Challenges of Outdoor Lighting & Solution PathwaysEnergy efficient h-igh brightness and great...

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Challenges of Outdoor Lighting & Solution Pathways

Kevin Tan | June 2018 | Webcast LEDs MagazineLight is OSRAM

OSRAM Opto Semiconductors | Webcast LEDs magazineKevin Tan I June 2018

2

AgendaNo Topics

1. Introduction

2. Challenges of Outdoor Lighting

3. Why work with OSRAM OS ?

4. OSRAM OS LED Technolgy and Package Design : OSLON® SQUARE, OSCONIQ® P and DURIS® S

5. Summary


3

Introduction of Outdoor Lighting

Outdoor lighting is the use of light in challenging outdoor condition to illuminate areas such as road, street, stadium, building, tunnel and etc.

It is essential to ensure the safety on driveways, steps and pedestrian pathways around residential area.

As outdoor lighting have more harsh environment than indoor lighting, the main criteria in choosing the right LEDs lies on the expected performance, lifetime, reliability requirement and fast pace dynamic development of LED technology.

In this webinar, OSRAM Opto Semiconductors will share our professional experiences in LEDs Package Design & Technology followed by series of state of the art outdoor products that could fit well into the application.

Specifically on White Epoxy Mold Compund (EMC) based LEDs, we have transferred our knowledge in automotive field in combining competitive lead frame technology and high power chips for supporting high volume market need of General Lighting.


4

Today’s challenges of a LED in modern environment


5

Application Requirement for Outdoor Lighting

Energy efficient - high brightness and great efficacy.

Intended beam angle and radiation pattern – lensed or without lensed LEDs.

Superior thermal resistance and heat dissipation & management for prolong lifetime.

Luminaire Ingression Protection needs to be waterproof (IP65 & above).

Total Cost of Ownership (TCO) – minimum (easy to install and service).

Superior long lifetime and reliability to minimize maintenance.(>50K hours or 10 -12 years)

Robust against moisture, corrosive and salty environment.

100% Instant Light – support dimming feature.

Street Light

Tunnel Light Stadium Light

Architectural Light

High Mast

Flood Light

http://www.siteco.com/de/produkte/aussenleuchten/chapter/1550/category/13236/family/12222.html

http://www.siteco.com/de/produkte/aussenleuchten/chapter/1550/category/13236/family/12222.html


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AgendaNo Topics

1. Introduction




5. Summary


7

Challenges of Outdoor Lighting

1. Broad range of Operating Temperatures• LED performance predominantly relies on the ambient temperature of the operating environment.• Adequate heatsinking or cooling is essential to maintain a long lifetime for LEDs.

2. Impacts of High Temperatures Variation• Accelerate the aging and degradation of luminaire system and LED components • Material expansion and contraction during temperature fluctuation will reduce significantly the reliability of LED

component interconnect and solder joint area of LEDs with PCB.

3. Humidity – Damn Environment• LED component absorbs moisture in high humidity environment and could damage LED chip inside the package.• Magnitude of electrostatic discharge (ESD) is higher in low humidity environment and could damage LED components inside

the luminaire.

4. Sulphur corrosion – Industrial Environment• Sulphur reacts with silver, Ag element in LED component to form Silver Sulfide, Ag2S, which causes significant brightness

degradation.

5. Salt corrosion – Salty Environment• Salt atmosphere origin from coastal area or de-icing salt on road can damage luminaire and also LED component inside it.


8

Outdoor temperature fluctuation imposes STRESS on LED solder joint !

• Outdoor temperature changes due to weather, climate and geographic location.• LED and PCB expand and contract when temperature changes, causing stress on solder joint.

Temperature change

Solder joint crack after long term thermal cycling.

LED and PCB expand at different frequency. It intensifies the stress on solder joint when there is CTE mismatch between LED and PCB.

Proven Finding: Ceramic LED & PCB CTE is typically 6x difference; EMC Leadframe LED & PCB CTE is only 2x difference. Larger size (eg: 5050 or 7070) has higher risk to CRACK !! Dimension is crucial !!

