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V1.0 CPO ELS GUIDANCE DOCUMENT 1 CPO JDF Co-packaged Optics External Laser Source Guidance Document
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Co-packaged Optics External Laser Source Guidance Document
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Table of Contents
1. Introduction..............................................................................................................................................51.1 Scope................................................................................................................................................................................................51.2 Introduction.................................................................................................................................................................................51.3 CommonTerms...........................................................................................................................................................................51.4 References.....................................................................................................................................................................................6
2. AbsoluteMaximumRatings.................................................................................................................7
3. OperatingConditions.............................................................................................................................8
4. OpticalRequirements............................................................................................................................94.1 Background..................................................................................................................................................................................94.2 OpticalSpecification..............................................................................................................................................................11
5. MechanicalDesignConsiderations.................................................................................................155.1 Formfactor................................................................................................................................................................................155.2 OpticalConnectiontotheOpticalModule...................................................................................................................165.3 ThermalConsiderations.......................................................................................................................................................16
6. ElectricalSpecifications......................................................................................................................176.1 LowSpeedPinsandSignaling...........................................................................................................................................176.2 LowPowerModeorPowerShutdown...........................................................................................................................17
7. ManagementInterface.........................................................................................................................187.1 MemoryMap.............................................................................................................................................................................187.2 ModuleOperation...................................................................................................................................................................21
8. EnvironmentalConditions.................................................................................................................22
9. QualityandReliability.........................................................................................................................239.1 EnvironmentalStressTesting............................................................................................................................................239.2 ServiceLife.................................................................................................................................................................................239.3 FailureRate...............................................................................................................................................................................23
10. RevisionHistory....................................................................................................................................23
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Table of FiguresTable1:Absolutemaximumratings..............................................................................................................................7
Table2:Operatingconditions............................................................................................................................................8
Table3:ELScharacteristicsforFR4applications...............................................................................................12
Table4:ELScharacteristicsforDR4applications..............................................................................................13
Table5:Examplelasernumberingfora2-channelCWDM4module......................................................18
Table6:MemorymapforELSmodule........................................................................................................................21
Table7:Environmentalconditions..............................................................................................................................22
Table8:Revisionhistory....................................................................................................................................................23
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Table of Tables Table1:Absolutemaximumratings ___________________________________________________________________7
Table2:Operatingconditions___________________________________________________________________________8
Table3:ELScharacteristicsforFR4applications___________________________________________________12
Table4:ELScharacteristicsforDR4applications___________________________________________________13
Table5:Examplelasernumberingfora2-channelCWDM4module_____________________________18
Table6:MemorymapforELSmodule_________________________________________________________________21
Table7:Environmentalconditions____________________________________________________________________22
Table8:Revisionhistory________________________________________________________________________________23
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1. Introduction
1.1 Scope Thisdocumentprovidesguidanceontherequirementsforanexternallasersourcedesignedfornetworkequipmentapplicationsusingco-packagedoptics.
1.2 Introduction TheCPOJDFplanstoreleasethreedocumentstoprovideguidancetovendorspursuingdifferentelementsofCo-PackagedOptics(CPO)includingtheopticalmodule,theExternalLightSource(ELS)module,andtheCPOassembly.ThisdocumentisfortheELSmodule.ThisfirstrevisionisintendedtofacilitateastructuredconversationabouttheELSmodule.Thisdocumentwillberevisedasinputarecollectedfromvendors.
1.3 Common Terms Thefollowingtermsandacronymsareusedinthisdocument.
● CPO–Co-PackagedOptics● CW–ContinuousWave● 400GE–400GigabitEthernet● 400GFR4–400GEopticalstandardutilizing4wavelengthsona1310nmCWDMgridwith
eachwavelengthtransmitting100Gb/susing56Gb/sPAM4modulation● 400GDR4–400GEopticalstandardutilizingribbonfiberwith4x100Gb/stransmitand
4x100Gb/sreceivelanes/fibers.1310nmisusedforalllanes● QSFP-DD–QuadSmallForm-factorPluggableDoubleDensityusedfor400GE● OSFP–OctalSmallFormFactorPluggable● CMIS–CommonManagementInterfaceSpecification● ESD–Electro-StaticDischarge● ELS–ExternalLaserSourceusedasaCWlightsourcefortheco-packagedopticalmodule● OBO–OnBoardOptic● COR–ClearonRead● OPT-Optional● RO–Read-Only● RQD–Required● RW–ReadableandWritable
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1.4 References Thefollowingspecificationsarereferencedinthisdocument.
