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8/10/2019 Class (11).pdf
1/16
Spring 2014 EE 430/530: Fundamentals of Solid-State Devices Subject 11, Slide 1/16
Subject 11: Outline
Rectification inpnJunctions
* The rectifier equation
* Electron and hole currents
* R-G currents
8/10/2019 Class (11).pdf
2/16
Spring 2014 EE 430/530: Fundamentals of Solid-State Devices Subject 11, Slide 2/16
Today we develop a QUANTITATIVE analysis that allows us to compute the CURRENT that
flows through apnjunction in response to the application of an EXTERNAL voltage (Va)
* We begin by noting that apnjunction may be broken up into two QUASI-NEUTRALregions that surround the DEPLETION region
For the sake of the analysis here we will assume that the ELECTRIC FIELD in
these quasi-neutral regions is exactly equal to ZERO
The Rectifier Equation
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E(x)
QUASI-NEUTRALREGION
QUASI-NEUTRALREGION
8/10/2019 Class (11).pdf
3/16
Spring 2014 EE 430/530: Fundamentals of Solid-State Devices Subject 11, Slide 3/16
Since the electric field is equal to zero the electron and hole DRIFT currents that flow in
the quasi-neutral regions must ALSO be equal to zero
* Previously we obtained expressions for the MINORITY-CARRIER concentrationsunder the influence of an external bias
The Rectifier Equation
JP =JP drift+JP diffusion = ! qDpd"pn
dx(11.2)
JN =JN drift+JN diffusion = qDnd!np
dx(11.1)
!pn (x)=ni
2
NDexp
qVa
kBT
"
#$
%
&'(1
"
#$
%
&'exp (
x
Lp
"
#$
%
&' , Lp = D)p (10.9)
!np(x)=ni
2
NAexp
qVa
kBT
"
#$
%
&'(1
"
#$
%
&'exp (
x
Ln
"
#$
%
&' , Ln = D)n (10.8)
8/10/2019 Class (11).pdf
4/16
Spring 2014 EE 430/530: Fundamentals of Solid-State Devices Subject 11, Slide 4/16
By combining Eqs. 10.9, 10.10, 11.1, and 11.2 we thus obtain expressions for the
electron and hole CURRENT DENSITIES in the junction
* Note the DIFFERENT way in which the directionxis defined in these two equations
The Rectifier Equation
JN = !qDnd"npdx
= qDn
Ln
ni2
NAexp
qVa
kBT
#
$%
&
'(!1
#
$%
&
'(exp !
x
Ln
#
$%
&
'( (11.3)
JP =! qDp d"pn
dx= qDp
Lp
ni2
NDexp qVa
kBT#$% &
'(!1#
$% &
'(exp ! x
Lp#$% &
'( (11.4)
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x
x = 0
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x
x = 0
Eq. 11.3
Eq. 11.4
8/10/2019 Class (11).pdf
5/16
Spring 2014 EE 430/530: Fundamentals of Solid-State Devices Subject 11, Slide 5/16
By SUMMINGthe electron and hole currents we obtain the TOTALjunction current
* Due to Kirchhoff's law we need only perform this sum at a SINGLE point within thejunction and we do this here by summing the currents at x = 0 (justified later!)
where have have taken the junction to have cross-sectional areaA
The Rectifier Equation
I =A(JN+JP )=Io exp qVa
kBT
!
"#
$
%&'1
!
"#
$
%& , Io = qA
Dn
Ln
ni2
NA+
Dp
Lp
ni2
ND
!
"#
$
%& (11.5)
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x
x = 0
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x
x = 0
1. WE EVALUATEJNHERE 2. AND ADD TO THEVALUE OFJPHERE
8/10/2019 Class (11).pdf
6/16
Spring 2014 EE 430/530: Fundamentals of Solid-State Devices Subject 11, Slide 6/16
The IDEAL-DIODE equation (Eq. 11.5) predicts a forward-bias current that grows
dramatically once Va> kBT/q
* Under REVERSEbias the current is expected to be roughly CONSTANTand equal to
the REVERSE SATURATION CURRENT (Io) whose value is NEGLIGIBLYsmall in the
range of pA
The Rectifier Equation
V(V)
1
2
-1
-2
-3
-4
-5
I(mA)
2
-2
AD
A
i
n
no
NNN
n
L
DqAI >>= ,
2
DA
D
i
p
p
o NN
N
n
L
DqAI >>= ,
2
I =A(JN+JP )=Io exp qVa
kBT
!
