58
Current and Future Needs for Polymeric Materials Bob Pfahl Symposium on Polymers Tuesday, May 8, 2012
Current and Future Needs for
Polymeric Materials
Bob Pfahl
Symposium on Polymers
Tuesday, May 8, 2012
1
Outline
• Introduction
– iNEMI
– Evolving and Growing Markets
• Technical Needs for Electronic Products
– Cost, Size, Performance
– Case Studies 1, 2, and 3
• Current Market Issues
– Perspectives of the Press
– Opportunities for Development
– Case Study 4
• Concluding Thoughts
Introduction
3
About iNEMI
International Electronics Manufacturing Initiative (iNEMI) is an industry-led
consortium of around 100 global manufacturers, suppliers, industry
associations, government agencies and universities. A Non Profit Funded by
Member Dues; In Operation Since 1994.
Visit us at www.inemi.org
5 Key Deliverables:
• Technology Roadmaps
• Collaborative Deployment
Projects
• Research Priorities Documents
• Proactive Forums
• Position Papers
3 Major Focus Areas:
• Miniaturization
• Environment & Energy
• Medical Electronics
Mission: Forecast and Accelerate improvements in the Electronics
Manufacturing Industry for a Sustainable Future.
4
OEM/ODM/EMS Members
4
5
Supplier Members
5
6
Supplier Members – PWB Supply Chain
6
7
Association/Consortium, Government, Consultant &
University Members
7
pinfa
Leadership through Innovation
8
• A proven approach for identifying the technology needs and gaps of the industry through our roadmapping process
• A strong track record of developing supply chains to introduce new materials, processes, and technologies into production
• A research vision with three major thrusts:
– Miniaturization
– Energy & the Environment
– Medical Electronics
Roadmaps and Projects • Board assembly
• Final assembly
• Test, inspection & measurement
• Electronic connectors & cables
• Energy storage & conversion systems
• Interconnect substrates – ceramic
• Interconnect PCB – organic
• Mass data storage
• Optoelectronics
• Packaging & Component Substrates
• Passive components
• Photovoltaics
• RF components & subsystems
• Semiconductor technology
• MEMS/Sensors
• Solid state illumination
• Information management
• Environmentally conscious electronics
• Modeling, simulation & design tools
• Thermal management
• Medical Electronics
• Large area, flexible electronics
Roadmaps •Open to Industry
•Cover Entire Infrastructure
•Developed by TWGs
Projects •Open to Members
•Focus on High Priority Areas
•Managed by TIGs
Red = Both Roadmapping &
Projects
Black = Roadmapping
Optoelectronics and
Optical Storage
Organic Printed
Circuit Boards
Magnetic and
Optical Storage
Supply Chain
Management
Semiconductors
iNEMI
Information
Management
TWG
iNEMI
Mass Data
Storage TWG
iNEMI / IPC / EIPC
/ TPCA
Organic PWB
TWG
iNEMI / ITRS /
MIG/PSMA
Packaging
TWG
iNEMI
Board
Assembly
TWG
Interconnect
Substrates—Ceramic
iNEMI Roadmap
iNEMI
Optoelectronics
TWG
Fourteen Contributing Organizations
10
iNEMI / MIG
/ ITRS
MEMS
TWG
iNEMI
Passives
TWG
Statistics for the 2011 iNEMI Roadmap • > 575 participants
• > 310 companies/organizations
• 18 countries from 4 continents
• 21 Technology Working Groups (TWGs)
• 6 Product Emulator Groups (PEGs)
• > 1800 pages of information
• Roadmaps the needs for 2011-2021
• New roadmaps on:
– MEMS/Sensors
– Energy Storage & Conversion
– Aerospace & Defense
11
Impact Roadmap used by industry to identify future market & technology needs.
Used by government & research organizations to identify and fund new research initiatives to address industries needs.
