
Therefore, only trained and qualified personnel may install and maintain the system.
The same text in German:
Wichtiger Hinweis zur Produktsicherheit
LEBENSGEFAHR - BEACHTEN SIE ALLE INSTALLATIONSHINWEISE.
Das System entspricht den Anforderungen der EN 60950 / IEC 60950. Alle an das System angeschlossenenGerte mssen die zutreffenden Sicherheitsbestimmungen erfllen.
In diesen Anlagen stehen die Netzversorgungsleitungen unter gefhrlicher Spannung. Einige Komponentenknnen auch eine hohe Betriebstemperatur aufweisen.Nichtbeachtung der Installations- und Sicherheitshinweise kann zu schweren Krperverletzungen oder
Sachschden fhren.
Deshalb darf nur geschultes und qualifiziertes Personal das System installieren und warten.
Caution:
This equipment has been tested and found to comply with EN 301489. Its class of conformity is defined in tableA30808-X3247-X910-*-7618, which is shipped with each product. This class also corresponds to the limits for aClass A digital device, pursuant to part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference when the equipment isoperated in a commercial environment.This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accor-
dance with the relevant standards referenced in the manual Guide to Documentation, may cause harmful inter-ference to radio communications.
For system installations it is strictly required to choose all installation sites according to national and local require-ments concerning construction rules and static load capacities of buildings and roofs.For all sites, in particular in residential areas it is mandatory to observe all respectively applicable electromagnetic
field / force (EMF) limits. Otherwise harmful personal interference is possible.
Trademarks:
All designations used in this document can be trademarks, the use of which by third parties for their own purposescould violate the rights of their owners.
Copyright (C) Siemens AG 2003.
Issued by the Information and Communication Mobile Group
Hofmannstrae 51
D-81359 Mnchen
Technical modifications possible.
Technical specifications and features are binding only insofar as
they are specifically and expressly agreed upon in a written contract.
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ITMN:BTSE BS 60
Reason for Update
Summary:
Second Edition for Release BR 7.0
Details:
Chapter / Section Reason for Update
4.1 Frequency / Channel Conversion Tables Deleted,
with General Reference to TED:BSS Common
Issue History
Issue
Number
Date of Issue Reason for Update
1 07/2003 First Edition for New Release BR 7.0
2 12/2003 Second Edition for Release BR 7.0
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ITMN:BTSE BS 60
This document consists of a total of 138 pages. All pages are issue 2.
Contents
1 Installation Test. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
1.1.1 Aims of Installation and Commissioning . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
1.1.2 Optional Measurements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
1.1.3 Using the ITMN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
1.1.4 Safety Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
1.2 Visual Inspection of BTSE Mechanics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
1.2.1 Rack Front View of BS 60. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
1.2.2 Mounting and Installation of BTSE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
1.2.3 Check of BTSE Modules. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
1.2.4 Antenna and Feeder Cables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
1.2.5 Module HW Coding. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
1.3 Visual Inspection of BTSE Electrics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
1.3.1 Polarity of DC Input and Tolerance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
1.3.2 Fuses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
1.3.3 Temperature Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
1.3.4 External Alarms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
1.3.5 DC Connector for Network Termination (NT) . . . . . . . . . . . . . . . . . . . . . . . 20
1.3.6 Serial Interface Connector SER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
1.4 Visual Inspection of BTSE Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
1.4.1 External Interfaces of BS 60 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
1.4.2 STAR / LOOP / MULTIDROP / CROSS CONNECT Connections . . . . . . . 211.4.3 Antenna Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
1.4.4 RF Rack Cabling. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
1.4.5 RF System Cabling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
1.4.6 Exchangeable Devices on Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
1.5 Preparation for Offline Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
1.5.1 Recommended Test Equipment and Tools. . . . . . . . . . . . . . . . . . . . . . . . . 46
1.5.2 Preparation and Presetting of Test Equipment. . . . . . . . . . . . . . . . . . . . . . 49
1.5.3 BTSE Power ON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
2 Task List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
3 Procedures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 553.1 SW Download and Activation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
3.2 Setting the Rack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
3.3 Hardware Related Managed Objects . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
3.4 HYCOM/DUCOM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
3.5 FICOM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
3.6 BBSIG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
3.7 ALCO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
3.8 CCLK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
3.9 FAN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
3.10 GPSU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
3.11 LI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
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3.12 PA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
3.13 RXAMOD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
3.14 RXMUCO/RXAMCO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
3.15 TPU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 883.16 Creating the Alarm Configuration (ENVABTSE) . . . . . . . . . . . . . . . . . . . . . 91
3.17 Setting the BTSE Attributes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
3.18 BPORT. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
3.19 XCONNECT. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
3.20 BTSM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
3.21 LAPDLE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
3.22 Checking the State of all Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
3.23 Replacing Failed HW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
3.24 External Alarm Check . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
3.25 Generating BTS Backup Files . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
3.26 Remote Inventory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1093.27 BTSE Phase 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118
3.28 Setup for Optional RF-Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
3.28.1 Measuring Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
3.29 Spectrum Analyzer Measurements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
3.30 VSWR Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
3.31 RFI Confirmation: Unit Acceptance Test Manual (ATMN) . . . . . . . . . . . . . 124
4 Tables, Lists and Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
4.1 Frequency / Channel Conversion Table. . . . . . . . . . . . . . . . . . . . . . . . . . . 126
5 Appendix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
5.1 Possible Configurations for Offline Tests . . . . . . . . . . . . . . . . . . . . . . . . . . 127
5.1.1 DUCOM - Cell Configuration Rules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
5.1.2 Possible Test Configurations for DUCOM . . . . . . . . . . . . . . . . . . . . . . . . . 128
5.1.3 Examples for DUCOM Test Configurations . . . . . . . . . . . . . . . . . . . . . . . . 129
5.2 Binary-HEX-Decimal Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
5.3 Power/Level Conversion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
5.4 Used Expressions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
5.5 Module Identification by Inventory Data and Label . . . . . . . . . . . . . . . . . . 133
6 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135
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Illustrations
Fig. 1.1 Installation Test Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Fig. 1.2 ESD Symbol. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Fig. 1.3 CE Symbol / UL Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Fig. 1.4 Six Carrier BTSE BS 60. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Fig. 1.5 Fuse Panel / Connection Board for 11 Fuses . . . . . . . . . . . . . . . . . . . . 18
Fig. 1.6 Fuse Panel / Connection Board for 12 Fuses . . . . . . . . . . . . . . . . . . . . 19
Fig. 1.7 RCAP BS 60 (Top View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Fig. 1.8 Star / Loop / Multidrop / Cross Connect Configurations. . . . . . . . . . . . . 22
Fig. 1.9 HYCOM (Vertical Type) Antenna Connection . . . . . . . . . . . . . . . . . . . . 23
Fig. 1.10 DUCOM Antenna Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Fig. 1.11 RX Antenna Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Fig. 1.12 RXAMOD (Bottom View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Fig. 1.13 RF System Cabling HYCOM/RXMUCO. . . . . . . . . . . . . . . . . . . . . . . . . 28
Fig. 1.14 RF System Cabling DUCOM/RXAMCO. . . . . . . . . . . . . . . . . . . . . . . . . 29
Fig. 1.15 Arrangement of FICOM Modules in 1-Cell Configuration . . . . . . . . . . . 30
Fig. 1.16 Arrangement of FICOM Modules in 2-Cell Configuration . . . . . . . . . . . 31
Fig. 1.17 Arrangement of FICOM Modules in 3-Cell Configuration . . . . . . . . . . . 32
Fig. 1.18 ALCO (Top View). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Fig. 1.19 LI; Variant 1 (Top View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Fig. 1.20 LI; Variant 2 (Top View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Fig. 1.21 LI; Variant 2 (Submodule) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Fig. 1.22 LIPA (Top View). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Fig. 1.23 Switches for Line Impedance Matching (PCM30 120 ) . . . . . . . . . . . . 41
Fig. 1.24 Switches for Line Impedance Matching (PCM30 75 ) . . . . . . . . . . . . . 41
Fig. 1.25 Switches for Line Impedance Matching (PCM24 100 ) . . . . . . . . . . . . 41
Fig. 1.26 RXMUCO (Top View). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Fig. 1.27 RXMUCO2 (Top View). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Fig. 1.28 RXAMCO (Top View). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Fig. 3.1 Measurement Setup. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
Fig. 3.2 Used Pins at the Trigger Adapter (TAD-Plug) . . . . . . . . . . . . . . . . . . . 120
Fig. 3.3 Spectrum Analyzer HP 8954A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
Fig. 5.1 Possible DUCOM Configurations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
Fig. 5.2 Test Configuration for DUCOM 2:1 Serving 1 Cell with 1 Carrier . . . . 129
Fig. 5.3 Test Configuration for DUCOM 2:1 Serving 1 Cell with 2 Carriers . . . 130
Fig. 5.4 Labels and Inventory Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133
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Tables
Tab. 1.1 Module HW Code Keys. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Tab. 1.2 ENVABTSE Instances and Corresponding Signal Names . . . . . . . . . . . 19
Tab. 1.3 RF Cabling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Tab. 1.4 Exchangeable Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Tab. 1.5 Boot Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Tab. 1.6 Software Images SWI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Tab. 1.7 ALCO Switch Settings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Tab. 1.8 Positions of Contacts for PCM30 120 . . . . . . . . . . . . . . . . . . . . . . . . . 41
Tab. 1.9 Positions of Contacts for PCM30 75 . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Tab. 1.10 Positions of Contacts for PCM24 100 . . . . . . . . . . . . . . . . . . . . . . . . . 41
Tab. 1.11 HYCOM Jumper . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Tab. 1.12 Jumper Positions on RXMUCO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Tab. 1.13 DIP Switch Configuration Versus RF Attenuation. . . . . . . . . . . . . . . . . . 44
Tab. 1.14 BS 60 Fuses (Fuse Panel with 11 Fuses). . . . . . . . . . . . . . . . . . . . . . . . 50
Tab. 5.1 Type of DUCOMs for the 6 Carrier BTSE . . . . . . . . . . . . . . . . . . . . . . . 127
Tab. 5.2 FICOM Modules Needed Depending on Carriers in the Cell . . . . . . . . 127
Tab. 5.3 Binary-HEX-Decimal Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
Tab. 5.4 Power Conversion Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
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ITMN:BTSE BS 60
1 Installation Test
1.1 Introduction
1.1.1 Aims of Installation and Commissioning
Installation and Commissioning is based on an extensive and high quality final factory
test. In the factory each module is tested during its production process. The final factory
test measures all RF parameters such as power- and modulation spectrum in the com-
plete BTSE rack in customer configuration.
