34
+ COLOR MONITOR SERVICE MANUAL CAUTION BEFORE SERVICING THE UNIT, READ THE SAFETY PRECAUTIONS IN THIS MANUAL. CHASSIS NO. : CL-11 MODEL: FPD1800, LG881Y
+
COLOR MONITORSERVICE MANUAL
CAUTIONBEFORE SERVICING THE UNIT, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS NO. : CL-11
MODEL: FPD1800, LG881Y
1. LCD CHARACTERISTICS
Type : Color Active Matrix TFT LCDSize : 18.1inch (45.97cm)Pixel Pitch : 0.2805mm(H) x 0.2805mm(V)Pixel Format : 1280 x 1024 pixels
RGB Stripe ArrangementColor Depth : 8-bit, color (24 bits)Active Video Area : 359mm x 287mmSurface Treatment : Anti-Glare, Hard Coating (3H)Backlight Unit : CCFL (Cold Cathode
Fluorescent Lamp)Electrical Interface : DVI-D
2. OPTICAL CHARACTERISTICS
2-1. Viewing Angle by Contrast Ratio ≥ 10Left : 80°Right : 80°Top : 80°Bottom : 80°
2-2. Luminance : 200 min.(Center of screen)
2-3. Contrast Ratio : 200 min : 1
3. SIGNAL (Refer to the Timing Chart)
3-1. Type : TMDS Digital
3-2. Voltage Level : 3.3V
3-3. Input Impedance : 50Ω
3-4. Operating FrequencyHorizontal : 64 kHzVertical : 60 Hz
4. POWER SUPPLY
4-1. Power AdaptorInput : AC 90~264V, 50/60Hz 1.4~0.7AOutput : DC 12V 5.8A
4-2. Power Consumption
5. ENVIRONMENT
5-1. Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)(Ambient)
5-2. Relative Humidity : 5% ~ 90%(Non-condensing)
5-3. Altitude : 0~10,000 feet
6. DIMENSIONS (with TILT/SWIVEL)
Width : 434.0mm (17.09'')Depth : 235.0mm (9.25'')Height : 443.1mm (17.44'')
7. WEIGHT (with TILT/SWIVEL)
Net Weight : 9.0kg (19.84 lbs)Gross Weight : 12.3kg (27.12 lbs)
CONTENTS
- 2 -
SPECIFICATIONS ................................................... 2PRECAUTION ......................................................... 3TIMING CHART ....................................................... 4OPERATING INSTRUCTIONS ................................ 4WIRING DIAGRAM ................................................. 5DISASSEMBLY ....................................................... 6BLOCK DIAGRAM ................................................... 8DESCRIPTION OF BLOCK DIAGRAM................... ..9
ADJUSTMENT ...................................................... 10TROUBLESHOOTING GUIDE .............................. 11PRINTED CIRCUIT BOARD................................... 13EXPLODED VIEW................................................... 14REPLACEMENT PARTS LIST ............................... 16PIN CONFIGURATION........................................... 20SCHEMATIC DIAGRAM ......................................... 28PACKING AND ACCESSORIES ............................ 34
SPECIFICATIONS
MODE
POWER ON (NORMAL)
DPM
POWER OFF
SIGNAL
ON
OFF
-
POWER CONSUMPTION
less than 50W
less than 5 W
less than 5 W
LED COLOR
GREEN
ORANGE
OFF
VIDEO
ACTIVE
OFF
-
PRECAUTION
- 3 -
WARNING FOR THE SAFETY-RELATED COMPONENT.
• There are some special components used in LCDmonitor that are important for safety. These parts aremarked on the schematic diagram and thereplacement parts list. It is essential that these criticalparts should be replaced with the manufacturer’sspecified parts to prevent electric shock, fire or otherhazard.
• Do not modify original design without obtaining writtenpermission from Gateway or you will void the originalparts and labor guarantee.
TAKE CARE DURING HANDLING THE LCD MODULEWITH BACKLIGHT UNIT.
• Must mount the module using mounting holes arrangedin four corners.
• Do not press on the panel, edge of the frame stronglyor electric shock as this will result in damage to thescreen.
• Do not scratch or press on the panel with any sharpobjects, such as pencil or pen as this may result indamage to the panel.
• Protect the module from the ESD as it may damage theelectronic circuit (C-MOS).
• Make certain that treatment person ’s body aregrounded through wrist band.
• Do not leave the module in high temperature and inareas of high humidity for a long time.
• The module not be exposed to the direct sunlight.
• Avoid contact with water as it may a short circuit withinthe module.
• If the surface of panel become dirty, please wipe it offwith a softmaterial. (Cleaning with a dirty or rough clothmay damage the panel.)
WARNING
BE CAREFUL ELECTRIC SHOCK !
• If you want to replace with the new backlight (CCFL) orinverter circuit, must turn off the power button ordisconnect the AC adapter because high voltageappears at inverter circuit about 650Vrms.
• Handle with care wires or connectors of the invertercircuit. If the wires are pressed cause short and mayburn or take fire.
CAUTIONPlease use only a plastic screwdriver to protect yourselffrom shock hazard during service operation.
CAUTION
• There is two backlight, and be careful of treatment it.
• MTBF (Mean Time Between Failure) of a backlightis about 30,000 hours(mininum 20,000 hours).
Backlight Ass’y (P/N: 6913TZZ002A)
IF BRIGHTNESS OF THE LCD MODULE DARKEN,REPLACE THE BACKLIGHT ONE OR ALL.
TIMING CHART
- 4 -
VIDEO
SYNC
C
E
DF
A
B
MODE
1
H(Pixels)
V(Lines)
SyncPolarity
+
+
Dot Clock
108.0MHz1280
X1024
63.981KHz
60.02Hz
1688
1066
1280 48
1024 1
112408
42 3
248
38
FrequencyTotal
Period(A)
VideoActiveTime (B)
BlankingTime (C)
SyncDuration
(E)
BackPorch
(F)
FrontPorch
(D)Resolution
OPERATING INSTRUCTIONS
Power ON/OFF ButtonThis button is used to turn the monitor on and off.
Power IndicatorThis indicator lights up green when the monitor operatesnormally; in DPMS (Energy Saving) mode, power off mode- itscolor changes to orange.
Brightness Control Buttons Use these buttons for adjusting the brightness.
+
+
Front View
Rear View
DVI-D Signal Connectors
WIRING DIAGRAM
- 5 -
J3
J4
CN2CN3
CN5CN4
J5
CN2
J5 J6
J3
CN1
J2J1
DISASSEMBLY
- 6 -
(a)
1. TILT/SWIVEL REMOVAL1) Remove Hinge Cover.(Push the tilt cover both side).
2) Remove two screws (a).3) Remove the Tilt/swivel.
