Confidential - OCP-IP 2009 OCP-IP Governing Steering Committee Meeting Teleconference April 23,...

Confidential - OCP-IP 2009

OCP-IPGoverning Steering Committee Meeting

TeleconferenceApril 23, 2009


5:00- 5:10 AM: Call to Order, Introductions, Agenda Review, Last Minutes (Ian)5:10- 5:15 AM: Next GSC Meeting (Ian) 5:15- 5:35 AM: Metadata WG Update (Prashant) 5:35- 6:05 AM: System Level Design WG Update (Mark/James)6:05- 6:25 AM: NoC BWG Update (Erno) 6:25- 6:45 AM: Motion to Adjourn/ Break/ Reconvene 6:45- 7:15 AM: Specification WG Status (Drew)

- Brief OCP v3.0 Update (Drew) - OCP v4.0 (Drew) - TI C2C Proposal (James)

7:15- 7:25 AM: FVWG Discussion (Ian) 7:25- 7:45 AM: Debug WG Update (Bob) 7:45- 7:50 AM: Technical Vision WG Status / Restated (Ian) 7:50- 8:05 AM: Progress in Asia (Ian)

Confidential – OCP-IP 2009

• Call to Order• Welcome from the President• Review Agenda

• Any additional items?

Call to Order and Agenda Review (Ian)

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8:05- 8:10 AM: 2009 Goals 8:10- 8:50 AM: AI Review (Ian)

- CoreCreator Shipments - Princeton Sponsor Level Upgrade

8:50- 9:00 AM: PR Update (Joe) 9:00- 9:20 AM: Motion to Adjourn/ Break/ Reconvene 9:20- 9:30 AM: Recruiting Update (Joe) 9:30- 9:40 AM: Budget/Cash Flow Update (Ian) 9:40- 9:55 AM: Administrative Update (VTM) 9:55- 10:00 AM: Enabling Resolution 10:00 AM: Motion to Adjourn


Vote to Approve Last GSC Meeting Minutes

• 29th GSC Meeting • January 15, 2009 in Milpitas, California

6






• 31st GSC Meeting• West Coast? Portland, Oregon?• Should this be telecon only?

• We do need occasional face-to-face meetings• Date around week of July 13th?

Next GSC Meeting (Ian)

8






OCP-IP Meta-Data Working GroupPlans and status

OCP GSC meeting

Apr 09

Confidential – OCP-IP 2009 11

2009 Goals given to MDWG by TVWG/GSC

• Spirit interoperability• Implement OCP within existing Spirit format

• Spirit enhancements

• Propose and drive modifications into IP-XACT standard

• Core compatibility reports• Ability to automatically compare OCP interface configurations

• Release IP-XACT checkers to OCP-IP community• Enhance for OCP 3.0


People involved

• Nokia: Vesa Lahtinen• TI: Prashant Karandikar, Anne-Francoise Joanblanq, Olivier Sagner,

Bob Maaraoui, James Aldis• Sonics: Kamil Synek, Pascal Chauvet, Drew Wingard• Synopsys: Mark Noll• STMicroelectronics: Serge Hustin, Christophe Amerijckx• Magillem Design Services: Cyril Spasevski, Stephane Guntz• Toshiba ( Yasuhiko )• OCP-IP: Ian Mackintosh

• Mentor Graphics later?• John Wilson already on the reflector, waiting for a Mentor

participant to the teleconferences


Background

1. OCP-IP has been talking about an IP-XACT description for several years, now we just simply need to provide it (in 2008, originally). Even if it means making some compromises.

2. Clean and elegant solution that fits all OCP users should be the goal, but it has to be something that complies with IP-XACT 1.4 and we need to get ok from key tool providers so that their tools will be able to use the description.

3. We should not make a monster. If somebody is only operating on small fixed OCP subsets, the full configurability of OCP should be hidden somehow. Still the description should also support the full set of configuration options.

4. Eventually IP-XACT description should replace rtl.conf.


Spirit Interoperability

Implement OCP within existing spirit format• Use the Magillem/Sonics proposal as basis• ST-style checking is used to validate an IP description

Status :• Vendor Extension Schema for Busdef and Abstraction Definition

have been defined and available in SVN repository.• OCP configuration Checker is also available in SVN repository.• Both of above deliveries have been conceptually agreed within

MDWG and pending final approval.

Next Steps• Documentation ( 2Q09 )


Spirit Enhancement

Propose and drive modifications into IP-XACT standard• Proposal for configurable bus interfaces was not

accepted for IP-XACT1.5• Spirit Consortium SWG agreed to put staging

process for configurable bus interface solution , it may become part of the schema sometime later.


Core Compatibility report

Ability to automatically compare OCP interface configurations• Check the inter-interface consistency (Current configuration

compliance checks)• Check consistency of a connected master / slave interface pair

(Current interface interoperability checks)• Check consistency of the ports and parameters• Generate the rtl.conf file out of configured IP-XACT parameter list

(legacy support)• Configure IP-XACT parameter list based on an rtl.conf file and give

rtl.conf files of OCP standard profiles as examples (legacy support)

• This activity is expected to happen during Q2/Q3 09


OCP3.0

Add OCP 3.0 signals and parameters to bus definition schema

• Activity duration is TBD


Release IP-XACT checker to OCP-IP community

• Steps for IP-XACT checker release• ocp vendor extension schema & checker approval

by MDWG members.• Documentation of the schema & checker has been

approved by MDWG members


GSC Request to MDWG

• Please put proposed schedule for all actions and plans listed• Specifically including goals to MDWG from

TWVG/GSC






SLD WG Update

Mark Burton (GreenSocs), April 2009


Overview

• Overview Status for SLD• Goals from TVWG• Mid-term outlook


Summary

• Release of TL1, TL2, TL3/4 for OCP in TLM 2.0• Great Achievement; quality of architecture and code is very high• release was later than planned because of impossibility to schedule

volunteer resource (architecture and review as well as code implementation)

• number of known gaps in the release• quality control, benchmarking and regression testing can be extended