Due to these assumptions the installation test can be concentrated on a functional test
of the delivered HW.
The installation and commissioning of a network element followed by unit acceptance is
proof of:
It is assumed that:
The subdivision of tests in the steps
final factory test
installation/commissioning (HW-test)
network integration (data base test)
allows a quick, economical and reliable commissioning procedure.
This is according to the requirements for modern communication systems regarding
self-tests, as well as a quick and economic commissioning procedure. Since the func-
tion test is based on self-test routines, a high degree of reliability is achieved.
1.1.2 Optional Measurements
RF- (Radio Frequency) measurements can be performed by means of spectrum analyz-
ers or other BS-testers and may be used as an option for locating suspected faults.They need not be done in every BTSE as regular measurements.
1.1.3 Using the ITMN
1.1.3.1 Required Knowledge
Only trained personnel should carry out the installation and installation tests.
The SIEMENS training center offers the necessary courses.
Correct, complete delivery according to network planning and the customer
order.
Correct mechanical and electrical installation according to the installation
documents.
The correct functioning of the the supplied HW
(correct functioning of the NEs at an interface to other network elements)
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1.1.3.2 Test Equipment
The test equipment and tools required for the tests are described in the corresponding
chapters.
1.1.3.3 Procedure in the Event of Faults after Commissioning
If faults occur in online operation they should be localized and cleared in accordance
with the instructions in the Maintenance Manual (MMN:BTSE BS 60).
1.1.3.4 Procedure in the Event of Faults not Described in the UMN
First the most experienced person in the installation team should try to clear the fault. Ifthe installation technician is not able to eliminate serious faults, a fault report must befilled in, providing the following information in detail:
description of the test step attempted
description of the system response
description of any system activities taking place at the same time, e.g. work done by
other testers during modifications to hardware or software
The fault report must be sent to the Technical Assistance Center (TAC).
1.1.3.5 Dealing with Defective Modules
If a module proves to be defective, it should be sent to the repair center in an appropriatepacking with the following information:
Name and code of the site
Name and code number of the module Description of the fault
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1.1.3.6 Installation Test Sequence
Fig. 1.1 Installation Test Sequence
Visual Checkof BTS Mechanics
Visual Check
of BTS Electrics
Visual Checkof Boards
Preparation for
Function Tests
Execution ofFunction Tests
VISUAL
CHECK
O
FFLINE
ONLINE
S T A R T
E N D
Preparation /Executionof Online Tests
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1.1.4 Safety Instructions
1.1.4.1 Electrostatically Sensitive Components
General
Most system modules contain electrostatically sensitive devices (ESDs) and therefore
must be handled with extreme care.
All modules which contain ESDs are marked with the ESD symbol.
Fig. 1.2 ESD Symbol
Rules for Handling
The following safety instructions are to be obeyed:
Personnel should avoid wearing synthetic clothing and shoes with plastic soles, as
these encourage the build-up of electrostatic charge.
Before handling modules, personnel should be discharged of electrostatic charging.
For this reason personnel should always put on a grounded wrist strap before chang-
ing a module.
ESDs should not be brought in contact with electrostatically charged or chargeable
objects. ESDs should only come in contact with high valued discharging material ("gentle"
discharching ), i.e. should not be made subject to "harsh" discharging with, for ex-
ample, a metal plate.
ESDs should be set down on grounded surfaces only (flexible bases with a ground-
ing connection for servicing purposes)
ESDs should not be brought into the vicinity of strong DC electrical fields, e.g. cath-
ode ray tubes/monitors (safety distance at least 10 cm / 4 inches).
All tools and test equipment should be discharged of electrostatic charging before
handling modules.
ESDs should only be transported in appropriate packing. A grounded wrist strap
must be put on before removing ESDs.
Modules should only be touched by their edges. Components or printed circuits
should not be touched.
1.1.4.2 System Voltages
All the system units require a power supply of ~230 V, which are converted to -48 V DC
(positive pole grounded). Some parts are supplied with the line voltage directly and are
to be handled with safety tools and with extreme care.
Only trained personnel should carry out those jobs.
Care must be taken because some parts heat up to a high operating temperature.
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This warning must appear in the original German text:
Alle Systemeinheiten bentigen eine Wechselspannung von 230 V, die in eine Gleich-
spannung von - 48 V (positiver Pol an Masse) umgesetzt wird.
Einige Teile fhren Netzspannung und sind mit besonderer Sorgfalt zu behandeln. Nurausgebildetes Personal darf entsprechende Arbeiten bernehmen.
Weiterhin ist zu beachten, dass sich einige Bauteile stark erhitzen.
1.1.4.3 Changing Fuses
Fuses may only be changed by the operater. Only those fuses declared allowable in the
manual may be used. Fuses are to be changed as described in the manual MMN:BTSE
BS 60.
1.1.4.4 Grounding of Modules / Racks
All modules must be plugged in correctly to ground them before power is switched on.Ground connections between racks must be plugged in correctly.
1.1.4.5 Handling Moist Modules
After storage in a humid environment, modules with condensation moisture must be
dried before they are used. This is important because otherwise the modules may be
damaged or destroyed.
1.1.4.6 CE and UL Declaration of Conformity
Fig. 1.3 CE Symbol / UL Symbol
The CE and UL declaration of conformity for the product will be fulfilled if the setup and
cabling is carried out in accordance with the specification in the manual and the docu-
mentation listed there, such as mounting instructions, cable lists etc..Wherever necessary, account should be taken of project-specific documentation.
Deviations from the specifications or arbitrary changes during setup, such as use of ca-
ble types with lower screening values, for example, can lead to a violation of the CE re-
quirements. In such cases the CE declaration of conformity is invalidated and the
responsibility passes to the person who has caused the deviations.
1.2 Visual Inspection of BTSE Mechanics
A visual inspection must be performed for all delivered racks in order to make sure that
these racks are not damaged and the quantity and location of the modules is correct.