Note : CTE - Coefficient ot Thermal Expansion


9

Humidity impose moisture and ESD stress on LED component

Moisture level is high in high humidity environment. High risk of electrical short of LED component due to condensation.

Moisture will also be absorbed into LED component and could damage the LED.

Low humidity increases magnitude of electrostatic discharge (ESD) and could damage the LED chip.

LED needs to be designed with low permeability encapsulantand high ESD immunity to operate in wide humidity range.


10

Sulphur corrosion can lead to significant permanent brightness degradation

• Sulphur reacts with silver content inside LED and forms Silver Sulfide.

• Silver Sulfide is a black color crystal structure which can lead to brightness degradation as much as 30 –40%.

• Sources of Sulphur content:• Vehicle exhaust gas, in the form of SO2,

concentrated especially in tunnel.• Outgassing from rubber gaskets or seals of

luminaire (containing Sulphur compounds).

Plating on ceramic substrate turn dark due to Sulphur corrosion after test. Resulted >10% brightness degradation.

Before After

Plating on leadframesubstrate turn dark due to Sulphur corrosion after test. Resulted >10% brightness degradation.


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Salty atmosphere can damage LED package or LED chip inside the package

• De-icing salt on road or bridges and coastal area create salty atmosphere in the environment.

• Salt compound may diffuse into LED package and damage LED chip inside the package.

• LED needs to be designed with low permeability encapsulant to prevent absorption in salty atmosphere.

Corroded LED chip.


12

AgendaNo Topics

1. Introduction




5. Summary


13

Why to work with OSRAM OS? Leverage expertise from OSRAM OS to improve the profitability of your business.

STREETLIGHTING INDUSTRIAL LIGHTING

Automotive environment

condition

Street & Industrial

environment condition

~If failure

It’s about safety = human life engagement

It’s about warranty = money engagement

If failure


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OSRAM OS What make the difference ?


15

Street & Industrial LightingHow to improve profitability?

Led X from Top3 Led supplier flagship product for street lighting with very long lifetime prediction of LM80/TM21 report. However after standard corrosion test…

Black = Silver has been corroded -5% loss of performance = Loss of

warranty = maintenance = Loss of money

OSRAM OSLON SquareOSCONIQ® P 3737 2WOSCONIQ® P 3737 3WOSCONIQ® P 7070

No silver No corrosion

What happens when using non-reliable LED?

Lifetime based in LM80/TM21 is not enough for outdoor applications.

We have quality reports, get in touch with your OSRAM OS partner


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Led Y from Top3 Led supplier flagship product for street lighting with very long lifetime prediction of LM80/TM21 report.

However after temperature cycle test…

OSCONIQ® P 3737 2WOSCONIQ® P 3737 3WOSCONIQ® P 7070

What happens when using non-reliable LED?

Lifetime based in LM80/TM21 is not enough for outdoor applications.

Uf

(Chi

p 1,

700

.0m

A) [

%]

90.0

92.5

95.0

97.5

100.0

102.5

105.0

107.5

110.0

Readout [C]

0 200 400 600 800 1000 1200 1400

We have quality reports, get in touch with your OSRAM OS partner


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Standard Tests Performed Condition DurationResistance to soldering heat (RTSH) JESD22-A113

Reflow soldering 260°C

3x

Temperature & humidity bias (T&HB)JESD22-A101

TA =85, R.H.= 85%;IF = 100mA

1000h

Temperature storage (TS) JESD22-A101

TA = -40°C, 1000h

Temperature cycle (TC)JESD22-A104

-40°C/+125°C15min each extreme

1000c

Steady state life test (SSLT)JESD22-A108

TA = -40°CIF = 1800mA

1000h


TA = 100°CIF = 1800mA 1000h


TA = 125°CIF = 800mA 1000h


TA = 125°CIF = 1400mA(overstress)

1000h

Pulse life test (PLT)JESD22-A108

TA = 55°CIF = 2000mAtp = 0.1ms; DC = 3%

1000h

Hydrogen Sulphide TestIEC 60068-2-43

15ppm H2S25°C/75%R.H. H

15ppm H2S 40°C/90%R.H.