• Outsource project to Greensocs highly successful• project is now finished• GS continuing to manage the SLD WG and provide support and small-

scale upgrade effort• SLD WG is still limited to Sonics, TI and Greensocs

• Nokia and Cadence have expressed interest in reviewing the kit• Still talking to other companies about joining the WG

• SLD WG plans are to• Do incremental work on the current code• Nothing else


SLD WG Status

Product Definition Priority Summary

Simulation Performance

Track and optimize SystemC Channel simulation performance 9 SLD WG

OCP Functional View Continue to drive adoption of OCP Functional View throughout the industry (i.e. OSCI)

9 SLD WG

Collaboration OSCI TLM 9 SLD WG

Support STARC to adopt OCP-IP TLM implementation 8 SLD WG

Understanding SPIRIT ESL WG (leverage Cadence's knowledge?) 8 SLD WG

Interconnect Model Advise GSC of such a SystemC utility is important for OCP-IP to provide

5 SLD WG

TLM kit Create OSCI TLM 2 based version 2.2 kits 9 SLD WG

Align next generation TLMs with OCP version 3.0 9 SLD WG

Validate quality of TLM 2.2 and commence shipments 9 SLD WG

Protocol checking SystemC assertions (like from Jeda) 7 SLD WG


OCP-3 TLM/SLD Standards

• Cache coherency extensions to OCP• This is on our roadmap for 2009• No committed resource

• Therefore impossible to predict delivery date


The SLD Mid-Term Vision - unchanged

• Ensure that OCP users have a 'complete' modelling infrastructure available • multiple levels of abstraction (pure-functional to cycle-accurate) and use

models (software development, architecture exploration, etc)• completeness means

• bus interface , performance monitoring interface ,system debug interface and configuration interface

• Make this modelling infrastructure standards compliant.• E.g. drive existing OCP-IP experience and expertise into OSCI-TLM • Maintain alignment between OSCI-TLM OCP-IP






Network-on-Chip benchmarking workgroup, status update

April 2009, Erno Salminen


Current status

• Erno Salminen is currently acting as a chairmain• Application modeling article

• Short version published at Embedded.com• Camera ready version sent to IET Computer and

Digital Techniques in April• Slide presentation will be published during DATE• Simulation tool Transaction Generator will become

open source (more info a bit later)


Current status (2)

• Video decoding benchmark• Specification document being accepted by the workgroup

• Vote 15th of April• Ready for member/GSC review (as/required?)• Describes the traffic patterns in HDTV decoding application

• Multiprocessing chip, shared memory communication via external DRAM

• Few accelerators in addition to CPUs• Bandwidth, burst size, target distribution

• Prepared by Krishnan Srinivasan, Sonics Inc. • This document will be formatted as a white paper


Current status (3)

• Call for benchmarks has not succeeded yet• Teleconference held with EEMBC consortium (Markus Levy,

Shay Gal-on)• We discussed collaboration between NoC wokrgroup and

EEMBC• They showed moderate interest but saw no immediate

benefits for themselves• Our workgroup aims to create traffic profiles from EEMBC’s

benchmark programs, especially from Multibench• System-level design workgroup also contacted (Mark Burton)

but no concrete advances yet


Transaction Generator (TG)

• Executes the NoC benchmarks • Reads the XML workload description • Injects/ejects data to/from network• Checks integrity, collects statistics

• Implemented in SystemC• Originally developed at Tampere University of

Technology• Will be published as open source in Q2-Q3 of 2009

• Promotes the availability of benchmarks


TG (2)

• Application model and XML format were derived from the work done with TG

• Only internal usage so far• Some effort

needed in documentation

Computation Architecture Highly abstracted including

characteristic parameters

Application Kahn process network Separation of

computation and communication

Communication Architecture Network model is cycle-accurate

or event-accurate with time estimation

Network model

A

C

E

B

F

PE1 PE2 PE3 PE4

28

30

20

25

4

8D

Legend:

Mapping Defines where tasks are

executedIV VIIIIII

Task

Group

Processing element (PE)

Inter-task transfer

Mapping/grouping

Initialization event

Tra

nsac

tion

Gen

era

tor


Transaction Generator (3)

• The license will be LGPL• GNU Lesser General Public license• Published changes will be LGPL, can be

combined to proprietary SW if unmodified• Open questions

• Where the repository will reside?• Detailed schedule• Documentation• Example designs


Ongoing activities

• Message-passing video encoder• Multiprocessor system implemented in FPGA• Runs MPEG-4 encoder• Initial measurements have been carried out• Detailed profiling is ongoing• Complements the shared mem. video benchmark

• Medical image processing• No access to realistic input data sets (medical images of

patients)• We will investigate if realistic traffic profiles can be obtained

with synthetic images


Ongoing activities

• Guideline preparation• Will start in full force once the TG has been

published

1. How to do measurements (higher priority)

2. How to create traffic models• Promotion plan is still being prepared• Finding more benchmarks

• Easier said than done






Break






Specification WG 2009 Plan

Definition Priority Delivery Plan

Updates - Bugs 9 Ongoing

Migrate meta data capture to SPIRIT 7 Pending MDWG & SPIRIT

Develop draft of OCP 3.0 for member review

9 Early May 2009

Publish OCP 3.0 with verification guidelines

9 Pending member review & FVWG

Consider transaction ID extension for OCP 3.1

8 Moderate interest – 4Q’09?

Propose content of OCP 4.0 7 See later

Consider cache coherence extensions 7 Placeholder – low interest

Consider limited performance parameters in OCP 3.1

8 Moderate interest – 4Q’09?


Specification WG Status

• 3.0 Member Review draft• Essentially complete – expect by next week

• 3.0 Specification bubble items• Relaxation of tag ordering rules

• Agreed• Extension to profile 1 (add optional MRespAccept)

• Retracted


Next Specification Releases

• OCP 3.0 (Member Review: May 09)• Focus is cache coherence extensions (major)

• Verification guidelines delayed until later release

• Also• Power management signaling (disconnect)• Write response extension• Profile 3


Specification WG Issues

• Cache coherence extensions• Planning to enable non-member reviewers (under

NDA)• No motivation to cover in CoreCreator

• Little clear drive for work beyond 3.0


CoreCreator 4.0 (The old version)

• Need to EOL this year• Only covers OCP 1.x and 2.0• Getting very old (support more difficult)

• Suggestion:• No new keys after July ’09 (~ 1 year after CC 2)• All keys expired by July ’10

• Can we go faster?