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1.2.1 Rack Front View of BS 60
Fig. 1.4 Six Carrier BTSE BS 60
BBSIG0
BBSIG1
BBSIG2
BBSIG3
BBSIG4
BBSIG5
SIEMENS
CB FP
MCLK0
CCTRL0
LI0
ALCO0
GPSU 0
FAN 0
FAN 1
FAN 2
Air Filter
DCPA0
DCTPU
0
DCPA1
DCTPU
1
DCPA2
DCTPU
2
DCPA3
DCTPU
3
DCPA4
DCTPU
4
DCPA5
DCTPU
5
PA0
TPU
0
PA1
TPU
1
PA2
TPU
2
PA3
TPU
3
PA4
TPU
4
PA5
TPU
5
RXMUCO0
RXMUCO1
RXMUCO2
RXMUCO3
RXMUCO4
RXMUCO5
RXMUCO6
RXMUCO7
ACOM 0 ACOM 1 ACOM 2
EXACO0
RFLB
OBIX0
OBIX1
OBIX2
MCLK1
CCTRL1
LI1
RXAMOD
5
RXFIL
5
RCAP
RXAMOD
4
RXAMOD
3
RXAMOD
2
RXAMOD
1
RXAMOD
0
RXFIL
4
RXFIL
3
RXFIL
2
RXFIL
1
RXFIL
0
99
S001...S006
98
D002...D012
ACOMx can be:- HYCOMx- DUCOMxor FICOMx
RXAMOD 0...5must be used withRXMUCO 0...5 atthe rack entry.
If DUCOM is used, orRXFIL in the RX-path,RXAMCO is requiredat the rack entry
RXMUCO 6, 7 are forcascading purposesonly.
MCLK 1, CCTRL 1,LI 1, OBIX 0,1,2,RFLB 0, EXACO 0
are not relevant
LMT
connector
GPSU 1
HMOs if FICOM isused as ACOM:FTNF, FVSWR
Hardware RelatedManaged Object(HMO): CCLK
Additional HMOs:
BPORT
LAPDLE
XCONNECT
ENVABTSE
OVPT
HMOs forPA0 ... 5 and
DCPA0 ... 5:PAx
HMOs for
TPU0 ... 5 andDCTPU0 ... 5:
TPUx
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1.2.2 Mounting and Installation of BTSE
Check the internal/external interfaces and least replaceable units (LRU). For more de-
tailed information refer to the MMN:BTSE BS 60.
1.2.2.1 Check of Base Transceiver Station BTSE
Check for delivery quality and quantity on site:
installation of BTS rack (rack fixing, fixed boards)
damage to rack or shelter (paintwork, dents)
correct insertion of modules
system/rack cabling
grounding, earthing
main fuses
external interfaces: power supply, antenna and Abis wiring
1.2.3 Check of BTSE Modules
1.2.3.1 Module Identification
Only modules with compatible release numbers may be put into service. Check every
module for this release by the special label. Refer to the Stock List / Release Notes.
After the configuration of themodules in a BTSE the code numbers and functional states
are also electronically readable via LMT, see chapter "5.5 Module Identification by In-
ventory Data and Label".
1.2.3.2 BTSE Modules
The entire BTSE contains several cells called BTS:
Up to three cells are available.
Check whether the BTSE modules are configured correctly.
Hardware (HW) Related Modules:
Per CELL:
HYCOM (4/2/1:1) hybrid combiner
RXAMOD receiver antenna module
RXAMCO receiver antenna module and multicoupler
RXMUCO receiver multicoupler
DUCOM duplex combiner
FICOM filter combiner
RXFIL RX filter
Per Transceiver TRX:
BBSIG baseband signal processing unit
TPU transceiver and processing unitDCTPU direct current converter for TPU
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Usage of FICOM Modules of Different Suppliers
FICOM modules (FBM2, FXM2 and FXM1) may be produced by several different man-
ufactures. The usage of FICOM modules from different suppliers is possible, if all mod-
ules of the FICOM belonging to the same cell come from the same manufacturer.
Installation of modules from different manufacturers within one FICOM, that means with-
in one cell (mixed population), can only be allowed with the following restrictions:
Redundancy
Only GPSU can be equipped in redundant configuration.
1.2.4 Antenna and Feeder Cables
The types of antennas must be tested in advance !
1.2.5 Module HW Coding
Each type of module has its own code key to ensure that it is fitted in the correct slot
position. The on-board code must match the backplane code of the BTSE rack.
PA power amplifier
DCPA direct current converter for PA
In addition there are common modules:
ALCO alarm and control board
CCTRL core controller
CCLK common clock
LI link interface
Basic Modules:
GPSU generic power supply
FP/CB fuse panel/connection board
FAN(FUC)/FIBOX fan (fan unit control)/filter box
OVPT(RCAP) overvoltage protection
(rack cabling access panel)
GSM 900 type: no restrictionsGSM 1800 type: mixed population will not be allowed because of performance degra-
dation and complex expansion cabling
GSM 1900 type: mixed population is not allowed because of high performance degra-
dation
Module Code Key
BBSIG 2
CCLK 1
Tab. 1.1 Module HW Code Keys
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CCTRL 4
LI 5ALCO 3
GPSU 4
DCPA 4
DCTPU 3
PA 2
TPU 1
RXAMCO 1
RXMUCO 1
Module Code Key
Tab. 1.1 Module HW Code Keys
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1.3 Visual Inspection of BTSE Electrics
1.3.1 Polarity of DC Input and Tolerance
The BTSE requires -48V DC with a tolerance range of -40.5 V...-57.0 V for correct op-
eration (positive pole is grounded).
Check this voltage.
1.3.2 Fuses
Rack internal fuses are available at the fuse panel (FP) for several modules to supply
direct current (DC).
The fuses are mounted at the Fuse Panel (FP) on the top of the rack.
There are two types of Fuse Panels: containing 11 or 12 fuses depending on the HW
issue.
Check for fully equipped fuses and that all fuses are being switched off.
Fig. 1.5 Fuse Panel / Connection Board for 11 Fuses
PCM 30
(RCAP)
01Fuse
Unit
Type 4A
FAN
0 - 2
02
4A
GPSU
0 - 1
03
16A
RXMUCO2
RXAMCO
04
0 - 7
10A
BBSIG
0 - 5
05
10A
TPU
PA
06
0
10A
TPU
PA
07
1
10A
TPU
PA
08
2
10A
TPU
PA
09
3
10A
TPU
PA
10
4
10A
TPU
PA
11
5
10A
A SIGN 048 V
48 V
48 V
FU 1 FU 6 FU 11
A SIGN 1
A SIGN 2
FI SIGN
ON
OFF
ON
OFF
ON
OFF
ON
OFF
ON
OFF
ON
OFF
ON
OFF
ON
OFF
ON
OFF
ON
OFF
ON
OFF
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Fig. 1.6 Fuse Panel / Connection Board for 12 Fuses
1.3.3 Temperature Sensors
Two temperature sensors, one for +70C and one for +45C are mounted in the fuse
panel (FP). The temperature sensors must be checked for correct installation.
1.3.4 External Alarms
There are several external alarms, which can be connected via the RCAP. In some cas-
es an additional overvoltage protection device may be used.
Shelter Alarms (SAL) and Operator Alarms (OAL) are available. These alarms can
be configured via the object ENVABTSE with the following assignment to signal names
and freely definable alarm strings:
PCM 30
(RCAP)
01Fuse
Unit
Type 4A
TADC
02
4A
FAN
0 - 2
03
4A
GPSU
0 - 1
04
16A
RXMUCO2
RXAMCO
05
0 - 7
10A
BBSIG
0 - 5
06
10A
TPU
PA
07
0
10A
TPU
PA
08
1
10A
TPU
PA
09
2
10A
TPU
PA
10
3
10A
TPU
PA
11
4
10A
TPU
PA
12
5
10A
HY SIGN 048 V
48 V
48 V
FU 1 FU 6 FU 12
HY SIGN 1
HY SIGN 2
FI SIGN
ON
OFF
ON
OFF
ON
OFF
ON
OFF
ON
OFF
ON
OFF
ON
OFF
ON
OFF
ON
OFF
ON
OFF
ON
OFF
ON
OFF
Object Signal Names Connector
ENVABTSE:# new old (Sub-D)0 ENVA0 P/M OPALM1 P/M OAL
1 ENVA1 P/M OPALM2 P/M OAL
2 ENVA2 P/M OPALM3 P/M OAL
3 ENVA3 P/M OPALM4 P/M OAL
4 ENVA4 P/M OPALM5 P/M OAL
5 ENVA5 P/M OPALM6 P/M OAL
6 ENVA6 P/M OPALM7 P/M OAL
Tab. 1.2 ENVABTSE Instances and Corresponding Signal Names
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1.3.4.1 Shelter Alarms SAL
A maximum number of 4 shelter internal wired alarms is available. The alarm lines areaccessible at the SAL SUB-D connecter.
For detailed information see IMN:BTSE BS 60.
1.3.4.2 Operator Alarms OAL
Check the available wired alarm lines for correct installation. The function will be
checked according to procedure "3.24 External Alarm Check". They are connected via
a distribution board to the OAL SUB-D connector on RCAP. A maximum number of 14
operator alarms is available.
