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Renewable Phenalkamide Epoxy Curing Agents for

High Performance & Cost-effective Solvent-free

CoatingsHong Xu, Mengjiu ChenCardolite CorporationOct. 27th, 2015

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Contents• Background

• CNSL technology

• Phenalkamide technology

• Solvent-free phenalkamides

– LITE 3040

– LITE 3060

• Conclusions

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Greener Coating

• Environmental awareness

• Stringent regulations

• Low VOC

• High solids/solvent free

• Higher bio-content

• Non-toxic

• Cost efficient

• Excellent performance

• CNSL technology

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CNSL technology

CNSL

Distillation

Various products

Cashew Nut

Cardanol

4

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Benefits of both worlds

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PolyamideTechnology

PhenalkamineTechnology

PhenalkamideTechnology

Fast cure

Surface tolerance

Low viscosity

Water resistance

Corrosion protection

Low temperature cure

Extended overcoat

Flexibility

Long potlife

Color stability

Cost effective

A new category of renewable epoxy curing agents designed to provide coating formulators with the benefits of both polyamides and phenalkamines in ONE PRODUCT.

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Naturally Great• Phenalkamides use natural,

renewable, non-food chain CNSL as their core building block.

• Low viscosity, solvent free and compatibility with a broad range of epoxy resins help formulate high solids coatings with lower VOC

• Meet stringent environment and health regulations without compromising quality

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LITE 3040• Cure properties

• Film appearance

• Early water resistance

• Flexibility

• Mechanical properties

• Intercoat adhesion

• Corrosion protection

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Typical PropertiesProperties LITE 3040

Solvent free Polyamide

Color (Gardner) ≤ 11 ≤ 11

Viscosity, cps 4,000 - 6,000 11,560

Amine value (mg KOH/g) 370 - 410 370 - 410

AHEW (theoretical) 118 97

Recommended use level (phr)

50 – 70 (55

recommended)50 - 70

Gel time @ 55phr (min) 110 158

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Hardness Development with Epon 828

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Day 2 Day 3 Day 4 Day 7 Day 10

0

20

40

60

80

100

120

@ 10°C/92%RH with Epon 828

LITE 3040 Solvent-free Polyamide

Pers

oz

hard

ness

, se

c

Much faster hardness development at lower temperature and high humidity

Day 3 Day 4 Day 7 Day 100

10

20

30

40

50

60

70

80@ 5°C with Epon 828

LITE 3040 Solvent-free Polyamide

Pers

oz

hard

ness

, se

c

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Film appearance @ 10°C & 92% RH

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Solvent-free Polyamide LITE 3040

Better film and compatibility with liquid epoxy resin

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Flexibility

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Systems Mandrel Bend

Direct impact(lbs)

Reverse impact(lbs)

Solvent-free Polyamide

1/8”, good 150 80

LITE 3040 1/8”, good 90 60

Good flexibility

Epon 828 system, phr=55 30 minutes induction time WFT =5 mils over CRS 7 days RT cure

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Early Water Resistance

12

#12 = 8 hrs

Better early water resistance

Solvent-free Polyamide

LITE 3040

• 30 minutes induction time• WFT = 8 mils over CRS panels• Water drops close to every hour (starting at point

1)• Cured at 25°C

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Mechanical Properties

Properties LITE 3040

Tensile strength (Mpa) 44.2

Flexural strength (Mpa) 97

Compressive strength (Mpa) 77

Elongation (%) at break 10.8

Water absorption (%) 0.79

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Intercoat adhesion @ RT

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•First white layer: polyamide/LITE3040 primer, different dry time @ RT•Second black layer: PU topcoat, 1 day dry time @ RT before

tape adhesion tests

5B

5B5B5B5B

5B 5B5B

Polyamide

LITE3040

1day 14day10day7day3day

5B

5B

Very good intercoat adhesion at RT cure condition

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Intercoat adhesion @ 5˚C

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0B

4B4B4B3B

1B 1B0B

Polyamide

LITE3040

1day 14day10day7day3day

0B

4B

•First white layer: polyamide/LITE3040 primer, different dry time @ 5˚C•Second black layer: PU topcoat, 3 days dry time @ 5˚C before

tape adhesion tests

Much better intercoat adhesion properties at low temperatures

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Salt Spray @ 500 hr, ~150µm DFT