● IEEEStd.802.3bs–MediaAccessControlParameters,PhysicalLayersandManagementParametersfor200Gb/sand400Gb/sOperation
● IEEEStd.802.3cu–MediaAccessControlParameters,PhysicalLayersandManagementParametersfor100Gb/sand400Gb/sOperationoverSMFat100Gb/s(currentlyindraft)
● CMISrevision4.0–CommonManagementInterfacespecification● COBO8-laneand16-laneOn-boardOpticalspecificationrelease1.1.● OSFPOctalSmallFormFactorPluggableModuleSpecificationRev2.0● IEC60825-1,Edition3.0Safetyoflaserproducts-Part1:Equipmentclassificationand
requirements● IEC60825-2,Edition3.2Safetyoflaserproducts–Part2:Safetyofopticalfibre
communicationsystems(OFCS)
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2. Absolute Maximum Ratings
ThevaluesinTable1belowareforguidanceanddiscussionandsubjecttochange.
Parameter Symbol Min Typical Max Unit Note
Storagetemperature T_st -40 85 °C
Relativehumidity,storageandtransportation
RH 5 95 % Noncondensing
ESD,electricalPINs ESD -1 1 kV Humanbodymodel
Powersupplyvoltage Vcc -0.3 3.6 V
Table1:Absolutemaximumratings
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3. Operating Conditions
Parameter Symbol Min Typical Max Unit Note
Powersupplyvoltage Vcc1 3.14 3.3 3.47 V
Operatingcasetemperature
Tcase 20 70 °C
Powerconsumption P
15 WWithQSFP-DDformfactor
20 WWithOSFPorotherpluggableformfactor
20 W With8xOBOformfactor
40 WWith16xOBOformfactor
PowerconsumptioninLowPowerMode
P_lpm 1.5 W
Steadystatecurrent Icc
5 A Formax15Wpowerconsumption
6.5 AFormax20Wpowerconsumption
13 AFormax40Wpowerconsumption
In-rush,instantaneouspeakcurrent
I_peak Iccmax+30% A Peakinrushcurrentfor
thesupplyrail
Relativehumidity RH 5 85 % Non-condensing
Table2:Operatingconditions
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4. Optical Requirements
4.1 Background AnexampleofaCPOassemblywithanELSmoduleisillustratedinFigure1.TheCPOassemblyconsistsofahigh-densityorganicsubstrate,switchICand8xopticalmodulesarrayedaroundtheswitchIC.EachopticalmoduleinFigure2hasthreefiberarrays:oneforTxfunction,oneforRxfunctionandonetoconnecttotheELSmodule.ELSmoduleswillconsistofahigh-powerlaserarrayprovidingaContinuousWave(CW)lightsourcetosupportCPOmoduleswithdifferentopticalspecifications.Themostcommonopticalstandardsforfirst-generationCPOmoduleswillbe400Gb/sasdescribedinasdescribedinIEEE400GBASE-DR4(IEEE802.3bs,clause124)and400GBASE-FR4(IEEE802.3cu,indraft).
Figure1:Exampleembodimentofa51Tb/sCPOassemblywithOBOELSmodules
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Figure2:ExampleofanopticalmoduleforCPOapplications
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4.2 Optical Specification
4.2.1 Number of Optical Lanes
EachlaseroftheELSmodulewillprovideCWlighttotheopticalmoduleusingopticalfiber.Thepowerfromalasercanbesplittomultipleopticalchannelswithintheopticalmodule.Thetotalnumberoflasersandfibersdependsonapplication,numberofopticalmodulesandopticalpowerofeachlaser.Forexample,aCPOassemblywith8x6.4Tb/sopticalmodulesusing400GBASE-FR4,eachopticalmodulerequiresfourlasersatfourwavelengthsandfourfibersifeachlasercansupport16x100Gb/slanes(seeFigure3),oreightlasers(twoforeachwavelength)andeightfibers,ifeachlasercansupport8x100Gb/slanes.Figure4showsanexampleof3.2Tb/sopticalmoduleusing400GBASE-DR4configurationwhereoneopticalmodulerequiresoneELSmodulewithtwolasersatthesamewavelength.Eachlasersupports16x100Gb/slanes.