For detailed information see IMN:BTSE BS 60.
1.3.5 DC Connector for Network Termination (NT)
The power supply (-48 V) is connected to the NT (PCM lines) with a 9 pin SUB-D-min
female plug (only BS 60).
1.3.6 Serial Interface Connector SER
not used with this release
7 ENVA7 P/M OPALM8 P/M OAL
8 ENVA8 P/M OPALM9 P/M OAL
9 ENVA9 P/M OPALM10 P/M OAL
10 ENVA10 P/M OPALM11 P/M OAL
11 ENVA11 P/M OPALM12 P/M OAL
12 ENVA12 P/M OPALM13 P/M OAL
13 ENVA13 P/M OPALM14 P/M OAL
14 (not used) (not used)
15 (not used) (not used)16 ENVA16 P/M OPALM17 P/M SAL
17 ENVA17 P/M OPALM18 P/M SAL
18 ENVA18 P/M OPALM19 P/M SAL
19 ENVA19 P/M OPALM20 P/M SAL
Object Signal Names Connector
ENVABTSE:# new old (Sub-D)
Tab. 1.2 ENVABTSE Instances and Corresponding Signal Names
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1.4 Visual Inspection of BTSE Modules
1.4.1 External Interfaces of BS 60
All external interfaces are available on the rack cabling access panel (RCAP). Check
whether all equipped interfaces are connected correctly.
Fig. 1.7 RCAP BS 60 (Top View)
1.4.2 STAR / LOOP / MULTIDROP / CROSS CONNECT Connections
The following figure shows four possible Abis configurations to connect the BTS to the
BSC. These configurations are called Star (single), Loop (several in a circle) Multidrop
(several in series) and Cross Connect.
In case of a STAR link only PCM1 has to be wired. For LOOP, MULTIDROP and
CROSS CONNECT link, PCM one and two are necessary.
For pinning see IMN:BTSE BS 60, chapter Abis-Interface - PCM30 Link Terminal.
For the settings of the Abis Interface for matching 120 or 75 line impedance, see
chapter "1.4.6.4 Switch Settings on Link Interface (LI)" or "1.4.6.5 Switch Settings on
Link Interface for Primary Access (LIPA)"
Earthing
screw
Abis-IF SAL OAL
LMT -48 V DC
NT
Serial IF
access to
-48 V DC terminal
OVPT
PCM1
+Ue
-Ue
RX0 RX1 RX2 RX3 RX4 RX5
PCM2
PCM3
PCM4
Earth
For pinning of the Abis interface see installation manual (IMN:BTSE BS 60).
iIt is recommended not to use a multidrop or cross connect configuration:
- if data rates are supported which need more than one 16 kbps frame on the Abis line
- if the delays within the LL network between BSC and BTS cant be reduced to small
values (< 375 s) compared to 20 ms.
Otherwise packet services with higher data rates cannot be used.
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Fig. 1.8 Star / Loop / Multidrop / Cross Connect Configurations
1.4.3 Antenna Connection
Check the connection of TX and RX coax jumper cables.
1.4.3.1 TX Antenna Connection
The TX antenna coax jumper cable must be connected directly to the 7/16" HYCOM or
DUCOM antenna connector.
Multidrop Cross Connect
BSC BTSE 1
BTSE 2 BTSE 3 BTSE 4
BSC
BTSE 2BTSE 1 BTSE 3
BSC
BTSE 2BTSE 1 BTSE 3
BSC
BTSE 2BTSE 1 BTSE 3
Star Loop
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Fig. 1.9 HYCOM (Vertical Type) Antenna Connection
PWR
ALMVSWR
1,51,72,0
ANTOUT
Scale 1:2
TESTOUT
TXIN 1
TXIN 0TXIN 2
TXIN 3
HYSIGN
PWR
ALMVSWR
1,51,72,0
ANTOUT
TESTOUT
TXIN 1
TXIN 0
HYSIGN
2-WAY 4-WAY
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Fig. 1.10 DUCOM Antenna Connection
1.4.3.2 VSWR Selector
The VSWR is an indication for correct antenna function and BTSE cabling.
The threshold for generating a VSWR warning can be set by the VSWR selector. The
default adjustment is 2.0.
A VSWR alarm will be set off if VSWR > 3, independent of the threshold chosen by the
selector.
Alarm 1
Power
Alarm 0
VSWR
Testout 1
TX0
TX1
TX2
TX3
RX0
RX1
1,5
1,7
2,0
ANT0 ANT1
Testout 0
CELWAVE
Alarm 1
Power
Alarm 0
VSWR
Testout 0
Testout 1
TX0
TX1
TX2
TX3
RX0
RX1
1,5
1,7
2,0
ANT0 ANT1
Scale 1:2
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1.4.3.3 Cable HYCOM/DUCOM - CB
The signal connection between HYCOM/DUCOM and CB is wired with a 15-wire flat ca-
ble, which is encased in a round sheathing. The cable has a 15-pin SUB-D female con-
nector at HYCOM/DUCOM and a 15-pin SUB-D male connector at CB/ASIGN. Checkthe equipped connections:
ASIGN 0 belongs to HYCOM/DUCOM 0.
ASIGN 1 belongs to HYCOM/DUCOM 1
ASIGN 2 belongs to HYCOM/DUCOM 2
1.4.3.4 RX Antenna Connection
The RX antennas are connected to the 6 inputs (N_female) on the RCAP via a jumper
cable. The three inputs RX_0/2/4 are for the receive path and the three inputs RX_1/3/5
are for diversity use.
Fig. 1.11 RX Antenna Connection
1.4.3.5 Receiver Antenna Module RXAMOD Connection
If an RXAMOD is present, check the correct RF cabling connections of the antenna and
BTSE. The receiver multicoupler RXMUCO supplies the DC power for RXAMOD at the
RF out connector via the RF coax cable !
RX5RX4RX3RX2RX1RX0
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Fig. 1.12 RXAMOD (Bottom View)
1.4.4 RF Rack Cabling
The RF semi-rigid cable for the RX path is always provided for the three RXMUCO mod-
ules and their optional diversity RXMUCO modules. Connect the equipped
RXMUCO_0/2/4 with the corresponding cable 0/2/4. Connect the equipped
RXMUCO_1/3/5 with the corresponding cable 1/3/5 for diversity use.
Handle with extreme care when connecting/changing cables !
1.4.5 RF System Cabling
There are several RF boards interconnected with RF cables.
Check whether the corresponding transceiver (TRX) modules are properly connected to
their branching equipment HYCOM/RXMUCO or DUCOM/RXAMCO.
RFOUT
RFIN
View of Mast Head Unit MHU from below
fromRX-Antenna
to RXMUCOvia RCAP
DC power supplyfrom RXMUCO
i Use an appropriate torque spanner for SMA and SMC connectors!
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Handle with extreme care when connecting/changing modules !
iIt is not necessary to use a terminating resistor for the test output connectors of the DU-
COM.
Connection Cable Type Connectors (male)
RXMUCO -> TPU 0.86 semi-rigid alu SMC -> SMC
RXAMCO -> TPU 0.86 semi-rigid alu SMC -> SMC
PA -> HYCOM 1.41 semi-rigid alu SMA -> SMA
PA -> DUCOM 1.41 semi-rigid alu SMA -> SMA
DUCOM -> RXAMCO 1.41 semi-rigid alu SMA -> SMA
TPU -> PA 0.86 semi-rigid alu SMC -> SMA
Tab. 1.3 RF Cabling
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Fig. 1.13 RF System Cabling HYCOM/RXMUCO
HYSIGN
ANTOUT
Alarm
Power
1,5
1,7
2,0
VSWRTestout
Grip
TXIN 3
TXIN 2
TXIN 1
TXIN 0
from RX at RCAP
TX out
TX in
ALM
TX
RXDIV
RX
TAD
RAC RDCRD1 RD2
SPA RYDDC5 RYA
RES
BIAS
RXIN
RXCA
RXO 0
RXO 1
RXO 2
RXO 3
RXMUCOTPUPA
HYCOM
(without 50 termination)
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Fig. 1.14 RF System Cabling DUCOM/RXAMCO
TX out
TX in
ALM
TX
RXDIV
RX
TAD
RAC RDCRD1 RD2
SPA RYDDC5 RYA
RES
BIAS
RXIN
RXCA
RXO1
RXO2
RXO3
TPU RXAMCOPA
ANT0 ANT1
TP 0
Alarm 0
VSWR,
1,751,5
2,0
Power
Alarm 1
TP 1
TX 0
TX 2
RX 0 RX 1
TX 1
TX 3
DUCOM
RFITLIN
RXO0
(without 50 termination)
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Fig. 1.15 Arrangement of FICOM Modules in 1-Cell Configuration
TX0 TX1
RF EXP
B002 B004 B006
Mounting Location
FBM2 FXM1FXM2
Cell 0
ANT OUT
TEST
Out
TX0 TX1
RF EXP
TX0
RF EXP
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Fig. 1.16 Arrangement of FICOM Modules in 2-Cell Configuration
TX0
RF EXP
ANT OUT
TEST Out
TX0 TX1
RF EXP
B002 B004 B006
Mounting Location
FXM1
TX0
RF EXP
FBM2
FBM2 FXM1
Cell 0
Cell 1
ANT OUT
TEST
Out
TX0 TX1
RF EXP
C004
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Fig. 1.17 Arrangement of FICOM Modules in 3-Cell Configuration
1.4.6 Exchangeable Devices on Modules
There are several modules that contain exchangeable devices.
