CHANGE NOTICE Date Prepared: 10/29/02 1. 2. … · c revision c (reference sscbds ... dcn 001 is...

CHANGE NOTICE Date Prepared: 10/29/02

1. The Boeing Company Johnson Space Center

2.

Proposed

3. Code Ident. 4. Change Notice No. DCN 002

Houston TX 77058 X

Approved 5. Contract No.

NAS15-10000

6. Directive No.

7. Document No./Rev.

SSP 30312 Revision H

8. Document Title

Electrical, Electronic, And Electromechanical (EEE) And Mechanical Parts Management And Implementation Plan For Space Station

9. SSCN No.

SSCN 005645

10. Related Change No.

11. Change Title

Exceptions To SSP 30312 Revision H

THIS NOTICE INFORMS RECIPIENTS THAT THE DOCUMENT IDENTIFIED BY THE NUMBER (AND REVISION LETTER) SHOWN IN BLOCK 7 HAS BEEN CHANGED. THE PAGES CHANGED BY THE CN BEING THOSE FURNISHED HERE WITH AND CARRYING THE SAME DATE AS THIS CN. THE PAGES OF THE PAGE NUMBERS AND DATES LISTED BELOW IN THE SUMMARY OF CHANGED PAGES COMBINED WITH NON-LISTED PAGES OF THE ORIGINAL ISSUE OF THE REVISION SHOWN IN BLOCK 7 CONSTITUTE THE CURRENT VERSION OF THIS SPECIFICATION.

12. CN No. 13. Pages Changed (Indicate Deletions) S* A* 15. Date

DCN 002

DCN 002

Revision and History Page Pages D-66 through D-140

S

A

10-29-02

10-29-02

14. Technical Concurrence /s/ Kinn Roopwah 10-29-02 Date

* “S” indicates supersedes earlier page. “A” indicates added page.

SSP 30312, Revision H, DCN 002 October 29th, 2002

i

REVISION AND HISTORY PAGE

REV. DESCRIPTION PUB. DATE

BASELINE ISSUE (REFERENCE SSCBD BB000228, EFF. 01-15-87) 01-15-87

A REVISON A (REFERENCE THE ELECTRONIC BASELINE VERSION) 07-30-88

B REVISION B (REFERENCE SSCBD BB000420A, EFF. 05-30-89)

CHANGE B1 (REFERENCE SSCBD BK000420C, EFF. 12-30-90)

07-30-89

02-15-91

C REVISION C (REFERENCE SSCBDs BB000762 EFF. 05-15-91 AND BB000727 EFF. 09-28-90)

CHANGE C1 (REFERENCE SSCBD BB000987AR1 EFF. 09-06-91)

CHANGE C2 (REFERENCE SSCBD BB10247 EFF. 06-04-92)

CHANGE C3 (REFERENCE SSCBDs BB003141 EFF. 0623-92 AND BK050042 EFF. 06-23-92)

07-91

09-91

06-92

07-92

D REVISION D (REFERENCE SSCBDs BB003141 EFF. 06-23-92 AND BK050042 EFF. 06-23-92)

CHANGE D1 (REFERENCE SSCBDs BB000893B EFF. 06-23-92 AND BB000893BR1 EFF. 07-30-92)

CHANGE D2 (REFERENCE SSCBDs BB000893C EFF. 11-20-92 AND BB000893D EFF. 11-20-92)

CHANGE D3 (REFERENCE SSCBD BB000093 DR1 EFF. 05-06-93

07-92

09-92

12-92

05-93

E REVISION E (Reference SSCBD: 00002 Eff. 02-07-94) 03-23-94

F REVISION F INCORPORATES ECP 145 (REFERENCE SSCBD 000145 EFF. 10-31-95)

11-27-95

G REVISION G INCORPORATES SSCN 001685 06-16-00

H REVISION H INCORPORATES SSCN 002439 03-26-02 DCN 001

DCN 001 IS AUTHORIZED BY SSCN 004415 AND INCORPORATES EXCEPTIONS 093, 094 AND 095

03-29-02

DCN 002

DCN 002 IS AUTHORIZED BY SSCN 05645 AND INCORPORATES EXCEPTIONS 053 THROUGH 092 AND 096, 097, 098 AND 099

11-04-02

ERU: /s/ M. Hehn 11-04-02

DCN 001 SSCN 004415

DCN 002 SSCN 05645


D - 66

Exception 053 To SSP 30312 Requirements

SUBMITTAL DATE EXCEPTION NO. REV. FLIGHT #(s) PAGE

2/15/00 053 - 4A 1 of 1 SYSTEM ORIGINATOR and PHONE NO. ORGANIZATION / CONTRACTOR

ISS EEE Parts/Boeing-Canoga Park END ITEM/CONFIG. ID NO. NEXT ASSEMBLY(s) PART NUMBER DESCRIPTION

F015291-0006

LDC 9115

Diode, Silicon, Rectifier, High Efficiency (UES

1304, UES 1305, UES 1306)

SPECIFICATION NUMBER SPEC. PARAGRAPH NO. MANUFACTURER LOCATION

SSP 30312 Paragraph 4.0, Data Requirements Microsemi Habitable: X Non-Habitable:

ISSUE DESCRIPTION: Tier 1 contractors are responsible for requiring data from lower tier contractors as necessary to support compliance with requirements. The Microsemi screening traveler on this lot of diodes was not properly completed. RATIONALE: (use continuation sheets if required) LORAL procured these diodes, and performed the requisite Incoming Inspection when Microsemi delivered them. Although the traveler for 100% Screening are blank, there exists objective evidence that Loral had received, reviewed and approved the complete data package which includes the aforementioned data. The data in the package provided evidence that the entire 650 pc lot was properly tested, with only 0.9% fallout over burn-in, and this defect allowance is well within the 10% allowed by the 015291 component specification. Rocketdyne has in its possession a complete DPA report for the subject lot/date code. The complete data package was reviewed and approved by LORAL. However the screening summary provided by Microsemi was incomplete. The LORAL review and acceptance of the Microsemi data package is sufficient to support compliance with requirements.

The lack of attribute data for 100% Screening became known to Rocketdyne after the required 5-year data retention period from the manufacturer. In addition, there exist no known GIDEP, NASA, Boeing, or supplier alerts against this manufacturer since 1990. RSOP 13.7 describes Rocketdyne’s automatic notification and tracking system for such alerts.

DISPOSITION BOEING PCB CHAIR NASA PCB CHAIR DATE APPROVE DEFER REJECT

/s/ Curtis G. Tallman /s/ W. David Beverly 2/15/00 X

COMMENTS: (use continuation pages if required) Document this exception in SSP 30312.

DCN 002


D - 67





F015580-0010

LDC 9526

Diode, Temperature Compensated, Zener

Reference (ref 1N4565A-1 thru

1N4574A-1)


SSP 30312 Paragraph 4.0, Data Requirements Microsemi Habitable: X Non-Habitable:

ISSUE DESCRIPTION: Tier 1 contractors are responsible for requiring data from lower tier contractors as necessary to support compliance with requirements. The Microsemi test report indicates that the wrong sample size was selected for Solderability testing. RATIONALE: (use continuation sheets if required) The 015580 Specification requires Solderability to be inspected in the Group B, subgroup 2A test sequence. For this particular lot, a 6-piece sample was to be selected for test. Microsemi incorrectly selected only 3 pieces for this test, but the records show that those samples passed the Steam Age / Solderability sequence. The original lot size was 228 pieces, and no subsequent solderability problems were found when those parts were installed on pc boards. In addition, there exists no known GIDEP, NASA, Boeing, or supplier alerts against this manufacturer since 1990. RSOP 13.7 describes Rockeydyne’s automatic notification and tracking system for such alerts. Due to the acceptable results on the original solderability test, and the fact that no subsequent solderability problems were detected when the parts were installed.




DCN 002


D - 68



2/17/00 055 - 4A and SUBQ 1 of 1 SYSTEM ORIGINATOR and PHONE NO. ORGANIZATION / CONTRACTOR

ISS Son Hoang 818-586-0681 EEE Parts/Boeing-Canoga Park END ITEM/CONFIG. ID NO. NEXT ASSEMBLY(s) PART NUMBER DESCRIPTION

BCDU (All Configurations) D016015-0001

Diode, Silicon, Power Rectifier, Fast

Recovery

RE 1807 S/N 0003 thru 0029


SSP 30312 3.5.1 Microsemi Corp. Habitable: Non-Habitable: X

ISSUE DESCRIPTION: The D016015-0001 Power Rectifier (diode) module is used in BCDU applications. The D016015-0001 completed 100% screening and qualification tests with the exceptions to Physical dimensions, Resistance to solvent, Salt atmosphere, Moisture resistance, Shock/ Vibration/ Constant acceleration, Intermittent life-2000 cycles, and Steady State Operational Life. RATIONALE: (use continuation sheets if required)

Physical Dimensions: The Diodes were installed into Fault Isolator assembly with no mechanical installation problems noted. Resistance to Solvents: Build records documented use of D016015-0001 with the Lot Date Code: 9516, 9543, 9719, 9830, and 9906. There were no marking rub off noticeable of diode modules. Salt Atmosphere: The BCDU ORU is covered but not sealed. However, all components are conformal coated during assembly and once P6 is launched, the salt atmosphere should not be an issue. Shock/ Vibration/ Constant Acceleration: This is a non-cavity device module. Similarly constructed diode modules have passed shock/ vibration/ and constant acceleration. Intermittent Life – 2000 Cycles: The component was surge tested at 100A @ 500 mS for 10 surges, which exceeds the estimated number (4) of on orbit faults. Also, during the ORU ATP testing, the diodes are activated only 102 times. Steady State Operational Life: The device module using in BCDU applications is not steady state application.




DCN 002


D - 69



2/18/00 056 - 4A and SUBQ 1 of 1 SYSTEM ORIGINATOR and PHONE NO. ORGANIZATION / CONTRACTOR


BCSU (All Configurations)

RM3605-001

Diode, Unidirectional Voltage Supressor

R 072610-51 S/N X830114, X830115, X650610, C253487 and C290758



ISSUE DESCRIPTION: The RM3605-001 Unidirectional Voltage Suppressor module (Diode) is used in BCSU applications. The RM3605-001 completed 100% screening and qualification tests with the exceptions to Salt atmosphere and Constant Acceleration. Additionally, the qualification samples sizes were less than specified in the specification. RATIONALE: (use continuation sheets if required)

Salt Atmosphere: The BCSU ORU is covered but not sealed. However, all components are conformal coated during assembly and once P6 is launched, the salt atmosphere should not be an issue. Constant Acceleration: The Constant Acceleration test was not done during qualification, but component shock and vibration qualification tests were completed. In addition, vibration test was performed on the diode module as part of DCSU qualification during acceptance test. Additional Information: The application of this component is considered low stress. The component is used to suppress common mode voltage between the return line and the chassis during chassis faults. The component failure history was verified: No diode modules have failed in operation. The component meets derating requirements. The average power of the component specification is 12.0W Sec while the IEA/Primary power system generates .084 W Sec.




DCN 002


D - 70





R078486-11

RM2694-002

Diode, Rectifier Module, 600 V, 50 A

R 078486-11 S/N X830282 and X830283



ISSUE DESCRIPTION: The RM2694-002 Rectifier module (Diode) is used in IDA applications. The RM2694-002 completed 100% screening and qualification tests with the exceptions to Physical dimensions, Resistance to solvent, Salt atmosphere, Moisture resistance, and Surge. Additionally, the qualification sample sizes were less than specified in the specification

RATIONALE: (use continuation sheets if required) Physical Dimensions: The Diodes were installed into Initialization Diode Assembly (IDA) with no mechanical installation problems noted. Resistance to Solvents: Build records documented use of RM2694-002 with the Lot Date Code: 9721 and serial numbers X830282 and X830283. There were no marking rub off noticeable of diode modules. Salt Atmosphere: The (IDA) is covered but not sealed. However, all components are conformal coated during assembly and once Z1 is launched, the salt atmosphere should not be an issue. Moisture Resistance: Same as Salt Atmosphere. Surge Test: The surge current test was not done in qualification but was completed as part of 100% screening. IF(surge) = 800A TP = 8.3 mSec, six surges. One surge/minute max. Additional Information: Usage of IDA is measured in days. Should the diode fail, an alternate channel can be used to charge the Batteries on the IEA. The parts meet all derating parameters. The component failure has been checked: No components have failed operation.




DCN 002


D - 71



2 March, 2000 059 N/C 3A 1 of 1 SYSTEM ORIGINATOR and PHONE NO. ORGANIZATION / CONTRACTOR

ISS Seak Lee 818-586-3960

EEE Parts/Boeing-Canoga Park

END ITEM/CONFIG. ID NO. NEXT ASSEMBLY(s) PART NUMBER DESCRIPTION

F015992-0XXX Capacitor, Ceramic, Fixed, CCR type

All ORU


SSP 30312 3.2.1.2 AVX Habitable: Non-Habitable: X

ISSUE DESCRIPTION: Missing Group B Data. RATIONALE: (use continuation sheets if required)

Receiving report show a one paragraph stating that Group B was done. These parts are built to MIL-C-20 specification, with additional QCI test as follow: IR, Low Voltage Humidity, Capacitance & DF test. There is read and record data for the additional QCI test, however, no attribute data for Group B test. Within the receiving report, there is Quality Conformance Inspection summary for each different type of MIL-C-20 capacitors built during that period, the summary includes Group A, subgroup 1 and Group B subgroups 1, 2, 3 and life The lots of capacitors with different values have been procured, and DPA was successfully performed on each of them, the DPA reports are as follows:

J4787 for –103F (1000pF, 100V), LDC9431 J4805-2 for –473F (47000pF, 50V), LDC9430 RR4J016257 for –333F (33000pF, 50V), LDC9430 RR4J016948 for –823F (82000pF, 50V), LDC9430

AVX is an approved Class S manufacturer for MIL-C-20 devices. DISPOSITION

BOEING PCB CHAIR NASA PCB CHAIR DATE APPROVE DEFER REJECT



DCN 002


D - 72



24 February, 2000 060 N/C 4A 1 of 1 SYSTEM ORIGINATOR and PHONE NO. ORGANIZATION / CONTRACTOR

ISS Seak Lee 818-586-3960



RM2658-001 LDC9632

Hybrids RPCM


SSP 30312 4.4 Aeroflex Habitable: X Non-Habitable: X

ISSUE DESCRIPTION: Missing 100% bond pull data. RATIONALE: (use continuation sheets if required)

Data includes a summary of the bonds pulled. However, number of devices tested are not specified. The bonds that were pulled meets requirements. The lot did successfully pass DPA test, which included 100% bond pull on the test (qty 1) sample as documented in report J6200, and the ORU where the parts are being used has also successfully passed the qualification test.



