11
Soldering & handling
Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc.
Cree, Inc.4600 Silicon Drive
Durham, NC 27703USA Tel: +1.919.313.5300
CLD
-CTA
P001 R
ev 22Cree® High‑Brightness LED
Soldering & Handling
FeaturesThe purpose of this document is to provide customers and users with a clear understanding about the ways to use our LeD lamps
appropriately.
DescriptionGenerally, LeDs can be used the same way as other general-purpose semiconductors. When using Cree’s Lamps, the following
precautions must be taken to protect the LeD.
P2 anD P4 LEDS
1. Cleaning
• Don’tuseunspecifiedchemicalliquidstocleantheLED;thechemicalcouldharmtheLED.Whenwashingisnecessary,please
wipetheLEDwithalcoholatnormalroomtemperatureanddryatnormalroomtemperaturefor15 minutesbeforeuse.
• TheinfluenceofultrasoniccleaningontheLEDsdependsonfactorssuchasultrasonicpowerandthewaytheLEDsaremounted.
Ultrasoniccleaningshouldbepre‑qualifiedtoensurethiswillnotcausedamagetotheLEDs.
2. Forming
• Duringleadsforming,theleadsshouldbebentatapointatleast3 mmfromthebaseofthepackage.
• Don’tformtheleadsduringoraftersoldering.Ifformingisrequired,thismustbedonebeforesoldering.
• Avoid stressing the LeD package during leads forming.
• When mounting the LeDs onto a PCB, the PCB holes must be aligned exactly with the lead position of the LeDs.
3. Storage
• 25 °Cand<40% RHinproperpackage
4. Soldering
• Aminimalcathodepadareaof0.18×0.18inchessquaredisrecommendedforP2LEDsand0.18×0.18inchessquared×2for
P4LEDs.
• SolderingLEDsatnotlessthan3 mmfromthebaseofthepackageandbelowthetie‑barisrecommended.
• TheLEDsolderingspecificationisshownbelow(suitableforbothleadedsolder&lead‑freesolder).
22
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2
HigH-BrigHtness LeD soLDering & HanDLing
Manual Soldering Solder Dipping
Soldering iron 35 Wmax Preheat 110 ºCmax
Temperature 300 ºCmaxPreheat time 60 secondsmax
Solder-bath temperature 260 ºCMax
Soldering time 3 secondsmax Dipping time 5 secondsmax
Position Notlessthan3 mmfromthebaseofthepackage. Position Notlessthan3 mmfromthebaseofthepackage.
• ManualsolderingontothePCBisnotrecommendedbecausesolderingtimeisuncontrollable.
• The recommended wave soldering is as below:
Differentlead‑freesolderrequiresdifferentsolderconditions.Pleasecontactusfordetails.
• Do not apply any stress to the LeD package, particularly when heated.
• TheLEDsmustnotbere usedoncetheyhavebeenextractedfromPCB.
• AfterLEDsoldering,thepackageshouldbeprotectedagainstmechanicalshockorvibrationuntiltheLEDshavereached40 ºCor
below.
• Precautions must be taken as mechanical stress on the LeDs may be caused by PCB warpage or from the clinching and cutting of
the LeD leads.
• WhenclampingofLEDsduringsolderingisrequired,itisimportanttoensurenomechanicalstressisexertedontheLEDs.
• Lead cutting must be performed at normal room temperature. Lead cutting at an elevated temperature may lead to LeD failures.
10 20 30 40 50 60 70 80 90 100 110 1200
30
150
100
300
250
200
50
Tem
pera
ture
ºC
Times (sec)
laminar wave
Fluxing
Preheat
33
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3
HigH-BrigHtness LeD soLDering & HanDLing
5. Electrostatic Discharge and Surge Current
• Electrostaticdischarge(ESD)orelectricaloverstress(EOS)maydamageLEDs.
• Precautions such as eSD wrist straps, eSD shoe straps or antistatic gloves must be worn whenever handling the LeDs.
• Alldevices,equipmentandmachinerymustbeproperlygrounded.
