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Challenges in dimensional metrology and the European Metrology Research Programme
Ruedi Thalmann, METAS
• Aims to develop new measurement capabilities which have a strategic impact for Europe
• With the overall goal to accelerate innovation and competitiveness necessary to improve quality of life
European Metrology Research Programme (EMRP)
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“The programme objective is to accelerate the development of new measurement capabilities and to improve significantly the dissemination and application of knowledge generated throughout the stakeholder community.”
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European Metrology Research Programme (EMRP)
Fully managed by EURAMET e.V., 22 participating countries, restricted toNMIs and designated institutes, industrial and university partnership
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EMRP Outline 2008
NIMTech Workshop, 22.02.2011, R. Thalmann
• Coordination of the national research and development programmes that continue to be conducted at a national level (outside core EMRP);
• Joint programme as delivered by the NMIs and DIs, namely research and innovation in measurement science;
• R&D in fundamental and underpinning measurement science; Knowledge transfer activities to support the research and innovation;
• Capacity building activities (grants);
• Promotion, governance and management.
EMRP: Five topics
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iMERA-plus, 2008 – 201121 joint reserach projects in 4 Targetted Programmes• Broader SI• Health• Electricity• Length Projects in progress
64 M€, 21 M€ provided by the European Commission
European Metrology Research Programme (EMRP)
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European Metrology Research Programme (EMRP)
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EMRP, Art. 169, 2010 – 2017, 11 dedicated calls, 400 M€2009 Energy Projects in progress2010 Environment
Metrology for Industry Projects in negotiation2011 Health II
SI Broader scope Call in progress New Technologies
2012 Metrology for Industry (II)SI Broader scope (II)Open excellence call
2013 Energy IIEnvironment II
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Challenges in dimensional metrology
• DM for advanced manufacturing
• DM for micro/nano technology
• Long range DM
• DM for a better SI
According to the roadmaps developed by EURAMET TC-Length for theEuropean Metrology Research Programme (EMRP)
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8NIMTech Workshop, 22.02.2011, R. Thalmann
Triggers
Targets
Experimentalrealisation
Metrologicalapplication ofbasic science& technology
Enablingscience &
technology
2005 2010 2015 2020
Dimensional metrology for advanced manufacturing te chnologiesCost effective sustainable manufacturing of innovative products with structures down to 10 µm and up to 10 m, facing requirements of increased complexity, normative requirements, higher measuring speed and reduced tolerances
Short range dimensionalmetrology 0.01 mm < L< 10 mm U < 0.05 µm
Probe-surface interaction including soft surfaces
Automatic uncertainty evaluation (virtual instruments)
3D-Segmentation andevaluation of large data files
Numerical artefacts –software datasets
Influences of environment (refractive index, temperature, vibrations, dust,…)
Existing procedures, sensor principles, ...
Dimensional metrology < 10 m in measuring room (U < 10-7) in production environment (U < 10-6)
Measuring instruments for short rangeunder industrial conditions
Advanced traceability methods for in-process metrology
Measuring instruments in labs for complex and freeform geometries
Next generation of sensors and measuring instrumentation(Computer Tomography , indoor-GPS, Laser tracker, Laser
interferometer, incremental scales, rangefinders/ADMS)
Multi-parametric results from high resolution point clouds
Measuring instruments for 10 m-range under industrial conditions
Artefacts for small objects or those with non-cooperative surfaces
U < 0.01 µm U < 0.005 µm
Fast and precise positioning (mechatronics, PZT motors,stick slip, DC, advanced servo controls
New materials, advanced computers and IT, ...
Research facilities for metrology in non-laboratory environment
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DM for advanced manufacturing
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Challenges in dimensional metrology
NIMTech Workshop, 22.02.2011, R. Thalmann
Cost effective sustainable manufacturing of innovative products with structures
down to 10 µm and up to 10 m, facing requirements of increased complexity,
normative requirements, higher measuring speed and reduced tolerances.