COMMENTS: (use continuation pages if required) Document this exception in SSP 30312. DCN

002


D - 73



24 February, 2000 061 - 3A 1 of 1 SYSTEM ORIGINATOR and PHONE NO. ORGANIZATION / CONTRACTOR


F015212-0XXX Diode, Transient Suppressor (1N5907, 1N5629A – 1N5665A)

DDCU MBSU PS A/E


SSP 30312 3.2.1.2b Microsemi Habitable: Non-Habitable: X

ISSUE DESCRIPTION: Missing data for Terminal strength and missing test limit on traveler for maximum pulse current test. RATIONALE: (use continuation sheets if required)

ORU where parts are used has been complete vibration test, which confirmed terminal strength to be acceptable. Since the manufacturer Microsemi is a QPL supplier for the equivalent JANTXV devices, their process are being monitored by the government on a continuing basis for compliance. There are also three DPA reports that confirm the lot meets the SCD requirement, the report are: RR4J014883 for –0038, LDC9307 J4300-1 for –0018, LDC9325 J5349-2 for –0004, LDC9324




DCN 002


D - 74



March 10, 2000 062 - 3A & SUBQ 1 of 1 SYSTEM ORIGINATOR and PHONE NO. ORGANIZATION / CONTRACTOR

ISS Joel Bruemmer 818-586-9346



R076500 R076522 R079903

F015212-0XXX DDCU-I DDCU-E

DDCU-HP SPECIFICATION NUMBER SPEC. PARAGRAPH NO. MANUFACTURER LOCATION

SSP 30312 4 Boeing Habitable: X Non-Habitable: X

ISSUE DESCRIPTION: The following component fails the derating criteria on the DDCU Power Supply D. Ref Des Part Number Description Parameter Part Rating Derating Value Nominal Value (W/C) Stress Ratio R12 RLR07C1500FS Resistor, Fixed 150 OHM 0.25W 0.15W 0.150417W 60.2% RATIONALE: (use continuation sheets if required)

Under nominal conditions R12 in PSD will dissipate 0.106 Watts. When the +15 Vdc is at its highest value (15.25V), the value of zener D3 is at its lowest value (10.45V), and R12 is at its highest value (151.5 ohm), then the power will be 0.150417 Watts which is over the derated value of 0.15 Watt. This is not likely to happen since temperature will not allow these values to vary in opposite directions.




DCN 002


D - 75



3/11/00 063 - ISS 1 of 3 SYSTEM ORIGINATOR and PHONE NO. ORGANIZATION / CONTRACTOR

ARIS Rack Gary R. De La O 256.961.1494

Boeing, Huntsville

END ITEM/CONFIG. ID NO. WIRE HARNESS/PART NUMBER DESCRIPTION NEXT HIGHER ASSY 683 L55A N/A See Attached Sheets 683-61600-001


SSP 30312 4 Boeing Habitable: X Non-Habitable: X

ISSUE DESCRIPTION: (use continuation pages if required) The following components did not meet the derating criteria for microcircuit supply voltages on the Active Rack Isolation System (ARIS). However, the applied voltages are below the manufacturer’s recommended values.

SEE ATTACHED PAGES. RATIONALE: (use continuation sheets if required)

In all cases, the microcircuits exceeded the supply voltage (positive and negative) derating criteria by 0.04. The supply voltages are standard power supply voltages and are recommended for use by their respective manufacturers.



COMMENTS: (use continuation pages if required)

DCN 002


D - 76

Exception 063 To SSP 30312 Requirements (continued) REMOTE ELECTRONICS UNIT ASSEMBLY, Part No. 683-61623-001

Printed Wiring Assembly, Accelerometer Board, Part No. 683-61622-001

Ref Des Part Number Description Parameter Actual Stress

Rated Value

Stress Ratio

SSP 30312 Limit

U1 683-61930-003 Op Amp V - 15.1 18 0.84 0.80 + 15.1 18 0.84 0.80

U5 683-61930-003 Op Amp V - 15.1 18 0.84 0.80 + 15.1 18 0.84 0.80

U12 683-61930-003 Op Amp V - 15.1 18 0.84 0.80 + 15.1 18 0.84 0.80

U16 683-61930-003 Op Amp V - 15.1 18 0.84 0.80 + 15.1 18 0.84 0.80

U20 683-61930-003 Op Amp V - 15.1 18 0.84 0.80 + 15.1 18 0.84 0.80

U23 683-61930-003 Op Amp V - 15.1 18 0.84 0.80 + 15.1 18 0.84 0.80

U27 683-61930-003 Op Amp V - 15.1 18 0.84 0.80 + 15.1 18 0.84 0.80

U31 683-61930-003 Op Amp V - 15.1 18 0.84 0.80 + 15.1 18 0.84 0.80

U34 683-61930-003 Op Amp V - 15.1 18 0.84 0.80 + 15.1 18 0.84 0.80

U48 683-62215-001 Op Amp V - 15.1 18 0.84 0.80 + 15.1 18 0.84 0.80

Printed Wiring Assembly, Position Sensor Board, Part No. 683-61615-001

Ref Des Part Number Description Parameter Actual Stress

Rated Value

Stress Ratio

SSP 30312 Limit

U20 683-61930-004 Op Amp V - 15.1 18 0.84 0.80 + 15.1 18 0.84 0.80

U21 683-61930-004 Op Amp V - 15.1 18 0.84 0.80 + 15.1 18 0.84 0.80

U22 683-61930-004 Op Amp V - 15.1 18 0.84 0.80 + 15.1 18 0.84 0.80

U23 683-61930-004 Op Amp V - 15.1 18 0.84 0.80 + 15.1 18 0.84 0.80

U24 683-61930-004 Op Amp V - 15.1 18 0.84 0.80 + 15.1 18 0.84 0.80

U25 683-61930-004 Op Amp V - 15.1 18 0.84 0.80 + 15.1 18 0.84 0.80

U28 683-62215-001 Op Amp V - 15.1 18 0.84 0.80 + 15.1 18 0.84 0.80

DCN 002


D - 77

Exception 063 To SSP 30312 Requirements (continued)

ACTUATOR DRIVER ASSEMBLY, Part No. 683-61760-001

ELECTRONICS MODULE, Part No. 683-61762-001

Printed Wiring Assembly, Amplifier Interface, Part No. 683-61560-001

Ref Des Part Number Description ParameterActual Stress

Rated Value

Stress Ratio

SSP 30312 Limit

U2 683-62212-022 Op Amp V - 15.1 18 0.84 0.80 + 15.1 18 0.84 0.80

U3 683-61930-006 Op Amp V - 15.1 18 0.84 0.80 + 15.1 18 0.84 0.80

U10 683-62212-022 Op Amp V - 15.1 18 0.84 0.80 + 15.1 18 0.84 0.80

CONTROLLER DRIVER ASSEMBLY, Part No. 683-61566-001

Printed Wiring Assembly, Digital Analog Converter, Part No. 683-61696-001

Ref Des Part Number Description ParameterActual Stress

Rated Value

Stress Ratio

SSP 30312 Limit

U2 683-61930-009 Op Amp V - 15.1 18 0.84 0.80 + 15.1 18 0.84 0.80

U3 683-61930-009 Op Amp V - 15.1 18 0.84 0.80 + 15.1 18 0.84 0.80

U10 683-61930-009 Op Amp V - 15.1 18 0.84 0.80 + 15.1 18 0.84 0.80

U10 683-61930-009 Op Amp V - 15.1 18 0.84 0.80 + 15.1 18 0.84 0.80

DCN

002


D - 78



17March00 064 N/C 4A 1 of 3

SYSTEM ORIGINATOR and PHONE NO. ORGANIZATION / CONTRACTOR

ISS Paul Lockwood 818-586-7155 EEE Parts/Boeing, Canoga Park

END ITEM/CONFIG. ID NO. WIRE HARNESS/PART NUMBER DESCRIPTION NEXT HIGHER ASSY RE1806-03 See Attached List Field Effect Devices SSU


SSP 30312 Appendix B.3.2.4, Transistor, Field Effect, Derating Factor

Various Habitable: Non-Habitable: X

ISSUE DESCRIPTION: (use continuation pages if required) SSU Field-effect devices were derating to the requirements of SSP 30312, Revision D (0.75 derating factor), and all parts meet that requirement. Revision F of SSP 30312 requires derating to 0.60, and several parts do not meet that requirement (see attached list). RATIONALE: (use continuation sheets if required)

Parts were selected to meet the requirements of SSP 30312 Revision D, as that was the controlling document at the time the SSU design was finalized. Reliability assessments were made with the Revision D requirements taken into consideration, and no detrimental effects were noted. PV Electronics Team comments regarding these MOSFET applications are attached (see page 2).




DCN 002


D - 79


MOSFET – GATE SOURCE VOLTAGE Failure mechanism is a breakdown/perforation of the silicon oxide layer between the gate and source regions (see IR application note 937 A). This occurs when the gate-to-source voltage exceeds 20V. Destruction of the MOSFET occurs when the gate-to-source voltage is high enough to arc across the gate dielectric and thus burn a microscopic hole in the gate oxide layer. International Rectifier in Application Note 955 provided this information. There is no documentation referring to a degradation of performance at gate-to-source voltages in the range of 15 volts to 20 volts. There are just the warnings to stay below the maximum rating of 20 volts. International Rectifier in Application Note 930A indicates that the :t20 volt absolute maximum gate voltage rating should never be exceeded or permanent damage can occur . Both the SSU and BCDU design was completed using the guidelines of SSP 30312 revision D. This document states that the MOSFET breakdown voltage [BV(GSS)] maximum stress ratio is 0.75. At this point only a major redesign, re-fabrication ltest of new ORUs and scrapping of completed ORUs would allow Loral to conform with the requirements of SSP 30312 Revision F. There has been no reliability data or failure analysis to support changing the BV(GSS) stress ratio from 0.75 to 0.60. The MOSFET vendors indicate that there is no degradation of parameters due to 15 volt operation just the possibility of failure if the gate-source voltage is above 20 volts. The application engineer at International Rectifier believes that the device will function above 20 volts and this requirement is conservative. What we now have is two magnitudes of safety margin built into the gate-source breakdown voltage rating. Unless data is presented relating to the effect on the reliability of the MOSFETs using a gate drive of 15 volts, we recommend using the parts as is. PV Electronics 3/16/00

DCN 002


D - 80


SSU – DERATING FOR FET TRANSISTOR Vgs

PART NUMBER

PART TYPE DESCRIPTION QTY ASSEMBLY MODULE Ref Des Rated Vgs

(Volts)

Actual Vgs

(Volts)

Ratio 0.6 Factor (S/B

<1)


<1) F015829-A001 IRHF7130 Transistor, MOS Field

Effect Semiconductor Device

3 E040034-01 Current Monitor

Q2, Q4, Q6

+/- 20 15 1.25 1.00

JANS2N3822 2N3822 Transistor, JFET Semiconductor Device

6 E040054-03 PVCE-2 Q10, Q11, Q12, Q13, Q14, Q15

50 30 1.00 0.80

JANS2N3822 2N3822 Transistor, JFET Semiconductor Device

1 E040054-03 PVCE-2 Q16 50 5 0.17 0.13

D016097-A001 IRHM7360 Transistor, MOS Field Effect Semiconductor Device, N Channel

1 E040067-03 Failsafe Assembly

Q1 +/- 20 6 0.50 0.40



Q2, Q3 +/- 20 11 0.92 0.73



Q4, Q5, Q8

+/- 20 8.5 0.71 0.57

D015888-0001 2N4858A Transistor, JFET, N-Channel, Switch, Silicon

3 E040073-01 Failsafe Logic Q1, Q3, Q7

-40 -17 0.71 0.57

F015551-A001 IRHC7360SE (Q1-Q4: Part Hybrid)

Microcircuit, Hybrid, Quad, HEXFET w/ Drivers

1 E040081-01/02

Ramp Generator

U3 +/- 20 15 1.25 1.00

F015551-A001 IRHC7360SE (Q1-Q4: Part Hybrid)

Microcircuit, Hybrid, Quad, HEXFET w/ Drivers

2 E040094-01 thru -10

8 String Module

U3, U10 +/- 20 15 1.25 1.00

D016097-A001 IRHM7360SE Transistor, MOS Field Effect Semiconductor Device, N Channel

5 E040525-03 DC/DC Converter

Q1, Q2, Q5, Q6, Q7

+/- 20 10 0.83 0.67

D016102-A001 IRHM7450SE Transistor, MOS Field Effect Semiconductor Device, N Channel

2 E040525-03 DC/DC Converter

Q3, Q4 +/- 20 10 0.83 0.67

DCN 002


D - 81



17March00 065 N/C 4A 1 of 3


ISS Paul Lockwood 818-586-7155 EEE Parts/Boeing, Canoga Park

END ITEM/CONFIG. ID NO. WIRE HARNESS/PART NUMBER DESCRIPTION NEXT HIGHER ASSY RE1807-03 See Attached List Field Effect Devices BCDU


SSP 30312 Appendix B.3.2.4, Transistor, Field Effect, Derating Factor

Various Habitable: Non-Habitable: X

ISSUE DESCRIPTION: (use continuation pages if required) BCDU Field-effect devices were derating to the requirements of SSP 30312, Revision D (0.75 derating factor), and all parts meet that requirement. Revision F of SSP 30312 requires derating to 0.60, and several parts do not meet that requirement (see attached list). RATIONALE: (use continuation sheets if required)

Parts were selected to meet the requirements of SSP 30312 Revision D, as that was the controlling document at the time the BDCU design was finalized. Reliability assessments were made with the Revision D requirements taken into consideration, and no detrimental effects were noted.

PV Electronics Team comments regarding these MOSFET applications are attached (see page 2).