OCP 4.0 Concept

• See Ian’s slides


Message StyleMessage Style Network StyleNetwork Style

Dedicated Wires(Cmd, Add, Data & Response, Control, etc.)

Dedicated Wires(Cmd, Add, Data & Response, Control, etc.)

Fewer Wires (Control + Payload)

Fewer Wires (Control + Payload)

Bus-like(parallelism)

Bus-like(parallelism)

Packet-stylePacket-style

Planned ADDITIONOCP v 4.0

Planned ADDITIONOCP v 4.0

ExistingOCP v 3.0

ExistingOCP v 3.0

OCP SPEC ROADMAP


IMPORTANCE


OCP 4.0 Status

• Ian out prospecting• Drew needs to engage as well

• Ian’s OCP 4.0 status• …

• Suggest we plan 4Q’09 start


OCP-IP Standardisation Roadmap

Low Latency Chip-to-Chip Memory-Mapped Interface

April 2009

James Aldis, Texas Instruments


Summary• TI wants to standardise a memory-mapped chip-to-chip protocol

• high bandwidth, low latency• lower latency than eg PCI-Express or Unipro

• tightly-coupled with on-chip memory-mapped bus protocols• moderate pin count (eg 20 to 100 pins)• one key goal:

• sharing of system memory, including CPU cache operations• TI wants OCP-IP to consider hosting this standardisation

• strong correlation with the possible “OCP network socket”• agreement of semantics and ordering rules on- and off-chip• likely need for rich configurability• known to be quick and efficient workplace

• Would apply only to the “protocol” and not to the physical interface• voltage, clocking, drive strength, pin locations, etc all outside OCP-IP scope

• TI is looking at a number of options; OCP-IP is one of them• Need OCP-IP GSC feedback on the ideas in these slides• All information in these slides is preliminary and speculative


Position in System

CHIP ONE

IP CORE IP CORE

IP CORE IP CORE IP CORE

IP CORE

On-Chip Interconnect

Slim Adapter

PHY

CHIP TWO

IP CORE IP CORE

IP CORE IP CORE IP CORE

IP CORE

On-Chip Interconnect

Slim Adapter

PHY

Memory Controller

Off-chip Memory

Key

OCP on-chip Interface

OCP on-chip socket

OCP chip-to-chip Interface

OCP chip-to-chip socket


Technical Ideas• Concept is to partially serialise the OCP to a small number of wires

• each wire carries multiplexed data, command, address, and so on• number of wires can be traded off against latency/throughput without changing the

protocol at higher level• this is what I imagine the OCP network socket to be

• In common with OCP, still needs• documentation of commands, burst types, burst lengths, supported for a socket• documentation of traffic classes and ordering restrictions (threads and tags) used

by a socket• flow control mechanisms, including non-blocking• concept will be to have OCP-IP specify a generic protocol, then for specific use (eg

OMAP9876) publish a PHY and an OCP C2C configuration• PHY and config may also need standardisation for specific uses, in other forum

or maybe as OCP C2C profiles• Differences from OCP network socket for chip-to-chip use

• clock synchronicity will not apply in general• other requirement differences tbd• really very little here! that’s the point: we hope this is just the addition of a few

requirements into the “OCP network socket” at the project start






FVWG Discussion (Ian)

• Key issues:• Delayed by implementation schedule of OCP 3.0• When should we re-engage

• Can we organize this immediately?• Chairmanship

• Gabriele Zarri appointed from Cadence• Need to officially recognize new Chair

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OCP-IP Standard Debug Signals for IP-Blocks

GSC Status

Apr 23, 2009Bob UvacekNeal Stollon


OCP-IP Debug Interface Standard Group

• (Ex. Toshiba) Bob Uvacek, chair

• (ex. MIPS/FS2) Neal Stollon

• TI Gilbert Laurenti

• Toshiba CY Pei

• OCP-IP contacts Brian, Paul, Ian Mackintosh

Reviewing members

• Nexus Neal Stollon

• GreenSocs Mark Burton

• Cadence Mike Young, Ran Avinun

• MIPI Rolf Kuehnis, Gary Swoboda

• ITRI / Springsoft Alan Su, Prof. Lee,

• SPIRIT Neal Stollon, Debug-WG Chair Anthony Berent, ARM

• PLS / Infineon / SPRINT Jens Braunes, Albrecht Mayer

• Tensilica Bruce Ableidinger, Grant Martin


OCP-IP Debug Interface Standard Roadmap

Ongoing Promote and present debug slides in shows and journalsIEEE International High Level Design Validation and Test Workshop on Nov 20 and 21, 2008, Neil StollonOCP TLM paper that’s being presented at ASP-DAC in Japan, January, Prof. K.J. Lee of NCKU, -> VLSI-DAT'09 paperSPRINT Project: SoC Design and Integration Standards at TLM with SystemC, IP-XACT, Debug API and AXI extensions ,

Yokohama , Japan , January 21, 2009, Albrecht MayerOCP WG Presentation at DATE 2008 has been downloaded 250 times from the OCP-IP website

June Check OCP 3.0 Standard for compatibility (delayed)

July-Aug Physical Specification, Propose waveforms for OCP signals (delayed)

Sep - Oct Publish it inside OCP for greater review (delayed)---------------------------------------------------------

Searching for new points of engagement with industry and universitiesUBC (University research work) Brad Quinton's PhD thesis: uP Debug Visibility (Steve Wilton)

Mercury (Looking for better multicore debug solutions) Charlie Frazer, [email protected] (Published first realized heterogeneous multicore debug with MCDS)FPGA (Rising popularity after SoC chip building has SoFPGA) Temento (OCP debug instrumentation) [email protected]

4

5

6

7

8

9

10

11

12

2009


Other Debug Activities

SPIRITMC Ass.

IP-XACT

P1687 - IJTAG1149.7 - CJTAG

RTL

ESL

ITRI

SPRINT GreenSocs




Main philosophy is:

Debug N cores on a chip by selecting any 2 or more cores fora time-aligned comparative debug session.