2. FRONT CABINET REMOVAL1) Remove two screws (a).2) Release ten latches (b).3) Remove the Front Cabinet.
3. INVERTER WIRE SHIELD & BACK COVER REMOVAL1) Remove four screws (a). 2) Remove two Inverter Wire Shield. 3) Remove three screws (b).4) Remove the Back Cover.
(a)
(b)
(a)
(a)
(b)
(b)
(b)
(b)
(a)
Front Cabinet Back Cover
Inverter Wire Shield
- 7 -
4. INVERTER FRAME & REAR SHIELD REMOVAL1) Remove sponge (a).2) Remove two screws (b).3) Remove the Inverter Frame.4) Remove six screws (c).5) Remove the Rear Frame.
(a)
(a)
(a)
(b)
(c)
5. MAIN TOTAL ASS’Y REMOVAL1) Disconnect J1, J2, J3 and J4.2) Remove five screws (a).3) Remove two fixers (b).4) Remove Aluminium Tape (c).5) Disconnect FPC Cable, Module Connector and
Control PCB Connector.6) Remove Main Total Ass’y and Inverter PCB
Ass’y.
6. MAIN PCB SHIELD REMOVAL1) Disconnect J04.2) Remove Inverter Ass’y from the Main PCB.3) Release two latches (a).4) Divide Top Shield, Main PCB, and Bottom Shield.
(b)
Rear Frame
Inverter Frame
FPC Cable
Control PCB Connector
Module Connector
PCB Shield (Top)
Inverter Ass’y
Main PCB
J04
PCB Shield (Bottom)
(c)(c)
(c)
(a)
J1J2
J3J4
(a)
BL
OC
K D
IAG
RA
M
- 8-
SiI161Display
DataTransmitter
LCD
Module
Form PSU12V
DC/DCConverter
Inverter
Data
Clock
Micro-Controller12V
LVDS83LG LCD PANEL
( LM181E3 )
. Brightness
3.3 V 3.3 V
5 V
MC68HC08
12V5 V
3.3 V
LVDS Even
LVDS Odd
TMDS
Input PortDVI-D
EEPROMFor
EDID
SDL-HSDA-H
EEPROM
SDL SDA
DESCRIPTION OF BLOCK DIAGRAM
- 9 -
1. DC/DC ConverterThis circuit supplies stand-by 5V(+5Vst) and regular 5V(+5V) for using LM2674 and LM2596S from AC/DC adapter(+12V). The +5V voltage supply to 3.3V voltage regulator.
2. Micro-ControllerThis circuit consists of one EEPROM IC(24C02) which stores the control data for system and communicatesDDC(Display Data Channel) and oscillator(X2).The operating procedures of Micro-Controller and its associated circuit are as follows;
1) The system controller detects frequency of vertical sync from Sil161A(U1) 47pin through AHC86(U10). The controller controls the power switching IC (SI4925) by the detection of vertical sync(H/V Sync).
2) The Micro-Controller controls the brightness of inverter by using the key control button and store the data to EEPROM (24C02).
3. LVDS CircuitLVDS transmitter (U2, U3) delivers digital signal to the receiver of module by the voltage swing of 1V. The peripheral circuitry of transmitter gets the DHS, DVS, DEN, DISPCLK signal, output LVDS signal. At the power down mode, MICOM lets the power down signal be low and shutdown pin be active low.
4. T.M.D.S ReceiverThe Sil161A gets the T.M.D.S. video signal converted T.M.D.S. to 2 channel TTL level. The output 8-bit R, G, B, DHS, DVS and DE signal to the transmitter(U2, U3).
ADJUSTMENT
- 10 -
220
IBMCompatible PC
PARALLEL PORT
Power inlet (required)
Power LED
ST Switch
Power Select Switch(110V/220V)
Con
trol
Lin
e
Not u
sed
RS232
C
PARAL
LEL
V-SY
NC
POW
ER
ST
VGS
MONITOR
E
E
V-Sync On/Off Switch(Switch must be ON.)
F
F
A
BB
C
C
15105
5
69
1
1
1
14
13
25
6
5V
5V
5V
4.7K4.7K
4.7K
74LS06
74LS06
OFF ON
OFF
ON
11
DVI-D Connector
Figure 1. Cable Connection
All adjustment are thoroughly checked and correctedwhen the monitor leaves the factory, but sometimesseveral minor adjustment may be required.
• Alignment appliances and tools.- IBM compatible PC.- Alignment Adapter and Software.- DVI-D Connector.
- Install the cable for adjustment such as Figure 1and run the alignment program on the DOS for IBM compatible PC.
1. DDC Data Write Procedure1) Use this procedure only when there is some problem
on 24LC02(DDC support IC).2) Select EEPROM -> Write EDID command and
Enter. 3) This will write the EDID data to 24LC02.
TROUBLESHOOTING GUIDE
- 11 -
TROUBLE INU8, U5
CHECK 5VST VOLTAGE
(5V) ?
NO
1. NO POWER
NO POWER(POWER INDICATOR OFF)
TROUBLE SOMEWHERE ELSE
TROUBLE INADAPTOR
CHECK J7INPUT VOLTAGE
(12V) ?
NO
TROUBLE INU4, U6
CHECK +3.3V VOLTAGE ?
NO
YES
YES
YES
- 12 -
2. NO RASTER
TROUBLE INU1
CHECKU11 PIN 42(H. PULSE)
NO
NO VIDEO
TROUBLE INU12
CHECKU12 PIN 5
(12V-MOD) ?
NO
TROUBLE INU1
CHECKU11 PIN 1
V. PULSE ?
NO
TROUBLE INU6
CHECKU6 PIN 2(3.3V)?