DISPOSITION

BOEING PCB CHAIR NASA PCB CHAIR DATE APPROVE DEFER REJECT



DCN 002


D - 82


MOSFET – GATE SOURCE VOLTAGE Failure mechanism is a breakdown/perforation of the silicon oxide layer between the gate and source regions (see IR application note 937 A). This occurs when the gate-to-source voltage exceeds 20V. Destruction of the MOSFET occurs when the gate-to-source voltage is high enough to arc across the gate dielectric and thus burn a microscopic hole in the gate oxide layer. International Rectifier in Application Note 955 provided this information. There is no documentation referring to a degradation of performance at gate-to-source voltages in the range of 15 volts to 20 volts. There are just the warnings to stay below the maximum rating of 20 volts. International Rectifier in Application Note 930A indicates that the :t20 volt absolute maximum gate voltage rating should never be exceeded or permanent damage can occur . Both the SSU and BCDU design was completed using the guidelines of SSP 30312 revision D. This document states that the MOSFET breakdown voltage [BV(GSS)] maximum stress ratio is 0.75. At this point only a major redesign, re-fabrication ltest of new ORUs and scrapping of completed ORUs would allow Loral to conform with the requirements of SSP 30312 Revision F. There has been no reliability data or failure analysis to support changing the BV(GSS) stress ratio from 0.75 to 0.60. The MOSFET vendors indicate that there is no degradation of parameters due to 15 volt operation just the possibility of failure if the gate-source voltage is above 20 volts. The application engineer at International Rectifier believes that the device will function above 20 volts and this requirement is conservative. What we now have is two magnitudes of safety margin built into the gate-source breakdown voltage rating. Unless data is presented relating to the effect on the reliability of the MOSFETs using a gate drive of 15 volts, we recommend using the parts as is. PV Electronics 3/16/00

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D - 83


BCDU – DERATING FOR FET TRANSISTOR Vgs

PART NUMBER


(Volts)

Actual Vgs

(Volts)


<1)


<1) D016097-A001 HRM7360SI Transistor, MOS Field

Effect Semiconductor Device, N-Channel, Silicon

2 E040090-01 Battery Heater Switch

Chassis Parts

Q1, Q2 +/- 20 15 1.25 1.00

F015534-A001 IRMF7230 Transistor, Field Effect Semiconductor Device, N-Channel, Silicon

2 E040406-02 BSCCM PS Q10, Q15 +/- 20 15 1.25 1.00

D015987-A001 IRHM7130 Transistor, MOS Field Effect Semiconductor Device, N-Channel, Silicon

1 E040410-03 LVBC Q3 +/- 20 15 1.25 1.00

D015988-A001 1RHM7230 Transistor, MOS Field Effect Semiconductor Device, N-Channel, Silicon

2 E040410-03 LVBC Q1, Q2 +/- 20 15 1.25 1.00


1 E040429-03 FI Lower Chassis

Q3 +/- 20 13.5 1.13 0.90

D015989-A001 1RHM9130 Transistor, Field Effect Semiconductor Device, P-Channel, Silicon

1 E040429-03 FI Lower Chassis

Q4 +/- 20 13.5 1.13 0.57

D015980-A001 SFET OCTA Transistor, Field Effect Semiconductor Device, N-Channel, Silicon

2 E040461-01 SuperFET Q1, Q2 +/- 24 12 0.83 0.67

F015854-A001 IRHF7110 Transistor, MOS HEX Field Effect Semiconductor Device, N-Channel, Silicon

2 E040465-01 Gate Drive Assy

U3, Q4 +/- 20 15 1.25 1.00

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D - 84


PART

NUMBER PART TYPE DESCRIPTION QTY ASSEMBLY MODULE Ref Des Rated

Vgs (Volts)

Actual Vgs

(Volts)


<1)


<1) F015878-A001 SFET Transistor, MOS Field

Effect Semiconductor Device, N-Channel, Silicon

1 E0404632-02 SuperFET Assy

Q! +/- 40 24 1.00 0.80


2 E041385-02 Bilateral Converter

Assy

Q1, Q3 +/- 20 6 0.50 0.40

F015989-A001 IRHM9130 Transistor, MOS Field Effect Semiconductor Device, P-Channel, Silicon

2 E041385-02 Bilateral Converter

Assy

Q2, Q4 +/- 20 6 0.50 0.40



Q1, Q4, Q11

+/- 20 13 1.08 0.87



Q7, Q8 +/- 20 15 1.25 1.00

D015989-A001 IRHM9130 Transistor, MOS Field Effect Semiconductor Device, P-Channel, Silicon


Q2, Q3 +/- 20 12 1.00 0.80

F015854 IRHF7110 Transistor, MOS HEX Field Effect Semiconductor Device, N-Channel, Silicon

2 E041425-03 Gate Drive CCA

Q6, Q8 +/- 20 11 0.92 0.73

D015853-A001 2N6845 Transistor, Field Effect Semiconductor Device, P-Channel, Silicon

1 E041429-02 PWM CCA Q2 +/- 20 6 0.50 0.40

D015854-A001 IRHF7110 Transistor, MOS HEX Field Effect Semiconductor Device, N-Channel, Silicon

5 E041429-02 PWM CCA Q3, Q12, Q13, Q14, Q15

+/- 20 15 1.25 1.00

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D - 85


PART NUMBER


(Volts)

Actual Vgs

(Volts)


<1)


<1) D015888-0001 2N4858A Transistor, JFET, N-

Channel Switch, Silicon 8 E041429-02 PWM CCA Q4, Q5,

Q6, Q7, Q8, Q9, Q10, Q11

- 40 - 12.5 0.52 0.42

D016027-A001 2N7278R Transistor, Field Effect Semiconductor Device, N-Channel, Silicon

1 E041505-01 Interface CCA Q4 +/- 20 15 1.25 1.00


2 E041515-02 Logic CCA Q13, Q14 +/- 20 15 1.25 1.00

JANTXV2N6661RS

2N6661 Transistor, Field Effect Semiconductor Device, N-Channel, Silicon

4 E041515-02 Logic CCA Q11, Q12, Q16, Q17

+/- 20 12.5 1.04 0.83

D016097-A001 HRM7360SI Transistor, Field Effect Semiconductor Device, N-Channel, Silicon

7 E041685-03 DC/DC PS Q1, Q2, Q3, Q4, Q5, Q6, Q7

+/- 20 15 1.25 1.00


6 E041709-02 Main Control CCA

Q7, Q8, Q9, Q10, Q11, Q12

+/- 20 15 1.25 1.00


2 E041715-02 Isoconverter / Feedback

CCA

Q7, Q8 +/- 20 15 1.25 1.00

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D - 86


PART

NUMBER PART TYPE DESCRIPTION QTY ASSEMBLY MODULE Ref Des Rated

Vgs (Volts)

Actual Vgs

(Volts)


<1)


<1) D015854-0001 IRHF7110 Transistor, MOS HEX

Field Effect Semiconductor Device, N-Channel, Silicon

28 E041796-01 Phased Control CCA

Q2, Q3, Q4, Q5, Q10, Q11, Q13, Q14, Q15, Q16, Q21, Q22, Q24, Q25, Q26, Q27, Q32, Q33, Q35, Q36, Q37, Q38, Q43, Q44, Q45, Q46, Q47, Q48

+/- 20 15 1.25 1.00

D015888-0001 2N4858A Transistor, JFET, N-Channel Switch, Silicon


Q6, Q7, Q8, Q9, Q17, Q18, Q19, Q20, Q28, Q29, Q30, Q31, Q39, Q40, Q41, Q42

- 40 - 12.5 0.52 0.42

JANTXV2N6661RS



Q1, Q12, Q23, Q34

+/- 20 15 1.25 1.00


7 E041823-03 Diode/FET Assy

Q1, Q2 +/- 20 12 1.00 0.80


4 E041947-01 Controller CCA

Q3, Q4, Q5, Q6

- 40 - 12.5 0.52 0.42



Q1, Q2, Q11

+/- 20 14 1.17 0.93

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D - 87


PART NUMBER


(Volts)

Actual Vgs

(Volts)


<1)


<1) JANTXV2N6661RS



Q10, Q12 +/- 20 15 1.25 1.00

D015854-0001 IRHF7110 Transistor, MOS HEX Field Effect Semiconductor Device, N-Channel, Silicon


Q1, Q3 +/- 20 14 1.17 0.93



Q3, Q4, Q5, Q6

- 40 - 12.5 0.52 0.42

JANTXV2N6661RS



Q7 +/- 20 15 1.25 1.00


2 E041989-01 Gate Drive CCA

Q3, Q4 +/- 20 15 1.25 1.00


1 E042000-02 RBI Assy Q6 +/- 20 14 1.17 0.93

D015989-0001 IRHF9130 Transistor, MOS HEX Field Effect Semiconductor Device, P-Channel, Silicon

1 E042000-02 RBI Assy Q5 +/- 20 14 1.17 0.93


4 E042000-02 RBI Assy Q1, Q2, Q3, Q4

+/- 20 14 1.17 0.93

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D - 88



March 16, 2000 066 - All Flights 1 of 2 SYSTEM ORIGINATOR and PHONE NO. ORGANIZATION / CONTRACTOR

ISS S. Lee 818-586-3960 EEE Parts/Boeing-Canoga Park END ITEM/CONFIG. ID NO. NEXT ASSEMBLY(s) PART NUMBER DESCRIPTION

See Page 2 RM2667-001 LDC 9624, 9716, 9741, and 9742

Microcircuit, EEPROM All ORUs


RM2667 Table VIII 100% Device Screening Elmo Habitable: X Non-Habitable: X

ISSUE DESCRIPTION: PIND failures exceeded 1% for lot date code 9624 on three runs, PIND failures exceeded 1% on lot date codes 9716, 9742, and 9741 on 1 run. However, PIND were not conducted on any of the lots until the failures were less than 1% for a run up to 5 runs as required. Therefore, the parts did not meet PIND test PDA requirement IAW MIL-STD-883, Method 2020, Condition A. RATIONALE: (use continuation sheets if required)

ORU’s where the parts are used has completed vibration testing and showed no failures that can attributed to loose particles. Five failures have been associated with these components. The system failures were analyzed and are due to weak write/read condition, and not related to loose particles. Three are also two DPA reports that confirmed the lot meets the SCD requirement, the reports are: J6677-2, LDC9716 J6325-7, LDC9624 No GIDEP alerts exist against these components.




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D - 89


Part Number ORU Next Assembly RM2667-001 PVM-P6A R076006-1 RM2667-001 PVM-P6A R076006-1 RM2667-001 RPC4IA R072702-41 RM2667-001 RPC4IA R072702-41 RM2667-001 105PG2 R079903-1 RM2667-001 105PG2 R079903-1 RM2667-001 RPC3EA R077418-21 RM2667-001 RPC3EA R077418-21 RM2667-001 RPC1IA R077416-31 RM2667-001 RPC5EA R077419-21 RM2667-001 RPC6EA R077420-21 RM2667-001 RPC4IA R072702-41 RM2667-001 DDCU-I R076500-01 RM2667-001 RPC4IA R072702-41 RM2667-001 RPC5EA R077419-21 RM2667-001 RPC6EA R077420-21 RM2667-001 DDCU-I R076500-101 RM2667-001 370PG2 R072610-31 RM2667-001 370PG2 R072610-31 RM2667-001 RPC2IA R077417-31 RM2667-001 RPC2IA R077417-31 RM2667-001 RPC4EA R072702-31 RM2667-001 230PG2 R075300-1 RM2667-001 RPC3IA R077418-31 RM2667-001 RPC4EA R072702-31 RM2667-001 RPC3IA R077418-31 RM2667-001 RPC5IA R077419-51 RM2667-001 230PG2 R075300-1 RM2667-001 RPC6IA R077420-31 RM2667-001 RPC6IA R077420-31 RM2667-001 RPC5IA R077419-51 RM2667-001 DDCU-EA R076522-11 RM2667-001 DDCU-IA R076500-1 RM2667-001 270PG2 R078480-1 RM2667-001 DDCU-IA R076500-1 RM2667-001 270PG2 R078480-1 RM2667-001 DDCU-EA R076522-11 RM2667-001 MBSUA R072591-11 RM2667-001 MBSUA R072591-11 RM2667-001 RPC2EA R077417-21 RM2667-001 RPC2EA R077417-21 RM2667-001 RPC1IA R077416-31 RM2667-001 320PG2 R072341-1 RM2667-001 320PG2 R072341-1 RM2667-001 Z1TRSA R080850-1 RM2667-001 Z1TRSA R080850-1

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D - 90



3/16/00 068 - ISS 1 of 1 SYSTEM ORIGINATOR and PHONE NO. ORGANIZATION / CONTRACTOR

ARIS Rack Gary R. De La O 256.961.1494

Boeing, Huntsville

END ITEM/CONFIG. ID NO. WIRE HARNESS/PART NUMBER(s) DESCRIPTION DESCRIPTION 683 L55A N/A Digital / Analog

Converter Card Assembly

683-61566-001


SSP30312 4 Boeing Habitable: X Non-Habitable: X

ISSUE DESCRIPTION: (use continuation pages if required) The following components did not meet the derating criteria for capacitor, tantalum solid supply voltages on the Active Rack Isolation System (ARIS).

CONTROLLER ASSEMBLY, Part No. 683-61566-001

Digital / Analog Converter Card Assembly, Part No. 683-61696-001

Actual Rated Stress SSP30312

Ref Des Part Number Description Parameter Stress Value Ratio limit

C1 CWR06HC336KC Capacitor, V +5.1 10 0.51 0.50 Tantalum, Solid

C2 CWR06HC336KC Capacitor, V +5.1 10 0.51 0.50 Tantalum, Solid

RATIONALE: (use continuation sheets if required)

In all cases, the capacitor exceeded the supply voltage derating criteria by 0.01 in a worst case scenario with a 5.1 volt supply maximum rating. However, for normal operation the applied voltage is 5 volt and within the manufacturer’s recommended range.