Evolving and Growing Markets
for Polymeric Materials
13
Applications for Polymeric Materials
Large Volume Applications
• Enclosures
• Printed Wiring Boards
• Semiconductor Packaging Substrates/Molding
Compounds
Small-Volume, Demanding Applications
• Adhesives
• Photo resists
• 3D Semiconductor Packaging
• MEMS
• High Voltage DC
• Solid State Illumination
• Medical (particularly Implantable and Portable)
• The Cloud (optical polymers)
• Automotive
Evolving Applications/Markets
14
15
Electronic Packaging Evolution
• Packaging innovation enables “More than Moore”
– 3D packaging technologies
– Equivalent scaling through functional diversity
• Consumer market demands drive innovation in
packaging
– Size, power, cost, performance, time to market
• New materials are required to meet today’s market
demand but will enable many future advances in
packaging “all Materials are replaced every decade”
16
Electronic
Materials
$107Bn
Active
Components
$257Bn
IC Assembly
Services
$12.4Bn
Passive
Components
$213Bn
EMS
Assembly
$166Bn
2007
Finished
Equipment
$1,285Bn
VALUE CREATION IN THE SUPPLY CHAIN
Typical
Companies
Sumitomo Bakelite,
DuPont, Henkel
Intel, STMicro,
LSI Logic
Amkor,
ASE, SPIL
Tyco, Molex,
AVX, Sharp
,
Sanmina-SCI,
Flextronics,
Jabil, Hon Hai
Dell, HP, Cisco,
Nokia, Teradyne,
Visteon, Siemens
Gross
Margin40% 40% 17% 25% 6% 30%
Operating
Margin10% 10% 8% 8% 2% 8%
R&D 7% 10% 2% 3% < 1% 3%
Margin
Value$11Bn $26Bn $0.2Bn $17Bn $3Bn $103Bn
R&D
Value$5Bn $26Bn $0.2Bn $6Bn $1Bn $38Bn
ls118.273bes-chain
%Total
R&D 7% 34% 8% 51%
…
…
Specialty Materials
…
…
…
…
…
…
…
…
…
…
…
…
…
Bas
e S
tatio
ns
..
Co
al
…
…
…
…
…
…
Services
…
…
Cellu
lar
Se
rvic
e
…
…
…
…
…
Product / Systems
…
…
…
Cellu
lar P
ho
nes
Au
tom
ob
iles
…
Te
levis
ion
s
…
Subsystem
…
…
…
…
…
…
…
…
Components
Material & Energy
Producers
…
…
Hyd
ro-
ele
ctric
Nu
cle
ar
Reyn
old
s
Alc
oa
KR
UP
P
US
Ste
el
Chemicals Metal
Casting Energy Aluminum Steel
…
…
…
…
…
..
…
…
…
…
…
…
…
…
ODM/EMS
Industrial Structure
17
Technical Needs of Electronic Products
1. Cost
2. Size
3. Performance
Case Study 1: Conversion to
BFR-Free Laminates
20
Case Study
Conversion to BFR Free Glass Epoxy PCBs
• 2000 BFR Materials introduced into cell phones because
improved loss tangent offset higher material cost
• 2009-2012 iNEMI Project stimulated development of materials
to meet the need of Personal Computer OEMs (Control of Dk
and Df)
• 2012-? High end applications need improved loss tangent, but
manufacturing process reliability needs to be demonstrated.
21
Technology Needs for Organic Packaging Substrates
Priority Details Key Projects
High • ↓ CTE mismatch between Si and PKG
• Enable assembly technologies compatible with Low K Si
wafers.
• Increased I/O density for reduced pitch w/ materials, design
and manufacturing processes
Packaging
technology to
enable low K /Cu
bumped Si in CSP
High • Wafer thinning and thin wafer handling, enabling thin substrate
manufacturing and assembly
• Improved solder joint reliability
Wafer level CSP
High • Integrated advanced design tool s
– Transient thermal analysis
– Reliability and life time predictions
– Electrical analysis (power distribution, signal and power
integrity analysis)
Coordinated Si-
Package co-design
and advanced
analysis tools
High • Low cost/high yield embedding technologies
• Embedded passives and embedded active devices
• Enable testing technology for in process monitoring and EOL
testing
• New material systems and designs to enable high quality and
reliability.