NO
YES
YES
YES
YES
TROUBLE INLCD MODULE
PRINTED CIRCUIT BOARD
- 13 -
1. MAIN BOARD (Component Side) 2. CONTROL BOARD (Component Side)
R87
R8
R9
R14
R11
R23
R12
ZD3
C20
R3
C21 R
24 C22
C23
C25ZD10
D9
D10
ZD4
C19
R22
R6
C31
C29
L202
D7
D8
C24C28
D1
D3
D4
U1
C27
L201 D2
J2
C18
C14
C13
C11
C15
C17C16
C12
C10
BA12BA13BA10BA11BA8 BA9 BA1BA7 BA2 BA3 BA4 BA5 BA6
CA9 CA10 CA7 CA8 CA11 CA12 CA5 CA1CA6 CA2 CA3 CA4
R20
C46 C
45
R17
C38 C
40
C39
R19R21
C47
C44
U3
R18
R16
C48
C41
C49 C42
C43
U2
C78
C79
C80
C81
C82 J3
C77
C74
C75
C76
C73 R75
J6
R76
R77
R78
Q2
Q3
U10 C67 C26
D5
C94
J5
R47 R
50
R33
U9 R25
R46
U13
C52
R30
D6
R36R37
C65
C60C61
R39
R66R
34
U11
R67
C68 R26R31
C85C86C87C89
C63
C51
R55
R56
R38
R53R54
C69
X2
R7
C64
R57
R59
R60
R58C72
C70
R62
C84
C83
R35
C62R71
R48
C71
R13R64
R63R61 L5
C5
U7
R28
R41
R70
R89
R65
R88
C36 U12
R29
R27R40 R
42
R43 R51R52
R32C53 R74
C54
R1
Q1
R45
R44 R10R15
C30
C35
U5 C37
U6
C3C2
C1
J7
L2
C34
C8 ZD
6 C50 C32 C33
C9
C105
R5
U8
R2
R4
U4 L2
4
L27
C107
C106
C6
C7 L1
R79
C10
3 C101 C91C4
C90
C93
ZD5
C97
C98
C99 C100
C10
2
L6
C95
C96
C92
L13
J4
30
20 110
PN
:687
0T24
7A11
LGE
DIG
ITA
L M
ON
ITO
R
SIH
200
0.03
.08
40
80
90
50
60 70
SO
LDE
RIN
G D
IRE
CT
ION
SW
5
PN
:6870T247C
11 VE
R 1.1
LG M
NT
PW
R B
oard
LED
1
1
J8
SW
1
R3
SW
2
R4
J1
1
R1
R2
R5
SW
3
ZD
2
ZD
1
1 J7
SW
4
LG M
NT
PN
:6870T247C
11
Key B
oard
VE
R : 1.2
EXPLODED VIEW
- 14-
2
3
4
5
6
7
8
9
1012
a
b
c
c
c
c
c
d
e
5-1
5-2
5-3
11
1
a
d
EXPLODED VIEW PARTS LIST
- 15 -
Ref. No.
1
2
3
4
5
5-1
5-2
5-3
6
7
8
9
10
11
12
a
b
c
d
e
Part No.
3091TKL010A
6304TLT181N
4814TKK064A
4951TKS034B
3313TL8006A
4950TKK049B
6871TMT158A
4950TKK048J
6633TZA004A
4814TKK067A
4950TKS097A
6871TST156A
3809TKL006D
3550TKK053F
3043TKK037F
332-095E
4930TKK014A
332-110A
332-095C
332-105F
Description
CABINET ASS’Y
LCD MODULE, LGE TFT LCD LM181E3-A2 18.1”
INVERTER WIRE SHIELD
METAL ASS’Y, MAIN FRAME
MAIN TOTAL ASS’Y
PCB SHIELD (BOTTOM)
MAIN PCB ASS’Y
PCB SHIELD (TOP)
INVERTER ASS’Y
INVERTER SHIELD
METAL, REAR FRAME
KEY CONTROL PCB ASS’Y
BACK COVER ASS’Y
HINGE COVER
TILT SWIVEL ASS’Y
SCREW, PZP+3x16 (MSWR/FZMW)
HOLDER, FIXER
SCREW, PZS+3x6 (MSWR/FZMY)
SCREW, PZP+3x12 (MSWR/FZMY)
SCREW, PVS+4x10 (MSWR/FZMW)
Q'ty
1
1
2
1
1
1
1
1
1
1
1
1
1
1
1
4
2
13
5
2
Material
PC+ABS
SPTE
SPTE
SPTE
SPTE
SBHG1
PC+ABS
PC+ABS
PC+ABS
STEEL
STEEL
STEEL
STEEL
REPLACEMENT PARTS LIST
CAUTION: BEFORE REPLACING ANY OF THESE COMPONENTS, READ CAREFULLY THE SAFETY PRECAUTIONS IN THIS MANUAL.
* NOTE : S SAFETY MarkAL ALTERNATIVE PARTS
MODEL:FPD1800, LG881Y DATE: 2000. 4. 1. *S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION REMARK
C1 0CH7476F661 CAPACITOR, CHIP[TANTALUM], 47UF 16V M 7343 TP(-)C2 0CH3104K566 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 0.1UF 50V K X 2012 R/TPC3 0CH6102K406 CAPACITOR, CHIP[CERAMIC LD-LESS TC], 1000PF 50V J SL 2012 R/TPC4 0CH3104K566 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 0.1UF 50V K X 2012 R/TPC5 0CH6102K406 CAPACITOR, CHIP[CERAMIC LD-LESS TC], 1000PF 50V J SL 2012 R/TPC6 0CH8107J611 CAPACITOR, CHIP[AL. ELECTROLYTIC], 100UF 35V M 85STD(CYL) R/TPC7 0CH8107J611 CAPACITOR, CHIP[AL. ELECTROLYTIC], 100UF 35V M 85STD(CYL) R/TPC8 0CH3103K516 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 10000PF 50V K B 2012 R/TPC9 0CH7227D661 CAPACITOR, CHIP[TANTALUM], 220UF 10V M 7343 TP(-)C10 0CH7106F621 CAPACITOR, CHIP[TANTALUM], 10UF 16V M 3528MM TP(-)C11 0CH3104K566 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 0.1UF 50V K X 2012 R/TPC12 0CH3104K566 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 0.1UF 50V K X 2012 R/TPC13 0CH3104K566 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 0.1UF 50V K X 2012 R/TPC14 0CH3104K566 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 0.1UF 50V K X 2012 R/TPC15 0CH3104K566 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 0.1UF 50V K X 2012 R/TPC16 0CH3104K566 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 0.1UF 50V K X 2012 R/TPC17 0CH6102K406 CAPACITOR, CHIP[CERAMIC LD-LESS TC], 1000PF 50V J SL 2012 R/TPC18 0CH3104K566 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 0.1UF 50V K X 2012 R/TPC19 0CH3104K566 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 0.1UF 50V K X 2012 R/TPC20 0CH3104K566 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 0.1UF 50V K X 2012 R/TPC21 0CH3104K566 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 0.1UF 50V K X 2012 R/TPC22 0CH3104K566 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 0.1UF 50V K X 2012 R/TPC24 0CH3104K566 