• ItisrecommendedtoperformelectricalteststoscreenoutESDfailuresatfinalinspection.
• It is important to eliminate the possibility of electrical overstress during circuitry design.
6. Heat Management
• HeatmanagementofLEDsmustbetakenintoconsiderationduringthedesignstageofanLEDapplication.Thecurrentshouldbe
de‑ratedappropriatelybyreferringtothede‑ratingcurveincludedineachproductspecification.
• The temperature surrounding the LeD shouldn’t be so high that it will make the LeD fail when used in an application, and the
temperaturesurroundingtheLEDintheapplicationshouldconformtothede‑ratingcurveinourLEDspecificationdocuments.
7. Other notes
• Care must be taken so that reverse voltage will not exceed the absolute maximum rating.
• Theleadsareplatedwithsolder.Leadswillbecometarnishedifincontacthydrogensulfideandothergaseouschemicals.Precautions
must be taken to maintain a clean storage atmosphere.
• The power of high-brightness LeDs is very strong and may injure human eyes. Precautions must be taken such as avoiding looking
directly into lit LeDs.
• 3-mm conventional LeDs are not auto-insertable.
SMD LEDS
1. Cleaning
• Don’tuseunspecifiedchemicalliquidstocleananSMDLED;thechemicalcouldharmtheSMDLED.Whenwashingisnecessary,
please wipe the LeD with alcohol at normal room temperature and dry at normal room temperature for 15 minutes before use.
• TheinfluenceofultrasoniccleaningontheSMDLEDdependsonfactorssuchasultrasonicpowerandthewaytheSMDLEDsare
mounted.Ultrasoniccleaningshouldbepre‑qualifiedtoensurethiswillnotdamagetheSMDLED.
2. Moisture‑Proof Packing
• In order to prevent moisture absorption into the SMD LEDs during the transportation and storage, the LEDs are packed in a
moisturebarrierbag.Desiccantsandahumidity indicatorarepackedtogetherwiththeSMDLEDsassecondaryprotection.The
humidity‑indicatorcardindicatesthehumiditywithintheSMDpacking.
3. Storage
• Do not open the sealed bag before you are ready to use the products.
44
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4
HigH-BrigHtness LeD soLDering & HanDLing
• Shelflifeintheoriginalsealedbagatthestorageconditionof≤40 ºCand≤90%RHis12months.Bakingisrequiredwhenevershelf
life is expired.
• Before opening the sealed bag, please check whether or not the bag leaked air.
• Afteropeningthesealedbag,theSMDLEDmustbestoredunderthecondition<30 ºCand<60%RH.Undertheseconditions,the
SMDLEDsmustbeused(subjecttoreflow)within24hoursafterbagopening,andbakingisrequiredwhenexceeding24hours.
• Forbaking,placetheSMDLEDsinanovenat80 ºC±5 ºCandrelativehumidity<=10%RHfor24hours.
• Takethematerialoutofthepackagingbagforre‑bake.Donotopentheovendoorfrequentlyduringthebakingprocess.
• Pleaserefertotheproductspecificationsformoredetailedinformation.
4. SolderingManual soldering by soldering iron
• Since the temperature of manual soldering is not stable, manual soldering by soldering iron is not recommended.
• Ifmanualsolderingisnecessary,theuseofasolderingironoflessthan25 Wisrecommended,andthetemperatureoftheironmust
bekeptatbelow315 ºC,withsolderingtimewithin2seconds.
• TheepoxyresinoftheSMDLEDshouldnotcontactthetipofthesolderingiron.
• NomechanicalstressshouldbeexertedontheresinportionoftheSMDLEDduringsoldering.
• HandlingoftheSMDLEDshouldbedonewhenthepackagehasbeencooleddowntobelow40 ºCorless.ThisistopreventLED
failures due to thermal-mechanical stress during handling.
