CMP annual users’ meeting - 30-Jan-2020 - PARIS
2019 Activity ResultsMPW Service Center for ICs, Photonics, & MEMS
Prototyping & Low Volume Production
https://mycmp.fr
Grenoble - France
Circuits Multi-Projets®
CMP annual users’ meeting - 30-Jan-2020 - PARIS
Technology Portfolio in 2019
2
IC
MEMS
ams
ST
CMP / ams
MEMSCAP
65nm CMOS 7LM130nm CMOS 6LM130nm HV-CMOS 4LM
28nm FDSOI130nm SOI - FEM0.16µ BCD-SOI
55nm SiGe BiCMOS130nm SiGe BiCMOS0.16µ BCD
0.35µ CMOS 4LM 0.35µ CMOS-Opto 4LM
0.35 µ CMOS front-side bulk micromachining
PolyMUMPS PiezoMUMPSSOIMUMPS
PhotonicsCEA-LETI Silicon Photonics / Si310-PHMP2M
3D-IC
LETI-CEA UBM, micro-bumps, RDL, TSV / 3D assembly / Open3D
ams 0.35um 4 LM Active or Passive Interposer + UBM
ams UBM + Bumps at Wafer Level on 0.35µ
ST UBM + Copper pillar at Wafer Level (processes on 300mm wafers)
0.35µ SiGe 4LM0.35µ HV-CMOS (50V / 120V)
AMF / CMC Silicon Photonics
ON Semi0.18µ CMOS 5LM0.35µ CMOS 4LM
0.18µ HV-CMOS (45/70V)0.35µ HV-CMOS (25/50V)
New
New
CMP annual users’ meeting - 30-Jan-2020 - PARIS
2019 : Main Results
3
191 Circuits82 Institutions23 Countries
173 Circuits in 201877 Institutions in 2018
Low Volume Prods32 Circuits18 Institutions
51 Circuits24 Institutions
Industrial circuits71 Circuits22 Institutions
62 Circuits20 Institutions
2019 2018
CMP annual users’ meeting - 30-Jan-2020 - PARIS
Circuits per Foundry in 2019
4
1.5% 3%
34%61.5%
CMP annual users’ meeting - 30-Jan-2020 - PARIS
Circuits per Foundry
5
AMS
ST
Other
2016
AMS
ST
CEA-LETI
MEMSCAP
2017
AMS
ST
Others
2018
AMS
ST
CEA-LETIMEMSCAP
2019
CMP annual users’ meeting - 30-Jan-2020 - PARIS
Circuits per process family in 2019
6
➢ Pure Bulk-CMOS process is no more dominant since 2018 at CMP.
➢ SiGe BiCMOS is used by more than 1/3 of total circuits.
CMOS25%
SiGe37.5%
HV13%
SOI23%
MEMS 1.5%
CMP annual users’ meeting - 30-Jan-2020 - PARIS
Circuits per process family
7
CMOS
SiGe
SOI
HV CMOS
2016
CMOS
SiGe
SOI
HV CMOS
Photonics MEMS
2017
CMOS
SiGe
SOI
HV CMOSPhotonics
2018
CMOS
SiGe
SOI
HV CMOS
MEMS
2019
CMP annual users’ meeting - 30-Jan-2020 - PARIS
Circuits E - R - I in 2019
8
Education 4%
Research59%
Industry37%
0102030405060708090
100110120130140150160170180190200
Education Research Industry
CMP annual users’ meeting - 30-Jan-2020 - PARIS
Circuits E - R - I
9
Education
Research
Industrial
2016
Education
Research
Industrial
2017
Education
Research
Industrial
2018
Education
Research
Industrial
2019
CMP annual users’ meeting - 30-Jan-2020 - PARIS
Circuits per Country
10
Australia Belgium
Canada
China Finland
France
Germany
Hong Kong
IndiaItaly
JapanMacau
Netherlands
Norway
Philippines
Poland
PortugalRussia
Spain
SwedenU.K
USA
Vietnam
➢ Circuits in 2019 are from 23 countries➢ 1st circuit from Vietnam
CMP annual users’ meeting - 30-Jan-2020 - PARIS
Circuits per region in 2019
11
Asia5%
France47%
Europe23%
N. America19%
RoW6%
0
10
20
30
40
50
60
70
80
90
20152016
20172018
2019
Asia France Europe N. America Rest of the World
CMP annual users’ meeting - 30-Jan-2020 - PARIS
New Customers in 2019
12
➢ 22 new customers ordered the first time :▪ 15 Universities / Research▪ 7 Industrial Companies
RMIT University Victoria AUSTRALIAShanghai MEDs Electronic Shanghai CHINALIMOS-ISIMA Aubière FRANCESDRF Biot FRANCEEASII IC Grenoble FRANCELab. RFIC Grenoble FRANCE
Energy lab - LE²P St Denis Réunion FRANCE
LIG St Martin d'Hères FRANCEYNCREA hauts de France Lille FRANCETiHive Meylan FRANCEChristian-Albrechts-Universität zu Kiel Kiel GERMANYUniversità degli Studi di Catania Catania ITALYEindhoven U. of Technology Eindhoven NETHERLANDSNOVA University of Lisbon (UNINOVA) Lisbon PORTUGALRHOPOINT – Microsoft Group East Grinstead U.KSurecore ltd. Sheffield U.KAnalog Photonics Boston USASouthern Illinois University Edwardsville (SIUE) Edwardsville USAU. of Nebraska-Lincoln Lincoln USAYale University New Haven USA
University at Buffalo, The State University of New York New York USA
Hanoi University of Science and Technology Hanoi VIETNAM
➢ 16 new customers in 2018 :▪ 6 Universities / Research▪ 10 Industrial Companies
CMP annual users’ meeting - 30-Jan-2020 - PARIS
Low Volume Productions in 2019
13
• Low volume productions available in MPW runs. • From tens to hundreds or thousands parts.