DCN 002


D - 91


DRAWING NUMBER: 683-61696, PL683-61696 REV. D NEXT ASSEMBLY: 683-61566 DATE: 9/15/99 ASSEMBLY NAME: DIGITAL / ANALOG CONVERTER CARD ASSEMBLY ANALYST: G.R. DE LA O DE-RATING STANDARD: NASA SSP 30312 REV. F UPDATE: 4/25/00

Ref Des Device Description Device Part

Number Parameter Rated

StressApplied Stress

Units Stress Ratio

De-rating Factor

Configuration

C86 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C87 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C136 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C151 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C152 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C153 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C154 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C157 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C158 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C159 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C160 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C162 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING

DCN 002


D - 92


DRAWING NUMBER: 683-61565 REV.A, PL683-61565 REV. D NEXT ASSEMBLY: 683-61566 DATE: 9/20/99 ASSEMBLY NAME: CONTROLLER CARD ASSEMBLY ANALYST: G.R. DE LA O DE-RATING STANDARD: NASA SSP 30312 REV. F UPDATE: 4/25/00


Number ParameterRated Stress

Applied Stress Units

Stress Ratio

De-rating Factor Configuration

C1 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C2 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C3 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C4 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C5 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C6 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C7 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C8 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C9 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C10 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C11 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C12 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C13 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C14 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C15 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C16 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C17 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C18 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C19 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C20 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C21 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C22 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C23 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C24 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C25 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C26 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C27 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING

DCN 002


D - 93






Stress Ratio



DCN 002


D - 94






Stress Ratio



DCN 002


D - 95

Exception 068 To SSP 30312 Requirements (continued) DRAWING NUMBER: 683-61565 REV.A, PL683-61565 REV. D NEXT ASSEMBLY: 683-61566 DATE: 9/20/99 ASSEMBLY NAME: CONTROLLER CARD ASSEMBLY ANALYST: G.R. DE LA O DE-RATING STANDARD: NASA SSP 30312 REV. F UPDATE: 4/25/00




Stress Ratio


C82 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C82 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C84 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C85 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C86 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C87 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C88 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C89 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C90 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C304 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C350 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C351 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C352 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C353 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C354 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C400 CAPACITOR CERAMIC 683-61914-002

(NOVA CAP) VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING

C401 CAPACITOR CERAMIC 683-61914-002 (NOVA CAP)

VOLTAGE 50 5.1 VOLTS 0.10 0.60 CHARGE PUMP


VOLTAGE 50 5.1 VOLTS 0.10 0.60 CHARGE PUMP


VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING


VOLTAGE 50 5.1 VOLTS 0.10 0.60 CAPACITOR GROUND

C804 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C850 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C851 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C852 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C853 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C854 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING

DCN 002


D - 96


DRAWING NUMBER: 683-61715 REV.A, PL683-61715 REV. D NEXT ASSEMBLY: 683-61623 DATE: 9/28/99 ASSEMBLY NAME: POSITION SENSOR ASSEMBLY (REMOTE ELECTRONICS, SERIAL INTERFACE) ANALYST: G.R. DE LA O DE-RATING STANDARD: NASA SSP 30312 REV. F UPDATE: 4/25/00




Stress Ratio


C4 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 POWER SUPPLY FILTERING


C19 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C43 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C44 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C20 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C49 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C50 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C61 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C62 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C63 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C64 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C65 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C66 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C67 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C68 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C69 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C70 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C71 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C76 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 CAPACITOR GROUND C77 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C79 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C120 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C200 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 FIRST ORDER

INTEGRATOR

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D - 97


DRAWING NUMBER: 683-61622 REV.A, PL683-61622 REV. E NEXT ASSEMBLY: 683-61623 DATE: 11/5/99 ASSEMBLY NAME: PRINTED WIRING ASSEMBLY, ACCELEROMETER BOARD ANALYST: G.R. DE LA O DE-RATING STANDARD: NASA SSP 30312 REV. F UPDATE: 4/25/00




Stress Ratio


C5 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C12 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C29 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C36 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C41 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C53 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C60 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C65 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C96 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C102 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 POWER SUPPLY

FILTERING C117 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C118 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C119 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C120 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C121 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING C122 CAPACITOR CERAMIC CDR04BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING

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DRAWING NUMBER: 683-61609 REV.D, PL683-61609 REV. H NEXT ASSEMBLY: 683-61762 DATE: 9/21/99 ASSEMBLY NAME: CONTROLLER CARD ASSEMBLY ANALYST: G.R. DE LA O DE-RATING STANDARD: NASA SSP 30312 REV. F UPDATE: 4/25/00




Stress Ratio








C70 CAPACITOR CERAMIC CDR33BX104AKUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 VOLTAGE DECOUPLING

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D - 99


DRAWING NUMBER: 683-61560 REV.D, PL683-61560 REV. E NEXT ASSEMBLY: 683-61762 DATE: 10/25/99 ASSEMBLY NAME: CONTROLLER CARD ASSEMBLY ANALYST: G.R. DE LA O DE-RATING STANDARD: NASA SSP 30312 REV. F UPDATE: 4/25/00




Stress Ratio


C7 CAPACITOR CERAMIC CDR34BP103AJUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 CAPACITOR GROUND C15 CAPACITOR CERAMIC CDR34BP103AJUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 FIRST ORDER

INTEGRATOR C16 CAPACITOR CERAMIC CDR34BP103AJUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 FIRST ORDER

INTEGRATOR C19 CAPACITOR CERAMIC CDR34BP103AJUS VOLTAGE 50 5.1 VOLTS 0.10 0.60 FIRST ORDER

INTEGRATOR

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D - 100


SUBMITTAL DATE EXCEPTION NO. REV. FLIGHT #(s) 06/13/00 070 4A PAGE1 of 1

SYSTEM ORIGINATOR and PHONE NO. ORGANIZATION / CONTRACTOR SAW Seak Lee

818-586-3960 Boeing – Canoga Park

END ITEM/CONFIG. ID NO. WIRE HARNESS/PART NUMBER(s) DESCRIPTION NEXT ASSEMBLY(s) RE1801-01 N/A DIDOE, BYPASS PV Array

SPECIFICATION NUMBER SPEC. PARAGRAPH NO. MANUFACTURER LOCATION 5838050-503 SSP 30312, Paragraph B.3.2.2.2 Microsemi

SSDI Habitable: Non-Habitable:

ISSUE DESCRIPTION: (use continuation pages if required) 1. Forward current for Microsemi is rated for 5A, the de-rated value should be 2.5A, and the actual apply current is

3.1A maximum worst case. 2. Junction temperature for both Microsemi and SSDI parts are rated at 1500C, derated value should be 1250C, and the actual

temperature the junction experienced is 1410C.

RATIONALE: (use continuation pages if required) Qualification Life test at diode level were performed on both parts successfully, the test conditions were as follow: a) Temp Cycle – 20,000 cycles, -1150C to + 1500C with ramp rate 300C / minute b) Power Cycle – 20,000 cycles, 500C ± 50C to 1500C ± 500C at IF = 3.0A A separate life test for both parts were also successfully tested at 2750C and 3000C for 5000 hours. Successful Qualification and Life test at extreme temperatures justified the parts used in flight that exceeded the de-rating requirement.


/s/ Kinn Roopwah for Curtis G. Tallman

/s/ Madhu Rao for David Beverly

06/13/00 X

COMMENTS: (use continuation pages if required) The bypass diodes are installed in the Solar Array Wing (SAW), normally the diodes are in reverse bias when the SAW is conducting, and switched to forward bias when the SAW is not conducting

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SUBMITTAL DATE EXCEPTION NO. REV. FLIGHT #(s)

6/13/00 071 - 4A PAGE 1 of 1


ISS Paul Lockwood 818-586-7155 EEE Parts/Boeing-Canoga Park

END ITEM/CONFIG. ID NO. WIRE HARNESS/PART NUMBER(s) DESCRIPTION NEXT ASSEMBLY(s)

SAW MD1047 Cable


SSP 30312 Appendix B, para B.3.5.2 Lockheed Habitable: Non-Habitable: X

ISSUE DESCRIPTION: (use continuation pages if required)

In several SAW locations, bundled 16AWG wires are carrying 6.2 amps in worst-case conditions. SSP30312 requires derating of bundled wires of this size to 6.0 amps, maximum.

RATIONALE: (use continuation pages if required) In the Solar Array Wing, the 6.2 amps is a worst-case condition, and is intermittent based upon orbit position and solar exposure. The true average current carried by the 16AWG wires is 5.4 amps.


/s/ Thomas M. Orton for Curtis G. Tallman

/s/ Madhu Rao for David Beverly

6/13/00 X


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D - 102



June20th 2000 072 N/C 8A PAGE 1 of 1 SYSTEM ORIGINATOR and PHONE NO. ORGANIZATION / CONTRACTOR

Rate Gyro Assembly Mohamed Moolji ex 70242 EEE Parts/Boeing-Huntington Beach END ITEM/CONFIG. ID NO. NEXT ASSEMBLY(s) PART NUMBER DESCRIPTION

222044A ISS 34096982 Honeywell NSPAR

No:HIF-0147B LDC9250

Connector Rect.Min. Rck & Panel


SSP 30312 Paragraph 3.3 Positronics Habitable: Non-Habitable: X

ISSUE DESCRIPTION: In NSPAR HIF-0147 B dated 01/08/99, “yes” in box “a” of section 11 was checked, indicating that the part is qualified, but qualification data (boxes “h” and “I” ) were not filled in. Honeywell which uses this part can not locate QCI (Quality Conformance Inspection) data package. RATIONALE: This part was evaluated as part of Boeing- Huntington Beach Flight 8A RGA technical assessment. The conclusion of the study was that there is no impact. The rest of the RGA nonstandard parts had QCI data packages, which indicates that Space Station requirements were complied with as a matter of policy, and QCI data packages in question was simply misplaced. We have completed a GIDEP search on Reynolds connectors dating back to 1990 and found no alerts having any impact to connectors on this NSPAR. Also RGA has passed qualification and acceptance testing. This data is more than 5yrs (LDC 9250) old therefore it exceeds the data retention requirements.



COMMENTS: (use continuation pages if required) Document this exception in SSP 30312

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D - 103






No:HIF-0084 A LDC 9303

Connector & CA Assy, PL RPC


SSP 30312 Paragraph 3.3 Reynolds Habitable: Non-Habitable: X

ISSUE DESCRIPTION: In NSPAR HIF-0084A dated 01/08/99, “yes” in box “a” of section 11 was checked, indicating that the part is qualified, but qualification data (boxes “h” and “I” ) were not filled in. Honeywell which uses this part can not locate QCI (Quality Conformance Inspection) data package. RATIONALE:

This part was evaluated as part of Boeing- Huntington Beach Flight 8A RGA technical assessment. The conclusion of the study was that there is no impact. The rest of the RGA nonstandard parts had QCI data packages, which indicates that Space Station requirements were complied with as a matter of policy, and QCI data packages in question was simply misplaced. We have completed a GIDEP search on Reynolds connectors dating back to 1990 and found no alerts having any impact to connectors on this NSPAR. Also RGA has passed qualification and acceptance testing. This data is more than 5yrs( LDC9303 ) old therefore it exceeds the data retention requirements.




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D - 104






No:HIF-082B LDC 9303

Connector And Cable Assembly, High Voltage


SSP 30312 Paragraph 3.3 Reynolds Habitable: Non-Habitable: X

ISSUE DESCRIPTION: In NSPAR HIF-082 B dated 01/08/99, “yes” in box “a” of section 11 was checked, indicating that the part is qualified, but qualification data (boxes “h” and “I” ) were not filled in. Honeywell which uses this part can not locate QCI (Quality Conformance Inspection) data package. RATIONALE:

This part was evaluated as part of Boeing- Huntington Beach Flight 8A RGA technical assessment. The conclusion of the study was that there is no impact. The rest of the RGA nonstandard parts had QCI data packages, which indicates that Space Station requirements were complied with as a matter of policy, and QCI data packages in question was simply misplaced. We have completed a GIDEP search on Reynolds connectors dating back to 1990 and found no alerts having any impact to connectors on this NSPAR. Also RGA has passed qualification and acceptance testing. This data is more than 5yrs( LDC9303 ) old therefore it exceeds the data retention requirements.




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6/07/00 075 -- ISS 1 of 1 SYSTEM ORIGINATOR and PHONE NO. ORGANIZATION / CONTRACTOR

Video Tape Recorder Micheal Delmas 256.461.2884

Boeing-Huntsville


CI 683138A N/A Interface Circuit Card Assembly

683-51020-001


SSP 30312 3.2.3.1 Boeing Habitable: X Non-Habitable: X

ISSUE DESCRIPTION: The Video Tape Recorder (VTR) assembly part number 683-51020-001 contains an integrated circuit, where it cannot be proven that the PIND test was performed. The integrated circuit is part number 5962-8764601EX and is located on the Interface Circuit Card Assembly Part Number 683-51036-004. This DESC part number 5962-8764601EX was going to have the PIND screening test performed to meet D683-50990-1. The part was kitted in February, 1996 and the drawing was changed to require PIND screening but no evidence can be found that the PIND test was actually performed. The recommendation is to use the part as is for the VTR.

RATIONALE: (use continuation pages if required)

In all cases, integrated circuits procured by Boeing for use in the VTR have had no PIND test performed with the exception of 5962-8764601EX. The risk of use of this part is low since the part has good reliability, the VTR is a criticality 3 item, and two VTRs are being flown on the International Space Station. Futhermore, the VTR contains a TEAC commercial, off-the-shelf, video recorder that is designed for military aircraft applications. This recorder contains electro-mechanical mechanisms that basically establish the reliability of the VTR. Integrated circuits within the TEAC assembly were not subjected to PIND tests. During card level testing, the card is vibrated at levels of 6.1 gRMS with power applied.

The recommendation is to approve the use of this part without PIND testing for the reasons described above. The circuit card assemblies that contain this part are part number 683-51036-004, serial numbers 001001, 001002, 001003 and 001004. A Boeing non-conformance (NC00640) was prepared to document this discrepancy. Also, the remaining parts in stock will be sent out for PIND screening.


/s/ Kinn Roopwah for Curtis G. Tallman

/s/ W. David Beverly 6/29/00 X


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7/17/00 076 C ALL Flights PAGE 1 of 1

SYSTEM ORIGINATOR and PHONE NO. ORGANIZATION / CONTRACTOR ISS Roger W. Parks 256-961-0372 Boeing, Huntsville

END ITEM/CONFIG. ID NO. WIRE HARNESS/PART NUMBER(s) DESCRIPTION NEXT ASSEMBLY(s) 220F03000 220F03082-1,-3,-5,-7,-9,-11 Power Filter Inductor


220F0382 Datatronics Habitable: Non-Habitable:

ISSUE DESCRIPTION: (use continuation pages if required) .Disapproved NSPAR SSI-TBE-0010

RATIONALE: (use continuation pages if required) Qualification Test Results: (100% screening complete) Datatronics Power Filter Inductor P/N 220F03082 Datatronics has completed the Qualification testing dtd 4/12/96 Qty 6 parts completed their testing Qty 2 Subgroup III tests completed without any anomaly. 1 Problem: Corroded lead that completely severed the lead. Datatronics could not reproduce the conditions that caused the corrosion. First Article Test Moisture Resistance test. Pin 4 broke off all, others met requirements. Qty 6 samples broke out of 24 tested. PC mount, round with 4 leads out of the bottom. 2. Problem: The Qualification by similarity per MIL-PRF-27F Appendix A para A4.1

• Similar products (yes) • MFG using same or similar

• Materials (yes) • Process (yes) 3. Problem: Resistance to Solder heat. Qty 4 used should be Qty 8




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7/17/00 077 B- ALL Flights PAGE 1 of 2


END ITEM/CONFIG. ID NO. WIRE HARNESS/PART NUMBER(s) DESCRIPTION NEXT ASSEMBLY(s) 220F03000 220F03090-1 IC, Adj. Lin. Reg.


