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Cleaning with SupercriticalCarbon Dioxide
Ken Laintz and Dale Spall
Los AlamosNATIONAL LABORATORY
Chemical Science and TechnologyOrganic Analytical Chemistry
CST-12, MS E537Los Alamos, New Mexico 87545
(505) 665-3545, FAX (505) 667-6561
Outline
Supercritical Fluids
Cleaning Operations using
Supercritial Fluid Solvents
Experimental Cleaning Results
Other Cleaning Applications
Significant Properties of Supercritical Fluids
0 High diffusivity results in high mass transfer
0 Low viscosity and surface tension results in small porepenetration
0 High density results in solvent properties similar to liquids
0 Density is a selective function of temperature andpressure
Operational Economics of Cleaning Prospects
Factory Costs
Consumables
Utilities
Finance
Quality
Direct LaborIndirect LaborLabor ExpensesBenefitsFactory OverheadDepreciationCycle Time CostsMaintenanceNew Technology Changeover CostsFacility Space Costs
ConsumablesDisposal CostsLiability Costs
Energy and Utilities
Taxes and FeesAdministration
Capital CostsFinance Charges
Cost of Quality
Aqueous Supercritical CO2Semi-aqueous
J A A S TJoint Association for the Advancement of
Supercritical Fluid Technology
Mission: To develop and disseminate SCF cleaning applications in support of environmentally
conscious manufacturing to meet the needs of the government and industry
Members
Hughes Aerospace
Allied Signal
Ciba Vision
Boeing
IBM
Honeywell
Draper Labs
Litton
Inland Technologies
Applied Separations DOE
Autoclave Engineers EPA
CF Technologies SNL
ISCO
National Forge
Liquid Carbonic
Pressure Products Ind., Inc.
Thar Design
LANL
PNL
NASA-LARC
NSWC/IH
U. Mass. Lowell
U. South Carolina
Comparison of Drawing Oil Removal fromStainless Steel using CO2 and Freon-113
Freon- 113CO2
CO2 Density (g/mL)
Overall Small Scale ContaminantRemoval Results
n Substrates 18 metals, glass,quartz, sapphire, and 24 polymers
n Contaminants 14 cutting oils, 17 machining oils, silicone fluids, 5 water
soluble cutting fluids, and 182 individual chemicals
n Observations Removals on the order of 85-100% for most compounds
Substrate independent
Silicon Wafer Photoresist Removal using Supercritical CO2
n Resist Types Positive W a xN e g a t i v e
n Problem: Organic solvent resist stripping methods usechlorinated solvents and sulfonic acids.
n Issues Toxicity Flammability
D i s p o s a l
n Solution: Investigate the use of supercritical CO2 for resistremoval.
Silicon Wafer Photoresist Removalusing Supercritical CO2
n Binary, two-step solvent cleaning system necessaryfor resist removal using supercritical CO2 processing.
Positive Resist: Supercritical CO2 treatmentfollowed by secondary solvent wash
Wax Resist: Hydrocarbon solvent treatmentfollowed by supercritical CO2 wash
Negative Resist: Solvent combinations underinvestigation
n Supercritical CO2 processing cleans as well as andbetter than current solvent stripping methods forpositive and wax resists.
Dry-Cleaning withCarbon Dioxide
Ken Laintz and Dale Spall
Los AlamosNATIONAL LABORATORY
Chemical Science and TechnologyOrganic Analytical Chemistry
CST-12, MS E537Los Alamos, New Mexico 87545
(505) 665-3545, FAX (505) 667-6561
Summary
n Super-critical carbon dioxide is capable of removing common contaminantsfrom a variety of surfaces to precision cleaning levels
n Supercritical carbon dioxide can remove oils down to and below levelsobtained using a Freon wash
n Cleaning with supercritical carbon dioxide tends to be substrateindependent
n Supercritical carbon dioxide cleaning efficiency translates from small scaleto large scale
Cleaning with supercritical carbon dioxide is an economically viablesolution to many cleaning problems