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Consortium Building Sessions
7 March 2018, Warsaw
https://artemis.eu
ARTEMIS Industry Association
Jan Lohstroh
Secretary General
ECSEL JU Call Forum
Warsaw 2018 March 17
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Industry representation in ECSEL-JUtri-partite organization (PPP)
Industry
(Private Members)
ECSEL Participating States
(EPS)
European Commission
(EC)
(Represented at ECSEL Governing Board)
Advanced Research & Technology for Embedded Intelligent Systems
ARTEMIS Industry Association is the association for actors in Embedded Intelligent Systems
within Europe.
4 Core values are:
+ European competitiveness
+ Innovation
+ Global impact
+ Improve day-to-day life
As private partner, the association represents its members - industry, SMEs, universities and
research institutes - in ECSEL Joint Undertaking.
The Electronics Value Chain
Focus Areas
Embedded & Cyber-Physical Systems
Many high-tech industrial systems are classified
as Cyber-Physical Systems (CPS) because of
the close interaction between computation,
communication and control elements (the cyber part), and physical processes
such as motion and vibration (the physical part).
Internet of Things
The Internet of Things interconnects the “Things”,
with their Embedded or Cyber-Physical Systems
inside, in networks of many devices – for example the
car to the fixed road infrastructure or the smart card to the banking and
payment systems and use of public services.
Digital Platforms
Digital Platforms are the
supporting infrastructures to
build the creation of the
digital economy on, Digital
Platforms consist of
hardware infrastructure with
software services for which
interoperability is well
defined and understood.
A grasp of our 170+ members
Collaboration
SRA 2016: Innovation EnvironmentScale-up efforts by collaboration
Electronic Components & Systems
‘Europe’s digital transformation is a great opportunity, as well as a pressing need, to undertake ambitious R&D&I to bring to the market products and services for the benefit of citizens, businesses and society.’
➢ Common ECS Strategic Research Agenda (ECS-SRA)
➢ Joint position papers on ECSEL2 and FP9
➢ Common Consortium Building sessions / brokerage events today and in 2019
➢ EFECS joint Forum (co-organized AENEAS, ARTEMISIA, EPoSS, EC, ECSEL JU) November 20-22, 2018 in Lisbon, Portugal save the date & check on https://efecs.eu/
➢ ECS Collaboration Tool, independent of any funding instrument, to share ideas and attract partners https://ecscollaborationtool.eu/
Intensified cooperation
between AENEAS, ARTEMIS-IA and EPoSS
Consortium Building Sessions
March 7th agenda
9.30 - 9.45 Introduction by the three Associations AENEAS, ARTEMIS-IA, EPoSS
9.45 - 10.00 ECS-SRA introduction
10.00 - 10.30Innovation Environment in Poland by Mateusz GaczyńskiVice Director, Department of Innovation and Development, Polish Ministry of Science and Higher Education
10:30 - 12.00 Project ideas presentation
12.00 - 13.30 Networking lunch & posters
13.30 - 15.00 Parallel sessions
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ECS-SRA Introduction
By Patrick Cogez, AENEAS Technical Programme Manager
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Industry representation in ECSEL-JUtri-partite organization (PPP)
Industry(Private Members)
ECSEL Participating States(EPS)
European Commission(EC)
(Represented at ECSEL Governing Board)
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MASP elaboration process – Up to 2016
AENEASStrategic Agenda
ARTEMIS-IAStrategicResearchAgenda
StrategicResearchAgenda
Of EPoSS
Three IndustryAssociations
MASRIA
Multiannualfinancial
perspectives (from PAs)
ECSELMASP
Step 3Step 2Step 1
Approved byECSEL GoverningBoard
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MASP elaboration process – 2017
Three IndustryAssociations
MASRIA
ECSELMASP
Approved byECSEL GoverningBoard
ECSStrategic ResearchAgenda
Step 2Step 1
Multiannualfinancial
perspectives (from PAs)
Funding agnostic
ECSEL-JU VMS taken into account
Same technical contentto optimiseMASRIA/MASP preparation process
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The ECS Value Chain stands for everything “smart”
and impacts all aspects of life and all industrial sectors
The rationale :
Better integration of the FULL ECS Value-chain
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The ECS SRA : It is not “yet another SRA”!