"#
$
%&'1
!
"#
$
%& , Io = qA
Dn
Ln
ni2
NA+
Dp
Lp
ni2
ND
!
"#
$
%& (11.5)
1
2
-1
-2
-3
-4
-5
I(mA)
2
-2
FORWARDCONDUCTION
REVERSE BIAS:NEGLIGIBLE
CURRENT
IN A JUNCTION WITH HEAVY DOPING ONONE SIDEIoIS DETERMINED BY THE DOPING
DENSITY ON THE LIGHTLY-DOPED SIDE
8/10/2019 Class (11).pdf
7/16
Spring 2014 EE 430/530: Fundamentals of Solid-State Devices Subject 11, Slide 7/16
The rectifier equation gives the TOTAL current that flows through the junction under the
influence of an externally applied voltage
* This total current is INDEPENDENT of position within thepnjunction as required byKirchoffs current law
* The INDIVIDUAL electron and hole currents are generally NOT independent of
position however
In the QUASI-NEUTRAL regions Equations 11.3 & 11.4 show that the MINORITY
carrier currents DECAY exponentially with distance due to recombination
Electron and Hole Currents
JN = !qDnd"npdx
= qDn
Ln
ni2
NAexp
qVa
kBT
#
$%
&
'(!1
#
$%
&
'(exp !
x
Ln
#
$%
&
'( (11.3)
JP =! qDpd"pndx
= qDp
Lp
ni2
NDexp
qVa
kBT
#
$%
&
'(!1
#
$%
&
'(exp !
x
Lp
#
$%
&
'( (11.4)
8/10/2019 Class (11).pdf
8/16
Spring 2014 EE 430/530: Fundamentals of Solid-State Devices Subject 11, Slide 8/16
INSIDE the depletion regions the electric field is NOT equal to zero and we must use the
continuity equations to compute the electron and hole currents
* If we consider a diode under STEADY-STATE conditions then the continuityequations (Eqs. 7.4 & 7.5) inside the depletion region become
* In the IDEAL-DIODE APPROXIMATION we assumed NO R-G processes within the
depletion region which requires in turn that the electron and hole currents in this
region must be INDEPENDENTof position
Electron and Hole Currents
!p
!t= 0 = "
1
q
dJP
dx+!p
!t ThermalR"G
(11.7)
!n
!t=
1
q"#J
N+
!n
!t thermalR$G
+
!n
!tOther
(7.4)
!p
!t=$
1
q"#J
P+
!p
!t thermalR$G
+
!p
!tOther
(7.5)
!n
!t= 0 =
1
q
dJN
dx+!n
!tThermalR"G
(11.6)
NO R-G PROCESSES!
NO R-G PROCESSES!
8/10/2019 Class (11).pdf
9/16
Spring 2014 EE 430/530: Fundamentals of Solid-State Devices Subject 11, Slide 9/16
With these considerations in mind the electron and hole currents inside apnjunction
may be sketched as shown below
* The minority-carrier currents decay exponentially away from the edges of thedepletion region
The majority-carrier currents counteract this variation in a manner that keeps
the TOTAL current CONSTANT at any particular point
* Inside the depletion region the electron and hole currents are CONSTANT
Electron and Hole Currents
x-xp xn
JN,P
JP JN
x-xp xn
JN,P
JP JN
1. DECAY ON A FEWMINORITY-CARRIERDIFFUSION LENGTH, Lp
1. DECAY ON A FEWMINORITY-CARRIER
DIFFUSION LENGTHS, Ln
2. MAJORITY CURRENTCOMPENSATES FOR CHANGEOF MINORITY CURRENT
2. MAJORITY CURRENTCOMPENSATES FOR CHANGE
OF MINORITY CURRENT
8/10/2019 Class (11).pdf
10/16
Spring 2014 EE 430/530: Fundamentals of Solid-State Devices Subject 11, Slide 10/16
We have seen that in FORWARDbias the minority-carrier concentrations are INCREASED
around the depletion region
* In REVERSE bias these concentrations are SUPPRESSED due to the associatedsuppression of carrier diffusion across the junction
The depletion region essentially acts as a SINK for minority carriers
* Reverse-bias voltages of only a few kBT/qreduce the minority concentrations toZEROat the edge of the depletion region
SUPPRESSED MINORITY-CARRIER CONCENTRATIONS IN ApnJUNCTION UNDER REVERSE BIAS
ni2/NA
ni2/ND
xxn-xp
n p
ni2/NA
ni2/ND
xxn-xp
n p
np = ni2exp
qVa
kBT
!