Embedded
components
22
Long Term (>5 years) Strategic Gaps
Time
Horizon Details Key Projects Research Area
2014 + • ↑ I/O density of package (e.g.: reduction in
routing trace pitch)
• ↑Vertical interconnect density through via
density increase, PTH pitch and diameter
scaling
• Improve electrical performance through
tolerance control, improved alternative
Dielectric materials
• Tighter controls in manufacturing process
and cleanliness
Accelerated
package Scaling
Mfg. / Mat / Design
2011 + • Cost effective thin organic packaging with
thin die
• Standardized and fungible handling and
HVM infrastructure
Flexible system
packaging
Mfg. / Mat / Design
2012 + • Material systems and novel architectures
to mitigate electro migration risk with
reduced bump pitch and shorter bump
height
Package to Sustain
High current
density
Mat / Design
2012 + • Through wafer via structure and via
manufacturing/fill processes
• Singulation of TSV wafers and, testing of
individual dies in TSV stack
• Alternative interconnect architectures
beyond the C4 based connection
3D packaging Mfg. / Mat / Design
Case Study 2: Technology Needs
for Increased Wiring Density in
Microelectronic Packaging
Hamid Azimi
Intel Corporation
24
Industry Trends for Computing
The pace to continue to reduce form factors, deliver enhanced performance, and increase connectivity is accelerating rapidly
25
Flip Chip pervades as premier, affordable HDI packaging technology with continued growth expected beyond 2011 timeframe
Source: Yole 2011
Semiconductor Packaging Progression
26
Industry (ITRS) Scaling Trends
20
40
60
80
100
120
140
160
180
2009 2011 2013 2015 2017 2019
Die
to
Su
bstr
ate
Pit
ch (
mic
ron
s) Flip Chip peripheral, mobile, and chip array
Flip Chip PC, notebook, netbook
Flip Chip high performance
To keep pace with FLI scaling, initiated the “Wiring Density Project” to create industry-wide momentum in driving standardized substrate building blocks &
enabling economically viable solutions
27
Silicon scaling, multi-core architectures, and multi-chip packaging drive increased I/O densities Need to invest in developing & maturing new building block technologies
Increased IO Count to Support: • Increased BW
• Multiple and higher number of
interfaces
• Next Gen IO Interface
Projected I/O Density Demands
28
• Achieving higher wiring density requires co-optimization of design rules: • SRO , C4 Pad • Via and stack • Line/Space, PTH /pitch • Litho/Laser Alignment
• Advances in materials, metallization, & process technologies needed in parallel
Translating Demand into Substrate Parameters
29
Since increased wiring density translates to line space pitch reduction, smaller microvia sizes, tighter feature positioning accuracy and advanced build up materials The iNEMI project includes 4 main thrusts to address key gaps in each of these areas
Thrust 1: Material Set
Thrust 2: Low Cost Patterning
Thrust 3: Plating
Thrust 4: Inspection & Test
Leading Substrate Focus Areas
30
Pb-free solder
Halogen free core
High Tg, low CTE Solder resist
Low Ra, CTE dielectric Surface finish
Needed: More complex materials requirements including superior electrical, mechanical, and reliability performance, processing compatibility, & EHS
compliance
Wide-ranging Substrate Material Needs
31
iNEMI Wiring Density Project Goals
Phase 1: Solicit membership, Survey industry to
define limits & ID Gaps Define execution scope
Phase 3: Drive integrated scaling approach
across supply chain and drive
standardization
Phase 2: Execute on defined scope to close the
Identified Gaps
• Overarching objective to steer the industry toward standardized solutions in support of wiring density roadmap
• Phase 1 is currently preparing final report
32
Wiring Density Survey - Participant Demographics
Outcome: achieved geographically diverse representation, with predominate participation coming from USA, Japan, & Taiwan