▶But a common ECS SRA from ECSEL JU Private Members AENEAS, ARTEMIS-IA and EPoSS
▪ Speak in one voice on the ECS complete Value Chain
With the ultimate goal of generating the right set of RD&I projects
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The ambition : ECS SRA to play a pivotal role
Three IndustryAssociations
MASRIA
ECSELMASP
ECSStrategicResearchAgenda
ECSEL Calls for Project
H2020 Calls for Project
PENTA Calls for Project
ARTEMIS, ENIAC & EPoSS ETP
National / Regional
Programmes
Covering TRL 2 to 8
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ECS SRA Strategy Implementation
Two Threads Strategy Implementation
Addressing next generation digital technologies and breakthroughs
Mission Oriented
Pooling ECS research efforts on a number of priorities to remove barriers between application
sectors
A Strong EU based ECS Industry
An Efficient Europe
R&D&I programmesand
Lighthouses
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ECS Process Technology, Equipment,Materials & Manufacturing
Computing & Storage
Safety, Security & Reliability
Connectivity & Interoperability
Systems and ComponentsArchitecture, Design & Integration
ECS Strategic Research Agenda
KEY APPLICATION AREAS >
ESSE
NTI
AL
CA
PAB
ILIT
IES
Transp
ort &
Smart M
ob
ility
Health
& W
ell-Bein
g
Energy
Digital In
du
stry
Digital Life
Basis for R&D&I activities in ECS in Europe
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The Innovation accelerators to make it happen
From great research projects to economic and societal value: Proper environment fostering innovation
Standardisationand Regulation
SupportSMEs, Start-up
Scale-ups
Pilot lines
ResearchInfrastructures
Cooperation withother
Initiatives
International Cooperation
Platforms & Business models
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The People behind
Chair: Laila Gide (Thales)
Core team: Patrick Cogez (Leader, AENEAS), Renzo Dal Molin (Cairdac), Marc Duranton (CEA), Mart Graef (TU Delft), Paul Merkus (Philips), Sven Rzepka (Fraunhofer), Arnaud Samama (Thales)
Chapters co-Leaders
Chapt 1: Transport and Smart Mobility: Michael Paulweber (AVL) ; Patrick Pype (NXP)
Chapt 2 : Health and Well-Being: Ronald Begeer (Philips Healthcare) ; Renzo Dal Molin (Cairdac)
Chapt 3: Energy: Wolfgang Dettmann (Infineon); Pertti Raatikainen (VTT); Antonio Imbruglia (STM)
Chapt 4: Digital Industry: Mika Karaila (Valmet) ; Olli Ventä (VTT)
Chapt 5: Digital Life: Paul Merkus (Philips) ; Mario Diaz-Nava (STM)
Chapt 6: Systems and Components: Architecture, Design and Integration: Jürgen Niehaus (SafeTrans) ; Ralf Popp (EdaCentrum) ; Reinhard Neul (Robert Bosch)
Chapt 7: Connectivity and Interoperability: Frédéric Gianesello (STM) ; Jerker Delsing (Lulea U.T)
Chapt 8: Safety, Security and Reliability: François Tuot (Gemalto) ; Daniel Watzenig (Virtual Vehicle)
Chapt 9: Computing & Storage: Marc Duranton (CEA) ; Huy-Nam Nguyen (ATOS)
Chapt 10: Electronic Components & Systems Process Technology, Equipment, Materials and Manufacturing: Jo de Boeck (IMEC) ; Arco Krijgsman (ASML)
Over 200 experts across the 10 chapter teams
Core team and chapters owners
For more information
www.aeneas-office.org
Thank you
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Innovation Environment in Poland by Mateusz GaczyńskiVice Director, Department of Innovation and Development, Polish Ministry of Science and Higher Education
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Consortium Building Sessions
By Patrick Cogez, AENEAS Technical Programme Manager
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Information sharing
Plenary session: pitches• This brings all at the same level of
information• Focus is on missing expertise or partners• What does your proposal need?