Figure3:ExampleofELSfor6.4Tb/s,400GBASE-FR4opticalmodule
Figure4:Exampleof3.2Tb/s,400GBASE-DR4opticalmodule
.
.
.ELS
(l0,l1,l2,l3)
6.4Tbs/sopticalmodule,16x400G-FR4
l0
l1
l2
l3
Ch0Tx(l0,l1,l2,l3)
Ch1Tx(l0,l1,l2,l3)TxTx
Ch15Tx(l0,l1,l2,l3)Tx
.
.
.ELS(l1)
3.2Tbs/sopticalmodule,8x400G-DR4
l1
Ch0Tx(4xl1)
l1
Ch1Tx(4xl1)TxTx
CH7Tx(4xl1)Tx
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4.2.2 Specifications for 400GBASE-FR4 Application
SpecificationofanELSmoduletosupportCPO’s400GBASE-FR4applicationisshowninTable3.
Description Value Unit Note
Lanewavelength Ref:IEEE802.3cu
Side-modesuppressionratio(SMSR)(min)
Ref:IEEE802.3cu
Averagelaunchpower,eachlane(max)
27 dBm Seesection4.2.4
Averagelaunchpower,eachlane(min)
23 dBm
Expectedminpoweracceptedinordertominimizeinputfiberquantity
AveragelaunchpowerofOFFtransmitter,eachlane(max) -15 dBm
RINc(max) -141.5 dB/Hz Note1
Note:1. RINccanbecalculatedfrommeasuredRIN_OMA.RIN_OMAcanbemeasuredusing
methodinIEEE802.3aewith17.1dBreflectioncoefficient.Table3:ELScharacteristicsforFR4applications
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4.2.3 Specification for 400GBASE-DR4 Application
SpecificationofELSmoduletosupportCPO’s400GBASE-DR4applicationisshowninTable4.
Description Value Unit Note
Lanewavelength(range) Ref:IEEE802.3bs
Side-modesuppressionratio(SMSR)(min)
Ref:IEEE802.3bs
Averagelaunchpower,eachlane(max)
27 dBm Seesection4.2.4
Averagelaunchpower,eachlane(min)
23 dBm
Expectedminpoweracceptedinordertominimizeinputfiberquantity
AveragelaunchpowerofOFFtransmitter,eachlane(max)
-15 dBm
RINc(max) -141.5 dB/Hz Note1
Note:1. RINccanbecalculatedfrommeasuredRIN_OMA.RIN_OMAcanbemeasuredusing
methodinIEEE802.3aewith17.1dBreflectioncoefficient.Table4:ELScharacteristicsforDR4applications
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4.2.4 Laser Safety Limit Consideration
Toreducethenumberoflasersneeded,itisdesiredtohavetheoutputpowerforeachlaserintherangeof+23to+27dBm.Thelasereyesafetyimplicationsofsuchpowerlevelsneedfurtherstudyandinputfromindustry.Theapplicablesafetystandards,IEC60825-1edition3.0(2014)andIEC60825-2edition3.2(2010)donotcurrentlyalignin1250nm-1400nmrange.ItisnotclearwhenIEC60825-2willreleaseanewamendmentandwhetheritwilladopttherecentchangeintheIEC60825-1specification.LasersafetyprotectionmechanismscanbeimplementedfortheELSmodulesuchasauto-laser-shutdownschemewhenthefiberconnectorisdetectedtobeunterminated.TheJDFisinterestedinpracticalproposalforELSmoduleshutdowntechniquefromvendorstopromotelasersafety.ThefactorsfordesignshouldincludebothDR4andFR4applications,powerofeachwavelength,numberoffibers,connectortype,fiberseparationandarrangement.