DM for advanced manufacturing: Targets
• Measurements in production environment (temperature, vibration...):U < 10-6
• Measurements under laboratory conditions:U < 10-7
• Small workpieces (0.01 mm ... 10 mm):U < 0.05 µm … 0.005 µm
• Large structures (... 10 m)
• Measurement of complex objects(including free form geometric elements)
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Challenges in dimensional metrology
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DM for advanced manufacturing: Tools
• Next generation sensors:CT, indoor GPS, laser trackers, range finders, …
• Fast and precise positioning
• Advanced data evaluation:data fusion, handling of large data sets, …
• Automatic, task specific uncertainty evaluation: virtual instruments
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Challenges in dimensional metrology
NIMTech Workshop, 22.02.2011, R. Thalmann
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Challenges in dimensional metrology
DM for micro/nano technology
• Nanoparticles (traceable size, shape, distribution)
• Traceable 2D(3D) metrology at sub-nm accuracy over sub-mm range:nano rulers (optical and x-ray interferometry), probe/surface interaction
• Traceable 2D(3D) metrology at nm accuracy over several 100 mm range:semiconductor production, EUV-lithography, x-ray-mirrors, photomasks
• Multi-parametrical characterization of new functional materials
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Challenges in dimensional metrology
Long range DM
• High accuracy length measurement up to 1 km- air refractive index- range finding (absolute distance measurement) with multi-wavelengthinterferometry or modulated sources
- new sources (fs combs)
• Traceability of global mapping systems (GPS, Galileo) with calibrated baselines
• 3D metrology in large scale production (< 100 m)- laser trackers- indoor GPS
NIMTech Workshop, 22.02.2011, R. Thalmann
4 joint research projects within iMERA-plus TP Length
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• Nano particles : Alexandre Cuenat, NPL (UK)
• Nano trace : Marco Pisani, INRIM (IT)
• NIMTech : Frank Härtig, PTB (DE)
• Long range : Jean-Pierre Wallerand, LNE (FR)
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Traceable Characterisation of Nanoparticles T3.J1.1, Nanoparticles
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Project Partners:NPL: United KingdomCEM: SpainCMI: Czech republcINRIM: ItalyMETAS: SwitzerlandMIKES: FinlandPTB: Germany
JRP Coordinator:Dr. Alexandre Cuenat, NPL, [email protected]
Publishable summary: Summary
NIMTech Workshop, 22.02.2011, R. Thalmann
Objectives
• traceable calibration of nanoparticles• new measurement services for the analysis of nanoparticles
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Issues addressed
• Calibration of individual techniques
• Specification of diameter, size and size distribution
• Sampling issues
• High-aspect ratio particles
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Which diameter matters?
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Diameter Definition
Stokes diameter dst Diameter of free falling sphere which would fall at the same rateas the particle in a given fluid
Seive diameter dT Minmum square aperture through which the particle will passVolume diameter dv Diameter of the sphere with the same volume as the particleSurface diameter ds Diameter of the sphere that has the same surface area as the
particleProjected area diameterdA Diameter of the cirle which has the same area as the projected
area of the particleFeret’s diameter dF Distance between two parrallel tangents which touch the outline
of the particle projectionAverage Feret diameter dFa
v
Average Feret diameter from diameters measured over all anlgesbetween 0 and180°
Maximum Feret dia. dFmax
Maximum distance between two paralle tangents which touch theoutline of the particle projection
Minmum Feret dia. dFmin
Minimum distance between two paralle tangents which touch theoutline of the particle projection
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Which diameter matters?
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For perfectly spherical particles: dst = ds = dv = dA = …
First goal: to obtain comparable results for the different measurement techniques for spherical reference particles
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Measuring Techniques: Single particle microscopy
TEM, SEM (transmission electron microscopy)++ Provides the highest resolution giving clear shape / structure
information.
-- Expensive, low number of particles analysed, difficultto analyse light elements, agglomerated particles.
SPM (scanning probe microscopy)++ Provides clear contrast independent of the particle composition, can
analyse agglomerated particles, works under liquid.
-- Low number of particles analysed, limited shape info
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DLS (dynamic light scattering)++ Fast, effective and reproducible analysis of a large number of
nanoparticles. Well established technique.
- Highly dependent on sampling, agglomeration a major problem,only works in a narrow concentration range, different measurand, traceability?
SAXS (Small angle x-ray scattering)++ Fast, effective and accurate analysis of a large number of
nanoparticles. Well established technique.
-- Highly dependent on sampling, agglomeration a major problem, only works in a narrow concentration range.
Measuring Techniques: Ensemble methods
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New Traceability Routes for Nanometrology T3.J1.4, NANOTRACE
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Project Partners:INRIM: ItalyCMI: Czech republcBEV: AustriaMIKES: FinlandNPL: United KingdomPTB: GermanyUME: Turkey
JRP Coordinator:Dr. Marco Pisani, INRIM, [email protected]
Publishable summary: Summary
JRP web site: www.nanotrace.it
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Objectives
• 10 pm accuracy in displacement metrology,by refined optical interferometry
• Uncertainty reduction of one order of magnitude with respect to the present state of the art
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• Development of new interferometer techniques• Realization of a transfer standard• Implementation of the NPL X-ray interferometer to calibrate
the transfer standard• Comparison of non transportable interferometers
Project description
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x-ray interferometer: the ultimate reference
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developed for COXI project, adapted for Nanotrace
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The transfer standard
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• High accuracy actuator used for indirect comparison between interferometers
• Range 100 µm, uncertainty 10 pm
• Optical layout identical to the XRI
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Development of new interferometric techniques
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optical setup to minimize the signal periodicity or to generate electronic signals of higher quality;
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Metrology for New Industrial Measurement Technologi esT3.J2.2, NIMTech
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Project Partners:PTB, GermanyCMI, Czech republicINRIM, ItalyMIRS/UM-FS, SloveniaNPL, United Kingdom
JRP Coordinator:Dr. Frank Härtig, PTB, [email protected]
JRP web site: www.euramet.org/index.php?id=nimtech
Publishable summary: Summary
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Objectives
Development of new industrial measurement technologies that:
• Ensure traceability in 3D coordinate metrology for complex geometries and freeform surfaces
• Improve manufacturing capability by increasing the understanding of complex manufacturing systems
• Provide input to standards specifications and encourage best metrology practice
• Strengthen the European NMIs
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Absolute long distance measurement in air T3.J3.1, Long Distance
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Project Partners:CNAM: FranceBEV: AustriaCEM: SpainCMI: Check republicFGI: FinlandINRIM, ItalyMIKES: FinlandVSL: NetherlandsPTB: Germany
JRP Coordinator:Dr. Jean-Pierre Wallerand, CNAM, [email protected]
JRP web site: www.longdistanceproject.eu
Publishable summary: Summary
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ObjectivesRealisation of instruments enabling measurement of d istance up to 1 km outdoor with a relative accuracy of 10 -7
•Refractive index: spectroscopic sensors for direct measurement of spatially integrated temperature and humidity.Target uncertainty: 0.1°C and 4% for relative humidi ty.•Synthetic wavelength systems: Interferometric measurement of distances using wavelengths in the cm range.Target relative uncertainty: 10-7 over several 100 m outdoor.•Femto second laser technology: pulse to pulse interferometry and phase shift measurement of repetition rate (TOF).Target relative uncertainty: 10-6 over 50 m under laboratory condition.