"#
$
%&
LAW OF THE JUNCTION (Eq. 10.5): MINORITYCONCENTRATIONSSUPPRESSED NEAR
DEPLETIONREGION DUE TO
INCREASEDBARRIER FORDIFFUSION
Va< 0
Electron and Hole Currents
8/10/2019 Class (11).pdf
11/16
Spring 2014 EE 430/530: Fundamentals of Solid-State Devices Subject 11, Slide 11/16
In deriving the rectifier equation it was assumed that NO R-G processes occur within the
depletion region
* In real junctions typically those fabricated in Si and GaAs it is found that inreverse bias or with a small forward bias the current can noticeably EXCEEDIo
This is due to ADDITIONAL current that is generated by R-G processes taking
place within the depletion region itself
* In REVERSE bias mode GENERATION of electron holes pairs in the depletion region
enhances the DRIFT current above its expected value
R-G Currents
SCHEMATIC ILLUSTRATION OF R-G CURRENTSIN A REVERSE-BIASEDpnJUNCTION
ELECTRONS AND HOLES CREATED IN THEDEPLETION REGION ARE RAPIDLY SWEPT AWAYBY THE HIGHELECTRIC FIELD IN THIS REGION
IN THIS CASE IT CAN BE SEEN THAT R-GPROCESSES ENHANCE THE DRIFT CURRENT INTHE JUNCTION WHICH THEREFORE EXCEEDS THEEXPECTED REVERSE SATURATION CURRENTIo
Ec
Ev
qVeff
ELECTRONDRIFT
HOLEDRIFT
e-h PAIRGENERATION
R-G HOLEDRIFT
R-G ELECTRONDRIFT
EF
8/10/2019 Class (11).pdf
12/16
Spring 2014 EE 430/530: Fundamentals of Solid-State Devices Subject 11, Slide 12/16
In FORWARD bias mode the main effect of R-G processes is to cause an ENHANCEMENT
of the RECOMBINATION rate
* Remember that forward biasing basically INCREASES the carrier concentrations inthe depletion regions above their equilibrium values
* This in turn gives rise to an enhanced recombination rate within the depletion region
that effectively corresponds to an ENHANCEMENT of the DIFFUSION current
R-G Currents
Ec
Ev
qVeff
EF
HOLEDIFFUSION
ELECTRON
DIFFUSION
ELECTRON
DRIFT
HOLEDRIFT
RECOMBINATION OF ELECTRONS AND HOLESINSIDE THE DEPLETION REGION IN A FORWARDBIASEDpnJUNCTION
A LARGE DIFFUSION CURRENT IS CARRIED BYTHOSE ELECTRONS AND HOLES (THICK ARROWS)IN THE DEPLETION REGION WITH SUFFICIENTENERGY TO OVERCOME THE BARRIER THATEXISTS TO THE DIFFUSION OF CURRENT
THE DIFFUSION CURRENTS ARE MUCH LARGERTHAN THE CORRESPONDING ELECTRON AND HOLEDRIFT CURRENTS (SMALLER ARROWS)
THE DIFFUSION CURRENTS ARE EFFECTIVELYENHANCED WHEN CARRIERS WITH INSUFFICIENTENERGY TO OVERCOME THE DIFFUSION BARRIERRECOMBINE (BLACK ARROWS) AND ARE THUSEFFECTIVELY ELIMINATED
8/10/2019 Class (11).pdf
13/16
Spring 2014 EE 430/530: Fundamentals of Solid-State Devices Subject 11, Slide 13/16
R-G Currents
To compute the current due to R-G processes in the depletion region we note that for
every electron-hole PAIRcreated or destroyed per unit time in the depletion region ONEelectron per unit time flows into or out of the diode contacts
* SUMMINGover either the electrons or holes created within the depletion region per