Reflow Soldering
• The temperature profile (1) is as below (for SMD LED CLV1A‑FKB/CLV1L‑FKB/CLV6B‑FKB/CLV6D‑FKB/CLX6B‑FKC/CLX6C‑FKB/
CLX6D‑FKB/CLX6E‑FKC/CLX6F‑FKC/CLY6C‑FKC/CLY6D‑FKC/CLYBA‑FKA):
Document No.: CREE-05-0057 Rev. NO. : 17
6/11
Use all SMD besides LP6-NPP1-01-N1 Solder = Sn63-Pb37 Solder = Lead-free
Average ramp-up rate = 4ºC/s max. Average ramp-up rate = 4ºC/s max
Preheat temperature = 100ºC ~150ºC Preheat temperature = 150ºC ~200ºC
Preheat time = 120s max. Preheat time = 120s max.
Ramp-down rate = 6ºC/s max. Ramp-down rate = 6ºC/s max.
Peak temperature = 230ºC max. Peak temperature = 250ºC max.
Time within 5ºC of actual Peak Temperature = 10s max. Time within 5ºC of actual Peak Temperature = 10s max.
Duration above 183ºC is 60s max. Duration above 217ºC is 60s max. Only use LP6-NPP1-01-N1 Solder = Low Lead-free
Average ramp-up rate = 3ºC/s max.
Preheat temperature = 130ºC ~170ºC
Preheat time = 120s max.
Ramp-down rate = 6ºC/s max.
Peak temperature = 213ºC max.
Time within 3ºC of actual Peak Temperature = 25s max.
Duration above 200ºC is 40s max.
Recommended solder pad design for heat dissipation (LM1 series):
0.5
7.5
7.0
4.5
2.6
1.5
Meltingpoint
Pre-heat Reflow Cooling
Time
Tem
pera
ture
55
Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc.
5
HigH-BrigHtness LeD soLDering & HanDLing
Solder
Average ramp-up rate 4 ºC/secondmax.
Preheat temperature 150 ºC~200 ºC
Preheat time 120 seconds max.
Ramp-down rate 6 ºC/secondmax.
Peak temperature 250 ºCmax.
Timewithin5 ºCofpeaktemperature 10 seconds max.
Durationabove217 ºC 60 seconds max.
• Thetemperatureprofile(2)isasbelow(forSMDLEDCLMVB‑DKA/CLMVB‑FKA/CLMVC‑FKA/CLMUC‑FKA/CLP6CFKB/CLV1S‑FKB/
CLV6A‑FKB/CLX6A‑FKB/CLVBA‑FKAandotherproductsnotlistedherein):
Solder
Average ramp-up rate 4 ºC/smax.
Preheat temperature 150 ºC~200 ºC
Preheat time 120 seconds max.
Ramp-down rate 6 ºC/smax.
Peak temperature 235 ºCmax.
Timewithin5 ºCofpeaktemperature 10 seconds max.
Durationabove217 ºC 45secondsmax.
Meltingpoint
Tem
pera
ture
Time
Pre-heat CoolingReflowSoak
66
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6
HigH-BrigHtness LeD soLDering & HanDLing
Theunitsinthegraphsbelowareinmillimeters(mm).