504h

336hElectro Static Discharge (ESD)ANSI/IESDA/JEDEC JS-001

Human Body Model 8000V

OSRAM OS Qualification Process assures Product Quality before market launch

• OSRAM Opto Semiconductors product qualification process is developed based on widely recognized industry standard (JEDEC, IEC, ANSI & etc.).

• Product passing the qualification tests is confident to operate under actual field application condition.


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What happens when using low Performance LED?Led A: 310lm @700mA 2,8V Ts85C 158lm/WLed B: 298lm @700mA 2,8V Ts85C 152lm/WΔperformance=158/152 +4%

If Led B has to reach the same performance of Led A =158lm/W Underdrive Led B:Led B : 248lm @560mA 2,76V Ts85C 158lm/W ΔLed Count=310/248 +25% Led B needs to be 25% cheaper than Led A

Using lower performance LED = Using more LED = Using more Lenses = Using more PCB Surface.

Using 4% better performance LED

ΔPerformance

ΔPrice


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AgendaNo Topics

1. Introduction




5. Summary


20

OSRAM Opto UX:3Leading LED Chip Technology for High-Power

Ideal Chip Technology for High-Power Applications requiring high flux density, efficacy and superior robustness.

Used in high volume >10 years for Outdoor and Industrial Lighting, Automotive, and many more.

UX:3 Surface EmittersUniform light extraction Uniform current linearity Ultimate thermal resistance


21

OSRAM UX:3 Chip TechnologyComparison to Sapphire Chips

UX3 Chip Sapphire Chip

Emission Characteristics

Surface Emitter NO side emission

Volume EmitterSide emission

Chip to Chip spacing in CoBs

≤150umNO crosstalk !

< 400um Crosstalk

LuminousIntensity Very High Moderate

Efficacy High HighTyp. current range 0.05 – 3 A 0.01 – 0.25 AOSRAM Products OSLON Square, OSCONIQ P DURIS S5, S8, S10

n p


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1. OSLON® SQUARE integrated with BEST technology to overcome outdoor challenges

Plating

- Plated with anti-corrosion alloy.

- Superior performance against Sulphur corrosion.

LED Encapsulant

- Very low permeability silicon material.- Effectively prevents moisture

absorption and other contaminant penetration.

ESD Diode

- Built in high grade ESD diode.- Ability to withstand up to ESD

8kV.

Substrate

- Aluminium nitride ceramic material with highest thermal conductivity.

- Provides better thermal dissipation.

Chip

- Highly efficient LED chip based on OSRAM-OS ThinGaN technology.

- Excellent efficacy at high driving current.

• Top efficacy in industry.• Superior robustness and long lifetime.• Superior performance against corrosion.


23

OSLON® SQUARE Evolution Roadmap

Next Gen OSLON(Y2020)

OSLON SQUARE Gen 5

(2019)340-355lm

(170-180lm/W)

>180lm/W

2018/192020

OSLON SQUARE Gen 3

(Giant)OSLON

SQUARE SCOSLON SQUARE LT

<280lm(140lm/W)

280-300lm(140-150lm/W)

300-325lm(150-165lm/W)

< 20142014/15

2016/17Started 2005/6

OSLON SQUARE Gen 4

(Q4 2018)325-340lm

(165-175lm/W)

2017/18


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2. OSCONIQ® P - QFN EMC Package with Long Lifetime Incorporated Know-How from OSRAM Automotive

Plating

- Plated with anti-corrosion alloy.

- Superior performance against Sulphur corrosion.

LED Encapsulant

- Very low permeability silicon material.- Effectively prevents moisture

absorption and other contaminant penetration.

ESD Diode

- Built in high grade ESD diode.- Ability to withstand up to ESD

8kV.

Chip

- Highly efficient LED chip based on OSRAM-OS ThinGaN technology.