Check the default states or special project settings.
The software image SWI is only exchangeable via LMT.
The following table gives an overview:
B002 B004 B006
Mounting Location
FBM2 FBM2FBM2
Cell 0 Cell 1 Cell 2
ANT OUT
TEST
Out
TX0 TX1
RF EXP
ANT OUT
TEST
Out
TX0 TX1
RF EXP
ANT OUT
TEST
Out
TX0 TX1
RF EXP
No OBJECT JUMPER SWITCH1 ALCO ..... X
2 BBSIG ..... .....
3 CCTRL ..... .....
4 LI ..... X
5 CCLK ..... .....
6 PA X .....
7 RXMUCO X .....
Tab. 1.4 Exchangeable Devices
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1.4.6.1 Boot Software (FW)
Some modules contain special on-board boot software on EPROMs.
The allocation of the removable EPROMs is listed in the Release Note. The new boot
software can be downloaded via LMT.
1.4.6.2 Software Images SWI
Some modules receive the SWI via the LMT.
8 RXAMCO X .....
9 TPU/TRXA ..... .....10 TPU/TRXD ..... .....
No OBJECT JUMPER SWITCH
Tab. 1.4 Exchangeable Devices
OBJECT FILE NAME
ALCO btscab01. swi
BBSIG44 btsbxb03. swi
CCTRL btsbmb01. swi
LI btslib01. swi
LIPA btslib04. swi
MCLK btsccb01. swi
TPU/TRXA btsarb01. swi
TPU/TRXD btsdxb01. swiTPU/TRXD2 btsdxb03. swi
Tab. 1.5 Boot Software
OBJECT FILE NAME
SWL hsxxxxxx. swl
depending on variant of ciphering
VAM vsxxxxxx. vam
depending on variant of ciphering
ALCO btscac01. swi
BBSIG44 btsbbx03. swi
CCTRL btsbmc01. swi
LI btslic01. swi
LIPA btslic04. swi
Tab. 1.6 Software Images SWI
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1.4.6.3 Switch Settings on Alarm and Control Board ALCO
The ALCO provides the rack address (Rack-ID) which is read out by the CCTRL.
Check the settings of the four DIP switches on the ALCO.
MCLK btscck01. swi
TPU/TRXA btsarc01. swiTPU/TRXD btsdrx01. swi
TPU/TRXD2 btsdrx03. swi
OMC Download relnotes. txt
OBJECT FILE NAME
Tab. 1.6 Software Images SWI
The switch positions are:
ON =0
OFF =1
The only address that is possible is zero!
Address Switch 1 Switch 2 Switch 3 Switch 4
0 ON ON ON ON
Tab. 1.7 ALCO Switch Settings
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Fig. 1.18 ALCO (Top View)
Plug
1
FrontPanel
D6
Rack-ID
OFF ON
EPROM
S10
S10
S1S2
S3
S4
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1.4.6.4 Switch Settings on Link Interface (LI)
The LI contains the two transceiver submodules for 75 or 120 impedance match-
ing.
There are several submodules on the LI printed circuit board (PCB). The following tableshows the position for the switches on each submodule.
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Fig. 1.19 LI; Variant 1 (Top View)
Plug
FrontPanel
1
D6
EPROM
S2
S2
S3
S4
S5
S3
S4
S5
Port 1
Port 2
1 2
1 2
1 2
1 2
S6
S7
S8
S9
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Switches Variant 1
Fig. 1.20 LI; Variant 2 (Top View)
Switch Position Function
S2/6 1
2
outgoing 75
outgoing 120
S3/7 1
2
incoming 75
incoming 120
S4/8 1
2
outgoing grounded
outgoing not grounded
S5/9 1
2
incoming grounded
incoming not grounded
Plug
FrontPanel
1
D6
EPROMSubmodule 2
Submodule 1
Submodule 1 and submodule 2 are
mounted upside down. The switchesface the motherboard.
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Fig. 1.21 LI; Variant 2 (Submodule)
Switches Variant 2
* The PCM30 clocks are routed via transformers on the PCM30 module to the TAD plug
of the module LI. Two lines for every clock are utilized on the PCM30 module to transfer
these clocks (a/b-wires). Only the a-wire of each clock is routed to the TAD. The b-wire
should be connected to ground via switch S5 on the PCM30 module. Then the signal
level is as follows: approx. +/-3V symmetrical to ground.
SwitchesSubmodule 1 / 2
S2
S3
S4
S5
1 2
1 2
1 2
1 2
1 2
S1
Switch Position Function
S1 1
2
outgoing 75
outgoing 120
S2 1
2
incoming 75
incoming 120
S3 1
2
outgoing grounded
outgoing not grounded
S4 1
2
incoming grounded
incoming not grounded
S5 * 1
2
PCM Receive/Transmit-Clock grounded at measurement
output
PCM Receive/Transmit-Clock not grounded at measure-
ment output
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1.4.6.5 Switch Settings on Link Interface for Primary Access (LIPA)
Fig. 1.22 LIPA (Top View)
Plug
FrontPanel
EPROM1
D94
S1
S2
S3
S4
1
10
9
8
7
6
5
4
3
2
ON
Port 1
Port 2
Port 3
Port 4
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Fig. 1.23 Switches for Line Impedance Matching (PCM30 120 )
Fig. 1.24 Switches for Line Impedance Matching (PCM30 75 )
Fig. 1.25 Switches for Line Impedance Matching (PCM24 100 )
1 1098765432
ON
PCM30120
Switch 1 2 3 4 5 6 7 8 9 10
Position OFF ON OFF OFF OFF OFF OFF OFF OFF OFF
Tab. 1.8 Positions of Contacts for PCM30 120
1 1098765432
ON
PCM3075
Switch 1 2 3 4 5 6 7 8 9 10
Position ON OFF ON ON ON OFF OFF ON OFF OFF
Tab. 1.9 Positions of Contacts for PCM30 75
1 1098765432
ON
PCM24100
Switch 1 2 3 4 5 6 7 8 9 10
Position ON OFF OFF ON OFF ON OFF OFF ON OFF
Tab. 1.10 Positions of Contacts for PCM24 100
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1.4.6.6 Jumper Settings on Core Controller CCRTL
There are no jumpers in the pinblock near the backplane connector.
1.4.6.7 Jumper Settings on Hybrid Combiner HYCOM
The VSWR board on the HYCOM is available with three JP options.
Three HYCOM types are available.
Each type of HYCOM has its own jumper position.
Check for correct setting.
1.4.6.8 Jumper Settings on Power Amplifier PA
For normal operation some jumpers on some types of PA have to be checked.
For correct jumper settings refer to MMN:BTSE BS 60.
1.4.6.9 Jumper Settings on Receiver Multicoupler RXMUCO
15 jumper (JP) positions are preset. The JP can be found near the backplane connector.
Check the jumper settings.
HYCOM TYPE DEFAULT JUMPER
4:1 4
2:1 2
1:1 1
Tab. 1.11 HYCOM Jumper
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
no set set no set set no set set no set set no set set
Tab. 1.12 Jumper Positions on RXMUCO
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Fig. 1.26 RXMUCO (Top View)
1.4.6.10 RXMUCO2 Gain Control
A step RF attenuator from 0 dB to 10 dB with 1 dB steps is provided in order to set the
required RF level in the RX chain for a given value of the RXAMOD-RXMUCO2 cable
attenuation.
Therefore, an external attenuator between RXAMOD and RXMUCO2 is no longer nec-
essary.