220F03090C QPL Habitable: Non-Habitable:

ISSUE DESCRIPTION: (use continuation pages if required) .Disapproved NSPAR SSI-TBE-0062B

RATIONALE: (use continuation pages if required) Requirements: • SCD 220F03090 is up-screened from 5962-7703405UX /883 B level part. • Additional screening beyond the 100% 883 method 5004 screening:

• Initial DPA Qty 3 • Temp Cycling 48 hours • Constant Acceleration • Seal • Particle Impact Noise Detection • Electrical Performance • Burn-in for 160 hours @ 125°C • Electrical Performance • Percent Defective Allowable = 5% • X-ray

Results: Qty: 10 and 15 (2 test lots, both LDC 9519) D/C: 9519 Mfg: Omnirel Tested by Pentest. No Failures.





D - 108

(THIS PAGE INTENTIONAL LEFT BLANK)

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D - 109

Exception 077 To SSP 30312 Requirement (continued)

Qualification by generic data Mfg: Omnirel Qty: 15 D/C: 4D9501 Generic P/N: 7703406UA Tested from 5962-8855301TA Tests 100% screening Group A, B, and C Plus 500 hrs Steady State Life @ 135°C & 18V Qty 45 with zero defects. The above qualification was not performed on the flight parts bought and tested, but was done on the generic part type as shown above. The Load Control Assembly is Criticality III hardware and authorized to use Grade B parts.

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D - 110



7/17/00 078 B ALL Flights PAGE 1 of 2


END ITEM/CONFIG. ID NO. WIRE HARNESS/PART NUMBER(s) DESCRIPTION NEXT ASSEMBLY(s) 220F01101-001

Positive Pressure Transducer Assembly

126430 (LM725H/883, LDC 9150)

IC Operational Amplifier


126430 National Semi Habitable: Non-Habitable:

ISSUE DESCRIPTION: (use continuation pages if required) .Disapproved NSPAR SSI-TBE-0076

RATIONALE: (use continuation pages if required) The EEE Part type listed below is used in the Positive Pressure Transducer Assembly. 1. Issue Screening Test Results: P/N 126430 NSPAR SS1-TBE-0076 Generic P/N LM725H/883 National Operational Amplifier Qty 110 lot size, Qty passed 90, Qty failed 20 Date Code H109150A Screening done Visual, Serialization, PIND, Radiographic Insp., Temperature Cycling, Pre-electrical, Dynamic Burn-in (240 hrs @ 125°C) Post Electrical, Hermetic Seal (Fine and gross) and DPA (6 pcs). Problems: Qty 7 devices failed PIND test per MIL-STD-883 Method 2020 condition Qty 4 devices failed Radiographic Inspection Qty 1 failed Power Burn-in (due to operator error) Qty 9 devices failed Delta Computation PDA computation was calculated and the maximum allowable limit of 5% was exceeded. “Taber Industries was notified and per their fax dated 4/6/93 the PDA requirements was waived and ATC was to continue and complete the screening process.” . ** S/N 210 failed both PIND and radiograph inspection (for voids).




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D - 111


Next Assembly Testing in the Positive Pressure Transducer (PPT) P/N: 220F01101-001 Qualification Test report # SS-TS-183B dtd 11/16/98

Test Requirements • Proof Pressure: 3 times, internal pressure • Leakage Tests: internal to external • Output Signal Test: tested to verify signal meets required range, accuracy & output

voltage. • Isolation / Insulation Resistance: 50 Mega Ohms minimum, using 50 V dc source. • Response Time Test: after cycled from low to high pressure. Response time shall

be less than 100 milliseconds. • Power Consumption Test: power consumption less than 0.6 watts steady state with

20psia. • Random Vibration: per SSP41172, 20 Hz to 200 Hz, level 0.8g2/Hz, X, Y, & Z axis. • Electrical Bonding Test: verify low resistance bond exists between PPT & Vacuum

System tubing. • Burn-in: minimum of 300 hrs. • EMI / EMC: verify compliance with emissions & susceptibility requirements of

SSP30327. • Acoustic Noise Generation: • Resonant Frequency Test: no resonant of 50 Hz and below. • Thermal Cycle Test: minimum 24 thermal cycles over +9°F to +150°F. • Output Signal Short Circuit Test: • Input Voltage Surge Test: no damage when 40 to 50 Volts surges. • Input Voltage Reverse Polarity Test: verify no damage when 28 Volt dc input applied

with reverse polarity. • Depressurization / Re-pressurization: verify no damage or performance impaired

when depressurization from 14 psia to 1E-2 torr, for 24 hrs. DCN

002


D - 112



7/17/00 079 - ALL Flights PAGE 1 of 1


END ITEM/CONFIG. ID NO. WIRE HARNESS/PART NUMBER(s) DESCRIPTION NEXT ASSEMBLY(s) 220F01012-003

Vacuum System Assembly (TBE)

220F01087 – 1” Valve 220F01082 - 2½” Valve

Vacuum System Valve EEE Parts

Application Analysis


220ANL1142 – Application Analysis

Marotta Habitable: X Non-Habitable:

ISSUE DESCRIPTION: (use continuation pages if required) .Disapproved Application Analysis for 220ANL1142

RATIONALE: (use continuation pages if required) The Application Analysis (AA) submitted on 7/5/00 includes part derating but does not include an assembly schematic or temperature / environments. The AA submitted on 4/1/96 that was disapproved did have an assembly schematic and part temperature info, but still did not include assembly environments. The two AA listed above are attached. Between the 2 application analyses (attached), there is sufficient electrical and environmental data to provide assurance that none of the EEE parts are being used in excess of their derating requirements.




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7/17/00 080 -A All Flights

1 of 1

SYSTEM ORIGINATOR and PHONE NO. ORGANIZATION / CONTRACTOR ISS Roger W. Parks 818-586-1914 Boeing-Huntsville

END ITEM/CONFIG. ID NO. WIRE HARNESS/PART NUMBER(s) DESCRIPTION NEXT ASSEMBLY(s) 1360AE7010

Sync & Control

1360PD1133-001 Microcircuit, EEPROM

SPECIFICATION NUMBER SPEC. PARAGRAPH NO. MANUFACTURER LOCATION 1360PD1133-001 Atmel Habitable: X

Non-Habitable:

ISSUE DESCRIPTION: (use continuation pages if required) Disapproved NSPAR SS1-LFS-0212. RATIONALE: (use continuation pages if required) Qualification Test Results: Atmel EEPROM Problem: 100% PIND test per MIL-STD-883, Method 2020, Condition A requires that not more than 1% of the lot fail. The failed parts may be removed from the lot and the remaining parts retested with not more than 1% failures. The lot may be retested up to five times to achieve the 1% failure rate. Qty tested: 96 Qty Passed: 94 Qty failed: 2 The issue is the lot was not retested as allowed by the MIL STD. DPA was done, however, on three samples and all passed. The Sync and Control circuit is Criticality III hardware. The 2 %failure rate is not excessive for the upscreen of a commercial part. Since the failed parts were removed from the lot, these EEPROMs are considered acceptable for use-as-is in the Sync and Control Unit.

DISPOSITION BOEING PCB CHAIR NASA PCB CHAIR DATE APPROVE DEFER REJECT /s/ Curtis G. Tallman /s/ W. David Beverly 7/28/00 X


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D - 114

Exception 081 To SSP 30312 Requirement


7/17/00 081 - All Flights

1 of 2

SYSTEM ORIGINATOR and PHONE NO. ORGANIZATION / CONTRACTOR ISS Roger W. Parks 818-586-1914 Boeing-Huntsville

END ITEM/CONFIG. ID NO. WIRE HARNESS/PART NUMBER(s) DESCRIPTION NEXT ASSEMBLY(s) 220RPT0652 U.S. Laboratory

Outfitting Load Control Assembly

EEE Parts

SPECIFICATION NUMBER SPEC. PARAGRAPH NO. MANUFACTURER LOCATION 220RPT0652 Teledyne Brown Habitable: X

Non-Habitable:

ISSUE DESCRIPTION: (use continuation pages if required) Disapproved Application Analysis 220RPT0652. RATIONALE: (use continuation pages if required) The Application Analysis (AA) submitted on 7/18/00 includes: • Power Supply Module (220F03044) • DC Control Module (220F03024) • Stepper Motor Control Module (220F03038) • 1553 Interface Module (220F03019) • 28VDC Converter Module • Motherboard Assembly (220F3015) • EEE Parts Failure Rate Summary Problem Areas: • Power Supply Module (220F03044) The derating analysis for the LCA Power Supply was performed under a worst case environment of 70°C ambient and 70°C board temperature in order to keep results general for use in all applications of the LCA. Reference detailed thermal analysis reports generated for each LCA application for verification that thermal conditions are below the worst case assumptions made for this analysis. U19 and U20 exceeded the input output voltage differential. Transformer T1 exceeded temperature derating. Temp °C Des Desc Derate Oper Parameter Units Rated Derate Oper Ratio Comments T1 Transformer 90 92 DWV Vrms 740 370 260 .7 Max rated temp for mtl 130°C U19 IC, Pos Reg 100 87 input volt V 35 28 19 .68 Output 15V exceeds by .25V U20 IC, Neg Reg 100 87 input volt V 35 28 19 .68 Output 15V exceeds by .25V



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Exception 081To SSP 30312 Requirement (continued)

Problem Areas: (cont) • 1553 Interface Module (220F03019) A table summarizing derating analysis results for the 1553 Interface Module is included in Appendix A. This analysis was performed using applicable SSP30312 Rev F derating criteria. Supply voltage exceeded the derated value on U65 and U74. Temp °C Des Desc Derate Oper Parameter Units Rated Derate Oper Ratio Comments U65, U74 IC, Multiplexer 100 69.95 Supply Voltage V 32 28.8 30 1.04 Supply voltage is Between V+ and V-

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D - 116



22 August 2000 082

A 8A/11A

1 of 2

SYSTEM ORIGINATOR and PHONE NO. ORGANIZATION / CONTRACTOR ISS W. Dykes

(714)896-3311 7-0062 EEE Parts/Boeing-Huntington Beach


222033A/222032A

See below

SARJ/TRRJ

All

SPECIFICATION NUMBER SPEC. PARAGRAPH NO. MANUFACTURER LOCATION SSP 30312

See also SSP 41173 3.14

3.3 and 3.5 LMMS Habitable:

Non-Habitable: X

ISSUE DESCRIPTION: (use continuation pages if required) LMMS has reported that some traceability data was not recorded in the as-built records. The data could only be partially reconstructed from existing data. Two lower tier subcontractors recorded incoming lot and serial numbers but did not record data at next assembly. LMMS had some loss of data due to missing shop orders for TRRJ and SRRJ #1 and #2 only. Summary details are noted on the following page. More details are available in the LMMS letters. RATIONALE: (use continuation pages if required) LMMS has examined the risks associated with flying with limited traceability for the parts noted and determined that there is little risk. Parts have completed qualification and acceptance testing with no failures and there is no trend data indicating that there might be lot related defects. Some traceability data can be recovered during future rework/ repair of affected next assemblies as serial numbers for switch and connectors can be recorded from the next assembly when access is available. Boeing feels that costs associated with traceability recovery are not warranted due to the low risk of needing this data at some future time. Some data is available from procurement records.




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D - 117

Exception 082 To SSP 30312 Requirement (continued)

End Item ORU Responsible subcontractor

Notes

SARJ #1 and # 2

UTA HSSO NZGL00T connectors. (6 types, 8 connectors total)

SARJ, all Trundle Able Engineering Limit switch (6 per including spares, 72 pieces total) A number of lot date codes are included in this material

TRRJ #1 & #2 DLA 1003 thru 1006 y

LMMS Limit switches, missing shop order records

TRRJ #1 & #2 TDLA LMMS Missing shop orders for Network resistors. DCN

002


D - 118


SUBMITTAL DATE EXCEPTION NO. REV. FLIGHT #(s) PAGE 8 June 2000 083 N/C 8A

1 of 1

SYSTEM ORIGINATOR and PHONE NO. ORGANIZATION / CONTRACTOR ISS William Floyd (714) 896-1465

EEE Parts/Boeing-Huntington Beach

CONFIG. ID NO. WIRE HARNESS/PART NUMBER(s) DESCRIPTION NEXT ASSEMBLY(s) 222XXXA

M39016/13-056P

Relay

ISS

SPECIFICATION NUMBER SPEC. PARAGRAPH NO. MANUFACTURER LOCATION SSP 30312 Paragraph 3.8.1

Boeing-Huntington

Beach Habitable: Non-Habitable: X

ISSUE DESCRIPTION: (use continuation pages if required) SSP 30312 requires use of Grade 1 parts derated per appendix B. No grade 1 relays exist. No military relays per the only approved specification (MIL-R-30916) listed in SSP 30423 are rated for the 120 Vdc used on the Space Station bus. Attempts to have relays specially built to source control drawing were no bid by the QPL vendor. RATIONALE: (use continuation pages if required) Relay P/N M39016/13-056P is used in the BBC (Bolt Bus Controller) to provide open circuit isolation of the redundant BBC ground connection. These devices are single use, only run for approximately 0.5 hours to mate truss segments together. In this application, maximum open circuit during a fault condition is 120 Vdc and the relay is rated for a minimum dielectric voltage of 350 Vrms at altitude. During BBC operation, the relay is closed before current flows and is used as a carry only device when current is flowing. The maximum current flow under normal operating condition is 750 mA. The minimum overload resistive switched current rating is 4 amperes at 28 volts. There is no minimum rating for carry-only in the military specification. The maximum carry only is a function of the contact resistance which is 0.15 ohms resulting in a worst case power loss of only 2.4 watts at final torque of the Bolt Motor Actuator. This worst case current occurs only during the last 1-2 minutes of mission operation, and is therefore not expected to cause significant temperature rise.




