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Curing of a paint on a localized area

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rinse of the wet autodeposited coating film. CURING OF A PAINT ON A LOCALIZED AREA U.S. Patent 6,033,517. Mar. 7, 2000 D.M. Chenetski, assignor to Honda of America Mfg. Inc., Marysville, Ohio A method of protecting at least one component on an object from excessive heating during curing of paint on a localized area of the object by exposure of the localized area to a heat source, the method including forming an airpocket adjacent the at least one compo- nent; forming an inlet and an out- let in the airpocket; and circulat- ing air through the air pocket by feeding in cold air through the inlet. PLATINGAPPARATUS U.S. Patent 6,033,540. Mar. 7, 2000 K. Kosaki and M. Tamaki, assignors to Mitsubishi Denki KK, Tokyo A plating apparatus comprising a plating tank suitable for holding a wafer so that a plating surface of the wafer faces upward; plating solution supply means for causing a plating solution supplied to the plating surface of the wafer to flow from a center of the plating surface of the wafer toward a pe- riphery of the plating surface of the wafer; and an annular mesh anode electrode having a central aperture and a plurality of open- ings surrounding the central ap- erture, the annular anode elec- trode being disposed opposite the wafer for generating an electric field between the anode electrode and the wafer, using the wafer as a cathode, the electric field having a lower density in a central por- tion of the wafer than at an edge of the wafer. ROTATING ELECTHODEPOSITION SYSTEM U.S. Patent 6,033,548. Mar. 7, 2000 S. Akram, and D.R. Hembree, assignors to Micron Technology Inc., Boise, Idaho A rotating system and method for electrodepositing materials on semiconductor wafers. HIGH TEMPERATURE RESISTANT COATING U.S. Patent 6,034,178. Mar. 7, 2000 O.H. Decker, and C.P. Tarnoski, assignors to Morton International Inc., Chicago Ultrasonic cleaning / ultrasonic rinsing / hot air drying Multiple rinses - Tap & DI or Counter-Flowing Combine with Pump/Filter Systems Powerful squarewave ultrasonics available in 40 or 80 Khz Compact - 12" x 18" x 46" (power generator in separate cabinet) 4 Chambers 10" x 12" x 8" ea Stainless steel construction 1 yr/2 yr/Ufe Warranty Over 25 years of Service P.O. Box 734 450 W. Taft Drive, South Holland, IL 60473 800-276-2466 esmainc @ ameritech.net www.esmainc.com Circle 035 on reader information card J X-MET ® 970 For fastand accuratereal-time analysis ~ f thin and ultra-thin cn~tin~, films orpaper Ruggedsyster~ inharsh, even For on-site, or ~o~.atr addil @n-Line Pr@¢ess for p|a¢ing s@|u¢i@ns meCa| ©@aCdnN ChJcNness .~ Metorex ~ C-9 For fast monitoring and automaticprecisecontrol of plating baths Rugged and durable construction onal )n See etorex.c, Circle 088 on reader information card April 2001 97
Transcript

rinse of the wet autodeposi ted coating film.

CURING OF A PAINT ON A LOCALIZED AREA U.S. Patent 6,033,517. Mar. 7, 2000 D.M. Chenetski, assignor to Honda of America Mfg. Inc., Marysville, Ohio

A method of protecting at least one component on an object from excessive heating during curing of paint on a localized area of the object by exposure of the localized area to a heat source, the method including forming an airpocket adjacent the at least one compo- nent; forming an inlet and an out- let in the airpocket; and circulat- ing air through the air pocket by feeding in cold air through the inlet.

PLATING APPARATUS U.S. Patent 6,033,540. Mar. 7, 2000 K. Kosaki and M. Tamaki, assignors to Mitsubishi Denki KK, Tokyo

A plating apparatus comprising a plating tank suitable for holding a wafer so that a plating surface of the wafer faces upward; plating solution supply means for causing a plating solution supplied to the plating surface of the wafer to flow from a center of the plating surface of the wafer toward a pe- riphery of the plating surface of the wafer; and an annular mesh anode electrode having a central aperture and a plurality of open- ings surrounding the central ap- erture, the annular anode elec- trode being disposed opposite the wafer for generating an electric

field between the anode electrode and the wafer, using the wafer as a cathode, the electric field having a lower density in a central por- tion of the wafer than at an edge of the wafer.

ROTATING ELECTHODEPOSITION SYSTEM U.S. Patent 6,033,548. Mar. 7, 2000 S. Akram, and D.R. Hembree, assignors to Micron Technology Inc., Boise, Idaho

A rotating system and method for e lec t rodepos i t ing ma te r i a l s on semiconductor wafers.

HIGH TEMPERATURE RESISTANT COATING U.S. Patent 6,034,178. Mar. 7, 2000 O.H. Decker, and C.P. Tarnoski, assignors to Morton International Inc., Chicago

• Ultrasonic cleaning / ultrasonic rinsing / hot air drying • Multiple rinses - Tap & DI or Counter-Flowing • Combine with Pump/Filter Systems • Powerful squarewave ultrasonics available in 40 or 80 Khz • Compact - 12" x 18" x 46" (power generator in separate cabinet) • 4 Chambers 10" x 12" x 8" ea • Stainless steel construction • 1 yr /2 yr/Ufe Warranty • Over 25 years of Service

P.O. Box 734 450 W. Taft Drive, South Hol land, IL 60473 800-276-2466 esmainc @ amer i tech.net www.esmainc .com

Circle 035 on reader informat ion card

J X-MET ® 970 • For fast and accurate real-time analysis

~ f thin and ultra-thin cn~tin~, films or paper Rugged syster~ in harsh, even For on-site, or

~ o ~ . a t r addil

@n-Line Pr@¢ess f o r p|a¢ing s@|u¢i@ns meCa| ©@aCdnN ChJcNness

. ~ Metorex ~ C-9

• For fast monitoring and automatic precise control of plating baths

• Rugged and durable construction

onal )n See etorex.c,

Circle 088 on reader informat ion card

April 2001 97

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