Crystal development Water jet cutting Glass glue bonding Diffusion bonding Large diameter boule growth Thermal stress analysis Reproducible growth of high optical quality crystals achieved. Stress fracture during fabrication arose as a new issue. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 cm Laser polish surfaces are activated with a basic solution such as KOH Bonds are permanent, optically transparent, and can withstand temperatures up to 1000 °C “Super” polished surfaces are optically contacted and heated to allow thermal diffusion Phase errors occur in bond region – thought to be thermally stress induced. 2.7 1.35 0 2.7 1.35 0 Water based non-thermal erosion using high pressure water in a thin stream ~ 1 mm thick. Stresses frozen into crystals during growth Analysis of the stress gives optimal cutting geometry for boules Current Slabs 6.5 cm Czochralski crystals grown No bonding required for full size Mercury slabs (Central Coast Gem Lab, Inc., Santa Maria, CA) (Onyx Optics, Inc., Dublin, CA) (Material Science Dept., UC Davis) (Schott Glass Technologies, Durea, PA) (Northrup Grumman / LLNL collaboration) This work was performed under the auspices of the U. S. Department of Energy by the University of California, Lawrence Livermore National Laboratory under Contract No. W-7405-Eng-48.
Transcript
Crystal development
Water jet cutting
Glass glue bonding
Diffusion bonding
Large diameter boule growth
Thermal stress analysis
Reproducible growth of high optical quality crystals achieved. Stress fracture during fabrication arose as a new issue.
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15cm
Laser polish surfaces are activated with a basic solution such as KOH
Bonds are permanent, optically transparent, and can withstand temperatures up to 1000 °C
“Super” polished surfaces are optically contacted and heated to allow thermal diffusion
Phase errors occur in bond region – thought to be thermally stress induced.
2.7
1.35
0
Static
2.7
1.35
0
Static
Water based non-thermal erosion using high pressure water in a thin stream ~ 1 mm thick.
Stresses frozen into crystals during growth
Analysis of the stress gives optimal cutting geometry for boules
CurrentSlabs
6.5 cm Czochralski crystals grown
No bonding required for full size Mercury slabs
(Central Coast Gem Lab, Inc., Santa Maria, CA)
(Onyx Optics, Inc., Dublin, CA)
(Material Science Dept., UC Davis)
(Schott Glass Technologies, Durea, PA)
(Northrup Grumman / LLNL collaboration)
This work was performed under the auspices of the U. S. Department of Energy by the University of California, Lawrence Livermore National Laboratory under Contract No. W-7405-Eng-48.
Technological advancements on the Mercury laser
Phase correction
LiquidAlcohol
Alcoholvapor
Substrate
Etchantsolution
HeNe
Capabilities: Maximum P-V modulation 7 microns Minimum feature size ~ 1 mm Plate size 30 x 30 cm2
Plate thickness > 300 m
Compensates for static phase distortions in S-FAP slabs, system optics, front end, as well as point operation thermal correction
With phasecorrector
Without phasecorrector
Front end
Far fields from amplifier alone:
Full system far fields:
With phasecorrector
Without phasecorrector
Fountain head etch tool
49% Energy in 5 TDL 7% Energy in 1 TDL
83% Energy in 5 TDL 15% Energy in 1 TDL
98% Energy in 5 TDL 15% Energy in 1 TDL
92% Energy in 5 TDL39% Energy in 1 TDL
90% Energy in 5 TDL 12% Energy in 1 TDL
Real time damage diagnostic
Record background image
Convert image to binary / blob analysis
Subtract background
Record shot
Shut down laser
Blob size above threshold
Blob size below threshold
Temporal Energy FarField
NearField
DarkField
Temporal Energy FarField
NearField
DarkField
a) b) c) d) f) g)
(a-f) Evolution of damage at 10 Hz and (g) the static near field (V-shaped cutouts are due to a fracture in phase plate.)
Background image Image with damage
Image with background subtracted Threshold increased
300 um spot
1 mm spot
Background image
Binary imagewith thresholding
Damage image
Damage - Background
A damage diagnostic algorithm allows automatic damage detection without user intervention.
Nearfield
w/ block
“Dark field" image
beam blockNearfield
w/ block
Nearfield
w/ block
“Dark field" image
beam blockbeam blockDark field
NearfieldNearfieldNearfield
Bright field
Dark field analysis (detects high spatial frequency damage)
Bright field analysis (detects low spatial frequency damage)
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