LM1 series recommended solder-pad design for heat dissipation:
LM4 & LM2 series recommended solder-pad design for heat dissipation:
LV1 & La1 & LVB series recommended solder-pad design for heat dissipation:
5/13
� The unit is millimeter (mm) in the graphs below. � LM1 series recommended solder pad design for heat dissipation:
7.5
0.5
7.0
2.6
4.5
1.5
1.5
� LM4 & LM2 series recommended solder pad design for heat dissipation:
7.50.5
7.0
0.4
4.51.5 1.5
2.6
1.1
� LV1 & LA1 & LVB series recommended solder pad design for heat dissipation:
9.5
1.52.52.50.5
7.0
0.4
0.5
3.3
1.65
2.6
1.1
4.51.5 1.5
� LP6 series recommended solder pad design for heat dissipation:
5/13
� The unit is millimeter (mm) in the graphs below. � LM1 series recommended solder pad design for heat dissipation:
7.5
0.5
7.0
2.6
4.5
1.5
1.5
� LM4 & LM2 series recommended solder pad design for heat dissipation:
7.50.5
7.0
0.4
4.51.5 1.5
2.6
1.1
� LV1 & LA1 & LVB series recommended solder pad design for heat dissipation:
9.5
1.52.52.50.5
7.0
0.4
0.5
3.3
1.65
2.6
1.1
4.51.5 1.5
� LP6 series recommended solder pad design for heat dissipation:
5/13
� The unit is millimeter (mm) in the graphs below. � LM1 series recommended solder pad design for heat dissipation:
7.5
0.5
7.0
2.6
4.5
1.5
1.5
� LM4 & LM2 series recommended solder pad design for heat dissipation:
7.50.5
7.0
0.4
4.51.5 1.5
2.6
1.1
� LV1 & LA1 & LVB series recommended solder pad design for heat dissipation:
9.5
1.52.52.50.5
7.0
0.4
0.5
3.3
1.65
2.6
1.1
4.51.5 1.5
� LP6 series recommended solder pad design for heat dissipation:
5/13
� The unit is millimeter (mm) in the graphs below. � LM1 series recommended solder pad design for heat dissipation:
7.5
0.5
7.0
2.6
4.5
1.5
1.5
� LM4 & LM2 series recommended solder pad design for heat dissipation:
7.50.5
7.0
0.4
4.51.5 1.5
2.6
1.1
� LV1 & LA1 & LVB series recommended solder pad design for heat dissipation:
9.5
1.52.52.50.5
7.0
0.4
0.5
3.3
1.65
2.6
1.1
4.51.5 1.5
� LP6 series recommended solder pad design for heat dissipation:
5/13
� The unit is millimeter (mm) in the graphs below. � LM1 series recommended solder pad design for heat dissipation:
7.5
0.5
7.0
2.6
4.5
1.5
1.5
� LM4 & LM2 series recommended solder pad design for heat dissipation:
7.50.5
7.0
0.4
4.51.5 1.5
2.6
1.1
� LV1 & LA1 & LVB series recommended solder pad design for heat dissipation:
9.5
1.52.52.50.5
7.0
0.4
0.5
3.3
1.65
2.6
1.1
4.51.5 1.5
� LP6 series recommended solder pad design for heat dissipation:
5/13
� The unit is millimeter (mm) in the graphs below. � LM1 series recommended solder pad design for heat dissipation:
7.5
0.5
7.0
2.6
4.5
1.5
1.5
� LM4 & LM2 series recommended solder pad design for heat dissipation:
7.50.5
7.0
0.4
4.51.5 1.5
2.6
1.1
� LV1 & LA1 & LVB series recommended solder pad design for heat dissipation:
9.5
1.52.52.50.5
7.0
0.4
0.5
3.3
1.65
2.6
1.1
4.51.5 1.5
� LP6 series recommended solder pad design for heat dissipation:
77
Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc.
7
HigH-BrigHtness LeD soLDering & HanDLing
LP6 series recommended solder-pad design for heat dissipation:
LU6 series recommended solder-pad design for heat dissipation:
Small‑top SMD LM3 series recommended solder-pad design for heat dissipation:
Note
Metalareaat1,2,3shouldnot
be less than 40 mm2 each for
sufficientheatdissipation.
6/13
1.60.
5
2.0
4
5
3
2
8.4
6
A
1
6.6
2.0
2.43.0
� LU6 series recommended solder pad design for heat dissipation:
4.71.65 1.4
0.8
0.3
5
9.4
9.5
4.01
.8
4
5
3
2
61
� Small Top SMD LM3 series recommended solder pad design for heat dissipation:
� Mini side 0.8mm SMD LS8 series recommended solder pad design for heat dissipation:
� LA6 series recommended solder pad design for heat dissipation:
Note:
Metal area at 1, 2, 3 should not
be less than 40mm2 each for
sufficient heat dissipation.