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 0.1UF 50V K X 2012 R/TPC26 0CH3104K566 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 0.1UF 50V K X 2012 R/TPC27 0CH3104K566 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 0.1UF 50V K X 2012 R/TPC28 0CH3104K566 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 0.1UF 50V K X 2012 R/TPC29 0CH3104K566 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 0.1UF 50V K X 2012 R/TPC30 0CH7476F661 CAPACITOR, CHIP[TANTALUM], 47UF 16V M 7343 TP(-)C31 0CH6102K406 CAPACITOR, CHIP[CERAMIC LD-LESS TC], 1000PF 50V J SL 2012 R/TPC32 0CH3103K516 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 10000PF 50V K B 2012 R/TPC33 0CH3103K516 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 10000PF 50V K B 2012 R/TPC34 0CH7227D661 CAPACITOR, CHIP[TANTALUM], 220UF 10V M 7343 TP(-)C35 0CH3103K516 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 10000PF 50V K B 2012 R/TPC36 0CE4776F618 CAPACITOR, AL.ELECTROLYTIC, 470U SMS 16V M FM5 TP5C37 0CH3103K516 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 10000PF 50V K B 2012 R/TPC38 0CH3104K566 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 0.1UF 50V K X 2012 R/TPC39 0CH3104K566 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 0.1UF 50V K X 2012 R/TPC40 0CH3104K566 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 0.1UF 50V K X 2012 R/TPC41 0CH6560K416 CAPACITOR, CHIP[CERAMIC LD-LESS TC], 56PF 50V J NP0 2012 R/TPC42 0CH3104K566 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 0.1UF 50V K X 2012 R/TPC43 0CH3104K566 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 0.1UF 50V K X 2012 R/TPC44 0CH3104K566 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 0.1UF 50V K X 2012 R/TPC45 0CH3104K566 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 0.1UF 50V K X 2012 R/TPC46 0CH3104K566 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 0.1UF 50V K X 2012 R/TPC47 0CH6560K416 CAPACITOR, CHIP[CERAMIC LD-LESS TC], 56PF 50V J NP0 2012 R/TPC48 0CH3104K566 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 0.1UF 50V K X 2012 R/TPC49 0CH3104K566 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 0.1UF 50V K X 2012 R/TPC50 0CH7227D661 CAPACITOR, CHIP[TANTALUM], 220UF 10V M 7343 TP(-)C51 0CH3104K566 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 0.1UF 50V K X 2012 R/TPC52 0CH3104K566 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 0.1UF 50V K X 2012 R/TPC53 0CH3104K566 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 0.1UF 50V K X 2012 R/TPC54 0CH3104K566 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 0.1UF 50V K X 2012 R/TPC60 0CH3104K566 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 0.1UF 50V K X 2012 R/TPC61 0CH3104K566 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 0.1UF 50V K X 2012 R/TPC62 0CH3104K566 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 0.1UF 50V K X 2012 R/TPC63 0CH6120K416 CAPACITOR, CHIP[CERAMIC LD-LESS TC], 12PF 50V J NP0 2012 R/TP
- 16 -
MAIN BOARDCAPACITORs
MODEL:FPD1800, LG881Y DATE: 2000. 4. 1. *S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION REMARK
C64 0CH6120K416 CAPACITOR, CHIP[CERAMIC LD-LESS TC], 12PF 50V J NP0 2012 R/TPC65 0CH6271K416 CAPACITOR, CHIP[CERAMIC LD-LESS TC], 270PF 50V J NP0 2012 R/TPC67 0CH6101K416 CAPACITOR, CHIP[CERAMIC LD-LESS TC], 100PF 50V J NP0 2012 R/TPC68 0CH6101K416 CAPACITOR, CHIP[CERAMIC LD-LESS TC], 100PF 50V J NP0 2012 R/TPC69 0CH3103K516 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 10000PF 50V K B 2012 R/TPC70 0CH3103K516 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 10000PF 50V K B 2012 R/TPC71 0CH6101K416 CAPACITOR, CHIP[CERAMIC LD-LESS TC], 100PF 50V J NP0 2012 R/TPC72 0CH6101K416 CAPACITOR, CHIP[CERAMIC LD-LESS TC], 100PF 50V J NP0 2012 R/TPC83 0CH3104K566 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 0.1UF 50V K X 2012 R/TPC84 0CE4776F618 CAPACITOR, AL.ELECTROLYTIC, 470U SMS 16V M FM5 TP5C85 0CH3104K566 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 0.1UF 50V K X 2012 R/TPC86 0CH3104K566 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 0.1UF 50V K X 2012 R/TPC87 0CH3104K566 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 0.1UF 50V K X 2012 R/TPC89 0CH3104K566 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 0.1UF 50V K X 2012 R/TPC90 0CH7106F621 CAPACITOR, CHIP[TANTALUM], 10UF 16V M 3528MM TP(-)C91 0CH3103K516 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 10000PF 50V K B 2012 R/TPC92 0CH3103K516 