OCP-IP has standardized the Debug Interface between system bus and any/multiple processor cores and IP-blocks in a SoC design.

• Enables reusable multi-core Debug-Hardware solutions. (OCP/JTAG/Nexus/MIPI)

• Enables Debug-Software for multiple cores in one GUI. (See SPRINT debug APIs)

• This will open the market for SoC designers to buy verified multi-core debug-IP solutions. (See IP-Extreme, HDL-Dynamics, Temento, ... IP providers)

Summary






Technical Vision WG Status Restated (Ian)

• OCP-IP offering was fully defined as prioritized “whole product” at January 14, 2009 TVWG meeting

• 2009 priorities were agreed by TVWG and were disseminated to all WGs for ratification and scheduling - all recommendations were reduced to agreed goals and were inserted as overall OCP-IP 2009 objectives

• Most WGs still not able to present robust and far-ranging measurable goals for GSC to monitor. However, most WGs have fairly solid action plans.

• January 2010 will be the next planning session for the TVWG

64






Asia: Japan Status• Website: active 11/04, reasonably strong activity continues• Key Relationships: Toshiba, CoWare, Sonics, VDEC, STARC and EDA Express• Members: 15 total (1 new Japanese member since last GSC meeting)

• Extremely successful 200+ attendee seminar given in Yokohama in May 2008. This was our last physical presence in Japan except for ongoing collateral distributions through CoWare and Sonics.

• Non-members we know (confidentially and confidently) are using OCP: Canon, Sharp, Fuji-Xerox, Sony and more!

• WIP: • VDEC interface converter evaluation was completed by Toshiba

• Again need production-worthiness comments from Toshiba• VDEC have posted our university datasheet on their Web site• Routinely adding relevant content to Japanese Web site• We are aware of non-members purchasing verification IP for OCP: We

don’t have full visibility into company names• James Aldis and Nakada-san were to work collaboration with STARC

• No progress again in last quarter.• We received proactive notification of non-renewals from financially depleted

STARC, Ricoh and Kawasaki.

66


Asia: Japan Status (cont’d)• Next Steps:

• Create articles on VDEC results with universities (likely article regarding converter development, if tool is viable)

• Promote VDEC interface converter technology if deemed viable and helpful for legacy conversion to OCP

• Fujita-san put new guy on tool support plus Nakada-san did not respond on viability for distribution

• Organization of 3rd Annual OCP Tech Forum in Spring 2009• Gracefully cancelled any perceived commitment given financial climate.

Nobody asked and we didn’t pursue.• Regularly report progress on SLD WG collaboration discussions with STARC

and continue to work through Toshiba (if possible?) to penetrate other WG’s• We did not prepare the planned collaboration proposal• STARC struggling financially and Nakada-san responding sluggishly

• Review ability to continue to leverage Toshiba’s strong help and support to drive membership in light of their discontinued GSC participation and financially struggling OCP-user (and all others!) companies in Japan

67


Asia: Taiwan Status• Website: Leveraging existing simplified Chinese and English Web sites• Key Relationships: ITRI, Global Unichip & Realtek• Members: 8 total (1 new Taiwanese member since last GSC meeting)

• ITRI hosted late November 2007 Debug/ESL seminar• Presented to rep orgs of key members 4Q07 (Only CoWare and Sonics

available), providing education regarding OCP-IP

• WIP: Implement 1H09 Debug/ESL seminar with ITRI• This is still promised with strong local OCP representation

• Next Steps: • Close on ITRI event for late 1H09 (may move to 2H?)

• Financial climate permits the only OCP-IP participation to be provision of collateral with small hope of placing speaker

• 2009 Taiwan OCP promotion will continue to be leveraged through ITRI and their influence (and our presence) in their reference platform development

• Continue ITRI collaboration with their involvement in Debug WG

68


Asia: Korea Status

• Website: Active 5/05; activity OK, small market• Key Relationship: KETI

• KETI appear to be driving SIP coordination initiative• Members: 5 total (1 new Korean member since last GSC meeting)

• Samsung is an OCP user and it is possible OCP interest will expand in more groups and motivate membership

• WIP: We still post relevant key announcements on Korean website• Next Steps:

• Still seeking Samsung long-term membership via GSC relationships

69


Asia: China Status• Website: Active 5/05; activity healthy and second to Japanese Web site level• Key Relationships: Harbin/IPGC, CSIP, SSIPEX• Members: 9 total (1 new Chinese member since last GSC meeting)

• Have provided much guidance on standards body membership• Governing Chinese bodies still not able to effectively sell any standards today!• Renewed both CSIP and SSIPEX contracts for 2 years in 1QCY08

• History: • Both CSIP and SSIPEX received OCP Training in 2005

• Turnovers in both organizations hamper promotions and technical grasp of OCP• CSIP promoting OCP with all other IPGC standards• SSIPEX struggled promoting OCP independently

• They have failed again since Ian’s 4Q06 visit• We just passed on tiny SSIPEX event in Shanghai November ‘08 event

• Next Steps: • Maintain relationship with Professor Ye

• No short-term opportunities given travel budget• Ian again pursued INRIA Franco-Sino membership in trade for OCP promotion • Professor Jolaboff struggling to close the deal • Jolaboff currently in France hoping to confirm relationship

• 2 of the 3 top credible SoC companies are members of OCP-IP• ViMicro, Spreadtrum are members; Action Semi is not• Continue posting relevant, current data on Chinese Web site

70


Asia: India and Russia Status• Website: None; English language fully applicable• Members: 9 Indian / 0 Russian (no additions since last GSC meeting)• WIP:

• All corporations visited (4Q06) offered substantial and useful audiences AND word of mouth OCP promotion

• Prompts by TI at MindTree (during 2Q CY08) have not permitted closure on memberships to date!

• Note that MindTree is soliciting OCP-based IP and were recently named TI’s vendor of the year

• Next Steps: • Russian market is embryonic and we inevitably passed on visiting in late

2008; it may be worth a visit through government and ASIC-based companies to seed the word about OCP. Cadence & MIPS connections could be useful.