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SUBMITTAL DATE EXCEPTION NO. REV. FLIGHT #(s) PAGE 11 September, 2000 084 N/C 8A

1 of 1

SYSTEM ORIGINATOR and PHONE NO. ORGANIZATION / CONTRACTOR Bolt Bus Controller

Signal Conditioning Unit Ali Lakhani (714) 896-3311 x7-1419 EEE Parts/Boeing-Huntington Beach

END ITEM/CONFIG. ID NO. WIRE HARNESS/PART NUMBER(s)

DESCRIPTION NEXT ASSEMBLY(s)

222064A 222082A

ISS (S0) 301R18W103KV4H 301S49W184KV4H H2010CPX0R75G

UC1842AL/883B

Capacitor, 0.1 uF 300V Capacitor, 0.18 uF 300V Resistor, 0.75 ohm Microcircuit, PWM

SPECIFICATION NUMBER SPEC. PARAGRAPH NO. MANUFACTURER LOCATION SSP30312 Para. 3.5 BBC, SCU (Boeing-HB)

DC/DC CONV–(APACE) Capacitor – (Johanson) Resistor – (State of Art) Microcircuit – (Unitrode)

Habitable: Non-Habitable: X

ISSUE DESCRIPTION: (use continuation pages if required) The BBC and SCU use a DC/DC Converter built by APACE. APACE will not provide qualification data for four parts (listed above) which are used in DC/DC Converter, without significant cost impact. Boeing-HB buyers and engineering personnel have tried various times to obtain this data without any success. Per APACE transmittal, obtaining this data would be a major cost impact to the program. RATIONALE: (use continuation pages if required) All parts used in the DC/DC Converter meet the electrical and thermal derating requirements of SSP30312. The electrical parts in the DC/DC Converter have also successfully passed qualification testing at both the power supply level and the ORU level. There have been no GIDEP ALERTs for these parts. Per written documentation from APACE, the qualification data does reside with the part manufacturers, however obtaining this data would be a major cost impact to the program. There is evidence that the parts did undergo qualification/acceptance testing at the parts level. There is also additional acceptance tests performed at the DC/DC Converter and ORU levels. These parts do not, therefore, present any significant risk to the reliability of the BBC and SCU.



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10/3/00 085 7A

1 of 2

SYSTEM ORIGINATOR and PHONE NO. ORGANIZATION / CONTRACTOR GFE Paul Meier/281-244-1761 NX22/SAIC

END ITEM/CONFIG. ID NO. WIRE HARNESS/PART NUMBER(s) DESCRIPTION NEXT ASSEMBLY(s) See comments for End Item N/A SPCE

Equipment

N/A

SPECIFICATION NUMBER SPEC. PARAGRAPH NO. MANUFACTURER LOCATION See comments for End number SSP30312 GFE Habitable: X

Non-Habitable:

ISSUE DESCRIPTION: (use continuation pages if required) This hardware does not comply with all the part selection requirements of SSP30312, for level 2 programs. The parts are military screened to MIL-STD-883. To support schedule, parts listed as JANTX versions were used rather than the recommended JANTXV version. No particle impact noise detection testing was done on cavity devices. No additional electrical screening was performed except a small effort on commercial capacitors at the Receiving and Test Facility. Two commercial microcircuits received no additional electrical testing. Theses parts were discussed and accepted for this application at the Parts Working Group meeting September 22, 2000. RATIONALE: (use continuation pages if required) This hardware is Criticality 2R for function. Except an issue previously approved by the Parts Working Group January 21, 2000 (see an excerpt of the minutes in comments section below), no parts are applied or used above manufacturers rating. The hardware is screened at the box level to 300 hours assembly burn-in minus part level burn-in time. The design is such that a failure of the battery charger will not damage EMU batteries. The charger is divided into four redundant boards. A short in this hardware which causes a trip of the circuit protection device, a circuit breaker, between the Remote Power Control Module (RPCM) channel and each battery charger will not propogate beyond that shorted channel. The architecture causes loss of power to only SPCE equipment, since SPCE equipment has dedicated circuitry aboard the space station. No other critical or non critical equipment is incapacitated by a loss of power (a circuit protection trip) to the SPCE equipment. The parts are judged adequate for this application.

DISPOSITION BOEING PCB CHAIR NASA PCB CHAIR DATE APPROVE DEFER REJECT /s/ Curtis G. Tallman /s/ Madhu Rao

for W. David Beverly 10/4/00 X

COMMENTS: (use continuation pages if required) SEG39128212-301 Battery Charger Assembly SEG39128213-301/-303 Battery Stowage Assembly SEG39128310-303 Fluid Pumping Unit Assembly SEG39128211-303/-305 Power Supply Assembly SED39128214-303/-305/-307 Battery Charger Interface Harness Assembly

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COMMENTS: (cont) From the excerpt from the minutes of the January 21, 2000 meeting. PSA (Power Supply Assembly) overstressed resistors was presented by Mike Defrancis. R22, a 1/8W rated RLR carbon film type resistor in the Power Supply Assembly of the Servicing and Performance Checkout Equipment was determined to be dissipating 1/4W. The R22 resistors in all PSAs, except S/N 1002, have been changed out for higher dissipation rated units. S/N 1002 has already been installed in the Airlock racks. Additional investigation revealed that the worst case skin temperature in this application is 80°C (actual measurement) compared to the rated maximum of 125°C. The skin temperature is maintained within acceptable limits by heatsinking to the power plane. Dale, the resistor manufacturer, predicted that the worst affect of the additional power dissipation in the resistor would be the additional 0.5% resistance value drift over the life of the part. The project manager is requesting the PCB to approve the temporary use of this stressed part to prevent the need to remove the unit from flight equipment. The resistor will be replaced once the SPCE is replaced in flight. The PCB agreed that this one-time use was acceptable since the reliability of the hardware was not effected.

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9/28/00 086 N/C 8A 1 of 2 SYSTEM ORIGINATOR and PHONE NO. ORGANIZATION / CONTRACTOR

PUMP CONTROL VALVE PACKAGE

Mohamed Moolji ex 70242 EEE Parts/Boeing-Huntington Beach


222044A ISS JANTXV2N3767 Ham-Std NSPAR

No: SSI-HAM-1091 LDC9602

Transistor,NPN, Power


SSP 30312 Paragraph 3.3 Silicon Transistor Corp. Habitable: Non-Habitable: X

ISSUE DESCRIPTION: In NSPAR SSI-HAM-1091 its stated that due to delivery and schedule constraints, this selection was made as specified in SSP30312, 3.2.3.1, instead of the higher order of precedence, 3.2.1.2c, a Grade 2 Standard Part upscreened in accordance with SSQ25001. This lot of parts was not screened to full requirements of SSQ25001, but only to MIL-STD –19500 JANTXV Level ( See attached chart) and PIND tested to MIL-STD-750 Method 2052 Condition A. RATIONALE:(For Reduced Burn-in). During end item (PCVP) acceptance testing, these devices are operated for additional 300 hrs of burn-in. In addition, during acceptance testing the PCVP is thermal cycled for 7 to 9 days ( 6 cycles, ramp rate dependent). The temperature extremes are –45 deg. F to +120 deg. F. The item is powered during thermal transitions, it is de-powered while soaking at temperature extremes. After soaking, the system is re-powered for system performance measurements at each extreme. There are no known alerts against this lot date code and no known failures at the system level.




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COMPARISON OF SCREENING REQUIREMENTS

TEST / SCREEN SSQ25001 JANTXV DEVICE

TEMP CYCLE √ √ PRE-SCREEN DPA √ NONE POST SCREEN DPA √ √ SURGE √ √ PIND √ √ SERIALIZATION √ NONE PRE BURN IN ELECTRICALS √ √ REVERSE BIAS BURN IN √ √ POWER BURN-IN √ √ (1) FINAL ELECTRICALS (+25°C, +125°C and -55°C)

√ √

PDA (2) √ √ SEAL (FINE and GROSS) √ √ LIFE (3) √ √ Notes (#) (1). Burn in duration = 160 hrs for JANTXV, 240 hrs SSQ25001 upgrade screened device. (2). PDA = 5% and 2% for re-submission per 25001, 5% for JANTXV AND 3% for resubmission. (3). For SSQ25001 upgrades, Life testing is performed for 1000 hours upon 22 devices for each lot. For

JANTXV parts life testing is same only required to be performed periodically by the manufacturer.

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9/28/00 087 N/C 8A 1 of 2 SYSTEM ORIGINATOR and PHONE NO. ORGANIZATION / CONTRACTOR

PUMP CONTROL VALVE PACKAGE

Mohamed Moolji ex 70242 EEE Parts/Boeing-Huntington Beach


222044A ISS 5962-9474301MXA Ham-Std NSPAR

No: SSI-HAM-1092 LDC 9703D

Microcircuit, linear, 16-bit,A to D converter


SSP 30312 Paragraph 3.3 Analog Devices Habitable: Non-Habitable: X

ISSUE DESCRIPTION: In NSPAR SSI-HAM-1092 its stated that due to delivery and schedule constraints, this selection was made as specified in SSP30312, 3.2.3.1, instead of the higher order of precedence, 3.2.1.2c, a Grade 2 Standard Part upscreened in accordance with SSQ25001. This lot of parts was not screened to full requirements of SSQ25001, but only to DSC 883 level B (see attached chart) and PIND tested to MIL-STD- 883 Method 2020 Condition A. RATIONALE: (For Reduced Burn-in). During end item (PCVP) acceptance testing, these devices are operated for additional 300 hrs of burn-in. In addition, during acceptance testing the PVCP is thermal cycled for 7 to 9 days (6 cycles, ramp rate dependent). The temperature extremes are –45 deg. F to +120 deg. F. The item is powered during thermal transitions, it is de-powered while soaking at temperature extremes. After soaking, the system is re-powered for system performance measurements at each extreme. There are no known alerts against this lot date code and no known failures at the system level.




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COMPARISON OF SCREENING REQUIREMENTS

TEST / SCREEN SSQ25001 DSCC /883 DEVICE

WAFER LOT ACCEPTANCE NONE NONE PRE-SCREEN DPA √ NONE POST SCREEN DPA √ NONE TEMP CYCLE √ √ PIND √ √ SERIALIZATION √ NONE PRE BURN IN ELECTRICALS √ √ (1) REVERSE BIAS BURN IN √ (3) NONE BURN IN √ √ (2) FINAL ELECTRICALS (+25°C, +125°C and -55°C)

√ √

PDA (4) √ √ LIFE (5) √ √ Notes (#) (1). Pre-burn-in electricals performed at 25°C for /883 devices versus 25°C, 125°C and -55°C for 25001 upscreened devices. (2). Burn in duration = 160 hrs for /883 device, 240 hrs SSQ25001 upgrade screened device. (3). Only as required by specific device specification slash sheet. (4). PDA = 5% and 2% for re-submission per 25001, 5% for /883. (5). For SSQ25001 upgrades, Life testing is performed for 1000 hours upon 22 devices for each lot. For 883B parts life testing is only requried to be performed periodically by the manufacturer.

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SUBMITTAL DATE EXCEPTION NO. REV. FLIGHT #(s) PAGE 30 October, 2000 088 N/C 8A

1 of 1

SYSTEM ORIGINATOR and PHONE NO. ORGANIZATION / CONTRACTOR Signal Conditioning Unit Ali Lakhani (714) 896-3311 x7-1419 EEE Parts/Boeing-Huntington Beach

END ITEM/CONFIG. ID NO. WIRE HARNESS/PART NUMBER(s) DESCRIPTION NEXT ASSEMBLY(s) 222082A ISS (S0) ISSA-515-113

LDC 9850, 9904, 9905, 9912, and 9913

Inductor Assembly

SPECIFICATION NUMBER SPEC. PARAGRAPH NO. MANUFACTURER LOCATION SSP30312 Para. 3.8 APACE Habitable:

Non-Habitable: X

ISSUE DESCRIPTION: (use continuation pages if required) The Signal Conditioning Unit (SCU) uses three DC/DC Converters (PS1: P/N 1F97574-503; PS2 and PS3: 1F97574-501) built by APACE. PS3 uses an Inductor Assembly (P/N ISSA-515-113) which consists of three Inductors. The hot spot temperature on these three Inductors exceeds the maximum derated hot spot temperature by 1°C. The maximum derated hot spot temeperature should not exceed 105°C, the calculated worst-case hot spot temperature is 106°C. RATIONALE: (use continuation pages if required) The Inductor Assembly’s hot spot temperature is well within the manufacturer’s rating of 125°C. There have been no failures or derating related issues on these parts during Acceptance and Qualification tests of the Signal Conditioning Unit. Exceeding the derating limit by 1°C will not pose any significant reliability problems.



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SUBMITTAL DATE EXCEPTION NO. REV. FLIGHT #(s) 24 October 2000 089 new 8A

9A PAGE 1 of 1


(714)896-3311 7-0062 EEE Parts/Boeing-Huntington Beach


222201A

D60693000-1 r

Mobile Transporter

LDU or LTU Spares


3.7

Boeing Vacuum

ISSUE DESCRIPTION: (use continuation pages if required) Thermostat parts to 1F97597 were previously reported as failing atmospheric leak test. Testing and analysis at the time showed that the parts were capable of operating with just an epoxy seal assuming operation below the dewpoint and vacuum operation. Refer to exception 051. Corrective action was taken at the time, February 2000, by modification of the traveller at the lead potting operation to assure no damaged glass-to-metal seals. This included a visual examination of the hermetic seal prior to potting and detailed careful handling while installing leaded devices in the potting fixture. Possibly as a result of this fix interim lots have been leak free, however one of 4 pieces of LDC 0026, the DPA sample received by Boeing HB did exhibit a 1.9 x 10-5 sccs leak rate. Note that leak testing is possible after the leads have been removed from the DPA sample. The balance of 3 pieces are not testable with 14, six foot leads each. A check of the lot records indicated that all devices passed prepotting leak check at better than 1x 10-7 sccs. These parts 1F97597-525 thermostats are needed to support schedule for completion of PIO29 spares (Mobile Transporter) and loan to support RBVM flight hardware schedules. RATIONALE: (use continuation pages if required) The same testing, analysis and rationale of exception 051 still applies for use here as all parts are intended for vacuum operation. Earthside long term storage of completed spares are appropriately sealed from humidity and contamination. The testing described and attached to the previous exception 051 consisted of placing holes in 2 thermostats and running them under voltage in the off condition for 23 hours at a point where H2O condensation occurred but just above freezing (3°C). Each day the units were allowed to stabilize at room ambient humidity (approx. 50%) for 1 hour before the next condensation exposure. This test was repeated until a total of 104 hours were reached. The part remained functional and operation setpoints remained unchanged. When the parts were opened post test they showed no evidence of corrosion or damage. This test at maximum condensation exposure and electrification would constitute a worse case condition. On-orbit the environment is vacuum and leakage presents no problem. A second test for corona partial discharge indicated no corona initiation at the worse case operating voltage. There are no voltages above 126 Vdc in the thermostats. Again this test shows no problem with the vacuum environment.