➢ Dedicated production runs of 6, 12, 18, 25, 50, or 100 wafers.➢ Up to 300 wafers per project per year can be ordered through CMP.
32 Low Volume Productions in 2019
Technology Institution Country Total
0.35µm CMOS Krakow design consultants POLAND 50
55nm SiGe BiCMOS Ghent U. BELGIUM 50
55nm SiGe BiCMOS Ghent U. BELGIUM 50
130nm SiGe BiCMOS THALES ALENIA SPACE FRANCE 50
28nm FDSOI KULeuven BELGIUM 50
0.35µm SiGe BiCMOS THALES Systems Aéroportés FRANCE 75
130nm SiGe BiCMOS THALES ALENIA SPACE FRANCE 75
130nm SiGe BiCMOS THALES ALENIA SPACE FRANCE 75
0.35 µm CMOS U. Nebraska USA 80
0.35µm SiGe BiCMOS RHOPOINT – Microsoft Group U.K 100
0.35µm SiGe BiCMOS THALES Systèmes Aéroportés FRANCE 100
55nm SiGe BiCMOS Analog Photonics USA 150
0.18µm HV-CMOS SILICONSORTIUM JAPAN 197
130nm SiGe BiCMOS THALES Systèmes Aéroportés FRANCE 200
130nm SiGe BiCMOS THALES_DMS FRANCE 200
130nm SiGe BiCMOS THALES Systèmes Aéroportés FRANCE 250
Technology Institution Country Total
130 nm SiGe BiCMOS THALES Systems Aeroportes FRANCE 250
0.35µm SiGe BiCMOS CEA-Saclay FRANCE 264
0.18µm HV-CMOS LAL FRANCE 300
0.35µm HV-CMOS U. de Sevilla SPAIN 300
65nm CMOS IHP GERMANY 300
130nm SiGe BiCMOS THALES Systems Aeroportes FRANCE 400
130nm SiGe BiCMOS THALES Systems Aeroportes FRANCE 400
0.35µm CMOS Newronika ITALY 540
0.35µm CMOS CEA Saclay FRANCE 709
0.35µm SiGe BiCMOS LPSC FRANCE 750
0.18µm CMOS LAL FRANCE 1 000
0.35µm SiGe BiCMOS CEA Saclay FRANCE 4 w
0.35µm SiGe BiCMOS Weeroc FRANCE 6 w
0.35µm CMOS Shanghai MEDs Electronic CHINA 12 w
0.35µm SiGe BiCMOS Shanghai MEDs Electronic CHINA 12 w
65 nm CMOS065 MIET RUSSIA 19 w
CMP annual users’ meeting - 30-Jan-2020 - PARIS14
IC
ams
ST
65nm CMOS 7LM130nm CMOS 6LM130nm HV-CMOS 4LM
28nm FDSOI130nm SOI - FEM0.16µ BCD-SOI
55nm SiGe BiCMOS130nm SiGe BiCMOS0.16µ BCD
0.35µ CMOS 4LM 0.35µ CMOS-Opto 4LM
0.35µ SiGe 4LM0.35µ HV-CMOS (50V / 120V)
ON Semi0.18µ CMOS 5LM0.35µ CMOS 4LM
0.18µ HV-CMOS (45/70V)0.35µ HV-CMOS (25/50V)
EM Microelectronic 0.18µ CMOS 5LM (ULP / ULV) New
Technology Portfolio in 2020 (1/2)
CMP annual users’ meeting - 30-Jan-2020 - PARIS
Technology Portfolio in 2020 (2/2)
15
15
MEMSCMP / ams
MEMSCAP
0.35 µ CMOS front-side bulk micromachining
PolyMUMPS PiezoMUMPSSOIMUMPS
Photonics
CEA-LETI Silicon Photonics / Si310-PHMP2M
3D-IC
LETI-CEA UBM, micro-bumps, RDL, TSV / 3D assembly / Open3D
ams 0.35um 4 LM Active or Passive Interposer + UBM
ams UBM + Bumps at Wafer Level on 0.35µ
ST UBM + Copper pillar at Wafer Level (processes on 300mm wafers)
AMF / CMC Silicon Photonics
TEEM Photonics Photonics on Glass New
ON Semi Passive Interposer + UBM New