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 10000PF 50V K B 2012 R/TPC93 0CH8107J611 CAPACITOR, CHIP[AL. ELECTROLYTIC], 100UF 35V M 85STD(CYL) R/TPC94 0CH3104K566 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 0.1UF 50V K X 2012 R/TPC95 0CH3103K516 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 10000PF 50V K B 2012 R/TPC96 0CH3104K566 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 0.1UF 50V K X 2012 R/TPC97 0CH6221K416 CAPACITOR, CHIP[CERAMIC LD-LESS TC], 220PF 50V J NP0 2012 R/TPC98 0CH6221K416 CAPACITOR, CHIP[CERAMIC LD-LESS TC], 220PF 50V J NP0 2012 R/TPC99 0CH6221K416 CAPACITOR, CHIP[CERAMIC LD-LESS TC], 220PF 50V J NP0 2012 R/TPC100 0CH6221K416 CAPACITOR, CHIP[CERAMIC LD-LESS TC], 220PF 50V J NP0 2012 R/TPC101 0CH6221K416 CAPACITOR, CHIP[CERAMIC LD-LESS TC], 220PF 50V J NP0 2012 R/TPC102 0CH6221K416 CAPACITOR, CHIP[CERAMIC LD-LESS TC], 220PF 50V J NP0 2012 R/TPC103 0CH7106F621 CAPACITOR, CHIP[TANTALUM], 10UF 16V M 3528MM TP(-)C106 0CH3104K566 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 0.1UF 50V K X 2012 R/TPC107 0CH3104K566 CAPACITOR, CHIP[CERAMIC LD-LESS HD], 0.1UF 50V K X 2012 R/TP
D1 0DS226009AA DIODE, SWITCHING, KDS226 TP KEC SOT-23 80V 300MA 2A 4NS 0.5UAD2 0DS226009AA DIODE, SWITCHING, KDS226 TP KEC SOT-23 80V 300MA 2A 4NS 0.5UAD3 0DS226009AA DIODE, SWITCHING, KDS226 TP KEC SOT-23 80V 300MA 2A 4NS 0.5UAD4 0DS226009AA DIODE, SWITCHING, KDS226 TP KEC SOT-23 80V 300MA 2A 4NS 0.5UAD5 0DS301109AA DIODE, SWITCHING, MMBD301LT1 TP MOTOROLA SOT23 30V 13NA 200NA D6 0DS301109AA DIODE, SWITCHING, MMBD301LT1 TP MOTOROLA SOT23 30V 13NA 200NA D7 0DS226009AA DIODE, SWITCHING, KDS226 TP KEC SOT-23 80V 300MA 2A 4NS 0.5UAD8 0DS226009AA DIODE, SWITCHING, KDS226 TP KEC SOT-23 80V 300MA 2A 4NS 0.5UAD9 0DS226009AA DIODE, SWITCHING, KDS226 TP KEC SOT-23 80V 300MA 2A 4NS 0.5UAD10 0DS226009AA DIODE, SWITCHING, KDS226 TP KEC SOT-23 80V 300MA 2A 4NS 0.5UAZD3 0DZ560009DA DIODE, ZENER, UDZ S 5.6B TP ROHM-K SOD323 200MW 5.6V 5MA .PFZD4 0DZ560009DA DIODE, ZENER, UDZ S 5.6B TP ROHM-K SOD323 200MW 5.6V 5MA .PFZD5 0DR340009AA DIODE, RECTIFIER, MBRS340 TP FAIRCHILD NON 40V 3A 80A .SEC 2MAZD6 0DR190309AA DIODE, RECTIFIER, MBRS190T3 TP MOTOROLA 403A-03 90V 1A 50A 10NS ZD10 0DZ560009DA DIODE, ZENER, UDZ S 5.6B TP ROHM-K SOD323 200MW 5.6V 5MA .PF
U1 0IS5161000A IC, SILICON IMAGE, SII161A 100PTQFP BK TMDS RECEIVER 165MHZU2 0ITI758300A IC, TEXAS INSTRUMENT, SN75LVDS83 56P,DDG TP 80MHZ F/LINK U3 0ITI758300A IC, TEXAS INSTRUMENT, SN75LVDS83 56P,DDG TP 80MHZ F/LINK U4 0INS259650A IC, NATIONAL SEMICONDUCTOR, LM2596-5V 5LEAD,TO263(S) TP 3A 5V U5 0ISS780500H IC, SAMSUNG ELECTRONICS, KA78M05-R 3P,D-PAK TP 5V 0.5A REGULU6 0IRH033200A IC, ROHM, BA033FP-E2 MOLD-3 TP REGULATORU7 0IKE704200J IC, KEC, KIA7042AF SOT-89 TP 4.2V VOLTAGE DETECTORU8 0INS267450A IC, NATIONAL SEMICONDUCTOR, LM2674M-5.0 8SOP TP 0.5A 5V S/DOWN U9 0ISS240210A IC, SAMSUNG ELECTRONICS, KS24C021CS SOP8 TP EEPROM 2K LOW VOLU10 0ITI748600L IC, TEXAS INSTRUMENT, SN74AHC86D 14P,SOIC TP QUAD 2INPUT XOR U11 0IZZTSZ069A IC[HYBRID ], 42PIN DIP BK LG881Y OPT ASSYU12 0TF492509AA FET, SI4925DY TP TEMIC 30V 6.1A SO-8U13 0ISS240210A IC, SAMSUNG ELECTRONICS, KS24C021CS SOP8 TP EEPROM 2K LOW VOL
- 17 -
DIODEs
ICs
MODEL:FPD1800, LG881Y DATE: 2000. 4. 1. *S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION REMARK
L1 6140TBZ007A COIL,CHOKE, DR10*7(K-30) 100UH 0.4MM 34.5T SMD CHOKE(LCD)L2 6140TBZ016B COIL,CHOKE, DR10*7(YL-9N) 220UH 0.32MM 75T LI571DL5 6210TCE001G CORE (CIRC), BEAD, HH-1M3216-501 CERATEC 3216MM R/TPL6 6210TCE001G CORE (CIRC), BEAD, HH-1M3216-501 CERATEC 3216MM R/TPL13 6210TCE001G CORE (CIRC), BEAD, HH-1M3216-501 CERATEC 3216MM R/TPL24 6210TCE001G CORE (CIRC), BEAD, HH-1M3216-501 CERATEC 3216MM R/TPL27 6210TCE001G CORE (CIRC), BEAD, HH-1M3216-501 CERATEC 3216MM R/TPL201 6200TEZ007A FILTER(CIRC), CAPACITOR, STC-B SERIES(104B) NIIGATA(FILMAC) L202 6200TEZ007A FILTER(CIRC), CAPACITOR, STC-B SERIES(104B) NIIGATA(FILMAC)
Q1 0TR162309CA TRANSISTOR, KSC1623 TP SAMSUNG SOT23 NPN EPI. SILICON TRQ2 0TR162309CA TRANSISTOR, KSC1623 TP SAMSUNG SOT23 NPN EPI. SILICON TRQ3 0TR162309CA TRANSISTOR, KSC1623 TP SAMSUNG SOT23 NPN EPI. SILICON TR