71


Asia: Summary

• Tight budgets in 2008 prevented routine travel to regions and this will continue in 2009

• Need to refresh old relationships and build new• 2009 budget outlook forces activity in these regions

to continue to languish• Updating native language Web sites (Japanese,

Chinese, Korean) is our PRIME in-hand method of maintaining visibility in the region

72






Goals for 2009

• 2009 WG goals were defined in January 14th TVWG meeting for Debug WG, Metadata WG, NoC BWG, SLD WG and Spec WG

• Completion dates to be confirmed by the WGs• Still need to ensure accurate dates and schedules

have been provided across the board from technical groups


MWG Goals for 2009 (Ian)• Press Releases

• 2009: 12 major announcements / 20 total• To Date: 6

• Articles• 2009: 3 viewpoint articles plus 12 contributed articles provided by OCP-IP (with > 24 articles with strong OCP mentions)• To Date: 9

• Presentations • 2009: Papers and presentations at 20 events minimum• To Date: 1 (Multicore Expo)

• Tradeshows • 2009: 2 formal tradeshow attendances (EDAC CEO Forecast & possibly IP 09?)• To Date: 1 (EDAC CEO Forecast)• Ian will physically attend DATE/DAC/IP ’09, funds permitting. No booth at any

location

• Seminar Collaborations• 2009: Only as many as are financially viable• To Date: 0


MWG Goals for 2009 (Ian)Membership Goals 2009:

Asia / India• Currently: 53 • 2009 Goal: 10 new Asian members• 2009 to date: 4 (Global Unichip, IBM Japan Ltd., ETRI, Shanghai Magima)

FPGA / Military• Currently: 10 • 2009 Goal: 5 new FPGA/military members• 2009 to date: 1 (ITT Corporation)

GSC• Currently: 3• 2009 Goal: 5 committed GSC members• 2009 to date: 3 (and action plans to rebuild are required)

Total Membership• Currently: 219• Since last GSC meeting: 9 additions• 2009 Goal: Add 5 New Major Corporations • 2009 to date: 2 (Global Unichip, IBM Japan Ltd.)• Secondary 2009 Goal: Reach 220 ASAP and re-evaluate goal






• See handout – OCP-IP GSC Action Items• ARM Update

• Follow-up to Ian’s May ‘08 meeting with VP Operations (Processor Group & GM of Fabric Division)

• All recent follow-ups have been made through Nokia/Vesa• Email discussions have been shared across GSC. Current update

promised from Vesa• Any GSC recommendations to record and further promote engagement?

• CoreCreator II Update• Original DesignWare VIP shipping since July ’07• PR announcing availability of CoreCreator II was published on March 4 and

we’re shipping OCP checker announced in PR dated November 11, 2008• Sonics’ CoreCreator II portion has shipped to 26 total companies • Synopsys’ DesignWare VIP CoreCreator II portion has shipped to 19 total

companies (no recent shipment delays; several competitors of Synopsys historically cancelled shipments)

Action Item Review (Ian)

78


OCP Conductor• Started shipping in late June• Shipped complimentary licenses to 9 companies so far

• Sonics• HDL Dynamics• Mentor Graphics• Imagination Technologies• Synopsys• Inventure• Olympus Digital Systems Corp.• K-Micro• Verilab, Inc.

• Article was published in 1Q09 and in our April newsletter79


Princeton’s Sponsor Upgrade

• Cristian Grecu• He is eventually slated to re-engage as NoC BWG

Chair• GSC needs to recognize Sponsor upgrade

granted to Cristian at Princeton

80






Recent Press Releases (Joe)March 16 - K-micro announces availability of FPGA board for the CatsEye

Development systems09 - K-Micro Announces Availability of CatsEye Development Systems

February25 - Magillem and STMicroelectronics Win OCP-IP Co-Contributor of the

Year Awards 16 - CircuitSutra Partners with GreenSocs to Provide High Quality

SystemC Based SoC Modeling Services 03 - CAST Improves SDIO Host and NAND Flash Memory Controllers

January05 - Atomic Rules Becomes Community Member of Open Core Protocol

International Partnership


Imminent Press Releases (Joe)

April TBD - OCP-IP Delivers New Advanced SystemC TLM Kits

• Will be before DATE 09

TBD - OCP-IP Releases OCP v3.0 Specification• Will be asked at DATE 09


Recent Articles with OCP Mentions (Joe)

March 13 - Verification IP: Solace for the Common Integration Nightmare? Chip Design

February 19 - NoC Your SoCs Off System-Level Design Community Chip Design

February 16 - TI Unveils Multi-Core OMAP 4 EE Times Europe

February 16 - Leveraging Standards When Times Are Tough SOCCentral

February 5 - Making A Multicore System Work System-Level Design Community (Part 2)


Recent Articles with OCP Mentions Pg2 (Joe)

January 29 - Making A Multicore System Work Properly System-Level Design Community (Part 1)

January 23 - Tracking SoC Performance Chip Design

January - New Pain Points In System-Level Design System-Level Design Community Chip Design

January - An application modeling & hardware description for network-on-chip benchmarking Embedded.com


Recent Events (Joe)

March 16 - 19 - Multicore Expo, Santa Clara Convention Center, Santa Clara,

CA (3 presentations)

• Using Multichannel DRAM Subsystems to Create Scalable Architectures for Video SoCs - Alex Chao, Sonics, Inc.

• Requirements for System-on-Chip Analysis from Simulation to Silicon - Pascal Chauvet, Sonics, Inc

• Power Management and Interconnects - Steve Hamilton, Sonics Inc.