1.3
4.0
9.3
1.3
2.2
1.55
4.4
1.0
0.9
1.4
3.81.0
Note:
Metal area at 1, 2, 3 should not
be less than 16mm2 each for
sufficient heat dissipation.
Note
Metal area at 1, 2, 3 should not
be less than 16 mm2 each for
sufficientheatdissipation.
6/13
1.60.
5
2.0
4
5
3
2
8.4
6
A
1
6.6
2.0
2.43.0
� LU6 series recommended solder pad design for heat dissipation:
4.71.65 1.4
0.8
0.3
59.4
9.5
4.01
.8
4
5
3
2
61
� Small Top SMD LM3 series recommended solder pad design for heat dissipation:
� Mini side 0.8mm SMD LS8 series recommended solder pad design for heat dissipation:
� LA6 series recommended solder pad design for heat dissipation:
Note:
Metal area at 1, 2, 3 should not
be less than 40mm2 each for
sufficient heat dissipation.
1.3
4.0
9.3
1.3
2.2
1.55
4.4
1.0
0.9
1.4
3.81.0
Note:
Metal area at 1, 2, 3 should not
be less than 16mm2 each for
sufficient heat dissipation.
6/13
1.60.
5
2.0
4
5
3
2
8.4
6
A
1
6.6
2.0
2.43.0
� LU6 series recommended solder pad design for heat dissipation:
4.71.65 1.4
0.8
0.3
5
9.4
9.5
4.01
.8
4
5
3
2
61
� Small Top SMD LM3 series recommended solder pad design for heat dissipation:
� Mini side 0.8mm SMD LS8 series recommended solder pad design for heat dissipation:
� LA6 series recommended solder pad design for heat dissipation:
Note:
Metal area at 1, 2, 3 should not
be less than 40mm2 each for
sufficient heat dissipation.
1.3
4.0
9.3
1.3
2.2
1.55
4.4
1.0
0.9
1.4
3.81.0
Note:
Metal area at 1, 2, 3 should not
be less than 16mm2 each for
sufficient heat dissipation.
6/13
1.60.
5
2.0
4
5
3
2
8.4
6
A
1
6.6
2.0
2.43.0
� LU6 series recommended solder pad design for heat dissipation:
4.71.65 1.4
0.8
0.3
5
9.4
9.5
4.01
.8
4
5
3
2
61
� Small Top SMD LM3 series recommended solder pad design for heat dissipation:
� Mini side 0.8mm SMD LS8 series recommended solder pad design for heat dissipation:
� LA6 series recommended solder pad design for heat dissipation:
Note:
Metal area at 1, 2, 3 should not
be less than 40mm2 each for
sufficient heat dissipation.
1.3
4.0
9.3
1.3
2.2
1.55
4.4
1.0
0.9
1.4
3.81.0
Note:
Metal area at 1, 2, 3 should not
be less than 16mm2 each for
sufficient heat dissipation.
6/13
1.60.
5
2.0
4
5
3
2
8.4
6
A
1
6.6
2.0
2.43.0
� LU6 series recommended solder pad design for heat dissipation:
4.71.65 1.4
0.8
0.3
59.4
9.5
4.01
.8
4
5
3
2
61
� Small Top SMD LM3 series recommended solder pad design for heat dissipation:
� Mini side 0.8mm SMD LS8 series recommended solder pad design for heat dissipation:
� LA6 series recommended solder pad design for heat dissipation:
Note:
Metal area at 1, 2, 3 should not
be less than 40mm2 each for
sufficient heat dissipation.
1.3
4.0
9.3
1.3
2.2
1.55
4.4
1.0
0.9
1.4
3.81.0
Note:
Metal area at 1, 2, 3 should not
be less than 16mm2 each for
sufficient heat dissipation.
88
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8
HigH-BrigHtness LeD soLDering & HanDLing
Mini side 0.8‑mm SMD LS8 series recommended solder-pad design for heat dissipation:
La6 series recommended solder-pad design for heat dissipation:
LB6 series recommended solder-pad design for heat dissipation:
6/13
1.60.