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5. Mechanical Design Considerations
5.1 Form factor TheELSmodulewillprovideCWlighttotheCPOmodulethoughexternalopticalfibers.Itshouldbeserviceableinthecaseofalaserfailure.TherearethreedesignoptionsfortheELSmodule.Thefirstoptionisastandardpluggablemoduletobeusedontheswitchfaceplate.AnexampleofaCPOassemblywithstandard,pluggableform-factorisshowninFigure5.QSFP-DDandOSFParegoodcandidatesforafront-panelpluggableformfactorsastheyarecompactandcandissipate>15Wofpower.Withsuchpluggablemoduledesign,theELScanbepoweredupandmanagedthoughanyQSFP-DDorOSFPport.Thereispotentiallasersafetyconcernwiththisapproachwhenthelaserpowerisaccessibleontheswitchfrontpanel.Specialshutteredportsmightberequired.Thesecondoptionisacustomizedpluggablemoduletoimprovelasersafetyprotection.TheELSmoduleisalsoinstalledtheswitchfaceplate.However,thereisonlyapull-tabatthefrontofthemodule.Bothelectricalandopticalconnectionsareonthebacksideofthemodule.TheJDFisinterestedinproposalsforapluggableELSwithaback-sideopticalconnector.ThethirdoptionisanOBOmoduleonthemainswitchPCBA.AnexampleofaCPOassemblywithOBOELSmodulesontheswitchPCBAisillustratedinFigure6.TheOBOform-factorsdefinedintheCOBOspecificationfor8xOBOand16xOBOarewell-definedcandidates.ThisguidancedocumentdoesnotintendtodefineafixedformfactorfortheELSmodule.Thevendorwouldconsiderseveralfactorsforthedesignforexampleserviceability,numberoflasers,opticalconnectorandpowerdissipation,lasersafety.TheJDFwelcomesinputontheformfactordefinitionforanELSmodule.
Figure5:ExampleofCPOassemblywithpluggableELSmoduleontheswitchfaceplate(courtesyofRockley
Photonics)
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Figure6:ExampleofCPOassemblywithpluggableELSmoduleontheswitchPCBA(courtesyofCisco)
5.2 Optical Connection to the Optical Module Dependingondesign,applicationsandoutputpower,eachopticalmodulerequiresatleastonefiberforeachwavelengthtoconnecttotheELSmodule.ForsomeCPOopticalmodules,PMfiberwillberequired.WithmultiplelasersinoneELSmodule,theELSmodulemayhaveapigtailedfiberassemblyoranintegrated,high-density,opticalconnectorsuchasMPO.IfoneELSmoduleprovidesCWsignalformultipleopticalmodules,afiberbreakoutschememayneedtobedeveloped.TheJDFlooksforwardtoproposalsfromvendorsforopticalconnectionschemes.
5.3 Thermal Considerations IfastandardQSFP-DD/OSFPformfactororanothercustomizedpluggableformfactorisused,thehostcoolingsystemshouldsupport15to20Wpowerdissipation.ForOBOdesigns,theELSmodulecanincorporateanintegratedheatsinkonthetopsurface.TheJDFlooksforwardtoproposalsforpowerdissipationandheatsinkdesignsforOBOdesigns.
ELS Modules
Fiber for ELS
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6. Electrical Specifications
ThemoduleshouldcontainrelevantcircuitryforcontrollingandmonitoringeachlaserchannelasshowninFigure7.Thevoltagesuppliedshouldbe+3.3V.Eachlaserchannelshouldincludecircuitrytoindividuallyenableeachlaserandobtainthelaser’sbiascurrent(ILD),biasvoltage(VLD),andoutputopticalpower(PO).
Figure7:ElectricalblockdiagramofanELSmodule
6.1 Low Speed Pins and Signaling Lowspeedpinsshouldfollowthelayoutandtimingrequirementsofthehardwareformfactorused.LowspeedpinssupportedshouldincludeVcc,GND,IntL,ModPrsL,LPMode,ResetL,ModselL,SCLandSDA.SignalingshouldfollowtheI2Cstandardsupportingspeedsupto400kHz.
6.2 Low Power Mode or Power Shutdown Insomeusecases,notalloftheopticallanesofanELSmodulewillbeused.Ideally,theseunusedlanescouldbeshutdownindependentlysuchthattheyconsumenopower.Themaximumlaunchedopticalpowerforeachshut-downlanecanbefoundinTable3andTable4forFR4andDR4applicationsrespectively.WhentheELSmoduleisinlowpowermode,allthelasersshouldbeshutdown.MaxpowerconsumptionoftheELSmoduleinlowpowermodeisprovidedinTable2.
ResetLSDASCL
ModselLIntL
LPMode
ILD
+
VLD
-x Number Lasers
Laser Control and Sense
TEC driver and TEC(optional)
IPo
In-rush current limiter Voltage regulatorVcc
GND
V_LDV_PDV_TEC
Vcc_0
MCU
En
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7. Management Interface
ThemanagementinterfacefortheELSmoduleusestheQSFP-DDCMISandcommunicatesoveratwo-wireinterface.Thisincludestheread/writeoperationsovertheI2Cinterface.TheCPOJDFwelcomesproposalsforthemanagementinterfaceincludinglowspeedpins,signalingandmemorymapandoperation.Aproposalismadeinthefollowingsections.