Recent Events (Continued) (Joe)

January 19-22 - 14th Asia and South Pacific Design Automation

Conference (ASP-DAC 2009)Pacifico YokohamaYokohama, Japan

14 - EDA Consortium CEO Forecast and Vision San Jose Convention Center San Jose, California


Recent Tradeshows (Joe)

None


• SLD / TLM Announcements• OCP 3.0• Collaboration Announcement (OSCI / OCP-IP)• Collaboration Announcement (SPIRIT/OCP-IP)• TI Further Adoption • Benchmarks Announcement (TBD)• OCP 4.0?• Other membership & product announcements as

appropriate

Pending Press Releases (Joe)


• NoC Summary Paper - Design and Test Mag (Submitted)• OSCI collaboration article • Synopsys VIP article (Being Drafted)• OCP Checker article (DATE presentation done, article draft TDB)• Non-Blocking Flow Control in OCP (In re-write)• Example of Non-Blocking Flow Control Implementation• SPIRIT Compatibility (Magillem, Drafted)• Challenges of Cache Coherence (Drafted)• Vivante article• Leveraging Standards Infrastructure• Power Management article (Drafted)

Articles in Process (Joe)


Future Article Possibilities (Joe)

• FVWG Deliverables• SLD Deliverables• FPGA / Military Program• NoC Benchmarking/ University Program• 2D Transactions in OCP• Example of 2D Transaction Implementation• FPGA Support• OCP 4.0 • Possible Benchmarking Article from Srini (TBD)• Other member product stories as members complete writing• Other GSC Suggestions?


• No booths present• Ian will represent (and walk the floor)

Upcoming Tradeshows (Joe)


• Possible article topics:• Technical content from WG activity• SystemC or TLM based items• Generic adoption stories

• Any articles already planned (with OCP content)?• Any other ideas for articles?• Conferences:

• Any other presentations already planned(with OCP content)?

GSC Support for Articles & Conferences (Joe)






Break






Recruiting Update (Joe)

• Focus continues to be on System Houses, IDMs and major EDA and IP providers , BUT only if there is obvious hope they can afford membership fees• Most energy will be focused on three fronts

• Salvaging fees from existing members who appear to have funds

• Pursuing new members who should participate with OCP 4.0

• Reconstructing the GSC


Recruiting Results (Joe)New members since last GSC meeting:

• ITT Corp.• IBM Japan Ltd.• Faculty of Sciences, Republic of Tunisia• ETRI• Shanghai Magima Digital Information• ISD S.A.• Beneware• Global Unichip• Swan On Chips


Hot List Recruiting - Joe

Short Term Possibilities:• Altera• Cisco• Juniper Network• SGI • Ericsson

Potential Upgrades• STM to GSC• Arteris• Mercury

Cutbacks leave us on OCP 4.0 recruiting, GSC repairs with opportunistic viable upgrades and new members


Hot List Recruiting Observations (Joe)

• Economic fall-out renders recruiting of most beleaguered companies pointless

• Other than recruiting energies for OCP 4.0 and GSC repairs, most energy is dispersed into operational PR, marketing activity and viable collections

• There remains a sustained perception of OCP-IP as a highly sought after industry leader with both media and members alike – lots of “buzz” (pity no one has any money!)


Recruiting Summary (Joe)

• 2009 Goal: 5 Major New Corporations and 220 members ASAP and revisit

• Current members:• 3 GSC members • 216 other members signed

• (Defunct companies constantly purged)• 219 total members

• If there is an agreement with Altera, the FPGA component of membership could grow explosively!• Altera is teetering on membership under guise of

OCP 4.0 interest






2009 Budget – Ian/VTM

• Changing commitments of multiple GSC members since early December necessitated a revamp of 2009 budget in January

• Nokia has advised of tentative problems with their fees in 4Q09

• Japan Inc. proactively bailed on 2009 fees since last January GSC meeting (Kawasaki, Ricoh and STARC)

• Key to our future is OCP 4.0 recruiting and revising GSC funding/membership to address current financial needs going into 2010

• It’s critical that the perception of OCP-IP’s stability and organizational commitment remains unblemished in the market

• Review spreadsheet of latest January approved budget vs. current forecast

103






Non-Member Specification Requests

0

50

100

150

200

250

Q1

2004

Q2

2004

Q3

2004

Q4

2004

Q1

2005

*

Q2

2005

Q3

2005

Q4

2005

Q1

2006

Q2

2006

Q3

2006

Q4

2006

Q1

2007

*

Q2

2007

Q3

2007

Q4

2007

Q1

2008

Q2

2008

Q3

2008

Q4

2008

Q1

2009

Dow

nloads

105


SystemC White Paper Downloads

0

200

400

600

800

1,000

1,200

1,400

Q4

2002

Q2

2003

Q4

2003

Q2

2004

Q4

2004

Q2

2005

Q4

2005

Q2

2006

Q4

2006

Q2

2007

Q4

2007

Q2

2008

Q4

2008

106


Other White Paper Downloads

Methodology White Paper

(# Downloads to Date)

Since October 2005

Through March 2009 1075

Debug White Paper


Since April 4, 2007


NoC Benchmarking White Paper


Since February 16, 2007


107


TLM Kits Request Summary

0

20

40

60

80

100

120

140

160

180

200

Q1 '06

Q2 '06

Q3 '06

Q4 '06

Q1 '07

Q2 '07

Q3 '07

Q4 '07

Q1 '08

Q2 '08

Q3 '08

Q4 '08

Q1 '09

v 2.1.2

v 2.1.3

v 2.2.0

v 2.2.1

108


Web Site Activity (VTM)Total Visitor Sessions

(Past 12 Months)

0

500

1000

1500

2000

2500

3000

3500

4000

4500

Apr '08 May '08 June '08 July '08 Aug '08 Sept '08 Oct '08 Nov '08 Dec '08 Jan '09 Feb '09 Mar '09

109


Web Site Activity (VTM)

Unique active users accessing the Member’s Only area of the Web Site

0

100

200

300

400

500

600

Q1 2006

Q2 2006

Q3 2006

Q4 2006

Q1 2007

Q2 2007

Q3 2007

Q4 2007

Q1 2008

Q2 2008

Q3 2008

Q4 2008

Q1 2009

110


Native Language Website Activity (past 12 months)

0

100

200

300

400

500

600

700

800

900

1000

Apr '08 May '08 June '08 July '08 Aug '08 Sept '08 Oct '08 Nov '08 Dec '08 Jan '09 Feb '09 Mar '09

Korea

China

Japan

111


0

20

40

60

80

100

120

140

160

180

0

50

100

150

200

250

Q1 '02 Q2 '03 Q3 '04 Q4 '05 Q1 '07 Q2 '08

Non-LinkedLinked

Q1 ’02 – Q1 ‘09

Member Links on Web Site (VTM)