R1 0RH6802D622 RESISTOR, CHIP, 68K 1/10W 5 D.R/TPR2 0RH2702D622 RESISTOR, CHIP, 27K 1/10W 5 D.R/TPR3 0RH1002D622 RESISTOR, CHIP, 10K 1/10W 5 D.R/TPR4 0RH4701D622 RESISTOR, CHIP, 4.7K 1/10W 5 D.R/TPR5 0RH4701D622 RESISTOR, CHIP, 4.7K 1/10W 5 D.R/TPR6 0RH5100D622 RESISTOR, CHIP, 510 1/10W 5 D.R/TPR7 0RH1004D622 RESISTOR, CHIP, 1.0M 1/10W 5 D.R/TPR8 0RH1002D622 RESISTOR, CHIP, 10K 1/10W 5 D.R/TPR9 0RH1002D622 RESISTOR, CHIP, 10K 1/10W 5 D.R/TPR10 0RH1000D622 RESISTOR, CHIP, 100 1/10W 5 D.R/TPR11 0RH1002D622 RESISTOR, CHIP, 10K 1/10W 5 D.R/TPR12 0RH1002D622 RESISTOR, CHIP, 10K 1/10W 5 D.R/TPR13 0RH1000D622 RESISTOR, CHIP, 100 1/10W 5 D.R/TPR14 0RH1002D622 RESISTOR, CHIP, 10K 1/10W 5 D.R/TPR15 0RH1002D622 RESISTOR, CHIP, 10K 1/10W 5 D.R/TPR16 0RH1002D622 RESISTOR, CHIP, 10K 1/10W 5 D.R/TPR17 0RH0222D622 RESISTOR, CHIP, 22 1/10W 5 D.R/TPR18 0RH1000D622 RESISTOR, CHIP, 100 1/10W 5 D.R/TPR19 0RH1002D622 RESISTOR, CHIP, 10K 1/10W 5 D.R/TPR20 0RH0222D622 RESISTOR, CHIP, 22 1/10W 5 D.R/TPR21 0RH1000D622 RESISTOR, CHIP, 100 1/10W 5 D.R/TPR22 0RH1002D622 RESISTOR, CHIP, 10K 1/10W 5 D.R/TPR24 0RH1002D622 RESISTOR, CHIP, 10K 1/10W 5 D.R/TPR25 0RH4701D622 RESISTOR, CHIP, 4.7K 1/10W 5 D.R/TPR27 0RH4702D622 RESISTOR, CHIP, 47K 1/10W 5 D.R/TPR28 0RH3302D622 RESISTOR, CHIP, 33K 1/10W 5 D.R/TPR29 0RH1000D622 RESISTOR, CHIP, 100 1/10W 5 D.R/TPR30 0RH0000D622 RESISTOR, CHIP, 0 1/10W P-TYPE TAPPINGR31 0RH0000D622 RESISTOR, CHIP, 0 1/10W P-TYPE TAPPINGR32 0RH0000D622 RESISTOR, CHIP, 0 1/10W P-TYPE TAPPINGR33 0RH1000D622 RESISTOR, CHIP, 100 1/10W 5 D.R/TPR34 0RH1000D622 RESISTOR, CHIP, 100 1/10W 5 D.R/TPR35 0RH1000D622 RESISTOR, CHIP, 100 1/10W 5 D.R/TPR44 0RH4701D622 RESISTOR, CHIP, 4.7K 1/10W 5 D.R/TPR46 0RH4701D622 RESISTOR, CHIP, 4.7K 1/10W 5 D.R/TPR50 0RH1000D622 RESISTOR, CHIP, 100 1/10W 5 D.R/TPR53 0RH1000D622 RESISTOR, CHIP, 100 1/10W 5 D.R/TPR54 0RH1000D622 RESISTOR, CHIP, 100 1/10W 5 D.R/TPR56 0RH1000D622 RESISTOR, CHIP, 100 1/10W 5 D.R/TPR57 0RH1000D622 RESISTOR, CHIP, 100 1/10W 5 D.R/TPR58 0RH1000D622 RESISTOR, CHIP, 100 1/10W 5 D.R/TPR59 0RH1000D622 RESISTOR, CHIP, 100 1/10W 5 D.R/TPR60 0RH1000D622 RESISTOR, CHIP, 100 1/10W 5 D.R/TPR61 0RH1002D622 RESISTOR, CHIP, 10K 1/10W 5 D.R/TPR62 0RH1002D622 RESISTOR, CHIP, 10K 1/10W 5 D.R/TPR63 0RH1201D622 RESISTOR, CHIP, 1.2K 1/10W 5 D.R/TP
- 18 -
COILs & COREs
TRANSISTORs
RESISTORs
MODEL:FPD1800, LG881Y DATE: 2000. 4. 1. *S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION REMARK
R64 0RH1002D622 RESISTOR, CHIP, 10K 1/10W 5 D.R/TPR65 0RH0000D622 RESISTOR, CHIP, 0 1/10W P-TYPE TAPPINGR66 0RH1000D622 RESISTOR, CHIP, 100 1/10W 5 D.R/TPR67 0RH1000D622 RESISTOR, CHIP, 100 1/10W 5 D.R/TPR70 0RH1000D622 RESISTOR, CHIP, 100 1/10W 5 D.R/TPR71 0RH1000D622 RESISTOR, CHIP, 100 1/10W 5 D.R/TPR74 0RH1002D622 RESISTOR, CHIP, 10K 1/10W 5 D.R/TPR75 0RH4700D622 RESISTOR, CHIP, 470 1/10W 5 D.R/TPR76 0RH1002D622 RESISTOR, CHIP, 10K 1/10W 5 D.R/TPR77 0RH4700D622 RESISTOR, CHIP, 470 1/10W 5 D.R/TPR78 0RH1002D622 RESISTOR, CHIP, 10K 1/10W 5 D.R/TPR79 0RH6800D622 RESISTOR, CHIP, 680 OHM 1 / 10 W 5% D R/TPR87 0RH1002D622 RESISTOR, CHIP, 10K 1/10W 5 D.R/TPR88 0RH4701D622 RESISTOR, CHIP, 4.7K 1/10W 5 D.R/TPR89 0RH4701D622 RESISTOR, CHIP, 4.7K 1/10W 5 D.R/TP
J7 6612TAH002A JACK,AC/DC POWER, DC-001 UNITOP DC-001 2.0MM (UNITOP) X2 6202TST001E CRYSTAL, SX-1 SUNNY CHIP 24MHZ 30PPM 20PF BK
LED1 0DL571300AA LED, °∞SPR571MVW3 TP ROHM GREEN/RED ±10,10MCDR1 0RD1001Q609 RESISTOR, FIXED CARBON FILM, 1K 1/4W(3 5% TA52R2 0RD1001Q609 RESISTOR, FIXED CARBON FILM, 1K 1/4W(3 5% TA52R3 0RD1800Q609 RESISTOR, FIXED CARBON FILM, 180 1/4W(3 5% TA52SW1 140-058E SWITCH, TACT, SKHV10910B LGEC NON 12V 20A HORIZENTAL 160GSW2 140-058E SWITCH, TACT, SKHV10910B LGEC NON 12V 20A HORIZENTAL 160GSW5 140-058E SWITCH, TACT, SKHV10910B LGEC NON 12V 20A HORIZENTAL 160GZD1 0DZ560009CE DIODE, ZENER, MTZJ5.6B TP ROHM-K DO34 500MW 5.6V 5MA 26MMZD2 0DZ560009CE DIODE, ZENER, MTZJ5.6B TP ROHM-K DO34 500MW 5.6V 5MA 26MM
LCD 6304TLT181N LCD(LIQUID CRYSTAL DISPLAY), LGE TFT LCD LM181E3-A2 18.1” 1280X1024 INVERTER 6633TZA004A INVERTER ASSY, SAMSUNG LG1801 FOR 18.1” LCD MNT(LB880B)ADAPTER 6634TBZ006H ADAPTER,AC-DC, PSCV700101A SAMSUNG 100-240V 12V 5.8A FOR G/WAYP/CORD 174-206F POWER CORD, SP305+IS14,SVT 18*3C I-SHENG UL/CSA 1830MM CT-098 S/CABLE 6866TDV004A SIGNAL CABLE, UL20276 DT 2000MM GLAY LG881Y(DVID-DVID) DM
- 19 -
OTHERs
CONTROL BOARD
MISCELLANEOUS
PIN CONFIGURATION
- 20 -
SiI 161A PanelLink® Receiver Preliminary Datasheet
DFO1
SiI 161A100-Pin TQFP
(Top View)
PD2
ST3
PIXS4
GND5
VCC6
STAG_OUT7
SCDT8
PDO9
QE010
QE111
QE212
QE313
QE414
QE515
QE616
QE717
OVCC18
OGND19
QE820
QE921
QE1022
QE1123
QE1224
QE1325
QE
14
26
QE
15
27
OG
ND
28
OV
CC
29
QE
16
30
QE
17
31
QE
18
32
QE
19
33
QE
20
34
QE
21
35
QE
22
36
QE
23
37
VC
C38
GN
D39
CT
L1
40
CT
L2
41
CT
L3
42
OV
CC
43
OD
CK
44
OG
ND
45
DE
46
VS
YN