5
2.0
4
5
3
2
8.4
6
A
1
6.6
2.0
2.43.0
� LU6 series recommended solder pad design for heat dissipation:
4.71.65 1.4
0.8
0.3
5
9.4
9.5
4.01
.8
4
5
3
2
61
� Small Top SMD LM3 series recommended solder pad design for heat dissipation:
� Mini side 0.8mm SMD LS8 series recommended solder pad design for heat dissipation:
� LA6 series recommended solder pad design for heat dissipation:
Note:
Metal area at 1, 2, 3 should not
be less than 40mm2 each for
sufficient heat dissipation.
1.3
4.0
9.3
1.3
2.2
1.55
4.4
1.0
0.9
1.4
3.81.0
Note:
Metal area at 1, 2, 3 should not
be less than 16mm2 each for
sufficient heat dissipation.
6/13
1.60.
5
2.0
4
5
3
2
8.4
6
A
1
6.6
2.0
2.43.0
� LU6 series recommended solder pad design for heat dissipation:
4.71.65 1.4
0.8
0.3
5
9.4
9.5
4.01
.8
4
5
3
2
61
� Small Top SMD LM3 series recommended solder pad design for heat dissipation:
� Mini side 0.8mm SMD LS8 series recommended solder pad design for heat dissipation:
� LA6 series recommended solder pad design for heat dissipation:
Note:
Metal area at 1, 2, 3 should not
be less than 40mm2 each for
sufficient heat dissipation.
1.3
4.0
9.3
1.3
2.2
1.55
4.4
1.0
0.9
1.4
3.81.0
Note:
Metal area at 1, 2, 3 should not
be less than 16mm2 each for
sufficient heat dissipation.
7/13
0.8
0.7
0.8
2.9
0.3
4.51.5 1.5
� LB6 series recommended solder pad design for heat dissipation:
1.5
1.4
1.5
5.2
0.4
7.4
1.8 3.8
� LT6 series recommended solder pad design for heat dissipation:
2.7
0.65
2.6
0.7
0.851.0
0.3
� LMV series recommended solder pad design for heat dissipation:
7/13
0.8
0.7
0.8
2.9
0.3
4.51.5 1.5
� LB6 series recommended solder pad design for heat dissipation:
1.5
1.4
1.5
5.2
0.4
7.4
1.8 3.8
� LT6 series recommended solder pad design for heat dissipation:
2.7
0.65
2.6
0.7
0.851.0
0.3
� LMV series recommended solder pad design for heat dissipation:
99
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9
HigH-BrigHtness LeD soLDering & HanDLing
LT6 series recommended solder-pad design for heat dissipation:
LMV series recommended solder-pad design for heat dissipation:
7/13
0.8
0.7
0.8
2.9
0.3
4.51.5 1.5
� LB6 series recommended solder pad design for heat dissipation :
1.5
1.4
1.5
5.2
0.4
7.4
1.8 3.8
� LT6 series recommended solder pad design for heat dissipation :
� LMV series recommended solder pad design for heat dissipation :
2.7
0.65
2.6
0.7
0.851.0
0.3
8/13
0.8
0.8
1.9
2.51 1
� LMU series recommended solder pad design for heat dissipation:
0.8
0.8
1.9
2.5
1 1
� LV6 series recommended solder pad design for heat dissipation:
1.7
5.65
1.3
1.7 0.
475
8.2
2.7 2.8
� LX6 series recommended solder pad design for heat dissipation:
1010
Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc.
10
HigH-BrigHtness LeD soLDering & HanDLing
LMU series recommended solder-pad design for heat dissipation:
LV6 series recommended solder-pad design for heat dissipation:
8/13
0.8
0.8
1.9
2.51 1
� LMU series recommended solder pad design for heat dissipation:
0.8
0.8
1.9
2.5
1 1
� LV6 series recommended solder pad design for heat dissipation:
1.7
5.65
1.3
1.7 0.