The RF attenuation can be set by DIP switches placed on the RXMUCO2 (see Fig. 1.27and Tab. 1.13)
The overall value for the RX chain attenuation must be 6 dB. In case of RXMUCO2 cas-
cading, the step attenuator of the cascaded RXMUCO2 must be set to the default value
of 0 dB.
Jumpers
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Fig. 1.27 RXMUCO2 (Top View)
Jumpers
S1
S2
S3
S4
Attenuation
Attenuation (dB) Switch 1 Switch 2 Switch 3 Switch 4
0 Open Open Open Open
1 Closed Open Open Open
2 Open Closed Open Open
3 Closed Closed Open Open
4 Open Open Closed Open
5 Closed Open Closed Open
6 Open Closed Closed Open
7 Closed Closed Closed Open
8 Open Open Open Closed
9 Closed Open Open Closed
10 Open Closed Open Closed
Tab. 1.13 DIP Switch Configuration Versus RF Attenuation
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1.4.6.11 Jumper Settings on Receiver Antenna Module and Multicoupler RX-
AMCO
These settings are valid for all BS types.
Fig. 1.28 RXAMCO (Top View)
Jumpers
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1.5 Preparation for Offline Tests
The purpose of this chapter is to execute all commissioning activities for
checking the delivery quality and quantity of the BTSE on site.
The following steps have to be executed to start the system:
(refer to the relevant procedures)
1. Obtain the recommended tests and test equipment
2. Prepare of tests and test equipment
3. Switch BTSE power on
4. Start LMT
5. Perform the procedures listed in chapter 2 "Task List"
Finally, all documents must be filled in and all activities must be confirmed by the cus-
tomer.
1.5.1 Recommended Test Equipment and Tools
Several devices, instruments, accessories and utensils have to be
provided and prepared for commisioning on site.
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1.5.1.1 Test Equipment
The equipment listed in the following must be present for call simulation and verification
of correct operation.
Local Maintenance Terminal LMT
For detailed requirements refer to manual OGL:LMT.
Spectrum Analyzer HP 8594A/E
MS_BS RF Coupling BOX
Receiver Antenna Module RXAMOD/MHU
- HW:
- HP8594A/E
- Option:004/010/021/101/102/105
- SW:
- GSM 900: HP 85715B Personality Card
- GSM 1800: HP 85722B Personality Card
- Cable:
- BNC_male-SMA_male: e.g. RG58
- Adapter:
- N_male-BNC_female
- HW:
- MS_BS-Coupling-Box (RF)
- Cables:
- BNC_male-BNC_male (MS)
- 3x 7/16_male-N_male (RX/TX)- Adapter:
- 7/16_male-N_male
- Tools:
- Attenuator 20 dB / 50 Watt
- 50 Termination N_male
- HW:
- RXAMOD/MHU D900; Type -401
- RXAMOD/MHU D1800; Type -402
- Cables:
- Attenuation Cable D900; 10.4 dB
- Attenuation Cable D1800; 7.2 dB
- Adapter:
- 7/16_male-N_male
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RF Termination
Depending on the BTSE and the equipped modules some RF terminations have to be
present.
Mobile Station MS
Multimeter
1.5.1.2 Tools
Special tools for commissioning activities on site are listed below.
IC Extraction Tools
Antistatic Set
for ESD Module Handling
SMA Tool
for semi-rigid cable connectors
SMC Tool
for semi-rigid cable connectors
Semi-Rigid Bending Tool
for semi-rigid cable connection
- TX:
- 50 SMA (HYCOM, ACOM)
- RX:
- 50 SMA (RXMUCO-RXCA)
- 50 SMC (RXMUCO:RXO_x)
- 50 SMA (HYCOM, ACOM)
- HW:
- GSM 900 / 1800 Mobile Phone, e.g. S45- GSM 1900 Mobile Phone, e.g. S55
- Test Plug-In SIM
- HW:
- SIEMENS Multimeter
- IC-Extraction Tool for DIL-EPROM
- IC-Extraction Tool for PLCC
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TDMA Measuring Tools (Tests with HP 8594A/E) and Trigger Adapter
1.5.2 Preparation and Presetting of Test Equipment
1.5.2.1 Test EquipmentFor minimum test time and correct test results the devices
have to be prepared on site.
Spectrum Analyzer
RF Termination
1.5.2.2 Software (SW)
For all tests only released SW (corresponding to the BTSE HW/SW release) is allowed
to be running on the test equipment (TE).
1.5.2.3 Boot Software/Firmware (SW/FW)
For all tests only the released SW is allowed to be running on the BTSE corresponding
to the BTSE HW/SW/FW release/revision.
- HW:
- 2 Measuring cables with male BNC plugs (sufficient length)
- Adapter SMC male - BNC female
- Trigger adapter for TAD at MCLK or LI
(50-pin AMP-Plug with 2 x BNC plug female)
- 2 Adapters N-Connector male - BNC female
- HP 8590 series spectrum analyzer operating manual
- Users Guide HP85715B GSM 900 Transmitter Measurement Personality
- Users Guide HP 85722B GSM 1800 Transmitter Measurement Personality
- HW: the HP8594A/E needs a warm-up time of 20 minutes depending on the
available options.
The display shows "OVEN COLD" during the heating phase. Afterwards
a CALIBRATION has to be carried out for defined measurement execu-
tion.
- SW: The SW of the GSM 900 / GSM 1800 card must be installed in advance.
- Cables: For special tests, a BNC loop at the backplane has to be provided:
GATE-OUTPUT(TTL) to EXTERN TRIGGER INPUT
The cable from CCLK(TAD) to GATE-INPUT(TTL)
for TDMA-FRAME Trigger has to be connected.
See analyzer operating manual for more detailed information.
- HW: Before RF measurements are executed the following connectors have to
be terminated with 50 SMA/SMC resistors:
- TX: open HYCOM inputs (SMA)
- RX: open RXMUCO outputs (SMC)
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1.5.3 BTSE Power ON
1.5.3.1 Fuses
Depending on the configuration of equipped PA/TPU modules the following fuses have
to be switched on. All other fuses not relataed to a PA/TPU are switched on.
1.5.3.2 LED Indications
The following LED description is only valid for the software installation.
During normal operation, these modules have the LED indications as shown below:
1. (Example with vertical HYCOM)
2.
3.
LABEL OBJECT FUSE_No.
TPU_0/PA_0 TRX_0 FU_06
TPU_1/PA_1 TRX_1 FU_07
TPU_2/PA_2 TRX_2 FU_08
TPU_3/PA_3 TRX_3 FU_09
TPU_4/PA_4 TRX_4 FU_10
TPU_5/PA_5 TRX_5 FU_11
Tab. 1.14 BS 60 Fuses (Fuse Panel with 11 Fuses)
iIf all fuses are to be monitored with one common alarm sensor, then all fuses have to
be switched on, irrespective of the configuration.
(R:) red
(G:) green
(Y:) yellow
(f:) flashing
(o:) off
HYCOM
ALARM
(0)
(G)
POWER
RXMUCO or RXAMCO
BIAS (G) BIAS (G)
DCPA
(G) PS
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4.
5.
6.
7.
8.
9.
10.
11.
GPSU
(G) PS
(G) PIP(G) 5V
(G) 12V
FAN
(G)
PA
(o) ALM
TPU or TPU2
RAC (R) (R) RDC RAC (R) (R) RDC
RD1 (R) (R) RD2 RD1 (R) (R) RD2
SPA (o) (G) RYD SPA (o) (G) RYD
DC5 (G) (o) RYA
BBSIG44
RBB1 (R) (R) RBBC
SPA1 (o) (G) RY
CCLK
RY (o) (R) RCCK
ACT (Y) (o) HMO
FLOC (o) (o) PMO
CCTRL
RY (G) (R) RBM
ACT (Y) (o) PRGA
SPA1 (o) (G) SPA2
LI or LIPA
1RAI
1ER-6
(o)
(o)
(o)
(o)
2RAI
2ER-6
3RAI
3ER-6
3ER-3
1RAI
1ER-6
(o)
(o)
(o)
(o)
(o)
(o)
(o)
(o)
(o)
(o)
4RAI
4ER-6
4ER-3
2RAI
2ER-6
RY
ACT
1ER-3
(o)
(o)
(o)
(R)
(o)
(o)
RLIC
SPA
2ER-3
RY
ACT
1ER-3
(o)
(o)
(o)
(R)
(o)
(o)
RLIC
SPA
2ER-3
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12.