C47
HS
YN
C48
QO
049
QO
150
75
QO21 74
QO20 73
QO19 72
QO18 71
QO17 70
QO16 69
GND 68
VCC 67
QO15 66
QO14 65
QO13 64
QO12 63
QO11 62
QO10 61
QO9 60
QO8 59
OGND 58
OVCC 57
QO7 56
QO6 55
QO5 54
QO4 53
QO3 52
QO2 51
QO22
OC
K_
INV
100
RE
SE
RV
ED
99
PG
ND
98
PV
CC
97
EX
T_R
ES
96
AV
CC
95
RX
C-
94
RX
C+
93
AG
ND
92
RX
0-
91
RX
0+
90
AG
ND
89
AV
CC
88
AG
ND
87
RX
1-
86
RX
1+
85
AV
CC
84
AG
ND
83
AV
CC
82
RX
2-
81
RX
2+
80
AG
ND
79
OV
CC
78
QO
23
77
OG
ND
76
DIFFERNTIAL SIGNAL
OD
D 8
-bit
s R
ED
EVEN 8-bits RED
OD
D 8
-bit
s G
RE
EN
EV
EN
8-b
its
GR
EE
N
OD
D 8
-bit
s B
LU
E
EV
EN
8-b
its
BL
UE
CO
NF
IG. P
INS
PLL
PW
RM
AN
AG
EM
EN
T
GPOOU
TP
UT
CL
OC
K
CONTROLS
Pin Configurations
- 21 -
Configuration Pins Description
Pin Name Pin # Type DescriptionOCK_INV 100 In ODCK Polarity. A LOW level selects normal ODCK output. A HIGH level selects
inverted ODCK output. All other output signals are not affected by this pin. They willmaintain the same timing no matter the setting of OCK_INV pin.
PIXS 4 In Pixel Select. A LOW level indicates one pixel (up to 24-bits) per clock mode usingQE[23:0]. A HIGH level indicates two pixels (up to 48-bits) per clock mode usingQE[23:0] for first pixel and QO[23:0] for second pixel.
DFO 1 In Output Data Format. For all DVI applications, this pin should be tied LOW.STAG_OUT 7 In Staggered Output. A HIGH level selects normal simultaneous outputs on all odd and
even data lines. A LOW level selects staggered output drive. This function is onlyavailable in 2-pixels per clock mode.
ST 3 In Output Drive. A HIGH level selects HIGH output drive strength. A LOW level selectsLOW output drive strength.
Output Pins Description
Pin Name
Pin # Type Description
QE23-QE0
SeeSil161A
PinDiagram
Out
QO23-QO0
SeeSil161A
PinDiagram
Out
Output Even Data[23:0] corresponds to 24-bit pixel data for 1-pixel/clock input modeand to the first 24-bit pixel data for 2-pixels/clock mode.
Refer to the TFT Signal Mapping application note (SiI/AN-0007) which tabulates therelationship between the input data to the transmitter and output data from thereceiver.
A low level on PD or PDO will put the output drivers into a high impedance(tri-state)mode. A weak internal pull-down device brings each output to ground.
Output Odd Data[23:0] corresponds to the second 24-bit pixel data for 2-pixels/clockmode.
ODCK 44 Out Output Data Clock. This output can be inverted using the OCK_INV pin. A low levelon PD or PDO will put the output driver into a high impedance (tri-state) mode. Aweak internal pull-down device brings the output to ground.
DE 46 Out Output Data Enable. This signal qualifies the active data area. A HIGH level signifiesactive display time and a LOW level signifies blanking time. This output signal issynchronized with the output data. A low level on PD or PDO will put the output driverinto a high impedance (tri-state) mode. A weak internal pull-down device brings theoutput to ground.
HSYNCVSYNCCTL1CTL2CTL3
4847404142
OutOutOutOutOut
Horizontal Sync input control signal.Vertical Sync input control signal.General output control signal 1. This output is not powered down by PDO.General output control signal 2.General output control signal 3.
Output data is synchronized with output data clock (ODCK).
A low level on PD or PDO will put the output drivers (except CTL1 by PDO) into ahigh impedance (tri-state) mode. A weak internal pull-down device brings eachoutput to ground.
Refer to the TFT Signal Mapping application note (SiI/AN-0007) which tabulates therelationship between the input data to the transmitter and output data from thereceiver.A low level on PD or PDO will put the output drivers into a high impedance(tri-state)mode. A weak internal pull-down device brings each output to ground.
During 1-pixel/clock mode, these outputs are driven low.
Output data is synchronized with output data clock (ODCK).
- 22 -
Differential Signal Data Pins Description
Pin Name Pin # Type DescriptionRX0+RX0-RX1+RX1-RX2+RX2-
909185868081
AnalogAnalogAnalogAnalogAnalogAnalog
TMDS Low Voltage Differential Signal input data pairs.
RXC+RXC-
9394
AnalogAnalog
TMDS Low Voltage Differential Signal input data pairs.
EXT_RES 96 Analog Impedance Matching Control. Resistor value should be ten times the characteristicimpedance of the cable. In the common case of 50Ω transmission line, an external500Ω resistor must be connected between AVCC and this pin.
Reserved Pin Description
Pin Name Pin # Type DescriptionRESERVED 99 In Must be tied HIGH for normal operation.