475
8.2
2.7 2.8
� LX6 series recommended solder pad design for heat dissipation:
8/13
0.8
0.8
1.9
2.51 1
� LMU series recommended solder pad design for heat dissipation:
0.8
0.8
1.9
2.5
1 1
� LV6 series recommended solder pad design for heat dissipation:
1.7
5.65
1.3
1.7 0.
475
8.2
2.7 2.8
� LX6 series recommended solder pad design for heat dissipation:
1111
Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc.
11
HigH-BrigHtness LeD soLDering & HanDLing
LX6 series recommended solder-pad design for heat dissipation:
LY6 series recommended solder-pad design for heat dissipation:
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� LY6 series recommended solder pad design for heat dissipation:
� Modification of an SMD LED is not recommended after soldering. If modification cannot be avoided, the modifications
must be pre-qualified to avoid damaging SMD LED.
� Reflow soldering should not be done more than one time.
� No stress should be exerted on the package during soldering.
� The PCB should not be wrapped after soldering to allow natural cooling down to 40ºC.
1.6
1.8
5.0
2.8
0.350.
70.
70.
7
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� LY6 series recommended solder pad design for heat dissipation:
� Modification of an SMD LED is not recommended after soldering. If modification cannot be avoided, the modifications
must be pre-qualified to avoid damaging SMD LED.
� Reflow soldering should not be done more than one time.
� No stress should be exerted on the package during soldering.
� The PCB should not be wrapped after soldering to allow natural cooling down to 40ºC.
4.0
1.6
1.6
1.8
5.0
2.8
0.350.
70.
70.
7
0.5
0.5
0.5
0.40
1.2
2.3
1212
Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc.
12
HigH-BrigHtness LeD soLDering & HanDLing
• ModificationofanSMDLED isnot recommendedaftersoldering. Ifmodificationcannotbeavoided, themodificationsmustbe
pre‑qualifiedtoavoiddamagingtheSMDLED.
• Reflowsolderingshouldnotbedonemorethanonetime.
• No stress should be exerted on the package during soldering.
• ThePCBshouldnotbewrappedaftersolderingtoallownaturalcoolingdownto40°.
5. Important notes (Small‑top and Mini‑side 0.8‑mm SMD Products)
• ThepackagingsizesoftheseSMDproductsareverysmallandtheresinisstillsoftaftersolidification.Usersarerequiredtohandle
withcare.NevertouchtheresinsurfaceofSMDproducts.
• Toavoiddamaging theproduct’ssurfaceand interiordevice, it is recommendedtochooseaspecialnozzle topickup theSMD
productsduringtheprocessofSMTproduction. Ifhandlingisnecessary,takespecialcarewhenpickinguptheseproducts.The
following two methods are necessary:
Fig.1a:ForSmallTopSMD Fig.1b:ForMini‑slde0.8 mmSMD
• SMDnozzle
For example: CLA1B
Forsilicone‑coveredSMDLEDs, it is recommended tousenon‑metallicnozzles.CreeandseveralofCree’scustomershavehad
successusingnozzlesfabricatedfromTeflonorfrom90durethane.
Document No.: CREE-05-0057 Rev. NO. : 16
9/9
pick up SMD products during the process of SMT production . If handling is necessary, it should take more
careful to pick up these products. The following two methods are necessary :
Fig. 1a: For Small Top SMD Fig. 1b: For Mini side 0.8mm SMD
For Small Top SMD series , it is recommended to use rubber material Nozzle to pick up SMD products .Two
figure size for reference : a.) Circular Nozzle: inner diameter: Ø1.8mm+/-0.05mm, outer diameter: Ø2.3mm+/-0.05mm.
b.) Rectangle Nozzle: inner size: 1.3mm x 2.3mm, outer size > SMD size.
6. Electrostatic Discharge and Surge current Electrostatic discharge (ESD) or surge current (EOS) may damage SMD LED.
Precautions such as ESD wrist strap, ESD shoe strap or antistatic gloves must be worn whenever handling of SMD LED.
All devices, equipment and machinery must be properly grounded.
It is recommended to perform electrical test to screen out ESD failures at final inspection.