33
Wiring Density Survey - Supply Chain Distribution
Outcome: Captured Balanced representation of the entire supply chain
Industry Segment
Semiconductor
Supplier 18%
Substrate Supplier 14%
Assembly Supplier 13%
Material and Chemical
Supplier 9%
OEM Computer 9%
OEM
Telecommunications 9%
EMS 7%
OEM Medical 5%
OEM Electronic
Products 4%
Consultant 2%
Equipment Supplier 2%
OEM Automotive 2%
OEM Military 2%
Research Institute 2%
Test Services 2%
University 2%
18%
14%
13%
9%
9%
9%
7%
5%
2%
2%
Semiconductor Supplier Substrate SupplierAssembly Supplier Material and Chemical SupplierOEM Computer OEM TelecommunicationsEMS OEM MedicalOEM Electronic Products ConsultantEquipment Supplier OEM AutomotiveOEM Military Research InstituteTest Services University
34
Summary
• Rapid convergence of various computing functionalities & IC scaling continues to drive demand for increased wiring density for packaging applications
• Highlighted several of the key technology challenges and forward looking direction to achieve these targets
• iNEMI Wiring Density Project kicked-off in response with goal to drive integrated scaling approach spanning the supply chain
• Next step activities focus on analyzing the iNEMI survey results & creating a well defined project scope to address major gaps driving toward standardized and integrated solution space
Case Study 3: Impact of Copper
Wire-bonding
36
Copper Wire Bonding Project
• Original Purpose: to speed the introduction of low cost
copper wire bonding into the high reliability market.
• Newly identified need: to evaluate new molding compounds to
address corrosion of copper.
• Another newly identified need: A simultaneous project on
“creep corrosion” has confirmed the need to address creep
corrosion of copper and silver which occurs in high humidity,
highly corrosive atmospheres and impacts both high
reliability and consumer electronics.
Focus Area:
Jun-12 TIG:
Project Members
Miniaturization
Packaging
Cu Wire Bonding Reliability
Phase 1 Project Members
Current Market Issues
Perspectives of the Press
Material use and resource efficiency in Europe
Trends in use of material resources and national experience with policies to support resource efficiency
Paweł Kaźmierczyk
Digital Europe meeting
Copenhagen, 7 February 2012.
40
Material Use and Resource Efficiency
The Bad News
• Size reduction of electronic products makes recovery more
difficult at end of life.
• Our reliability and performance requirements make using post
consumer polymers a challenge.
• We are no longer as important a customer for polymers as the
auto industry.
The Opportunities and Good News
• We should explore applications where post consumer
polymers could be used.
• Electronics continue to use less energy and material per given
function.
41
42
Project Proposal
Defining and implementing science-based sustainable
solutions to complex challenges.
iNEMI Draft Research Proposal: Bio-Polymer Fact Sheets
Champion: Nils F. Nissen (Fraunhofer IZM)
Background
Bio-polymers are cited repeatedly as an environmental improvement option for
electronic products. Many demonstrators and even mass-market products have
employed bio-polymers already, yet the market penetration in the electronics
industry remains very low.
Polymers and fibers from renewable resources are the focus of this proposal,
whereas polymers, that are bio-degradable but not from renewable sources, are
not the favored option.
Though the standard argument that bio-polymers are CO2-neutral and therefore
environmentally preferable to petroleum based polymers is untrue (well, for
experts it is obvious), and reappears in many forms and guises. Independent facts
without political or company specific biases are hard to obtain; even well intended
and highly detailed data sets can be misleading when used by outside
practitioners.