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Solvent-free Polyamide LITE 3040

Good corrosion protection

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LITE 3040• Faster cure and hardness

development

• Better film appearance at extreme conditions

• Superb early water resistance

• Balanced mechanical properties

• Very good intercoat adhesion

• Good corrosion protection

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LITE 3060• Cure properties

• Color stability

• Adhesion over different substrates

• Corrosion protection

• Adhesion over dry/wet concrete blocks

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Typical Properties

Properties LITE 3060

Polyamidoamine adduct

#1 #2

Color (Gardner) ≤ 10 ≤ 10 ≤ 10

Viscosity, cps 500 - 1,000 700 - 2,000 450 - 1,300

Amine value (mg KOH/g)

450-490 250 - 290 280 - 320

AHEW (theoretical) 104 115 115

Recommended use level (phr)

55 ~60 ~60

Gel time @ 55phr (mins)

35-55 78 50

Solvent NoBenzyl alcohol

Benzyl alcohol

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Cure time with DER 331

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Faster dry time with liquid epoxy resin

No induction time, WFT=8mils

Poly

amid

oam

ine

addu

ct #

1

Poly

amid

oam

ine

addu

ct #

2

LITE

306

0 05

10152025

25˚C

10˚C

Dry

hard

(hrs

)

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Hardness Development @ 5˚C

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2 3 4 7 110

50

100

150

200

250

Clear coating system with DER 331

Polyamidoamine #1Polyamidoamine #2LITE 3060

Cure time at 5˚C (days)

Pers

oz h

ard

ness (

sec)

Much faster hardness development at low temperature

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100% solids formulation – Base #A

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Material Base #A

DER 331 (BisA type epoxy resin) 35.5

UL 513 (diluent) 6.2

DISPERBYK 111 (dispersant) 1.4

TIPURE R-706 (pigment) 6.7

Zeosphere G600 (filler) 16.9

Wollastonite 10ES (filler) 17.5

Cimbar EX (filler) 15.7

BYK 085 (defoamer) 0.03

BYK 361 N (leveling agent) 0.05

Total base 100.00

Polyamidoamine #1 / Necires EPX-L2 23.3/11.7

Polyamidoamine #2 /Necires EPX-L2 23.3/11.7

LITE 3060/Necires EPX-L2 21.2/10.6

%vol NVM 100

%PVC 20.5

Amine/Epoxy 1.00

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100% solids formulation – Base #B

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Material Base #B

DER 353 (BisA/F diluted epoxy) 42.1

DISPERBYK 111 (dispersant) 1.7

Nicron 302 Talc 8.4

Wollastonite 10 ES (filler) 7.4

Imsil A-25 silica (filler) 15.4

TIPURE R-706 (pigment) 13.7

Cimbar EX (filler) 10.5

BYK 085 (defoamer) 0.2

BYK 358 N (leveling) 0.6

Total base 100.00

Poly A #1/#2/#3/#4 24.8

LITE 3060 22.6

%vol NVM 100

%PVC 21.2

Amine/Epoxy 1.00

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Color Stability

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Good color stability

0 20 40 60 80 1001201401601800

2

4

6

8

10

12

Base #A

Polyamidoamine #1Polyamidoamine #2LITE 3060

QUV A exposure time (hrs)

Delt

a E

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Gloss Retention

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Better gloss retention and no chalking

0 20 40 60 80 1001201401601800

20

40

60

80

100

120

Base #A

Polyamidoamine #1Polyamidoamine #2LITE 3060

QUV A exposure time (hrs)

Glo

ss @

20

˚

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Panel images

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ΔE = 7.1320° = 1.460° = 8.185° = 27.9

ΔE = 10.7220° = 1.360° = 11.385° = 49.4

ΔE = 9.7920° = 58.460° = 91.985° = 94.9

After 168 hrs QUV A exposure

• Much better gloss retention• No surface chalking

PolyA #1 PolyA #2 LITE 3060

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Salt spray – 2000 hrs

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Good anti-corrosion performance

• Base #A system• 20 minutes induction time• DFT = ~ 9 mils over SA2.5 panels• 7 days RT cure

PolyA #1 PolyA #2 LITE 3060

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Typical Properties

Properties LITE 3060

Modified Polyamidoamines

#3 #4

Color (Gardner) ≤ 10 ≤ 10 ≤ 10

Viscosity, cps 500 - 1,000 200 -400 900 - 1,900

Amine value (mg KOH/g)