ALCO
S1_S2
AC_S3RY_R0
(o)
(o)(o)
(o)
(o)(R)
RY_R1
AC_S3
S1_S2
(o)
(o)
(o)
(R)
(o)
(o)
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2 Task List
2.1 SW Download and Activation
The SW has to be downloaded from the LMT to the BTSE . . . . . . . . . . . . . . . . . . . . PROC: 3.1
2.2 Setting the Rack
Here the rack type has to be defined . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC: 3.2
2.3 Creation of HW Related Managed Objects
Each HW related managed object has to be created separately . . . . . . . . . . . . . . . . PROC: 3.3
2.4 Creating the Alarm Configuration (ENVABTSE)The alarm configuration has to be created . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC: 3.16
2.5 Setting the BTSE Attributes
The BTSE attributes have to be set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC: 3.17
2.6 BPORT
The PCM line configurations must be determined . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC: 3.18
2.7 XCONNECTThe Cross Connect settings must be defined. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC: 3.19
2.8 Setting the BTSM
The BTSM must be set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC: 3.20
2.9 Creating LAPDLE
The object LAPDLE must be created . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC: 3.21
2.10 State of ModulesCheck the state of all modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC: 3.22
2.11 Replacing Failed HW
Failed HW has to be replaced. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC: 3.23
2.12 External Alarm Check
External alarms have to be checked. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC: 3.24
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2.13 Creating a Backup
Create a backup of the configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC: 3.25
2.14 Remote Inventory
The Remote Inventory data have to checked, added and copied for backup . . . . . . PROC: 3.26
2.15 Changing the BTSE to Phase 3
Change the BTSE from phase 2 to 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC: 3.27
2.16 Execution of Optional RF-Tests
These RF-tests may be performed on an optional basis . . . . . . . . . . . . . . . . . . . . . . PROC: 3.28
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3 Procedures
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3.1 SW Download and Activation
1 Reset Core Controller CCTRL
Reset the CCTRL with the push button on the board.
After about 15 seconds the CCTRL reaches the start connection status
2 Connect LMT CableConnect the LMT cable on the RCAP to the LMT 15-pin SUB-D connector. ......(see Fig. 1.7)
3 Start LMT Programb Start
Programs
LMT xxxxx (string of version)
Start LMT
The LMT DashBoard appears (title bar named LMT Control Center)
Detailed explanation for using the DashBoard is given in OGL:LMT ......OGL:LMT
4 Start Connection to the BTSEb Click on the StartNet button
The Session Starter window appears
(Start new Session is pre-selected)
b Click on the OK buttonb Click on the Logon button
The Logon Request window appears
b Enter UserID: Enter Password:
Click on the Connect buttonClick on the Close button
iA directory for the software to be downloaded has to be present on the harddisk of the
LMT containing all files of the relevant software load.
The V.11/X.21 interface (EICON-Card+SW) has been installed and tested in advance.
LED_Indication of CCTRL:
RY (G) (R) RBM
ACT (Y) (o) PRGA
SPA1 (o) (Gf) SPA2
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5 System Response
The BTSE is now in phase 1
6 Start Input Handlerb Click on the Input Hdl button
The Input Handler window appears
7 SW Downloadb MANAGED-ELEMENT
SOFTWARE-MANAGEMENT
DNLALLEXE
SRCPATH=
OVERWRITE=yes
DNLALLEXE:SRCPATH="\hs010808",OVERWRITE=YES;
Connection on Port 1Logon Ack Received!
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8 System Response
For the download of each file:
followed by several messages of the structure shown below providing informa-
tion on the progress and the end of the download for each file:
It is possible that the LMT performs an automatic logoff after a few minutes. If
the session is closed, please log on again.
9 SW Activationb MANAGED-ELEMENT
BSS-FUNCTIONAL
BTSM
ACTIVATE BTSM
NAME=BTSM:0FILEID=
FILESWV=
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10 System Response
11 Loginb Click on the Logon button
The Session Starter window appears
(Start new Session is pre-selected)
b Click on the OK buttonb Click on the Logon button
The Logon Request window appears
b Enter UserID: Enter Password: Click on the Connect button
Click on the Close button
ACTSW BTSM:NAME=BTSM:0;FILEID="hs011207.swl",FILESWV="01-04-12-05-07-00_00-07-25";
Command
============================================
JOB:
PC Time&Date:
NE Time&date:
USER:
COMMAND: Activate BTSM:NAME=BTSM:0,FILEID="Hs011302.swl",FILESWV="01-04-13-05-02-
03_01-04-11";
SW RELEASE: 01-04-13-05-02-03_01-04-11
COMMAND RESULT: OPERATION COMPLETED
Activate BTSM SW ACK:
fileId = "Hs011302.swl"
fileVersion = "01-04-13-05-02-03_01-04-11"
END OF OUTPUT FOR JOB
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12 System Response
The BTSE is now in phase 2
END
Connection on Port 1Logon Ack Received
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3.2 Setting the Rack
1 Setting the Rack Type
b MANAGED-ELEMENTBSS-EQUIPMENT
BTSE
RACK
SET RACK
NAME=RACK:0
BATTBAK= (see below)
TYPRACK=BS60
TYPRFSR= (see below)
......OGL:LMT
Battery backup (BATTBAK) can be set to:
installed -> if a backup battery is installed
not_installed -> backup battery is not installed
not_valid
Subrack type (TYPRFSR) can be set to:
RF_subrack_V1 -> RF subrack, BR2.0 design
RF_subrack_V2 -> RF subrack, BR2.1 design
SET RACK:NAME=RACK:0,BATTBAK=,TYPRACK=BS60,
TYPRFSR=;
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2 System Response
Several messages will follow. They provide information on the progress and the
end of the download for each file.
END
Set RACK:NAME=RACK:0,BATTBAK=,TYPRACK=BS60;
Command
============================================
JOB:
PC Time&Date:
NE Time&date:
USER:
COMMAND: Set RACK:NAME=RACK:0,BATTBAK=TYPRACK=BS60;
SW RELEASE:
COMMAND RESULT: OPERATION COMPLETED
SET ATTRIBUTES ACK RACK:
name = RACK:0
batteryBackup =
type Of BTSE = BS60
END OF OUTPUT OF JOB
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3.3 Hardware Related Managed Objects
1 Overview of Hardware Related Managed Objects
For each BTSE all types of hardware related managed objects (HMO) have to
be created.
The CCTRL is always provided automatically.
For mounting positions of the modules, refer to ... ......MMN:BTSE BS60
Now proceed with the following creation procedures.
END
i The RACK has to be set before HMOs are created!
NO. MODULE RANGE
1. ACOM 0...2
2. ALCO 0
3. BBSIG 0...5
4. CCLK 0
5. ENVABTSE 0...19
6. FAN 0...2
7. GPSU 0
8. LI 0
9. PA 0...5
10. RXAMOD 0...5
11. RXMUCO 0...5
12. TPU 0...5
13. FVSWR 0...2
14. FTNF 0...5
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3.4 HYCOM/DUCOM
1 HYCOM/DUCOM Creation
The following action has to be repeated for each equipped module. The exam-
ple shows the input and the resulting system response for HYCOM 0.
b MANAGED-ELEMENTBSS-EQUIPMENT
BTSE
RACK
ACOM
CREATE ACOM
NAME=RACK:/ACOM:0
WDACOM=PA
CELLNO=
TYPACTAM= (see below)
......OGL:LMT
These are the TYPACTAM:
HYCOM_V1 -> horizontal type of frame
HYCOM_V2 -> vertical type of frame ( for BS60 and BS 61
DUCOM_V2 -> for BS21/BS22
DUCOM_V3 -> for BS20
WDACOM: to select more than one PA press shift.
CREATE ACOM:NAME=RACK:/ACOM:0,WDACOM=PA,CELLNO=,TYPACTAM=;
iIf the combining hardware of a cell is changed from FICOM to DUCOM or HYCOM
equipment, then the FTNFs, the FVSWR and also the RXMUCOs of this cell have to be
deleted before the creation of a DUCOM or HYCOM.
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2 System Response
Several CHANGED STATE EVENT REPORTs will follow. They can be examined
in the LMT Browser window.
Operational State = ENABLED
Notification Identifier=
The LED indicators do not change.