Networking lunch & posters
In-depth project discussions • Extended presentations – Room 2.41• Free networking (project tables) – Room 2.42
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Pitches / Project proposals
Pitch # Project proposal Presenter Contact email Topic SRA Chapter
1 APhoPack Joni Turunen [email protected] optics, photonics and packaging solutions ECS PTEMM
2 LAMP Annelise Poenninger [email protected]
Pilot line for micro and nanopatterning replication technology
ECS PTEMM
3 COMTROL Patrick [email protected] COntamination Management
and conTROLECS PTEMM
3a AMPLEi4 Ilan [email protected]
Advanced Metrology Pilot Line for Electronic Industry 4.0
ECS PTEMM
3b METRONOME Ilan [email protected]
Metrology for Emerging Technologies
ECS PTEMM
4 VIZTA Laurent Dugoujon [email protected]
Vision and Identification Z-sensing Technology and Applications
ECS PTEMM
5 THERADD Livio Baldi [email protected] detector via integration of antenna and image sensor
ECS PTEMM
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Pitches / Project proposals
Pitch # Project proposal Presenter Contact email Topic SRA Chapter
6 BIOIMAGO Livio Baldi [email protected] sensor and silicon NW for RT images of cell potential Health and Well-Being
7 MEMS4HEALTH Ronald Dekker [email protected] technology platforms for BioMEMS 4.0
Health and Well-Being
8 NEXTGAN Michael Salter [email protected]
NexGen III-V components via innovative materials and process technology
Energy
9 DC-mG Alessio Iovine [email protected] of a smart electrical DC MicroGrid
Energy
10 DAFNE Giulio Vivo [email protected] layered IIoT platform for process improvements
Digital Industry
11 ERPA Olli Ventä [email protected] Efficient & Reliable Predictive Analytics
Digital Industry
11a Florian Schreiner [email protected]
1) OPC UA over TSN Autoconfig, 2) vPLC Edge Orchestration
Digital Industry
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Pitch # Partner Presenter Contact email Topic SRA Chapter
12 AMAT Victor Acinas Garzon [email protected]
Partner offering for solar, Industry 4.0 and printed electronics
ECS PTEMM
13 OSAI Alice Tori [email protected] sensors calibration and testing and laser applications
ECS PTEMM
14 XTPL Alessio Gerardo Maugeri [email protected] printing of conductive lines
ECS PTEMM
15 ISD Livio Baldi [email protected]
Hardened components HW, SW and systems for automotive and spaceAR for homeland security
SCADI
16 ADGENERA Livio Baldi [email protected]
Smart Systems, Wearables, LP communications, Energy Harvesting, Sensor Fusion
SCADI
17 DCX Jan Lisowski [email protected] Liquid Cooling system Computing and
StoragePitch / Running projectPitch # Pitch title Presenter Contact email Topic SRA Chapter
18 TETRAMAX Rainer Leupers [email protected]
Technology Transfer via Multinational Application Experiments - low-energy computing for cyber physical systems and the internet of things
Computing and Storage
Pitches / Partnership proposals
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Pitches available on ECS Collaboration Tool (1/2)
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Pitches available on ECS Collaboration Tool (2/2)
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In-Depth Project DiscussionsSchedule
Room 2.41
13:30 – 14:00 TETRAMAXProf. Dr. Rainer LeupersRWTH Aachen University
14:00 – 14:30 NextGanMichael SalterRISE Acreo AB
14:30 – 15:00 DAFNEGiulio VivoCRF
Room 2.42
ID# + time slotID#
Floorplan
For more information
www.aeneas-office.org
Thank you