DISPOSITION BOEING PCB CHAIR NASA PCB CHAIR

DATE

APPROVE DEFER REJECT

/s/ Curtis G. Tallman



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SUBMITTAL DATE EXCEPTION NO. REV. FLIGHT #(s) 7November 2000 090 New 9A

PAGE 1 of 1


(714) 896-3311 7-0062 EEE Parts/Boeing-Huntington Beach


222073A

1F01194-1 A2 Board

Video Luminaire

All


3.8.1

Boeing St. Louis External

ISSUE DESCRIPTION: (use continuation pages if required) Thermal concerns based on earlier data measured on the Video Luminaire have largely been resolved. Higher than expected temperatures during thermal vacuum tests resulted on some circuit changes and a T1 transformer redesign. However final analysis of the modified Luminaire design indicates that there are 4 components that still do not meet SSP 30312 derating criteria at expected worse case flight conditions. C11 and C35 capacitors, M39006/22-0571H (CLR79), rated at 50 Volts nominal and 40 Volts at a W-C local board temperature of 113°C. The derated maximum is 24 Vdc from 30312 and the applied voltage is 28 Vdc. R51 and R173 resistors, RLR32C1000G, rated at 1.0 watts nominal and 0.55 W at a W-C local board temperature of 110.6°C. The derated maximum is 0.33 W from 30312 and applied is .36 W. Recommendation is to use as is based on the rationale below. RATIONALE: (use continuation pages if required) Parts are 70% and 65% of their ratings for the capacitor and resistor respectively. They should be 60% maximum. In reviewing the potential impacts, HB Thermal personnel reviewed the expected thermal profile and determined that the worse case temperature would apply; no more than 5% of the year, and less than 1/2 the orbit. It also assumed that 1 of 4 Luminaire's would be installed in the worse case of 14 locations and be powered on. Impact on reliability based on this analysis indicates that the increased risk could not be differentiated from the baseline MTBF.

DISPOSITION BOEING PCB CHAIR NASA PCB CHAIR

DATE

APPROVE DEFER REJECT




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D - 129

Exception 091 To SSP 30312 Requirements SUBMITTAL DATE EXCEPTION NO. REV. FLIGHT #(s) PAGE

15 January 2001 091 NEW Spares only 1 of 2 SYSTEM ORIGINATOR and PHONE NO. ORGANIZATION / CONTRACTOR

ISS W. Dykes (714)896-3311 7-0062 EEE Parts/Boeing-Huntington Beach END ITEM/CONFIG. ID NO. WIRE HARNESS/PART NUMBER(s) DESCRIPTION NEXT ASSEMBLY(s)

222007A 5080097-1 Control Moment Gyro Follow-on spares SPECIFICATION NUMBER SPEC. PARAGRAPH NO. MANUFACTURER LOCATION

SSP 30312 SSQ21218

3.7, 4.3.1.4, 4.3.3.1, 4.3.4c L3 Teterboro Habitable: Non-Habitable: X

ISSUE DESCRIPTION: (use continuation pages if required) Last production lot of SSQ devices by Maxwell Sierra is held at the supplier's facility as there are DCMA issues with the lot, as cited by the DCMA rep. Provided herein are Maxwell's responses, the DCMA response (1/20/2000) to Maxwell's fix, and any second response by Maxwell to the DCMA: 1. Solderability: At end of Group A, subgroup 3, 3 of 5 samples exhibited 95% dewetting. Maxwell's fix: (Probably due to tarnish of the lead finish from environmental tests.) Maxwell requested BFGoodrich/AlliedSignal/NASA approval to re-tin (solder-dip) terminals then re-perform solderability. NASA (Ralph Grau) approved Maxwell's re-tinning procedure (8/24/99) (so did AlliedSignal) and solderability passed. 2. CAR 99-W-01: DCMC withholds acceptance/approval of the lot for additional problems (12/99): a. Maxwell's DPA test procedure TPS-6270 Rev E does not make reference to RS-469 which is referenced in the SSQ drawing. Maxwell's fix: Add RS-469 (EIA-469) to Applicable Documents in TPS 6270. DCMC response: This is form reference, not use of the procedures which are required per MIL-F-28861, para. 30.3.3. Resolution: Accept these devices for use-as is and verify all applicable documents are correct prior to use in future. b. Maxwell does not grind the samples in accordance with the RS-469, that is, grinding rpm, disk speed range and grinding pressure; in addition the grinding wheel is not calibrated. Maxwell's fix: The information in RS-469 is for monolithic, non-discoidal capacitors, not axial units mounted in filters. In addition, the information is recommendations, not requirements. DCMC response: Yes, RS-469 is a recommendation, but MIL-F-28861 states grinding shall conform to the RS-469 procedures [thereby RS-469 becomes a requirement]. Resolution: Accept devices for use-as-is and verify all applicable documents are interpreted correctly in the future. c. Cracks were present on the first two samples that DCMC witnessed. Maxwell's fix: Much time and effort was expended by Maxwell to point out and verify that the cracks were induced during DPA and not present in the basic capacitors; and all other testing of the lot passed. d. The Xray certification states 181 pieces were Xrayed, but the serial numbers run from 001 to 185. (4) Testing failures had been pulled from the lot prior to Xray. Improper component tracking during Xray resulted in inaccurate documentation and untraceability of lot pieces.. Maxwell’s Fix: Maxwell QA will review all POs for correctness in the future. DCMC response: The lot is not traceable back to the Xray certification since the certification does not match the serialized parts.

Resolution: Accept devices for use-as-is. Maxwell personnel were instructed on the need to clearly call requirements on the PO for the C of C. Vendor was reminded to follow all instructions on the PO

e. SSQ states serial number should be four digit: they are three digits. Cause: PO did not state leading zeros. Maxwell's fix: Maxwell corrected marking procedure to be alpha-numeric four digit. DCMC response: Yes, corrected for future build, not this lot. Maxwell's fix: Add a zero in front of each number (resolved). f. MIL-F-28861 states that the contractor shall implement and use statistical process control which is non-evident. Maxwell's fix: The DCMC rep was shown AlliedSignal's 9/16/99 SPC approval for this lot; in addition, the DCMC rep reviewed all other SPC activity data at Maxwell (resolved). g. The contractor does not maintain age control on chemicals used in the DPA lab. Maxwell's fix: Struers (Potting compound

manufacturer) and Buehler (sectioning materials manufacturer) stated that age control is not applicable to grinding pastes, polishes and grit paper. In addition, age control is not required by SSQ; RS-469 only makes recommendations, not requirements (resolved).

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RATIONALE: (use continuation pages if required) (A) h. There were other concerns raised by DCMA concerning adequacy of instruction, communication and

understanding of requirements at the production line level. In addition to the DPA at the finished filter level issue which has been resolved via the earlier Exception to SSQ21218 there are other issues raised by DCMA which are holding the lot acceptance. Technical review indicates that the discrepancies do not impact part quality or reliability. Summary of evaluation: 1. Solderability re work procedures approved, parts passed. This resolution is technically acceptable. 2a. Current SSQ21218 paragraph does not make direct reference to RS-469, it is cited in data section as it relates to format only. Reference drawing apply onty to the extent specified in the SSQ document. This is a technically acceptable translation of spec requirements. 2b. Rational provided is correct. Further, filter industry indicates that DPA induced failures in this product type warrant adjustment to grinding rates and times due to different forces subjected to the finished product. 2c. This was addressed directly in the earlier exception. 2d. Maxwell error in specifying number of parts to X-ray. Traceability to Xray inspection and certification of all parts submitted not in question. 2e. Maxwell error in not specifying correct number of digits in serial number. Not a technical or reliability issue. No future lots. 2f. SPC would have been audited during original ISS survey activity. Allied Signals effort may be assumed to be more recent re audit and with approval is further verification of adequacy. 2g. Agree that age controls for DPA sectioning materials not required. (A) In response to general concerns, the following re-performance of acceptance by an independent lab is to be accomplished prior to final acceptance: Re-perform the 100% tests of Group A which includes: Thermal Shock- Voltage Conditioning Dielectric withstanding Insulation resistance Insertion loss- verify lab capability for adequate fixtures. DC resistance, DC voltage drop Radiographic inspection (since serialized x-rays are available the task is to re review these for adequacy) Seal test Visual- mechanical inspection. Solderability- ( re-emersion not required with an inspection of the terminals to assure adequate solder coverage is acceptable as a part of the inspection above.) Group B sample test are to be restricted to the following critical tests only. Small sample life test. DPA- Use and re examine existing DPA report. Only re perform as needed. Other tests of Group B not applicable for the following reasons: Not applicable to on-orbit environment- Salt spray, moisture resistance, AC voltage drop, barometric pressure reduced (hard vacuum). Shock (high aspect ratio parts required reduction of shock test but meet 100 G's with no problem). Redundant Group A tests- Thermal shock and immersion, resistance to solder heat, radiographic inspection, seal Design related attributes already proven and low risk. Voltage- temperature limits of capacitance, Insertion loss at temperature, temperature rise, current overload, terminal strength, resistance to solvents, and vibration.


/s/ Curtis G. Tallman /s/ W. David Beverly

1/15/01 ! --- ---


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11/21/00 092 N/C N/A

1 of 1

SYSTEM ORIGINATOR and PHONE NO. ORGANIZATION / CONTRACTOR MDM Ali Lakhani (714) 896-3311 x7-1419 Boeing-Huntington Beach

END ITEM/CONFIG. ID NO. WIRE HARNESS/PART NUMBER(s) DESCRIPTION NEXT ASSEMBLY(s) 8269360-901

On-Orbit Tester ISS 56W-NW125DC-CGO GREEN LED

SPECIFICATION NUMBER SPEC. PARAGRAPH NO. MANUFACTURER LOCATION SSP30312 3.5 Data Display Products Habitable:

Non-Habitable: X

ISSUE DESCRIPTION: (use continuation pages if required) The LED used is commercial and meets only the derating requirements of SSP30312. The purpose of the LED is to indicate on/off. The LED was not in the original design but was requested by the astronauts upon seeing the equipment. The 120VDC part required for this application is not available in the MIL-Qualified version because of the unusual supply voltage. RATIONALE: (use continuation pages if required) This is the same LED used in the Utility Power Strip, a piece of GFE. There are redundant LEDs at both ends of the cable, Insert adapter and Utility Power Strip both have one. Procedure dictates not plugging in test items with Utility Power Strip powered on. Three standard parts, a LED, a blocking diode and a resistor would be required to replace this part. This LED is not used on critical hardware and was chosen to avoid necessity for additional spares on orbit.

DISPOSITION BOEING PCB CHAIR NASA PCB CHAIR DATE APPROVE DEFER REJECT /s/ Kinn Roopwah

for Curtis G. Tallman /s/ W. David Beverly 11/21/00 X


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ISS W. Dykes (714)896-3311 7-0062 EEE Parts/Boeing-Huntington Beach END ITEM/CONFIG. ID NO. WIRE HARNESS/PART NUMBER(s) DESCRIPTION NEXT ASSEMBLY(s)

1F97597-517 AIRLOCK LTA Heater Assy 683-52037-001 683-52038-001 Thermostat 683-52030-001

SPECIFICATION NUMBER SPEC. PARAGRAPH NO. MANUFACTURER LOCATION SSP 30312 3.8 Micropac Industries Habitable: X

Non-Habitable:ISSUE DESCRIPTION: (use continuation pages if required) During the Lab insertion ( Flight 5A) there was an LTA heater anomaly. Investigation lead to the realization that the thermostats were dissipating more than expected power; a result of a lack of good power data to the thermal engineering personnel at HSV for the Airlock application. The thermostat module is a hybrid device with attached wire interconnects. The power switch in this device is subject to momentary thermal spikes exceeding manufacturer’s published limits. The steady state junction temperature is expected to be 123°C when the hybrid case temperature is at it’s maximum of 105°C (221°F), which meets ISS requirement of <125°C Tj. The concern is that the FET switch requires 10 ms to turn off, during which time the junction temperature is expected temperature rise 37°C resulting in a peak temperature of 160°C. The maximum Tj for this FET, P/N IRFC9240, is rated at 150°C by International Rectifier. Due to the 10 ms turn-off ramp, the FET Tj is calculated to exceed 150°C for 23 ms every turn-off cycle. RATIONALE: (use continuation pages if required) This technology has good characteristics with regard to thermal runaway or current hogging of the individual vertical MOSFET cells. The critical attributes to prevent thermal runaway include, a) technology, temperature, time, voltage and current. 1) This device is a HEXFET III device which provides resistance to momentary breakdown. This has been demonstrated by reliable performance while being subjected to repetitive momentary breakdowns (due to inductive voltage spikes) at high temperature. 2) Rds(on), channel resistance, has a positive thermal constant and therefore intrinsically shares well with adjacent cells. 3) The duty cycle for this transient event is very small. The 10 ms turn-off occurs only once per many minutes to many hours. As this heater system is only active as a supplemental heat source at the worse case beta angles, it is active only during certain times of the year. Thermally driven failure modes such as diffusion and ionic recombination affecting oxides and contributing to field distortion would not contribute to an increased failure rate due to the miniscule cumulative duration of the thermal spike events. 4) The heater load is resistive so there are no voltage spikes or sustained high voltage during current shut off which means that the voltage stays below 126 Vdc and meets it's derating requirements (rated 200 Vdc). 5) Due to the thermal delay, the Tj is above 150°C for the last 5 ms of the turn-off ramp where the current is down to 1.3 amperes. For 80% of the time the junction temperature is above 150°C, the FET switch is fully off. 6) Evaluation of the attach material, Ablebond 84-1, indicates that the material, which cures at 175°C, is capable of operation to that temperature. Reliability data for power cycling indicates that these FET's will exhibit better than .0001% cumulative failure rate for 500,000 cycles for a 37°C delta temperature. 7) The 37°C rise is based on a TO254 package device on a beryllia tab, which is similar to the hybrid application. Some preliminary modeling by HB indicated that the more massive alumina substrate of the hybrid device may provide a better thermal response, approximately 25°C delta T. However there is no test data or more detailed FEA analysis to back up this position therefore the more conservative position must be addressed. In summary, the very short period (23 ms), low duty cycle (once per minutes to hours), small (10°C) thermal excursion above rated, and limited thermostat operating time per year will have minimal impact on the reliability of the IRFC9240 switching FET in this application. This allows the thermostats to be flown on the ISS with minimal risk.




COMMENTS: (use continuation pages if required) The models and analysis for the delta T and thermal response time are attached.