unit time should therefore give the additional current due to R-G processes
Note here that the minus sign accounts for the POLARITYof the current
* Previously (see Subjects 5 & 6) we have been able to express the rate of change of
carrier concentrations due to R-G processes using expressions of the form
This approach CANNOTbe used here however since the R-G processes takingplace in the depletion region do NOTcorrespond to low-level injection
IR!G
= !qA "n
"t thermalR!G
dx
!xp
xn=0
#
$
%%%
(11.8)
!n
!t thermalR"G
= "#n
$n
(11.9)
8/10/2019 Class (11).pdf
14/16
Spring 2014 EE 430/530: Fundamentals of Solid-State Devices Subject 11, Slide 14/16
IR-Gmust be calculated by properly solving for STEADY-STATE conditions under R-Gprocesses with the depletion region an analysis that is BEYONDthe scope of our present
discussion
* In REVERSE bias it may be shown that the additional drift current due to electron-
hole pair creation may be written as
Where !ois a LIFETIME associated with R-G center generation and depends onthe ENERGY of the R-G centers
* In Si and GaAs diodes at room temperatureIR-Gin Eq. 11.10 is much GREATERthan the ideal-diode current expected at reverse bias and small forward bias
In Ge however the larger value of nimakesIomuch larger thanIR-G
R-G Currents
IR!G =qAni
2"oW (11.10)
Io = qA Dn
Ln
ni2
NA+
Dp
Lp
ni2
ND
!
"#
$
%&>IR'G (11.11)
8/10/2019 Class (11).pdf
15/16
Spring 2014 EE 430/530: Fundamentals of Solid-State Devices Subject 11, Slide 15/16
While the ideal-diode equation predicts a CONSTANTcurrent (-Io) for a wide range ofreverse bias the R-G current GROWS with increasing |V
a|
* The growth of the R-G current follows from the increase in the WIDTHof thedepletion region under reverse biasing
As the width of the depletion region grows the volume involved in the creationof electron-hole pairs INCREASES leading to a larger R-G current
R-G Currents
IR!G =qAni
2"oW (11.10)
REVERSECURREN
T(pA)
REVERSE BIAS, Va(V)
-10-30 -20-40
-100
-200
-300REVERSE
CURREN
T(pA)
REVERSE BIAS, Va(V)
-10-30 -20-40
-100
-200
-300
NOTE UNITS!
REVERSE-BIASR-G CURRENT GROWS WITH
INCREASING
BIASING
REVERSE-BIASBREAKDOWN
DIFFERENT IN
ORIGIN TO R-G
CURRENT
SipnJUNCTION300 K
8/10/2019 Class (11).pdf
16/16
Spring 2014 EE 430/530: Fundamentals of Solid-State Devices Subject 11, Slide 16/16
For small FORWARD bias it is found that the R-G current typically varies with voltage as
* In this expression the parameter "is an empirical IDEALITY FACTOR whose valuedepends on the relative magnitude of the R-G and forward-bias diffusion currents
When IDEALdiffusion dominates "= 1 but when R-Gprocesses dominate "= 2
R-G Currents
IR!G" exp qVa
#kBT
$
%&
'
() , Va >
kBT
q(13.5)
FORWARD BIAS, Va(V)
0.4 0.8 1.210-9
10-7
10-5
10-3
10-1
FORWARDCU
RRENT(A)
"= 2
"= 1
"= 2
"= 1
Si
GaAs
300 K