• Member requests prompted IP library project• Library live as of August 6th, 2003

• 103 pieces of IP currently listed from 15 providers

• Press release announcement on November 10th, 2003

• IP library traffic (by visitor session):• Q3 ’03 (2029); Q4 ’03 (2499); Q1 ’04 (1629); Q2 ’04 (1843); Q3 ’04 (1202); Q4

’04 (1522); Q1 ’05 (1522); Q2 ’05 (2034); Q3 ’05 (1419); Q4 ’05 (1357); Q1 ’06 (1261); Q2 ’06 (1314); Q3 ’06 (1093); Q4 ’06 (1033); Q1 ’07 (1025); Q2 ’07 (940); Q3 ’07 (1070); Q4 ’07 (1007); Q1 ‘08 (938); Q2 ’08 (822); Q3 ’08 (763); Q4 ’08 (729); Q1 ’09 (808)

• IP Providers do not aggressively promote OCP availability

• In March we revisited our entire membership with requests to update current library

IP Library Update (VTM)

113


EDA Products Library Update (VTM)

• Posted September 9th, 2003

• 22 products by 11 providers posted

• Press release announcement on November 10 th, 2003

• EDA products library traffic (by visitor session):• Q4 ’03 (497); Q1 ’04 (268); Q2 ’04 (299); Q3 ’04 (286); Q4 ’04 (230); Q1 ’05 (244); Q2

’05 (379) Q3 ’05 (437) Q4 ’05 (549) Q1 ’06 (369) Q2 ’06 (478); Q3 ’06 (392); Q4 ’06 (318); Q1 ‘07 (348); Q2 ’07 (286); Q3 ’07 (334); Q4 ’07 (335); Q1 ’08 (297); Q2 ’08 (289); Q3 ’08 (268); Q4 ’08 (257); Q1 ’09 (239)


114


IP & EDA Library Providers (VTM)

Members with OCP compliant EDA offerings (11):

• AerieLogic• Cadence• Carbon Design Systems• CoWare• Duolog• Jasper• Magillem• Mentor Graphics• OCP-IP• Sonics• Synopsys

Members with OCP compliantIP in library (15):

• Amphion• Arasan • Arteris• CAST• Digital Blocks• DMP Inc.• Evatronix• First Silicon Solution• FS2• Hantro Products• Jeda Technologies• Mentor Graphics• MIPS• Sonics• Synopsys

115


Service Providers and ASIC Library Update (VTM)

• Launched June 27, 2004

• Includes list of providers of OCP-related services• Constitutes part of the OCP Libraries

• Redesigned Web pages to prominently feature librarieswww.ocpip.org/library.

• Features 5 different service providers

• Related Services library traffic (by visitor session):• Q3 ’04 (149); Q4 ’04 (275); Q1 ’05 (259); Q2 ’05 (197); Q3 ’05 (312); Q4 ’05 (362); Q1

’06 (147); Q2 ‘06(202); Q3 ’06 (185); Q4 ’06 (165); Q1 ’07 (145); (Q2 ’07 (123); (Q3 ’07 (149); Q4 ’07 (131); Q1 ’08 (149); Q2 ’08 (99); Q3 ’08 (149); Q4 ’08 (83); Q1 ’09 (115)

• ASIC traffic is counted with Service Providers as of April ’05


116


• Potential contributors:• Members collaborating on articles,

conference papers or in our newsletter

• Any new members• Any major new FPGA/MIL member

• Focus generally toward large company names

• Listings are numerous enough already• Prefer to add a few large Corporations

• Routinely purge list of stale stories

OCP Adoption Stories (VTM)

Cadence (2)Coware (3)DAFCADenali Software (2)Digital Media ProfessionalsDuolog eASIC (2)eInfochipsENSTAHDL DynamicsIntel (2)JetstreamKawasaki Micro. (2)Leiden UniversityMagillemMentor GraphicsMercury (3)MIPS (3)Nascentric

Nokia (2)PLS Development ToolsPUCRSSiemensSonics (3)SpringsoftSynopsys (3)Tampere University of Technology Technical University of DenmarkTexas Instruments (4)Toshiba (3)TransEDA (2)UC Berkeley (2)University of British ColumbiaVDECVerilabVTTYogitech (2)

38 Contributors (61 total stories):

117


3Plus14DSP Inc.AccentAdvanced ArchitecturesAerieLogic Agnisys Technology PVT-Ltd.AIZYC TechnologiesAlcatelAlpha DataAmimonApplied Science & Technology Research InstituteArasan Chip Systems, Inc.ARC InternationalArtec Design GroupArterisASICs World Services, Ltd.Atomic Rules LLCAtrenta, Inc.Attogenix Biosystems Australian Semiconductor

Technology Co.Averant, Inc.Axell CorporationBeach SolutionsBeceem CommunicationsBeneware Inc.Bluespec, Inc.Boston Circuits, Inc.Broadcom

eASiC Ecole Polytechnique de MontrealEDA CaféEDA ConsortiumEDA Express Co. Ltd. Electronics and

Telecommunication Research Institute

eInfochips, Inc.Elliptic Semiconductor, Inc.Embedded Systems Lab.ENSTA Entropic CommunicationsErnst & Young, LLPEsterel TechnologiesETIS/ENSEAEuropean Electronic Chips &

Systems European Space AgencyEvatronix S.A. EVEFaculty of SciencesFirst Silicon SolutionsForte Design SystemsFueTrek Co.GDA TechnologiesGeologic DesignGeorgia Institute of TechnologyGlobal Unichip GreenSocsHCL Technologies

OCP-IP Membership List (pg. 1)

Cadence Design Systems, Inc.Carbon Design Systems Carnegie Mellon UniversityCAST CCLRCCeloxica, Inc.Chips & Media, Inc.CircuitSutra Technologies

Pvt Ltd.CNFMCologne Chip AGComtech EF DataControlNet India PVT-Ltd.CoWare Crevinn TeorantaCubic Defense ApplicationsCurtiss-Wright Controls Embedded ComputingDAFCA Den CommDenali Software, Inc.Design and Reuse Digimarc Corp.Digital Blocks, Inc.Digital Dynamics CorporationDigital Media Professionals Dolphin IntegrationDoulosDuolog TechnologiesEADS Astrium

HDL Design HouseHDL Dynamics HifnHughesIBMIBM JapanIcera SemiconductorIcron TechnologiesImagination Technologies Infineon TechnologiesInicore, inc. Innovision ResearchIntegrated Device TechnologyInventure, Inc.ISD S.A.ITRI ITT CorporationJasper Design AutomationJEDA Technologies, Inc.Jetstream Media TechnologiesKaben Wireless SiliconKawasaki MicroelectronicsKETIL-3 Communications Systems-WestLeiden UniversityMagillem Design ServicesMagnum SemiconductorManhattan RoutingMarvell Semiconductor, inc.