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5/10/01 097 N/C N/A 1 of 1 SYSTEM ORIGINATOR and PHONE NO. ORGANIZATION / CONTRACTOR

SSMMU Ali Lakhani, 714-896-3311 X7-1419 Boeing-Huntington Beach END ITEM/CONFIG. ID NO. NEXT ASSEMBLY(s) PART NUMBER DESCRIPTION

BG8259015-914

ISS

8265409-005 LDC 0019

RAD Tolerant FPGA


SSP 30312

3.7

Actel Habitable: Non-Habitable: X

ISSUE DESCRIPTION: (use continuation pages if required) The device is an FPGA, generic P/N RT54SX32-1CQ256B manufactured by Actel. One part failed Residual Gas analysis during DPA (8361ppm vs 5000ppm maximum limit). Three other devices from the same lot date code (LDC 0019) passed RGA at the qualification testing. RGA data shows insignificant amount O2, Ar, and CO2 and therefore there is no evidence of part leakage or that the origin of the H2O is from atmospheric leakage or exchange. The ISS PCB provided conditional approval of these devices (See minutes from January 26, 2001) pending successful completion of Qualification test at the assembly level. RATIONALE: (use continuation pages if required) Qualification testing at the assembly level is complete, the unit passed all required tests. The qualification tests were witnessed by Honeywell Quality Engineer, Boeing Customer Representative and DCMC. Request PCB approve the results of the qualification testing at the assembly level and grant final acceptance of NCMR 007107 for P/N 8265409-005. * Excerpts from the 1/26/01 PCB. 8265409-005 – Ali Lakhani and Pat Lintz: This device is an FPGA, generic P/N RT54SX32-1CQ256B manufactured

by Actel. This issue is one part failed Residual Gas Analysis testing during DPA due to the package containing excess water vapor (8361 ppm vs 5000 ppm maximum limit), after 3 parts had successfully passed RGA during initial lot testing. Pat Lintz from Honeywell presented data in response to questions from the PCB of 1/12/01. Pat confirmed that the 3 DPA samples from the same LDC were tested at Pernicka. He did not get the actual RGA results from them, merely that they passed. Pat also presented the data from the RGA analysis performed on their DPA sample. The dew point (+5°C) does fall within the application temperature expected to be seen by the device (-6.7°C to +48.9°C). The RGA indicated the content and percentages of all internal gas elements were nominal with the exception of the water vapor content. No explanation was provided as to the source of the moisture. The devices do not utilize conformal coating or other environmental barrier to protect conductive components within the package. Due to time and cost constraints, it was concluded that additional devices would not be procured and DPA be performed. It was determined that the Qualification testing these devices will be subjected to at the assembly level would provide acceptable levels of stress through the dew point to provide confidence that the operation of the flight parts will not be impacted by possible excess water vapor in the packages. If the devices pass Qualification testing at the box level without failure, Ali will generate an Exception to SSP 30312. The PCB provided conditional approval to use these devices pending the successful completion of Qualification testing.

DISPOSITION BOEING PCB CHAIR NASA PCB CHAIR DATE APPROVE DEFER REJECT /s/ Curtis G. Tallman /s/ W. David Beverly 5/11/01 ✔


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EXCEPTION 098 To SSP 30312 Requirements

SUBMITTAL DATE EXCEPTION NO. REV. FLIGHT #(s) 30 May 2001 098 N/C Stage 7A.1 and

Subsequent PAGE 1 of 6


ARIS equipped rack Henry Hoang (281) 336-5157 Utilization

CONFIG. ID NO. WIRE HARNESS/PART NUMBER(s) Description NEXT Assembly (s)

1J01101-1 (J1 Umbilical, looped) 1J01101-501 (J1 Umbilical, unlooped) SK683-20005-6 (J2 Umbilical, looped) SK683-20005-5 (J2 Umbilical, unlooped)

Wire Harnesses

ISS

SPECIFICATION NUMBER SPEC. PARAGRAPH NO. Manufacture LOCATION

SSP 30312 Paragraph 3.8.1

Boeing-Houston Habitable: X Non-Habitable:

ISSUE DESCRIPTION: (use continuation pages if required) The Payload Engineering Integration (PEI) team has identified the case that 6 kW racks with Active Rack Isolation System (ARIS) may require 8-gauge power wire to carry the maximum nominal current of 50 amps. The ARIS is installed in EXPRESS Racks (Rack 2 or 3), and the nominal current of 50Amps is the maximum current allowed for 6 kW racks. The actual operating current is expected to be lower than 50 Amps, as limited by power available to payloads. The SSP 30312 derated single wire current for 8 gauge wire is 44 amps and the maximum allowable circuit breaker trip point is 57.2 amps (130% of 44 amps). See Attachment 1 & 2 for J1/J2 umbilical cables drawing assembly. A program exception is requested to allow 50 amps on a 8 gauge wire in the wire harnesses listed above.

RATIONALE: (use continuation pages if required) The use of 8-gauge wire for ARIS power supply through the J1 and J2 connectors of the Utility Interface Panel (UIP) is necessary to meet microgravity isolation requirements and safe to use in all rack locations within the US Laboratory only. The J1 and J2 power umbilicals in the ARIS umbilical set have 4-gauge supply and return wires, and an 8-gauge ground. For brevity, this umbilical wire configuration will be referred to as a 4-4-8 configuration. These umbilicals are looped to reduce their stiffness. The current umbilical configuration has a large dynamic resonance at 10 Hz. Due to this resonance ARIS isolation is predicted to be -26dB at 10 Hz. The DAC-6 analysis indicates we need -33dB to meet the system microgravity requirement onboard the ARIS rack at 10 Hz. Ground tests show that isolation performance at 10 Hz can be improved by a factor of two if the two 4-gauge wires are replaced by two 8-gauge wires (an 8-8-8 configuration). Analysis indicates that this “factor of two” improvement in isolation performance is sufficient to meet the system microgravity requirement onboard the ARIS rack at 10 Hz. Under the provisions of the SSP 30312, Rev. F, the request for an exception to SSP 30312 requirements for this case was analyzed by the PEI engineer - see the engineering analysis with supporting calculations.

DISPOSITION

BOEING PCB CHAIR NASA PCB CHAIR DATE APPROVE DEFER REJECT /s/ Curtis Tallman /s/ David Beverly 6/12/01 X


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Exception 098 TO SSP 30312 Requirements (Continued)

Subject: Request for Parts Control Board (PCB) Approval Reference: Exception 01 (65 amps through 8 gauge power wire) of SSP 30312, Background: The Payload Engineering Integration (PEI) team has identified the case that 6 kW racks with Active Rack Isolation System (ARIS) ISS Characterization Experiment (ICE) may require 8 gauge power wire to carry the maximum nominal current of 50 amps. The SSP30312 limits for 8 gauge wire is 44 amps and a maximum circuit breaker trip point of 57.2 amps. Therefore, the PEI team asks the PCB to allow 50 amps on 8 gauge wire in the following wire harnesses:

Boeing, Houston Harness Nomenclature/Identifier Harness Part Number

J1 Umbilical, looped 1J01101-1 J1 Umbilical, unlooped 1J01101-501

J2 Umbilical, looped SK683-20005-6 J2 Umbilical, unlooped SK683-20005-5

Analysis: The PEI analysis reached the conclusion, the 8 gauge wire can handle 50 amps for a limited (in days) amount of time.

1. The Exception is applicable to all the EXPRESS Racks with ARIS for using of 8-gauge wire power

supply through J1 and J2 connectors of the UIP in the US Lab for 7A.1 and Subsequent.

2. Current rating for 8-gauge wire: • According to NASA Technical Memorandum 102179, Table 2

Environment Rating (Amp)

72ºF / 14.7 PSI 72ºF / 10¯6 TORR 200ºF / 10¯6 TORR

169.0

88.4

81.0

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Exception 098 TO SSP 30312 REQUIREMENTS (Continued)

• According to SSP 30312, Appendix B.3.5.2

3. US Lab Compatibility: The maximum nominal current flow supplied at any ISPR location is 50Amp. This value is well below the current rating defined in NASA Technical Memo 102179 for a shirt sleeve environment (72ºF / 14.7 PSI). The maximum sustained current available in the USL based on RPC trip characteristic is 55Amp, which is well below the 102179 current rating 169.0 Amp.

SSP 30312 current for 8-gauge wire is 44Amp, but allows for sustained current flow of up to 130% (57.2A) of this rating without concurrence of EEE Parts Control Board. This rating is defined for a vacuum environment and the derating of this wire is more severe for vacuum than a pressurized environment. Even so, the nominal current and maximum sustained current values for the USL fall below the allowable 30312 current ratings. The maximum temperature for the ISS is defined as 46ºC (115ºF) with a nominal range of 17 to 28ºC (63-82ºF). Based on the maximum defined temperature of 46ºC and the wire insulation rated at 200ºC, the maximum allowable delta T for the ARIS J1/J2 umbilical is 154ºC (309ºF). Based on the 102179, Figure 3 - single wire in free air, the delta T for an 8-gauge wire at 55Amp is 25ºF. This value falls below the maximum allowable delta T of 309ºF. In the unlikely event that the rack remains powered at same time the module is unpressurized the delta T at 55Amp would be ~ 140ºF (reference 102179, Figure 5 - single wire in a vacuum at 72ºF ambient). This delta T is also below the maximum allowable of 309ºF. The IVA touch temperature limit for Teflon is defined as 120ºC (248ºF) for incidental contact and 70ºC (158ºF) for intentional contact in MA2-95-048. The touch temperature of the wire under pressurized conditions at the maximum nominal ISS cabin temperature (82ºF) is 107ºF.

Based upon the data presented 8-gauge wire is compatible for all ISPR locations in the US Lab.

4. JEM Compatibility: Based on SSP57001, Figure 3.2.6-3, the maximum sustained current attainable in the JEM is 65A. This value falls below both the pressurized and vacuum environment current ratings defined in 102179, but exceeds the SSP30312 current ratings. The delta T in a pressurized environment would be 35ºF and 180ºF in a vacuum environment. The resultant IVA touch temperature at 82ºF ambient is 117ºF. Based on the current ratings defined in 102179 the ARIS umbilicals are compatible with all ISPR locations in the JEM, however approval for use in the JEM must be coordinated with NASDA.

Environment Single WireCurrent (Isw)

(A)

Remarks

70ºC / 10¯6 TORR 44.0

6. Circuit protective devices shall not allow sustained current exceeding 130% (57.2Amp) of derated single wire current without PCB AIT approval.

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Exception 098 TO SSP 30312 REQUIREMENTS (Continued)

5. APM Compatibility: Based on SSP57001, Figure 3.2.6-1, the maximum sustained current attainable in the APM is 79.6A. This value falls below both the pressurized and vacuum environment current ratings defined in 102179, but exceeds the SSP30312 current ratings. The delta T in a pressurized is 60ºF and is 250ºF in a vacuum environment. Both of these values fall below the maximum allowable delta T of 390ºF. The resultant IVA touch temperature at 82ºF ambient is 142ºF. Based on the current ratings defined in 102179 the ARIS umbilicals are compatible with all ISPR locations in the APM, however approval for use in the APM must be coordinated with ESA. Note: Using Type III RPC to protect 6 kW rack (nominal current of 50 Amps) complies with ISS EPS Architecture requirements. Type III RPC will trip between 55 Amps and 60 Amps if the overcurrent condition persists for more than 40 ms. Type III RPC allows higher transient current for shorter duration, e.g., 95 Amps for transient less than 40 ms. The duration of surge current form the racks will be limited to 10 ms. Therefore, nuisance trips are avoided.

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Exception 98 To SSP 30312 Requirements (continued) Attachment 1 - J1 Umbilical Cables

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Exception 98 To SSP 30312 Requirements (continued) Attachment 2 – J2 Umbilical Cables

ASSY 5 4

25.0

SK683-20005

ASSY 6 4

31.0

SK683-20005

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6-13-01 099 8A 1 of 1 SYSTEM ORIGINATOR and PHONE NO. ORGANIZATION / CONTRACTOR

ISS W. Dykes (714) 896-3311 7-0062 EEE Parts/Boeing-Huntington Beach END ITEM/CONFIG. ID NO. WIRE HARNESS/PART NUMBER(s) DESCRIPTION NEXT ASSEMBLY(s)

222064A &B/ 1F45012-1 & -501 222082A/ 1F97520-1

1F67621-1 and 1F67621-501 DC-DC Converter Bolt Bus Controller (BBC) Signal Conditioning Unit (SCU)


3.7

Modular Devices Inc.(MDI) LI NY

Uninhabited

ISSUE DESCRIPTION: (use continuation pages if required) A family of DC-DC Converters (+5, +/-15, +/-5V) was developed for use in the above units. Engineering units were installed in system qualification units however due to device level qualification test failures, the required subsequent redesign and rebuild, the 1F67621 schedule no longer supported the program. A second supplier (APACE Inc.) was developed who built, tested and delivered flight hardware for a drop-in replacement to a new drawing 1F97574. Due to test and failure issues with this 2nd supplier there are no longer enough converters to produce SCU spares build using 1F97574 parts. In the mean time 1F67621 parts arrived and when DPA problems were cited the parts were retained in MRB (-1 version) and receiving interim stores (-501 version) until a final disposition could be made. As the parts were not needed and the supplier's assessment was that they met the spec and not returnable, this storage has extended to 2 years prior to this resolution. Proposal is to use the 1F67621 parts with retest. A study was conducted to assure that the performance of the 2 suppliers was compatible with interchangeability. DPA exceptions are: 1) Residue appearing to be flux was in evidence from capacitor/ magnetic soldering operations. 2) Excess encapsulation materials used on magnetic devices. 3) 3 of 5 parts failed RGA at 7170, 7727 and 7483 ppm. 4) Surface mount tantalum capacitor anomaly. RATIONALE: (use continuation pages if required) 1) Solder connection of magnetics and capacitors necessitates use of flux. Cleaning processes should remove all visible traces of flux per MIL-STD-883, Method 2017. Proximity of delicate wire and die makes normal wiping processes prone to cause rejectable damage to those elements. 2) Epoxy bonding material required to mount transformer/ inductor cores and to secure lead wires and stacked ceramic capacitors. There is no objective criteria for excessive bonding material. 3) RGA failures are only marginally outside of expected limit of 5000 ppm and consistent with other large hybrids with organic die mounting medium reviewed by the PCB. Leak checks are 100% pass balance of gas present is N2, CO2 and only 490, 851, 801, 736 and 471 ppm of detected hydrocarbons. This indicates little re condensible contaminate to cause corrosion effects. This ameliorates the potential issues caused by anomalies 1) and 2) above. 4) It was reported that a solid tantalum capacitor had a cracked plug. If the plug were cracked it is doubtful that the unit would operate. On re examination it was determined that the anomaly occured when the core was packed prior to sintering where a small area like a wrinkle was present. While rare this does not present a functional problem for the capacitor. Screening prior to reuse. 1) Open 2 units and conduct an aqueous test for chlorides and conductivity. This assures that the residue noted will not cause long term corrosion. 2) Conduct an electrical retest of all units.


/s/ Alex Di Taranto for Curtis G. Tallman



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