- Excellent efficacy at high driving current.

Packaging

- High grade epoxy molded compound + metal leadframe.

- CTE closely matched with PCB to eliminate solder joint crack due to CTE mismatch.

• High efficacy• Superior robustness and long lifetime.• Superior performance against

corrosion.


25

OSCONIQ® P Package Construction

Reliable Package Design and Superior Corrosion Robustness

Surface emitting

chip

Compared to other EMC LEDs,OSCONIQ® P series eliminate luminous flux degradation by package browning due to superior packaging design. • Surface top emitting chip (no side emitted lights)• TiO2 protection layer (cavity is protected) • Light extracting lens (direct light upward).


26

OSCONIQ® PSuperior Solder Joint Reliability

Thermal cycling stress is causing fatigue failures, especially in the solder jointcomes down to lifetimes beyond 15K hours.

Outdoor luminaires are exposed to large temperature variations, increasing stress on the solder joint between LED and PCB.

Under extension Accelerated Life Test (ALT), OSCONIQ® P shows superior resistance to thermal cycling stress.

ALT : induce field failure in lab at much faster rate, harsher & representative environment.

Failure Criteria : Standard IPC-9701 (PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS) defines 20% increase of resistance as a failure. It corresponds to +2% increase in Uf by considering the LED diode behavior.

360 cycles from 10°C to 50°C per year (due to on/off-switching)

In addition long-term cycles: 20x delta T of 90°C (e.g. -20°C/+70°C) per year. (frost, intensive solar radiation)

Exemplary real life data:

Paper published by J.Kloosterman from Philips Lighting. Solder Joint Reliability in SSL Application.


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Solder Joint Reliability : Accelerated Thermal Cycling OSCONIQ® P7070 vs Competitors

Thermal Cycles

Res

ista

nce

+20%

Competitor C Competitor L

• Competitors Results: CTE Mismatch -> Cracked Solder JointsAluminium Nitride ceramic -> Significant CTE mismatch

• P7070 stable, 6000+ thermal cycles• No Vf-increase, no cracks found.

OSCONIQ® P7070

TC -4

0/85

°CTC

-40/

110°

C

Epoxy molded compound (EMC) + metal lead frame -> NO CTE mismatch


28

OSCONIQ® P series covers all brightness ranges from 1W - 12Wat Highest Quality and Performance Standards

OSCONIQ P 3737 (2W)GW PUSRA1.PM317 lm ; 162 lm/W1)

2 mm2 chip3.7 x 3.7 mm2 footprint700mA…1500mA

OSCONIQ P 3737 (3W)GW PUSTA1.PM479 lm ; 166 lm/W1)

GW PULTA1.CM (Flat)350 lm ; 121 lm/W 4 mm2 chip3.7 x 3.7 mm2 footprint1050mA…3000mA

1) 85 °C, 5000 K, CRI70

OSCONIQ P 7070 (8-12W)GW P7STA1.PM1190 lm ; 148 lm/W1)

4 x 2 mm2 chips7 x 7 mm2 footprint700mA…1000mA; 12V1400mA…2000mA ; 6V

OSCONIQ P 3030 (1W)GW QSSPA1.PM160 lm ; 163 lm/W1)

1 mm2 chip3.0 x 3.0 mm2 footprint350mA…1300mA


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3. Chip Array SMD (CAS) DURIS® S8 & S10 Designed for Economical Consumer Outdoor

Outdoor / Industrial High Efficacy

>170 lm/W @ 3.6W, 25’C CRI 70≥ 200lm/W @ 1W

Low LED count designs Long Lifetime

L70>54khrs, Ts=85’C Proven Outdoor Robustness Pass Salt-Fog and H2S test

Residential Streetlight

High Bay

Flood Light Parking

Sconce LightsCanopy

DURIS® S8 WEMC

Silicone filled with phosphor Leadframe

50

60

70

80

90

100

110

0 1,000 2,000 3,000 4,000 5,000 6,000 7,000 8,000 9,000

Lum

en M

aint

enan

ce (%

)