It is important to eliminate the possibility of surge current during circuitry design
7. Heat Management
Heat management of SMD LED must be taken into consideration during the design stage of SMD LED application. The
current should be de-rated appropriately by referring to the de-rating curve attached on each product specification. Data is subject to change without prior notice.
1313
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• Items to notice before opening the bag:
1. Checktheshelflife(countingfromtheFQCstampingdateontheproductlabel).Iftheshelflifeisover12months,re‑bakingis
required.
2. RecordthelotnumberoftheSMDproducttoaidinvestigation.
3. Avoidexternaldamagetothepackagingbagafterproductistakenoutofthebox.Forexample,manySMDproductsarestacked
withoutbox;re‑packingwithbubbleplasticbagforprotectionisrecommended.
4. Before opening the vacuum-sealed bag, check for air leakage.
5. Recommendation for product opening and storage: use scissors to cut the bag along the sealing mark in order to re-pack
convenientlyforproductnottobeusedwithin24hours.
1414
Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc.
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• Items to notice after opening the bag:
1. Checkthecolorofthehumidity‑indicationcard(30%RH)atthetimeofopeningthevacuum‑sealedbag.Ifthecolorisslight
greenorblue,bakingisrequiredbeforeusage.
2. Record the date and time on the reel.
3. Theproductshouldbeusedwithin24hours.
4. IfSMDproductscan’tbeusedwithin24hours,theyshouldbere‑packedinavacuum‑sealedbag.Beforeattemptingtouseagain,
bakingisrequired.
• Bakingisrequiredwhenthefollowingconditionsoccur:
1. Shelflifehasexpired(over12months).
2. The vacuum-sealed bag has an air leak.
3. Thehumidity‑indicationcardhaschangecolorat30%RHatthetimeofopeningthevacuum‑sealedbag.
4. Thevacuum‑sealedbaghasbeenopened,butthestepslistedunder“Noticeitemsafteropeningthebag”(above)havenotbeen
followed.
• Baking method:
1. TheSMDLEDshouldnotbebakedwithinthepackagingbag.Thebakingconditionis80 ºCfor24hours.Theovendoorshould
notbeopenedfrequentlyduringthebakingprocess.
2. Refer to the photo below for a baking model that can help avoid reel deformation.
Color changeNormal
1515
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For small reels For large reels
3. Bakedproductsshouldcooldownto40 ºCintheovenbeforebeingremovedforuse.
6. Electrostatic Discharge and Electrical Overstress
• Electrostaticdischarge(ESD)orelectricaloverstress(EOS)maydamageanSMDLED.
• PrecautionssuchasESDwriststraps,ESDshoestrapsorantistaticglovesmustbewornwheneverhandlingSMDLEDs.
• Alldevices,equipmentandmachinerymustbeproperlygrounded.
• ItisrecommendedtoperformelectricaltesttoscreenoutESDfailuresatfinalinspection.
• It is important to eliminate the possibility of electrical overstress during circuitry design.
7. Heat ManagementHeatmanagementofSMDLEDsmustbetakenintoconsiderationduringthedesignstageofSMDLEDapplications.Thecurrentshould
bede‑ratedappropriatelybyreferringtothede‑ratingcurveincludedineachproductspecification.
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Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc.
16
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8. SMD Screen Product Moisture Sensitivity Level
Product Family P/n Moisture Sensitivity Level
SMDLEDs
CLMVB‑DKA
5a
CLMVB‑FKA
CLMVC‑FKA
CLMUC‑FKA
CLP6C‑FKB
CLV1A‑FKB
CLV1L‑FKB
CLV1S‑FKB
CLV6A‑FKB
CLV6B‑FKB
CLV6D‑FKB
CLVBA‑FKA
CLX6A‑FKB
CLX6B‑FKC
CLX6C‑FKB
CLX6D‑FKB
CLX6E‑FKC
CLX6F‑FKC
CLY6C‑FKC
CLY6D‑FKC
CLYBA‑FKA
The information in this document is subject to change without notice.