43
44
45
46
47
Case Study 4: Alternatives to
PVC Power Cables
49
Background
• Seven of the top 10 global PC manufacturers have set goals to
phase-out PVC, where viable alternatives have been identified
– These 7 manufacturers represent over 50% of the worldwide
market share for PCs (per IDC WW Quarterly PC Tracker for
Q1-2008)
• PVC alternatives project was proposed at the September 2008
iNEMI Sustainability Summit
• The project planned to focus on:
– Phase 1 - Cradle-to-grave Life cycle assessment (LCA)
comparing PVC versus PVC-free cables
– Phase 2 - Technical evaluation of PVC alternatives –
electrical, mechanical, safety
Project Chair: Project Co-Chair:
Strategy Tactics Start: End:
Issues Graphics
Focus Area:
Jun-12 TIG:
Goal: Perform an Life Cycle Assessment of the electrical and mechanical properties, and safety aspects of PVC alternatives for Power Cord Sets
Environmental
ECE
PVC Alternatives
Jim Arnold, iNEMI Scott O’Connell, Dell
• Phase I conduct a cradle-to-grave Life Cycle Assessment (LCA) on PVC and PVC-free Alternatives for detachable US desktop power cord sets
• Phase 2 Conduct performance testing of different PVC-free alternatives
• Phase 1 - Develop environmental (LCA) comparing PVC with PVC-free compounds for detachable desktop US power cord sets
• Phase 2 - Develop and conduct a test to gain a better understanding of the electrical, mechanical and safety aspects of PVC-free alternatives
• Industry migration to “PVC-free” materials
• LCA studies can be costly and it remains to be seen if there will be a critical mass of companies who want to share the cost of performing a full LCA on various materials used in US Power Cord Sets.
01-11 07-11
51
iNEMI PVC Alternatives Project
Project IS / IS NOT Analysis
This Project IS: This Project IS NOT:
A scoping environmental life cycle
assessment (LCA) comparing PVC resins
(and additives) with PVC-free resins (and
additives) for desktop power cord
applications
An economic, social, or toxicological
assessment
An ISO aligned LCA analysis
A cradle-to-gate LCA, including a survey on
end of life aspects (recycling, incineration,
landfill, etc)
A comparative Assertion
Focused on US desktop power cords for PC
applications
Focused on other cables or cords (for
initial assessment)
Designed to gain a better understanding of
the electrical, mechanical, and safety aspects
of “PVC-free” alternatives
Designed to develop standards
Multi-stakeholder Electronics industry only
Focus Area:
Jun-12 TIG:
Project Members
Environment
ECE
PVC Alternatives Initiative
53
Project Proposal
White List of Acceptable Polymeric Materials
• Proposal to list or rank polymers and their additives for environmental impact
• Similar to Proposals from Clean Production Action
• White List ranking should include:
– Polymers
– Flame Retardants
– Catalysts
– Softeners
– Other Additives
– Possibilities for recycled content
• Objectives:
– Improve environmental impact
– Make “customers” aware of difficult trade offs that must be made in optimizing a solution for performance and for the environment.
Concluding Thoughts
55
Concluding Thoughts on Polymers
• Improved performance drives technology needs
• Reliability verification of new polymer materials is necessary but time consuming.
• Scientifically based reliability and environmental impacts need to be understood
• While materials evolve, significant changes to new generations of polymers require a decade to implement
• With the increased use of polymers in transportation, the electronics industry is no longer a significant market.
• How do the OEMs and Electronic Material Providers (the firms with research funds) develop a business model to address these issues?
• One approach: Improved Management Communications within the Supply Chain
56
Concluding Thoughts
Where do we want Electronics to be in 2021
• Our primary foci will be on Electronic Products
empowering sustainable lifestyles.
• Our secondary foci will be on
– Continuing to reduce energy use of our products
– Increasing the recycling and reuse of our products
• We will have to expand our understanding of our
ecologic impact on the world.
“The Journey to a Sustainable World ”
Electronic Products are leading in the Journey