7.1 Memory Map ThemanagementinterfacefortheELSmoduleshallimplementthecustomizedmemorymapasdescribedbelow.Theentirememorymapfitswithin256bytes,andthuscomparedtomorecomplicatedopticaltransceiverscanbeimplementedinaflatmemorymap.Thememorymapissuitableforupto16lasers.Ifamoduleimplementsfewerlasers,unusedfieldsshouldremainread-onlyandequalto0.LasersshouldbeidentifiedbylaserID.AnexampleoflaserIDforFR4applicationusingeightlasersisshowninTable5.OutputfiberlaneassignmentshouldmatchthelaserID.
LaserID Wavelength(nm)
0 1271
1 1291
2 1311
3 1331
4 1271
5 1291
6 1311
7 1331 Table5:Examplelasernumberingfora2-channelCWDM4module
Forfieldswhichoccupytwobytes,theloweraddressreferstotheMSBandthehigheraddressreferstotheLSB.SeeTable6fordetails.
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Address Bit Name Description Type
0 All Identifier Identifier-TypeofSerialModule–DefinitionTBD RO,RQD
1 All Revision
Managementinterfacerevision;theuppernibbleisthewholenumberpartandthelowernibbleisthedecimalpart.Example:01hindicatesversion0.1,21hindicatesversion2.1.
RO,RQD
2
7-5 Reserved RO,RQD
4 LaserGridLaserwavelengthgrid.0=CWDM41=DR4
RO,RQD
3-0 LaserCount
Numberoflasersimplementedinmoduleminus1(0=1laser,15=16lasers) RO,RQD
3
7-2 Reserved RO,RQD
1 ModuleState
Modulestate0=Highpowermode1=Lowpowermode
RO,RQD
0 Interrupt Digitalstateofinterruptoutputsignal RO,RQD
4
7-1 Reserved RO,RQD
0 ModuleLowPower
Modulelowpower.ModulewillbeinhighpowereitherLPModepinorModulelowpowerbitaresettohighpowermode0=Highpowermode1=Lowpowermode(default)
RW,RQD
5 All LaserDisable
Setswhichlaserswillbedisabledinhighpowermode.Disablingorenablingalaserwhileinhighpowermodewilltakeeffectimmediately.0=Enable(default)1=DisableBits7-0correspondtolasers7-0,respectively
RW,RQD
6 All LaserDisable
Sameasabove.Bits7-0correspondtolasers15-8,respectively RW,RQD
7 All LaserActive
Reportswhichlasersareinitializedandactive.0=Inactive(default)1=ActiveBits7-0correspondtolasers7-0,respectively
RO,RQD
8 All LaserActive
Sameasabove.Bits7-0correspondtolasers15-8,respectively RO,RQD
9 7 VccLowWarning LatchedlowVccwarningflag.Clearonread COR,RQD
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Address Bit Name Description Type
6 VccHighWarning LatchedhighVccwarningflag.Clearonread COR,RQD
5 VccLowAlarm LatchedlowVccalarmflag.Clearonread COR,RQD
4 VccHighAlarm LatchedhighVccalarmflag.Clearonread COR,RQD
3 TempLowWarning
Latchedlowtemperaturewarningflag.Clearonread COR,RQD
2 TempHighWarning
Latchedhightemperaturewarningflag.Clearonread COR,RQD
1 TempLowAlarm Latchedlowtemperaturealarmflag.Clearonread COR,RQD
0 TempHighAlarm Latchedhightemperaturealarmflag.Clearonread COR,RQD
10 All LaserBiasWarning
Latchedlaserwarningalarm.Clearonread.Bits7-0correspondtolasers7-0,respectively COR,RQD
11 All LaserBiasWarning
Sameasabove.Bits7-0correspondtolasers15-8,respectively COR,RQD
12 All LaserBiasAlarm
Latchedlaserbiasalarm.Clearonread.Bits7-0correspondtolasers7-0,respectively COR,RQD
13 All LaserBiasAlarm
Sameasabove.Bits7-0correspondtolasers15-8,respectively COR,RQD
14-21 All Reserved RO,RQD
22-23 All ModuleTempMSB
Internallymeasuredtemperature:signed2'scomplementin1/256degreeCelsiusincrements. RO,RQD
24-25 AllModuleSupply3.3V
Internallymeasured3.3Voltinputsupplyvoltagein100µVincrements RO,RQD
26-27 All Laser0Current