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759,5 760,0 760,5 761,0 761,5 762,00
20
40
60
80
100
-0,4
-0,2
0,0
0,2
0,4
0,6
0,8
1,0
1,2
1,4
1,6
1,8
Rel
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e ch
ange
of l
ine
inte
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[%/K
]12 m absorption path
Tra
nsm
issi
on a
fter
12 m
ab
sorp
tion
path
[%]
Wavelength [nm]
Spectroscopic measurement of temperature
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EO-IM
Beam splitter Mode-matching
λ/4
PD A
Mirror
25 mm (1/e2) beam
λ/4λ/2
λ/2
DFB laserBeam shaping Fiber collimation
67 m
PD B
DFB laser
Shutter Shutter
−∆−
= 0
11
02
01
)(
)( TTk
Erot
eTS
TSRatio
The ratio of the peak heights of two
or more lines depends only on their
molecular parameters and on T (1)
(1) Silver and Kane, Meas. Sci. Technol. 10101010, pp. 845-852 (1999)NIMTech Workshop, 22.02.2011, R. Thalmann
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Superheterodyne Interferometer
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Two synthetic wavelengths generated by AOMs (frequency shifters):
82 MHz AOM at 1064 nm: Λ = 3,65 m
1.7 GHz AOM at 532 nm: Λ = 176 mm
Ref PD 532 nm
Meas PD 532 nm
MeasurementReference
532 nm
1064 nm
Pol
Pol
Broadband λ/4Fresnel rhomb
Ref PD 1064 nm
Meas PD 1064 nm
NIMTech Workshop, 22.02.2011, R. Thalmann
Distance measurement with pulse to pulse interferom etryof a fs frequency comb
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• Measure cross-correlation between pulses for path length difference equal to multiple of interpulse-distance.
• Model pulse propagation in air
1st or 2nd order correlation
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EMRP call 2010: Metrology for industry
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Optical and tactile metrology for absolute form characterization, Michael Schulz, PTB
Form measurements- on flat with uncertainties < 1nm and - on curved surfaces with uncertainties < 10 nm,using imaging (interferometric) and scanning (optical and tactile) methods, developing software for the handling of a large number of data points,investigating error influences for interferometric and tactile scanning methods by modelling and simulation.
NIMTech Workshop, 22.02.2011, R. Thalmann
EMRP call 2010: Metrology for industry
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Thermal design and time-dependent dimensional drift behaviour of sensors, materials and structures, Jens Flügge, PTB
Development of test facilities, techniques and procedures for measurements of dimensional drift;
Investigation of long term drift properties of sensors, materials and structures;
Measurement of thermal behaviour of materials and structures, modelling and optimisation of thermal design.
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EMRP call 2010: Metrology for industry
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Metrology of Small Structures for the Manufacturing of Electronic and Optical Devices, Bernd Bodermann, PTB
Scatterometry and CD-SEM for metrology of advanced functional structures in the sub micrometer-range (e.g. micro-structured surfaces);
Validation and optimisation for application in industry (for this aim, probing strategies for AFM to detect e.g. sidewall angles and vertical surface roughness of sidewalls should be developed);
Development of ”golden” reference standards for metrology in wafer processing making use of the above-mentioned technologies.
NIMTech Workshop, 22.02.2011, R. Thalmann
Further needs
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Basics InstrumentsApplication
(manufact. technology)
nmµm
mm
mkm
Nano particles
Nano trace
Long range
NIMTech
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For
m
Drif
t
Sca
ttero
met
ry
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Conclusion
• The EMRP develops the collaboration between European NMIs, universities and industry
• The programme addresses the stakeholder needs• It allows for collaborative research beyond the possibilities of single institutes• It strengthens the position of smaller NMIs
Further research activities are needed in particula r for• Basic understanding of probe/surface interaction at the very small scale• Dimensional metrology at the meso scale• Improving new sensor principles, such as CT• Metrology for large scale production (indoor GPS…)• Automated uncertainty evaluation through virtual instruments
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