END
Create ACOM:NAME=RACK:/ACOM:,WDACOM=PA,CELLNO=,TYPACTAM= Command
============================================
JOB:
PC Time&Date:
NE Time&Date:
USER:
COMMAND: CREATE ACOM:NAME=RACK:/ACOM:0,WEACOM=PA,CELLNO=,TYPACTAM=
SW RELEASE:
COMMAND RESULT:
CREATE ACOM ACK:
name = RACK:/ACOM:
wiringDataACOM = PA
cellNumber =
typeOfACTAM =
END OF OUTPUT FOR JOB
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3.5 FICOM
1 FVSWR Creation
Allocation of the FICOM to a cell.
b MANAGED-ELEMENTBSS-EQUIPMENT
BTSE
RACKFVSWR
CREATE FVSWR
NAME=RACK:/FVSWR:
......OGL:LMT
Cell can be 0, 1 or 2
CREATE FVSWR:NAME=RACK:/FVSWR:;
2 System Response
iFVSWR
FTNF
Is one of the two managed objects of the FICOM and exists only once per
base module (not in expansion modules). This HMO supplies the VSWR
logic of the FICOM.
There are two managed objects of this type per module; they must be han-
dled separately. This MO is the tunable narrowband filter.
iMinimum carrier spacing for all TNFs is 600 kHz. This means: between two used chan-
nels there must be at least two unused channels !
iAt least one TNF-stage of the FICOM base module has to be configured so that the cell
can go into service!
CREATE FVSWR:NAME=RACK:/FVSWR:;
Command
============================================
JOB:
PC Time&Date =
NE Time&Date =
USER:
COMMAND: CREATE FVSWR:NAME=RACK:/FVSWR:;
SW RELEASE: = "xx-xx-xx-xx-xx-xx_xx-xx-xx"
COMMAND RESULT: OPERATION COMPLETED
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Several CHANGED STATE EVENT REPORTs will follow.They can be examined
in the LMT Message Browser Window.
Administrative State = UNLOCKED
Operational State = ENABLED
Availability Status = NULL_value
Alarm Status = cleared
3 FTNF Creation
There are two managed objects of this type per module and they have to be
handled separately
b MANAGED-ELEMENTBSS-EQUIPMENT
BTSE
RACK
FTNF
CREATE FTNF
NAME=RACK:/FTNF:TNFRS485 Rel_Stage_no= Rel_Cell_no= (see below)
TNFWIRED= PA
......OGL:LMT
CREATE FTNF:NAME=RACK:/FTNF:,TNFRS485=-,TNF-
WIRED=PA;
The TNFRS485 attribute contains one octet specifying the RS485 address the
TNF is accessed via the serial interface. The RS485 address is derived from the
composition of the relative cell number the TNF is connected with and the rela-
tive number of the TNF within that cell and must fit the settings of the DIL switch-
es at the related module. Refer to CML:BS-2x/6x ......CML:BS-2x/6x
CREATE FVSWR ACK:
name = RACK:/FVSWR:
END OF OUTPUT FOR JOB
Bit 0 ... Bit 3 reserved for TNF address selection (0 ... 15)
Bit 4... Bit 5 reserved for cell selection
Bit 6... Bit 7 reserved for VSWR alarm threshold setting
iThe TNFRS485 address must be a unique value (dont use the same ad-
dress twice).
If the second TRX of a board is not used, the TNFRS485 address must be a
possible value and not the same as the first one.
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4 System Response
Several CHANGED STATE EVENT REPORTs will follow. They can be examined
in the LMT Message Browser window and end with:
Administrative State = UNLOCKED
Operational State = ENABLED
Availability Status = NULL_VALUE
Alarm Status = cleared
The LED indicators do not change.
END
CREATE FTNF:NAME=RACK:/FTNF:,TNFRS485=-,TNFWIRED=PA;
Command
============================================
JOB:
PC Time&Date =
NE Time&Date =
USER:
COMMAND: CREATE FTNF:NAME=RACK:/FTNF:,TNFRS485=-,TNF-
WIRED=PA;
SW RELEASE: = "xx-xx-xx-xx-xx-xx_xx-xx-xx"COMMAND RESULT: OPERATION COMPLETED
CREATE FTNF ACK:
name = RACK:/FTNF:
TNFRS485
Rel_Stage_no =
Rel_Cell_no =
tNFwiredRFInput = PA
END OF OUTPUT FOR JOB
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3.6 BBSIG
1 BBSIG Creation
The following action must be repeated for each equipped module.
b MANAGED-ELEMENTBSS-EQUIPMENT
BTSE
RACK
BBSIG
CREATE BBSIG
NAME=RACK:/BBSIG:
TXLEVADJ= (see below)
......(see OGL:LMT)
CREATE BBSIG:NAME=RACK:/BBSIG:;TXLEVADJ=
TXLEVADJ:
Adjustable values are:
TXLEVADJ: -63.0 ... 63.0 in steps of 1.0.
The following formula is used to determine this value:
TXLEVADJ = attenuation factor of the used combiner + attenuation factor of RF
cable - amplification factor of the used booster
Note: use factors without minus/plus sign for the formula!
Example:
Combiner: -1.5 dBCable: -0.5 dB
Booster: +15 dB
(1.5 dB) + (0.5 dB) - (15 dB) = -13 dB
See TED: BS-2x/6x for typical attenuation factors in the TX path. ......see TED: BS-2x/6x
i BBSIG is the Hardware Related Managed Object (HMO) for the BBSIG44 module
iMake sure that each BBSIG is assigned to the TX path of the corresponding TPU, i.e.
BBSIG:0 -> TPU:0, BBSIG:1 -> TPU:1 etc.
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2 System Response
Several CHANGED STATE EVENT REPORTs will follow. They can be examined
in the LMT Browser window and end with:
Operational State = ENABLED
Notification Identifier=
END
Create BBSIG:NAME=RACK:/BBSIG:,TXLEVADJ=
Command
============================================
JOB:
PC Time&Date:
NE Time&Date:
USER:
COMMAND: Create:NAME=RACK:/BBSIG:,TXLEVADF=
SW RELEASE:
COMMAND RESULT:
CREATE BBSIG ACK:
name = RACK:/BBSIG:
txLevAdjust(dB) =
END OF OUTPUT FOR JOB
Change of LED indication:
BBSIG44
RBB1 (o) (o) RBBC
SPA1 (o) (G) RY
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3.7 ALCO
1 ALCO Creation
b MANAGED-ELEMENTBSS-EQUIPMENT
BTSE
RACK
ALCO
CREATE ALCO
NAME=RACK:/ALCO:
......OGL:LMT
CREATE ALCO:NAME=RACK:/ALCO:;
2 System Response
Several CHANGED STATE EVENT REPORTs will follow. They can be examined
in the LMT Browser window and end with:
Operational State = ENABLED
Notification Identifier=
Create ALCO:NAME=RACK:/ALCO:
Command
============================================
JOB:
PC Time&Date:
NE Time&Date:
USER:
COMMAND: Create ALCO:NAME=RACK:/ALCO:
SW RELEASE:
COMMAND RESULT:
CREATE ALCO ACK:
name = RACK:/ALCO:
END OF OUTPUT FOR JOB
Change of LED indication:
ALCO
S1_S2 (o) (o) RY_R1 (o) (R)
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3 Example of Failure Event Report
After the creation of the ALCO all current failure event reports will be displayed.
In this phase of commissioning these failure event reports must be ignored.
For example: In case of an open rack door, the Error-Id: "20504" (rack door
open) will be displayed.
AC_S3 (o) (o) AC_S3 (o) (o)
RY_R0 (G) (o) S1_S2 (o) (o)
JOB:
PC Time&Date:
NE Time&Date:
USER:
COMMAND: Create ALCO:NAME=RACK:/ALCO:
SW RELEASE:
COMMAND RESULT:
FAILURE EVENT REPORT:
NAME = RACK:0
Event Type = Environmental Failure Event
Event Time =
Probable Cause = Exclosure door open
Specific Problems= 127 Enclosure Door Open Alarm
Severity = Minor
Trend Indication = Less Severe
Notification Identifier =
Proposed Repair Actions = 6 See the Foreseen Operating Company Repair Action
Originator = 2561
Additional Word =
Software Version =
END OF OUTPUT FOR JOB
Binary Command
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END
Binary Response
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3.8 CCLK
1 CCLK Creation
b MANAGED-ELEMENTBSS-EQUIPMENT
BTSE
RACK
CCLKCREATE CCLK
NAME=RACK:/CCLK:
......(see OGL:LMT)
CREATE CCLK:NAME=RACK:/CCLK:;
iAfter the deletion of the flash database a reset of the CCTRL will occur. To avoid a sec-
ond reset it is necessary to create the object CCLK within approximately 30 seconds.
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2 System Response
Several CHANGE STATED EVENT REPORTs will follow. They can be examined
in the LMT Message Browser window and end with:
Operational State = ENABLED
Notification Identifier=
END
Create CCLK:NAME=RACK:/CCLK:
Command
========