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- PUBLIC - Page 1 Carl Zeiss SMT GmbH, Timo Laufer, Senior Scientist

Star European Conference March 22-23, 2011

Noordwijk

Thermal Fluid-Structure Analysis of an optical Device including Radiation and Conduction

Timo Laufer Senior Engineer Carl Zeiss SMT GmbH, Oberkochen, Germany

CFD-Simulations Aron Kneer, TinniT Technologies GmbH, Karlsruhe, Germany

Carl Zeiss SMT GmbH


Content

1. Carl Zeiss SMT GmbH and Products

2. Basic Principles of EUVL (Extreme Ultra Violet Lithography)

3. Essential System-Components, thermal Boundary Conditions

4. Heat Transport Mechanisms in rarefied Gases

5. CFD-Model and Results of the Simulation

6. Summary and Benefits


Content








Position of Carl Zeiss SMT GmbH within the Carl Zeiss Group


Sequence of Producing Micro Chips

cutting polishing

Material layering or alteration

Photo resist- coating

exposure (step and scan) Development

and fixture

Etching and ion implementation

Photo resist- removal (ashing)

Finished wafer separation apply connections

ASML other suppliers

exposure with lenses from

Carl Zeiss SMT GmbH


Exposure Machine ASML TWINSCAN XT:1950i

Zeiss components reticle

wafer


Moore’s Law The number of transistors on a chip doubles every 2 years

Des

ign

rule

/ R

esol

utio

n (m

m)

86 88 90 92 94 96 98 00 02 04 06 08

1.0

0.7

0.5

0.35

0.25

0.18

0.13

0.10

0.07

0.05

year

0.035

10

25 - 50Mhz

66-100Mhz

200 - 300 Mhz

500 - 600 Mhz

1-3 Ghz

≥ 3 Ghz

Future Processors 4-? Ghz

Processors

Incr

easi

ng P

erfo

rman

ce


Projection Lenses of Carl Zeiss SMT AG


Microlithography Optics enable Moore’s Law bigger Lenses for Finer Details

First stepper lens 436nm 365nm 248nm 193nm 193nm

immersion

Optics have increased pixels/field ~24.000x !

NA k

l = Res

NA k · =

1 Resolution

13.5nm

Stepper / Scanner

David Mann (GCA) 4800

ASML /40

ASML /300

ASML /1100

ASML 19X0i

ASML 3100

NA 0.28 0.4 0.57 0.75 1.35 0.25

Resolution (nm) 1400 700 250 100 38 27

No. of pixels x 10^9 0.05 0.4 10 86 594 1177

weight (kg) 2 20 250 400 1080 688

1st prototype 1975 1987 1995 2000 2007 2009


Projection Lens Starlith® 1900i

Technical Key Data

•  Wavelength 193 nm

•  NA 1.35

•  RMS optical performance < 0.9 nm

•  Height 1290 mm

•  Weight 1080

kg


Content








Projection Optics EUV – Alpha Demo Tool

Key Technical Data

•  Wavelength 13.5 nm

•  Height 1500 mm

•  Weight 790 kg

•  Resolution 50 nm (early PO) 40 nm (AD1, AD2)

•  Aberrations < 3 nm (early PO) 1.4 nm (AD1, AD2)


EUV Mirror Specs: Compared to Real World

100 mm

1000 km

peaks of 2 mm in area of Germany

2962 m

Germany

surface roughness of ~ 0.2 nm corresponds to

mirror surface roughness about 0.2 nm


Alpha-Tool schematic Representation

ca. 1 m


Content








EUV-System

ca. 1 m

EUV source

reticle

wafer


Thermal Boundary Conditions Heat Loads and Heat Sinks

ca. 1 m

EUV source

reticle

wafer Heat Loads •  EUV source compartment, total generated heat flux within the source >> 10 kW

•  EUV-light absorbed by the mirrors, max. absorbed heat flux > 500 W

•  Actuators / motors, sensors, electrical components, …

Heat Sinks (Coolers) •  Water cooled heat sinks and heat shields at temperature sensitive components.