Internallymeasuredlaserbiascurrentmonitor.Unsignedintegerin10µAincrements. RO,RQD
28-57 All Lasers1-15Current Sameasabove. RO,RQD
58 All LaserVoltage
Internallymeasuredlaserbiasvoltagemonitor.Unsignedintegerin10µVincrements. RO,RQD
59-74 All Lasers1-15Voltage Sameasabove. RO,RQD
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Address Bit Name Description Type
75-76 AllLaser0OpticalPower
Internallymeasuredlaseropticalpowermonitor.Unsignedintegerin10µWincrements. RO,RQD
77-106 AllLasers1-15OpticalPower
Sameasabove. RO,RQD
122-123 All TECCurrent
TECcurrentmonitorsigned2'scomplementnumberin1/32767%increments+32767ismaxTECcurrent(100%)-Maxheating-32767isminTECcurrent(100%)-Maxcooling
RO,OPT
124-127 All Reserved RO,RQD
129-144 All VendorName Vendorname(ASCII) RO,RQD
145-147 All VendorOUI VendorIEEEcompanyID RO,RQD148-163 All VendorPN Vendorpartnumber(ASCII) RO,RQD164-165 All VendorRev Vendorrevisionnumber(ASCII) RO,RQD166-181 All VendorSN Vendorserialnumber(ASCII) RO,RQD
182-183 All DateCodeYear
Datecodeyear(ASCII).Twolowerorderdigitsofyear(00=2000) RO,RQD
184-185 All DateCodeMonth Datecodemonth(ASCII).(01=Jan.12=Dec) RO,RQD
186-187 AllDateCodeDayofMonth
Datecodedayofmonth(ASCII)(01-31) RO,RQD
188-189 All LotCode Customlotcode(ASCII),maybeblank RO,OPT
190-199 All CLEICode CommonLanguageEquipmentIdentification(CLEI)code(ASCII) RO,OPT
200 All MaxPower Maximumworstcasepowerconsumptioninincrementsof0.25W RO,RQD
201-255 All Reserved RO,RQDTable6:MemorymapforELSmodule
7.2 Module Operation TheELSmoduleshalladheretothebehaviorsdescribedbytheModuleStateMachineformoduleswithaflatmemorymapinthelatestCMISdocuments.
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8. Environmental Conditions
ThevaluesinTable7belowareforgeneralguidanceanddiscussionandsubjecttochange.
Parameter Symbol Min Typical Max Unit Note
Altitude,duringoperation,tosealevel
-50 1800 m
Acoustic,duringoperation 55 dBA
Vibration,duringoperation TBD Note1
Altitude,storage,tosealevel
5 km
Altitude,transportation,tosealevel
12 km
Gaseouscontamination Note2
Note:1. RefertoIEC68-2-36,IEC68-2-62. ConformtoSeverityLevelG1perANSI/ISA71.04-1985.
Table7:Environmentalconditions
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9. Quality and Reliability
Detailedqualityandreliabilityrequirementswillbetailoredbycustomerandprogram.High-levelguidanceforELS’susedinCPOapplicationsisprovidedbelow.
9.1 Environmental Stress Testing AsdescribedinTelcordiaGR-468-COREsection4.2forIntegratedModules.
9.2 Service Life Maximumservicelifewillvarybetweenfiveandsevenyears.Overtheservicelife,themaximumfailureratebelowapplies.
9.3 Failure Rate TheexactFITraterequiredfortheELSmodulewillvarydependingonthespecificimplementation.Itmustbelowenoughtoensuretheenduser’sAnnualFailureRate(AFR)targetsforthefinishednetworkequipment.TheJDFisinterestedinvendor’sperspectivesonwhatFITratescouldbeachievedforCPOELS’sandworkingtogethertoensuresystemAFRtargetscanbeachieved.LaserredundancycanbeusedtoimprovethereliabilityoftheELSmoduleandoverallnetworkequipment.Inthisdesign,asecondarylaseriscalledintoservicewhenthefirstlaserfails.TheJDFwelcomesdesignproposalsforredundancyincludingarchitecture,switchingmechanismandswitchingtime.
10. Revision History
TherevisionhistoryofthisdocumentiscapturedinTable8below.Revision Date Description of Changes 1.0 TBD Initial release
Table8:Revisionhistory