Power and Ground Pins Description
Pin Name Pin # Type DescriptionVCC 6,38,67 Power Digital Core VCC, must be set to 3.3V.GND 5,39,68 Ground Digital Core GND.
OVCC 18,29,43,57,78 Power Output VCC, must be set to 3.3V.OGND 19,28,45,58,76 Ground Output GND.AVCC 82,84,88,95 Power Analog VCC must be set to 3.3V.AGND 79,83,87,89,92 Ground Analog GND.PVCC 97 Power PLL Analog VCC must be set to 3.3V.PGND 98 Ground PLL Analog GND.
Power Management Pins Description
PinName
Pin # Type Description
SCDT 8 Out Sync Detect. A HIGH level is outputted when DE is actively toggling indicating that thelink is alive. A LOW level is outputted when DE is inactive, indicating the link is down.Can be connected to PDO to power down the outputs when DE is not detected. TheSCDT output itself, however, remains in the active mode at all times.
PDO 9 In Output Driver Power Down (active LOW). A HIGH level indicates normal operation. ALOW level puts all the output drivers only (except SCDT and CTL1) into a highimpedance (tri-state) mode. A weak internal pull-down device brings each output toground. PDO is a sub-set of the PD description. The chip is not in power-down modewith this pin. There is an internal pull-up resistor that defaults the chip to normaloperation if left unconnected. SCDT and CTL1 are not tri-stated by this pin.
PD 2 In Power Down (active LOW). A HIGH level indicates normal operation and a LOW levelindicates power down mode. During power down mode, all output buffers are disabledand brought low, all analog logic is powered down, and all inputs are disabled.
- 23 -
LM2674 Simple Switcher® Power Converter High Efficiency 500mA Step-Down Voltage Regulator
FEEDBACK
3.3V, R2 =4.32k5V, R2 = 7.83k
12V, R2 = 22.3kADJ,R2 = 0ΩR1 is OPEN
4
7
VIN
GainCompensation
BiasGenerator
1.21VReferance
Bias 1.21V
3.2V
0.6V
VRAMP
R2
R1= 2.5k
260kHzOscillator
Freq. Shift
Reset
GM 2GM 1
10k15k
2k
20mH*
–––
+
+
++
1.21V
10nF
PWMComparator
GND
ControlLogic
Driver
Enable
Enable
500mASwitch
6
VSWITCH
CBOOTSTRAP
8
1
ThermalShutdown
RSENSECurrent
Limit
5 ON/OFF
5V
7V
5V InternalRegulator
StartUP
Pin Configuration
Block Diagram
Top View
- 24 -
LM2596 Simple Switcher® Power Converter 150kHz 3A Step-Down Voltage Regulator
BLOCK DIAGRAM
Side View Top View
- 25 -
SN75LVDS83 FLATLINK™ TRANSMITTER
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28
Vcc D5
D6
D7
GN
D D8
D9
D10 Vcc
D11
D12
D13
GN
D
D14
D15
D16
CLK
SE
L
D17
D18
D19
GN
D
D20
D21
D22
D23 Vcc
D24
D25
D4
D3
D2
GN
D
D1
D0
D27
LVD
SG
ND
Y0M
Y0P
Y1M
Y1P
LVD
SV
cc
LVD
SG
ND
Y2M
Y2P
CLK
OU
TM
CLK
OU
TP
Y3M
Y3P
GN
D
PLL
GN
D
PLL
Vcc
PLL
GN
D
CLK
IN
D26
GN
D
47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 2956 55 54 53 52 51 50 49 48
SH
TD
N
D0, D1, D2, D3, D4, D6, D7
7Parallel-Lode 7-Bit
Shift RegisterA, B, ...G
CLK
SHIFT/LOAD
Y0P
Y0M
D8, D9, D12, D13, D14, D15, D18
7Parallel-Lode 7-Bit
Shift RegisterA, B, ...G
CLK
SHIFT/LOAD
Y1P
Y1M
D19, D20, D21, D22, D24, D25, D26
7Parallel-Lode 7-Bit
Shift RegisterA, B, ...G
CLK
SHIFT/LOAD
Y2P
Y2M
D5, D10, D11, D16, D17, D23, D27
SHTDN
CLKIN
CLKSEL
7Parallel-Lode 7-Bit
Shift Register
Control Logic
A, B, ...G
CLK
SHIFT/LOAD
Y3P
Y3M
7 X CLOCK/PLL
CLK
7XCLK
RISING/FALLING EDGE
CLKING
CLKOUTP
CLKOUTM
Inp
ut
Bu
s
BLOCK DIAGRAM
Pin Configuration
- 26 -
SI4925DY Dual P-Channel 30-V (D-S) Rated MOSFET
S 1
G 1
S 2
G 2
D 1 D 1 D 2 D 2
S O - 8
1
2
3
4
8
7
6
5
S 1
G 1
S 2
G 2
D 1
D 1
D 2
D 2
Pin Configuration
P-Channel MOSFET
24LC02 2K 2.5V I2C™ Serial EEPROM
I/OControl Logic
MemoryControl Logic XDEC
HV Generator
EEPROM
Array
Write Protect Circuitry
YDECVcc
Vss
SENSE AMPR/W CONTROL
SDA SCL
A0 A1 A2 WP
24LC
024
1234
8765
VccWPSCLSDA
A0A1A2
Vss
PIN CONFIGURATION BLOCK DIAGRAM
1
8
- 27 -
PARTSTYPE PARTSTYPE
KDS181
12
3BA033FP
KA78M05R
1. INPUT2. GND3. OUTPUT
1. CATHODE 12. CATHODE 23. ANODE
1
3
2
1. Vcc2. GND3. OUT
1
3
21
3
2
KDS226
12
3
1. CATHODE 12. ANODE 23. ANODE 1 / CATHODE 2
1
3
2
KSC1623
1. BASE2. EMITTER3. COLLECTOR
2
3
1
0CH7106F621 10uF/16V
0CH7227F661 220uF/6.3V
0CH7476F661 47uF/10V
_
+
Regulator Schottky Diode
Diode
Diode
Transistor
Tantalum Capacitor
MBRS190T3
1
2
1
2
SC
HE
MA
TIC
DIA
GR
AM
- 28-
1. DIG
ITAL
INP
UT
- 29-
2. TM
DS
RE
CE
IVE
R
- 30-
3.LVD
S
- 31-
4. PO
WE
R G
EN
.
- 32-
5. MIC
OM
- 33-
7. CO
NN
EC
TOR
& JA
CK
PACKING AND ACCESSORIES
- 34 -
Right Packing
PE Bag
Left Packing
Owner’s Manual
Adaptor
Signal Cable
Power Cord Kit Box