Thermal Boundary Conditions Heat Transfer

Heat Transfer

•  Heat conduction in solids

•  Heat transfer solid / solid

•  Heat transfer in atmosphere in rarefied gases - conduction and / or convection also in small gaps - heat transfer fluid / solid – fluid / solid interaction – with consideration of the slip condition.

• IR-radiation with consideration of - the view factors of all components - the emissivities of all components

Radiation is important specially for bigger distances between heat exchanging components and in case of high temperatures; the hottest components reach a temperature >> 700 °C.


Thermal Boundary Conditions Output to be Evaluated

Output

•  Transient thermal analyses of the whole EUV system.

All components with every single heat transfer between solid/solid and fluid/solid,

emissivities, view factors, thermal conductivity, heat capacity and density are taken into account.

For the temperature sensitive components

a stability in the µK/min-range must be reached.

•  Transient thermal-elastic analyses show the deformations over time.

The transient deformations in the pm/min-range are important.


StarCCM+ Simulation Model

dummy POB to test the handling

Summary Data CFD: Number of Cells: > 4.5 million

Number of Structure Properties: > 20

Number of Fluids: 1 (atmosphere)

Number of Interfaces including thermal resistance models: > 130

Number of regions: > 50


Content








Fluid Properties

EUV atmosphere Unit

Molecular weight M = … [g/mol]

No. of energy storage modes f = … [1]

Lennard-Jones length = … [Å]

Lennard-Jones energy /k = … [K]


Slip Boundary and Knudsen Number


Content








StarCCM+ Simulation CFD-Model


Summary Data CFD: Number of Cells: > 4.5 Mio

Number of Structure Properties: > 20

Number of Fluids: 1 (atmosphere)

Number of Interfaces including thermal resistance models: > 130

Number of regions: > 50


StarCCM+ Simulation first Result thermal Simulation


This CFD-simulation shows hot spots, which are short term effects in the beginning of the heating.

In general the heat generating components have different time constants and the generated heat of these components has different heat paths to the temperature sensitive elements and/or to the heat sink.

The heat loads of some heat generating components are even transient, so that we have transient heat loads as an input for a transient CFD-simulation.


StarCCM+ Simulation CFD-Model POB Test Facility

CFD model of the vacuum chamber

POB

schematic representation of the test facility

photo of the vacuum chamber within the test facility

vacuum chamber

Within the vacuum chamber different scenarios can be tested.

vacuum chamber


StarCCM+ Simulation Results POB Test Facility (Vacuum Chamber)

vacuum chamber

Hot spots at the outside of the vacuum chamber can be seen according to the

heat generating POB components.

The heat transfer mechanism from the heat generating POB components

to the vacuum chamber is radiation and conduction/convection.

with POB

inside

photo of the vacuum chamber within the test facility

CFD model of the vacuum chamber


Content








Summary and Benefits

Benefits •  The results of the transient CFD-simulation is an important input to quantify the thermal stability of the EUV-system. •  This information is essential during the layout and detailed design phase. •  The results of the transient thermal simulations help in the design of coolers to prohibit hotspots.

•  Within a test facility (vacuum chamber) different scenarios can be tested.

Summary •  Max. absorbed heat loads > 500 W •  Temperatures > 700 °C

•  Heat transport mechanisms: - heat conduction in solids - heat transfer solid/solid - heat transfer conduction/convection in rarefied gases, also in small gaps - heat transfer fluid/solid in rarefied gases with consideration of slip condition - radiation, all view factors and emissivities are taken into account

•  Complex model with > 4.5 million elements, > 20 structure properties, > 130 interfaces, … •  Transient thermal input for transient thermal CFD-simulations. •  Thermal stability in the µK/min- and pm/min-range must be guaranteed.


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