Time (h)

55 °C / 200 mA

85 °C / 200 mA

105 °C / 200 mA

115 °C / 200 mA

L70 EoL


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Advantages of DURIS® S8 & S10 for Outdoor LightingSignificant saving in System Cost

lm/W

Price

Low/Mid Power (2835 / 3030)

High Power 1W-2W Ceramics

DURIS® S8

DURIS® S10

> 200lm/W

System costreduction

Advantages vs Low/Mid Power Suitable for High Efficacy design

>>150lm/W Less LEDs & Design space, more

compact. Simple Optics, cheaper system cost

Advantages vs Ceramics Up to 20% Higher Efficacy

when under drive at 1-2W Less LEDs, cheaper system

cost


31

AgendaNo Topics

1. Introduction




5. Summary


32

Street & Industrial LightingWith which products?

New

Product Positioning and Strengths:

OSCONIQ® P 3737 2W

OSCONIQ® P 3737 3W

OSCONIQ® P 7070

OSLON® Square 3030

Flagship withindustry

leading lm/W

Value option with

high lm/$ and lm/W

Large die option for

boosting lm/W and / or

reducing LED count

Multi-die option withhigh flux for

reducingsystem cost

DURIS® S 8 DURIS® S 10

Multi-die sapphire LED with scalable flux output at highest lm/$

Multi-die sapphire LED with scalable and highest

flux output at highest lm/$

Award for the most seen product


33

Out

door

robu

stne

ss

Premium

Improved

200 300 400 500 600 700 800 900 1000 1100 1200 1300 1400 1500 1600 1700 1800

Ballpark Flux (lm) per LED at typ. current


New

DURIS® S 8 DURIS® S 10

values based on CRI70 / 5000K

OSLON® Square

OSCONIQ® P 3737 2W OSCONIQ® P 3737 3W OSCONIQ® P 7070


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Type Q3 2018 Performance*

OSLON® SquareGW CSSRM2.PM3030

Std bin 320lm N5@T85C – 700mA – Vf=2,8V

OSCONIQ® P 3737 2W GW PUSRA1.PM3737

Std bin 310lm N4@T85C – 700mA – Vf=2,8V

OSCONIQ® P 3737 3WGW PUSTA1.PM3737

Std bin 460lm NE@T85C – 1050mA – Vf=2,75V

OSCONIQ® P 7070 8WGW P7STA1.PM7070

Std bin 1160lm VJ @T85C – 700mA – Vf=11,5V

DURIS® S8-10chipGW P9LT32.PM5050

Std bin 658lm QP@T25C – 750mA – Vf=6.3V

DURIS® S10-24chipGW P7LP32.PM7070

Std bin 1640lm RU@T25C – 300mA – Vf=38V

*subject to change

*Performance for 5000K – CRI70 min

New

Device LM80

OSLON® Square@700mA – Ts85

L70(9k) > 54kh – L90(9k) >54khDLC premium achieved

OSCONIQ® P 3737 2W@700mA – Ts85

L70(10k) > 60kh – L90(9k) >30khDLC achieved

OSCONIQ® P 3737 3W@1050mA - Ts85

L70 (7k) > 42kh - L90 (7k) > 42 khDLC premium achieved

OSCONIQ® P 7070 8W@700mA – Ts85

L70 (6k) > 36kh - L90 (6k) > 36 khDLC premium achievedNote : Aug 18 for 9kh data.

DURIS® S8@150mA – Ts85


DURIS® S10@300mA – Ts85


DLC Premium is a higher-performance classification for luminaires and retrofit kits. Requirements: L70 ≥50,000 hours + L90 of >36,000 hours.


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Contact

Kevin Tan

General Lighting Application EngineeringOSRAM Opto Semiconductors (Malaysia) Sdn. Bhd.

Email : [email protected] : +6019 477 0467

mailto:[email protected]


36

THANK YOU

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Challenges of Outdoor Lighting & Solution PathwaysEnergy efficient h-igh brightness and great...

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