440 - 480 333 290 - 350

AHEW (theoretical) 104 115 115

Recommended use level (phr)

~55 ~60 ~60

Gel time @ (mins) 48 57.7 100

Benzyl alcohol Free Free Free

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Adhesion over rusted panel

Rusted S-36 panels

5B 5B5B

Good adhesion to rusted panels

• Base #B system• 20 minutes induction time• WFT = 6 mils over rusted S-36 panels• 7 days RT cure

PolyA #3 PolyA #4 LITE 3060

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Adhesion over CRS

4B 5B3B

Good adhesion to CRS panels

• Base #B system• 20 minutes induction time• WFT = 6 mils over CRS• 7 days RT cure

CRS panels

PolyA #3 PolyA #4 LITE 3060

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Adhesion over Al alloy panel

5B 5B5B

Good adhesion to AA 2024 T3 substrate

• Base #B system• 20 minutes induction time• WFT = 6 mils over AA 2024 T3• 7 days RT cure

AA 2024 T3

PolyA #3 PolyA #4 LITE 3060

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Shore D tests

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PolyA #3 PolyA #4 LITE 3060

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Shore D @ 25˚C

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Quick walkability development in first day at 25°C

Base #B20 mins induction timeAl pan, sample weight = 8 g

1 2 30

10

20

30

40

50

60

70

80

90

1961LV3282-1LITE 3060

Cure time @ 25°C/days

Sh

ore

D h

ard

ness

Walk onPoly A #3Poly A #4LITE 3060

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Quick walkability development at low temperature

Shore D @ 10˚C + 92%R.H.

1 2 30

10

20

30

40

50

60

70

80

90

1961LV3282-1LITE 3060

Cure time @ 10°C/days

Sh

ore

D h

ard

ness

Walk onPoly A #3Poly A #4LITE 3060

Base #B20 mins induction timeAl pan, sample weight = 8 g

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Quick walkability development at low temperature

Shore D @ 5˚C

1 2 30

10

20

30

40

50

60

70

80

90

1961LV3282-1LITE 3060

Cure time @ 5°C/days

Sh

ore

D h

ard

ness

Walk onPoly A #3Poly A #4LITE 3060

Base #B20 mins induction timeAl pan, sample weight = 8 g

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Concrete•Dry concrete blocks: stored

at RT and ~50%R.H. conditions before applying a coating. RT cure.

•Damp concrete blocks: submersed in tap water for 24 hours, then removed from water bath. Use a paper towel to remove the standing water before applying a coating, RT cure.

•Wet concrete blocks: submersed in tap water for 24 hours, placed in a basin with tap water level under 1/2 inch from the block surface. Use a paper towel to remove the standing water before applying a coating. The coated blocks remained in water during the curing period.36

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Pull off tests over concretes

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•High strength concrete blocks: Dry and Wet concrete blocks

•Flooring primer: Base #B + curing agents with 20 mins induction

•Applications: Drawn down via WFT = 25 mils

•Cure conditions: 7 days @ RT (wet concretes in water basin)

•Pull off tests: PosiTest AT-A automatic adhesion tester

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Pull off adhesion

Base #B system

Pull off adhesion after 7 day cure, MPa

Dry concrete blocks

Wet concrete blocks

Failure mode

Poly A #2 4.9 3.5 Concrete failure

Poly A #3 5.2 3.5 Concrete failure

Poly A #4 4.8 4.3 Concrete failure

LITE 3060 4.9 3.9 Concrete failure

Good adhesion on wet and dry concrete substrates, failure mode is on

concrete blocks

Concrete failure

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LITE 3060• Low viscosity for 100%

solids formulation

• Fast cure and hardness development especially at low temperatures

• Excellent early walkability

• Good color and gloss stability

• Superb adhesion over different substrates

• Excellent adhesion over dry/wet concrete blocks

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Novel phenalkamidesLITE 3040 & LITE 3060

• Low viscosity & benzyl alcohol free

• Non-toxic labeling

• Fast cure and hardness development

• Good early water resistance

• Superb adhesion over different type substrates and PU topcoat

• Enable true solvent-free formulations without compromising quality

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Thank you!

Any questions?

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