118


Mentor GraphicsMercuryMicronasMimasicMinistry of Information IndustryMIPS TechnologyMIT Lincoln LibraryMobileyeMobileyeMotorolaMtekvision Co. Ltd.NallatechNascentric, Inc.National Applied Research Labs National Tsing Hua University NEC ElectronicsNexus 5001 ForumNoBugNokiaNVIDIA CorporationOlympus Digital System Design

Corp. ON DEMAND Microelectronics On2 OSCI Paradigm WorksPixelworks, Inc. pls Programmierbare Logik

Systeme GmbH

Silistix SMI CorporationSoC Microelectronics GmbHSonicsSpace and Naval Warfare Systems Center SpreadtrumSpringsoftSTARCSTMicroelectronicsStream ProcessorsSwan On ChipsSynforaSynopsysTaiwan SoC ConsortiumTampere University of Technology Tata Elxsi LimitedTechnical University of Denmark TechOnLineTemento SystemsTensilica, Inc.Teradici CorporationTexas InstrumentsThe MITRE CorporationThomsonToshiba SemiconductorTower SemiconductorTransEDA, Inc.TranSwitch CorporationTrustIC Design SRL

OCP-IP Membership List (pg. 2)

Princeton UniversityProDesign Electronics Corporation PUCRSQThinkQualCore LogicRealtek Semiconductor CorporationRegulus Co., Ltd.Ricoh Company, LtdRockwell CollinsRoyal Institute of Technology Sasken Communication Tech.Savant Company, Inc. Semiconductor Technology Academic

Research Center SESCA Embedded SolutionsShanghai Hometown Microsystems Shanghai Magima Digital

InformationShanghai Silicon Intellectual Property

ExchangeShenzhen Graduate SchoolSIEMENS AG Oesterreich Silicon HiveSilicon & Software SystemsSilicon Image GmbH Silicon Integration Initiative Silicon Interfaces Private, Ltd.Silicon Laboratories Inc. Silicon Valley PA, Inc.

TSMCUMCUniversidad de Castilla-La Mancha Universita di BolognaUniversite de Bretange SudUniversite de Cergy PontoiseUniversity of Bristol, UKUniversity of British Columbia University of California at BerkeleyUniveristy of HoustonUniversity of SouthamptonUniversity of Tokyo, VDEC VaST Systems TechnologyVerification Technology Inc.VeriLab Inc. VimicroVivante CorporationVSI AllianceVTT Washington State University WavanteWipro TechnologiesWiQuest CommunicationsXilinx, inc.Yamaha CorporationYogiTechZoetronicsZoranZuken, Inc.

119


OCP-IP Membership

Participant

Community

Sponsor

University

GSC

Participant 70%

Community 16%

Sponsor* 7%

University 5%

GSC 1%

Total Members 219

120

* Includes free upgrades of Community, University and Participant members


• Recruiting has basically accomplished objectives in numbers; growth is steady and hard work (membership is money!). Most new members are starting as non-paying Participants and it’s clear that 2008 was a hostile financial environment (and 2009 seems worse!).

• Getting people to participate is generally easier than getting them to pay!• We need large orgs and higher paying sponsor members to drive revenue. • We have a credible presence in Asia, but it’s clear that non-paying Participant

membership is likely first penetration step, rather than hoping for up-front membership fee. Lack of visits and personal contact will likely cause our presence to languish going forward. (China, India, Taiwan & Russia are inevitable value proposition problems)

• Always want more large companies (for revenue and adoption!). Many of the big guys have “heartburn” over parting with ANY money for any membership fees

• Paying membership demands active solicitation and marketing• Experiencing continued success operating three native language Web sites

• Very good hits on native language Web sites, which must help our visibility in Asia• OVERALL, WEB SITE ACTIVITY IS HEALTHY, with surprising recent up-ticks.

• Our best option still appears to be supporting free Participant membership to get players on board, who hopefully appreciate value later and pay for membership

2009 Ops Summary (VTM)

121


2009 Ops Summary (VTM)

• We’ve essentially abandoned most tradeshows throughout the year due to the severe financial outlook

• MWG publications (PRs, articles, conference presentations) still perform strongly and have secured the industry image we enjoy today

• Technical WG achievements for year are still sufficient when viewed externally.

• WE MUST MONITOR 2009 PERFORMANCE MORE CLOSELY AS THERE ARE 1H DELIVERABLES WHICH SHOULD NOW BE CRISPLY MADE AVAILABLE TO THE GENERAL MEMBERSHIP

• Original white papers and particularly those from NoC and Debug WGs are still getting very impressive levels of attention!

• WG’s have generally been very effective, but FVWG needs to be re-started and managed to support OCP 3.0, Debug WG is essentially in networking mode & NoC BWG continues with high productivity.

• We need strong follow-up to rebuild the GSC and drive OCP 4.0 participation • Still need to work carefully with some of the Chairs, though they are all

extremely cooperative and hard-working. Need to make sure they know we value them!

• All economic indicators show most corporations in financial distress122






Enabling Resolution (Ian)

• Motion to resolve that the officers of the Corporation are hereby authorized and directed to execute all documents and incur all expenses necessary or appropriate or convenient to effectuate the purposes of the foregoing resolutions.

124






OCP-IPGoverning Steering Committee Meeting

TeleconferenceApril 23, 2009

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