LevioContactless pick & place machine
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Die ejection module
The die ejection module implemented in
Levio allows for completely contactless
die ejection of dies from adhesive tape.
Die ejection is one of the process steps
where defects can mostly arise. With
contactless technology you can
completely avoid contact-induced
imperfections.
Available for wafer sizes from 4’’ to 12’’
with multiple substrate materials and
thickness possible.
Technical information is subject to change without prior notice
Contactless process
Levio allows to perform a complete
process, from wafer to carrier or from
carrier to carrier, completely contactless.
The component can be picked up from a
wafer or input carrier, inspected and
placed into a wide range of output
carriers. All of this while never touching
the upper surface.
This allows for a cleaner process with a
sensibly higher yield and quality.
Technical information is subject to change without prior notice
Pick up
contactless
Contactless
Transport Autocenter and
Place
Completely contactless handling
Touchless Automation novel technlogy
allows for contactless manipulation of
components of any material.
Thanks to its combination of air
streams and pressure, it can levitate
components and manipulate them with
the utmost care.
Discover more on the technology on
touchless-automation.ch
Technical information is subject to change without prior notice
Autocentering
The contactless technology allows to
center the component to the tip of the
handling tool automatically, without the
need for mechanical tools or expensive
vision modules. The reason behind lies
in the very physical phenomena being
exploited.
Inspection and placing can be
performed in a quicker and more reliable
way.
Technical information is subject to change without prior notice
Multiple input and output modules
Your process could lead to many
different paths and your components
would need to be handled with many
different carriers.
For this reason Levio was designed with
multiple input and output to better fit with
your existing facilities, machines and
suppliers.
Special input and output carriers could
be implemented upon request.
Technical information is subject to change without prior notice
Multiple applications
Touchless Automation technology has
been able to succesfully manipulate
components of any material and a wide
range of shapes.
This capability, together with Aatec
expertise in process development and
automation, allows Levio to be easily
implemented in your already existing
process and evolve it.
Imaging Sensors
LEDLenses
VCSEL Laser diodes
MEMS
Technical information is subject to change without prior notice
Touchless Automation GmbH
Rue David Moning, 8
2504 Biel/Bienne, Switzerland
Your direct contact
Maurizio Migliore, COO
Mobile: +41 (0) 78 405 63 31
Fax: +41 (0) 32 343 60 39
Email: [email protected]
www.smt-equipment.com www.touchless-automation.ch
•Welded Frame/Base plate with safety
protection and electronic cabinet
•Doors on both side
• Touch screen HMI
•Die ejection module with xy dynamic
•Contactless pick up head
•High precision motion control/positioning
•CE Marking
•UPH: 1000-1500 parts/hour
Base equipment
• Inputs:
Wafer from 4’’ to 12’’
Up to 6 waffle trays 4’’
Up to 20 waffle trays 2’’
2 Jedec trays
•Outputs:
Up to 6 waffle/Gel Pak trays 4’’
Up to 20 waffle/Gel Pak trays 2’’
2 Jedec trays
Tape & Reel module (optional)
• Flip module (optional)
• Vision inspection module (top/bottom)
Features
• Any size from 0.5x0.5mm to 10x10mm
• Any material (GaAs, GaN, Glass, …)
•Delicate surfaces and MEMS
Components
• Voltage 220-240 VAC / 12A Max
• Air pressure 6 Bars max
• Dimensions:
o L = 1200mm
o W= 1150mm
o H = 1700mm
•Weight: 600 kg
Dimension and requirements